CN109416564B - 用于数据中心的存储托架 - Google Patents
用于数据中心的存储托架 Download PDFInfo
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- CN109416564B CN109416564B CN201780038401.8A CN201780038401A CN109416564B CN 109416564 B CN109416564 B CN 109416564B CN 201780038401 A CN201780038401 A CN 201780038401A CN 109416564 B CN109416564 B CN 109416564B
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Abstract
示例可以包括用于数据中心的机架的托架,其包括物理存储资源。托架包括安装凸缘和存储设备安装槽,安装凸缘用于使得能够机器人化地插入机架和从机架移除,存储设备安装槽用于使得能够将存储设备机器人化地插入托架和从托架移除。存储设备通过存储资源控制器和双模光网络接口耦合到光结构。
Description
相关申请
本申请要求享有以下先前提交的申请的权益和优先权:2016年12月29日提交且指定序列号为15/394,392的题为“Storage Sled for a Data Center”的美国专利申请,其要求享有2016年11月29日提交且指定序列号为62/427,268的题为“Framework andTechniques for Pools of Configurable Computing Resources”的美国临时专利申请的优先权;2016年8月18日提交且指定序列号为62/376,859的题为“Scalable SystemFramework Prime(SSFP)Omnibus Provisional II”的美国临时专利申请;以及2016年7月22日提交且指定序列号为62/365,969的题为“Framework and Techniques for Pools ofConfigurable Computing Resources”的美国临时专利申请,所有这些申请由此通过引用整体并入。
技术领域
本文描述的示例总体上涉及数据中心,并且特别地涉及用于耦合数据中心中的物理存储资源的存储托架(sled)。
背景技术
联网方面的进步使得可配置计算资源的池能够增长。可配置计算资源的池可以由包括分解物理资源的物理基础设施形成,例如,如在大型数据中心中发现的。物理基础设施可以包括具有处理器、存储器、存储装置、联网、电力、冷却等的多个资源。这些数据中心的管理实体可以聚合一系列资源以形成服务器和/或计算主机。随后可以分配这些主机以执行和/或托管系统SW(例如,OS、VM、容器、应用等)。数据中心中的数据存储量经常以指数级别持续增加,因此要求数据中心中的物理存储资源。本公开涉及这样的物理存储资源。
附图说明
图1示出了第一示例数据中心。
图2示出了数据中心的第一示例机架。
图3示出了第二示例数据中心。
图4示出了第三示例数据中心。
图5示出了数据中心连接方案。
图6示出了第二示例机架。
图7示出了第三示例机架。
图8示出了第四示例机架。
图9示出了第一示例托架。
图10示出了第二示例托架。
图11示出了第三示例托架。
图12A-12C示出了第四示例托架的透视图。
图13A-13B示出了第五示例托架和对应的透视图。
图14示出了第四示例数据中心。
图15示出了示例计算平台。
具体实施方式
数据中心通常可以由大量机架组成,这些机架可以包含多种类型的硬件或可配置资源(例如,处理单元、存储器、存储装置、加速器、联网、风扇/冷却模块、电力单元等)。在数据中心中部署的该类型的硬件或可配置资源也可以称为物理资源或分解元件。应理解,数据中心内的物理资源的大小和数量可以很大,例如,数十万物理资源的数量级。此外,可以将这些物理资源池化以形成用于大量计算任务和各种计算任务的虚拟计算平台。
这些物理资源经常布置在数据中心内的机架中。本公开提供了布置为接纳多个托架的机架,其中每个托架可以存放多个物理资源。特别地,描述了将多个物理存储资源(例如,固态驱动器(SSD)等)耦合到数据中心的托架。提供了托架可以使用诸如机器人化耦合或操纵之类的自动化技术耦合到机架。托架可以容纳多个存储设备(例如,SSD等),并且可以将存储设备耦合到数据中心中提供的光结构。此外,托架可以适应存储设备的自动化移除和/或安装。更具体地,如下面将更详细描述的,托架可以适应存储设备的机器人化安装和/或移除。
托架可以包括双模光网络接口,其可操作以耦合到托架上的存储设备(例如,基于电信令)并且耦合到数据中心中的光结构(例如,基于光信令)。下面将更详细地描述本公开的这个特征和其他特征。
现在参考附图,其中相同的附图标记始终用于指代相同的元素。在以下描述中,出于解释的目的,阐述了许多具体细节以便提供对其的透彻理解。然而,显而易见的是,可以在没有这些具体细节的情况下实践新颖的实施例。在其他实例中,已知的结构和设备以框图形式示出,以便促进对其的描述。意图是提供详尽描述,使得充分描述权利要求范围内的所有修改、等同物和替代物。
另外,可以引用变量,例如,“a”、“b”、“c”,其用于表示其中可以实现多于一个组件的组件。重要的是注意到,不一定需要多个组件,并且进一步地,在实现多个组件的情况下,这些组件不一定相同。相反,为了方便和清楚地呈现,使用变量来引用附图中的组件。
图1示出了根据各种实施例的数据中心100的概念性概述,该数据中心100通常可以表示其中/对其而言可以实现本文中描述的一种或多种技术的数据中心或其他类型的计算网络。如该图中所示,数据中心100通常可以包含多个机架,其中的每个机架可以存放包括相应的一组物理资源的计算设备。在该图中描绘的特定非限制性示例中,数据中心100包含四个机架102A至102D,其存放包括相应的各组物理资源(PCR)105A至105D的计算设备。根据该示例,数据中心100的共同的一组物理资源106包括分布在机架102A至102D之中的各组物理资源105A至105D。物理资源106可以包括多种类型的资源,例如,处理器、协处理器、加速器、现场可编程门阵列(FPGA)、存储器和存储装置。实施例不限于这些示例。
说明性数据中心100在许多方面不同于典型的数据中心。例如,在说明性实施例中,其上放置诸如CPU、存储器和其他组件之类的组件的电路板(“托架”)被设计用于提高的热性能。特别地,在说明性实施例中,托架比典型的板浅。换言之,托架从前到后更短,冷却风扇位于其中。这减少了空气必须穿过板上的组件的路径的长度。此外,托架上的组件与典型的电路板相比间隔得更远,并且这些组件被布置为减少或消除遮蔽(即,一个组件在另一组件的空气流动路径中)。在说明性实施例中,诸如处理器之类的处理组件位于托架的顶侧,而诸如DIMM之类的附近存储器位于托架的底侧。由于该设计提供的增强的空气流动,组件可以以比典型系统高的频率和功率水平操作,从而提高性能。此外,托架被配置为与每个机架102A、102B、102C、102D中的电力和数据通信电缆盲配合,增强了机架被快速移除、升级、重新安装和/或更换的能力。类似地,位于托架上的个体组件(例如,处理器、加速器、存储器和数据存储驱动器)被配置为由于其彼此间隔增加而容易升级。在说明性实施例中,组件另外包括硬件证实特征以证明其真实性。
此外,在说明性实施例中,数据中心100利用支持多个其他网络架构(包括以太网和Omni-Path)的单个网络架构(“结构”)。在说明性实施例中,托架经由光纤耦合到交换机,光纤相比典型的双绞线布线(例如,类别5、类别5e、类别6等)提供更高的带宽和更低的延迟。由于高带宽、低延迟互连和网络架构,数据中心100可以在使用中将物理地分解的资源(例如,存储器、加速器(例如,图形加速器、FPGA、ASIC等)以及数据存储驱动器)池化,并且基于需要将其提供给计算资源(例如,处理器),使得计算资源能够访问池化的资源,就好像这些资源在本地一样。说明性数据中心100另外接收各种资源的使用情况信息,基于过去的资源使用情况来预测不同类型的工作负荷的资源使用情况,并且基于该信息来动态地重新分配资源。
