CN109313580A - 用于托架架构的技术 - Google Patents

用于托架架构的技术 Download PDF

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Publication number
CN109313580A
CN109313580A CN201780038329.9A CN201780038329A CN109313580A CN 109313580 A CN109313580 A CN 109313580A CN 201780038329 A CN201780038329 A CN 201780038329A CN 109313580 A CN109313580 A CN 109313580A
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China
Prior art keywords
bracket
circuit board
board substrate
chassis circuit
chassis
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CN201780038329.9A
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English (en)
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CN109313580B (zh
Inventor
M·J·阿迪莱塔
A·戈里乌斯
M·维尔德
M·T·克罗克
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Intel Corp
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Intel Corp
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Abstract

用于数据中心的对应机架中的操作的托架包括无底盘电路板基板，其具有耦合到无底盘电路板的顶侧的一个或多个物理资源以及耦合到无底盘电路板的底侧的一个或多个存储器设备。托架不包括壳体或底盘，并且向本地环境开放。在说明性实施例中，托架可以体现为计算托架、加速器托架或存储托架。

Description

用于托架架构的技术
相关申请的交叉引用
本申请要求享有以下申请的优先权：于2016年12月31日提交的题为“TECHNOLOGIES FOR SLED ARCHITECTURE”的序列号为15/396,646的美国实用专利申请，其要求享有以下申请的优先权：于2016年7月22日提交的编号为62/365,969的美国临时专利申请；于2016年8月18日提交的编号为62/376,859的美国临时专利申请；以及于2016年11月29日提交的编号为62/427,268的美国临时专利申请。
背景技术
典型的企业级数据中心可以包括若干个到数百个机架或机柜，其中，每个机架/机柜容纳多个服务器。数据中心的各种服务器中的每一个可以是可经由一个或多个本地网络交换机、路由器和/或其他互连设备、电缆和/或接口通信地彼此连接的。特定数据中心的机架和服务器的数量以及数据中心的设计的复杂性可以取决于数据中心的预期用途，以及数据中心旨在提供的服务质量。
数据中心的传统服务器是被设计为安装到数据中心的对应机架中的独立计算设备。为此，典型的数据中心服务器包括具有用于促进将服务器安装到机架或机柜中的对应安装机构(例如，支架)的壳体。服务器的电气组件位于壳体内，并且壳体向电气组件提供一定量的保护免于本地环境以及杂散电磁干扰的影响。另外，典型的服务器通常包括它们自己的外围组件或系统，例如内部电源和内部冷却。如此，典型服务器的壳体的尺寸是针对在壳体本身内部包括这样的组件而确定的。
在一些数据中心中，每个服务器可以体现为能够服务于不同类型的工作负载的通用服务器。当然，与其他服务器(例如，更多或更少的处理器核心)相比，一些服务器可以具有不同的资源。在一些情况下，服务器中的一些可以是被配置为处理专门的工作负载的专用服务器。
附图说明
本文描述的构思在附图中通过示例的方式而不是通过限制的方式示出。为了说明的简单和清楚，附图中示出的元素不一定按比例绘制。在认为适当的情况下，在附图之间重复使用附图标记以指示对应或类似的元素。
图1是根据各种实施例的其中可以实现本文描述的一种或多种技术的数据中心的概念性概述的图；
图2是图1的数据中心的机架的逻辑配置的示例性实施例的图；
图3是根据各种实施例的其中可以实现本文描述的一种或多种技术的另一数据中心的示例性实施例的图；
图4是根据各种实施例的其中可以实现本文描述的一种或多种技术的数据中心的另一示例性实施例的图；
图5是表示可以在图1、图3和图4的数据中心的各种托架之间建立的链路层连接的连接方案的图；
图6是可以表示根据一些实施例的图1-4中描绘的机架中的任何特定的一个的架构的机架架构的图；
图7是可以与图6的机架架构一起使用的托架的示例性实施例的图；
图8是用于提供对以扩展能力为特征的托架的支持的机架架构的示例性实施例的图；
图9是根据图8的机架架构实现的机架的示例性实施例的图；
图10是被设计为用于与图9的机架结合使用的托架的示例性实施例的图；
图11是根据各种实施例的其中可以实现本文描述的一种或多种技术的数据中心的示例性实施例的图；
图12是可用于图1、图3、图4和/或图11的数据中心中的托架的顶侧的至少一个实施例的简化框图；
图13是图12的托架的底侧的至少一个实施例的简化框图；
图14是可用于图1、图3、图4和/或图11的数据中心中的计算托架的至少一个实施例的简化框图；
图15是图14的计算托架的至少一个实施例的顶部透视图；
图16是图15的计算托架的底部透视图；
图17是图15的计算托架的俯视图；
图18是图15的计算托架的俯视图，其中，处理器散热器被移除；
图19是图15的计算托架的仰视图；
图20是可用于图1、图3、图4和/或图11的数据中心中的加速器托架的至少一个实施例的简化框图；
图21是图20的加速器托架的至少一个实施例的顶部透视图；
图22是图21的加速器托架的底部透视图；
图23是图21的加速器托架的俯视图；
图24是图21的加速器托架的仰视图；
图25是可用于图1、图3、图4和/或图11的数据中心中的存储托架的至少一个实施例的简化框图；
图26是图25的存储托架的至少一个实施例的顶部透视图；
图27是图26的存储托架的底部透视图；
图28是图26的存储托架的俯视图；以及
图29是图26的存储托架的仰视图。
具体实施方式
虽然本公开内容的构思易于进行各种修改和替代形式，但是其具体实施例已经通过附图中的示例的方式示出并且将在本文中被详细描述。然而，应当理解的是，并不旨在将本公开内容的构思限于所公开的特定形式，而是相反，意图是覆盖与本公开内容和所附权利要求相一致的所有修改、等同物和替代方案。
