TW201614017A - Protective film composition, manufacturing method for semiconductor device and laser cutting method - Google Patents
Protective film composition, manufacturing method for semiconductor device and laser cutting methodInfo
- Publication number
- TW201614017A TW201614017A TW104131223A TW104131223A TW201614017A TW 201614017 A TW201614017 A TW 201614017A TW 104131223 A TW104131223 A TW 104131223A TW 104131223 A TW104131223 A TW 104131223A TW 201614017 A TW201614017 A TW 201614017A
- Authority
- TW
- Taiwan
- Prior art keywords
- protective film
- film composition
- laser cutting
- substrate
- semiconductor device
- Prior art date
Links
Landscapes
- Dicing (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides a protective film composition which can form a good cutting shape in the cutting of a substrate having a thickness by a laser, a manufacturing method for a semiconductor device and a laser cutting method. The aforementioned protective film composition comprises a water-soluble resin, a resin capsule in which a laser light absorber is contained, and an aqueous solvent. Preferably, the protective film composition contains a surfactant. Further preferably, the protective film composition is used for laser cutting. The manufacturing method for semiconductor device and the laser cutting method provided by the present invention comprises the following steps: applying the protective film composition to a substrate to form a protective layer; irradiating a laser beam through the protective layer onto the substrate for laser cutting; after laser cutting washing the substrate with water and removing the protective layer from the substrate.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-196188 | 2014-09-26 | ||
JP2014196188A JP6242776B2 (en) | 2014-09-26 | 2014-09-26 | Protective film composition, semiconductor device manufacturing method, and laser dicing method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201614017A true TW201614017A (en) | 2016-04-16 |
TWI668279B TWI668279B (en) | 2019-08-11 |
Family
ID=55805818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104131223A TWI668279B (en) | 2014-09-26 | 2015-09-22 | Protective film composition, method of manufacturing semiconductor device, and laser cutting method |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6242776B2 (en) |
TW (1) | TWI668279B (en) |
Cited By (5)
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CN108063118A (en) * | 2016-11-08 | 2018-05-22 | 株式会社迪思科 | The processing method of chip |
TWI638870B (en) | 2016-10-06 | 2018-10-21 | 奇美實業股份有限公司 | Solution for forming protective layer used in picosecond laser process and method for manufacturing thereof |
CN112300637A (en) * | 2019-07-30 | 2021-02-02 | 东京应化工业株式会社 | Protective film forming agent and method for manufacturing semiconductor chip |
TWI726719B (en) * | 2020-05-12 | 2021-05-01 | 彰洋材料股份有限公司 | Composition of peelable protective film and reflective peelable protective film and spray product thereof |
CN112876929A (en) * | 2019-11-13 | 2021-06-01 | 奇美实业股份有限公司 | Protective film composition, method for manufacturing semiconductor device, and laser dicing method |
Families Citing this family (12)
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US9793132B1 (en) * | 2016-05-13 | 2017-10-17 | Applied Materials, Inc. | Etch mask for hybrid laser scribing and plasma etch wafer singulation process |
JP6866038B2 (en) * | 2017-06-21 | 2021-04-28 | 株式会社ディスコ | Manufacturing method of packaged device |
JP7161369B2 (en) * | 2018-10-23 | 2022-10-26 | 日本酢ビ・ポバール株式会社 | Protective film forming composition |
JP7161371B2 (en) * | 2018-10-23 | 2022-10-26 | 日本酢ビ・ポバール株式会社 | Protective film forming composition |
CN113039628A (en) * | 2018-11-15 | 2021-06-25 | 东京应化工业株式会社 | Protective film forming agent for plasma dicing and method for manufacturing semiconductor chip |
SG11202109147YA (en) * | 2019-02-27 | 2021-09-29 | John Cleaon Moore | Water washable thermal and plasma resistant coating for laser interactive applications |
US11342226B2 (en) * | 2019-08-13 | 2022-05-24 | Applied Materials, Inc. | Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch process |
TWI740212B (en) | 2019-09-19 | 2021-09-21 | 國立陽明交通大學 | Method for manufacturing micro-led chip |
JPWO2021131472A1 (en) * | 2019-12-24 | 2021-07-01 | ||
KR20230118140A (en) * | 2021-01-14 | 2023-08-10 | 도오꾜오까고오교 가부시끼가이샤 | Protective film forming agent and method for manufacturing semiconductor chips |
CN112898853A (en) * | 2021-02-02 | 2021-06-04 | 深圳市化讯半导体材料有限公司 | Laser cutting protection liquid and preparation method and application thereof |
JP7185086B1 (en) * | 2021-09-16 | 2022-12-06 | 積水化学工業株式会社 | Temporary protective material |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS538634A (en) * | 1976-07-14 | 1978-01-26 | Nippon Electric Co | Coating liquid for laser scriber |
JP2780554B2 (en) * | 1992-01-17 | 1998-07-30 | 王子製紙株式会社 | Method for producing microcapsules encapsulating ultraviolet absorber |
NL1013644C2 (en) * | 1999-11-23 | 2001-05-28 | Dsm Nv | Laser-markable polymer composition. |
US6685765B1 (en) * | 2001-12-28 | 2004-02-03 | Vahid Ghodoussi | Water based protectant containing UV absorbers |
JP4571850B2 (en) * | 2004-11-12 | 2010-10-27 | 東京応化工業株式会社 | Protective film agent for laser dicing and wafer processing method using the protective film agent |
KR101896710B1 (en) * | 2012-08-29 | 2018-09-10 | 동우 화인켐 주식회사 | Wafer dicing protective film for a laser |
-
2014
- 2014-09-26 JP JP2014196188A patent/JP6242776B2/en active Active
-
2015
- 2015-09-22 TW TW104131223A patent/TWI668279B/en active
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI638870B (en) | 2016-10-06 | 2018-10-21 | 奇美實業股份有限公司 | Solution for forming protective layer used in picosecond laser process and method for manufacturing thereof |
CN108063118A (en) * | 2016-11-08 | 2018-05-22 | 株式会社迪思科 | The processing method of chip |
CN108063118B (en) * | 2016-11-08 | 2022-02-11 | 株式会社迪思科 | Method for processing wafer |
CN112300637A (en) * | 2019-07-30 | 2021-02-02 | 东京应化工业株式会社 | Protective film forming agent and method for manufacturing semiconductor chip |
CN112300637B (en) * | 2019-07-30 | 2024-03-15 | 东京应化工业株式会社 | Protective film forming agent and method for manufacturing semiconductor chip |
CN112876929A (en) * | 2019-11-13 | 2021-06-01 | 奇美实业股份有限公司 | Protective film composition, method for manufacturing semiconductor device, and laser dicing method |
CN112876929B (en) * | 2019-11-13 | 2023-09-19 | 奇美实业股份有限公司 | Protective film composition, method for manufacturing semiconductor device, and laser cutting method |
TWI726719B (en) * | 2020-05-12 | 2021-05-01 | 彰洋材料股份有限公司 | Composition of peelable protective film and reflective peelable protective film and spray product thereof |
Also Published As
Publication number | Publication date |
---|---|
JP2016066768A (en) | 2016-04-28 |
JP6242776B2 (en) | 2017-12-06 |
TWI668279B (en) | 2019-08-11 |
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