数据中心100的机架102A、102B、102C、102D可以包括促进将各种类型的维护任务自动化的物理设计特征。例如,数据中心100可以使用这样的机架来实现:这些机架被设计为是机器人化地访问的并且接受和存放可机器人化地操纵的资源托架。此外,在说明性实施例中,机架102A、102B、102C、102D包括集成电源,其接收比对电源而言典型的电压更大的电压。增加的电压使得电源能够向每个托架上的组件提供附加的电力,使得组件能够以高于典型频率的频率进行操作。图2示出了数据中心100的机架202的示例性逻辑配置。如该图中所示,机架202通常可以存放多个托架,其中的每个托架可以包括相应的一组物理资源。在图2中描绘的特定非限制性示例中,机架202存放包括相应的各组物理资源205-1至205-4的托架204-1至204-4,这些物理资源中的每个构成机架202中包括的共同的一组物理资源206的一部分。关于图1,如果机架202表示例如机架102A,则物理资源206可以对应于机架102A中包括的物理资源105A。在该示例的上下文中,物理资源105A因此可以由相应的各组物理资源组成,包括包含在机架202的托架204-1至204-4中的物理存储装置资源205-1、物理加速器资源205-2、物理存储器资源205-3和物理计算资源205-4。实施例不限于此示例。每个托架可以包含各种类型的物理资源(例如,计算、存储器、加速器、存储装置)中的每种类型的物理资源的池。通过使可机器人化地访问和可机器人化地操纵的托架包括分解的资源,每种类型的资源能够彼此独立地并且以其自己的优化刷新速率进行升级。
图3示出了根据各种实施例的数据中心300的示例,该数据中心300通常可以表示其中/对其而言可以实现本文中描述的一种或多种技术的数据中心。在图3中描绘的特定非限制性示例中,数据中心300包括机架302-1至302-32。在各种实施例中,数据中心300的机架可以以限定和/或容纳各种访问路径的方式来布置。例如,如图3所示,数据中心300的机架可以以限定和/或容纳访问路径311A、311B、311C和311D的方式来布置。在一些实施例中,这种访问路径的存在通常可以使得自动化维护设备(例如,机器人化维护设备)能够物理地访问存放在数据中心300的各种机架中的计算设备并执行自动化维护任务(例如,替换故障的托架,升级托架)。在各种实施例中,可以选择访问路径311A、311B、311C和311D的尺寸,机架302-1至302-32的尺寸和/或数据中心300的物理布局的一个或多个其他方面,以促进这种自动化操作。实施例不限于此上下文。
图4示出了根据各种实施例的数据中心400的示例,该数据中心400通常可以表示其中/对其而言可以实现本文中描述的一种或多种技术的数据中心。如该图中所示,数据中心400可以以光结构412为特征。光结构412通常可以包括光信令介质(例如,光布线)和光交换基础设施的组合,数据中心400中的任何特定托架可以经由其向数据中心400中的其他托架中的每个托架发送信号(并且从数据中心400中的其他托架中的每个托架接收信号)。光结构412向任何给定托架提供的信令连接可以包括到同一机架中的其他托架和其他机架中的托架的连接。在该图中描绘的特定非限制性示例中,数据中心400包括四个机架402A至402D。机架402A至402D存放相应的托架对404A-1和404A-2、404B-1和404B-2、404C-1和404C-2以及404D-1和404D-2。因此,在该示例中,数据中心400包括总共八个托架。经由光结构412,每个这样的托架可以具有与数据中心400中的七个其他托架中的每个托架的信令连接。例如,经由光结构412,机架402A中的托架404A-1可以具有与机架402A中的托架404A-2以及分布在数据中心400的其他机架402B、402C和402D之中的六个其他托架404B-1、404B-2、404C-1、404C-2、404D-1和404D-2的信令连接。实施例不限于此示例。
图5示出了连接方案500的概述,该连接方案500通常可以表示在一些实施例中可以在数据中心(例如,图1、图3和图4的示例数据中心100、300和400中的任何一个)的各种托架之中建立的链路层连接。可以使用以双模光交换基础设施514为特征的光结构来实现连接方案500。双模光交换基础设施514通常可以包括能够根据多个链路层协议经由相同统一的一组光信令介质接收通信并且适当地交换这种通信的交换基础设施。在各种实施例中,可以使用一个或多个双模光交换机515来实现双模光交换基础设施514。在各种实施例中,双模光交换机515通常可以包括高基数交换机。在一些实施例中,双模光交换机515可以包括多层交换机,例如,四层交换机。在各种实施例中,双模光交换机515可以以集成硅光子为特征,与常规交换设备相比,使得双模光交换机515能够以显著减少的延迟交换通信。在一些实施例中,双模光交换机515可以以叶-脊架构构成叶交换机530,另外包括一个或多个双模光脊交换机520。
在各种实施例中,双模光交换机能够经由光结构的光信令介质接收携带互联网协议(IP分组)的以太网协议通信和根据第二、高性能计算(HPC)链路层协议(例如,Intel的Omni-Path架构、Infiniband)的通信两者。如图5关于具有与光结构的光信令连接的任何特定托架对504A和504B所反映的,连接方案500因此可以经由以太网链路和HPC链路两者对链路层连接提供支持。因此,单个高带宽、低延迟交换结构可以支持以太网通信和HPC通信两者。实施例不限于此示例。然而,值得注意的是,双模光交换机可以在单个托架(例如,根据本公开的实施例的存储托架等)内提供单独的故障域。因此,可以与机架级相反而在托架级跨故障域写入信息,以在托架级提供数据丢失、损坏或故障缓解。
图6示出了根据一些实施例的机架架构600的总体概述,该机架架构600可以表示图1至图4中描绘的机架中的任何特定的一个机架的架构。如该图所反映的,机架架构600通常可以以多个托架空间为特征,托架可以插入托架空间中,托架空间中的每个可以是经由机架访问区域601可机器人化地访问的。在图6中描绘的特定非限制性示例中,机架架构600以五个托架空间603-1至603-5为特征。托架空间603-1至603-5以相应的多用途连接器模块(MPCM)616-1至616-5为特征。
图7示出了机架架构700的示例,该机架架构700可以表示可以被实现以便对以扩展能力为特征的托架(例如,图14的托架1404和图15的托架1504)提供支持的机架架构。在该图中描绘的特定非限制性示例中,机架架构700包括七个托架空间703-1至703-7,其以相应的MPCM 716-1至716-7为特征。托架空间703-1至703-7包括相应的主区域703-1A至703-7A和相应的扩展区域703-1B至703-7B。关于每个这样的托架空间,当对应的MPCM与插入的托架的配对MPCM耦合时,主区域通常可以构成托架空间中的物理地容纳插入的托架的区域。在插入的托架配置有扩展模块(例如,图14的扩展托架1418和图15的扩展托架1518)的情况下,扩展区域通常可以构成托架空间中的可以物理地容纳这种模块的区域。
图8示出了根据一些实施例的机架802的示例,该机架802可以表示根据图7的机架架构700实现的机架。在图8中描绘的特定非限制性示例中,机架802以七个托架空间803-1至803-7为特征,其包括相应的主区域803-1A至803-7A和相应的扩展区域803-1B至803-7B。在各种实施例中,可以使用空气冷却系统来实现机架802中的温度控制。例如,如该图中所反映的,机架802可以以多个风扇819为特征,多个风扇819通常布置为在各种托架空间803-1至803-7内提供空气冷却。在一些实施例中,托架空间的高度大于常规的“1U”服务器高度。在这样的实施例中,与常规机架配置中使用的风扇相比,风扇819通常可以包括相对慢的大直径冷却风扇。相对于以较高速度运行的较小直径的冷却风扇,以较低速度运行较大直径的冷却风扇可以增加风扇寿命,同时仍提供相同的冷却量。托架比常规的机架尺寸物理地更浅。此外,在每个托架上布置组件以减少热遮蔽(即,没有沿空气流动方向串联地布置)。因此,更宽、更浅的托架允许提高设备性能,因为由于改进的冷却,设备可以在更高的热封套(例如,250W)下操作(即,没有热遮蔽,设备之间有更多空间,对于较大的散热器有更多余地等)。