说明书中对“一个实施例”、“实施例”、“说明性实施例”等的引用指示所描述的实施例可以包括特定特征、结构或特性，但是每个实施例可以包括或可以不一定包括该特定特征、结构或特性。而且，这样的短语不一定指代相同实施例。此外，当结合实施例描述特定特征、结构或特性(无论是否明确描述)时，认为结合其他实施例实现这样的特征、结构或特性在本领域技术人员的知识范围内。另外，应当领会，被包括在采用“A、B和C中的至少一个”的形式的列表中的项目可以意指(A)；(B)；(C)；(A和B)；(A和C)；(B和C)；或(A、B和C)。类似地，以“A、B或C中的至少一个”的形式列出的项目可以意指(A)；(B)；(C)；(A和B)；(A和C)；(B和C)；或(A、B和C)。
在一些情况下，所公开的实施例可以用硬件、固件、软件或其任何组合来实现。所公开的实施例还可以被实现为由暂时性或非暂时性机器可读(例如，计算机可读)存储介质承载或存储在其上的指令，所述指令可以由一个或多个处理器读取和执行。机器可读存储介质可以体现为用于存储或发送采用机器可读形式的信息的任何存储设备、机构或其他物理结构(例如，易失性或非易失性存储器、媒体盘或其他媒体设备)。
在附图中，可以以特定布置和/或排序示出一些结构特征或方法特征。然而，应当领会，可以不需要这样的特定布置和/或排序。而是，在一些实施例中，这样的特征可以以不同于说明性附图中示出的方式和/或次序来布置。另外，在特定图中包括结构特征或方法特征并不意味着暗示这样的特征在所有实施例中都被需要，并且在一些实施例中，可以不被包括或者可以与其他特征组合。
图1示出了数据中心100的概念性概述，所述数据中心100可以概括地表示数据中心或其他类型的计算网络，在其中/针对其可以根据各种实施例实现本文描述的一种或多种技术。如图1所示，数据中心100通常可以包含多个机架，所述机架中的每一个可以容纳包括相应的物理资源集的计算装备。在图1中描绘的特定非限制性示例中，数据中心100包含四个机架102A至102D，其容纳包括相应的物理资源集105A至105D的计算装备。根据该示例，数据中心100的物理资源集合集106包括分布在机架102A至102D之间的各个物理资源集105A至105D。物理资源106可以包括多种类型的资源，例如处理器、协处理器、加速器、现场可编程门阵列(FPGA)、存储器和存储装置。实施例不限于这些示例。
说明性数据中心100在许多方面不同于典型的数据中心。例如，在说明性实施例中，其上放置诸如CPU、存储器和其他组件之类的组件的电路板(“托架”)被设计为用于提高热性能。具体而言，在说明性实施例中，托架浅于典型的板。换言之，托架从前到后(冷却风扇位于其中)较短。这减少了空气必须穿过板上组件的路径的长度。此外，托架上的组件与典型的电路板相比间隔得更远，并且组件被设置为减少或消除阴影(即，一个组件在另一组件的空气流动路径中)。在说明性实施例中，诸如处理器之类的处理组件位于托架的顶侧，而近存储器(例如，双列直插式存储器模块(DIMM))位于托架的底侧。作为由该设计提供的增强的气流的结果，与典型系统中的相比这些组件可以以更高的频率和电力水平操作，从而提高性能。此外，托架配置为与每个机架102A、102B、102C、102D中的电源和数据通信电缆盲配对，以增强它们被快速移除、升级、重新安装和/或更换的能力。类似地，位于托架上的个别组件(例如，处理器、加速器、存储器和数据存储驱动器)被配置为由于它们增加的彼此间隔而容易升级。在说明性实施例中，组件另外地包括用于证明其真实性的硬件证明特征。
此外，在说明性实施例中，数据中心100利用支持包括以太网和Omni-Path的多个其他网络架构的单个网络架构(“结构”)。在说明性实施例中，托架经由光纤耦合到交换机，与典型双绞线电缆(例如，类别5、类别5e、类别6等)相比所述光纤提供更高的带宽和更低的延时。由于高带宽、低延时互连和网络架构，数据中心100可以在使用时池化资源，例如物理地解聚的存储器、加速器(例如，图形加速器、FPGA、专用集成电路(ASIC)等)和数据存储驱动器，并且根据需要向计算资源(例如处理器)提供它们，以使得计算资源能够如同它们是本地的一样访问池化的资源。说明性的数据中心100另外地接收各种资源的使用信息，基于过去的资源使用来预测不同类型的工作负载的资源使用，并且基于该信息来动态地重新分配资源。
数据中心100的机架102A、102B、102C、102D可以包括促进各种类型的维护任务的自动化的物理设计特征。例如，数据中心100可以使用被设计为机器人访问的以及接受并容纳机器人可操纵的资源托架的机架来实现。此外，在说明性实施例中，机架102A、102B、102C、102D包括接收与对于电源而言典型的相比更大的电压的集成电源。增加的电压使得电源能够向每个托架上的组件提供另外的电力，以使得组件能够以高于典型频率的频率操作。
图2示出了数据中心100的机架202的示例性逻辑配置。如图2所示，机架202通常可以容纳多个托架，所述托架中的每一个可以包括相应的物理资源集。在图2描绘的特定非限制性示例中，机架202容纳包括相应的物理资源集205-1至205-4的托架204-1至204-4，所述物理资源集中的每一个构成被包括在机架202中的物理资源集合集206的一部分。关于图1，如果机架202表示例如机架102A，则物理资源206可以对应于被包括在机架102A中的物理资源105A。在该示例的上下文中，物理资源105A因此可以由相应的物理资源集构成，所述物理资源集包括在机架202的托架204-1至204-4中所包括的物理存储资源205-1、物理加速器资源205-2、物理存储器资源205-3和物理计算资源205-5。实施例不限于该示例。每个托架可以包含各种类型的物理资源(例如，计算、存储器、加速器、存储)中的每一个的池。通过具有包括解聚的资源的机器人可访问的和机器人可操纵的托架，每种类型的资源都可以彼此独立地并以其自己的优化的刷新率进行升级。
图3示出了根据各种实施例的数据中心300的示例，所述数据中心可以概括地表示在其中/针对其可以实现本文描述的一种或多种技术的数据中心。在图3描绘的特定非限制性示例中，数据中心300包括机架302-1至302-32。在各种实施例中，数据中心300的机架可以以定义和/或容适各种访问通路的方式进行布置。例如，如图3所示，数据中心300的机架可以以定义和/或容适访问通路311A、311B、311C和311D的方式进行布置。在一些实施例中，这样的访问通路的存在通常可以使得自动化维护设备(例如，机器人维护装备)能够物理地访问被容纳在数据中心300的各种机架中的计算装备并且执行自动化维护任务(例如，更滑故障的托架、升级托架)。在各种实施例中，可以选择访问通路311A、311B、311C和311D的尺寸、机架302-1至302-32的尺寸和/或数据中心300的物理布局的一个或多个其他方面以促进这样的自动化操作。实施例在该上下文中不受限制。
