SG11201901811RA - Lens contamination prevention device and method - Google Patents

Lens contamination prevention device and method

Info

Publication number
SG11201901811RA
SG11201901811RA SG11201901811RA SG11201901811RA SG11201901811RA SG 11201901811R A SG11201901811R A SG 11201901811RA SG 11201901811R A SG11201901811R A SG 11201901811RA SG 11201901811R A SG11201901811R A SG 11201901811RA SG 11201901811R A SG11201901811R A SG 11201901811RA
Authority
SG
Singapore
Prior art keywords
lens
contamination
turned
protective layer
contamination prevention
Prior art date
Application number
SG11201901811RA
Inventor
Baotong Hao
Dongchun Lang
Original Assignee
Shanghai Micro Electronics Equipment Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Group Co Ltd filed Critical Shanghai Micro Electronics Equipment Group Co Ltd
Publication of SG11201901811RA publication Critical patent/SG11201901811RA/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
    • G03F9/7053—Non-optical, e.g. mechanical, capacitive, using an electron beam, acoustic or thermal waves
    • G03F9/7057—Gas flow, e.g. for focusing, leveling or gap setting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

Abstract

A lens contamination prevention device, comprising a first device () and a second device (400) connected to the first device (300); the first device (300) is closer to a lens (100) relative to the second device (400), wherein the first device (300) is used to output protective layer gas, and the protective layer gas flows uniformly against the lower surface of the lens (100) by means of a nozzle (330), which may clean the already contaminated lens (100) and form a protective layer so as to prevent recontamination; the second device (400) is used to take away the gas near a contamination source, and the contamination gas enters an annular cavity (420) by means of a small hole (410) and is discharged into a remote environment by means of exhaust power of an exhaust channel (200). Also disclosed is a lens contamination prevention method. Before exposure, first the first device (300) is turned on, then the second device (400) is turned on, and the second device (400) may be turned off after 12 hours of exposure has been complete. The device and method may better solve the problem wherein photoresist organic matter volatilizes and contaminates the lens, and have the advantages of simple installation, long service life, low cost and high reliability, ensuring that the contamination matter is completely removed and does not enter the inside of the lens. 14
SG11201901811RA 2016-08-30 2017-08-29 Lens contamination prevention device and method SG11201901811RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610767140.0A CN107783283B (en) 2016-08-30 2016-08-30 Lens anti-pollution device and method
PCT/CN2017/099513 WO2018041099A1 (en) 2016-08-30 2017-08-29 Lens contamination prevention device and method

Publications (1)

Publication Number Publication Date
SG11201901811RA true SG11201901811RA (en) 2019-04-29

Family

ID=61300017

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201901811RA SG11201901811RA (en) 2016-08-30 2017-08-29 Lens contamination prevention device and method

Country Status (8)

Country Link
US (1) US10539887B2 (en)
EP (1) EP3508920A4 (en)
JP (1) JP6954996B2 (en)
KR (1) KR102212629B1 (en)
CN (1) CN107783283B (en)
SG (1) SG11201901811RA (en)
TW (1) TWI639062B (en)
WO (1) WO2018041099A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109283797B (en) 2017-07-21 2021-04-30 上海微电子装备（集团）股份有限公司 Objective lens protection device, objective lens system and lithographic apparatus
CN110764368A (en) * 2018-07-27 2020-02-07 上海微电子装备（集团）股份有限公司 Objective contamination prevention device
US10946838B2 (en) 2019-03-21 2021-03-16 Ford Global Technologies, Llc Cleaning apparatus for sensor
CN110620858B (en) * 2019-09-11 2024-03-22 昆山丘钛微电子科技有限公司 Lens protection element, camera module and manufacturing method of camera module
CN112748641B (en) * 2019-10-31 2022-08-12 上海微电子装备（集团）股份有限公司 Air curtain protection device at bottom of lens
CN112718702A (en) * 2020-12-30 2021-04-30 中国科学院微电子研究所 Controllable microlens array cleaning device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE412127B (en) * 1978-06-15 1980-02-18 Aga Ab DEVICE FOR AN OPTICAL ELEMENT
JP3531914B2 (en) * 2000-04-14 2004-05-31 キヤノン株式会社 Optical apparatus, exposure apparatus, and device manufacturing method
KR100833275B1 (en) * 2000-05-03 2008-05-28 에이에스엠엘 유에스, 인크. Non-contact seal using purge gas
KR100326432B1 (en) * 2000-05-29 2002-02-28 윤종용 Air shower for wafer stage
US6934003B2 (en) * 2002-01-07 2005-08-23 Canon Kabushiki Kaisha Exposure apparatus and device manufacturing method
US7057702B2 (en) * 2004-06-23 2006-06-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102005020521B4 (en) * 2005-04-29 2013-05-02 Xtreme Technologies Gmbh Method and device for suppressing debris in the generation of short-wave radiation based on a plasma
CN101034261B (en) * 2006-03-09 2010-08-11 中芯国际集成电路制造(上海)有限公司 Method and device for preventing barrier processing from polluting optical element
CN202837812U (en) * 2012-11-01 2013-03-27 张添祥 Lens group for stepping-type exposure machine
CN104887311A (en) * 2014-03-04 2015-09-09 镇江市新天医疗器械有限公司 Surface demister of optical lens of oral dental surgical microscope

Also Published As

Publication number Publication date
WO2018041099A1 (en) 2018-03-08
KR102212629B1 (en) 2021-02-04
CN107783283B (en) 2020-01-24
CN107783283A (en) 2018-03-09
JP2019525259A (en) 2019-09-05
JP6954996B2 (en) 2021-10-27
TW201812485A (en) 2018-04-01
US10539887B2 (en) 2020-01-21
EP3508920A4 (en) 2019-09-04
US20190187561A1 (en) 2019-06-20
EP3508920A1 (en) 2019-07-10
TWI639062B (en) 2018-10-21
KR20190043168A (en) 2019-04-25

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