MPCM 816-1至816-7可以被配置为向插入的托架提供对由相应的电力模块820-1至820-7源送的电力的访问,其中的每个电力模块可以从外部电源821汲取电力。在各种实施例中,外部电源821可以向机架802输送交流(AC)电力,并且电力模块820-1至820-7可以被配置为将这种AC电力转换为直流(DC)电力以供源送至插入的托架。在一些实施例中,例如,电力模块820-1至820-7可以被配置为将277伏AC电力转换为12伏DC电力,以经由相应的MPCM 816-1至816-7提供给插入的托架。实施例不限于此示例。
MPCM 816-1至816-7还可以布置为向插入的托架提供与双模光交换基础设施814的光信令连接,双模光交换基础设施814可以与图5的双模光交换基础设施514相同或相似。在各种实施例中,包含在MPCM 816-1至816-7中的光连接器可以被设计为与插入的托架的MPCM中包含的配对光连接器耦合,以经由相应长度的通过光布线822-1至822-7向这种托架提供与双模光交换基础设施814的光信令连接。在一些实施例中,每个这种长度的光布线可以从其对应的MPCM延伸到在机架802的托架空间外部的光互连织机823。在各种实施例中,光互连织机823可以布置为穿过机架802的支撑柱或其他类型的负载承载元件。实施例不限于此上下文。由于插入的托架经由MPCM连接到光交换基础设施,因此可以节省典型地耗费在手动配置机架布线以容纳新插入的托架方面的资源。
图9示出了托架904的示例,该托架904可以表示设计用于与根据一些实施例的机架(例如,根据机架架构600或700或者机架802的机架)结合使用的托架。托架904可以以MPCM 916为特征,MPCM 916包括光连接器916A和电力连接器916B,并且被设计为与将MPCM916插入到托架空间中相结合而与托架空间的配对MPCM耦合。将MPCM 916与这样的配对MPCM耦合可以使电力连接器916与配对MPCM中包括的电力连接器耦合。这通常可以使得托架904的物理资源905能够经由电力连接器916和电力传输介质924从外部源来源送电力,电力传输介质924将电力连接器916导通地耦合到物理资源905。特别地,如本文描述的,本公开提供了用于存储资源的托架。因此,物理资源905是物理存储资源905。
物理存储资源905可以包括可移除存储设备阵列933和存储资源处理电路935。在一些示例中,可移除存储设备阵列933可以包括多个存储设备,例如,SSD、非易失性存储器模块等。应注意,如本文所使用的,可移除存储设备阵列可以包括存储设备的阵列,其中阵列中的每个存储设备可彼此独立地移除。通常,可移除存储设备阵列933可以具有任何容量。在一些示例中,可移除存储设备阵列933可以具有0.5和2拍字节的存储容量。更具体地,对于一些非限制性示例,可移除存储设备阵列933可以容纳2个到24个之间的可移除设备。在特定示例中,托架可以容纳4个可移除驱动器。在另一特定示例中,托架可以容纳16个可移除驱动器。仅出于说明目的,假设托架可以容纳16个可移除驱动器。在该示例中,可移除设备中的每个可移除设备提供32太字节的容量,托架904将提供0.5拍字节的容量。然而,在可移除设备中的每个可移除设备提供128太字节的容量的情况下,托架904将提供2拍字节的容量。
托架904还可以包括双模光网络接口电路926。双模光网络接口电路926通常可以包括能够根据图8的双模光交换基础设施814支持的多个链路层协议中的每个链路层协议通过光信令介质进行通信的电路。在一些实施例中,双模光网络接口电路926能够进行以太网协议通信和根据第二、高性能协议的通信两者。在各种实施例中,双模光网络接口电路926可以包括一个或多个光收发器模块927,其中的每个光收发器模块927能够通过一个或多个光信道中的每个光信道发送和接收光信号。因此,双模光网络接口电路926可以在托架级提供故障域粒度(例如,参见图11)。实施例不限于此上下文。
将MPCM 916与给定机架中的托架空间的配对MPCM耦合可以使光连接器916A与配对MPCM中包括的光连接器耦合。这通常可以经由一组光信道925中的每个光信道925在托架的光布线与双模光网络接口电路926之间建立光连接。对于一些示例,光信道925包括4个光纤信道。对于一些示例,光信道中的每个光信道可以提供20千兆字节/秒(GB/s)到80GB/s之间的带宽。对于具体示例,光信道中的每个光信道可以提供50GB/s的带宽。作为另一示例,光信道中的每个光信道可以提供200GB/s的带宽。双模光网络接口电路926可以经由电信令介质928与托架904的物理资源905通信。除了托架的尺寸和组件在托架上的布置用于提供改进的冷却并且使得能够在相对较高的热封套(例如,250W)下操作之外,如上面参考图8描述的,在一些实施例中,托架可以包括一个或多个附加特征以促进空气冷却,例如,布置为消散由物理资源905产生的热量的热管和/或散热器。值得注意的是,尽管图9中所描绘的示例托架904不以扩展连接器为特征,但是根据一些实施例以托架904的设计元素为特征的任何给定托架也可以以扩展连接器为特征。实施例不限于此上下文。
存储资源处理电路935可以包括存储器控制器,其被配置为协调对可移除存储驱动器阵列933的设备的访问(例如,写入、读取等)。在一些示例中,存储资源处理电路935可以提供用于物理存储资源905的缓存、条带化、池化、压缩,数据复制、精简供应、数据克隆或其他数据管理技术。在一些示例中,可移除存储设备阵列933的个体设备可以经由各种互连中的任何一种耦合到存储资源处理电路935,例如,快速外围组件互连(PCIe)。特别地,耦合可移除存储设备阵列933和存储资源处理电路935的电信令介质928可以是4通道PCIe4总线,以提供符合快速非易失性存储器(NVMe)的逻辑设备互连能力。例如,在可移除存储设备阵列933容纳16个存储设备的情况下,耦合可移除存储设备阵列933的电信令介质928可以提供16个PCI Gen4x4连接。作为另一示例,在可移除存储设备阵列933可以容纳4个存储设备的情况下,耦合可移除存储设备阵列933的电信令介质928可以提供4个PCI4x4连接。
此外,应注意,本文详述的技术和连接方案可以应用于所有物理存储资源505,包括可移除存储驱动器阵列533和存储器阵列537。
对于一些示例,耦合存储资源处理电路935和双模光网络接口电路926的电信令介质928可以包括PCIe4或其他接口系统,例如,专有接口。
对于一些示例,物理存储资源905可以包括耦合到可移除存储设备阵列933的存储器阵列。图10示出了托架1004的示例,该托架1004可以表示设计用于与根据一些实施例的机架(例如,根据机架架构600或700或者机架802的机架)结合使用的托架。托架1004可以以与关于图9描述的托架904类似的组件为特征。另外,托架1004的物理存储资源1005可以包括存储器阵列937。在一些示例中,存储器阵列937可以包括易失性和/或非易失性存储器。例如,存储器阵列可以包括经由电信令介质928耦合到存储资源处理电路的多个双列直插式存储器模块(DIMM)。在一些示例中,存储器阵列937可以包括RAM、DRAM、DDRAM、同步DRAM、NAND存储器、NOR存储器、3维交叉点存储器(例如,的3D XPoint存储器等)、铁电存储器、硅-氧化物-氮化物-氧化物-硅(SONOS)存储器、诸如铁电聚合物存储器之类的聚合物存储器、铁电晶体管随机存取存储器(FeTRAM或FeRAM)、纳米线、相变存储器、磁阻随机存取存储器(MRAM)、自旋转移力矩MRAM(STT-MRAM)存储器等。
