JPS538634A - Coating liquid for laser scriber - Google Patents

Coating liquid for laser scriber

Info

Publication number
JPS538634A
JPS538634A JP8408576A JP8408576A JPS538634A JP S538634 A JPS538634 A JP S538634A JP 8408576 A JP8408576 A JP 8408576A JP 8408576 A JP8408576 A JP 8408576A JP S538634 A JPS538634 A JP S538634A
Authority
JP
Japan
Prior art keywords
coating liquid
laser scriber
scriber
laser
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8408576A
Other languages
Japanese (ja)
Other versions
JPS5747933B2 (en
Inventor
Masao Kachi
Hiroshi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP8408576A priority Critical patent/JPS538634A/en
Publication of JPS538634A publication Critical patent/JPS538634A/en
Publication of JPS5747933B2 publication Critical patent/JPS5747933B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Paints Or Removers (AREA)
  • Dicing (AREA)
JP8408576A 1976-07-14 1976-07-14 Coating liquid for laser scriber Granted JPS538634A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8408576A JPS538634A (en) 1976-07-14 1976-07-14 Coating liquid for laser scriber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8408576A JPS538634A (en) 1976-07-14 1976-07-14 Coating liquid for laser scriber

Publications (2)

Publication Number Publication Date
JPS538634A true JPS538634A (en) 1978-01-26
JPS5747933B2 JPS5747933B2 (en) 1982-10-13

Family

ID=13820647

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8408576A Granted JPS538634A (en) 1976-07-14 1976-07-14 Coating liquid for laser scriber

Country Status (1)

Country Link
JP (1) JPS538634A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52122291U (en) * 1976-03-12 1977-09-17
JPS58136660A (en) * 1982-02-05 1983-08-13 Daicel Chem Ind Ltd Composition for masking paint
KR20140030451A (en) 2012-08-29 2014-03-12 동우 화인켐 주식회사 Wafer dicing protective film for a laser
US9090783B2 (en) 2004-11-12 2015-07-28 Tokyo Ohka Kogyo Co., Ltd. Protective film agent for laser dicing and wafer processing method using the protective film agent
JP2015531994A (en) * 2012-07-10 2015-11-05 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Uniform masking for wafer dicing using laser and plasma etching
JP2016066768A (en) * 2014-09-26 2016-04-28 富士フイルム株式会社 Protection film composition, method for manufacturing semiconductor device, and laser dicing method
JP2018078162A (en) * 2016-11-08 2018-05-17 株式会社ディスコ Processing method for wafer

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS64113Y2 (en) * 1985-07-19 1989-01-05
ATE552934T1 (en) * 2003-06-06 2012-04-15 Electro Scient Ind Inc LASER PROCESSING USING A SURFACTANT FILM

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52122291U (en) * 1976-03-12 1977-09-17
JPS58136660A (en) * 1982-02-05 1983-08-13 Daicel Chem Ind Ltd Composition for masking paint
JPH0453909B2 (en) * 1982-02-05 1992-08-27 Daicel Chem
US9090783B2 (en) 2004-11-12 2015-07-28 Tokyo Ohka Kogyo Co., Ltd. Protective film agent for laser dicing and wafer processing method using the protective film agent
JP2015531994A (en) * 2012-07-10 2015-11-05 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Uniform masking for wafer dicing using laser and plasma etching
KR20140030451A (en) 2012-08-29 2014-03-12 동우 화인켐 주식회사 Wafer dicing protective film for a laser
JP2016066768A (en) * 2014-09-26 2016-04-28 富士フイルム株式会社 Protection film composition, method for manufacturing semiconductor device, and laser dicing method
JP2018078162A (en) * 2016-11-08 2018-05-17 株式会社ディスコ Processing method for wafer

Also Published As

Publication number Publication date
JPS5747933B2 (en) 1982-10-13

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