JPH06124873A - 液浸式投影露光装置 - Google Patents

液浸式投影露光装置

Info

Publication number
JPH06124873A
JPH06124873A JP4296518A JP29651892A JPH06124873A JP H06124873 A JPH06124873 A JP H06124873A JP 4296518 A JP4296518 A JP 4296518A JP 29651892 A JP29651892 A JP 29651892A JP H06124873 A JPH06124873 A JP H06124873A
Authority
JP
Japan
Prior art keywords
wafer
liquid
exposure apparatus
projection exposure
apparatus according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4296518A
Other languages
English (en)
Inventor
Kazuo Takahashi
一雄 高橋
Original Assignee
Canon Inc
キヤノン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc, キヤノン株式会社 filed Critical Canon Inc
Priority to JP4296518A priority Critical patent/JPH06124873A/ja
Publication of JPH06124873A publication Critical patent/JPH06124873A/ja
Application status is Pending legal-status Critical

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/708Construction of apparatus, e.g. environment, hygiene aspects or materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70216Systems for imaging mask onto workpiece
    • G03F7/70341Immersion

Abstract

(57)【要約】 【目的】 従来のプロセス技術を生かせる液浸式露光装
置を提供する。 【構成】 レチクルを照明する照明手段、これによって
照明されたレチクル上のパターンをウエハ上に投影する
投影光学手段、ウエハを所定位置に位置決めする位置決
め手段を備えた投影露光装置において、投影光学手段は
ウエハの露光面に対向し、平面もしくはウエハ側へ凸ん
だ凸面を有する光学素子、およびこの光学素子の平面も
しくは凸面とウエハの露光面との間を少なくとも満たす
液体を保持するための液槽を具備する。

Description

【発明の詳細な説明】

【0001】

【産業上の利用分野】本発明は、半導体製造工程におい
てウエハ上に微細な回路パターンを露光する為の液浸式
投影露光装置に関する。

【0002】

【従来の技術】半導体素子の微細化が進み、従来、露光
光源としては、高圧水銀灯のg線からより波長の短いi
線へと移行してきた。そしてより高解像力を必要とする
為、投影レンズのNA(開口数)を大きくしなければな
らず、その為、焦点深度はますます浅くなる傾向にあ
る。これらの関係は一般に良く知られている様に、次式
で表すことができる。 (解像力)=k1 (λ/NA) (焦点深度)=±k2 λ/NA2 ここに、λは露光に使用する光源の波長、NAは投影レ
ンズのNA(開口数)、k1 ,k2 はプロセスに関係す
る係数である。

【0003】近年では、従来の高圧水銀灯のg線、i線
から、より波長の短いエキシマレーザと呼ばれる(Kr
F,ArF)、更には、X線の使用も検討されている。
また一方では、位相シフトマスク、或は変形照明等によ
る高解像力、高深度化の検討もなされ、実用され始めて
いる。しかし、エキシマレーザと呼ばれる(KrF,A
rF)やX線を利用する方法は、装置コストが高くな
り、位相シフトマスク、或は変形照明等は、回路パター
ンによって効果が期待できない場合もある等の問題を抱
えている。

【0004】そこで、液浸方を適用する試みがなされて
いる。例えば、特公昭63−49893号公報には、露
光装置において、縮小レンズの先端を取り囲んで液体流
入口を有するノズルを設け、これを介して液体を供給
し、縮小レンズとウエハとの間に液体を保持するように
したものが記載されている。

【0005】

【発明が解決しようとする課題】しかしながら、この従
来技術においては、ただ単に液体を供給するようにした
のみであり、実際の製造工程で使用するには、従来のプ
ロセス技術が生かせない等、種々の問題を有している。

【0006】本発明の目的は、上述従来技術の問題点に
鑑み、g線、i線、或はエキシマレーザ等の使用する露
光光源の波長に拘らず、どの波長でも、それぞれの波長
に応じた効果を期待できるコストの安い液浸式露光装置
を提供し、更には、従来のプロセス技術を生かせる液浸
式露光装置を提供することを目的とする。

【0007】

【課題を解決するための手段】この目的を達成するため
本発明では、レチクルを照明する照明手段、これによっ
て照明されたレチクル上のパターンをウエハ上に投影す
る投影光学手段、ウエハを所定位置に位置決めする位置
決め手段を備えた投影露光装置において、投影光学手段
はウエハの露光面に対向し、平面もしくはウエハ側へ凸
んだ凸面を有する光学素子、およびこの光学素子の平面
もしくは凸面とウエハの露光面との間を少なくとも満た
す液体を保持するための液槽を具備する。

【0008】位置決め手段は、通常、ウエハ位置を検出
するアライメント計測手段と、投影光学手段のフォーカ
ス位置に対するウエハ露光面の位置を検出するフォーカ
ス位置検出手段と、ウエハをその露光面に平行なXおよ
びY方向、これらに垂直な軸の回りのθ方向、Z方向、
ならびにウエハを任意の方向に傾ける方向にウエハを保
持して駆動するウエハ駆動手段と、ウエハ駆動手段の保
持位置上にウエハを搬入しおよび搬出するウエハ搬送手
段とを備える。

【0009】液槽は閉空間を構成し、液槽内の液体の加
圧手段等を有する場合もある。液槽はまた、光学手段に
対して位置的に固定され、あるいはXYステージに位置
的に固定されている場合もある。液槽が光学手段に対し
て位置的に固定されている場合は、例えば、微動ステー
ジが液槽内に配置され、液槽は透磁率の高い材料で構成
され、そして液槽を介して微動ステージとXYステージ
が磁気結合される。

【0010】

【作用】光学式顕微鏡の解像力をあげる方法としては、
従来から、対物レンズと試料の間を高屈折率の液体で満
たす、所謂、液浸法が知られている(例えば、D.W.
Pohl,W.Denk & M.Lanz,App
l.Phys.Lett.44652(1984))。
この効果を半導体素子の微細回路パターンの転写に応用
した例としては、『H.Kawata,J.M.Car
ter,A.Yen,H.I.Smith,Micro
electronic Engineering 9
(1989)』、或は、『T.R.Corle,G.
S.kino,USP 5,121,256(Jun.
9,1992)』がある。前論文は、露光における液浸
の効果を検討したもので、実用的な半導体露光装置とし
ての構成を論じておらず、後者のパテントは、液浸レン
ズをウエハの表面近くに置く方法を開示しているに過ぎ
ない。

【0011】本発明は、従来から知られている顕微鏡の
対物レンズと試料の間を高屈折率の液体で満たすという
方法を、生産設備としての投影露光装置で実現する為の
具体的方法に関するものであり、本発明によれば、液浸
の効果を利用した露光装置を提供することが可能とな
る。

【0012】この「液浸の効果」とは、λ0 を露光光の
空気中での波長とし、また、図10に示すように、nを
液浸に使用する液体の空気に対する屈折率、αを光線の
収束半角とし、NA0 =sinαとすると、液浸した場
合、前述の解像力および焦点深度は、次式のようにな
る。(解像力)=k1 (λ0 /n)/NA0 (焦点深度)=±k2 (λ0 /n)/(NA02 すなわち、液浸の効果は波長が1/nの露光波長を使用
するのと等価である。言い換えれば、同じNAの投影光
学系を設計した場合、液浸により、焦点深度をn倍にす
ることができる。これは、あらゆるパタ−ンの形状に対
しても有効であり、更に、現在検討されている位相シフ
ト法、変形照明法等と組み合わせることも可能である。
この効果を生かすためには、液体の純度、均一性、温度
等の精密な管理が必要であり、ステップ・アンド・リピ
−ト動作でウエハ上に逐次露光して行く露光装置では、
動作中に発生する液体の流動や振動を極力少なくするこ
と、ウエハを液体内に搬入する際のウエハ表面に残留す
る気泡をいかにして除去するか等が問題になる。本発明
では、実施例で説明するように、これらの諸問題を解決
するための装置の構成を提案し、液浸の効果を十分生か
せるようにしている。従来、256Mbit〜1Gbi
tのDRAMの生産では、i線、エキシマレーザを光源
とする従来のステッパから、X線、或は電子ビーム(E
B)の露光装置が必要と考えられていたが、本発明によ
って、i線、或はエキシマレーザを光源とする従来のス
テッパで従来の製造プロセスを流用出来、技術的に確立
された製造プロセスでコスト的にも有利な生産が可能と
なる。

【0013】以下に、実施例を通じてより詳細に説明す
る。

【0014】

【実施例】実施例1 図1は、本発明の第1の実施例に係る液浸式投影露光装
置の構成図である。図中、1はレチクル、2は感光剤が
塗布され、レチクル1上の回路パターンが露光・転写さ
れるウエハ、3はウエハ2上にレチクル1上の回路パタ
ーンを投影するためのシャッタ及び調光装置等を備えた
照明光学系、4はウエハ2上にレチクル1上の回路パタ
ーンを投影する投影光学系、5はレチクル1を保持し、
所定の位置に位置決めするためのレチクルステージ、6
はレチクル1を位置決めするため、及びレチクル像をウ
エハ2上に既に転写されている回路パターンに合致させ
るためのアライメント光学系である。

【0015】投影光学系4のウエハ2表面に対向するレ
ンズを第2の光学素子7と呼ぶことにすると、この第2
の光学素子7のウエハ2表面に対向する面は、図2およ
び図3に示すように、平面あるいはウエハ2表面に向か
って凸となる様に構成されている。これは、液浸する際
に、第2の光学素子7表面に空気層や気泡が残らない様
にするためである。また、液浸される光学素子7の表面
およびウエハ2上の感光剤の表面は、液浸に使用する液
体30と浸和性のあるコーチングを施すことが望まし
い。第2の光学素子7と投影光学系4の鏡筒との間に
は、液体30の鏡筒への侵入を防ぐためのシール8があ
る。このシールは、第2の光学素子7の厚さを、図4に
示すように厚く取り、液体30を浸す高さを管理する機
能を付加するように構成にすれば不要である。

【0016】9は液体30を満たすための液槽(チャン
バ)、10はウエハカセット、12はウエハ2を保持す
るためのウエハチャック、11−1〜11−4はウエハ
の粗位置決め装置、13はウエハ2を所定の位置に位置
決めするためのXYステージ、14はXYステージ上に
配置され、ウエハ2のθ方向位置の補正機能、ウエハ2
のZ位置の調整機能、およびウエハ2の傾きを補正する
ためのチルト機能を有する微動ステージである。チャン
バ9の中に、ウエハカセット10からウエハを搬入しウ
エハチャック12上にセットするためのウエハ搬送装
置、粗位置決め装置11−1〜11−4の一部もしくは
全体、ウエハチャック12、XYステージ13、および
微動ステージ14がある。

【0017】15はレーザ干渉計、16は微動ステージ
14上にXおよびY方向(Y方向は不図示)に取り付け
られ、微動ステージ14の位置を計測するためにレーザ
干渉計15の光を反射する参照ミラー、17はレーザ干
渉計15の光を通過させるためチャンバ9に設けられた
窓、18はチャンバ9の外側に設けられ、外部との熱的
遮断を保つ断熱材である。チャンバ9自体を断熱効果の
ある材料、例えばエンジニリアリングセラミックで構成
すれば、断熱材18は不要である。更に、チャンバ9の
材質を低熱膨張材、例えばゼロジュール(商品名)を使
用し、図5に示すように、レーザ干渉計15をその側面
に直接取り付け、レーザ干渉計15の計測精度が空気の
インデックスの影響を受けないようにすることも可能で
ある。

【0018】チャンバ9にはまた、液体30の高さを測
定するための液面ゲージ19、液体30の温度を測定す
る温度計20、および温度コントローラ21が設けられ
ている。チャンバ9には、さらに、液体30の高さを制
御するためのポンプ22が設けられている。ポンプ22
は温度制御された液体30を循環させる機能も備え、液
体30中の不純物をろ過するためのフィルタ23もセッ
トされている。24は液体30の屈折率を測定するため
の測定器、25は液体30を均質にするため、およびウ
エハ2表面や第2の光学素子7表面に気泡が付着するの
を防ぐ目的で設置された超音波加振装置、26は露光装
置の防振架台である。

【0019】次に、上記構成の装置の実際の動作、作
用、および効果等を説明する。露光をする際には、ま
ず、あらかじめ感光剤を塗布してあるウエハ2をウエハ
搬送装置11−1で、ウエハカセット10より取り出
し、ウエハ位置粗検出機構11ー2(通常、プリアライ
メント機構と呼んでいる)に載せ、粗位置決めした後
に、ウエハ送り込みハンド11−3でウエハ2をハンド
リングし、チャンバ9内に設置されたウエハチャック1
2上にウエハ2をセットする。ウエハチャック12上に
載せられたウエハ2は、バキューム吸着によって固定さ
れ、平面矯正される。これと同時に、温度制御装置21
で一定温度に制御された液浸用の液体30が輸送ポンプ
22によって、フィルタ23を介して、チャンバ9内に
送り込まれる。液体30が所定の量になると、液面ゲ−
ジ19がこれを検知して、ポンプ22を停止する。

【0020】液体30の温度は、温度センサ20により
常時監視しており、所定の温度からずれた場合は、再度
輸送ポンプ22を作動させ、一定温度の液体30を循環
させるようになっている。その際、液体30の循環によ
る、液体30の流動が起こり、液体30の均一性が崩れ
るが、屈折率測定装置24で、均一性の測定も行われ
る。また、液体30中の気泡、ウエハ2表面に付着した
気泡、第2の光学素子7表面に付着した気泡は、超音波
加振装置25を作動させて除去する。この超音波加振
は、液体30自体を均一にする効果も有しており、振動
の振幅が小さく、周波数が高いために、ウエハ2の位置
決めや露光には影響しない。

【0021】屈折率測定装置24で液体30の均一性が
確認されると、通常の露光装置と同様に、ウエハ2の精
密位置決め(アライメント、フォ−カス等)と露光が行
われる。このとき、ステップ・アンド・リピ−ト動作に
より、液体30の流動が発生するが、第2の光学素子7
とウエハ2表面との間隔が数mmから数十mm程度であ
り、液体30が粘性を有する事から、比較的短時間で、
この部分の液体30の流動はなくなる。従って、各ショ
ット毎にステップ後に遅延時間を取るか、屈折率測定装
置24で、この部分の液体30の流動状態を測定し、流
動が停止した時点でシ−ケンスを継続させれば良い。ま
た、チャンバ9の外周は、断熱材18で覆ってあるた
め、通常、1枚のウエハを処理する時間程度は、輸送ポ
ンプ22を作動させ、一定温度の液体30を循環させる
必要はない。

【0022】ウエハ2の全面の露光が完了すると、これ
と同時に輸送ポンプ22が再び作動し、チャンバ9内の
液体30を排出し始める。この時、液面ゲ−ジ19が常
時液体30の高さを検知しており、液体30の高さがウ
エハチャック12面より僅かに低くなった時点で、輸送
ポンプを停止させる。従って、排出する液体30の量
は、僅かである。この後、ウエハチャック12のバキュ
−ムを切り、搬出ハンド11−4で、ウエハチャック1
2上のウエハ2をハンドリングして、ウエハカセット1
0に収納する。この時、収納直前に、ウエハ2の両面を
クリ−ンなエアでブロ−して、液体30をウエハ2表面
から除去するようにしてもよい。

【0023】実施例2 図11は本発明の第2の実施例に係る液浸式投影露光装
置の構成図、図12は図11におけるウエハチャック1
2の断面図、そして図14は図11におけるステージ部
分の変形例を示す模式図である。これらの図において、
31はウエハ2をチャンバ9内に搬入および搬出するた
めの搬送口、32は微動ステージ14を水平方向に移動
可能にするための流体ベアリングガイド、33はチャン
バ9の内部を負圧にして、液体30中の気泡を除去する
ための真空ポンプ、34は真空ポンプ33に接続された
バルブ、35は液体30を除去するためにクリーンなエ
アをウエハ2表面に吹き付けるためのノズルを有するブ
ロア、36はチャンバ9の内圧を測定するための圧力
計、37はウエハチャックに内蔵されたシャッタ機構で
ある。他の構成は図1の場合と同様であるが、シール8
はチャンバ9の機密を保たせる機能をも有する。また、
ポンプ22は、液体30を循環させる機能に加え、液体
30の圧力をコントロールする機能をも備える。

【0024】この構成においては、実施例1の場合と動
作が異なる点として、チャンバ9内へウエハ2を搬送し
および搬出するそれぞれの場合において、搬送口31の
開閉が行われる。またウエハ2をウエハチャック12上
にセットし、液体30を所定量満たしてポンプ22を停
止した後、さらに、バキュームチャンバ9に接続してい
る真空ポンプ33が作動され、液体30中の気泡が除去
される。このとき同時に、超音波加振装置25を作動さ
せて、液体30中の気泡、ウエハ2表面に付着した気
泡、第2の光学素子7表面に付着した気泡も除去する。
気泡を除去し終ると、真空ポンプ33は停止し、同時
に、これに接続されているバルブ34も閉じられ、ポン
プ22が作動して、液体30を加圧し始める。そしてチ
ャンバ9の内圧を測定している圧力計36の圧力が所定
の値を示した時点で、実施例1の場合と同様に、温度セ
ンサ20による液体30の温度の常時監視を行う。ま
た、ウエハカセット10への収納直前には、ブラ35に
よりウエハ2の両面がクリ−ンなエアでブロ−され、液
体30がウエハ表面から除去される。他の動作は実施例
1の場合と同様である。

【0025】これによれば、液体30が加圧されている
ため、ステップ・アンド・リピート動作による液体30
の流動は、より短時間で消失する。また、加圧された液
体30の圧力によって、ウエハチャック12上のウエハ
2の平面矯正能力も増加させることが可能である。

【0026】実施例3 図12は本発明の第3の実施例に係る液浸式露光装置の
ウエハチャック部分の断面図である。上述においては、
ウエハ毎に液体を流入し排出するようにしているが、こ
こでは、図12に示すように、ウエハチャック12にシ
ャッタ機構37を付加し、ウエハ2がウエハチャック1
2上にある場合のみシャッタを開いてバキュ−ム吸着す
るようにして、液体30を満たしたままでも処理できる
ようにしている。これにより、スル−プットの向上が図
られる。この場合、搬送されるウエハ2は、ウエハ送り
込みハンド11−3によって、液体30に対して斜め或
は垂直に気泡が残らないように液体30中に挿入され、
液体30中で水平にされてウエハチャック12上にセッ
トされる。

【0027】実施例4 図6は、本発明の第4の実施例に係る液浸式露光装置の
ステージ部分を示す断面図である。これは、実施例1の
構成において、液体30中に不純物が混入するのを防ぐ
ために、XYステ−ジ13の駆動系を、チャンバ9の外
部に置くように構成したものである。この場合、同図に
示すように、XYステ−ジ13全体がチャンバ9の外に
配置され、XYステ−ジ13上にチャンバ9を載せてチ
ャンバ9ごと位置決めされる。この場合、液体30全体
をステップ・アンド・リピ−ト動作させるために、チャ
ンバ9内部の液体30が移動時の加速度によって流動す
るので、図7に示すような、板材をメッシュ状に組み合
わせたスタビライザ29をステップ時に液体30中に挿
入して、液体30の流動や波立ちを押さえられる構造に
なっている。なお、実施例2の構成に対しても、同様の
ステージ構成を適用することができる。また、スタビラ
イザ29を、図13に示すように、中心に投影レンズ4
を通すための穴を設けた形状にしてもよい。

【0028】実施例5 図8は、本発明の第5の実施例に係る液浸式露光装置の
ステージ部分を示す断面図である。これは、実施例1の
構成において、液体30中に不純物が混入するのを防ぐ
ために、XYステ−ジ13の駆動系を、実施例4の場合
と同様に、チャンバ9の外部に置くように構成したもの
である。ただしこの場合は、同図に示すように、微動ス
テ−ジ14の底面に磁石27を配し、チャンバ9の底面
を透磁性の材料で構成して、チャンバ9の下部にあるX
Yステ−ジ13上の磁石28と磁気的に結合させ、チャ
ンバ9の底面を微動ステ−ジ14のガイドとして、XY
ステ−ジ13を移動させることにより、チャンバ9内の
微動ステ−ジ14を間接的に駆動させるように構成す
る。

【0029】実施例6 図14は、本発明の第6の実施例に係る液浸式露光装置
のステージ部分を示す断面図である。これは、実施例2
の構成において、液体30中に不純物が混入するのを防
ぐために、XYステ−ジ13の駆動系を、実施例5の場
合と同様に、チャンバ9の外部に置き、微動ステ−ジ1
4の底面に磁石27を配し、チャンバ9の底面を透磁性
の材料で構成して、チャンバ9の下部にあるXYステ−
ジ13上の磁石28と磁気的に結合させ、チャンバ9の
底面を微動ステ−ジ14のガイドとして、XYステ−ジ
13を移動させることにより、チャンバ9内の微動ステ
−ジ14を間接的に駆動させるように構成したものであ
る。またさらに、微動ステージ14下面に液体を吹き出
すノズルを設け、液浸に使用している液体30をそこか
ら噴出させるようにして、流体ベアリングガイド32を
構成している。これにより、ステップ・アンド・リピー
ト動作時の可動部分の質量を軽くすることができるた
め、スループットをさらに向上させることができる。

【0030】実施例7 図9は、本発明の第7の実施例に係る液浸式露光装置の
ステージ部分を示す断面図である。これは、ウエハチャ
ック12を含む部分のみをチャンバ9内に配置しあるい
はチャンバ9の底面にウエハチャック12を直接構成
し、微動ステージ14上にチャンバ9を配置したもので
ある。この場合、チャンバ9の底面とこれに隣接する2
面とがそれぞれ直角になるようにこれらを低熱膨張材料
で構成し、この2面をレ−ザ干渉計15の計測用の参照
面とすることも可能である。

【0031】なお、上述各実施例において、ウエハをウ
エハチャック12上に搬入しあるいはチャック12上か
らウエハを搬出するための搬送装置は、チャンバ9の中
に構成することもチャンバ9の外に構成することも可能
である。

【0032】

【発明の効果】以上説明したように本発明によれば、解
像度や焦点深度を高める液浸法を、実際の製造工程で十
部に使用できる態様で、露光装置に適用することができ
るようになる。したがって、g線、i線、或はエキシマ
レーザ等の、露光光源の波長に拘らず、どの波長でも、
それぞれの波長に応じた効果を期待できるコストの安い
液浸式露光装置を提供し、更には、従来のプロセス技術
を生かせる液浸式露光装置を提供することができる。

【図面の簡単な説明】

【図1】 本発明の第1の実施例に係る液浸式投影露光
装置の構成を示す構成図である。

【図2】 図1の装置に適用される光学素子の断面図で
ある。

【図3】 図1の装置に適用される他の光学素子の断面
図である。

【図4】 図1の装置に適用されるさらに他の光学素子
の断面図である。

【図5】 図1の装置において、チャンバの側面にレー
ザ干渉計を直接取り付けた場合を示すの断面図である。

【図6】 本発明の第4の実施例に係る液浸式露光装置
のステージ部分を示す断面図である。

【図7】 図6の装置に適用されるスタビライザの斜視
図である。

【図8】 本発明の第5の実施例に係る液浸式露光装置
のステージ部分を示す断面図である。

【図9】 本発明の第7の実施例に係る液浸式露光装置
のステージ部分を示す断面図である。

【図10】 液浸の効果を説明するための断面図であ
る。

【図11】 本発明の第2の実施例に係る液浸式投影露
光装置の構成図である。

【図12】 図11におけるウエハチャックの断面図で
ある。

【図13】 図14の装置に適用できるスタビライザの
斜視図である。

【図14】 図11におけるステージ部分の変形例を示
す模式図である。

【符号の説明】

1:レチクル、2:ウエハ、3:照明光学系、4:投影
光学系、5:レチクルステージ、6:アライメント光学
系、7:光学素子、8:シール、9:液槽、10:ウエ
ハカセット、12:ウエハチャック、11−1〜11−
4:粗位置決め装置、13:XYステージ、14:微動
ステージ、15:レーザ干渉計、16:参照ミラー、1
7:窓、18:断熱材、19:液面ゲージ、20:温度
計、21:温度コントローラ、22:ポンプ、23:フ
ィルタ、24:測定器、25:超音波加振装置、26:
防振架台、27,28:磁石、29:スタビライザ、:
30:液体、31:搬送口、32:流体ベアリングガイ
ド、33:真空ポンプ、34:バルブ、35:ブロア、
36:圧力計、37:シャッタ機構。

Claims (40)