对于一些示例,可移除存储驱动器阵列933和存储器阵列937可以分成可移除存储驱动器阵列和存储器阵列的子集或组。在这样的示例中,可以提供多个存储资源处理电路935。图11描绘了这样的示例托架。更具体地转到图11,描绘了托架1104。通常,托架1104可以包括与图10的托架1004类似的组件。然而,可移除存储驱动器阵列和存储器阵列被分成两个子集。特别地,托架1104包括物理存储资源1105,其包括可移除存储驱动器阵列子集1133-1至1133-2、存储资源处理电路1135-1至1135-2以及存储器阵列子集1137-1至1137-2。如所描绘的,存储资源处理电路1135-1可操作地耦合到可移除存储驱动器阵列子集1133-1和存储器阵列子集1137-1,而存储资源处理电路1135-2可操作地耦合到可移除存储驱动器阵列子集1133-2和存储器阵列子集1137-2。
存储资源处理电路1135-1和1135-2经由电信令介质1128可操作地耦合到可移除存储驱动器阵列子集和存储器阵列子集。电信令介质1138可以是任何信令介质,例如,PCIe4总线,用于提供符合NVMe标准的逻辑设备互连功能。
存储资源处理电路1135-1和1135-2进一步经由电信令介质1128可操作地耦合到双模光网络接口电路1126。应注意,与将存储资源处理电路1135-1和1135-2耦合到可移除存储驱动器阵列子集和存储器阵列子集的电信令介质1128相比,将双模光网络接口电路耦合到存储资源处理电路1135-1和1135-2的该电信令介质1128可以是不同类型、配置的和/或支持不同的信令标准。实例不限于此上下文。
此外,托架1104可以以双模光网络接口电路1126为特征,双模光网络接口电路1126包括经由光信道1125耦合到MPCM 1116的光连接器1116A的(多个)光收发器模块1127。另外,托架1104可以以MPCM 1116的电力连接器1116B为特征,用于经由电力传输介质1124向托架1104的组件提供电力。
在一些实施例中,物理资源1105可以分成多个故障域。在该说明性示例中,托架1104包括2个故障域1107-1和1107-2。特别地:故障域1107-1包括存储资源处理电路1135-1、可移除存储驱动器阵列子集1133-1和存储器阵列子集1137-1;而故障域1107-2包括存储资源处理电路1135-2、可移除存储驱动器阵列子集1133-2和存储器阵列子集1137-2。因此,在操作期间,故障域可以在托架级向彼此“故障转移”,以提供数据丢失的缓解。
图12A、图12B和图12C示出了托架1204的透视图,该托架1204可以表示设计用于与根据一些实施例的机架(例如,根据机架结构600或700或者机架802的机架)结合使用的托架。特别地,这些图描绘了包括物理存储资源的托架。托架被配置为自动化地和/或机器人化地安装到数据中心的机架。作为非限制性示例,所描绘的托架可以实现为图2的数据中心200中的机架202的托架204-1,如所描绘的,托架204-1包括物理存储资源205-1。应注意,参考图11中所描绘的托架1104来描述托架1204。然而,这仅出于方便和清楚的目的,而不是限制性的。
更具体地转到图12A,托架1204可以包括框架1260,框架1260在相对端部处具有安装凸缘1261。例如,安装凸缘1261被描绘为在框架1260的横向端部处。在一些示例中,框架1260可以包括两个部分或部位,其可以配合在一起(例如,如所描绘的)以形成框架1260。例如,该图示出了框架上部1260U和框架下部1260L。
安装凸缘1261可以布置为配合到机架的安装支架1263中。特别地,安装凸缘1261布置为促进从机架自动化安装和/或移除。更具体地,可以对安装凸缘1261确定大小、确定尺寸和/或整形,以自动化地插入到机架安装支架1263中和从机架安装支架1263移除。可以对安装凸缘1261和机架安装支架1263确定大小、确定尺寸和/或整,以对齐托架空间(例如,图6中所描绘的托架空间604等)内的托架1204并且将托架1204放置为与托架空间内的对应MPCM“盲”配合。
框架1260包括可移除存储设备托盘1265,其包括多个可移除存储设备安装槽1267。通常,可移除存储设备托盘1265包括至少一个可移除存储设备安装槽1267,用于将每个可移除存储设备插入可移除存储设备托盘1265。例如,该图的可移除存储设备托盘1265被描绘为包括存储设备1270。例如,描绘了存储设备1270-1至1270-N。可移除存储设备1270-1至1270-N中的每个被描绘为插入对应的可移除存储设备安装槽1267中。在一些示例中,可移除存储设备安装槽1267可以形成在可移除存储设备安装托盘1265中,以保持存储设备1270-1至1270-N处于垂直布置,跨可移除存储设备托盘1265横向设置。可移除存储设备安装槽1267可以间隔开一定距离以促进自动化(例如,机器人化等)安装和/或移除个体存储设备1270。例如,可移除存储设备安装槽1267可以间隔开一定距离,以促进机器人化抓取装置抓住存储设备1270中的单个存储设备。
注意,可移除存储设备托盘1265可以包括任何数量的可移除存储设备安装槽1267,以容纳任何数量的存储设备1270。然而,在一些示例中,可移除存储设备托盘1265可以包括16对可移除存储设备安装槽1267,以容纳16个存储设备1270。在另一示例中,可移除存储设备托盘1265可以包括4对可移除存储设备安装槽1267,以容纳4个存储设备1270。所描绘的存储设备1270-1至1270-N可以形成可移除存储设备阵列1133。注意,可移除存储驱动器阵列1133可以包括各种非易失性存储器存储设备中的任何一种,例如,SSD、非易失性DIMM等。实例不限于此上下文。
托架1204包括耦合到框架1261的基板1269。在基板1269上,可以安装托架1204的多个组件。更具体地转到图12B,描绘了没有框架1261的托架1204,以更全面地示出基板1269以及组件在基板1269上的放置和/或布置。此外,可移除存储设备托盘1265以带有虚线边框的块形式示出。
托架1204可以包括MPCM 1116。特别地,托架1204可以包括在托架1204后部设置在基板1269上的MPCM 1116,在与托架1204插入其中的托架空间的对应MPCM(例如,图6的MPCM616-1等)一起安装的位置。托架1204可以包括经由光信道1125耦合到MPCM 1116的双模光网络接口电路1126。托架1204还可以包括多个存储资源处理电路1135。例如,该图示出了包括耦合到双模光网络接口电路1126的存储资源处理电路1135-1和存储资源处理电路1135-2的托架1204。
托架1204还包括多个可移除存储设备MPCM 1271。例如,可以针对可移除存储设备托盘1265被布置为容纳的每个存储设备提供耦合到存储资源处理电路1135中的一个的可移除存储设备MPCM 1271。例如,托架1204被描绘为包括耦合到存储资源处理电路1135-1的可移除存储设备MPCM 1271-1至1271-M,以及耦合到存储资源处理电路1135-2的可移除存储设备MPCM 1271-(M+1)至1271-N。可移除存储设备MPCM 1271-1至1271-N可以被放置为:当存储设备1270-1至1270-N被安置在可移除存储设备托盘1265中时,特别是安置在可移除存储设备安装槽1267中时,促进存储设备1270-1至1270-N的连接接口与电信令介质928的自动化配合和机械耦合。例如,更具体地转到图12C,托架1204被描绘为其中多个存储设备1270从可移除存储设备托盘1265移除。如可以看出的,一对可移除存储设备安装槽1267与对应的可移除存储设备MPCM 1271对齐,以促进存储设备1271在其插入(例如,经由机器人化插入等)到可移除存储设备安装槽1267中时的自动化机械耦合。在一些示例中,可移除存储设备安装槽1267中的每对中的一个可移除存储设备安装槽1267形成在框架下部1260L中和/或设置在框架下部1260L上,而可移除存储设备安装槽1267中的每对中的另一个可移除存储设备安装槽1267形成在框架上部1260U中和/或布置在框架上部1260U上,以垂直地保持多个存储设备中的每个存储设备。
