JPS5747933B2 - - Google Patents
Info
- Publication number
- JPS5747933B2 JPS5747933B2 JP8408576A JP8408576A JPS5747933B2 JP S5747933 B2 JPS5747933 B2 JP S5747933B2 JP 8408576 A JP8408576 A JP 8408576A JP 8408576 A JP8408576 A JP 8408576A JP S5747933 B2 JPS5747933 B2 JP S5747933B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Paints Or Removers (AREA)
- Dicing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8408576A JPS538634A (en) | 1976-07-14 | 1976-07-14 | Coating liquid for laser scriber |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8408576A JPS538634A (en) | 1976-07-14 | 1976-07-14 | Coating liquid for laser scriber |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS538634A JPS538634A (en) | 1978-01-26 |
JPS5747933B2 true JPS5747933B2 (en) | 1982-10-13 |
Family
ID=13820647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8408576A Granted JPS538634A (en) | 1976-07-14 | 1976-07-14 | Coating liquid for laser scriber |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS538634A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS64113Y2 (en) * | 1985-07-19 | 1989-01-05 | ||
JP2006527477A (en) * | 2003-06-06 | 2006-11-30 | エグシル テクノロジー リミテッド | Laser cutting using surfactant film |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52122291U (en) * | 1976-03-12 | 1977-09-17 | ||
JPS58136660A (en) * | 1982-02-05 | 1983-08-13 | Daicel Chem Ind Ltd | Composition for masking paint |
JP4571850B2 (en) | 2004-11-12 | 2010-10-27 | 東京応化工業株式会社 | Protective film agent for laser dicing and wafer processing method using the protective film agent |
US9048309B2 (en) * | 2012-07-10 | 2015-06-02 | Applied Materials, Inc. | Uniform masking for wafer dicing using laser and plasma etch |
KR101896710B1 (en) | 2012-08-29 | 2018-09-10 | 동우 화인켐 주식회사 | Wafer dicing protective film for a laser |
JP6242776B2 (en) * | 2014-09-26 | 2017-12-06 | 富士フイルム株式会社 | Protective film composition, semiconductor device manufacturing method, and laser dicing method |
JP6739873B2 (en) * | 2016-11-08 | 2020-08-12 | 株式会社ディスコ | Wafer processing method |
-
1976
- 1976-07-14 JP JP8408576A patent/JPS538634A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS64113Y2 (en) * | 1985-07-19 | 1989-01-05 | ||
JP2006527477A (en) * | 2003-06-06 | 2006-11-30 | エグシル テクノロジー リミテッド | Laser cutting using surfactant film |
JP2012110964A (en) * | 2003-06-06 | 2012-06-14 | Electro Scientific Industries Inc | Laser cutting work using surfactant film |
Also Published As
Publication number | Publication date |
---|---|
JPS538634A (en) | 1978-01-26 |