TW201614017A - Protective film composition, manufacturing method for semiconductor device and laser cutting method - Google Patents

Protective film composition, manufacturing method for semiconductor device and laser cutting method

Info

Publication number
TW201614017A
TW201614017A TW104131223A TW104131223A TW201614017A TW 201614017 A TW201614017 A TW 201614017A TW 104131223 A TW104131223 A TW 104131223A TW 104131223 A TW104131223 A TW 104131223A TW 201614017 A TW201614017 A TW 201614017A
Authority
TW
Taiwan
Prior art keywords
protective film
film composition
laser cutting
substrate
semiconductor device
Prior art date
Application number
TW104131223A
Other languages
Chinese (zh)
Other versions
TWI668279B (en
Inventor
Yu Iwai
Seiya Masuda
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of TW201614017A publication Critical patent/TW201614017A/en
Application granted granted Critical
Publication of TWI668279B publication Critical patent/TWI668279B/en

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  • Dicing (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention provides a protective film composition which can form a good cutting shape in the cutting of a substrate having a thickness by a laser, a manufacturing method for a semiconductor device and a laser cutting method. The aforementioned protective film composition comprises a water-soluble resin, a resin capsule in which a laser light absorber is contained, and an aqueous solvent. Preferably, the protective film composition contains a surfactant. Further preferably, the protective film composition is used for laser cutting. The manufacturing method for semiconductor device and the laser cutting method provided by the present invention comprises the following steps: applying the protective film composition to a substrate to form a protective layer; irradiating a laser beam through the protective layer onto the substrate for laser cutting; after laser cutting washing the substrate with water and removing the protective layer from the substrate.
TW104131223A 2014-09-26 2015-09-22 Protective film composition, method of manufacturing semiconductor device, and laser cutting method TWI668279B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-196188 2014-09-26
JP2014196188A JP6242776B2 (en) 2014-09-26 2014-09-26 Protective film composition, semiconductor device manufacturing method, and laser dicing method

Publications (2)

Publication Number Publication Date
TW201614017A true TW201614017A (en) 2016-04-16
TWI668279B TWI668279B (en) 2019-08-11

Family

ID=55805818

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104131223A TWI668279B (en) 2014-09-26 2015-09-22 Protective film composition, method of manufacturing semiconductor device, and laser cutting method

Country Status (2)

Country Link
JP (1) JP6242776B2 (en)
TW (1) TWI668279B (en)

Cited By (5)

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CN108063118A (en) * 2016-11-08 2018-05-22 株式会社迪思科 The processing method of chip
TWI638870B (en) 2016-10-06 2018-10-21 奇美實業股份有限公司 Solution for forming protective layer used in picosecond laser process and method for manufacturing thereof
CN112300637A (en) * 2019-07-30 2021-02-02 东京应化工业株式会社 Protective film forming agent and method for manufacturing semiconductor chip
TWI726719B (en) * 2020-05-12 2021-05-01 彰洋材料股份有限公司 Composition of peelable protective film and reflective peelable protective film and spray product thereof
CN112876929A (en) * 2019-11-13 2021-06-01 奇美实业股份有限公司 Protective film composition, method for manufacturing semiconductor device, and laser dicing method

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US9793132B1 (en) * 2016-05-13 2017-10-17 Applied Materials, Inc. Etch mask for hybrid laser scribing and plasma etch wafer singulation process
JP6866038B2 (en) * 2017-06-21 2021-04-28 株式会社ディスコ Manufacturing method of packaged device
JP7161369B2 (en) * 2018-10-23 2022-10-26 日本酢ビ・ポバール株式会社 Protective film forming composition
JP7161371B2 (en) * 2018-10-23 2022-10-26 日本酢ビ・ポバール株式会社 Protective film forming composition
CN113039628A (en) * 2018-11-15 2021-06-25 东京应化工业株式会社 Protective film forming agent for plasma dicing and method for manufacturing semiconductor chip
SG11202109147YA (en) * 2019-02-27 2021-09-29 John Cleaon Moore Water washable thermal and plasma resistant coating for laser interactive applications
US11342226B2 (en) * 2019-08-13 2022-05-24 Applied Materials, Inc. Hybrid wafer dicing approach using an actively-focused laser beam laser scribing process and plasma etch process
TWI740212B (en) 2019-09-19 2021-09-21 國立陽明交通大學 Method for manufacturing micro-led chip
JPWO2021131472A1 (en) * 2019-12-24 2021-07-01
KR20230118140A (en) * 2021-01-14 2023-08-10 도오꾜오까고오교 가부시끼가이샤 Protective film forming agent and method for manufacturing semiconductor chips
CN112898853A (en) * 2021-02-02 2021-06-04 深圳市化讯半导体材料有限公司 Laser cutting protection liquid and preparation method and application thereof
JP7185086B1 (en) * 2021-09-16 2022-12-06 積水化学工業株式会社 Temporary protective material

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Publication number Priority date Publication date Assignee Title
JPS538634A (en) * 1976-07-14 1978-01-26 Nippon Electric Co Coating liquid for laser scriber
JP2780554B2 (en) * 1992-01-17 1998-07-30 王子製紙株式会社 Method for producing microcapsules encapsulating ultraviolet absorber
NL1013644C2 (en) * 1999-11-23 2001-05-28 Dsm Nv Laser-markable polymer composition.
US6685765B1 (en) * 2001-12-28 2004-02-03 Vahid Ghodoussi Water based protectant containing UV absorbers
JP4571850B2 (en) * 2004-11-12 2010-10-27 東京応化工業株式会社 Protective film agent for laser dicing and wafer processing method using the protective film agent
KR101896710B1 (en) * 2012-08-29 2018-09-10 동우 화인켐 주식회사 Wafer dicing protective film for a laser

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI638870B (en) 2016-10-06 2018-10-21 奇美實業股份有限公司 Solution for forming protective layer used in picosecond laser process and method for manufacturing thereof
CN108063118A (en) * 2016-11-08 2018-05-22 株式会社迪思科 The processing method of chip
CN108063118B (en) * 2016-11-08 2022-02-11 株式会社迪思科 Method for processing wafer
CN112300637A (en) * 2019-07-30 2021-02-02 东京应化工业株式会社 Protective film forming agent and method for manufacturing semiconductor chip
CN112300637B (en) * 2019-07-30 2024-03-15 东京应化工业株式会社 Protective film forming agent and method for manufacturing semiconductor chip
CN112876929A (en) * 2019-11-13 2021-06-01 奇美实业股份有限公司 Protective film composition, method for manufacturing semiconductor device, and laser dicing method
CN112876929B (en) * 2019-11-13 2023-09-19 奇美实业股份有限公司 Protective film composition, method for manufacturing semiconductor device, and laser cutting method
TWI726719B (en) * 2020-05-12 2021-05-01 彰洋材料股份有限公司 Composition of peelable protective film and reflective peelable protective film and spray product thereof

Also Published As

Publication number Publication date
JP2016066768A (en) 2016-04-28
JP6242776B2 (en) 2017-12-06
TWI668279B (en) 2019-08-11

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