在一些示例中,可移除存储设备安装槽1267中的每对与可移除存储设备安装槽1267中的另一对间隔开一定距离(例如,距离1267')。在说明性示例中,距离1267'可以足够大以容纳围绕存储设备1270中的个体存储设备1270插入的机器人化装置(例如,手、抓爪、爪、夹钳等)。注意,精确尺寸可以基于实现方式而变化,然而,距离1267'可以足够大以促进机器人化插入和移除多个存储设备,甚至在个体规模上也是如此。
如上面指出的,对于一些示例,包括物理存储资源的托架(例如,图10的托架1004、图11的托架1104等)可以包括存储器阵列。对于一些示例,存储器阵列1137可以设置在托架1204的基板1269上。例如,基板1269可以包括多个插座(例如,DIMM插座等)以接受耦合到存储资源处理电路1135的存储器模块(例如,DIMM等)。在一些示例中,存储器阵列1137可以经由扩展托架耦合到托架。图13A示出了托架1304的示例,托架1304可以表示这种类型的托架。如该图所示,托架1304可以包括一组物理资源1305以及MPCM 1316,MPCM 1316被设计用于当托架1304插入托架空间(例如,图8的托架空间803-1至803-7中的任何一个)时与配对MPCM耦合。托架1304还可以以双模光网络接口电路1326为特征,双模光网络接口电路1326用于将托架1304的组件耦合到数据中心的光结构。
托架1304还可以以扩展连接器1317为特征。扩展连接器1317通常可以包括插座、槽或能够接受一种或多种类型的扩展模块(例如,扩展托架1318)的其他类型的连接元件。通过与扩展托架1318上的配对连接器耦合,扩展连接器1317可以向物理资源1305提供对驻留在扩展托架1318上的补充物理资源1305B的访问。
例如,物理资源1305可以包括物理存储资源,例如,可移除存储驱动器阵列1333和存储资源处理电路1335。可以经由扩展托架1318上的补充物理资源1305B针对托架1304提供存储器阵列1337。
更具体地转到图13B,描绘了图13A的示例托架1304的透视图。在该说明性示例中,具有安装凸缘(未示出)的框架1360设置在机架1302中。具体地,框架1360设置在机架安装支架1363中。托架1304包括耦合到框架1360的基板1369。在基板1369上安装MPCM 1316、双模光接口电路1326、存储资源处理电路1335-1和1335-2以及可移除存储设备MPCM(未示出)。
图14示出了根据各种实施例的数据中心1400的示例,该数据中心1400通常可以表示其中/对其而言可以实现本文中描述的一种或多种技术的数据中心。如该图所反映的,可以实现物理基础设施管理框架1450A以促进管理数据中心1400的物理基础设施1400A。在各种实施例中,物理基础设施管理框架1450A的一个功能可以是管理数据中心1400内的自动化维护功能,例如,使用机器人化的维护设备来对物理基础设施1400A内的计算设备进行检修。在一些实施例中,物理基础设施1400A可以以高级遥测系统为特征,该高级遥测系统执行足够鲁棒以支持对物理基础设施1400A的远程自动化管理的遥测报告。在各种实施例中,由这种高级遥测系统提供的遥测信息可以支持诸如故障预测/预防能力和容量规划能力之类的特征。在一些实施例中,物理基础设施管理框架1450A还可以被配置为使用硬件证实技术来管理对物理基础设施组件的认证。例如,机器人可以在安装之前通过分析从与要安装的每个组件相关联的射频识别(RFID)标签收集的信息来验证组件的真实性。实施例不限于此上下文。
如该图中所示,数据中心1400的物理基础设施1400A可以包括光结构1412,其可以包括双模光交换基础设施1414。光结构1412和双模光交换基础设施1414可以分别与图4的光结构412和图5的双模光交换基础设施514相同或相似,并且可以在数据中心1400的托架之中提供高带宽、低延迟、多协议连接。如上面参考图1讨论的,在各种实施例中,这种连接的可用性可以使得分解和动态地池化诸如加速器、存储器和存储装置之类的资源可行。在一些实施例中,例如,一个或多个池化加速器托架1430可以包括在数据中心1400的物理基础设施1400A之中,其中的每个池化加速器托架1430可以包括经由光结构1412和双模光交换基础设施1414而可供其他托架全局访问的、加速器资源(例如,协处理器和/或FPGA)的池。
在另一示例中,在各种实施例中,一个或多个池化存储托架1432可以包括在数据中心1400的物理基础设施1400A之中,其中的每个池化存储托架1432可以包括经由光结构1412和双模光交换基础设施1414而可供其他托架全局访问的、存储资源的池。在一些实施例中,这种池化存储托架1432可以包括诸如固态驱动器(SSD)之类的固态存储设备的池。在各种实施例中,一个或多个高性能处理托架1434可以包括在数据中心1400的物理基础设施1400A之中。在一些实施例中,高性能处理托架1434可以包括高性能处理器的池,以及增强空气冷却以产生高达250W或更高的较高热封套的冷却特征。在各种实施例中,任何给定的高性能处理托架1434可以以扩展连接器1417为特征,该扩展连接器1417可以接受远存储器扩展托架,使得该高性能处理托架1434本地可用的远存储器从包括在该托架上的处理器和附近存储器分解。在一些实施例中,这样的高性能处理托架1434可以使用包括低延迟SSD存储装置的扩展托架而配置有远存储器。光基础设施允许一个托架上的计算资源利用远程加速器/FPGA、存储器和/或SSD资源,这些资源在位于数据中心中的相同机架或任何其他机架上的托架上分解。远程资源可以位于上面参考图5描述的脊-叶网络架构中的一次交换机跳跃外或两次交换机跳跃外。实施例不限于此上下文。
在各种实施例中,可以将一个或多个抽象层应用于物理基础设施1400A的物理资源,以便定义虚拟基础设施,例如,软件定义的基础设施1400B。在一些实施例中,可以分配软件定义的基础设施1400B的虚拟计算资源1436以支持云服务1440的提供。在各种实施例中,可以将特定的各组虚拟计算资源1436分组以供以SDI服务1438的形式提供给云服务1440。云服务1440的示例可以包括但不限于软件即服务(SaaS)服务1442、平台即服务(PaaS)服务1444以及基础设施即服务(IaaS)服务1446。
在一些实施例中,可以使用虚拟基础设施管理框架1450B来进行对软件定义的基础设施1400B的管理。在各种实施例中,虚拟基础设施管理框架1450B可以被设计为与管理将虚拟计算资源1436和/或SDI服务1438分配给云服务1440相结合地实现工作负载指纹识别技术和/或机器学习技术。在一些实施例中,虚拟基础设施管理框架1450B可以与执行这样的资源分配相结合地使用/咨询遥测数据。在各种实施例中,可以实现应用/服务管理框架1450C以便为云服务1440提供QoS管理能力。实施例不限于此上下文。
图15示出了示例计算平台3000。在一些示例中,如该图所示,计算平台3000可以包括处理组件3040、其他平台组件3050或通信接口3060中的任何一个。根据一些示例,计算平台3000可以托管用于数据中心(例如,本文描述的数据中心)的物理存储资源。计算平台3000可以是单个物理服务器或组合逻辑服务器,该组合逻辑服务器包括来自可配置物理资源的池中的物理资源的组合。