图4示出了根据各种实施例的数据中心400的示例，所述数据中心400可以概括地表示在其中/针对其可以实现本文描述的一种或多种技术的数据中心。如图4所示，数据中心400可以以光学结构412为特征。光学结构412通常可以包括光学信令介质(例如，光缆)和光学交换基础设施的组合，经由其数据中心400中的任何特定托架可以发送去往(并且接收来自)数据中心400的其他托架中的每一个的信号。光学结构412向任何给定托架提供的信令连接可以包括到相同机架中的其他托架和其他机架中的托架二者的连接。在图4中描绘的特定非限制性示例中，数据中心400包括四个机架402A至402D。机架402A至402D容纳相应的托架对404A-1和404A-2、404B-1和404B-2、404C-1和404C-2以及404D-1和404D-2。因此，在该示例中，数据中心400包括总计八个托架。经由光学结构412，每个这样的托架可以具有与数据中心400中的七个其他托架中的每一个的信令连接。例如，经由光学结构412，机架402A中的托架404A-1可以具有与机架402A中的托架404A-2以及分布在数据中心400的其他机架402B、402C和402D之中的其他六个托架404B-1、404B-2、404C-1、404C-2、404D-1和404D-2的信令连接。实施例不限于该示例。
图5示出了连接方案500的概述，所述连接方案500可以概括地表示可以在一些实施例中在数据中心(例如，图1、图3和图4中的示例性数据中心100、300和400中任何一个)的各种托架之间的建立的链路层连接。连接方案500可以使用以双模光学交换基础设施514为特征的光学结构来实现。双模光学交换基础设施514通常可以包括交换基础设施，其能够根据多个链路层协议经由相同的统一光学信令介质集来接收通信，并且能够适当地切换这样的通信。在各种实施例中，可以使用一个或多个双模光学交换机515来实现双模光学交换基础设施514。在各种实施例中，双模光学交换机515通常可以包括高基交换机。在一些实施例中，双模光学交换机515可以包括多层交换机，例如四层交换机。在各种实施例中，双模光学交换机515可以以集成硅光子学为特征，所述集成硅光子学使得所述双模光学交换机515能够以与传统交换机设备相比显著减少的延时来切换通信。在一些实施例中，双模光学交换机515可以构成另外包括一个或多个双模光学脊交换机520的叶脊架构中的叶交换机530。
在各种实施例中，双模光学交换机可以是能够经由光学结构的光学信令介质接收承载互联网协议的以太网协议通信(IP分组)和根据第二、高性能计算(HPC)链路层协议(例如，英特尔的Omni-Path架构的，即Infiniband)的通信二者的。如图5反映的，关于具有到光学结构的光学信令连接的任何特定的托架对504A和504B，连接方案500因此可以提供对经由以太网链路和HPC链路二者的链路层连接的支持。因此，以太网和HPC通信二者都可以由单个高带宽、低延时交换结构支持。实施例不限于该示例。
图6示出了根据一些实施例的机架架构600的总体概述，其可以表示图1至图4中描绘的机架中的任何特定的一个的架构。如图6反映的，机架架构600通常可以以托架可以插入其中的多个托架空间为特征，所述托架空间中的每一个都可以是可经由机架访问区域601机器人访问的。在图6描绘的特定非限制性示例中，机架架构600以五个托架空间603-1至603-5为特征。托架空间603-1至603-5以相应的多用途连接器模块(MPCM)616-1至616-5为特征。
图7示出了可以表示这样的类型的托架的托架704的示例。如图7所示，托架704可以包括物理资源集705以及MPCM 716，所述MPCM 716被设计为当托架704被插入到诸如图6的托架空间603-1至603-5中任何一个之类的托架空间中时与配对MPCM相耦合。托架704还可以以扩展连接器717为特征。扩展连接器717通常可以包括能够接受一种或多种类型的扩展模块(例如，扩展托架718)的插口、槽或其他类型的连接元件。通过与扩展托架718上的配对连接器相耦合，扩展连接器717可以向物理资源705提供对驻留在扩展托架718上的补充计算资源705B的访问。实施例在该上下文中不受限制。
图8示出了机架架构800的示例，所述机架架构800可以表示被实现以便提供对以扩展能力为特征的托架(例如，图7的托架704)的支持的机架架构。在图8描绘的特定非限制性示例中，机架架构800包括七个托架空间803-1至803-7，其以相应的MPCM 816-1至816-7为特征。托架空间803-1至803-7包括相应的主区域803-1A至803-7A和相应的扩展区域803-1B至803-7B。关于每个这样的托架空间，当对应的MPCM与插入的托架的配对MPCM相耦合时，主区域通常可以构成托架空间的物理地容适插入的托架的区域。在插入的托架配置有这样的模块的情况下，扩展区域通常可以构成托架空间的可以物理地容适扩展模块的区域(例如，图7的扩展托架718)。
图9示出了根据一些实施例的机架902的示例，所述机架902可以表示根据图8的机架架构800实现的机架。在图9描绘的特定非限制性示例中，机架902以七个托架空间903-1至903-7为特征，其包括相应的主区域903-1A至903-7A和相应的扩展区域903-1B至903-7B。在各种实施例中，机架902中的温度控制可以使用空气冷却系统来实现。例如，如图9反映的，机架902可以以多个风扇919为特征，所述风扇919通常被布置为在各个托架空间903-1至903-7内提供空气冷却。在一些实施例中，托架空间的高度大于传统的“1U”服务器高度。在这样的实施例中，与常规机架配置中使用的风扇相比，风扇919通常可以包括相对较慢的大直径冷却风扇。相对于以较高速度运行的较小直径的冷却风扇，以较低速度运行较大直径的冷却风扇可以延长风扇的寿命，同时仍提供相同的冷却量。托架在物理上浅于传统的机架尺寸。此外，组件被布置在每个托架上以减少热遮蔽(即，不沿气流方向连续布置)。因此，更宽、更浅的托架允许设备性能的提高，这是因为由于改善的冷却(例如，没有热遮蔽、器件之间更多的空间、用于较大的散热器(heatsink)的更多空间等)，设备可以以更高的热封套(例如，250W)操作。
MPCM 916-1至916-7可以被配置为向插入的托架提供对由相应的电力模块920-1至920-7提供的电力的访问，所述电力模块中的每一个可以从外部电源921汲取电力。在各种实施例中，外部电源921可以将交流(AC)电力递送到机架902，并且电力模块920-1到920-7可以被配置为将这样的AC电力转换为直流(DC)电力以向插入的托架提供。在一些实施例中，例如，电力模块920-1至920-7可以被配置为将277伏AC电力转换为12伏DC电力，以经由相应的MPCM 916-1至916-7向插入的托架供应。实施例不限于该示例。
MPCM 916-1至916-7还可以被布置为向插入托架提供到双模光学交换基础设施914的光学信令连接，所述双模光学交换基础设施914可以与图5的双模光学交换基础设施514相同或相似。在各种实施例中，包含在MPCM916-1至916-7中的光学连接器可以被设计为与包含在插入的托架的MPCM中的配对光学连接器相耦合，以向这样的托架提供经由相应长度的光缆922-1至922-7到双模光学交换基础设施914的光学信令连接。在一些实施例中，每个这样长度的光缆可以从其对应的MPCM延伸到在机架902的托架空间外部的光学互连隐现器923。在各种实施例中，光学互连隐现器923可以被布置为穿过支架902的支柱或其他类型的承载元件。实施例在该上下文中不受限制。因为插入的托架经由MPCM连接到光学交换基础设施，所以可以节省通常用于手动配置机架电缆以容适新插入的托架的资源。