    【特許請求の範囲】
  1. 【請求項1】 レチクルを照明する照明手段、これによ
    って照明されたレチクル上のパターンをウエハ上に投影
    する投影光学手段、ウエハを所定位置に位置決めする位
    置決め手段を備えた投影露光装置において、投影光学手
    段はウエハの露光面に対向し、平面もしくはウエハ側へ
    凸んだ凸面を有する光学素子、およびこの光学素子の平
    面もしくは凸面とウエハの露光面との間を少なくとも満
    たす液体を保持するための液槽を具備することを特徴と
    する液浸式投影露光装置。
  2. 【請求項2】 位置決め手段は、ウエハ位置を検出する
    アライメント計測手段と、投影光学手段のフォーカス位
    置に対するウエハ露光面の位置を検出するフォーカス位
    置検出手段と、ウエハをその露光面に平行なXおよびY
    方向、これらに垂直な軸の回りのθ方向、Z方向、なら
    びにウエハを任意の方向に傾ける方向にウエハを保持し
    て駆動するウエハ駆動手段と、ウエハ駆動手段の保持位
    置上にウエハを搬入しおよび搬出するウエハ搬送手段と
    を備えることを特徴とする請求項1記載の液浸式投影露
    光装置。
  3. 【請求項3】 ウエハに対向する光学素子は平行平面ガ
    ラスである請求項2記載の液浸式投影露光装置。
  4. 【請求項4】 投影光学手段は鏡筒を有し、ウエハに対
    向する光学素子はその鏡筒の下端に取り付けられてお
    り、その光学素子と鏡筒との間にはシール部材が設けて
    あることを特徴とする請求項2記載の液浸式投影露光装
    置。
  5. 【請求項5】 ウエハに対向する光学素子はその光軸方
    向に移動させ、任意の位置に位置決め可能であることを
    特徴とする請求項2記載の液浸式投影露光装置。
  6. 【請求項6】 ウエハに対向する光学素子の平面もしく
    はウエハ側へ凸んだ凸面およびウエハの露光面の少なく
    とも一方には、これら両面間を満たすために使用する液
    体と浸和性のあるコーティング剤が塗布してあることを
    特徴とする請求項2記載の液浸式投影露光装置。
  7. 【請求項7】 液槽の上面は解放されていることを特徴
    とする請求項2記載の液浸式投影露光装置。
  8. 【請求項8】 液槽は閉空間を構成していることを特徴
    とする請求項2記載の液浸式投影露光装置。
  9. 【請求項9】 液槽は開閉可能なウエハ搬送用の窓を有
    することを特徴とする請求項8記載の液浸式投影露光装
    置。
  10. 【請求項10】 液槽はバキュームチャンバを構成して
    いる請求項8記載の液浸式投影露光装置。
  11. 【請求項11】 液槽内の圧力を検出するための圧力計
    を有する請求項8記載の液浸式投影露光装置。
  12. 【請求項12】 液槽内に供給する液体の加圧装置、減
    圧装置のうち少なくとも一方を有する請求項8記載の液
    浸式投影露光装置。
  13. 【請求項13】 液槽内の液体の加圧手段を有する請求
    項8記載の液浸式投影露光装置。
  14. 【請求項14】 液槽は光学手段に対して位置的に固定
    されていることを特徴とする請求項7または8記載の液
    浸式投影露光装置。
  15. 【請求項15】 ウエハ駆動手段は、ウエハをその露光
    面に平行なXおよびY方向に移動させるためのXYステ
    ージおよびその駆動手段を有し、液槽はXYステージに
    位置的に固定されていることを特徴とする請求項7また
    は8記載の液浸式投影露光装置。
  16. 【請求項16】 ウエハ駆動手段は、ウエハをその露光
    面に平行なXおよびY方向に移動させるためのXYステ
    ージおよびその駆動手段を有し、XYステージの駆動部
    は液槽の外部に位置することを特徴とする請求項14ま
    たは15記載の液浸式投影露光装置。
  17. 【請求項17】 ウエハ駆動手段はXおよびY方向にウ
    エハを移動させるためのXYステージおよびウエハを任
    意の方向に傾ける微動ステージを有し、液槽はXYステ
    ージ上に配置されていることを特徴とする請求項7また
    は8記載の液浸式投影露光装置。
  18. 【請求項18】 微動ステージは液槽内に配置され、液
    槽は透磁率の高い材料で構成されており、液槽を介して
    微動ステージとXYステージが磁気結合されていること
    を特徴とする請求項17記載の液浸式投影露光装置。
  19. 【請求項19】 液槽は低熱膨張材料で構成されている
    ことを特徴とする請求項14または15記載の液浸式投
    影露光装置。
  20. 【請求項20】 位置決め手段はレーザ干渉計によりウ
    エハ位置を検出する手段を有し、液槽はこのレーザ干渉
    計のための窓を有することを特徴とする請求項14また
    は15記載の液浸式投影露光装置。
  21. 【請求項21】 位置決め手段はレーザ干渉計によりウ
    エハ位置を検出する手段を有し、このレーザ干渉計は液
    槽に固定されていることを特徴とする請求項14または
    15記載の液浸式投影露光装置。
  22. 【請求項22】 液槽に液体を供給しそのレベルおよび
    量を制御する液体供給制御手段を備えることを特徴とす
    る請求項14または15記載の液浸式投影露光装置。
  23. 【請求項23】 液体供給制御手段は供給する液体をろ
    過する手段を有することを特徴とする請求項22記載の
    液浸式投影露光装置。
  24. 【請求項24】 液槽に満たされた液体を加振する手段
    を備える請求項14または15記載の液浸式投影露光装
    置。
  25. 【請求項25】 ウエハを加振する手段を有する請求項
    14または15記載の液浸式投影露光装置。
  26. 【請求項26】 ウエハに対向する光学素子を加振する
    手段を有する請求項14または15記載の液浸式投影露
    光装置。
  27. 【請求項27】 加振手段は超音波加振装置である請求
    項25または26記載の液浸式投影露光装置。
  28. 【請求項28】 液槽内に供給された液体の温度を計測
    し制御する温度制御手段を備える請求項14または15
    記載の液浸式投影露光装置。
  29. 【請求項29】 液槽内に供給された液体の屈折率を測
    定する屈折率測定手段を備える請求項14または15記
    載の液浸式投影露光装置。
  30. 【請求項30】 液槽内に供給された液体の流動を阻止
    するスタビライザを備える請求項14または15記載の
    液浸式投影露光装置。
  31. 【請求項31】 液槽の外壁は、断熱部材で覆われてい
    る請求項14または15記載の液浸式投影露光装置。
  32. 【請求項32】 ウエハ駆動手段は、ウエハを吸着して
    保持するウエハチャックを備え、このウエハチャックは
    ウエハを真空吸引して吸着するための経路、およびこの
    経路内に液体が流入するのを防止するシャッタを有する
    ことを特徴とする請求項14または15記載の液浸式投
    影露光装置。
  33. 【請求項33】 ウエハ駆動手段はウエハを液槽内の露
    光位置に搬入しおよび搬出するウエハ搬送手段を備え、
    このウエハの搬送手段は、少なくとも一部が液槽内に配
    置されていることを特徴とする請求項14または15記
    載の液浸式投影露光装置。
  34. 【請求項34】 搬送手段は、液槽内に保持された液体
    にウエハを垂直もしくは斜めに搬入し、液体中でウエハ
    を水平にする手段を有する請求項33記載の液浸式投影
    露光装置。
  35. 【請求項35】 搬送手段が液槽内に保持された液体中
    からウエハを搬出する際に、ウエハの少なくとも片面を
    エアーブローする手段を有する請求項33記載の液浸式
    投影露光装置。
  36. 【請求項36】 液体を液槽内に供給しおよび排出させ
    るポンプを有することを特徴とする請求項14または1
    5記載の液浸式投影露光装置。がある。
  37. 【請求項37】 ウエハ駆動手段はXおよびY方向に移
    動するXYステージおよびこれによってXおよびY方向
    に移動されかつウエハを任意の方向に傾ける微動ステー
    ジを有し、液槽は微動ステージ上に固定されていること
    を特徴とする請求項7または8記載の液浸式投影露光装
    置。
  38. 【請求項38】 液槽の底面がウエハを保持するウエハ
    チャックを構成していることを特徴とする請求項37記
    載の液浸式投影露光装置。
  39. 【請求項39】 液槽の少なくとも2側面が直交した平
    面で構成され、これらの平面がレーザ光の反斜面を構成
    していることを特徴とする請求項37記載の液浸式投影
    露光装置。
  40. 【請求項40】 液槽の底面部材と微動ステージ底面と
    が流体ベアリングの平面ガイドを構成していることを特
    徴とする請求項18記載の液浸式投影露光装置。
JP4296518A 1992-10-09 1992-10-09 液浸式投影露光装置 Pending JPH06124873A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4296518A JPH06124873A (ja) 1992-10-09 1992-10-09 液浸式投影露光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4296518A JPH06124873A (ja) 1992-10-09 1992-10-09 液浸式投影露光装置

Publications (1)

Publication Number Publication Date
JPH06124873A true JPH06124873A (ja) 1994-05-06

Family

ID=17834578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4296518A Pending JPH06124873A (ja) 1992-10-09 1992-10-09 液浸式投影露光装置

Country Status (1)

Country Link
JP (1) JPH06124873A (ja)