根据一些示例,处理组件3040可以包括各种硬件元件、软件元件或两者的组合。硬件元件的示例可以包括设备、逻辑器件、组件、处理器、微处理器、电路、处理器电路、电路元件(例如,晶体管、电阻器、电容器、电感器等)、集成电路、专用集成电路(ASIC)、可编程逻辑器件(PLD)、数字信号处理器(DSP)、现场可编程门阵列(FPGA)、存储器单元、逻辑门、寄存器、半导体器件、芯片、微芯片、芯片组等。软件元件的示例可以包括软件组件、程序、应用、计算机程序、应用程序、设备驱动程序、系统程序、软件开发程序、机器程序、操作系统软件、中间件、固件、软件模块、例程、子例程、函数、方法、过程、软件接口、应用程序接口(API)、指令集、计算代码、计算机代码、代码段、计算机代码段、字、值、符号或其任何组合。确定是否使用硬件元件和/或软件元件实现示例可以根据任何数量的因素而变化,例如,期望的计算速率、功率水平、热容差、处理周期预算、输入数据速率、输出数据速率、存储器资源、数据总线速度以及其他设计或性能约束,如给定示例期望的。
在一些示例中,其他平台组件3050可以包括常见的计算元件,例如,一个或多个处理器、多核心处理器、协处理器、存储器单元、芯片组、控制器、外围设备、接口、振荡器、定时设备、视频卡、音频卡、多媒体输入/输出(I/O)组件(例如,数字显示器)、电源等。存储器单元的示例可以包括但不限于以一个或多个较高速存储器单元形式的各种类型的计算机可读和机器可读存储介质,例如,只读存储器(ROM)、随机存取存储器(RAM)、动态RAM(DRAM)、双倍数据速率DRAM(DDRAM)、同步DRAM(SDRAM)、静态RAM(SRAM)、可编程ROM(PROM)、可擦除可编程ROM(EPROM)、电可擦除可编程ROM(EEPROM)、闪速存储器、诸如铁电聚合物存储器之类的聚合物存储器、双向存储器、相变或铁电存储器、硅-氧化物-氮化物-氧化物-硅(SONOS)存储器、磁卡或光卡、诸如独立磁盘冗余阵列(RAID)驱动器之类的设备的阵列、固态存储器设备(例如,USB存储器)、固态驱动器(SSD)以及适于存储信息的任何其他类型的存储介质。
在一些示例中,其他平台组件3050可以包括物理存储资源205-1、905、1005、1205和/或1205B。
在一些示例中,通信接口3060可以包括用于支持通信接口的逻辑和/或特征。对于这些示例,通信接口3060可以包括一个或多个通信接口,其根据各种通信协议或标准进行操作以通过直接或网络通信链路进行通信。直接通信可以经由使用在一个或多个行业标准(包括后代和变体)中描述的通信协议或标准来发生,例如,与PCIe规范相关联的那些通信协议或标准。网络通信可以经由使用诸如在IEEE颁布的一个或多个以太网标准中描述的通信协议或标准之类的通信协议或标准来发生。例如,一种这样的以太网标准可以包括IEEE802.3。网络通信还可以根据诸如OpenFlow硬件抽象API规范之类的一个或多个OpenFlow规范发生。网络通信还可以根据Infiniband架构规范或TCP/IP协议发生。
可以使用分立电路、专用集成电路(ASIC)、逻辑门和/或单芯片架构的任何组合来实现计算平台3000的组件和特征。此外,在适当情况下,计算平台1000的特征可以使用微控制器、可编程逻辑阵列和/或微处理器或前述的任何组合来实现。注意,硬件、固件和/或软件元件可以在本文中统称为或单独称为“逻辑”或“电路”。
应理解,该图的框图中示出的示例性计算平台3000可以表示许多潜在实现方式的一个功能描述性示例。因此,附图中描绘的块功能的划分、省略或包含并不推断出用于实现这些功能的硬件组件、电路、软件和/或元件必须被划分、省略或包括在实施例中。
至少一个示例的一个或多个方面可以由存储在至少一种机器可读介质上的代表性指令来实现,该至少一种机器可读介质表示处理器内的各种逻辑,该代表性指令当由机器、计算设备或系统读取时使机器、计算设备或系统制造逻辑以执行本文描述的技术。这种称为“IP核心”的表示可以存储在有形的机器可读介质上,并且提供给各种客户或制造设施以加载到实际制作逻辑或处理器的制造机器中。
可以使用硬件元件、软件元件或两者的组合来实现各种示例。在一些示例中,硬件元件可以包括设备、组件、处理器、微处理器、电路、电路元件(例如,晶体管、电阻器、电容器、电感器等)、集成电路、专用集成电路(ASIC)、可编程逻辑器件(PLD)、数字信号处理器(DSP)、现场可编程门阵列(FPGA)、存储器单元、逻辑门、寄存器、半导体器件、芯片、微芯片、芯片组等。在一些示例中,软件元件可以包括软件组件、程序、应用、计算机程序、应用程序、系统程序、机器程序、操作系统软件、中间件、固件、软件模块、例程、子例程、函数、方法、过程、软件接口、应用程序接口(API)、指令集、计算代码、计算机代码、代码段、计算机代码段、字、值、符号或其任何组合。确定是否使用硬件元件和/或软件元件实现示例可以根据任何数量的因素而变化,例如,期望的计算速率、功率水平、热容差、处理周期预算、输入数据速率、输出数据速率、存储器资源、数据总线速度以及其他设计或性能约束,如给定实现方式期望的。
一些示例可以包括制品或至少一种计算机可读介质。计算机可读介质可以包括用于存储逻辑的非暂时性存储介质。在一些示例中,非暂时性存储介质可以包括能够存储电子数据的一种或多种类型的计算机可读存储介质,包括易失性存储器或非易失性存储器、可移除或不可移除存储器、可擦除或不可擦除存储器、可写或可重写存储器等。在一些示例中,逻辑可以包括各种软件元件,例如,软件组件、程序、应用、计算机程序、应用程序、系统程序、机器程序、操作系统软件、中间件、固件、软件模块、例程、子例程、函数、方法、过程、软件接口、API、指令集、计算代码、计算机代码、代码段、计算机代码段、字、值、符号或其任何组合。
根据一些示例,计算机可读介质可以包括用于存储或维护指令的非暂时性存储介质,该指令当由机器、计算设备或系统执行时使机器、计算设备或系统执行根据所描述的示例的方法和/或操作。指令可以包括任何合适类型的代码,例如,源代码、编译代码、解释代码、可执行代码、静态代码、动态代码等。可以根据预定义的计算机语言、方式或语法来实现指令,用于指导机器、计算设备或系统执行特定功能。可以使用任何合适的高级编程语言、低级编程语言、面向对象的编程语言、可视编程语言、编译编程语言和/或解释编程语言来实现指令。
可以使用表达“在一个示例中”或“示例”及其衍生词来描述一些示例。这些术语意味着结合该示例描述的特定特征、结构或特性包括在至少一个示例中。短语“在一个示例中”在说明书中各处的出现不一定都指代同一示例。
可以使用表达“耦合”和“连接”及其衍生词来描述一些示例。这些术语不一定旨在彼此同义。例如,使用术语“连接”和/或“耦合”的描述可以指示两个或更多个元件彼此直接物理或电接触。然而,术语“耦合”也可能意味着两个或更多个元件彼此不直接接触,但仍然彼此协作或交互。
以下示例涉及本文公开的技术的其他示例。
要强调的是,提供本公开的摘要以符合37C.F.R.第1.72(b)节,要求可以让读者快速确定技术公开的实质的摘要。提交时应理解,摘要不用于解释或限制权利要求的范围或含义。此外,在前面的具体实施方式中,可以看出,为了精简本公开的目的,在单个示例中将各种特征组合在一起。这种公开的方法不应被解释为反映所要求保护的示例要求比每项权利要求中明确叙述的更多特征的意图。相反,如所附权利要求所反映的,发明主题在于少于单个公开的示例的所有特征。因此,所附权利要求由此并入具体实施方式中,其中每项权利要求独立地作为单独的示例。在所附权利要求中,术语“包括(including)”和“其中(inwhich)”分别用作相应术语“包含(comprising)”和“其中(wherein)”的通俗英语等同词。此外,术语“第一”、“第二”、“第三”等仅用作标签,而并不旨在对其对象施加数字要求。
尽管已经以结构特征和/或方法动作特定的语言描述了主题,但是应理解,所附权利要求中限定的主题不一定限于上述特定特征或动作。相反,上面描述的特定特征和动作作为实现权利要求的示例形式公开。
本公开可以以各种实施例中的任何实施例来实现,例如,以下非穷举列出了示例实施例。
示例1.一种用于数据中心的托架的装置,包括:框架,其耦合到数据中心的机架,该框架包括被布置为接纳多个存储设备的多个可移除存储设备安装槽;基板,其耦合到框架;多用途连接器模块(MPCM),其设置在基板上,MPCM被布置为耦合到机架的对应的连接器模块;以及多个存储设备MPCM,其设置在基板上,多个存储设备MPCM中的每个存储设备MPCM耦合到被布置为耦合到多个存储设备中的对应的一个存储设备的MPCM。