图10示出了根据一些实施例的托架1004的示例，所述托架1004可以表示被设计为用于与图9的机架902结合使用的托架。托架1004可以以MPCM 1016为特征，所述MPCM 1016包括光学连接器1016A和电力连接器1016B，并且所述MPCM 1016被设计为与MPCM 1016插入到该托架空间中相结合地与托架空间的配对MPCM相耦合。将MPCM 1016与这样的配对MPCM相耦合可以使电力连接器1016与包括在配对MPCM中的电力连接器相耦合。这通常可以使得托架1004的物理资源1005能够经由电力连接器1016和将电力连接器1016导电地耦合到物理资源1005的电力传输介质1024从外部源获得电力。
托架1004还可以包括双模光学网络接口电路1026。双模光学网络接口电路1026通常可以包括能够根据由图9的双模光学交换基础设施914支持的多个链路层协议中的每一个在光学信令介质上通信的电路。在一些实施例中，双模光学网络接口电路1026可以是能够进行以太网协议通信和根据第二、高性能协议的通信二者的。在各种实施例中，双模光学网络接口电路1026可以包括一个或多个光学收发器模块1027，所述光学收发器模块1027中的每一个可以是能够在一个或多个光学通道中的每一个上发送和接收光信号的。实施例在该上下文中不受限制。
将MPCM 1016与给定机架中的托架空间的配对MPCM相耦合可以使光学连接器1016A与包括在配对MPCM中的光学连接器相耦合。这通常可以经由光通道集1025中的每一个建立托架的光缆和双模光学网络接口电路1026之间的光学连接。双模光学网络接口电路1026可以经由电信令介质1028与托架1004的物理资源1005通信。除了用于提供改善的冷却并且使得能够以相对较高的热封套(例如，250W)操作的托架的尺寸和托架上的组件的布置，如以上参考图9描述的，在一些实施例中，托架还可以包括用于促进空气冷却的一个或多个另外的特征，例如被布置为消散由物理资源1005生成的热量的热管和/或散热器。值得注意的是，虽然图10描绘的示例性托架1004没有以扩展连接器为特征，但是根据一些实施例以托架1004的设计元素为特征的任何给定托架也可以以扩展连接器为特征。实施例在该上下文中不受限制。
图11示出了根据各种实施例的数据中心1100的示例，所述数据中心1100可以概括地表示在其中/针对其可以实现本文描述的一种或多种技术中的数据中心。如图11反映的，可以实现物理基础设施管理框架1150A以促进对数据中心1100的物理基础设施1100A的管理。在各种实施例中，物理基础设施管理框架1150A的一个功能可以是管理数据中心1100内的自动化维护功能，例如使用机器人维护装备来维护物理基础设施1100A内的计算装备。在一些实施例中，物理基础设施1100A可以以执行遥测报告的先进遥测系统为特征，所述先进遥测系统足够鲁棒以支持物理基础设施1100A的远程自动化管理。在各种实施例中，由这样的先进遥测系统提供的遥测信息可以支持诸如故障预测/预防能力和容量规划能力之类的特征。在一些实施例中，物理基础设施管理框架1150A还可以被配置为使用硬件证明技术来管理对物理基础设施组件的认证。例如，机器人可以通过分析从与要安装的每个组件相关联的射频识别(RFID)标签中收集的信息来在安装之前验证组件的真实性。实施例在该上下文中不受限制。
如图11所示，数据中心1100的物理基础设施1100A可以包括光学结构1112，其可以包括双模光学交换基础设施1114。光学结构1112和双模光学交换基础设施1114可以分别与图4的光学结构412和图5的双模光学交换基础设施514相同或相似，并且可以在数据中心1100的托架之间提供高带宽、低延时、多协议的连接。如以上讨论的，参考图1，在各种实施例中，这样的连接的可用性可以使得解聚并动态地池化诸如加速器、存储器和存储装置之类的资源变得可行。在一些实施例中，例如，数据中心1100的物理基础设施1100A之中可以包括一个或多个池化加速器托架1130，所述池化加速器托架1130中的每一个可以包括加速器资源池，例如协处理器和/或FPGA，所述加速器资源池例如是可由其他托架经由光学结构1112和双模光学交换基础设施1114全局访问的。
在另一示例中，在各种实施例中，数据中心1100的物理基础设施1100A之中可以包括一个或多个池化存储器托架1132，所述池化存储器托架1132中的每一个可以包括存储资源池，其是可由其他托架经由光学结构1112和双模光学交换基础设施1114全局访问的。在一些实施例中，这样的池化存储器托架1132可以包括诸如固态驱动器(SSD)之类的固态存储设备的池。在各种实施例中，可以在数据中心1100的物理基础设施1100A之中包括一个或多个高性能处理托架1134。在一些实施例中，高性能处理托架1134可以包括高性能处理器池以及增强空气冷却以产生高达250W或更高的较热封套的冷却特征。在各种实施例中，任何给定的高性能处理托架1134可以以扩展连接器1117为特征，所述扩展连接器1117可以接受远存储器扩展托架，以使得高性能处理托架1134本地可用的远存储器与包含在该托架上的处理器和近存储器解聚。在一些实施例中，这样的高性能处理托架1134可以被配置有使用包括低延时SSD存储装置的扩展托架的远存储器。光学基础设施允许一个托架上的计算资源利用解聚在位于相同机架或数据中心中的任何其他机架上的托架上的远程加速器/FPGA、存储器和/或SSD资源。在以上参考图5描述的脊叶网络架构中，远程资源可以相隔一个交换机跳或两个交换机跳地定位。实施例在该上下文中不受限制。
在各种实施例中，可以将一个或多个抽象层应用于物理基础设施1100A的物理资源，以便定义诸如软件定义的基础设施1100B之类的虚拟基础设施。在一些实施例中，软件定义的基础设施1100B的虚拟计算资源1136可以被分配以支持云服务1140的供应。在各种实施例中，可以将特定的虚拟计算资源集1136分组以便以SDA服务1138的形式向云服务1140供应。云服务1140的示例可以包括但不限于软件即服务(SaaS)服务1142、平台即服务(PaaS)服务1144以及基础设施即服务(IaaS)服务1146。
在一些实施例中，对软件定义的基础设施1100B的管理可以使用虚拟基础设施管理框架1150B来进行。在各种实施例中，虚拟基础设施管理框架1150B可以被设计为结合管理虚拟计算资源1136和/或SDI服务1138到云服务1140的分配来实现工作负载指纹识别技术和/或机器学习技术。在一些实施例中，虚拟基础设施管理框架1150B可以结合执行这样的资源分配来使用/查阅遥测数据。在各种实施例中，可以实现应用/服务管理框架1150C以便为云服务1140提供QoS管理能力。实施例在该上下文中不受限制。