Cited By (386)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999049504A1 (en) * 1998-03-26 1999-09-30 Nikon Corporation Projection exposure method and system
WO2004053955A1 (ja) * 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
WO2004053953A1 (ja) * 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
WO2004053954A1 (ja) 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
WO2004053956A1 (ja) * 2002-12-10 2004-06-24 Nikon Corporation 露光装置及び露光方法、デバイス製造方法
WO2004053950A1 (ja) 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
WO2004053958A1 (ja) * 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
WO2004053952A1 (ja) * 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
JP2004207711A (ja) * 2002-12-10 2004-07-22 Nikon Corp 露光装置及び露光方法、デバイス製造方法
WO2004076535A1 (ja) * 2003-02-26 2004-09-10 Tokyo Ohka Kogyo Co., Ltd. シルセスキオキサン樹脂、ポジ型レジスト組成物、レジスト積層体及びレジストパターン形成方法
WO2004086468A1 (ja) * 2003-02-26 2004-10-07 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
JP2004282023A (ja) * 2002-12-10 2004-10-07 Nikon Corp 露光装置及びデバイス製造方法
WO2004086470A1 (ja) * 2003-03-25 2004-10-07 Nikon Corporation 露光装置及びデバイス製造方法
WO2004102646A1 (ja) * 2003-05-15 2004-11-25 Nikon Corporation 露光装置及びデバイス製造方法
WO2004105107A1 (ja) * 2003-05-23 2004-12-02 Nikon Corporation 露光装置及びデバイス製造方法
EP1486827A2 (en) * 2003-06-11 2004-12-15 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2004112108A1 (ja) * 2003-06-13 2004-12-23 Nikon Corporation 露光方法、基板ステージ、露光装置、及びデバイス製造方法
JP2005012201A (ja) * 2003-05-28 2005-01-13 Nikon Corp 露光方法及び露光装置、並びにデバイス製造方法
WO2005006417A1 (ja) 2003-07-09 2005-01-20 Nikon Corporation 露光装置及びデバイス製造方法
WO2005020298A1 (ja) * 2003-08-26 2005-03-03 Nikon Corporation 光学素子及び露光装置
WO2005022616A1 (ja) * 2003-08-29 2005-03-10 Nikon Corporation 露光装置及びデバイス製造方法
WO2004093159A3 (en) * 2003-04-09 2005-03-17 Derek Coon Immersion lithography fluid control system
JP2005101487A (ja) * 2002-12-10 2005-04-14 Nikon Corp 露光装置及びデバイス製造方法、露光システム
JP2005101488A (ja) * 2002-12-10 2005-04-14 Nikon Corp 露光装置及び露光方法、デバイス製造方法
WO2004090577A3 (en) * 2003-04-11 2005-04-21 Nippon Kogaku Kk Maintaining immersion fluid under a lithographic projection lens
WO2005036623A1 (ja) * 2003-10-08 2005-04-21 Zao Nikon Co., Ltd. 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造方法
WO2005036621A1 (ja) * 2003-10-08 2005-04-21 Zao Nikon Co., Ltd. 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造方法
JP2005116571A (ja) * 2003-10-02 2005-04-28 Nikon Corp 露光装置及びデバイス製造方法
WO2005031799A3 (ja) * 2003-09-29 2005-06-23 Nippon Kogaku Kk 露光装置、露光方法及びデバイス製造方法
JP2005183416A (ja) * 2003-12-16 2005-07-07 Tadahiro Omi 露光方法、及び液浸型露光装置
WO2005067013A1 (ja) * 2004-01-05 2005-07-21 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
WO2005067011A1 (ja) * 2004-01-07 2005-07-21 Tokyo Electron Limited 塗布・現像装置及び塗布・現像方法
WO2005074014A1 (ja) * 2004-02-02 2005-08-11 Nikon Corporation ステージ駆動方法及びステージ装置、露光装置、並びにデバイス製造方法
WO2005076323A1 (ja) 2004-02-10 2005-08-18 Nikon Corporation 露光装置及びデバイス製造方法、メンテナンス方法及び露光方法
WO2005081292A1 (ja) * 2004-02-20 2005-09-01 Nikon Corporation 露光装置、供給方法及び回収方法、露光方法、ならびにデバイス製造方法
JP2005252247A (ja) * 2004-02-04 2005-09-15 Nikon Corp 露光装置、露光方法及びデバイス製造方法
JP2005264131A (ja) * 2004-02-16 2005-09-29 Tokyo Ohka Kogyo Co Ltd 液浸露光プロセス用レジスト保護膜形成用材料、および該保護膜を用いたレジストパターン形成方法
US6952253B2 (en) 2002-11-12 2005-10-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005277363A (ja) * 2003-05-23 2005-10-06 Nikon Corp 露光装置及びデバイス製造方法
WO2005093791A1 (ja) * 2004-03-25 2005-10-06 Nikon Corporation 露光装置及びデバイス製造方法
US6954256B2 (en) 2003-08-29 2005-10-11 Asml Netherlands B.V. Gradient immersion lithography
EP1598705A1 (en) * 2004-05-18 2005-11-23 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005122218A1 (ja) 2004-06-09 2005-12-22 Nikon Corporation 露光装置及びデバイス製造方法
WO2005124420A1 (ja) * 2004-06-16 2005-12-29 Nikon Corporation 光学系、露光装置、および露光方法
WO2005124833A1 (ja) 2004-06-21 2005-12-29 Nikon Corporation 露光装置及びその部材の洗浄方法、露光装置のメンテナンス方法、メンテナンス機器、並びにデバイス製造方法
WO2005054955A3 (en) * 2003-11-24 2006-01-05 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
WO2006013734A1 (ja) * 2004-08-03 2006-02-09 Nikon Corporation 投影光学系、露光装置、および露光方法
EP1630610A1 (en) 2004-08-11 2006-03-01 Fuji Photo Film Co., Ltd. Protective film-forming composition for immersion exposure and pattern forming method using the same
US7009682B2 (en) 2002-11-18 2006-03-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7009148B2 (en) 2002-10-11 2006-03-07 Kabushiki Kaisha Toshiba Method of processing a substrate, heating apparatus, and method of forming a pattern
US7012673B2 (en) 2003-06-27 2006-03-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2006041086A1 (ja) * 2004-10-13 2006-04-20 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
US7034917B2 (en) 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7038760B2 (en) 2003-06-30 2006-05-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7050146B2 (en) 2004-02-09 2006-05-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006135165A (ja) * 2004-11-08 2006-05-25 Nikon Corp 露光装置及びデバイス製造方法
WO2006054719A1 (ja) * 2004-11-19 2006-05-26 Nikon Corporation メンテナンス方法、露光方法、露光装置及びデバイス製造方法
US7053983B2 (en) 2003-09-04 2006-05-30 Canon Kabushiki Kaisha Liquid immersion type exposure apparatus
JP2006140459A (ja) * 2004-10-13 2006-06-01 Nikon Corp 露光装置、露光方法及びデバイス製造方法
JP2006148133A (ja) * 2004-11-23 2006-06-08 Taiwan Semiconductor Manufacturing Co Ltd メガソニック超音波リンスを使用するイマージョン式フォトリソグラフィ
US7075616B2 (en) 2002-11-12 2006-07-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006190971A (ja) * 2004-10-13 2006-07-20 Nikon Corp 露光装置、露光方法及びデバイス製造方法
US7081943B2 (en) 2002-11-12 2006-07-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2006080516A1 (ja) 2005-01-31 2006-08-03 Nikon Corporation 露光装置及びデバイス製造方法
US7110081B2 (en) 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7110087B2 (en) 2003-06-30 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7113259B2 (en) 2003-10-31 2006-09-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7116395B2 (en) 2003-06-25 2006-10-03 Canon Kabushiki Kaisha Liquid immersion type exposure apparatus
US7119874B2 (en) 2003-06-27 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7119876B2 (en) 2004-10-18 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006295161A (ja) * 2005-04-05 2006-10-26 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
JP2006295107A (ja) * 2004-08-03 2006-10-26 Nikon Corp 露光装置、露光方法及びデバイス製造方法
US7133114B2 (en) 2004-09-20 2006-11-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006310723A (ja) * 2004-11-10 2006-11-09 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2006310724A (ja) * 2004-11-10 2006-11-09 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2006313904A (ja) * 2005-05-03 2006-11-16 Asml Netherlands Bv リソグラフィ装置及びデバイス製造方法
US7145630B2 (en) 2004-11-23 2006-12-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR100659259B1 (ko) * 2003-08-29 2006-12-19 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조방법
KR100659257B1 (ko) * 2003-08-29 2006-12-19 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조방법
JP2006528835A (ja) * 2003-07-24 2006-12-21 カール・ツアイス・エスエムテイ・アーゲー マイクロリソグラフィ投影露光装置および浸漬液体を浸漬空間へ導入する方法
WO2006137410A1 (ja) 2005-06-21 2006-12-28 Nikon Corporation 露光装置及び露光方法、メンテナンス方法、並びにデバイス製造方法
US7158211B2 (en) 2003-09-29 2007-01-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7161654B2 (en) 2004-12-02 2007-01-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7161663B2 (en) 2004-07-22 2007-01-09 Asml Netherlands B.V. Lithographic apparatus
WO2007004567A1 (ja) 2005-07-01 2007-01-11 Nikon Corporation 露光装置、露光方法及びデバイス製造方法、並びにシステム
JP2007502539A (ja) * 2003-08-11 2007-02-08 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッドAdvanced Micro Devices Incorporated 浸漬リソグラフィシステムの監視・制御方法及び装置
US7175968B2 (en) 2003-07-28 2007-02-13 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a substrate
US7180574B2 (en) 2004-03-29 2007-02-20 Canon Kabushiki Kaisha Exposure apparatus and method
US7184122B2 (en) 2003-07-24 2007-02-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2007023813A1 (ja) 2005-08-23 2007-03-01 Nikon Corporation 露光装置及び露光方法、並びにデバイス製造方法
JP2007504646A (ja) * 2003-08-29 2007-03-01 東京エレクトロン株式会社 基板を乾燥させる方法とシステム。
JP2007059929A (ja) * 2003-05-23 2007-03-08 Nikon Corp 露光装置及び露光方法、並びにデバイス製造方法
US7193681B2 (en) 2003-09-29 2007-03-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7193232B2 (en) 2002-11-12 2007-03-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method with substrate measurement not through liquid
US7196770B2 (en) 2004-12-07 2007-03-27 Asml Netherlands B.V. Prewetting of substrate before immersion exposure
US7195860B2 (en) 2003-11-13 2007-03-27 Matsushita Electric Industrial Co., Ltd. Semiconductor manufacturing apparatus and pattern formation method
WO2007034838A1 (ja) 2005-09-21 2007-03-29 Nikon Corporation 露光装置及び露光方法、並びにデバイス製造方法
US7199858B2 (en) 2002-11-12 2007-04-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007103841A (ja) * 2005-10-07 2007-04-19 Toshiba Corp 半導体装置の製造方法
US7209213B2 (en) 2004-10-07 2007-04-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2007055199A1 (ja) 2005-11-09 2007-05-18 Nikon Corporation 露光装置及び方法、並びにデバイス製造方法
WO2007058354A1 (ja) 2005-11-21 2007-05-24 Nikon Corporation 露光方法及びそれを用いたデバイス製造方法、露光装置、並びに基板処理方法及び装置
US7224434B2 (en) * 2004-10-19 2007-05-29 Canon Kabushiki Kaisha Exposure method
US7224431B2 (en) 2005-02-22 2007-05-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7227619B2 (en) 2004-04-01 2007-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2007066679A1 (ja) 2005-12-06 2007-06-14 Nikon Corporation 露光装置、露光方法、投影光学系及びデバイス製造方法
JP2007516613A (ja) * 2003-12-15 2007-06-21 カール・ツアイス・エスエムテイ・アーゲー 少なくとも1つの液体レンズを備えるマイクロリソグラフィー投影対物レンズとしての対物レンズ
JPWO2005057635A1 (ja) * 2003-12-15 2007-07-05 株式会社ニコン 投影露光装置及びステージ装置、並びに露光方法
WO2007077875A1 (ja) 2005-12-28 2007-07-12 Nikon Corporation 露光装置及び露光方法、並びにデバイス製造方法
JP2007180555A (ja) * 2005-12-27 2007-07-12 Asml Netherlands Bv 露光装置および基板端部シール
US7248334B2 (en) 2004-12-07 2007-07-24 Asml Netherlands B.V. Sensor shield
JP2007520893A (ja) * 2004-02-03 2007-07-26 ロチェスター インスティテュート オブ テクノロジー 流体を使用したフォトリソグラフィ法及びそのシステム
US7251017B2 (en) 2003-04-10 2007-07-31 Nikon Corporation Environmental system including a transport region for an immersion lithography apparatus
US7251013B2 (en) 2004-11-12 2007-07-31 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7253879B2 (en) 2005-04-19 2007-08-07 Asml Holding N.V. Liquid immersion lithography system with tilted liquid flow
US7256868B2 (en) 2004-02-09 2007-08-14 Canon Kabushiki Kaisha Projection exposure apparatus, device manufacturing method, and sensor unit
EP1528431A3 (en) * 2003-10-31 2007-08-22 Nikon Corporation Supporting plate, stage device, exposure apparatus and exposure method
WO2007094407A1 (ja) 2006-02-16 2007-08-23 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
WO2007094414A1 (ja) 2006-02-16 2007-08-23 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
WO2007105645A1 (ja) 2006-03-13 2007-09-20 Nikon Corporation 露光装置、メンテナンス方法、露光方法及びデバイス製造方法
JP2007527611A (ja) * 2003-07-08 2007-09-27 株式会社ニコン 液浸リソグラフィ用ウェハテーブル
JP2007531251A (ja) * 2003-11-24 2007-11-01 エーエスエムエル ネザーランズ ビー.ヴイ. オブジェクティブにおける光学素子のための保持装置
US7291850B2 (en) 2005-04-08 2007-11-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7295283B2 (en) 2004-04-02 2007-11-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7301606B2 (en) * 2003-10-31 2007-11-27 Nikon Corporation Supporting plate, stage device, exposure apparatus, and exposure method
US7304715B2 (en) 2004-08-13 2007-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2007138834A1 (ja) 2006-05-31 2007-12-06 Nikon Corporation 露光装置及び露光方法
JP2007329453A (ja) * 2006-04-07 2007-12-20 Carl Zeiss Smt Ag 光学エレメントのための保持デバイス
WO2007145139A1 (ja) 2006-06-16 2007-12-21 Nikon Corporation 可変スリット装置、照明装置、露光装置、露光方法及びデバイス製造方法
US7317507B2 (en) 2005-05-03 2008-01-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2008007633A1 (en) 2006-07-12 2008-01-17 Nikon Corporation Illuminating optical apparatus, exposure apparatus and device manufacturing method
WO2008007632A1 (fr) 2006-07-12 2008-01-17 Nikon Corporation Appareil optique d'éclairage, appareil d'exposition, et procédé de fabrication du dispositif
US7321415B2 (en) 2003-04-10 2008-01-22 Nikon Corporation Environmental system including vacuum scavenge for an immersion lithography apparatus
US7324274B2 (en) 2003-12-24 2008-01-29 Nikon Corporation Microscope and immersion objective lens
US7324185B2 (en) 2005-03-04 2008-01-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7330238B2 (en) 2005-03-28 2008-02-12 Asml Netherlands, B.V. Lithographic apparatus, immersion projection apparatus and device manufacturing method
JP2008505485A (ja) * 2004-07-01 2008-02-21 株式会社ニコン 液浸リソグラフィのための動的流体制御システム
US7342640B2 (en) 2005-10-11 2008-03-11 Canon Kabushiki Kaisha Exposure apparatus and method
US7345737B2 (en) 2003-09-09 2008-03-18 Canon Kabushiki Kaisha Exposure method and apparatus having a projection optical system in which a projection gap is filled with liquid
US7349064B2 (en) 2003-06-27 2008-03-25 Canon Kabushiki Kaisha Immersion exposure technique
JP2008072147A (ja) * 2003-07-31 2008-03-27 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
US7352437B2 (en) 2005-02-08 2008-04-01 Canon Kabushiki Kaisha Exposure apparatus
US7352433B2 (en) 2003-10-28 2008-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7352435B2 (en) 2003-10-15 2008-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7352440B2 (en) 2004-12-10 2008-04-01 Asml Netherlands B.V. Substrate placement in immersion lithography
US7355674B2 (en) 2004-09-28 2008-04-08 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and computer program product
US7359030B2 (en) 2002-11-29 2008-04-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7365827B2 (en) 2004-12-08 2008-04-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7365828B2 (en) 2004-09-03 2008-04-29 Canon Kabushiki Kaisha Exposure apparatus, exposure method, and device manufacturing method
JP2008118114A (ja) * 2006-11-03 2008-05-22 Taiwan Semiconductor Manufacturing Co Ltd 液浸リソグラフィ装置、及び液浸露光方法
JP2008118102A (ja) * 2006-11-03 2008-05-22 Taiwan Semiconductor Manufacturing Co Ltd 液浸リソグラフィ装置、液浸露光方法及び液浸露光装置
US7379162B2 (en) 2003-12-08 2008-05-27 Canon Kabushiki Kaisha Substrate-holding technique
US7378025B2 (en) 2005-02-22 2008-05-27 Asml Netherlands B.V. Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method
US7379155B2 (en) 2004-10-18 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7379159B2 (en) 2004-05-03 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1926129A1 (en) 2003-11-20 2008-05-28 Nikon Corporation Beam transforming element, illumination optical apparatus, exposure apparatus, and exposure method
JP2008134214A (ja) * 2006-11-01 2008-06-12 Lasertec Corp マスク検査装置
US7394521B2 (en) 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2008078688A1 (ja) 2006-12-27 2008-07-03 Nikon Corporation ステージ装置、露光装置、及びデバイスの製造方法
US7397532B2 (en) 2003-04-10 2008-07-08 Nikon Corporation Run-off path to collect liquid for an immersion lithography apparatus
US7399979B2 (en) 2003-05-23 2008-07-15 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
US7399978B2 (en) * 2002-12-19 2008-07-15 Koninklijke Philips Electronics N.V. Method and device for irradiating spots on a layer
US7403261B2 (en) 2004-12-15 2008-07-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7405805B2 (en) 2004-12-28 2008-07-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411657B2 (en) 2004-11-17 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411658B2 (en) 2005-10-06 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411650B2 (en) 2003-06-19 2008-08-12 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
US7414794B2 (en) 2003-04-17 2008-08-19 Nikon Corporation Optical arrangement of autofocus elements for use with immersion lithography
US7414699B2 (en) 2004-11-12 2008-08-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7423720B2 (en) 2004-11-12 2008-09-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7423731B2 (en) 2002-12-03 2008-09-09 Nikon Corporation Illumination optical system, exposure apparatus, and exposure method with polarized switching device
US7428038B2 (en) 2005-02-28 2008-09-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid
JP2008227548A (ja) * 2004-12-20 2008-09-25 Asml Netherlands Bv リソグラフィ装置とデバイス製造方法
US7433015B2 (en) 2003-10-15 2008-10-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7433016B2 (en) 2005-05-03 2008-10-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7443482B2 (en) 2003-04-11 2008-10-28 Nikon Corporation Liquid jet and recovery system for immersion lithography
US7446850B2 (en) 2004-12-03 2008-11-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7450217B2 (en) 2005-01-12 2008-11-11 Asml Netherlands B.V. Exposure apparatus, coatings for exposure apparatus, lithographic apparatus, device manufacturing method, and device manufactured thereby
JP2008277469A (ja) * 2007-04-27 2008-11-13 Hitachi Ltd 感光性sam膜の露光方法および半導体装置の製造方法
US7456929B2 (en) 2004-10-15 2008-11-25 Nikon Corporation Exposure apparatus and device manufacturing method
JP2008288619A (ja) * 2003-11-14 2008-11-27 Asml Netherlands Bv リソグラフィ装置および装置製造方法
US7468779B2 (en) 2005-06-28 2008-12-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7471374B2 (en) 2003-05-01 2008-12-30 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US7474379B2 (en) 2005-06-28 2009-01-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7480029B2 (en) 2003-04-07 2009-01-20 Nikon Corporation Exposure apparatus and method for manufacturing device
US7486381B2 (en) 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7491661B2 (en) 2004-12-28 2009-02-17 Asml Netherlands B.V. Device manufacturing method, top coat material and substrate
JP2009044186A (ja) * 2004-04-14 2009-02-26 Asml Netherlands Bv リソグラフィック装置及びデバイス製造方法
EP2037489A2 (en) 2004-01-15 2009-03-18 Nikon Corporation Exposure apparatus and device producing method
US7514699B2 (en) * 2002-12-19 2009-04-07 Koninklijke Philips Electronics N.V. Method and device for irradiating spots on a layer
US7522259B2 (en) 2003-04-11 2009-04-21 Nikon Corporation Cleanup method for optics in immersion lithography
US7522261B2 (en) 2004-09-24 2009-04-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7522258B2 (en) 2005-06-29 2009-04-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing movement of clean air to reduce contamination
JP2009088563A (ja) * 2004-07-07 2009-04-23 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
US7528931B2 (en) 2004-12-20 2009-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7532306B2 (en) * 2003-05-30 2009-05-12 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus
JP2009105414A (ja) * 2002-12-10 2009-05-14 Nikon Corp 露光方法、及びデバイス製造方法
US7535644B2 (en) 2005-08-12 2009-05-19 Asml Netherlands B.V. Lens element, lithographic apparatus, device manufacturing method, and device manufactured thereby
WO2009078224A1 (ja) 2007-12-17 2009-06-25 Nikon Corporation 照明光学系、露光装置、およびデバイス製造方法
WO2009078223A1 (ja) 2007-12-17 2009-06-25 Nikon Corporation 空間光変調ユニット、照明光学系、露光装置、およびデバイス製造方法
WO2009084644A1 (ja) * 2007-12-28 2009-07-09 Nikon Corporation 露光装置、露光方法、クリーニング装置、及びデバイス製造方法
US7561249B2 (en) 2005-03-18 2009-07-14 Canon Kabushiki Kaisha Exposure apparatus, exposure method, and device manufacturing method
WO2009101958A1 (ja) 2008-02-14 2009-08-20 Nikon Corporation 照明光学系、露光装置、デバイス製造方法、補正フィルター、及び露光光学系
US7583357B2 (en) 2004-11-12 2009-09-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN101526759A (zh) * 2003-09-29 2009-09-09 株式会社尼康 曝光装置
US7589818B2 (en) 2003-12-23 2009-09-15 Asml Netherlands B.V. Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus
JP2009212539A (ja) * 2004-02-18 2009-09-17 Nikon Corp 光学素子及び露光装置
US7599545B2 (en) 2003-09-05 2009-10-06 Hitachi High-Technologies Corporation Method and its apparatus for inspecting defects
JP2009536452A (ja) * 2006-05-09 2009-10-08 カール・ツァイス・エスエムティー・アーゲー 光学結像装置
WO2009125511A1 (ja) 2008-04-11 2009-10-15 株式会社ニコン 空間光変調ユニット、照明光学系、露光装置、およびデバイス製造方法
US7633073B2 (en) 2005-11-23 2009-12-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7652746B2 (en) 2005-06-21 2010-01-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7656501B2 (en) 2005-11-16 2010-02-02 Asml Netherlands B.V. Lithographic apparatus
US7670730B2 (en) 2004-12-30 2010-03-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7684010B2 (en) 2005-03-09 2010-03-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, seal structure, method of removing an object and a method of sealing
US7688436B2 (en) 2006-04-27 2010-03-30 Nikon Corporation Measuring and/or inspecting method, measuring and/or inspecting apparatus, exposure method, device manufacturing method, and device manufacturing apparatus
US7692761B2 (en) 2005-03-25 2010-04-06 Canon Kabushiki Kaisha Exposure apparatus and method, and device manufacturing method
US7692760B2 (en) 2004-08-05 2010-04-06 Canon Kabushiki Kaisha Liquid immersion exposure apparatus, method of controlling the same, and device manufacturing method
US7697110B2 (en) 2004-01-26 2010-04-13 Nikon Corporation Exposure apparatus and device manufacturing method
US7705962B2 (en) 2005-01-14 2010-04-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7705968B2 (en) 2005-03-18 2010-04-27 Nikon Corporation Plate member, substrate holding device, exposure apparatus and method, and device manufacturing method
US7706074B2 (en) 2004-09-13 2010-04-27 Nikon Corporation Projection optical system, method of manufacturing projection optical system, exposure apparatus, and exposure method
JP2010098328A (ja) * 2003-09-29 2010-04-30 Nikon Corp 露光装置及び露光方法並びにデバイス製造方法
US7738074B2 (en) 2003-07-16 2010-06-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7742147B2 (en) 2005-10-11 2010-06-22 Canon Kabushiki Kaisha Exposure apparatus
US7751027B2 (en) 2005-06-21 2010-07-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2010153933A (ja) * 2010-04-05 2010-07-08 Nikon Corp 露光装置及びデバイス製造方法
US7773195B2 (en) 2005-11-29 2010-08-10 Asml Holding N.V. System and method to increase surface tension and contact angle in immersion lithography
US7782442B2 (en) 2005-12-06 2010-08-24 Nikon Corporation Exposure apparatus, exposure method, projection optical system and device producing method
US7791709B2 (en) 2006-12-08 2010-09-07 Asml Netherlands B.V. Substrate support and lithographic process
EP2226682A2 (en) 2004-08-03 2010-09-08 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP2010199615A (ja) * 2003-05-28 2010-09-09 Nikon Corp 露光方法及び露光装置、並びにデバイス製造方法
US7804577B2 (en) 2005-11-16 2010-09-28 Asml Netherlands B.V. Lithographic apparatus
US7804576B2 (en) 2004-12-06 2010-09-28 Nikon Corporation Maintenance method, maintenance device, exposure apparatus, and device manufacturing method
US7804574B2 (en) 2003-05-30 2010-09-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method using acidic liquid
US7803516B2 (en) 2005-11-21 2010-09-28 Nikon Corporation Exposure method, device manufacturing method using the same, exposure apparatus, and substrate processing method and apparatus
US7811740B2 (en) 2004-10-08 2010-10-12 Fujifilm Corporation Positive resist composition and pattern-forming method using the same
US7812926B2 (en) 2005-08-31 2010-10-12 Nikon Corporation Optical element, exposure apparatus based on the use of the same, exposure method, and method for producing microdevice
US7817245B2 (en) 2003-09-29 2010-10-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7826031B2 (en) 2003-08-29 2010-11-02 Nikon Corporation Liquid recovery apparatus, exposure apparatus, exposure method, and device manufacturing method
US7834974B2 (en) 2005-06-28 2010-11-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7839485B2 (en) 2006-01-19 2010-11-23 Nikon Corporation Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method
US7839483B2 (en) 2005-12-28 2010-11-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a control system
US7851363B2 (en) 2004-01-15 2010-12-14 Kabushiki Kaisha Toshiba Pattern forming method and manufacturing method of semiconductor device
US7852456B2 (en) 2004-10-13 2010-12-14 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
EP2264534A2 (en) 2003-07-28 2010-12-22 Nikon Corporation Exposure apparatus, method for producing device, and method for controlling exposure apparatus
US7864291B2 (en) 2005-03-18 2011-01-04 Canon Kabushiki Kaisha Exposure apparatus and device manufacturing method
US7864292B2 (en) 2005-11-16 2011-01-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2273304A1 (en) 2007-10-24 2011-01-12 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US7872730B2 (en) 2006-09-15 2011-01-18 Nikon Corporation Immersion exposure apparatus and immersion exposure method, and device manufacturing method
US7876418B2 (en) 2002-12-10 2011-01-25 Nikon Corporation Optical element and projection exposure apparatus based on use of the optical element
US7875418B2 (en) 2004-03-16 2011-01-25 Carl Zeiss Smt Ag Method for a multiple exposure, microlithography projection exposure installation and a projection system
EP2278380A1 (en) 2007-09-14 2011-01-26 Nikon Corporation Design and manufacturing method of an optical element
EP2284614A2 (en) 2003-10-09 2011-02-16 Nikon Corporation Exposure apparatus, exposure method and device producing method
US7894040B2 (en) 2004-10-05 2011-02-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7892722B2 (en) 2004-05-17 2011-02-22 Fujifilm Corporation Pattern forming method
WO2011021444A1 (en) 2009-08-17 2011-02-24 Nikon Corporation Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method
JP2011049607A (ja) * 2003-07-09 2011-03-10 Nikon Corp 露光装置、露光方法、並びにデバイス製造方法
US7914972B2 (en) 2004-07-21 2011-03-29 Nikon Corporation Exposure method and device manufacturing method
US7924416B2 (en) 2005-06-22 2011-04-12 Nikon Corporation Measurement apparatus, exposure apparatus, and device manufacturing method
US7932996B2 (en) 2003-10-28 2011-04-26 Nikon Corporation Exposure apparatus, exposure method, and device fabrication method
US7948604B2 (en) 2002-12-10 2011-05-24 Nikon Corporation Exposure apparatus and method for producing device
US7973910B2 (en) 2006-11-17 2011-07-05 Nikon Corporation Stage apparatus and exposure apparatus
JP2011138164A (ja) * 2004-01-16 2011-07-14 Carl Zeiss Smt Gmbh 偏光変調光学素子
US8004658B2 (en) 2004-10-19 2011-08-23 Nikon Corporation Lighting optical device, exposure system, and exposure method
WO2011105308A1 (en) 2010-02-25 2011-09-01 Nikon Corporation Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method
WO2011105307A1 (en) 2010-02-25 2011-09-01 Nikon Corporation Measuring method and measuring apparatus of pupil transmittance distribution, exposure method and exposure apparatus, and device manufacturing method
US8013975B2 (en) 2006-12-01 2011-09-06 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8018573B2 (en) 2005-02-22 2011-09-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8035797B2 (en) 2003-09-26 2011-10-11 Nikon Corporation Projection exposure apparatus, cleaning and maintenance methods of a projection exposure apparatus, and device manufacturing method
US8035799B2 (en) 2004-12-09 2011-10-11 Nikon Corporation Exposure apparatus, exposure method, and device producing method
US8040490B2 (en) 2006-12-01 2011-10-18 Nikon Corporation Liquid immersion exposure apparatus, exposure method, and method for producing device
US8040489B2 (en) 2004-10-26 2011-10-18 Nikon Corporation Substrate processing method, exposure apparatus, and method for producing device by immersing substrate in second liquid before immersion exposure through first liquid
US8045135B2 (en) 2006-11-22 2011-10-25 Asml Netherlands B.V. Lithographic apparatus with a fluid combining unit and related device manufacturing method
US8045134B2 (en) 2006-03-13 2011-10-25 Asml Netherlands B.V. Lithographic apparatus, control system and device manufacturing method
US8054465B2 (en) 2004-11-18 2011-11-08 Nikon Corporation Position measurement method
US8054445B2 (en) 2005-08-16 2011-11-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8059257B2 (en) 2006-09-04 2011-11-15 Canon Kabushiki Kaisha Exposure apparatus and device manufacturing method
US8064037B2 (en) 2003-08-21 2011-11-22 Nikon Corporation Immersion exposure apparatus and device manufacturing method with no liquid recovery during exposure
US8064039B2 (en) 2005-04-25 2011-11-22 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US8070145B2 (en) 2005-08-26 2011-12-06 Nikon Corporation Holding unit, assembly system, sputtering unit, and processing method and processing unit
EP2392971A1 (en) 2006-11-16 2011-12-07 Nikon Corporation Surface treatment method and surface treatment apparatus, exposure method and exposure apparatus, and device manufacturing method
US20110310366A1 (en) * 2010-06-16 2011-12-22 Canon Kabushiki Kaisha Exposure apparatus and article manufacturing method
WO2011158912A1 (ja) 2010-06-19 2011-12-22 株式会社ニコン 照明光学系、露光装置、およびデバイス製造方法
US8090875B2 (en) 2005-10-28 2012-01-03 Nikon Corporation Device and method for connecting device manufacturing processing apparatuses, program, device manufacturing processing system, exposure apparatus and method, and measurement and inspection apparatus and method
US8089608B2 (en) 2005-04-18 2012-01-03 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8102512B2 (en) 2004-09-17 2012-01-24 Nikon Corporation Substrate holding device, exposure apparatus, and device manufacturing method
US8111374B2 (en) 2005-09-09 2012-02-07 Nikon Corporation Analysis method, exposure method, and device manufacturing method
US8134681B2 (en) 2006-02-17 2012-03-13 Nikon Corporation Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium
US8144308B2 (en) 2007-11-08 2012-03-27 Nikon Corporation Spatial light modulation unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US8159650B2 (en) 2006-03-07 2012-04-17 Nikon Corporation Device manufacturing method, device manufacturing system, and measurement/inspection apparatus
US8164736B2 (en) 2007-05-29 2012-04-24 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
US8164734B2 (en) 2004-06-16 2012-04-24 Asml Netherlands B.V. Vacuum system for immersion photolithography
US8179517B2 (en) 2005-06-30 2012-05-15 Nikon Corporation Exposure apparatus and method, maintenance method for exposure apparatus, and device manufacturing method
US8189168B2 (en) 2007-05-28 2012-05-29 Nikon Corporation Exposure apparatus, device production method, cleaning apparatus, cleaning method, and exposure method
US8208119B2 (en) 2004-02-04 2012-06-26 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8236467B2 (en) 2005-04-28 2012-08-07 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US8237915B2 (en) 2002-12-10 2012-08-07 Carl Zeiss Smt Gmbh Method for improving an optical imaging property of a projection objective of a microlithographic projection exposure apparatus
DE112010002795T5 (de) 2009-07-01 2012-08-23 Nikon Corporation Schleifvorrichtung, Schleifverfahren, Belichtungsvorrichtung undVerfahren zum Herstellen eines Bauelements
US8253924B2 (en) 2005-05-24 2012-08-28 Nikon Corporation Exposure method, exposure apparatus and device manufacturing method
US8253921B2 (en) 2003-09-03 2012-08-28 Nikon Corporation Exposure apparatus and device fabricating method
US8294873B2 (en) 2004-11-11 2012-10-23 Nikon Corporation Exposure method, device manufacturing method, and substrate
US8325326B2 (en) 2004-06-07 2012-12-04 Nikon Corporation Stage unit, exposure apparatus, and exposure method
US8323855B2 (en) 2007-03-01 2012-12-04 Nikon Corporation Pellicle frame apparatus, mask, exposing method, exposure apparatus, and device fabricating method
US8330939B2 (en) 2004-11-01 2012-12-11 Nikon Corporation Immersion exposure apparatus and device manufacturing method with a liquid recovery port provided on at least one of a first stage and second stage
WO2012172705A1 (ja) 2011-06-13 2012-12-20 株式会社ニコン 照明光学系、露光装置、およびデバイス製造方法
US8339614B2 (en) 2005-03-25 2012-12-25 Nikon Corporation Method of measuring shot shape and mask
US8368870B2 (en) 2004-06-21 2013-02-05 Nikon Corporation Exposure apparatus and device manufacturing method
US8373843B2 (en) 2004-06-10 2013-02-12 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8411271B2 (en) 2005-12-28 2013-04-02 Nikon Corporation Pattern forming method, pattern forming apparatus, and device manufacturing method
KR101257960B1 (ko) * 2004-06-04 2013-04-24 칼 짜이스 에스엠테 게엠베하 광학적 결상 시스템의 결상 품질을 측정하기 위한 시스템
US8451430B2 (en) 2008-12-24 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8477283B2 (en) 2006-05-10 2013-07-02 Nikon Corporation Exposure apparatus and device manufacturing method
US8482716B2 (en) 2004-06-10 2013-07-09 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8488099B2 (en) 2004-04-19 2013-07-16 Nikon Corporation Exposure apparatus and device manufacturing method
EP2615480A1 (en) 2004-02-06 2013-07-17 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US8508713B2 (en) 2004-06-10 2013-08-13 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8540824B2 (en) 2005-09-25 2013-09-24 Sokudo Co., Ltd. Substrate processing method
US8570484B2 (en) 2006-08-30 2013-10-29 Nikon Corporation Immersion exposure apparatus, device manufacturing method, cleaning method, and cleaning member to remove foreign substance using liquid
US8585830B2 (en) 2004-12-06 2013-11-19 Sokudo Co., Ltd. Substrate processing apparatus and substrate processing method
US8609301B2 (en) 2006-09-08 2013-12-17 Nikon Corporation Mask, exposure apparatus and device manufacturing method
US8634053B2 (en) 2006-12-07 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8638422B2 (en) 2005-03-18 2014-01-28 Nikon Corporation Exposure method, exposure apparatus, method for producing device, and method for evaluating exposure apparatus
JP2014017533A (ja) * 2003-07-09 2014-01-30 Nikon Corp 露光装置、及びデバイス製造方法
US8654308B2 (en) 2004-07-12 2014-02-18 Nikon Corporation Method for determining exposure condition, exposure method, exposure apparatus, and method for manufacturing device
US8675174B2 (en) 2004-09-17 2014-03-18 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8681314B2 (en) 2005-10-24 2014-03-25 Nikon Corporation Stage device and coordinate correction method for the same, exposure apparatus, and device manufacturing method
EP2717295A1 (en) 2003-12-03 2014-04-09 Nikon Corporation Exposure apparatus, exposure method, and method for producing a device
US8698998B2 (en) 2004-06-21 2014-04-15 Nikon Corporation Exposure apparatus, method for cleaning member thereof, maintenance method for exposure apparatus, maintenance device, and method for producing device
US8705008B2 (en) 2004-06-09 2014-04-22 Nikon Corporation Substrate holding unit, exposure apparatus having same, exposure method, method for producing device, and liquid repellant plate
US8717533B2 (en) 2004-06-10 2014-05-06 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8721803B2 (en) 2006-12-05 2014-05-13 Nikon Corporation Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus, and device fabricating method
US8780326B2 (en) 2005-09-09 2014-07-15 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8797502B2 (en) 2003-09-29 2014-08-05 Nikon Corporation Exposure apparatus, exposure method, and method for producing device with electricity removal device by adding additive to liquid
US8859188B2 (en) 2005-02-10 2014-10-14 Asml Netherlands B.V. Immersion liquid, exposure apparatus, and exposure process
US8860923B2 (en) 2003-10-28 2014-10-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8891053B2 (en) 2008-09-10 2014-11-18 Asml Netherlands B.V. Lithographic apparatus, method of manufacturing an article for a lithographic apparatus and device manufacturing method
US8928856B2 (en) 2003-10-31 2015-01-06 Nikon Corporation Exposure apparatus and device fabrication method
US8937710B2 (en) 2006-08-31 2015-01-20 Nikon Corporation Exposure method and apparatus compensating measuring error of encoder due to grating section and displacement of movable body in Z direction
US8947635B2 (en) 2008-12-24 2015-02-03 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8947629B2 (en) 2007-05-04 2015-02-03 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
US8947637B2 (en) 2003-08-29 2015-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8964163B2 (en) 2003-07-28 2015-02-24 Asml Netherlands B.V. Immersion lithographic apparatus and device manufacturing method with a projection system having a part movable relative to another part
US8964164B2 (en) 2003-05-13 2015-02-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR20150039869A (ko) * 2003-10-22 2015-04-13 가부시키가이샤 니콘 노광 장치, 노광 방법, 디바이스의 제조 방법
US9013672B2 (en) 2007-05-04 2015-04-21 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
KR20150046360A (ko) * 2004-06-10 2015-04-29 가부시키가이샤 니콘 노광 장치, 노광 방법, 및 디바이스 제조 방법
US9097981B2 (en) 2007-10-12 2015-08-04 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US9097992B2 (en) 2004-08-19 2015-08-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US9122170B2 (en) 2010-08-02 2015-09-01 Nikon Corporation Transmission optical system, illumination optical system, exposure apparatus, and device manufacturing method
US9195069B2 (en) 2006-04-17 2015-11-24 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US9224632B2 (en) 2004-12-15 2015-12-29 Nikon Corporation Substrate holding apparatus, exposure apparatus, and device fabricating method
US9235133B2 (en) 2004-08-17 2016-01-12 Nikon Corporation Lighting optical device, regulation method for lighting optical device, exposure system, and exposure method
US9239524B2 (en) 2005-03-30 2016-01-19 Nikon Corporation Exposure condition determination method, exposure method, exposure apparatus, and device manufacturing method involving detection of the situation of a liquid immersion region
US9250537B2 (en) 2004-07-12 2016-02-02 Nikon Corporation Immersion exposure apparatus and method with detection of liquid on members of the apparatus
US9256136B2 (en) 2010-04-22 2016-02-09 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method involving gas supply
US9329060B2 (en) 2006-02-21 2016-05-03 Nikon Corporation Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method
US9341956B2 (en) 2009-12-23 2016-05-17 Nikon Corporation Spatial light modulator unit, illumination optical system, exposure device, and device manufacturing method
US9377698B2 (en) 2006-09-01 2016-06-28 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method
US9423698B2 (en) 2003-10-28 2016-08-23 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9436095B2 (en) 2004-01-20 2016-09-06 Carl Zeiss Smt Gmbh Exposure apparatus and measuring device for a projection lens
US9477158B2 (en) 2006-04-14 2016-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9482966B2 (en) 2002-11-12 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9513560B2 (en) 2011-10-24 2016-12-06 Nikon Corporation Illumination optical assembly, exposure apparatus, and device manufacturing method
US9551943B2 (en) 2003-06-19 2017-01-24 Nikon Corporation Exposure apparatus and device manufacturing method
US9581911B2 (en) 2004-01-16 2017-02-28 Carl Zeiss Smt Gmbh Polarization-modulating optical element
US9581811B2 (en) 2012-05-02 2017-02-28 Nikon Corporation Method for evaluating and improving pupil luminance distribution, illumination optical system and adjustment method thereof, exposure apparatus, exposure method, and device manufacturing method
US9632425B2 (en) 2006-12-07 2017-04-25 Asml Holding N.V. Lithographic apparatus, a dryer and a method of removing liquid from a surface
US9678437B2 (en) 2003-04-09 2017-06-13 Nikon Corporation Illumination optical apparatus having distribution changing member to change light amount and polarization member to set polarization in circumference direction
US9690214B2 (en) 2006-02-21 2017-06-27 Nikon Corporation Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method
US9703199B2 (en) 2004-12-06 2017-07-11 Screen Semiconductor Solutions Co., Ltd. Substrate processing apparatus
US9798245B2 (en) 2003-12-15 2017-10-24 Nikon Corporation Exposure apparatus, and exposure method, with recovery device to recover liquid leaked from between substrate and member
US9817319B2 (en) 2003-09-03 2017-11-14 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US9857697B2 (en) 2006-02-21 2018-01-02 Nikon Corporation Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method, and device manufacturing method
US9874822B2 (en) 2006-09-01 2018-01-23 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US9891539B2 (en) 2005-05-12 2018-02-13 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9958792B2 (en) 2006-08-31 2018-05-01 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
USRE46933E1 (en) 2005-04-08 2018-07-03 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
US10061207B2 (en) 2005-12-02 2018-08-28 Asml Netherlands B.V. Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus
US10067428B2 (en) 2006-08-31 2018-09-04 Nikon Corporation Movable body drive system and movable body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision-making method
US10151983B2 (en) 2004-02-03 2018-12-11 Nikon Corporation Exposure apparatus and device manufacturing method
US10175583B2 (en) 2011-06-07 2019-01-08 Nikon Corporation Illumination optical system, exposure apparatus, device production method, and light polarization unit
EP3428723A1 (en) 2005-08-31 2019-01-16 Nikon Corporation Optical element, exposure apparatus based on the use of the same, exposure method and method for producing microdevice