示例2.示例1的装置,包括设置在基板上的双模光网络接口,双模光网络接口可操作地耦合到MPCM和存储设备MPCM。
示例3.示例2的装置,包括至少一个存储资源处理电路,双模光网络接口经由至少一个存储资源处理电路可操作地耦合到存储设备MPCM。
示例4.示例3的装置,至少一个存储资源处理电路包括第一存储资源处理电路和第二存储资源处理电路,双模光网络接口经由第一存储资源处理电路可操作地耦合到存储设备MPCM的第一子集,并且经由第二存储资源处理电路可操作地耦合到存储设备MPCM的第二子集。
示例5.示例4的装置,包括多个存储设备。
示例6.示例1至5中任一项的装置,包括用于接纳多个存储器模块的多个存储器模块插座,多个存储器模块插座中的每个存储器模块插座耦合到MPCM。
示例7.示例6的装置,包括多个存储器模块。
示例8.示例1至5中任一项的装置,框架包括设置在框架的横向端部上的至少两个安装凸缘,该至少两个安装凸缘被布置为机械地耦合到机架的安装支架。
示例9.示例8的装置,机架安装凸缘和安装支架被布置为使得框架能够机器人化地插入机架并且从机架移除。
示例10.示例1至5中任一项的装置,多个可移除存储设备安装槽成对布置,多个可移除存储设备安装槽中的每对用于接纳多个存储设备中的一个存储设备。
示例11.示例10的装置,多个可移除存储设备安装槽中的每对中的一个可移除存储设备安装槽设置在框架的下部,并且多个可移除存储设备安装槽中的每对中的另一个可移除存储设备安装槽设置在框架的上部,以垂直地保持多个存储设备中的每个存储设备。
示例12.示例11的装置,多个可移除存储设备安装槽中的每对与多个可移除存储设备安装槽中的另一对间隔开足够将多个存储设备机器人化地插入和移除的距离。
示例13.一种用于数据中心的机架的系统,包括:机架,该机架包括:多个安装支架,其被布置为形成至少一个托架空间;以及多个机架侧多用途连接器模块(MPCM),其耦合到光结构;以及至少一个托架,该至少一个托架中的每个托架包括:耦合多个安装支架中的一个安装支架的框架,框架包括被布置为接纳多个存储设备的多个可移除存储设备安装槽;耦合到框架的基板;设置在基板上的托架侧MPCM,该托架侧MPCM被布置为耦合到机架侧MPCM中的对应的一个机架侧MPCM;以及设置在基板上的多个存储设备MPCM,该多个存储设备MPCM中的每个存储设备MPCM耦合到托架侧MPCM,并且被布置为耦合到多个存储设备中的对应的一个存储设备,以将多个可移除存储设备通信地耦合到光结构。
示例14.示例13的系统,至少一个托架中的每个托架包括设置在基板上的双模光网络接口,该双模光网络接口可操作地耦合到MPCM和存储设备MPCM。
示例15.示例14的系统,至少一个托架中的每个托架包括至少一个存储资源处理电路,双模光网络接口经由至少一个存储资源处理电路可操作地耦合到存储设备MPCM。
示例16.示例15的系统,至少一个存储资源处理电路中的每个存储资源处理电路包括第一存储资源处理电路和第二存储资源处理电路,双模光网络接口经由第一存储资源处理电路可操作地耦合到存储设备MPCM的第一子集,并且经由第二存储资源处理电路可操作地耦合到存储设备MPCM的第二子集。
示例17.示例16的系统,至少一个托架中的每个托架包括多个存储设备。
示例18.示例13至17中任一项的系统,至少一个托架中的每个托架包括用于接纳多个存储器模块的多个存储器模块插座,该多个存储器模块插座中的每个存储器模块插座耦合到托架侧MPCM。
示例19.示例18的系统,至少一个托架中的每个托架包括多个存储器模块。
示例20.示例13至17中任一项的系统,至少一个托架中的每个托架的框架包括设置在框架的横向端部上的安装凸缘,安装凸缘被布置为机械地耦合到多个安装支架中的一个安装支架,以将托架机械地放置在至少一个托架空间中的一个托架空间中。
示例21.示例20的系统,多个安装支架和至少一个托架的安装凸缘被布置为使得至少一个托架可机器人化地插入机架并且从机架移除。
示例22.示例13至17中任一项的系统,至少一个托架中的每个托架的多个可移除存储设备安装槽成对布置,多个可移除存储设备安装槽中的每对用于接纳多个存储设备中的一个存储设备。
示例23.示例22的系统,多个可移除存储设备安装槽中的每对中的一个可移除存储设备安装槽设置在框架的下部,并且多个可移除存储设备安装槽中的每对中的另一个可移除存储设备安装槽设置在框架的上部,以垂直地保持多个存储设备中的每个存储设备。
示例24.示例23的系统,多个可移除存储设备安装槽中的每对与多个可移除存储设备安装槽中的另一对间隔开足够机器人化地插入和移除多个存储设备的距离。
示例25.一种用于数据中心的托架的装置,包括:框架,其包括用于机械地耦合到可移除存储设备托盘的第一部分和第二部分,该第一部分和第二部分被布置为形成安装凸缘,以机械地耦合到数据中心的机架;可移除存储设备托盘,其包括被布置为接纳多个存储设备的多个可移除存储设备安装槽;耦合到框架的基板;多用途连接器模块(MPCM),其设置在基板上,MPCM被布置为耦合到机架的对应的连接器模块;多个存储设备MPCM,其设置在基板上,多个存储设备MPCM中的每个存储设备MPCM耦合到被布置为耦合到多个存储设备中的对应的一个存储设备的MPCM;以及双模光网络接口,其设置在基板上,双模光网络接口可操作地耦合到MPCM和存储设备MPCM。
示例26.示例25的装置,包括至少一个存储资源处理电路,双模光网络接口经由至少一个存储资源处理电路可操作地耦合到存储设备MPCM。
示例27.示例26的装置,至少一个存储资源处理电路包括第一存储资源处理电路和第二存储资源处理电路,双模光网络接口经由第一存储资源处理电路可操作地耦合到存储设备MPCM的第一子集,并且经由第二存储资源处理电路可操作地耦合到存储设备MPCM的第二子集。
示例28.示例27的装置,包括多个存储设备。
示例29.示例25至28中任一项的装置,包括用于接纳多个存储器模块的多个存储器模块插座,该多个存储器模块插座中的每个存储器模块插座耦合到MPCM。
示例30.示例29的装置,包括多个存储器模块。
示例31.示例25至28中任一项的装置,安装凸缘设置在框架的横向端部处。
示例32.示例31的装置,安装凸缘被布置为使得框架可机器人化地插入机架并且从机架移除。
示例33.示例25至28中任一项的装置,多个可移除存储设备安装槽成对布置,多个可移除存储设备安装槽中的每对用于接纳多个存储设备中的一个存储设备。
示例34.示例33的装置,多个可移除存储设备安装槽中的每对中的一个可移除存储设备安装槽设置在框架的下部,并且多个可移除存储设备安装槽中的每对中的另一个可移除存储设备安装槽设置在框架的上部,以垂直地保持多个存储设备中的每个存储设备。
示例35.示例34的装置,多个可移除存储设备安装槽中的每对与多个可移除存储设备安装槽中的另一对间隔开足够机器人化地插入和移除多个存储设备的距离。
示例36.一种用于数据中心的托架的装置,包括:框架,其耦合到数据中心的机架,该框架包括被布置为接纳多个存储设备的多个可移除存储设备安装单元;基板,其耦合到框架;连接器单元,其设置在基板上,连接器单元耦合到机架的对应的连接器单元;以及多个存储设备连接器单元,其设置在基板上,多个存储设备连接器单元中的每个存储设备连接器单元将多个存储设备中的一个存储设备耦合到连接器单元。
示例37.示例36的装置,包括设置在基板上的双模接口单元,该双模接口单元可操作地耦合到连接器单元和存储设备连接器单元。
示例38.示例37的装置,包括至少一个存储资源控制单元,双模接口单元经由至少一个存储资源控制单元可操作地耦合到存储设备连接器单元。
示例39.示例38的装置,至少一个存储资源控制单元包括第一存储资源控制单元和第二存储资源控制单元,双模接口单元经由第一存储资源控制单元可操作地耦合到存储设备连接器单元的第一子集,并且经由第二存储资源控制单元可操作地耦合到存储设备控制单元的第二子集。
示例40.示例39的装置,包括多个存储设备。