现在参考图12和图13，在一些实施例中，托架204、404、504、704、1004中的每一个可以体现为托架1200。如以下更详细地讨论的，托架1200被配置为安装在数据中心100、300、400、1100的对应机架102、202、302、402、902中。在一些实施例中，托架1200可以被优化或者以其他方式配置以用于执行特定任务，例如计算任务、加速任务、数据存储任务等。例如，托架1200可以体现为计算托架1400(如以下关于图14-19讨论的)、加速器托架2000(如以下关于图20-24讨论的)、存储托架2500(如以下关于图25-29讨论的)或者体现为被优化或以其他方式配置以执行其他专门任务的托架。
示例性托架1200包括无底盘电路板基板1202，其支持安装在其上的各种电气组件。应当领会，电路板基板1202是“无底盘”的，这是因为托架1200不包括壳体或外壳。而是，无底盘电路板基板1202对本地环境开放。无底盘电路板基板1202可以由能够支持安装在其上的各种电气组件的任何材料形成。例如，在说明性实施例中，无底盘电路板基板1202由FR-4玻璃增强环氧树脂层压材料形成。当然，在其他实施例中，可以使用其他材料来形成无底盘电路板基板1202。
如以下更详细地讨论的，无底盘电路板基板1202包括多个特征，所述特征改善了安装在无底盘电路板基板1202上的各种电气组件的热冷却特性。如所讨论的，无底盘电路板基板1202不包括壳体或外壳，这可以通过减少可能抑制空气流动的那些结构来改善托架1200的电气组件上的气流。例如，因为无底盘电路板基板1202没有定位在个别的壳体或外壳中，所以没有到无底盘电路板基板1202的底板(例如，底盘的背板)，其可能抑制跨电气组件的空气流动。另外，无底盘电路板基板1202具有被配置为减少跨安装到无底盘电路板基板1202的电气组件的气流路径的长度的几何形状。例如，示例性无底盘电路板基板1202的宽度1204大于无底盘电路板基板1202的深度1206。在一个特定实施例中，例如，与宽度约为17英寸且深度约为39英寸的典型的服务器相比，无底盘电路板基板1202的宽度约为21英寸并且深度约为9英寸。如此，从无底盘电路板基板1202的前边缘1210朝向后边缘1212延伸的气流路径1208相对于典型服务器具有较短的距离，这可以改善托架1200的热冷却特性。此外，尽管未在图12中示出，但安装到无底盘电路板基板1202的各种电气组件安装在对应的位置中，以使得任何两个实质上产生热量的电气组件都不彼此遮蔽，如以下更详细地讨论的。换言之，在操作期间产生可观的热量(即，大于标称热量)的任何两个电气组件不在沿着气流路径1208的方向(即，沿着从无底盘电路板基板1202的前边缘1210朝向后边缘1212延伸的方向)上在直线上彼此对齐地安装到无底盘电路板基板1202。
说明性托架1200包括安装到无底盘电路板基板1202的顶侧1250的一个或多个物理资源1220。尽管图12中示出了两个物理资源1220，但是应当领会，在其他实施例中，托架1200可以包括一个、两个或更多个物理资源1220。物理资源1220可以体现为能够执行各种任务(例如，计算功能和/或控制托架1200的功能，这取决于例如托架1200的类型或预期的功能)的任何类型的处理器、控制器或其他计算电路。例如，如以下更详细地讨论的，物理资源1220可以在其中托架1200体现为计算托架的实施例中体现为高功率处理器，在其中托架1200体现为加速器托架的实施例中体现为加速器协处理器或电路，并且/或者在其中托架1200体现为存储托架的实施例中体现为存储控制器。
托架1200还包括安装到无底盘电路板基板1202的顶侧1250的一个或多个另外的物理资源1230。在说明性实施例中，另外的物理资源包括网络接口控制器(NIC)，如以下更详细地讨论的。当然，取决于托架1200的类型和功能，在其他实施例中，物理资源1230可以包括另外的或其他的电气组件、电路和/或设备。
物理资源1220经由输入/输出(I/O)子系统1222通信地耦合到物理资源1230。I/O子系统1222可以体现为电路和/或组件，其用于促进与物理资源1220、物理资源1230和/或托架1200的其他组件的输入/输出操作。例如，I/O子系统1222可以体现为或以其他方式包括存储器控制器集线器、输入/输出控制集线器、集成传感器集线器、固件设备、通信链路(例如，点对点链路、总线链路、电线、电缆、光导、印刷电路板迹线等)和/或用于促进输入/输出操作的其他组件和子系统。在说明性实施例中，I/O子系统1222体现为或以其他方式包括双倍数据速率4(DDR4)数据总线或DDR5数据总线。
在一些实施例中，托架1200还可以包括控制器到控制器互连1224。控制器到控制器互连1224可以体现为能够促进控制器到控制器通信的任何类型的通信互连。在说明性实施例中，控制器到控制器互连1224体现为高速点对点互连(例如，快于I/O子系统1222)。例如，控制器到控制器互连1224可以体现为QuickPath互连(QPI)、UltraPath互连(UPI)或专用于控制器到控制器通信的其他高速点对点互连。
托架1200还包括电力连接器1240，其被配置为当托架1200安装在对应的机架102、202、302、402中时与机架102、202、302、402、902的对应的电力连接器配对。托架1200经由电力连接器1240从机架102、202、302、402、902的电源接收电力，以向托架1200的各种电气组件供电。换言之，托架1200不包括用于向托架1200的电气组件提供电力的任何本地电源(即，板载电源)。排除本地或板载电源促进减少无底盘电路板基板1202的整体占用空间，这可以增加安装在无底盘电路板基板1202上的各种电气组件的热冷却特性，如以上讨论的。
除了缺少本地或板载电源之外，应当领会，示例性托架1200还不包括用于冷却托架1200的电气组件的本地或板载冷却系统。换言之，托架1200不包括板载风扇或其他有源冷却设备或系统。例如，虽然物理资源1220可以包括散热器或其他无源冷却设备，但物理资源1220的散热器不包括附接于其的风扇。另外，因为无底盘电路板基板1202不包括壳体或外壳，所以没有风扇或其他有源冷却系统连接到壳体，这在标准服务器中是典型的。而是，如以上讨论的，机架102、202、302、402、902包括风扇阵列，其操作以通过沿着气流路径1208拉动空气来冷却托架1200。
在一些实施例中，托架1200还可以包括安装特征1242，其被配置为与机器人的安装臂或其他结构配对，以促进由机器人将托架1200放置在机架102、202、302、402、902中。安装特征1242可以体现为允许机器人抓住托架1200而不损坏无底盘电路板基板1202或安装到其上的电气组件的任何类型的物理结构。例如，在一些实施例中，安装特征1242可以体现为附接到无底盘电路板基板1202的非导电垫。在其他实施例中，安装特征可以体现为支架、支座或附接到无底盘电路板基板1202的其他类似结构。安装特征1242的特定数量、形状、尺寸和/或构成可以取决于被配置为管理托架1200的机器人的设计。