Cited By (1108)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999049504A1 (en) * 1998-03-26 1999-09-30 Nikon Corporation Projection exposure method and system
US7009148B2 (en) 2002-10-11 2006-03-07 Kabushiki Kaisha Toshiba Method of processing a substrate, heating apparatus, and method of forming a pattern
US7294586B2 (en) 2002-10-11 2007-11-13 Kabushiki Kaisha Toshiba Method of processing a substrate, heating apparatus, and method of forming a pattern
US8446568B2 (en) 2002-11-12 2013-05-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9740107B2 (en) 2002-11-12 2017-08-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9588442B2 (en) 2002-11-12 2017-03-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7199858B2 (en) 2002-11-12 2007-04-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9482966B2 (en) 2002-11-12 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9366972B2 (en) 2002-11-12 2016-06-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9360765B2 (en) 2002-11-12 2016-06-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9195153B2 (en) 2002-11-12 2015-11-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7193232B2 (en) 2002-11-12 2007-03-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method with substrate measurement not through liquid
US7110081B2 (en) 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7932999B2 (en) 2002-11-12 2011-04-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7081943B2 (en) 2002-11-12 2006-07-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9091940B2 (en) 2002-11-12 2015-07-28 Asml Netherlands B.V. Lithographic apparatus and method involving a fluid inlet and a fluid outlet
US7075616B2 (en) 2002-11-12 2006-07-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9057967B2 (en) 2002-11-12 2015-06-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7482611B2 (en) 2002-11-12 2009-01-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7224436B2 (en) 2002-11-12 2007-05-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9885965B2 (en) 2002-11-12 2018-02-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7795603B2 (en) 2002-11-12 2010-09-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10191389B2 (en) 2002-11-12 2019-01-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US6952253B2 (en) 2002-11-12 2005-10-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10222706B2 (en) 2002-11-12 2019-03-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10261428B2 (en) 2002-11-12 2019-04-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8344341B2 (en) 2002-11-12 2013-01-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9097987B2 (en) 2002-11-12 2015-08-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7119881B2 (en) 2002-11-18 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7009682B2 (en) 2002-11-18 2006-03-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7359030B2 (en) 2002-11-29 2008-04-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7515248B2 (en) 2002-12-03 2009-04-07 Nikon Corporation Illumination optical system, exposure apparatus, and exposure method with polarized state detection result and adjustment
US7423731B2 (en) 2002-12-03 2008-09-09 Nikon Corporation Illumination optical system, exposure apparatus, and exposure method with polarized switching device
US7515247B2 (en) 2002-12-03 2009-04-07 Nikon Corporation Illumination optical system, exposure apparatus, and exposure method with polarized state fluctuation correcting device
KR101037057B1 (ko) * 2002-12-10 2011-05-26 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US8767173B2 (en) 2002-12-10 2014-07-01 Nikon Corporation Optical element and projection exposure apparatus based on use of the optical element
WO2004053954A1 (ja) 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
EP1571701A1 (en) * 2002-12-10 2005-09-07 Nikon Corporation Exposure apparatus and method for manufacturing device
US7589821B2 (en) 2002-12-10 2009-09-15 Nikon Corporation Exposure apparatus and device manufacturing method
WO2004053956A1 (ja) * 2002-12-10 2004-06-24 Nikon Corporation 露光装置及び露光方法、デバイス製造方法
JP2005101487A (ja) * 2002-12-10 2005-04-14 Nikon Corp 露光装置及びデバイス製造方法、露光システム
US7589820B2 (en) 2002-12-10 2009-09-15 Nikon Corporation Exposure apparatus and method for producing device
JP2004282023A (ja) * 2002-12-10 2004-10-07 Nikon Corp 露光装置及びデバイス製造方法
JP2009105472A (ja) * 2002-12-10 2009-05-14 Nikon Corp 真空システム、液浸露光装置及び露光方法、デバイス製造方法
WO2004053950A1 (ja) 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
JP2009105414A (ja) * 2002-12-10 2009-05-14 Nikon Corp 露光方法、及びデバイス製造方法
JP2009105471A (ja) * 2002-12-10 2009-05-14 Nikon Corp 露光装置、及びデバイス製造方法
US8237915B2 (en) 2002-12-10 2012-08-07 Carl Zeiss Smt Gmbh Method for improving an optical imaging property of a projection objective of a microlithographic projection exposure apparatus
US7515246B2 (en) 2002-12-10 2009-04-07 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
WO2004053958A1 (ja) * 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
JP2005101488A (ja) * 2002-12-10 2005-04-14 Nikon Corp 露光装置及び露光方法、デバイス製造方法
WO2004053953A1 (ja) * 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
WO2004053952A1 (ja) * 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
JP4525827B2 (ja) * 2002-12-10 2010-08-18 株式会社ニコン 露光装置及びデバイス製造方法、露光システム
KR101101737B1 (ko) * 2002-12-10 2012-01-05 가부시키가이샤 니콘 노광장치 및 노광방법, 디바이스 제조방법
SG150388A1 (en) * 2002-12-10 2009-03-30 Nikon Corp Exposure apparatus and method for producing device
US7505111B2 (en) 2002-12-10 2009-03-17 Nikon Corporation Exposure apparatus and device manufacturing method
US8089611B2 (en) 2002-12-10 2012-01-03 Nikon Corporation Exposure apparatus and method for producing device
US7466392B2 (en) 2002-12-10 2008-12-16 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7460207B2 (en) 2002-12-10 2008-12-02 Nikon Corporation Exposure apparatus and method for producing device
JP2004207711A (ja) * 2002-12-10 2004-07-22 Nikon Corp 露光装置及び露光方法、デバイス製造方法
US7876418B2 (en) 2002-12-10 2011-01-25 Nikon Corporation Optical element and projection exposure apparatus based on use of the optical element
US7446851B2 (en) 2002-12-10 2008-11-04 Nikon Corporation Exposure apparatus and device manufacturing method
US7379158B2 (en) 2002-12-10 2008-05-27 Nikon Corporation Exposure apparatus and method for producing device
US7436486B2 (en) 2002-12-10 2008-10-14 Nikon Corporation Exposure apparatus and device manufacturing method
US7436487B2 (en) 2002-12-10 2008-10-14 Nikon Corporation Exposure apparatus and method for producing device
KR101066084B1 (ko) * 2002-12-10 2011-09-20 가부시키가이샤 니콘 노광장치 및 디바이스 제조방법
US7948604B2 (en) 2002-12-10 2011-05-24 Nikon Corporation Exposure apparatus and method for producing device
US7639343B2 (en) 2002-12-10 2009-12-29 Nikon Corporation Exposure apparatus and device manufacturing method
WO2004053955A1 (ja) * 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
EP1571701A4 (en) * 2002-12-10 2008-04-09 Nikon Corp Exposure apparatus and method for manufacturing device
JP2009105473A (ja) * 2002-12-10 2009-05-14 Nikon Corp 露光装置及びデバイス製造方法、露光システム
US7514699B2 (en) * 2002-12-19 2009-04-07 Koninklijke Philips Electronics N.V. Method and device for irradiating spots on a layer
USRE46433E1 (en) 2002-12-19 2017-06-13 Asml Netherlands B.V. Method and device for irradiating spots on a layer
KR100971441B1 (ko) * 2002-12-19 2010-07-21 코닌클리케 필립스 일렉트로닉스 엔.브이. 레이어 상의 스폿을 조사하기 위한 방법 및 장치
US7399978B2 (en) * 2002-12-19 2008-07-15 Koninklijke Philips Electronics N.V. Method and device for irradiating spots on a layer
JP2018106206A (ja) * 2003-02-26 2018-07-05 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
JP2011023765A (ja) * 2003-02-26 2011-02-03 Nikon Corp 露光装置、露光方法及びデバイス製造方法
WO2004076535A1 (ja) * 2003-02-26 2004-09-10 Tokyo Ohka Kogyo Co., Ltd. シルセスキオキサン樹脂、ポジ型レジスト組成物、レジスト積層体及びレジストパターン形成方法
JPWO2004076535A1 (ja) * 2003-02-26 2006-06-01 東京応化工業株式会社 シルセスキオキサン樹脂、ポジ型レジスト組成物、レジスト積層体及びレジストパターン形成方法
US7453550B2 (en) 2003-02-26 2008-11-18 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP2012129565A (ja) * 2003-02-26 2012-07-05 Nikon Corp 露光装置、露光方法及びデバイス製造方法
JP2016075963A (ja) * 2003-02-26 2016-05-12 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
US10180632B2 (en) 2003-02-26 2019-01-15 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP2015121825A (ja) * 2003-02-26 2015-07-02 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
WO2004086468A1 (ja) * 2003-02-26 2004-10-07 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
US7542128B2 (en) 2003-02-26 2009-06-02 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP2009147386A (ja) * 2003-02-26 2009-07-02 Nikon Corp 露光装置、及びデバイス製造方法
JP2014112741A (ja) * 2003-02-26 2014-06-19 Nikon Corp 露光装置、露光方法及びデバイス製造方法
US7268854B2 (en) 2003-02-26 2007-09-11 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP4640516B2 (ja) * 2003-02-26 2011-03-02 株式会社ニコン 露光装置、及びデバイス製造方法
JP2009302596A (ja) * 2003-02-26 2009-12-24 Nikon Corp 露光装置、露光方法及びデバイス製造方法
US9766555B2 (en) 2003-02-26 2017-09-19 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP2010028127A (ja) * 2003-02-26 2010-02-04 Nikon Corp 露光装置、露光方法及びデバイス製造方法
JP2017068287A (ja) * 2003-02-26 2017-04-06 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
US7535550B2 (en) 2003-02-26 2009-05-19 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP2009158977A (ja) * 2003-03-25 2009-07-16 Nikon Corp 露光装置及びデバイス製造方法
WO2004086470A1 (ja) * 2003-03-25 2004-10-07 Nikon Corporation 露光装置及びデバイス製造方法
US7471371B2 (en) 2003-03-25 2008-12-30 Nikon Corporation Exposure apparatus and device fabrication method
US8018570B2 (en) 2003-03-25 2011-09-13 Nikon Corporation Exposure apparatus and device fabrication method
JP2011044736A (ja) * 2003-03-25 2011-03-03 Nikon Corp 露光装置及びデバイス製造方法
US7916272B2 (en) 2003-03-25 2011-03-29 Nikon Corporation Exposure apparatus and device fabrication method
JP2014030061A (ja) * 2003-03-25 2014-02-13 Nikon Corp 露光装置及びデバイス製造方法
JP2012080148A (ja) * 2003-03-25 2012-04-19 Nikon Corp 露光装置及びデバイス製造方法
US7480029B2 (en) 2003-04-07 2009-01-20 Nikon Corporation Exposure apparatus and method for manufacturing device
US9678437B2 (en) 2003-04-09 2017-06-13 Nikon Corporation Illumination optical apparatus having distribution changing member to change light amount and polarization member to set polarization in circumference direction
US9885959B2 (en) 2003-04-09 2018-02-06 Nikon Corporation Illumination optical apparatus having deflecting member, lens, polarization member to set polarization in circumference direction, and optical integrator
US7339650B2 (en) 2003-04-09 2008-03-04 Nikon Corporation Immersion lithography fluid control system that applies force to confine the immersion liquid
US9618852B2 (en) 2003-04-09 2017-04-11 Nikon Corporation Immersion lithography fluid control system regulating flow velocity of gas based on position of gas outlets
US8497973B2 (en) 2003-04-09 2013-07-30 Nikon Corporation Immersion lithography fluid control system regulating gas velocity based on contact angle
WO2004093159A3 (en) * 2003-04-09 2005-03-17 Derek Coon Immersion lithography fluid control system
US8797500B2 (en) 2003-04-09 2014-08-05 Nikon Corporation Immersion lithography fluid control system changing flow velocity of gas outlets based on motion of a surface
US8102501B2 (en) 2003-04-09 2012-01-24 Nikon Corporation Immersion lithography fluid control system using an electric or magnetic field generator
US7456930B2 (en) 2003-04-10 2008-11-25 Nikon Corporation Environmental system including vacuum scavenge for an immersion lithography apparatus
US7355676B2 (en) 2003-04-10 2008-04-08 Nikon Corporation Environmental system including vacuum scavenge for an immersion lithography apparatus
JP2018041111A (ja) * 2003-04-10 2018-03-15 株式会社ニコン 液浸露光装置
US8243253B2 (en) 2003-04-10 2012-08-14 Nikon Corporation Lyophobic run-off path to collect liquid for an immersion lithography apparatus
JP2017037350A (ja) * 2003-04-10 2017-02-16 株式会社ニコン 液浸リソグフラフィ装置用の移送領域を含む環境システム
US7321415B2 (en) 2003-04-10 2008-01-22 Nikon Corporation Environmental system including vacuum scavenge for an immersion lithography apparatus
US9007561B2 (en) 2003-04-10 2015-04-14 Nikon Corporation Immersion lithography apparatus with hydrophilic region encircling hydrophobic region which encircles substrate support
US9977350B2 (en) 2003-04-10 2018-05-22 Nikon Corporation Environmental system including vacuum scavenge for an immersion lithography apparatus
US7397532B2 (en) 2003-04-10 2008-07-08 Nikon Corporation Run-off path to collect liquid for an immersion lithography apparatus
KR20170040370A (ko) * 2003-04-10 2017-04-12 가부시키가이샤 니콘 액침 리소그래피 장치용 진공 배출을 포함하는 환경 시스템
US9632427B2 (en) 2003-04-10 2017-04-25 Nikon Corporation Environmental system including a transport region for an immersion lithography apparatus
US7251017B2 (en) 2003-04-10 2007-07-31 Nikon Corporation Environmental system including a transport region for an immersion lithography apparatus
US9910370B2 (en) 2003-04-10 2018-03-06 Nikon Corporation Environmental system including a transport region for an immersion lithography apparatus
US9658537B2 (en) 2003-04-10 2017-05-23 Nikon Corporation Environmental system including vacuum scavenge for an immersion lithography apparatus
US7345742B2 (en) 2003-04-10 2008-03-18 Nikon Corporation Environmental system including a transport region for an immersion lithography apparatus
KR101364889B1 (ko) * 2003-04-10 2014-02-19 가부시키가이샤 니콘 액침 리소그래피 장치용 진공 배출을 포함하는 환경 시스템
US9958786B2 (en) 2003-04-11 2018-05-01 Nikon Corporation Cleanup method for optics in immersion lithography using object on wafer holder in place of wafer
JP2013251573A (ja) * 2003-04-11 2013-12-12 Nikon Corp 液浸リソグラフィにおける光学素子の洗浄方法
US10185222B2 (en) 2003-04-11 2019-01-22 Nikon Corporation Liquid jet and recovery system for immersion lithography
KR101498405B1 (ko) * 2003-04-11 2015-03-04 가부시키가이샤 니콘 액침 리소그래피 머신에서 웨이퍼 교환동안 투영 렌즈 아래의 갭에서 액침 액체를 유지하는 장치 및 방법
JP2014225703A (ja) * 2003-04-11 2014-12-04 株式会社ニコン 液浸リソグラフィにおける光学素子の洗浄方法
US8059258B2 (en) 2003-04-11 2011-11-15 Nikon Corporation Liquid jet and recovery system for immersion lithography
KR101533206B1 (ko) * 2003-04-11 2015-07-01 가부시키가이샤 니콘 액침 리소그래피 머신에서 웨이퍼 교환동안 투영 렌즈 아래의 갭에서 액침 액체를 유지하는 장치 및 방법
TWI614564B (zh) * 2003-04-11 2018-02-11 尼康股份有限公司 浸沒曝光設備、浸沒曝光方法和元件製造方法
JP2013191884A (ja) * 2003-04-11 2013-09-26 Nikon Corp 液浸リソグラフィ装置、デバイス製造方法
US9946163B2 (en) 2003-04-11 2018-04-17 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
JP2018025818A (ja) * 2003-04-11 2018-02-15 株式会社ニコン 液浸リソグラフィにおける光学系の洗浄方法
TWI486701B (zh) * 2003-04-11 2015-06-01 尼康股份有限公司 浸沒曝光設備、浸沒曝光方法和元件製造方法
JP2016053721A (ja) * 2003-04-11 2016-04-14 株式会社ニコン 液浸リソグラフィにおける光学素子の洗浄方法
TWI397762B (zh) * 2003-04-11 2013-06-01 尼康股份有限公司 浸沒曝光設備、浸沒曝光方法、及元件製造方法
TWI382270B (zh) * 2003-04-11 2013-01-11 尼康股份有限公司 流體浸沒曝光設備和方法以及裝置製造方法
WO2004090577A3 (en) * 2003-04-11 2005-04-21 Nippon Kogaku Kk Maintaining immersion fluid under a lithographic projection lens
US7522259B2 (en) 2003-04-11 2009-04-21 Nikon Corporation Cleanup method for optics in immersion lithography
TWI425302B (zh) * 2003-04-11 2014-02-01 尼康股份有限公司 浸沒曝光設備、浸沒曝光方法、及元件製造方法
US9500960B2 (en) 2003-04-11 2016-11-22 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
JP2011171758A (ja) * 2003-04-11 2011-09-01 Nikon Corp 液浸リソグラフィにおける光学素子の洗浄方法
JP2010093298A (ja) * 2003-04-11 2010-04-22 Nikon Corp 液浸リソグラフィにおける光学素子の洗浄方法
JP2012138624A (ja) * 2003-04-11 2012-07-19 Nikon Corp 液浸リソグラフィにおける光学素子の洗浄方法
US9785057B2 (en) 2003-04-11 2017-10-10 Nikon Corporation Liquid jet and recovery system for immersion lithography
TWI648589B (zh) * 2003-04-11 2019-01-21 日商尼康股份有限公司 浸沒微影設備、浸沒微影方法和元件製造方法
JP2017037333A (ja) * 2003-04-11 2017-02-16 株式会社ニコン 液浸リソグラフィにおける光学素子の洗浄方法
US7932989B2 (en) 2003-04-11 2011-04-26 Nikon Corporation Liquid jet and recovery system for immersion lithography
US7443482B2 (en) 2003-04-11 2008-10-28 Nikon Corporation Liquid jet and recovery system for immersion lithography
US7414794B2 (en) 2003-04-17 2008-08-19 Nikon Corporation Optical arrangement of autofocus elements for use with immersion lithography
US7570431B2 (en) 2003-04-17 2009-08-04 Nikon Corporation Optical arrangement of autofocus elements for use with immersion lithography
US7471374B2 (en) 2003-05-01 2008-12-30 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US9798246B2 (en) 2003-05-13 2017-10-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8964164B2 (en) 2003-05-13 2015-02-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9477160B2 (en) 2003-05-13 2016-10-25 Asml Netherland B.V. Lithographic apparatus and device manufacturing method
WO2004102646A1 (ja) * 2003-05-15 2004-11-25 Nikon Corporation 露光装置及びデバイス製造方法
JPWO2004102646A1 (ja) * 2003-05-15 2006-07-13 株式会社ニコン 露光装置及びデバイス製造方法
US9933708B2 (en) 2003-05-23 2018-04-03 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
TWI474380B (zh) * 2003-05-23 2015-02-21 尼康股份有限公司 A method of manufacturing an exposure apparatus and an element
JP2011139106A (ja) * 2003-05-23 2011-07-14 Nikon Corp 露光装置及びデバイス製造方法
WO2004105107A1 (ja) * 2003-05-23 2004-12-02 Nikon Corporation 露光装置及びデバイス製造方法
JP2015029154A (ja) * 2003-05-23 2015-02-12 株式会社ニコン 露光装置及びデバイス製造方法
EP1628329A1 (en) * 2003-05-23 2006-02-22 Nikon Corporation Exposure device and device manufacturing method
JP2018077518A (ja) * 2003-05-23 2018-05-17 株式会社ニコン 液浸露光装置、露光装置及びデバイス製造方法
EP2498131A2 (en) 2003-05-23 2012-09-12 Nikon Corporation Exposure apparatus and method for producing device
JP2012248903A (ja) * 2003-05-23 2012-12-13 Nikon Corp 露光装置及びデバイス製造方法
EP2466620A2 (en) 2003-05-23 2012-06-20 Nikon Corporation Exposure apparatus and method for producing device
JP2007059929A (ja) * 2003-05-23 2007-03-08 Nikon Corp 露光装置及び露光方法、並びにデバイス製造方法
EP2466616A2 (en) 2003-05-23 2012-06-20 Nikon Corporation Exposure apparatus and method for producing device
US9939739B2 (en) 2003-05-23 2018-04-10 Nikon Corporation Exposure apparatus and method for producing device
EP1628329A4 (en) * 2003-05-23 2009-09-16 Nikon Corp Exposure device and device manufacturing method
EP3032572A1 (en) 2003-05-23 2016-06-15 Nikon Corporation Exposure apparatus and method for producing a device
JP2014075609A (ja) * 2003-05-23 2014-04-24 Nikon Corp 露光装置及びデバイス製造方法
KR101523828B1 (ko) * 2003-05-23 2015-05-28 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
JP2010109391A (ja) * 2003-05-23 2010-05-13 Nikon Corp 露光装置及びデバイス製造方法
US8384877B2 (en) * 2003-05-23 2013-02-26 Nikon Corporation Exposure apparatus and method for producing device
EP2466615A2 (en) 2003-05-23 2012-06-20 Nikon Corporation Exposure apparatus and method for producing device
EP2466619A2 (en) 2003-05-23 2012-06-20 Nikon Corporation Exposure apparatus and method for producing device
EP2466617A2 (en) 2003-05-23 2012-06-20 Nikon Corporation Exposure apparatus and method for producing device
JP2011159995A (ja) * 2003-05-23 2011-08-18 Nikon Corp 露光装置及びデバイス製造方法
US7399979B2 (en) 2003-05-23 2008-07-15 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
EP2466618A2 (en) 2003-05-23 2012-06-20 Nikon Corporation Exposure apparatus and method for producing device
KR101508811B1 (ko) * 2003-05-23 2015-04-07 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
KR101327697B1 (ko) * 2003-05-23 2013-11-11 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
JP2017107215A (ja) * 2003-05-23 2017-06-15 株式会社ニコン 露光装置及びデバイス製造方法
JP2015222451A (ja) * 2003-05-23 2015-12-10 株式会社ニコン 露光装置及びデバイス製造方法
JP2017037345A (ja) * 2003-05-23 2017-02-16 株式会社ニコン 露光装置、露光方法、並びにデバイス製造方法
EP2535769A2 (en) 2003-05-23 2012-12-19 Nikon Corporation Exposure apparatus and method for producing device
JP2012129562A (ja) * 2003-05-23 2012-07-05 Nikon Corp 露光装置及びデバイス製造方法
JP2011139105A (ja) * 2003-05-23 2011-07-14 Nikon Corp 露光装置及びデバイス製造方法
JP2011139107A (ja) * 2003-05-23 2011-07-14 Nikon Corp 露光装置及びデバイス製造方法
US9977336B2 (en) 2003-05-23 2018-05-22 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
JP2005277363A (ja) * 2003-05-23 2005-10-06 Nikon Corp 露光装置及びデバイス製造方法
JP2011018942A (ja) * 2003-05-28 2011-01-27 Nikon Corp 露光装置及びデバイス製造方法
JP2011044725A (ja) * 2003-05-28 2011-03-03 Nikon Corp 露光装置、及びデバイス製造方法
US10082739B2 (en) 2003-05-28 2018-09-25 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
JP2010199615A (ja) * 2003-05-28 2010-09-09 Nikon Corp 露光方法及び露光装置、並びにデバイス製造方法
JP2012129558A (ja) * 2003-05-28 2012-07-05 Nikon Corp 露光方法及び露光装置、並びにデバイス製造方法
JP2005012201A (ja) * 2003-05-28 2005-01-13 Nikon Corp 露光方法及び露光装置、並びにデバイス製造方法
US7804574B2 (en) 2003-05-30 2010-09-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method using acidic liquid
US7808611B2 (en) 2003-05-30 2010-10-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method using acidic liquid
US7532306B2 (en) * 2003-05-30 2009-05-12 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus
US7570343B2 (en) 2003-05-30 2009-08-04 Carl Zeis Smt Ag Microlithographic projection exposure apparatus
US9541843B2 (en) 2003-06-09 2017-01-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a sensor detecting a radiation beam through liquid
US9081299B2 (en) 2003-06-09 2015-07-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving removal of liquid entering a gap
JP2012114485A (ja) * 2003-06-09 2012-06-14 Asml Netherlands Bv リソグラフィ装置及びデバイス製造方法
US9152058B2 (en) 2003-06-09 2015-10-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a member and a fluid opening
JP2007235179A (ja) * 2003-06-09 2007-09-13 Asml Netherlands Bv リソグラフィ装置及びデバイス製造方法
US10180629B2 (en) 2003-06-09 2019-01-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4558762B2 (ja) * 2003-06-09 2010-10-06 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置及びデバイス製造方法
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2010161421A (ja) * 2003-06-09 2010-07-22 Asml Netherlands Bv リソグラフィ装置及びデバイス製造方法
US9964858B2 (en) 2003-06-11 2018-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9110389B2 (en) 2003-06-11 2015-08-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7684008B2 (en) * 2003-06-11 2010-03-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1486827A3 (en) * 2003-06-11 2005-03-09 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
CN102063018A (zh) * 2003-06-11 2011-05-18 Asml荷兰有限公司 光刻装置和器件制造方法
JP2010258470A (ja) * 2003-06-11 2010-11-11 Asml Netherlands Bv リソグラフィ投影装置
JP2010239158A (ja) * 2003-06-11 2010-10-21 Asml Netherlands Bv リソグラフィ投影装置
JP2008010892A (ja) * 2003-06-11 2008-01-17 Asml Netherlands Bv リソグラフィ装置及びデバイス製造方法
EP1486827A2 (en) * 2003-06-11 2004-12-15 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4580968B2 (ja) * 2003-06-11 2010-11-17 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置及びデバイス製造方法
WO2004112108A1 (ja) * 2003-06-13 2004-12-23 Nikon Corporation 露光方法、基板ステージ、露光装置、及びデバイス製造方法
US9846371B2 (en) 2003-06-13 2017-12-19 Nikon Corporation Exposure method, substrate stage, exposure apparatus, and device manufacturing method
JP2012248892A (ja) * 2003-06-13 2012-12-13 Nikon Corp 基板ステージ、露光装置、及びデバイス製造方法
JP2013016839A (ja) * 2003-06-13 2013-01-24 Nikon Corp 基板ステージ、露光装置、及びデバイス製造方法
JP2010010703A (ja) * 2003-06-13 2010-01-14 Nikon Corp 基板ステージ、露光装置、及びデバイス製造方法
US8670105B2 (en) 2003-06-19 2014-03-11 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
US8004649B2 (en) 2003-06-19 2011-08-23 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
US10191388B2 (en) 2003-06-19 2019-01-29 Nikon Corporation Exposure apparatus, and device manufacturing method
US9551943B2 (en) 2003-06-19 2017-01-24 Nikon Corporation Exposure apparatus and device manufacturing method
US10007188B2 (en) 2003-06-19 2018-06-26 Nikon Corporation Exposure apparatus and device manufacturing method
US9810995B2 (en) 2003-06-19 2017-11-07 Nikon Corporation Exposure apparatus and device manufacturing method
US9715178B2 (en) 2003-06-19 2017-07-25 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
US9709899B2 (en) 2003-06-19 2017-07-18 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
US8730450B2 (en) 2003-06-19 2014-05-20 Asml Holdings N.V. Immersion photolithography system and method using microchannel nozzles
JP2011066458A (ja) * 2003-06-19 2011-03-31 Asml Holding Nv 浸漬フォトリソグラフィシステム
US7411650B2 (en) 2003-06-19 2008-08-12 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
JP2017090932A (ja) * 2003-06-19 2017-05-25 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
US8817230B2 (en) 2003-06-19 2014-08-26 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
US7116395B2 (en) 2003-06-25 2006-10-03 Canon Kabushiki Kaisha Liquid immersion type exposure apparatus
US7561248B2 (en) 2003-06-27 2009-07-14 Canon Kabushiki Kaisha Immersion exposure technique
US7420651B2 (en) 2003-06-27 2008-09-02 Canon Kabushiki Kaisha Immersion exposure technique
US7679718B2 (en) 2003-06-27 2010-03-16 Canon Kabushiki Kaisha Immersion exposure technique
US7372542B2 (en) 2003-06-27 2008-05-13 Canon Kabushiki Kaisha Immersion exposure technique
US7119874B2 (en) 2003-06-27 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7450216B2 (en) 2003-06-27 2008-11-11 Canon Kabushiki Kaisha Immersion exposure technique
US7619714B2 (en) 2003-06-27 2009-11-17 Canon Kabushiki Kaisha Immersion exposure technique
US7349064B2 (en) 2003-06-27 2008-03-25 Canon Kabushiki Kaisha Immersion exposure technique
US7012673B2 (en) 2003-06-27 2006-03-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7466393B2 (en) 2003-06-27 2008-12-16 Canon Kabushiki Kaisha Immersion exposure technique
USRE42741E1 (en) 2003-06-27 2011-09-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7038760B2 (en) 2003-06-30 2006-05-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7110087B2 (en) 2003-06-30 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007527611A (ja) * 2003-07-08 2007-09-27 株式会社ニコン 液浸リソグラフィ用ウェハテーブル
JP2010232679A (ja) * 2003-07-08 2010-10-14 Nikon Corp 液浸リソグラフィ用ウェハテーブル
JP4697138B2 (ja) * 2003-07-08 2011-06-08 株式会社ニコン 液浸リソグラフィ装置、液浸リソグラフィ方法、デバイス製造方法
JP2011049607A (ja) * 2003-07-09 2011-03-10 Nikon Corp 露光装置、露光方法、並びにデバイス製造方法
US7433019B2 (en) 2003-07-09 2008-10-07 Nikon Corporation Exposure apparatus and device manufacturing method
US9097988B2 (en) 2003-07-09 2015-08-04 Nikon Corporation Exposure apparatus and device manufacturing method
JP2014090189A (ja) * 2003-07-09 2014-05-15 Nikon Corp 露光装置、及びデバイス製造方法
JP2014017533A (ja) * 2003-07-09 2014-01-30 Nikon Corp 露光装置、及びデバイス製造方法
WO2005006417A1 (ja) 2003-07-09 2005-01-20 Nikon Corporation 露光装置及びデバイス製造方法
US9977352B2 (en) 2003-07-09 2018-05-22 Nikon Corporation Exposure apparatus and device manufacturing method
US10151989B2 (en) 2003-07-16 2018-12-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8823920B2 (en) 2003-07-16 2014-09-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9383655B2 (en) 2003-07-16 2016-07-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9733575B2 (en) 2003-07-16 2017-08-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8711323B2 (en) 2003-07-16 2014-04-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8913223B2 (en) 2003-07-16 2014-12-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7738074B2 (en) 2003-07-16 2010-06-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9804509B2 (en) 2003-07-24 2017-10-31 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10146143B2 (en) 2003-07-24 2018-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7184122B2 (en) 2003-07-24 2007-02-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9213247B2 (en) 2003-07-24 2015-12-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7557901B2 (en) 2003-07-24 2009-07-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006528835A (ja) * 2003-07-24 2006-12-21 カール・ツアイス・エスエムテイ・アーゲー マイクロリソグラフィ投影露光装置および浸漬液体を浸漬空間へ導入する方法
US9594308B2 (en) 2003-07-24 2017-03-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8711333B2 (en) 2003-07-24 2014-04-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9760026B2 (en) 2003-07-28 2017-09-12 Nikon Corporation Exposure apparatus, method for producing device, and method for controlling exposure apparatus
JP2012151493A (ja) * 2003-07-28 2012-08-09 Nikon Corp 露光装置及びデバイス製造方法、並びに露光装置の制御方法
JP2011160001A (ja) * 2003-07-28 2011-08-18 Nikon Corp 露光装置及びデバイス製造方法、並びに露光装置の制御方法
US10185232B2 (en) 2003-07-28 2019-01-22 Nikon Corporation Exposure apparatus, method for producing device, and method for controlling exposure apparatus
US8964163B2 (en) 2003-07-28 2015-02-24 Asml Netherlands B.V. Immersion lithographic apparatus and device manufacturing method with a projection system having a part movable relative to another part
JP2014017527A (ja) * 2003-07-28 2014-01-30 Nikon Corp 露光装置及びデバイス製造方法、並びに露光装置の制御方法
US7175968B2 (en) 2003-07-28 2007-02-13 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a substrate
EP2264535A2 (en) 2003-07-28 2010-12-22 Nikon Corporation Exposure apparatus, method for producing device, and method for controlling exposure apparatus
US10303066B2 (en) 2003-07-28 2019-05-28 Asml Netherlands B.V. Lithographic projection apparatus and device manufacturing method
EP2264534A2 (en) 2003-07-28 2010-12-22 Nikon Corporation Exposure apparatus, method for producing device, and method for controlling exposure apparatus
EP2264533A2 (en) 2003-07-28 2010-12-22 Nikon Corporation Exposure apparatus, method for producing device, and exposure method