示例41.示例36至40中任一项的装置,包括用于接纳多个存储器模块的多个存储器模块连接器单元,该多个存储器模块连接器单元中的每个存储器模块连接器单元耦合到连接器单元。
示例42.示例41的装置,包括多个存储器模块。
示例43.示例36至40中任一项的装置,框架包括设置在框架的横向端部上的安装凸缘,安装凸缘被布置为机械地耦合到机架的安装支架。
示例44.示例43的装置,机架安装凸缘和安装支架被布置为使得框架能够机器人化地插入机架并且从机架移除。
示例45.示例36至40中任一项的装置,多个可移除存储设备安装单元成对布置,多个可移除存储设备安装单元中的每对用于接纳多个存储设备中的一个存储设备。
示例46.示例45的装置,多个可移除存储设备安装单元中的每对中的一个可移除存储设备安装单元设置在框架的下部,并且多个可移除存储设备安装单元中的每对中的另一个可移除存储设备安装单元设置在框架的上部,以垂直地保持多个存储设备中的每个存储设备。
示例47.示例46的装置,多个可移除存储设备安装单元中的每对与多个可移除存储设备安装单元中的另一对间隔开足够机器人化地插入和移除多个存储设备的距离。
Claims (24)
1.一种数据中心托架,包括:
框架,其耦合到数据中心的机架,所述框架包括被布置为接纳多个存储设备的多个可移除存储设备安装槽;
基板,其耦合到所述框架;
多用途连接器模块MPCM,其设置在所述基板上,所述MPCM被布置为耦合到所述机架的对应的连接器模块;以及
多个存储设备MPCM,其设置在所述基板上,所述多个存储设备MPCM中的每个存储设备MPCM耦合到所述MPCM,并且被布置为耦合到所述多个存储设备中的对应的一个存储设备;以及
双模光网络接口,其设置在所述基板上,所述双模光网络接口可操作地耦合到所述MPCM和所述存储设备MPCM。
2.如权利要求1所述的数据中心托架,包括至少一个存储资源处理电路,所述双模光网络接口经由所述至少一个存储资源处理电路可操作地耦合到所述存储设备MPCM。
3.如权利要求2所述的数据中心托架,所述至少一个存储资源处理电路包括第一存储资源处理电路和第二存储资源处理电路,所述双模光网络接口经由所述第一存储资源处理电路可操作地耦合到所述存储设备MPCM的第一子集,并且经由所述第二存储资源处理电路可操作地耦合到所述存储设备MPCM的第二子集。
4.如权利要求3所述的数据中心托架,包括所述多个存储设备。
5.如权利要求1所述的数据中心托架,包括用于接纳多个存储器模块的多个存储器模块插座,所述多个存储器模块插座中的每个存储器模块插座耦合到所述MPCM。
6.如权利要求5所述的数据中心托架,包括所述多个存储器模块。
7.如权利要求1所述的数据中心托架,所述框架包括设置在所述框架的横向端部上的安装凸缘,所述安装凸缘被布置为机械地耦合到所述机架的安装支架。
8.如权利要求7所述的数据中心托架,所述机架安装凸缘和所述安装支架被布置为使得所述框架能够机器人化地插入所述机架并且从所述机架移除。
9.如权利要求1所述的数据中心托架,所述多个可移除存储设备安装槽成对布置,所述多个可移除存储设备安装槽中的每对用于接纳所述多个存储设备中的一个存储设备。
10.如权利要求9所述的数据中心托架,所述多个可移除存储设备安装槽中的每对中的一个可移除存储设备安装槽设置在所述框架的下部,并且所述多个可移除存储设备安装槽中的每对中的另一个可移除存储设备安装槽设置在所述框架的上部,以垂直地保持所述多个存储设备中的每个存储设备。
11.如权利要求10所述的数据中心托架,所述多个可移除存储设备安装槽中的每对与所述多个可移除存储设备安装槽中的另一对间隔开足够将所述多个存储设备机器人化地插入和移除的距离。
12.一种数据中心机架,包括:
多个安装支架,其被布置为形成至少一个托架空间;以及
多个机架侧多用途连接器模块MPCM,其耦合到光结构;以及
至少一个托架,所述至少一个托架中的每个托架包括:
框架,其耦合所述多个安装支架中的一个安装支架,所述框架包括被布置为接纳多个存储设备的多个可移除存储设备安装槽;
基板,其耦合到所述框架;
托架侧MPCM,其设置在所述基板上,所述托架侧MPCM被布置为耦合到所述机架侧MPCM中的对应的一个机架侧MPCM;
多个存储设备MPCM,其设置在所述基板上,所述多个存储设备MPCM中的每个存储设备MPCM耦合到所述托架侧MPCM,并且被布置为耦合到所述多个存储设备中的对应的一个存储设备,以将多个可移除存储设备通信地耦合到所述光结构;以及
双模光网络接口,其设置在所述基板上,所述双模光网络接口可操作地耦合到MPCM和所述存储设备MPCM。
13.如权利要求12所述的数据中心机架,所述至少一个托架中的每个托架包括:
第一存储资源处理电路,所述双模光网络接口经由所述第一存储资源处理电路可操作地耦合到所述存储设备MPCM的第一子集;以及
第二存储资源处理电路,所述双模光网络接口经由所述第二存储资源处理电路可操作地耦合到所述存储设备MPCM的第二子集。
14.如权利要求12所述的数据中心机架,所述至少一个托架中的每个托架包括用于接纳多个存储器模块的多个存储器模块插座,所述多个存储器模块插座中的每个存储器模块插座耦合到所述托架侧MPCM。
15.如权利要求14所述的数据中心机架,所述至少一个托架中的每个托架包括:
所述多个存储设备;以及
所述多个存储器模块。
16.如权利要求12所述的数据中心机架,所述至少一个托架中的每个托架的所述框架包括设置在所述框架的横向端部上的安装凸缘,所述安装凸缘被布置为机械地耦合到所述多个安装支架中的一个安装支架,以将所述托架机械地放置在所述至少一个托架空间中的一个托架空间中。
17.如权利要求16所述的数据中心机架,所述多个安装支架和所述至少一个托架的安装凸缘被布置为使得所述至少一个托架可机器人化地插入所述机架并且从所述机架移除。
18.如权利要求12所述的数据中心机架,所述至少一个托架中的每个托架的所述多个可移除存储设备安装槽成对布置,所述多个可移除存储设备安装槽中的每对用于接纳所述多个存储设备中的一个存储设备。
19.如权利要求18所述的数据中心机架,所述多个可移除存储设备安装槽中的每对中的一个可移除存储设备安装槽设置在所述框架的下部,并且所述多个可移除存储设备安装槽中的每对中的另一个可移除存储设备安装槽设置在所述框架的上部,以垂直地保持所述多个存储设备中的每个存储设备。
20.如权利要求19所述的数据中心机架,所述多个可移除存储设备安装槽中的每对与所述多个可移除存储设备安装槽中的另一对间隔开足够机器人化地插入和移除所述多个存储设备的距离。
21.一种用于数据中心的托架的装置,包括:
框架,其包括用于机械地耦合到可移除存储设备托盘的第一部分和第二部分,所述第一部分和所述第二部分被布置为形成安装凸缘,以机械地耦合到数据中心的机架;
所述可移除存储设备托盘,其包括被布置为接纳多个存储设备的多个可移除存储设备安装槽;
基板,其耦合到所述框架;
多用途连接器模块MPCM,其设置在所述基板上,所述MPCM被布置为耦合到所述机架的对应的连接器模块;
多个存储设备MPCM,其设置在所述基板上,所述多个存储设备MPCM中的每个存储设备MPCM耦合到所述MPCM,并且被布置为耦合到所述多个存储设备中的对应的一个存储设备;以及
双模光网络接口,其设置在所述基板上,所述双模光网络接口可操作地耦合到所述MPCM和所述存储设备MPCM。
22.如权利要求21所述的装置,至少一个存储资源处理电路包括第一存储资源处理电路和第二存储资源处理电路,所述双模光网络接口经由所述第一存储资源处理电路可操作地耦合到所述存储设备MPCM的第一子集,并且经由所述第二存储资源处理电路可操作地耦合到所述存储设备MPCM的第二子集。
23.如权利要求21所述的装置,包括用于接纳多个存储器模块的多个存储器模块插座,所述多个存储器模块插座中的每个存储器模块插座耦合到所述MPCM。
24.如权利要求21所述的装置,所述安装凸缘设置在所述框架的横向端部处,并且被布置为使得所述框架可机器人化地插入所述机架并且从所述机架移除。
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