现在参考图13，除了安装在无底盘电路板基板1202的顶侧1250上的物理资源1230之外，托架1200还包括安装到无底盘电路板基板1202的底侧1350的一个或多个存储器设备1320。换言之，无底盘电路板基板1202体现为双面电路板。物理资源1220经由I/O子系统1222通信地耦合到存储器设备1320。例如，物理资源1220和存储器设备1320可以通过延伸通过无底盘电路板基板1202的一个或多个通孔(via)通信地耦合。在一些实施例中，每个物理资源1220可以通信地耦合到不同的一个或多个存储器设备集1320。替代地，在其他实施例中，每个物理资源1220可以通信地耦合到每个存储器设备1320。
存储器设备1320可以体现为能够在托架1200的操作期间存储用于物理资源1220的数据的任何类型的存储器设备。例如，在说明性实施例中，存储器设备1320体现为双列直插式存储器模块(DIMM)，其可以支持DDR、DDR2、DDR3、DDR4或DDR5随机存取存储器(RAM)。当然，在其他实施例中，存储器设备1320可以利用其他存储器技术，包括易失性和/或非易失性存储器。例如，易失性存储器的类型可以包括但不限于数据速率同步动态RAM(DDRSDRAM)、静态随机存取存储器(SRAM)、晶闸管RAM(T-RAM)或零电容器RAM(Z-RAM)。非易失性存储器的类型可以包括字节或块可寻址类型的非易失性存储器。字节或块可寻址类型的非易失性存储器可以包括但不限于：3维(3-D)交叉点存储器、使用硫属化物相变材料(例如，硫属化物玻璃)的存储器、多门限级别NAND闪速存储器、NOR闪速存储器、单级或多级相变存储器(PCM)、电阻式存储器、纳米线存储器、铁电晶体管随机存取存储器(FeTRAM)、包括忆阻器技术的磁阻随机存取存储器(MRAM)存储器、或自旋转移扭矩MRAM(STT-MRAM)、或以上各项中的任何一项的组合、或其他非易失性存储器类型。
现在参考图14，在一些实施例中，托架1200可以体现为计算托架1400。计算托架1400被优化或以其他方式配置为执行计算任务。当然，如以上讨论的，计算托架1400可以依赖于其他托架(例如，加速托架和/或存储托架)来执行这样的计算任务。计算托架1400包括与托架1200的组件类似的各种组件，其已在图14中使用相同的附图标记标识。以上关于图12和图13提供的这样的组件的描述应用于计算托架1400的对应组件，并且为了清楚描述计算托架1400而在本文中不再重复。
在说明性计算托架1400中，物理资源1220体现为处理器1420。尽管在图14中仅示出了两个处理器1420，但是应当领会，在其他实施例中，计算托架1400可以包括另外的处理器1420。说明性地，处理器1420体现为高功率处理器1420，并且可以被配置为以相对高的额定功率操作。尽管以大于典型处理器的额定功率操作(其以大约155-230瓦操作)的处理器1420生成另外的热量，但是以上讨论的无底盘电路板基板1202的增强的热冷却特性促进更高功率的操作。例如，在说明性实施例中，处理器1420被配置为以至少250瓦的额定功率操作。在一些实施例中，处理器1420可以被配置为以至少350瓦的额定功率操作。
在一些实施例中，计算托架1400还可以包括处理器到处理器互连1442。类似于以上讨论的托架1200的控制器到控制器互连1224，处理器到处理器互连1442可以体现为能够促进处理器到处理器互连1442通信的任何类型的通信互连。在说明性实施例中，处理器到处理器互连1442体现为高速点对点互连(例如，快于I/O子系统1222)。例如，处理器到处理器互连1442可以体现为QuickPath互连(QPI)、UltraPath互连(UPI)或专用于处理器到处理器通信的其他高速点对点互连。
计算托架1400还包括通信电路1410。说明性通信电路1430包括网络接口控制器(NIC)1432，其还可以被称为主机结构接口(HFI)。NIC 1432可以体现为或以其他方式包括任何类型的集成电路、分立电路、控制器芯片、芯片组、内插板(add-in-board)、子卡、网络接口卡、可以由计算托架1400用于与另一计算设备连接(例如，与其他托架1200连接)的其他设备。在一些实施例中，NIC 1432可以体现为包括一个或多个处理器的片上系统(SoC)的部分，或者被包括在还包含一个或多个处理器的多芯片封装上。在一些实施例中，NIC 1432可以包括本地处理器(未示出)和/或本地存储器(未示出)，它们都在NIC 1432本地。在这样的实施例中，NIC 1432的本地处理器可以是能够执行处理器1420的功能中的一个或多个的。另外或替代地，在这样的实施例中，NIC 1432的本地存储器可以以板级、插口级、芯片级和/或其他级集成到计算托架的一个或多个组件中。
通信电路1430通信地耦合到光学数据连接器1434。光学数据连接器1434被配置为当计算托架1400安装在机架102、202、302、402、902中时与机架102、202、302、402、902的对应光学数据连接器1434配对。说明性地，光学数据连接器1434包括多个光纤，所述光纤从光学数据连接器1434的配对表面通向光学收发器1436。光学收发器1436被配置为将来自机架侧光学数据连接器的传入光信号转换为电信号，并且将电信号转换为去往机架侧光学数据连接器的传出光信号。尽管在说明性实施例中被示出为形成光学数据连接器1434的部分，但是在其他实施例中，光学收发器1436可以形成通信电路1430的一部分。
在一些实施例中，计算托架1400还可以包括扩展连接器1440。在这样的实施例中，扩展连接器1440被配置为与扩展无底盘的电路板基板的对应连接器配对，以向计算托架1400提供另外的物理资源。例如，在计算托架1400的操作期间，处理器1420可以使用另外的物理资源。扩展无底盘电路板基板可以与以上讨论的无底盘电路板基板1202基本类似，并且可以包括安装到其上的各种电气组件。安装到扩展无底盘电路板基板的特定电气组件可以取决于扩展无底盘电路板基板的预期功能。例如，扩展无底盘电路板基板可以提供另外的计算资源、存储器资源和/或存储资源。如此，扩展无底盘电路板基板的另外的物理资源可以包括但不限于处理器、存储器设备、存储设备和/或加速器电路，包括例如现场可编程门阵列(FPGA)、专用集成电路(ASIC)、安全协处理器、图形处理单元(GPU)、机器学习电路、或其他专用处理器、控制器、设备和/或电路。
现在参考图15-19，示出了计算托架1400的说明性实施例。、如图15、图17和图18所示，处理器1420、通信电路1430和光学数据连接器1434安装到无底盘电路板基板1202的顶侧1250。可以使用任何合适的附接或安装技术来将计算托架1400的电气组件安装到无底盘电路板基板1202。例如，各种组件可以安装在对应的插口(例如，处理器插口)、保持架(holder)或支架中。在一些情况下，电气组件中的一些可以经由焊接或类似技术直接安装到无底盘电路板基板1202。