US9639006B2 (en) 2003-07-28 2017-05-02 Asml Netherlands B.V. Lithographic projection apparatus and device manufacturing method
JP2013214761A (ja) * 2003-07-28 2013-10-17 Nikon Corp 露光装置及びデバイス製造方法、並びに露光装置の制御方法
US9285686B2 (en) 2003-07-31 2016-03-15 Asml Netherlands B.V. Lithographic apparatus involving an immersion liquid supply system with an aperture
JP2008072147A (ja) * 2003-07-31 2008-03-27 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
US8937704B2 (en) 2003-07-31 2015-01-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a resistivity sensor
JP4652392B2 (ja) * 2003-07-31 2011-03-16 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置およびデバイス製造方法
JP2007502539A (ja) * 2003-08-11 2007-02-08 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッドAdvanced Micro Devices Incorporated 浸漬リソグラフィシステムの監視・制御方法及び装置
US10209622B2 (en) 2003-08-21 2019-02-19 Nikon Corporation Exposure method and device manufacturing method having lower scanning speed to expose peripheral shot area
US10203608B2 (en) 2003-08-21 2019-02-12 Nikon Corporation Exposure apparatus and device manufacturing method having lower scanning speed to expose peripheral shot area
US8064037B2 (en) 2003-08-21 2011-11-22 Nikon Corporation Immersion exposure apparatus and device manufacturing method with no liquid recovery during exposure
EP2284615A2 (en) 2003-08-26 2011-02-16 Nikon Corporation Optical element and exposure apparatus
WO2005020298A1 (ja) * 2003-08-26 2005-03-03 Nikon Corporation 光学素子及び露光装置
US10175584B2 (en) 2003-08-26 2019-01-08 Nikon Corporation Optical element and exposure apparatus
EP2278402A2 (en) 2003-08-26 2011-01-26 Nikon Corporation Optical element and exposure apparatus
US7697111B2 (en) 2003-08-26 2010-04-13 Nikon Corporation Optical element and exposure apparatus
JP2010118678A (ja) * 2003-08-26 2010-05-27 Nikon Corp 光学素子及び露光装置
EP2804048A1 (en) 2003-08-29 2014-11-19 Nikon Corporation Exposure apparatus and device fabricating method
KR100659257B1 (ko) * 2003-08-29 2006-12-19 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조방법
US9606448B2 (en) 2003-08-29 2017-03-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US6954256B2 (en) 2003-08-29 2005-10-11 Asml Netherlands B.V. Gradient immersion lithography
JP2012151513A (ja) * 2003-08-29 2012-08-09 Asml Netherlands Bv リソグラフィック装置及びデバイス製造方法
US8208124B2 (en) 2003-08-29 2012-06-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR100659259B1 (ko) * 2003-08-29 2006-12-19 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조방법
US8804097B2 (en) 2003-08-29 2014-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7733459B2 (en) 2003-08-29 2010-06-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9025127B2 (en) 2003-08-29 2015-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7826031B2 (en) 2003-08-29 2010-11-02 Nikon Corporation Liquid recovery apparatus, exposure apparatus, exposure method, and device manufacturing method
US9041901B2 (en) 2003-08-29 2015-05-26 Nikon Corporation Liquid recovery apparatus, exposure apparatus, exposure method, and device manufacturing method
US9568841B2 (en) 2003-08-29 2017-02-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9316919B2 (en) 2003-08-29 2016-04-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9581914B2 (en) 2003-08-29 2017-02-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8953144B2 (en) 2003-08-29 2015-02-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10012909B2 (en) 2003-08-29 2018-07-03 Nikon Corporation Liquid recovery apparatus, exposure apparatus, exposure method, and device manufacturing method
US8208123B2 (en) 2003-08-29 2012-06-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007504646A (ja) * 2003-08-29 2007-03-01 東京エレクトロン株式会社 基板を乾燥させる方法とシステム。
KR101419192B1 (ko) * 2003-08-29 2014-07-15 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US8947637B2 (en) 2003-08-29 2015-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8867017B2 (en) 2003-08-29 2014-10-21 Nikon Corporation Liquid recovery apparatus, exposure apparatus, exposure method, and device manufacturing method
EP2816410A1 (en) 2003-08-29 2014-12-24 Nikon Corporation Exposure apparatus, liquid removing method, and device manufacturing method
US10025204B2 (en) 2003-08-29 2018-07-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9442388B2 (en) 2003-08-29 2016-09-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10146142B2 (en) 2003-08-29 2018-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8854599B2 (en) 2003-08-29 2014-10-07 Nikon Corporation Liquid recovery apparatus, exposure apparatus, exposure method, and device manufacturing method
WO2005022616A1 (ja) * 2003-08-29 2005-03-10 Nikon Corporation 露光装置及びデバイス製造方法
US7847916B2 (en) 2003-08-29 2010-12-07 Nikon Corporation Liquid recovery apparatus, exposure apparatus, exposure method, and device manufacturing method
EP3163375A1 (en) 2003-08-29 2017-05-03 Nikon Corporation Exposure apparatus and exposure method
US10203610B2 (en) 2003-09-03 2019-02-12 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US8253921B2 (en) 2003-09-03 2012-08-28 Nikon Corporation Exposure apparatus and device fabricating method
US9817319B2 (en) 2003-09-03 2017-11-14 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US7053983B2 (en) 2003-09-04 2006-05-30 Canon Kabushiki Kaisha Liquid immersion type exposure apparatus
US7599545B2 (en) 2003-09-05 2009-10-06 Hitachi High-Technologies Corporation Method and its apparatus for inspecting defects
US7345737B2 (en) 2003-09-09 2008-03-18 Canon Kabushiki Kaisha Exposure method and apparatus having a projection optical system in which a projection gap is filled with liquid
EP3007207A2 (en) 2003-09-26 2016-04-13 Nikon Corporation A projection exposure apparatus, cleaning and maintenance methods of a projection exposure apparatus, and device manufacturing method
US8035797B2 (en) 2003-09-26 2011-10-11 Nikon Corporation Projection exposure apparatus, cleaning and maintenance methods of a projection exposure apparatus, and device manufacturing method
US8724076B2 (en) 2003-09-26 2014-05-13 Nikon Corporation Projection exposure apparatus, cleaning and maintenance methods of a projection exposure apparatus, and device manufacturing method
WO2005031799A3 (ja) * 2003-09-29 2005-06-23 Nippon Kogaku Kk 露光装置、露光方法及びデバイス製造方法
KR101441840B1 (ko) * 2003-09-29 2014-11-04 가부시키가이샤 니콘 노광장치, 노광방법 및 디바이스 제조방법
TWI610342B (zh) * 2003-09-29 2018-01-01 曝光裝置及曝光方法、以及元件製造方法
US10025194B2 (en) 2003-09-29 2018-07-17 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
KR101498437B1 (ko) * 2003-09-29 2015-03-03 가부시키가이샤 니콘 노광장치, 노광방법 및 디바이스 제조방법
US8400615B2 (en) 2003-09-29 2013-03-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7817245B2 (en) 2003-09-29 2010-10-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101421398B1 (ko) * 2003-09-29 2014-07-18 가부시키가이샤 니콘 노광장치, 노광방법 및 디바이스 제조방법
CN101526759A (zh) * 2003-09-29 2009-09-09 株式会社尼康 曝光装置
EP2312395A1 (en) 2003-09-29 2011-04-20 Nikon Corporation Exposure apparatus, exposure method, and method for producing a device
US7193681B2 (en) 2003-09-29 2007-03-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2010098328A (ja) * 2003-09-29 2010-04-30 Nikon Corp 露光装置及び露光方法並びにデバイス製造方法
EP2320273A1 (en) 2003-09-29 2011-05-11 Nikon Corporation Exposure apparatus, exposure method, and method for producing a device
KR101323396B1 (ko) * 2003-09-29 2013-10-29 가부시키가이샤 니콘 노광장치, 노광방법 및 디바이스 제조방법
US8797502B2 (en) 2003-09-29 2014-08-05 Nikon Corporation Exposure apparatus, exposure method, and method for producing device with electricity removal device by adding additive to liquid
EP3093710A2 (en) 2003-09-29 2016-11-16 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7158211B2 (en) 2003-09-29 2007-01-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP3093711A2 (en) 2003-09-29 2016-11-16 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP2005116571A (ja) * 2003-10-02 2005-04-28 Nikon Corp 露光装置及びデバイス製造方法
JP2011211221A (ja) * 2003-10-08 2011-10-20 Miyagi Nikon Precision Co Ltd 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造装置及びデバイス製造方法
JP2009094541A (ja) * 2003-10-08 2009-04-30 Nikon Corp 基板搬送装置、基板搬送方法、露光方法、露光装置、及びデバイス製造方法
US20110122393A1 (en) * 2003-10-08 2011-05-26 Zao Nikon Co., Ltd. Substrate transport apparatus and method, exposure apparatus and exposure method, and device fabricating method
WO2005036623A1 (ja) * 2003-10-08 2005-04-21 Zao Nikon Co., Ltd. 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造方法
JP2009094542A (ja) * 2003-10-08 2009-04-30 Nikon Corp 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造装置及びデバイス製造方法
KR101319109B1 (ko) * 2003-10-08 2013-10-17 가부시키가이샤 자오 니콘 기판 반송 장치 및 기판 반송 방법, 노광 장치 및 노광 방법, 디바이스 제조 방법
TWI620990B (zh) * 2003-10-08 2018-04-11 Nikon Corp Substrate transfer device, substrate transfer method, exposure device, exposure method, and device manufacturing method
KR101361892B1 (ko) * 2003-10-08 2014-02-12 가부시키가이샤 자오 니콘 기판 반송 장치 및 기판 반송 방법, 노광 장치 및 노광 방법, 디바이스 제조 방법
US8755025B2 (en) * 2003-10-08 2014-06-17 Nikon Corporation Substrate transport apparatus and method, exposure apparatus and exposure method, and device fabricating method
WO2005036621A1 (ja) * 2003-10-08 2005-04-21 Zao Nikon Co., Ltd. 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造方法
EP3206083A1 (en) 2003-10-09 2017-08-16 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
EP3410216A1 (en) 2003-10-09 2018-12-05 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
EP3432073A1 (en) 2003-10-09 2019-01-23 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
EP2284614A2 (en) 2003-10-09 2011-02-16 Nikon Corporation Exposure apparatus, exposure method and device producing method
US10209623B2 (en) 2003-10-09 2019-02-19 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
EP2937734A1 (en) 2003-10-09 2015-10-28 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8570486B2 (en) 2003-10-15 2013-10-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8711330B2 (en) 2003-10-15 2014-04-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4482593B2 (ja) * 2003-10-15 2010-06-16 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置およびデバイス製造方法
US7352435B2 (en) 2003-10-15 2008-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9285685B2 (en) 2003-10-15 2016-03-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8174674B2 (en) 2003-10-15 2012-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2008235930A (ja) * 2003-10-15 2008-10-02 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
US7433015B2 (en) 2003-10-15 2008-10-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7961293B2 (en) 2003-10-15 2011-06-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR20150039869A (ko) * 2003-10-22 2015-04-13 가부시키가이샤 니콘 노광 장치, 노광 방법, 디바이스의 제조 방법
US10248034B2 (en) 2003-10-28 2019-04-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8860922B2 (en) 2003-10-28 2014-10-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7352433B2 (en) 2003-10-28 2008-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8860923B2 (en) 2003-10-28 2014-10-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9423698B2 (en) 2003-10-28 2016-08-23 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9760014B2 (en) 2003-10-28 2017-09-12 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US8797506B2 (en) 2003-10-28 2014-08-05 Nikon Corporation Exposure apparatus, exposure method, and device fabrication method
US8272544B2 (en) 2003-10-28 2012-09-25 Nikon Corporation Exposure apparatus, exposure method, and device fabrication method
US9182679B2 (en) 2003-10-28 2015-11-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9482962B2 (en) 2003-10-28 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7932996B2 (en) 2003-10-28 2011-04-26 Nikon Corporation Exposure apparatus, exposure method, and device fabrication method
EP3392713A1 (en) 2003-10-31 2018-10-24 Nikon Corporation Immersion exposure apparatus and method
US9563133B2 (en) 2003-10-31 2017-02-07 Nikon Corporation Exposure apparatus and device fabrication method
EP3064998A1 (en) 2003-10-31 2016-09-07 Nikon Corporation Immersion exposure apparatus and method
US9829801B2 (en) 2003-10-31 2017-11-28 Nikon Corporation Exposure apparatus and device fabrication method
US10048597B2 (en) 2003-10-31 2018-08-14 Nikon Corporation Exposure apparatus and device fabrication method
US7301606B2 (en) * 2003-10-31 2007-11-27 Nikon Corporation Supporting plate, stage device, exposure apparatus, and exposure method
EP1528431A3 (en) * 2003-10-31 2007-08-22 Nikon Corporation Supporting plate, stage device, exposure apparatus and exposure method
US7113259B2 (en) 2003-10-31 2006-09-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8928856B2 (en) 2003-10-31 2015-01-06 Nikon Corporation Exposure apparatus and device fabrication method
US7573560B2 (en) 2003-10-31 2009-08-11 Nikon Corporation Supporting plate, stage device, exposure apparatus, and exposure method
US7195860B2 (en) 2003-11-13 2007-03-27 Matsushita Electric Industrial Co., Ltd. Semiconductor manufacturing apparatus and pattern formation method
US9952515B2 (en) 2003-11-14 2018-04-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10345712B2 (en) 2003-11-14 2019-07-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2015130519A (ja) * 2003-11-14 2015-07-16 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置およびデバイス製造方法
JP2016177322A (ja) * 2003-11-14 2016-10-06 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置および装置製造方法
US9134622B2 (en) 2003-11-14 2015-09-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9134623B2 (en) 2003-11-14 2015-09-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2008288619A (ja) * 2003-11-14 2008-11-27 Asml Netherlands Bv リソグラフィ装置および装置製造方法
EP2117034A1 (en) 2003-11-20 2009-11-11 Nikon Corporation Beam transforming element, illumination optical apparatus, exposure apparatus, and exposure method
US10281632B2 (en) 2003-11-20 2019-05-07 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power to rotate linear polarization direction
EP1926129A1 (en) 2003-11-20 2008-05-28 Nikon Corporation Beam transforming element, illumination optical apparatus, exposure apparatus, and exposure method
EP2251896A1 (en) 2003-11-20 2010-11-17 Nikon Corporation Beam transforming element, illumination optical apparatus, exposure apparatus, and exposure method
EP3118890A2 (en) 2003-11-20 2017-01-18 Nikon Corporation Beam transforming element, illumination optical apparatus, exposure apparatus, and exposure method
US9885872B2 (en) 2003-11-20 2018-02-06 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical integrator and polarization member that changes polarization state of light
US7545481B2 (en) 2003-11-24 2009-06-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4747263B2 (ja) * 2003-11-24 2011-08-17 エーエスエムエル ネザーランズ ビー.ブイ. オブジェクティブにおける光学素子のための保持装置
WO2005054955A3 (en) * 2003-11-24 2006-01-05 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US8472006B2 (en) 2003-11-24 2013-06-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007531251A (ja) * 2003-11-24 2007-11-01 エーエスエムエル ネザーランズ ビー.ヴイ. オブジェクティブにおける光学素子のための保持装置
EP3139214A2 (en) 2003-12-03 2017-03-08 Nikon Corporation Exposure apparatus, exposure method, device producing method, and optical component
EP2717295A1 (en) 2003-12-03 2014-04-09 Nikon Corporation Exposure apparatus, exposure method, and method for producing a device
US10088760B2 (en) 2003-12-03 2018-10-02 Nikon Corporation Exposure apparatus, exposure method, method for producing device, and optical part
US7602476B2 (en) 2003-12-08 2009-10-13 Canon Kabushiki Kaisha Substrate-holding technique
US7379162B2 (en) 2003-12-08 2008-05-27 Canon Kabushiki Kaisha Substrate-holding technique
JP2007516613A (ja) * 2003-12-15 2007-06-21 カール・ツアイス・エスエムテイ・アーゲー 少なくとも1つの液体レンズを備えるマイクロリソグラフィー投影対物レンズとしての対物レンズ
US9798245B2 (en) 2003-12-15 2017-10-24 Nikon Corporation Exposure apparatus, and exposure method, with recovery device to recover liquid leaked from between substrate and member
KR101111363B1 (ko) * 2003-12-15 2012-04-12 가부시키가이샤 니콘 투영노광장치 및 스테이지 장치, 그리고 노광방법
JP2010161411A (ja) * 2003-12-15 2010-07-22 Nikon Corp 投影露光装置及びステージ装置、並びに露光方法
JPWO2005057635A1 (ja) * 2003-12-15 2007-07-05 株式会社ニコン 投影露光装置及びステージ装置、並びに露光方法
JP2005183416A (ja) * 2003-12-16 2005-07-07 Tadahiro Omi 露光方法、及び液浸型露光装置
JP2008219020A (ja) * 2003-12-23 2008-09-18 Asml Netherlands Bv リソグラフィ装置
US7589818B2 (en) 2003-12-23 2009-09-15 Asml Netherlands B.V. Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus
US9465301B2 (en) 2003-12-23 2016-10-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9684250B2 (en) 2003-12-23 2017-06-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4526572B2 (ja) * 2003-12-23 2010-08-18 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置
US7394521B2 (en) 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9817321B2 (en) 2003-12-23 2017-11-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7324274B2 (en) 2003-12-24 2008-01-29 Nikon Corporation Microscope and immersion objective lens
US8064044B2 (en) 2004-01-05 2011-11-22 Nikon Corporation Exposure apparatus, exposure method, and device producing method
WO2005067013A1 (ja) * 2004-01-05 2005-07-21 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
EP3376523A1 (en) 2004-01-05 2018-09-19 Nikon Corporation Exposure apparatus, exposure method, and device producing method
KR101324810B1 (ko) * 2004-01-05 2013-11-01 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
KR20170070260A (ko) * 2004-01-05 2017-06-21 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
EP2199859A2 (en) 2004-01-05 2010-06-23 Nikon Corporation Exposure apparatus, exposure method, and device producing method
JP2012089889A (ja) * 2004-01-05 2012-05-10 Nikon Corp 露光装置、露光方法及びデバイス製造方法
KR20140081905A (ko) * 2004-01-05 2014-07-01 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
US9910369B2 (en) 2004-01-05 2018-03-06 Nikon Corporation Exposure apparatus, exposure method, and device producing method
US9588436B2 (en) 2004-01-05 2017-03-07 Nikon Corporation Exposure apparatus, exposure method, and device producing method
JP2005223315A (ja) * 2004-01-05 2005-08-18 Nikon Corp 露光装置、露光方法及びデバイス製造方法
TWI403853B (zh) * 2004-01-05 2013-08-01 尼康股份有限公司 Exposure apparatus, exposure method, and device manufacturing method
KR101006635B1 (ko) * 2004-01-07 2011-01-07 도쿄엘렉트론가부시키가이샤 도포·현상 장치 및 도포·현상 방법
US7530749B2 (en) 2004-01-07 2009-05-12 Tokyo Electron Limited Coater/developer and coating/developing method
WO2005067011A1 (ja) * 2004-01-07 2005-07-21 Tokyo Electron Limited 塗布・現像装置及び塗布・現像方法
US7851363B2 (en) 2004-01-15 2010-12-14 Kabushiki Kaisha Toshiba Pattern forming method and manufacturing method of semiconductor device
US9897918B2 (en) 2004-01-15 2018-02-20 Toshiba Memory Corporation Pattern forming method and manufacturing method of semiconductor device
EP2037489A2 (en) 2004-01-15 2009-03-18 Nikon Corporation Exposure apparatus and device producing method
US8728943B2 (en) 2004-01-15 2014-05-20 Kabushiki Kaisha Toshiba Pattern forming method and manufacturing method of semiconductor device
US9601331B2 (en) 2004-01-15 2017-03-21 Kabushiki Kaisha Toshiba Pattern forming method and manufacturing method of semiconductor device
US9202722B2 (en) 2004-01-15 2015-12-01 Kabushiki Kaisha Toshiba Pattern forming method and manufacturing method of semiconductor device
US8861084B2 (en) 2004-01-16 2014-10-14 Carl Zeiss Smt Ag Polarization-modulating optical element
US9316772B2 (en) 2004-01-16 2016-04-19 Carl Zeiss Smt Gmbh Producing polarization-modulating optical element for microlithography system
JP2011138164A (ja) * 2004-01-16 2011-07-14 Carl Zeiss Smt Gmbh 偏光変調光学素子
US9581911B2 (en) 2004-01-16 2017-02-28 Carl Zeiss Smt Gmbh Polarization-modulating optical element
US9436095B2 (en) 2004-01-20 2016-09-06 Carl Zeiss Smt Gmbh Exposure apparatus and measuring device for a projection lens
US10345710B2 (en) 2004-01-20 2019-07-09 Carl Zeiss Smt Gmbh Microlithographic projection exposure apparatus and measuring device for a projection lens
US7697110B2 (en) 2004-01-26 2010-04-13 Nikon Corporation Exposure apparatus and device manufacturing method
US8330934B2 (en) 2004-01-26 2012-12-11 Nikon Corporation Exposure apparatus and device manufacturing method
KR101476015B1 (ko) * 2004-02-02 2014-12-23 가부시키가이샤 니콘 스테이지 구동 방법 및 스테이지 장치, 노광 장치, 그리고 디바이스 제조 방법
US10139737B2 (en) 2004-02-02 2018-11-27 Nikon Corporation Lithographic apparatus and method having substrate and sensor tables
US9665016B2 (en) 2004-02-02 2017-05-30 Nikon Corporation Lithographic apparatus and method having substrate table and sensor table to hold immersion liquid
KR101276423B1 (ko) * 2004-02-02 2013-06-19 가부시키가이샤 니콘 스테이지 구동 방법 및 스테이지 장치, 노광 장치, 그리고 디바이스 제조 방법
US9632431B2 (en) 2004-02-02 2017-04-25 Nikon Corporation Lithographic apparatus and method having substrate and sensor tables
KR101235523B1 (ko) * 2004-02-02 2013-02-20 가부시키가이샤 니콘 스테이지 구동 방법 및 스테이지 장치, 노광 장치, 그리고 디바이스 제조 방법
KR101288139B1 (ko) * 2004-02-02 2013-07-19 가부시키가이샤 니콘 스테이지 구동 방법 및 스테이지 장치, 노광 장치, 그리고 디바이스 제조 방법
US10007196B2 (en) 2004-02-02 2018-06-26 Nikon Corporation Lithographic apparatus and method having substrate and sensor tables
TWI499870B (zh) * 2004-02-02 2015-09-11 尼康股份有限公司 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
US9684248B2 (en) 2004-02-02 2017-06-20 Nikon Corporation Lithographic apparatus having substrate table and sensor table to measure a patterned beam
WO2005074014A1 (ja) * 2004-02-02 2005-08-11 Nikon Corporation ステージ駆動方法及びステージ装置、露光装置、並びにデバイス製造方法
JP2007520893A (ja) * 2004-02-03 2007-07-26 ロチェスター インスティテュート オブ テクノロジー 流体を使用したフォトリソグラフィ法及びそのシステム
US10151983B2 (en) 2004-02-03 2018-12-11 Nikon Corporation Exposure apparatus and device manufacturing method
EP2765595A1 (en) 2004-02-04 2014-08-13 Nikon Corporation Exposure apparatus, exposure method, and method for producing a device
US8208119B2 (en) 2004-02-04 2012-06-26 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8605252B2 (en) 2004-02-04 2013-12-10 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
EP3252533A1 (en) 2004-02-04 2017-12-06 Nikon Corporation Exposure apparatus, exposure method, and method for producing a device
JP2005252247A (ja) * 2004-02-04 2005-09-15 Nikon Corp 露光装置、露光方法及びデバイス製造方法
EP3267469A1 (en) 2004-02-04 2018-01-10 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
KR20140129373A (ko) * 2004-02-04 2014-11-06 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
EP3093873A2 (en) 2004-02-04 2016-11-16 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
EP3208658A1 (en) 2004-02-04 2017-08-23 Nikon Corporation Exposure apparatus, exposure method, and method for producing a device
US10048602B2 (en) 2004-02-04 2018-08-14 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US9316921B2 (en) 2004-02-04 2016-04-19 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US20130271945A1 (en) 2004-02-06 2013-10-17 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
EP3173866A1 (en) 2004-02-06 2017-05-31 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method
US10241417B2 (en) 2004-02-06 2019-03-26 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
EP2618188A1 (en) 2004-02-06 2013-07-24 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
EP2615480A1 (en) 2004-02-06 2013-07-17 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10007194B2 (en) 2004-02-06 2018-06-26 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
EP2615479A1 (en) 2004-02-06 2013-07-17 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10234770B2 (en) 2004-02-06 2019-03-19 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US7522264B2 (en) 2004-02-09 2009-04-21 Canon Kabushiki Kaisha Projection exposure apparatus, device manufacturing method, and sensor unit
US7050146B2 (en) 2004-02-09 2006-05-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7256868B2 (en) 2004-02-09 2007-08-14 Canon Kabushiki Kaisha Projection exposure apparatus, device manufacturing method, and sensor unit
WO2005076323A1 (ja) 2004-02-10 2005-08-18 Nikon Corporation 露光装置及びデバイス製造方法、メンテナンス方法及び露光方法
US7557900B2 (en) 2004-02-10 2009-07-07 Nikon Corporation Exposure apparatus, device manufacturing method, maintenance method, and exposure method
EP2256790A2 (en) 2004-02-10 2010-12-01 Nikon Corporation exposure apparatus, device manufacturing method and maintenance method
JPWO2005076323A1 (ja) * 2004-02-10 2007-10-18 株式会社ニコン 露光装置及びデバイス製造方法、メンテナンス方法及び露光方法
US8115902B2 (en) 2004-02-10 2012-02-14 Nikon Corporation Exposure apparatus, device manufacturing method, maintenance method, and exposure method
JP2005264131A (ja) * 2004-02-16 2005-09-29 Tokyo Ohka Kogyo Co Ltd 液浸露光プロセス用レジスト保護膜形成用材料、および該保護膜を用いたレジストパターン形成方法
JP2009212539A (ja) * 2004-02-18 2009-09-17 Nikon Corp 光学素子及び露光装置
US8023100B2 (en) 2004-02-20 2011-09-20 Nikon Corporation Exposure apparatus, supply method and recovery method, exposure method, and device producing method
WO2005081292A1 (ja) * 2004-02-20 2005-09-01 Nikon Corporation 露光装置、供給方法及び回収方法、露光方法、ならびにデバイス製造方法
JP5076497B2 (ja) * 2004-02-20 2012-11-21 株式会社ニコン 露光装置、液体の供給方法及び回収方法、露光方法、並びにデバイス製造方法
US8634060B2 (en) 2004-03-16 2014-01-21 Carl Zeiss Smt Gmbh Method for a multiple exposure, microlithography projection exposure installation and a projection system
US7875418B2 (en) 2004-03-16 2011-01-25 Carl Zeiss Smt Ag Method for a multiple exposure, microlithography projection exposure installation and a projection system
JP2012156540A (ja) * 2004-03-25 2012-08-16 Nikon Corp 露光装置及びデバイス製造方法
WO2005093791A1 (ja) * 2004-03-25 2005-10-06 Nikon Corporation 露光装置及びデバイス製造方法
KR20140140644A (ko) * 2004-03-25 2014-12-09 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
KR101504445B1 (ko) * 2004-03-25 2015-03-19 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US10126661B2 (en) 2004-03-25 2018-11-13 Nikon Corporation Exposure apparatus and device fabrication method
JPWO2005093791A1 (ja) * 2004-03-25 2008-02-14 株式会社ニコン 露光装置及びデバイス製造方法
JP2010153931A (ja) * 2004-03-25 2010-07-08 Nikon Corp 露光装置及びデバイス製造方法
JP4525676B2 (ja) * 2004-03-25 2010-08-18 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
JP2011199311A (ja) * 2004-03-25 2011-10-06 Nikon Corp 露光装置及びデバイス製造方法
US7180574B2 (en) 2004-03-29 2007-02-20 Canon Kabushiki Kaisha Exposure apparatus and method
US7034917B2 (en) 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7227619B2 (en) 2004-04-01 2007-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7375796B2 (en) 2004-04-01 2008-05-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7295283B2 (en) 2004-04-02 2007-11-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10234768B2 (en) 2004-04-14 2019-03-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9829799B2 (en) 2004-04-14 2017-11-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2009044186A (ja) * 2004-04-14 2009-02-26 Asml Netherlands Bv リソグラフィック装置及びデバイス製造方法
JP2009044185A (ja) * 2004-04-14 2009-02-26 Asml Netherlands Bv リソグラフィック装置及びデバイス製造方法
US9207543B2 (en) 2004-04-14 2015-12-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a groove to collect liquid
US9989861B2 (en) 2004-04-14 2018-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2009060127A (ja) * 2004-04-14 2009-03-19 Asml Netherlands Bv リソグラフィック装置及びデバイス製造方法
US9568840B2 (en) 2004-04-14 2017-02-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8488099B2 (en) 2004-04-19 2013-07-16 Nikon Corporation Exposure apparatus and device manufacturing method
US9599907B2 (en) 2004-04-19 2017-03-21 Nikon Corporation Exposure apparatus and device manufacturing method
US7652751B2 (en) 2004-05-03 2010-01-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7379159B2 (en) 2004-05-03 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7892722B2 (en) 2004-05-17 2011-02-22 Fujifilm Corporation Pattern forming method
US9623436B2 (en) 2004-05-18 2017-04-18 Asml Netherlands B.V. Active drying station and method to remove immersion liquid using gas flow supply with gas outlet between two gas inlets
JP4669735B2 (ja) * 2004-05-18 2011-04-13 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置及びデバイス製造方法
EP1598705A1 (en) * 2004-05-18 2005-11-23 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005333134A (ja) * 2004-05-18 2005-12-02 Asml Netherlands Bv リソグラフィ装置及びデバイス製造方法
US7486381B2 (en) 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101368523B1 (ko) * 2004-06-04 2014-02-27 칼 짜이스 에스엠테 게엠베하 광학적 결상 시스템의 결상 품질을 측정하기 위한 시스템
US9429495B2 (en) 2004-06-04 2016-08-30 Carl Zeiss Smt Gmbh System for measuring the image quality of an optical imaging system
KR101257960B1 (ko) * 2004-06-04 2013-04-24 칼 짜이스 에스엠테 게엠베하 광학적 결상 시스템의 결상 품질을 측정하기 위한 시스템
US8325326B2 (en) 2004-06-07 2012-12-04 Nikon Corporation Stage unit, exposure apparatus, and exposure method
JPWO2005122218A1 (ja) * 2004-06-09 2008-04-10 株式会社ニコン 露光装置及びデバイス製造方法
JP2010103579A (ja) * 2004-06-09 2010-05-06 Nikon Corp 露光装置及びデバイス製造方法
KR101422964B1 (ko) * 2004-06-09 2014-07-24 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
JP4760708B2 (ja) * 2004-06-09 2011-08-31 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法、メンテナンス方法
JP2012134558A (ja) * 2004-06-09 2012-07-12 Nikon Corp 露光装置及びデバイス製造方法
JP4665883B2 (ja) * 2004-06-09 2011-04-06 株式会社ニコン 露光装置及び露光方法、メンテナンス方法、デバイス製造方法
CN103439863A (zh) * 2004-06-09 2013-12-11 尼康股份有限公司 曝光装置、曝光方法、元件制造方法及维护方法
EP3203498A1 (en) 2004-06-09 2017-08-09 Nikon Corporation Exposure apparatus and device manufacturing method
EP2966670A1 (en) 2004-06-09 2016-01-13 Nikon Corporation Exposure apparatus and device manufacturing method
CN103605262A (zh) * 2004-06-09 2014-02-26 尼康股份有限公司 曝光装置及元件制造方法
WO2005122218A1 (ja) 2004-06-09 2005-12-22 Nikon Corporation 露光装置及びデバイス製造方法
KR101433496B1 (ko) * 2004-06-09 2014-08-22 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
JP2017021392A (ja) * 2004-06-09 2017-01-26 株式会社ニコン 露光装置及びデバイス製造方法
KR101421915B1 (ko) * 2004-06-09 2014-07-22 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
KR101440746B1 (ko) * 2004-06-09 2014-09-17 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
CN101819386A (zh) * 2004-06-09 2010-09-01 尼康股份有限公司 曝光装置及元件制造方法
CN105911821A (zh) * 2004-06-09 2016-08-31 株式会社尼康 曝光装置
JP2014060459A (ja) * 2004-06-09 2014-04-03 Nikon Corp 露光装置及びデバイス製造方法
US9645505B2 (en) 2004-06-09 2017-05-09 Nikon Corporation Immersion exposure apparatus and device manufacturing method with measuring device to measure specific resistance of liquid
JP2007019548A (ja) * 2004-06-09 2007-01-25 Nikon Corp 露光装置及び露光方法、メンテナンス方法、デバイス製造方法
CN103439863B (zh) * 2004-06-09 2016-01-06 株式会社尼康 曝光装置、曝光方法、元件制造方法及维护方法
JP2015029155A (ja) * 2004-06-09 2015-02-12 株式会社ニコン 露光装置及びデバイス製造方法
US8705008B2 (en) 2004-06-09 2014-04-22 Nikon Corporation Substrate holding unit, exposure apparatus having same, exposure method, method for producing device, and liquid repellant plate
JP2015232734A (ja) * 2004-06-09 2015-12-24 株式会社ニコン 露光装置及びデバイス製造方法
JP2015128171A (ja) * 2004-06-10 2015-07-09 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
EP3067749A2 (en) 2004-06-10 2016-09-14 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US9134621B2 (en) 2004-06-10 2015-09-15 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8704999B2 (en) 2004-06-10 2014-04-22 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
KR20150046360A (ko) * 2004-06-10 2015-04-29 가부시키가이샤 니콘 노광 장치, 노광 방법, 및 디바이스 제조 방법
US8508713B2 (en) 2004-06-10 2013-08-13 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8717533B2 (en) 2004-06-10 2014-05-06 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US9411247B2 (en) 2004-06-10 2016-08-09 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP2013229632A (ja) * 2004-06-10 2013-11-07 Nikon Corp 露光装置、露光方法及びデバイス製造方法
JP2018063450A (ja) * 2004-06-10 2018-04-19 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
US10203614B2 (en) 2004-06-10 2019-02-12 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US9529273B2 (en) 2004-06-10 2016-12-27 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8373843B2 (en) 2004-06-10 2013-02-12 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP2017037344A (ja) * 2004-06-10 2017-02-16 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
US9778580B2 (en) 2004-06-10 2017-10-03 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP2016048395A (ja) * 2004-06-10 2016-04-07 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
EP3067750A2 (en) 2004-06-10 2016-09-14 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8482716B2 (en) 2004-06-10 2013-07-09 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8164734B2 (en) 2004-06-16 2012-04-24 Asml Netherlands B.V. Vacuum system for immersion photolithography
US9857699B2 (en) 2004-06-16 2018-01-02 Asml Netherlands B.V. Vacuum system for immersion photolithography
US8830440B2 (en) 2004-06-16 2014-09-09 Asml Netherlands B.V. Vacuum system for immersion photolithography
US9507270B2 (en) 2004-06-16 2016-11-29 Asml Netherlands B.V. Vacuum system for immersion photolithography
KR101151767B1 (ko) * 2004-06-16 2012-06-15 에이에스엠엘 네델란즈 비.브이. 스트림 추출 시스템 및 방법
US10168624B2 (en) 2004-06-16 2019-01-01 Asml Netherlands B.V. Vacuum system for immersion photolithography
WO2005124420A1 (ja) * 2004-06-16 2005-12-29 Nikon Corporation 光学系、露光装置、および露光方法
US8810767B2 (en) 2004-06-21 2014-08-19 Nikon Corporation Exposure apparatus, method for cleaning member thereof, maintenance method for exposure apparatus, maintenance device, and method for producing device
EP3190605A1 (en) 2004-06-21 2017-07-12 Nikon Corporation Exposure apparatus, exposure method and device manufacturing method
US9470984B2 (en) 2004-06-21 2016-10-18 Nikon Corporation Exposure apparatus
EP3462241A1 (en) 2004-06-21 2019-04-03 Nikon Corporation Exposure apparatus, exposure method and method for producing a device
EP3255652A1 (en) 2004-06-21 2017-12-13 Nikon Corporation Exposure apparatus, exposure method and device manufacturing method
US9904182B2 (en) 2004-06-21 2018-02-27 Nikon Corporation Exposure apparatus
WO2005124833A1 (ja) 2004-06-21 2005-12-29 Nikon Corporation 露光装置及びその部材の洗浄方法、露光装置のメンテナンス方法、メンテナンス機器、並びにデバイス製造方法
US8698998B2 (en) 2004-06-21 2014-04-15 Nikon Corporation Exposure apparatus, method for cleaning member thereof, maintenance method for exposure apparatus, maintenance device, and method for producing device
US8368870B2 (en) 2004-06-21 2013-02-05 Nikon Corporation Exposure apparatus and device manufacturing method
JP2008505485A (ja) * 2004-07-01 2008-02-21 株式会社ニコン 液浸リソグラフィのための動的流体制御システム
US8194229B2 (en) 2004-07-01 2012-06-05 Nikon Corporation Dynamic fluid control system for immersion lithography
KR101285905B1 (ko) * 2004-07-01 2013-07-12 가부시키가이샤 니콘 액침 리소그래피용 동적 유체 제어 시스템
US9104117B2 (en) 2004-07-07 2015-08-11 Bob Streefkerk Lithographic apparatus having a liquid detection system
JP2010183099A (ja) * 2004-07-07 2010-08-19 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
US10338478B2 (en) 2004-07-07 2019-07-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2009088563A (ja) * 2004-07-07 2009-04-23 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
US9250537B2 (en) 2004-07-12 2016-02-02 Nikon Corporation Immersion exposure apparatus and method with detection of liquid on members of the apparatus
US8654308B2 (en) 2004-07-12 2014-02-18 Nikon Corporation Method for determining exposure condition, exposure method, exposure apparatus, and method for manufacturing device
US7914972B2 (en) 2004-07-21 2011-03-29 Nikon Corporation Exposure method and device manufacturing method
US7161663B2 (en) 2004-07-22 2007-01-09 Asml Netherlands B.V. Lithographic apparatus
US9063436B2 (en) 2004-08-03 2015-06-23 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
EP3048485A1 (en) 2004-08-03 2016-07-27 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
EP3258318A1 (en) 2004-08-03 2017-12-20 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8169591B2 (en) 2004-08-03 2012-05-01 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8102508B2 (en) 2004-08-03 2012-01-24 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
WO2006013734A1 (ja) * 2004-08-03 2006-02-09 Nikon Corporation 投影光学系、露光装置、および露光方法
EP2226682A2 (en) 2004-08-03 2010-09-08 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
EP3267257A1 (en) 2004-08-03 2018-01-10 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP2006295107A (ja) * 2004-08-03 2006-10-26 Nikon Corp 露光装置、露光方法及びデバイス製造方法
US7692760B2 (en) 2004-08-05 2010-04-06 Canon Kabushiki Kaisha Liquid immersion exposure apparatus, method of controlling the same, and device manufacturing method
EP1630610A1 (en) 2004-08-11 2006-03-01 Fuji Photo Film Co., Ltd. Protective film-forming composition for immersion exposure and pattern forming method using the same
US7304715B2 (en) 2004-08-13 2007-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9188880B2 (en) 2004-08-13 2015-11-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a heater
US10254663B2 (en) 2004-08-13 2019-04-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a heater
US9268242B2 (en) 2004-08-13 2016-02-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a heater and a temperature sensor
US9235133B2 (en) 2004-08-17 2016-01-12 Nikon Corporation Lighting optical device, regulation method for lighting optical device, exposure system, and exposure method
US9507278B2 (en) 2004-08-19 2016-11-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9488923B2 (en) 2004-08-19 2016-11-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9904185B2 (en) 2004-08-19 2018-02-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10331047B2 (en) 2004-08-19 2019-06-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9746788B2 (en) 2004-08-19 2017-08-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9097992B2 (en) 2004-08-19 2015-08-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7365828B2 (en) 2004-09-03 2008-04-29 Canon Kabushiki Kaisha Exposure apparatus, exposure method, and device manufacturing method
US7706074B2 (en) 2004-09-13 2010-04-27 Nikon Corporation Projection optical system, method of manufacturing projection optical system, exposure apparatus, and exposure method
US8102512B2 (en) 2004-09-17 2012-01-24 Nikon Corporation Substrate holding device, exposure apparatus, and device manufacturing method
US9958785B2 (en) 2004-09-17 2018-05-01 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8675174B2 (en) 2004-09-17 2014-03-18 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
TWI610340B (zh) * 2004-09-17 2018-01-01 Nikon Corp 曝光裝置、曝光方法及元件製造方法
TWI508136B (zh) * 2004-09-17 2015-11-11 尼康股份有限公司 Exposure apparatus, exposure method, and device manufacturing method
US9341959B2 (en) 2004-09-17 2016-05-17 Nikon Corporation Substrate holding device, exposure apparatus, and device manufacturing method
US7133114B2 (en) 2004-09-20 2006-11-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7808614B2 (en) 2004-09-24 2010-10-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7522261B2 (en) 2004-09-24 2009-04-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8427629B2 (en) 2004-09-24 2013-04-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8068210B2 (en) 2004-09-28 2011-11-29 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and computer program product
US7355674B2 (en) 2004-09-28 2008-04-08 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and computer program product
US8755027B2 (en) 2004-10-05 2014-06-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving fluid mixing and control of the physical property of a fluid
US7894040B2 (en) 2004-10-05 2011-02-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8027026B2 (en) 2004-10-05 2011-09-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7209213B2 (en) 2004-10-07 2007-04-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8241833B2 (en) 2004-10-08 2012-08-14 Fujifilm Corporation Positive resist composition and pattern-forming method using the same
US7811740B2 (en) 2004-10-08 2010-10-12 Fujifilm Corporation Positive resist composition and pattern-forming method using the same
EP1806773A4 (en) * 2004-10-13 2008-12-31 Nikon Corp Exposure device, exposure method, and device manufacturing method
US7852456B2 (en) 2004-10-13 2010-12-14 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
WO2006041086A1 (ja) * 2004-10-13 2006-04-20 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
EP1806773A1 (en) * 2004-10-13 2007-07-11 Nikon Corporation Exposure device, exposure method, and device manufacturing method
JP2006190971A (ja) * 2004-10-13 2006-07-20 Nikon Corp 露光装置、露光方法及びデバイス製造方法
JP2006140459A (ja) * 2004-10-13 2006-06-01 Nikon Corp 露光装置、露光方法及びデバイス製造方法
US8456609B2 (en) 2004-10-15 2013-06-04 Nikon Corporation Exposure apparatus and device manufacturing method
EP2426700A2 (en) 2004-10-15 2012-03-07 Nikon Corporation Exposure apparatus and device manufacturing method
US7456929B2 (en) 2004-10-15 2008-11-25 Nikon Corporation Exposure apparatus and device manufacturing method
EP3306647A1 (en) 2004-10-15 2018-04-11 Nikon Corporation Exposure apparatus and device manufacturing method
EP3046135A2 (en) 2004-10-15 2016-07-20 Nikon Corporation Exposure apparatus and device manufacturing method
US7379155B2 (en) 2004-10-18 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9436097B2 (en) 2004-10-18 2016-09-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10248033B2 (en) 2004-10-18 2019-04-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7119876B2 (en) 2004-10-18 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8004652B2 (en) 2004-10-18 2011-08-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9753380B2 (en) 2004-10-18 2017-09-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8934082B2 (en) 2004-10-18 2015-01-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8004658B2 (en) 2004-10-19 2011-08-23 Nikon Corporation Lighting optical device, exposure system, and exposure method
US7224434B2 (en) * 2004-10-19 2007-05-29 Canon Kabushiki Kaisha Exposure method
US8941808B2 (en) 2004-10-26 2015-01-27 Nikon Corporation Immersion lithographic apparatus rinsing outer contour of substrate with immersion space
US8040489B2 (en) 2004-10-26 2011-10-18 Nikon Corporation Substrate processing method, exposure apparatus, and method for producing device by immersing substrate in second liquid before immersion exposure through first liquid
US8330939B2 (en) 2004-11-01 2012-12-11 Nikon Corporation Immersion exposure apparatus and device manufacturing method with a liquid recovery port provided on at least one of a first stage and second stage
US9709900B2 (en) 2004-11-01 2017-07-18 Nikon Corporation Exposure apparatus and device fabricating method
US8922754B2 (en) 2004-11-01 2014-12-30 Nikon Corporation Immersion exposure apparatus and device fabricating method with two substrate stages and metrology station
JP2006135165A (ja) * 2004-11-08 2006-05-25 Nikon Corp 露光装置及びデバイス製造方法
JP4517354B2 (ja) * 2004-11-08 2010-08-04 株式会社ニコン 露光装置及びデバイス製造方法
JP2006310723A (ja) * 2004-11-10 2006-11-09 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2006310724A (ja) * 2004-11-10 2006-11-09 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
US8496761B2 (en) 2004-11-10 2013-07-30 Sokudo Co., Ltd. Substrate processing apparatus and substrate processing method
US8294873B2 (en) 2004-11-11 2012-10-23 Nikon Corporation Exposure method, device manufacturing method, and substrate
US7583357B2 (en) 2004-11-12 2009-09-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9645507B2 (en) 2004-11-12 2017-05-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7710537B2 (en) 2004-11-12 2010-05-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7251013B2 (en) 2004-11-12 2007-07-31 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8817231B2 (en) 2004-11-12 2014-08-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a liquid confinement structure
US9964861B2 (en) 2004-11-12 2018-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a liquid confinement structure
US7423720B2 (en) 2004-11-12 2008-09-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7414699B2 (en) 2004-11-12 2008-08-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10274832B2 (en) 2004-11-12 2019-04-30 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a liquid confinement structure
US9261797B2 (en) 2004-11-12 2016-02-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a liquid confinement structure
US7852457B2 (en) 2004-11-12 2010-12-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2011211235A (ja) * 2004-11-12 2011-10-20 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
US9798247B2 (en) 2004-11-12 2017-10-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method involving a liquid confinement structure
US9188882B2 (en) 2004-11-17 2015-11-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411657B2 (en) 2004-11-17 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9581916B2 (en) 2004-11-17 2017-02-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7978306B2 (en) 2004-11-17 2011-07-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9857692B2 (en) 2004-11-18 2018-01-02 Nikon Corporation Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
US9298108B2 (en) 2004-11-18 2016-03-29 Nikon Corporation Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
US8059260B2 (en) * 2004-11-18 2011-11-15 Nikon Corporation Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
US8054465B2 (en) 2004-11-18 2011-11-08 Nikon Corporation Position measurement method
US8576379B2 (en) 2004-11-18 2013-11-05 Nikon Corporation Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
US9223230B2 (en) 2004-11-18 2015-12-29 Nikon Corporation Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
KR20150112038A (ko) * 2004-11-18 2015-10-06 가부시키가이샤 니콘 위치 계측 방법, 위치 제어 방법, 계측 방법, 로딩 방법, 노광 방법, 노광 장치, 및 디바이스 제조 방법
US8072578B2 (en) 2004-11-18 2011-12-06 Nikon Corporation Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
KR20150010775A (ko) * 2004-11-18 2015-01-28 가부시키가이샤 니콘 위치 계측 방법, 위치 제어 방법, 계측 방법, 로딩 방법, 노광 방법, 노광 장치, 및 디바이스 제조 방법
US9348238B2 (en) 2004-11-18 2016-05-24 Niko Corporation Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
US9223231B2 (en) 2004-11-18 2015-12-29 Nikon Corporation Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
US10222708B2 (en) 2004-11-18 2019-03-05 Nikon Corporation Position measurement method, position control method, measurement method, loading method, exposure method and exposure apparatus, and device manufacturing method
WO2006054719A1 (ja) * 2004-11-19 2006-05-26 Nikon Corporation メンテナンス方法、露光方法、露光装置及びデバイス製造方法
US7145630B2 (en) 2004-11-23 2006-12-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006148133A (ja) * 2004-11-23 2006-06-08 Taiwan Semiconductor Manufacturing Co Ltd メガソニック超音波リンスを使用するイマージョン式フォトリソグラフィ
US7812924B2 (en) 2004-12-02 2010-10-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7161654B2 (en) 2004-12-02 2007-01-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7764356B2 (en) 2004-12-03 2010-07-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7446850B2 (en) 2004-12-03 2008-11-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8456608B2 (en) 2004-12-06 2013-06-04 Nikon Corporation Maintenance method, maintenance device, exposure apparatus, and device manufacturing method
US7804576B2 (en) 2004-12-06 2010-09-28 Nikon Corporation Maintenance method, maintenance device, exposure apparatus, and device manufacturing method
US8891055B2 (en) 2004-12-06 2014-11-18 Nikon Corporation Maintenance method, maintenance device, exposure apparatus, and device manufacturing method
US8585830B2 (en) 2004-12-06 2013-11-19 Sokudo Co., Ltd. Substrate processing apparatus and substrate processing method
US9703199B2 (en) 2004-12-06 2017-07-11 Screen Semiconductor Solutions Co., Ltd. Substrate processing apparatus
US7196770B2 (en) 2004-12-07 2007-03-27 Asml Netherlands B.V. Prewetting of substrate before immersion exposure
US7643127B2 (en) 2004-12-07 2010-01-05 Asml Netherlands B.V. Prewetting of substrate before immersion exposure
US7248334B2 (en) 2004-12-07 2007-07-24 Asml Netherlands B.V. Sensor shield
US7365827B2 (en) 2004-12-08 2008-04-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8115905B2 (en) 2004-12-08 2012-02-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8860926B2 (en) 2004-12-08 2014-10-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8035799B2 (en) 2004-12-09 2011-10-11 Nikon Corporation Exposure apparatus, exposure method, and device producing method
US8913224B2 (en) 2004-12-09 2014-12-16 Nixon Corporation Exposure apparatus, exposure method, and device producing method
US8077291B2 (en) 2004-12-10 2011-12-13 Asml Netherlands B.V. Substrate placement in immersion lithography
US9740106B2 (en) 2004-12-10 2017-08-22 Asml Netherlands B.V. Substrate placement in immersion lithography
US10345711B2 (en) 2004-12-10 2019-07-09 Asml Netherlands B.V. Substrate placement in immersion lithography
US9182222B2 (en) 2004-12-10 2015-11-10 Asml Netherlands B.V. Substrate placement in immersion lithography
US7352440B2 (en) 2004-12-10 2008-04-01 Asml Netherlands B.V. Substrate placement in immersion lithography
US7751032B2 (en) 2004-12-15 2010-07-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2995997A2 (en) 2004-12-15 2016-03-16 Nikon Corporation Exposure apparatus, exposure method, and device fabricating method
US8233135B2 (en) 2004-12-15 2012-07-31 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9964860B2 (en) 2004-12-15 2018-05-08 Nikon Corporation Substrate holding apparatus, exposure apparatus, and device fabricating method
US7403261B2 (en) 2004-12-15 2008-07-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9690206B2 (en) 2004-12-15 2017-06-27 Nikon Corporation Substrate holding apparatus, exposure apparatus, and device fabricating method
EP3285282A1 (en) 2004-12-15 2018-02-21 Nikon Corporation Exposure apparatus and device fabricating method
EP3428724A1 (en) 2004-12-15 2019-01-16 Nikon Corporation Exposure apparatus and device fabricating method
US9224632B2 (en) 2004-12-15 2015-12-29 Nikon Corporation Substrate holding apparatus, exposure apparatus, and device fabricating method
US9835960B2 (en) 2004-12-20 2017-12-05 Asml Netherlands B.V. Lithographic apparatus
US9417535B2 (en) 2004-12-20 2016-08-16 Asml Netherlands B.V. Lithographic apparatus
JP2012044227A (ja) * 2004-12-20 2012-03-01 Asml Netherlands Bv リソグラフィ装置
JP2008277854A (ja) * 2004-12-20 2008-11-13 Asml Netherlands Bv リソグラフィ装置とデバイス製造方法
JP2008227547A (ja) * 2004-12-20 2008-09-25 Asml Netherlands Bv リソグラフィ装置とデバイス製造方法
US8941811B2 (en) 2004-12-20 2015-01-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9703210B2 (en) 2004-12-20 2017-07-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7528931B2 (en) 2004-12-20 2009-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10248035B2 (en) 2004-12-20 2019-04-02 Asml Netherlands B.V. Lithographic apparatus
US8462312B2 (en) 2004-12-20 2013-06-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9116443B2 (en) 2004-12-20 2015-08-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2008263221A (ja) * 2004-12-20 2008-10-30 Asml Netherlands Bv リソグラフィ装置とデバイス製造方法
JP2008227548A (ja) * 2004-12-20 2008-09-25 Asml Netherlands Bv リソグラフィ装置とデバイス製造方法
US8233137B2 (en) 2004-12-20 2012-07-31 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9329494B2 (en) 2004-12-20 2016-05-03 Asml Netherlands B.V. Lithographic apparatus
US7763355B2 (en) 2004-12-28 2010-07-27 Asml Netherlands B.V. Device manufacturing method, top coat material and substrate
US7405805B2 (en) 2004-12-28 2008-07-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8913225B2 (en) 2004-12-28 2014-12-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8013978B2 (en) 2004-12-28 2011-09-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7491661B2 (en) 2004-12-28 2009-02-17 Asml Netherlands B.V. Device manufacturing method, top coat material and substrate
US8354209B2 (en) 2004-12-30 2013-01-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8102507B2 (en) 2004-12-30 2012-01-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7670730B2 (en) 2004-12-30 2010-03-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7450217B2 (en) 2005-01-12 2008-11-11 Asml Netherlands B.V. Exposure apparatus, coatings for exposure apparatus, lithographic apparatus, device manufacturing method, and device manufactured thereby
US8830446B2 (en) 2005-01-12 2014-09-09 Asml Netherlands B.V. Exposure apparatus
US8542341B2 (en) 2005-01-12 2013-09-24 Asml Netherlands B.V. Exposure apparatus
US7705962B2 (en) 2005-01-14 2010-04-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP3079164A1 (en) 2005-01-31 2016-10-12 Nikon Corporation Exposure apparatus and method for producing device
US9746781B2 (en) 2005-01-31 2017-08-29 Nikon Corporation Exposure apparatus and method for producing device
WO2006080516A1 (ja) 2005-01-31 2006-08-03 Nikon Corporation 露光装置及びデバイス製造方法
EP2506289A2 (en) 2005-01-31 2012-10-03 Nikon Corporation Exposure apparatus and method for manufacturing device
US7352437B2 (en) 2005-02-08 2008-04-01 Canon Kabushiki Kaisha Exposure apparatus
US9164391B2 (en) 2005-02-10 2015-10-20 Asml Netherlands B.V. Immersion liquid, exposure apparatus, and exposure process
US9454088B2 (en) 2005-02-10 2016-09-27 Asml Netherlands B.V. Immersion liquid, exposure apparatus, and exposure process
US9772565B2 (en) 2005-02-10 2017-09-26 Asml Netherlands B.V. Immersion liquid, exposure apparatus, and exposure process
US8859188B2 (en) 2005-02-10 2014-10-14 Asml Netherlands B.V. Immersion liquid, exposure apparatus, and exposure process
US7914687B2 (en) 2005-02-22 2011-03-29 Asml Netherlands B.V. Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method
US8018573B2 (en) 2005-02-22 2011-09-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8902404B2 (en) 2005-02-22 2014-12-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8246838B2 (en) 2005-02-22 2012-08-21 Asml Netherlands B.V. Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method
US7224431B2 (en) 2005-02-22 2007-05-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7378025B2 (en) 2005-02-22 2008-05-27 Asml Netherlands B.V. Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method
US8107053B2 (en) 2005-02-28 2012-01-31 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid
US8958051B2 (en) 2005-02-28 2015-02-17 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid
US7428038B2 (en) 2005-02-28 2008-09-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid
US7324185B2 (en) 2005-03-04 2008-01-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7843551B2 (en) 2005-03-04 2010-11-30 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8514369B2 (en) 2005-03-04 2013-08-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9477159B2 (en) 2005-03-04 2016-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7684010B2 (en) 2005-03-09 2010-03-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, seal structure, method of removing an object and a method of sealing
US8390778B2 (en) 2005-03-09 2013-03-05 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, seal structure, method of removing an object and a method of sealing
US7705968B2 (en) 2005-03-18 2010-04-27 Nikon Corporation Plate member, substrate holding device, exposure apparatus and method, and device manufacturing method
US7561249B2 (en) 2005-03-18 2009-07-14 Canon Kabushiki Kaisha Exposure apparatus, exposure method, and device manufacturing method
US8638422B2 (en) 2005-03-18 2014-01-28 Nikon Corporation Exposure method, exposure apparatus, method for producing device, and method for evaluating exposure apparatus
US7864291B2 (en) 2005-03-18 2011-01-04 Canon Kabushiki Kaisha Exposure apparatus and device manufacturing method
US8339614B2 (en) 2005-03-25 2012-12-25 Nikon Corporation Method of measuring shot shape and mask
EP3159738A2 (en) 2005-03-25 2017-04-26 Nikon Corporation Method of measuring shot shape and mask
US7692761B2 (en) 2005-03-25 2010-04-06 Canon Kabushiki Kaisha Exposure apparatus and method, and device manufacturing method
US7330238B2 (en) 2005-03-28 2008-02-12 Asml Netherlands, B.V. Lithographic apparatus, immersion projection apparatus and device manufacturing method
US7859644B2 (en) 2005-03-28 2010-12-28 Asml Netherlands B.V. Lithographic apparatus, immersion projection apparatus and device manufacturing method
US9239524B2 (en) 2005-03-30 2016-01-19 Nikon Corporation Exposure condition determination method, exposure method, exposure apparatus, and device manufacturing method involving detection of the situation of a liquid immersion region
JP2011066416A (ja) * 2005-04-05 2011-03-31 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
US10209629B2 (en) 2005-04-05 2019-02-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9429853B2 (en) 2005-04-05 2016-08-30 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN101256365A (zh) * 2005-04-05 2008-09-03 Asml荷兰有限公司 光刻装置和器件制造方法
JP2010074187A (ja) * 2005-04-05 2010-04-02 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
US8976334B2 (en) 2005-04-05 2015-03-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8259287B2 (en) 2005-04-05 2012-09-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8988651B2 (en) 2005-04-05 2015-03-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9857695B2 (en) 2005-04-05 2018-01-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006295161A (ja) * 2005-04-05 2006-10-26 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
US7411654B2 (en) 2005-04-05 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7291850B2 (en) 2005-04-08 2007-11-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
USRE46933E1 (en) 2005-04-08 2018-07-03 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
US7582881B2 (en) 2005-04-08 2009-09-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8089608B2 (en) 2005-04-18 2012-01-03 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8724077B2 (en) 2005-04-18 2014-05-13 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US7256864B2 (en) 2005-04-19 2007-08-14 Asml Holding N.V. Liquid immersion lithography system having a tilted showerhead relative to a substrate
US7253879B2 (en) 2005-04-19 2007-08-07 Asml Holding N.V. Liquid immersion lithography system with tilted liquid flow
US9618854B2 (en) 2005-04-25 2017-04-11 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US8064039B2 (en) 2005-04-25 2011-11-22 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US9335639B2 (en) 2005-04-25 2016-05-10 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US8941812B2 (en) 2005-04-28 2015-01-27 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