如以上讨论的，个别处理器1420和通信电路1430安装到无底盘电路板基板1202的顶侧1250，以使得任何两个产生热量的电气组件都不彼此遮蔽。例如，如图17所示，处理器1420和通信电路1430安装在无底盘电路板基板1202的顶侧1250上的对应位置中，以使得这些电气组件中的任何两个都不沿着气流路径1208的方向在直线上与其它电气组件对齐。应当领会，尽管光学数据连接器1434与通信电路1430对齐，但光学数据连接器1434在操作期间不产生热量或产生标称热量。
如图16和图19所示，计算托架1400的存储器设备1320安装到无底盘电路板基板1202的底侧1350，如以上关于托架1200讨论的。尽管安装到底侧1350，存储器设备1320经由I/O子系统1222通信地耦合到位于顶侧1250上的处理器1420。因为无底盘电路板基板1202体现为双面电路板，所以存储器设备1320和处理器1420可以通过延伸通过无底盘电路板基板1202的一个或多个通孔来通信地耦合。当然，在一些实施例中，每个处理器1420都可以通信地耦合到不同的一个或多个存储器设备集1320。替代地，在其他实施例中，每个处理器1420可以通信地耦合到每个存储器设备1320。
如图19中最佳地示出的并且类似于处理器1420和通信电路1430，存储器设备1320安装到无底盘电路板基板1202的底侧1350，以使得任何两个存储器设备都不彼此遮蔽。换言之，存储器设备1320安装在无底盘电路板基板1202的底侧1350上的对应位置中，以使得存储器设备1320中的任何两个都不沿着气流路径1208的方向在直线上与另一存储器设备1320对齐。另外，在图19的说明性实施例中，存储器设备1320体现为双列直插式存储器模块(DIMM)并且安装到无底盘电路板基板1202的底侧1350，以使得存储器设备1320的纵向轴线1900与无底盘电路板基板1202基本上平行的侧边缘1902和气流路径1208。在该配置中，气流路径1208沿着DIMM存储器设备1320的长度行进，这可以改善存储器设备1320的冷却特性。
返回参考图17，处理器1420中的每一个都包括固定到其上的散热器1700。由于存储器设备1350安装到无底盘电路板基板1202的底侧1350(以及对应机架102、202、302、402、902中的托架1200的垂直间距)，因此无底盘电路板基板1202的顶侧1250包括另外的“自由”区域或空间，其促进使用相对于典型服务器中使用的传统散热器具有更大尺寸的散热器1700。换言之，散热器1700可以是相对于传统散热器尺寸过大的。例如，在图17的说明性实施例中，每个散热器1700具有基本上矩形的顶部轮廓形状，其具有长度1702。每个散热器1700的尺寸被设置为使得其长度1702大于无底盘电路板基板1202的宽度1204的四分之一宽度1704。另外，散热器1700的长度1702的总和大于无底盘电路板基板1202的宽度1204的一半宽度1706。当然，在其他实施例中，可以使用具有不同尺寸的散热器1700。另外，如以上讨论的，由于无底盘电路板基板1202的改善的热冷却特性，处理器散热器1700中的任何一个都不包括附接于其的冷却风扇。换言之，散热器1700中的每一个都体现为无风扇散热器。
现在参考图20，在一些实施例中，托架1200可以体现为加速器托架2000。加速器托架2000被优化或以其他方式配置为执行专门的计算任务，例如机器学习、加密、散列或其他计算密集型任务。在一些实施例中，例如，计算托架1400可以在操作期间将任务卸载到加速器托架2000。加速器托架2000包括类似于托架1200和/或计算托架1400的组件的各种组件，其已在图20中使用相同的附图标记标识。以上关于图12、图13和图14提供的这样的组件的描述应用于加速器托架2000的对应组件，并且为了清楚描述加速器托架2000而在本文中不再重复。
在说明性加速器托架2000中，物理资源1220体现为加速器电路2020。尽管在图20中仅示出了两个加速器电路2020，但是应当领会，在其他实施例中，加速器托架2000可以包括另外的加速器电路2020。例如，如图23所示，在一些实施例中，加速器托架2000可以包括四个加速器电路2020。加速器电路2020可以体现为能够执行计算或处理操作的任何类型的处理器、协处理器、计算电路或其他设备。例如，加速器电路2020可以体现为例如现场可编程门阵列(FPGA)、专用集成电路(ASIC)、安全协处理器、图形处理单元(GPU)、机器学习电路或其他专用处理器、控制器、设备和/或电路。
在一些实施例中，计算托架1400还可以包括加速器到加速器互连2042。类似于以上讨论的托架1200的控制器到控制器互连1224，加速器到加速器互连2042可以体现为能够促进加速器到加速器通信的任何类型的通信互连。在说明性实施例中，加速器到加速器互连2042体现为高速点对点互连(例如，快于I/O子系统1222)。例如，加速器到加速器互连2042可以体现为QuickPath互连(QPI)、UltraPath互连(UPI)或专用于处理器到处理器通信的其他高速点对点互连。
现在参考图21-24，示出了加速器托架2000的说明性实施例。如图21和图23所示，加速器电路2020、通信电路1430和光学数据连接器1434安装到无底盘电路板基板1202的顶侧1250。再次，如以上讨论的，可以使用任何合适的附接或安装技术来将加速器托架2000的电气组件安装到无底盘电路板基板1202，所述技术包括例如插口(例如，处理器插口)、保持架、支架、焊接连接和/或其他安装或固定技术。
如以上讨论的，个别加速器电路2020和通信电路1430安装到无底盘电路板基板1202的顶侧1250，以使得任何两个产生热量的电气组件都不彼此遮蔽。例如，如图23所示，加速器电路2020和通信电路1430安装在无底盘电路板基板1202的顶侧1250上的对应位置中，以使得那些电气组件中的任何两个都不沿着气流路径1208的方向在直线上与其他电气组件对齐。再次，应当领会，尽管光学数据连接器1434与通信电路1430对齐，但光学数据连接器1434在操作期间不产生热量或产生标称热量。
如图22和图24所示，加速器托架2000的存储器设备1320安装到无底盘电路板基板1202的底侧1350，如以上关于托架1200讨论的。虽然安装到底侧1350，但存储器设备1320经由I/O子系统1222通信地耦合到位于顶侧1250上的加速器电路2020。再次，因为无底盘电路板基板1202体现为双面电路板，所以存储器设备1320和加速器电路2020可以通过延伸通过无底盘电路板基板1202的一个或多个通孔通信地耦合。当然，在一些实施例中，每个加速器电路2020可以通信地耦合到不同的一个或多个存储器设备集1320。替代地，在其他实施例中，每个加速器电路2020可以通信地耦合到每个存储器设备1320。
如图24中最佳地示出的，并且类似于加速器电路2020和通信电路1430，加速器托架2000的存储器设备1320安装到无底盘电路板基板1202的底侧1350，以使得任何两个存储器设备1320都不彼此遮蔽。换言之，存储器设备1320安装在无底盘电路板基板1202的底侧1350上的对应位置中，以使得存储器设备1320中的任何两个沿着气流路径1208的方向与另一个线性地成一直线。另外，类似于计算托架1400，加速器托架2000的存储器设备1320在如图24所示的说明性实施例中体现为双列直插式存储器模块(DIMM)。DIMM存储器设备1320安装到无底盘电路板基板1202的底侧1350，以使得存储器设备1350的纵向轴线1900与无底盘电路板基板1202基本上平行的侧边缘1902和气流路径1208。