EP2527921A2 (en) 2005-04-28 2012-11-28 Nikon Corporation Exposure method and exposure apparatus
US8236467B2 (en) 2005-04-28 2012-08-07 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US9146478B2 (en) 2005-05-03 2015-09-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7433016B2 (en) 2005-05-03 2008-10-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7317507B2 (en) 2005-05-03 2008-01-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9081300B2 (en) 2005-05-03 2015-07-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9606449B2 (en) 2005-05-03 2017-03-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8860924B2 (en) 2005-05-03 2014-10-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10025196B2 (en) 2005-05-03 2018-07-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9229335B2 (en) 2005-05-03 2016-01-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8248577B2 (en) 2005-05-03 2012-08-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9477153B2 (en) 2005-05-03 2016-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006313904A (ja) * 2005-05-03 2006-11-16 Asml Netherlands Bv リソグラフィ装置及びデバイス製造方法
US10353296B2 (en) 2005-05-03 2019-07-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9891539B2 (en) 2005-05-12 2018-02-13 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US8253924B2 (en) 2005-05-24 2012-08-28 Nikon Corporation Exposure method, exposure apparatus and device manufacturing method
US9268236B2 (en) 2005-06-21 2016-02-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method having heat pipe with fluid to cool substrate and/or substrate holder
WO2006137410A1 (ja) 2005-06-21 2006-12-28 Nikon Corporation 露光装置及び露光方法、メンテナンス方法、並びにデバイス製造方法
US7652746B2 (en) 2005-06-21 2010-01-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7751027B2 (en) 2005-06-21 2010-07-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7924416B2 (en) 2005-06-22 2011-04-12 Nikon Corporation Measurement apparatus, exposure apparatus, and device manufacturing method
US10386725B2 (en) 2005-06-28 2019-08-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9766556B2 (en) 2005-06-28 2017-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8687168B2 (en) 2005-06-28 2014-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7929112B2 (en) 2005-06-28 2011-04-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9099501B2 (en) 2005-06-28 2015-08-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7834974B2 (en) 2005-06-28 2010-11-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7474379B2 (en) 2005-06-28 2009-01-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8120749B2 (en) 2005-06-28 2012-02-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8848165B2 (en) 2005-06-28 2014-09-30 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9952514B2 (en) 2005-06-28 2018-04-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9448494B2 (en) 2005-06-28 2016-09-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7468779B2 (en) 2005-06-28 2008-12-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7522258B2 (en) 2005-06-29 2009-04-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing movement of clean air to reduce contamination
US8179517B2 (en) 2005-06-30 2012-05-15 Nikon Corporation Exposure apparatus and method, maintenance method for exposure apparatus, and device manufacturing method
WO2007004567A1 (ja) 2005-07-01 2007-01-11 Nikon Corporation 露光装置、露光方法及びデバイス製造方法、並びにシステム
US7535644B2 (en) 2005-08-12 2009-05-19 Asml Netherlands B.V. Lens element, lithographic apparatus, device manufacturing method, and device manufactured thereby
US8054445B2 (en) 2005-08-16 2011-11-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2007023813A1 (ja) 2005-08-23 2007-03-01 Nikon Corporation 露光装置及び露光方法、並びにデバイス製造方法
US8018571B2 (en) 2005-08-23 2011-09-13 Nikon Corporation Exposure apparatus and exposure method, and device manufacturing method
US8668191B2 (en) 2005-08-26 2014-03-11 Nikon Corporation Holding unit, assembly system, sputtering unit, and processing method and processing unit
US8070145B2 (en) 2005-08-26 2011-12-06 Nikon Corporation Holding unit, assembly system, sputtering unit, and processing method and processing unit
US8724075B2 (en) 2005-08-31 2014-05-13 Nikon Corporation Optical element, exposure apparatus based on the use of the same, exposure method, and method for producing microdevice
US7812926B2 (en) 2005-08-31 2010-10-12 Nikon Corporation Optical element, exposure apparatus based on the use of the same, exposure method, and method for producing microdevice
EP3428723A1 (en) 2005-08-31 2019-01-16 Nikon Corporation Optical element, exposure apparatus based on the use of the same, exposure method and method for producing microdevice
US8111374B2 (en) 2005-09-09 2012-02-07 Nikon Corporation Analysis method, exposure method, and device manufacturing method
US8780326B2 (en) 2005-09-09 2014-07-15 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
WO2007034838A1 (ja) 2005-09-21 2007-03-29 Nikon Corporation 露光装置及び露光方法、並びにデバイス製造方法
US8540824B2 (en) 2005-09-25 2013-09-24 Sokudo Co., Ltd. Substrate processing method
US8958054B2 (en) 2005-10-06 2015-02-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411658B2 (en) 2005-10-06 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8004654B2 (en) 2005-10-06 2011-08-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7537871B2 (en) 2005-10-07 2009-05-26 Kabushiki Kaisha Toshiba Method of manufacturing semiconductor device
JP2007103841A (ja) * 2005-10-07 2007-04-19 Toshiba Corp 半導体装置の製造方法
US7342640B2 (en) 2005-10-11 2008-03-11 Canon Kabushiki Kaisha Exposure apparatus and method
US7742147B2 (en) 2005-10-11 2010-06-22 Canon Kabushiki Kaisha Exposure apparatus
US8681314B2 (en) 2005-10-24 2014-03-25 Nikon Corporation Stage device and coordinate correction method for the same, exposure apparatus, and device manufacturing method
US8090875B2 (en) 2005-10-28 2012-01-03 Nikon Corporation Device and method for connecting device manufacturing processing apparatuses, program, device manufacturing processing system, exposure apparatus and method, and measurement and inspection apparatus and method
WO2007055199A1 (ja) 2005-11-09 2007-05-18 Nikon Corporation 露光装置及び方法、並びにデバイス製造方法
US8786823B2 (en) 2005-11-16 2014-07-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7656501B2 (en) 2005-11-16 2010-02-02 Asml Netherlands B.V. Lithographic apparatus
US9140996B2 (en) 2005-11-16 2015-09-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7804577B2 (en) 2005-11-16 2010-09-28 Asml Netherlands B.V. Lithographic apparatus
US8421996B2 (en) 2005-11-16 2013-04-16 Asml Netherlands B.V. Lithographic apparatus
US7864292B2 (en) 2005-11-16 2011-01-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10126664B2 (en) 2005-11-16 2018-11-13 Asml Netherlands, B.V. Lithographic apparatus and device manufacturing method
US9618853B2 (en) 2005-11-16 2017-04-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2007058354A1 (ja) 2005-11-21 2007-05-24 Nikon Corporation 露光方法及びそれを用いたデバイス製造方法、露光装置、並びに基板処理方法及び装置
US7803516B2 (en) 2005-11-21 2010-09-28 Nikon Corporation Exposure method, device manufacturing method using the same, exposure apparatus, and substrate processing method and apparatus
US8138486B2 (en) * 2005-11-23 2012-03-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7928407B2 (en) 2005-11-23 2011-04-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7633073B2 (en) 2005-11-23 2009-12-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8481978B2 (en) 2005-11-23 2013-07-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7773195B2 (en) 2005-11-29 2010-08-10 Asml Holding N.V. System and method to increase surface tension and contact angle in immersion lithography
US8456611B2 (en) 2005-11-29 2013-06-04 Asml Holding N.V. System and method to increase surface tension and contact angle in immersion lithography
US10061207B2 (en) 2005-12-02 2018-08-28 Asml Netherlands B.V. Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus
US7782442B2 (en) 2005-12-06 2010-08-24 Nikon Corporation Exposure apparatus, exposure method, projection optical system and device producing method
WO2007066679A1 (ja) 2005-12-06 2007-06-14 Nikon Corporation 露光装置、露光方法、投影光学系及びデバイス製造方法
US7420194B2 (en) 2005-12-27 2008-09-02 Asml Netherlands B.V. Lithographic apparatus and substrate edge seal
JP2007180555A (ja) * 2005-12-27 2007-07-12 Asml Netherlands Bv 露光装置および基板端部シール
US8003968B2 (en) 2005-12-27 2011-08-23 Asml Netherlands B.V. Lithographic apparatus and substrate edge seal
JP2010278475A (ja) * 2005-12-27 2010-12-09 Asml Netherlands Bv 露光装置および基板端部シール
JP4675877B2 (ja) * 2005-12-27 2011-04-27 エーエスエムエル ネザーランズ ビー.ブイ. 露光装置および基板端部シール
US8232540B2 (en) 2005-12-27 2012-07-31 Asml Netherlands B.V. Lithographic apparatus and substrate edge seal
US8411271B2 (en) 2005-12-28 2013-04-02 Nikon Corporation Pattern forming method, pattern forming apparatus, and device manufacturing method
US8564760B2 (en) 2005-12-28 2013-10-22 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a control system
US7839483B2 (en) 2005-12-28 2010-11-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a control system
WO2007077875A1 (ja) 2005-12-28 2007-07-12 Nikon Corporation 露光装置及び露光方法、並びにデバイス製造方法
US8743339B2 (en) 2005-12-30 2014-06-03 Asml Netherlands Lithographic apparatus and device manufacturing method
US10222711B2 (en) 2005-12-30 2019-03-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9436096B2 (en) 2005-12-30 2016-09-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9851644B2 (en) 2005-12-30 2017-12-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8947631B2 (en) 2005-12-30 2015-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8941810B2 (en) 2005-12-30 2015-01-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10185227B2 (en) 2006-01-19 2019-01-22 Nikon Corporation Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method
US7839485B2 (en) 2006-01-19 2010-11-23 Nikon Corporation Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method
US10185228B2 (en) 2006-01-19 2019-01-22 Nikon Corporation Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method
US10203613B2 (en) 2006-01-19 2019-02-12 Nikon Corporation Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method
US10133195B2 (en) 2006-01-19 2018-11-20 Nikon Corporation Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus, and device manufacturing method
US8390779B2 (en) 2006-02-16 2013-03-05 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
WO2007094407A1 (ja) 2006-02-16 2007-08-23 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
US8027020B2 (en) 2006-02-16 2011-09-27 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
WO2007094414A1 (ja) 2006-02-16 2007-08-23 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
US8134681B2 (en) 2006-02-17 2012-03-13 Nikon Corporation Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium
US9329060B2 (en) 2006-02-21 2016-05-03 Nikon Corporation Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method
US10409173B2 (en) 2006-02-21 2019-09-10 Nikon Corporation Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method, and device manufacturing method
US9690214B2 (en) 2006-02-21 2017-06-27 Nikon Corporation Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method
US10139738B2 (en) 2006-02-21 2018-11-27 Nikon Corporation Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method
US10012913B2 (en) 2006-02-21 2018-07-03 Nikon Corporation Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method
US10132658B2 (en) 2006-02-21 2018-11-20 Nikon Corporation Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method
US10345121B2 (en) 2006-02-21 2019-07-09 Nikon Corporation Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method
US9989859B2 (en) 2006-02-21 2018-06-05 Nikon Corporation Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method
US10088759B2 (en) 2006-02-21 2018-10-02 Nikon Corporation Pattern forming apparatus and pattern forming method, movable body drive system and movable body drive method, exposure apparatus and exposure method, and device manufacturing method
US10088343B2 (en) 2006-02-21 2018-10-02 Nikon Corporation Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure apparatus and method, and device manufacturing method
US9857697B2 (en) 2006-02-21 2018-01-02 Nikon Corporation Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method, and device manufacturing method
US10234773B2 (en) 2006-02-21 2019-03-19 Nikon Corporation Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method, and device manufacturing method
US8159650B2 (en) 2006-03-07 2012-04-17 Nikon Corporation Device manufacturing method, device manufacturing system, and measurement/inspection apparatus
US8045134B2 (en) 2006-03-13 2011-10-25 Asml Netherlands B.V. Lithographic apparatus, control system and device manufacturing method
US9482967B2 (en) 2006-03-13 2016-11-01 Asml Netherlands B.V. Lithographic apparatus, control system and device manufacturing method
US8035800B2 (en) 2006-03-13 2011-10-11 Nikon Corporation Exposure apparatus, maintenance method, exposure method, and method for producing device
WO2007105645A1 (ja) 2006-03-13 2007-09-20 Nikon Corporation 露光装置、メンテナンス方法、露光方法及びデバイス製造方法
JP2007329453A (ja) * 2006-04-07 2007-12-20 Carl Zeiss Smt Ag 光学エレメントのための保持デバイス
US9477158B2 (en) 2006-04-14 2016-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9195069B2 (en) 2006-04-17 2015-11-24 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US7688436B2 (en) 2006-04-27 2010-03-30 Nikon Corporation Measuring and/or inspecting method, measuring and/or inspecting apparatus, exposure method, device manufacturing method, and device manufacturing apparatus
US9810996B2 (en) 2006-05-09 2017-11-07 Carl Zeiss Smt Gmbh Optical imaging device with thermal attenuation
JP2009536452A (ja) * 2006-05-09 2009-10-08 カール・ツァイス・エスエムティー・アーゲー 光学結像装置
US8902401B2 (en) 2006-05-09 2014-12-02 Carl Zeiss Smt Gmbh Optical imaging device with thermal attenuation
JP2016177289A (ja) * 2006-05-09 2016-10-06 カール・ツァイス・エスエムティー・ゲーエムベーハー 光学結像装置
JP2012256921A (ja) * 2006-05-09 2012-12-27 Carl Zeiss Smt Gmbh 光学結像装置
US8477283B2 (en) 2006-05-10 2013-07-02 Nikon Corporation Exposure apparatus and device manufacturing method
WO2007138834A1 (ja) 2006-05-31 2007-12-06 Nikon Corporation 露光装置及び露光方法
EP3392903A1 (en) 2006-06-16 2018-10-24 Nikon Corporation Variable slit device, illumination device, exposure apparatus, exposure method, and device manufacturing method
WO2007145139A1 (ja) 2006-06-16 2007-12-21 Nikon Corporation 可変スリット装置、照明装置、露光装置、露光方法及びデバイス製造方法
WO2008007632A1 (fr) 2006-07-12 2008-01-17 Nikon Corporation Appareil optique d'éclairage, appareil d'exposition, et procédé de fabrication du dispositif
US8325324B2 (en) 2006-07-12 2012-12-04 Nikon Corporation Illuminating optical apparatus, exposure apparatus and device manufacturing method
WO2008007633A1 (en) 2006-07-12 2008-01-17 Nikon Corporation Illuminating optical apparatus, exposure apparatus and device manufacturing method
US8570484B2 (en) 2006-08-30 2013-10-29 Nikon Corporation Immersion exposure apparatus, device manufacturing method, cleaning method, and cleaning member to remove foreign substance using liquid
US10338482B2 (en) 2006-08-31 2019-07-02 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US10162274B2 (en) 2006-08-31 2018-12-25 Nikon Corporation Movable body drive method and system, pattern formation method and apparatus, exposure method and apparatus for driving movable body based on measurement value of encoder and information on flatness of scale, and device manufacturing method
US10067428B2 (en) 2006-08-31 2018-09-04 Nikon Corporation Movable body drive system and movable body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision-making method
US10353301B2 (en) 2006-08-31 2019-07-16 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US9958792B2 (en) 2006-08-31 2018-05-01 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US8947639B2 (en) 2006-08-31 2015-02-03 Nikon Corporation Exposure method and apparatus measuring position of movable body based on information on flatness of encoder grating section
US10073359B2 (en) 2006-08-31 2018-09-11 Nikon Corporation Movable body drive system and movable body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision-making method
US9983486B2 (en) 2006-08-31 2018-05-29 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US10101673B2 (en) 2006-08-31 2018-10-16 Nikon Corporation Movable body drive method and system, pattern formation method and apparatus, exposure method and apparatus for driving movable body based on measurement value of encoder and information on flatness of scale, and device manufacturing method
US8937710B2 (en) 2006-08-31 2015-01-20 Nikon Corporation Exposure method and apparatus compensating measuring error of encoder due to grating section and displacement of movable body in Z direction
US10353302B2 (en) 2006-08-31 2019-07-16 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US9625834B2 (en) 2006-09-01 2017-04-18 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method
US9971253B2 (en) 2006-09-01 2018-05-15 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method
US10197924B2 (en) 2006-09-01 2019-02-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method
US9846374B2 (en) 2006-09-01 2017-12-19 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method
US10289010B2 (en) 2006-09-01 2019-05-14 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US10289012B2 (en) 2006-09-01 2019-05-14 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method
US9874822B2 (en) 2006-09-01 2018-01-23 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US9740114B2 (en) 2006-09-01 2017-08-22 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method
US9760021B2 (en) 2006-09-01 2017-09-12 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method
US9377698B2 (en) 2006-09-01 2016-06-28 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and calibration method
US8059257B2 (en) 2006-09-04 2011-11-15 Canon Kabushiki Kaisha Exposure apparatus and device manufacturing method
US9563116B2 (en) 2006-09-08 2017-02-07 Nikon Corporation Mask, exposure apparatus and device manufacturing method
US8609301B2 (en) 2006-09-08 2013-12-17 Nikon Corporation Mask, exposure apparatus and device manufacturing method
US8743341B2 (en) 2006-09-15 2014-06-03 Nikon Corporation Immersion exposure apparatus and immersion exposure method, and device manufacturing method
US7872730B2 (en) 2006-09-15 2011-01-18 Nikon Corporation Immersion exposure apparatus and immersion exposure method, and device manufacturing method
JP2008134214A (ja) * 2006-11-01 2008-06-12 Lasertec Corp マスク検査装置
US10168625B2 (en) 2006-11-03 2019-01-01 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography system using a sealed wafer bath
US8767178B2 (en) 2006-11-03 2014-07-01 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography system using direction-controlling fluid inlets
US9046789B2 (en) 2006-11-03 2015-06-02 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography system using a sealed wafer bath
US8208116B2 (en) 2006-11-03 2012-06-26 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography system using a sealed wafer bath
JP4742077B2 (ja) * 2006-11-03 2011-08-10 台湾積體電路製造股▲ふん▼有限公司Taiwan Semiconductor Manufacturing Company,Ltd. 液浸リソグラフィ装置、液浸露光方法及び液浸露光装置
US8253922B2 (en) 2006-11-03 2012-08-28 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography system using a sealed wafer bath
US9696634B2 (en) 2006-11-03 2017-07-04 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography system using a sealed wafer bath
JP2008118114A (ja) * 2006-11-03 2008-05-22 Taiwan Semiconductor Manufacturing Co Ltd 液浸リソグラフィ装置、及び液浸露光方法
JP2008118102A (ja) * 2006-11-03 2008-05-22 Taiwan Semiconductor Manufacturing Co Ltd 液浸リソグラフィ装置、液浸露光方法及び液浸露光装置
EP2392971A1 (en) 2006-11-16 2011-12-07 Nikon Corporation Surface treatment method and surface treatment apparatus, exposure method and exposure apparatus, and device manufacturing method
US7973910B2 (en) 2006-11-17 2011-07-05 Nikon Corporation Stage apparatus and exposure apparatus
US8749755B2 (en) 2006-11-17 2014-06-10 Nikon Corporation Stage apparatus and exposure apparatus
US8045135B2 (en) 2006-11-22 2011-10-25 Asml Netherlands B.V. Lithographic apparatus with a fluid combining unit and related device manufacturing method
US9330912B2 (en) 2006-11-22 2016-05-03 Asml Netherlands B.V. Lithographic apparatus, fluid combining unit and device manufacturing method
US8013975B2 (en) 2006-12-01 2011-09-06 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8040490B2 (en) 2006-12-01 2011-10-18 Nikon Corporation Liquid immersion exposure apparatus, exposure method, and method for producing device
US8721803B2 (en) 2006-12-05 2014-05-13 Nikon Corporation Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus, and device fabricating method
US10268127B2 (en) 2006-12-07 2019-04-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9632425B2 (en) 2006-12-07 2017-04-25 Asml Holding N.V. Lithographic apparatus, a dryer and a method of removing liquid from a surface
US9645506B2 (en) 2006-12-07 2017-05-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8634053B2 (en) 2006-12-07 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10185231B2 (en) 2006-12-07 2019-01-22 Asml Holding N.V. Lithographic apparatus, a dryer and a method of removing liquid from a surface
US7791709B2 (en) 2006-12-08 2010-09-07 Asml Netherlands B.V. Substrate support and lithographic process
EP2998983A2 (en) 2006-12-27 2016-03-23 Nikon Corporation Stage apparatus, exposure apparatus and device fabricating method
WO2008078688A1 (ja) 2006-12-27 2008-07-03 Nikon Corporation ステージ装置、露光装置、及びデバイスの製造方法
US8323855B2 (en) 2007-03-01 2012-12-04 Nikon Corporation Pellicle frame apparatus, mask, exposing method, exposure apparatus, and device fabricating method
JP2008277469A (ja) * 2007-04-27 2008-11-13 Hitachi Ltd 感光性sam膜の露光方法および半導体装置の製造方法
US8947629B2 (en) 2007-05-04 2015-02-03 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
US9013672B2 (en) 2007-05-04 2015-04-21 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
US8189168B2 (en) 2007-05-28 2012-05-29 Nikon Corporation Exposure apparatus, device production method, cleaning apparatus, cleaning method, and exposure method
US8164736B2 (en) 2007-05-29 2012-04-24 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
EP2631699A1 (en) 2007-09-14 2013-08-28 Nikon Corporation Illumination optical system, configuration and illumination methods
EP2278380A1 (en) 2007-09-14 2011-01-26 Nikon Corporation Design and manufacturing method of an optical element
US10101666B2 (en) 2007-10-12 2018-10-16 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US9097981B2 (en) 2007-10-12 2015-08-04 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US9857599B2 (en) 2007-10-24 2018-01-02 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
EP2620799A2 (en) 2007-10-24 2013-07-31 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9341954B2 (en) 2007-10-24 2016-05-17 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
EP2620800A2 (en) 2007-10-24 2013-07-31 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
EP2273305A2 (en) 2007-10-24 2011-01-12 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
EP2620801A2 (en) 2007-10-24 2013-07-31 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
EP2273304A1 (en) 2007-10-24 2011-01-12 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US9678332B2 (en) 2007-11-06 2017-06-13 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US8953147B2 (en) 2007-11-08 2015-02-10 Nikon Corporation Spatial light modulation unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
EP2518565A1 (en) 2007-11-08 2012-10-31 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
EP3101478A2 (en) 2007-11-08 2016-12-07 Nikon Corporation Spatial light modulation unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US8144308B2 (en) 2007-11-08 2012-03-27 Nikon Corporation Spatial light modulation unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
WO2009078223A1 (ja) 2007-12-17 2009-06-25 Nikon Corporation 空間光変調ユニット、照明光学系、露光装置、およびデバイス製造方法
WO2009078224A1 (ja) 2007-12-17 2009-06-25 Nikon Corporation 照明光学系、露光装置、およびデバイス製造方法
US8451425B2 (en) 2007-12-28 2013-05-28 Nikon Corporation Exposure apparatus, exposure method, cleaning apparatus, and device manufacturing method
JP5515742B2 (ja) * 2007-12-28 2014-06-11 株式会社ニコン 露光装置、露光方法、クリーニング装置、及びデバイス製造方法
WO2009084644A1 (ja) * 2007-12-28 2009-07-09 Nikon Corporation 露光装置、露光方法、クリーニング装置、及びデバイス製造方法
EP3306398A1 (en) 2008-02-14 2018-04-11 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method, compensation filter, and exposure optical system
US8908151B2 (en) 2008-02-14 2014-12-09 Nikon Corporation Illumination optical system, exposure apparatus, device manufacturing method, compensation filter, and exposure optical system
WO2009101958A1 (ja) 2008-02-14 2009-08-20 Nikon Corporation 照明光学系、露光装置、デバイス製造方法、補正フィルター、及び露光光学系
WO2009125511A1 (ja) 2008-04-11 2009-10-15 株式会社ニコン 空間光変調ユニット、照明光学系、露光装置、およびデバイス製造方法
US8891053B2 (en) 2008-09-10 2014-11-18 Asml Netherlands B.V. Lithographic apparatus, method of manufacturing an article for a lithographic apparatus and device manufacturing method
US8451430B2 (en) 2008-12-24 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8947635B2 (en) 2008-12-24 2015-02-03 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
DE112010002795T5 (de) 2009-07-01 2012-08-23 Nikon Corporation Schleifvorrichtung, Schleifverfahren, Belichtungsvorrichtung undVerfahren zum Herstellen eines Bauelements
WO2011021444A1 (en) 2009-08-17 2011-02-24 Nikon Corporation Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method
US9341956B2 (en) 2009-12-23 2016-05-17 Nikon Corporation Spatial light modulator unit, illumination optical system, exposure device, and device manufacturing method
US9817229B2 (en) 2009-12-23 2017-11-14 Nikon Corporation Spatial light modulator unit, illumination optical system, exposure device, and device manufacturing method
US10203496B2 (en) 2009-12-23 2019-02-12 Nikon Corporation Spatial light modulator unit, illumination optical system, exposure device, and device manufacturing method
WO2011105307A1 (en) 2010-02-25 2011-09-01 Nikon Corporation Measuring method and measuring apparatus of pupil transmittance distribution, exposure method and exposure apparatus, and device manufacturing method
US9389519B2 (en) 2010-02-25 2016-07-12 Nikon Corporation Measuring method and measuring apparatus of pupil transmittance distribution, exposure method and exposure apparatus, and device manufacturing method
WO2011105308A1 (en) 2010-02-25 2011-09-01 Nikon Corporation Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method
JP2010153933A (ja) * 2010-04-05 2010-07-08 Nikon Corp 露光装置及びデバイス製造方法
US9846372B2 (en) 2010-04-22 2017-12-19 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
US10209624B2 (en) 2010-04-22 2019-02-19 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
US9256136B2 (en) 2010-04-22 2016-02-09 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method involving gas supply
US8810770B2 (en) * 2010-06-16 2014-08-19 Canon Kabushiki Kaisha Exposure apparatus and article manufacturing method
US20110310366A1 (en) * 2010-06-16 2011-12-22 Canon Kabushiki Kaisha Exposure apparatus and article manufacturing method
US9563130B2 (en) 2010-06-19 2017-02-07 Nikon Corporation Illumination optical system, exposure apparatus and device manufacturing method
WO2011158912A1 (ja) 2010-06-19 2011-12-22 株式会社ニコン 照明光学系、露光装置、およびデバイス製造方法
US10168620B2 (en) 2010-06-19 2019-01-01 Nikon Corporation Illumination optical system, exposure apparatus and device manufacturing method
US8934086B2 (en) 2010-06-19 2015-01-13 Nikon Corporation Illumination optical system, exposure apparatus and device manufacturing method
EP3547032A1 (en) 2010-06-19 2019-10-02 Nikon Corporation Illumination optical system, exposure apparatus and device manufacturing method
US9122170B2 (en) 2010-08-02 2015-09-01 Nikon Corporation Transmission optical system, illumination optical system, exposure apparatus, and device manufacturing method
US10175583B2 (en) 2011-06-07 2019-01-08 Nikon Corporation Illumination optical system, exposure apparatus, device production method, and light polarization unit
US10353294B2 (en) 2011-06-13 2019-07-16 Nikon Corporation Illumination optical assembly, exposure device, and device manufacturing method
WO2012172705A1 (ja) 2011-06-13 2012-12-20 株式会社ニコン 照明光学系、露光装置、およびデバイス製造方法
US9523918B2 (en) 2011-06-13 2016-12-20 Nikon Corporation Illumination optical assembly, exposure device, and device manufacturing method
US9513560B2 (en) 2011-10-24 2016-12-06 Nikon Corporation Illumination optical assembly, exposure apparatus, and device manufacturing method
US9581811B2 (en) 2012-05-02 2017-02-28 Nikon Corporation Method for evaluating and improving pupil luminance distribution, illumination optical system and adjustment method thereof, exposure apparatus, exposure method, and device manufacturing method

Similar Documents

Publication Publication Date Title
KR100717689B1 (ko) 노광장치 및 디바이스제조방법
US7468780B2 (en) Exposure apparatus and method
US7385674B2 (en) Exposure apparatus and device manufacturing method
KR100546860B1 (ko) 리소그래피 장치 및 디바이스 제조방법
EP1670038B1 (en) Optical element and exposure apparatus
JP4288694B2 (ja) 基板保持装置、露光装置及びデバイス製造方法
KR100443452B1 (ko) 주사형노광장치
US8441617B2 (en) Substrate placement in immersion lithography
CN1650401B (zh) 曝光方法与曝光装置、以及器件的制造方法
KR100737505B1 (ko) 리소그래피 장치 및 디바이스 제조 방법
US7532310B2 (en) Apparatus, method for supporting and/or thermally conditioning a substrate, a support table, and a chuck
CN101424883B (zh) 曝光设备和器件制造法
KR100695988B1 (ko) 리소그래피 투영 장치에 사용되는 정화 가스 시스템
KR100851092B1 (ko) 이중층 레티클 블랭크 및 이것의 제조방법
US20170153556A1 (en) Lithographic apparatus and device manufacturing method
CN100562805C (zh) 光刻投影装置和器件制作方法
US20110090473A1 (en) Lithographic apparatus
US6614504B2 (en) Exposure apparatus, exposure method, and device manufacturing method
JP5237309B2 (ja) 液浸型投影装置の汚染を防止または低減する方法および液浸型リソグラフィ装置
CN101470360B (zh) 光刻装置和器件制造方法
US7057702B2 (en) Lithographic apparatus and device manufacturing method
JP4383993B2 (ja) リソグラフィ装置
JP3747566B2 (ja) 液浸型露光装置
US8233135B2 (en) Lithographic apparatus and device manufacturing method
US20050134817A1 (en) Liquid immersion type exposure apparatus