返回参考图23，加速器电路2020中的每一个都包括固定到其上的散热器2300。再次由于将存储器设备1350安装到无底盘电路板基板1202的底侧1350，无底盘电路板基板1202的顶侧1250包括另外的“自由”区域或空间，其促进使用相对于典型服务器中使用的传统散热器具有更大尺寸的散热器2300。换言之，相对于专用处理器、协处理器或类似电路的传统散热器，散热器2300可以尺寸过大。另外，如以上讨论的，由于无底盘电路板基板1202的改善的热冷却特性，散热器2300中的任何一个都不包括附接到其上的冷却风扇。换言之，散热器2300中的每一个都体现为无风扇散热器。
现在参考图25，在一些实施例中，托架1200可以体现为存储托架2500。存储托架2500被优化或以其他方式配置为将数据存储在存储托架2500本地的数据存储装置2550中。例如，在操作期间，计算托架1400或加速器托架2000可以存储和取回来自存储托架2500的数据存储装置2250的数据。存储托架2500包括类似于托架1200和/或计算托架1400的组件的各种组件，所述组件已经使用相同的附图标记在图25中标识。以上关于图12、图13和图14提供的这样的组件的描述应用于存储托架2500的对应组件，并且为了清楚描述存储托架2500而在本文中不再重复。
在说明性存储托架2500中，物理资源1220体现为存储控制器2520。尽管在图25中仅示出了两个存储控制器2520，但是应当领会，在其他实施例中，存储托架2500可以包括另外的存储控制器2520。存储控制器2520可以体现为能够基于经由通信电路1430接收的请求来控制将数据存储和取回到数据存储装置2550中的任何类型的处理器、控制器或控制电路。在说明性实施例中，存储控制器2520体现为相对低功率的处理器或控制器。例如，在一些实施例中，存储控制器2520可以被配置为以大约75瓦的额定功率操作。
在一些实施例中，计算托架1400还可以包括控制器到控制器2542。类似于以上讨论的托架1200的控制器到控制器互连1224，控制器到控制器2542可以体现为能够促进控制器到控制器的通信的任何类型的通信互连。在说明性实施例中，控制器到控制器2542体现为高速点对点互连(例如，快于I/O子系统1222)。例如，控制器到控制器2542可以体现为QuickPath互连(QPI)、UltraPath互连(UPI)或专用于处理器到处理器通信的其他高速点对点互连。
现在参考图21-24，示出了存储托架2500的说明性实施例。在说明性实施例中，数据存储装置2550体现为或以其他方式包括存储笼2552，所述存储笼2552被配置为容纳一个或多个固态驱动器(SSD)2554。为此，存储笼2552包括多个安装槽2556，所述安装槽2556中的每一个都被配置为接收对应的固态驱动器2554。安装槽2556中的每一个都包括多个驱动引导件2558，其合作以定义对应安装槽2556的访问开口2560。存储笼2552被固定到无底盘电路板基板1202，以使得访问开口背对无底盘电路板基板1202(即，朝向无底盘电路板基板1202前方)。如此，当存储托架2500安装在对应的机架102、202、302、402、902中时，固态驱动器2554是可访问的。例如，固态驱动器2554可以从机架102、202、302、402、902换出(例如，经由机器人)，同时存储托架2500保持安装在对应的机架102、202、302、402、902中。
存储笼2552说明性地包括十六个安装槽2556并且能够安装和存储十六个固态驱动器2554。当然，存储笼2552可以被配置为在其他实施例中存储另外或更少的固态驱动器2554。另外，在说明性实施例中，固态驱动器垂直安装在存储笼2552中，但是在其他实施例中可以以不同的朝向安装在存储笼2552中。每个固态驱动器2554可以体现为能够存储长期数据的任何类型的数据存储设备。为此，固态驱动器2554可以包括易失性和非易失性存储器设备。例如，易失性存储器的类型可以包括但不限于数据速率同步动态RAM(DDR SDRAM)、静态随机存取存储器(SRAM)、晶闸管RAM(T-RAM)或零电容器RAM(Z-RAM)。非易失性存储器的类型可以包括字节或块可寻址类型的非易失性存储器。字节或块可寻址类型的非易失性存储器可以包括但不限于3维(3-D)交叉点存储器、使用硫属化物相变材料(例如，硫属化物玻璃)的存储器、多门限级别NAND闪速存储器、NOR闪速存储器、单级或多级相变存储器(PCM)、电阻式存储器、纳米线存储器、铁电晶体管随机存取存储器(FeTRAM)、包括忆阻器技术的磁阻随机存取存储器(MRAM)存储器、或自旋转移力矩MRAM(STT-MRAM)、或以上各项中的任何一项的组合、或其他非易失性存储器类型。
如图26和图28所示，存储控制器2520、通信电路1430和光学数据连接器1434安装到无底盘电路板基板1202的顶侧1250。再次，如以上讨论的，任何合适的附接或安装技术可以用于将存储托架2500的电气组件安装到无底盘电路板基板1202，所述技术包括例如插口(例如，处理器插口)、保持架、支架、焊接连接和/或其他安装或固定技术。
如以上讨论的，个别存储控制器2520和通信电路1430安装到无底盘电路板基板1202的顶侧1250，以使得任何两个产生热量的电气组件都不彼此遮蔽。例如，如图28所示，存储控制器2520和通信电路1430安装在无底盘电路板基板1202的顶侧1250上的对应位置中，以使得这些电气组件中任何两个都不沿着气流路径1208的方向在直线上与另一电气组件对齐。再次，应当领会，尽管光学数据连接器1434与通信电路1430对齐，但光学数据连接器1434在操作期间不产生热量或产生标称热量。
如图27和图29所示，存储托架2500的存储器设备1320安装到无底盘电路板基板1202的底侧1350，如以上关于托架1200讨论的。尽管安装到底侧1350，但存储器设备1320经由I/O子系统1222通信地耦合到位于顶侧1250上的存储控制器2520。再次，因为无底盘电路板基板1202体现为双面电路板，所以存储器设备1320和存储控制器2520可以通过延伸通过无底盘电路板基板1202的一个或多个通孔来通信地耦合。当然，在一些实施例中，每个存储控制器2520可以通信地耦合到不同的一个或多个存储器设备集1320。替代地，在其他实施例中，每个存储控制器2520可以通信地耦合到每个存储器设备1320。
如图29中最佳地示出的并且类似于存储控制器2520和通信电路1430，存储托架2500的存储器设备1320安装到无底盘电路板基板1202的底侧1350，以使得任何两个存储器设备1320都不彼此遮蔽。换言之，存储器设备1320安装在无底盘电路板基板1202的底侧1350上的对应位置中，以使得存储器设备1320中的任何两个都不沿着气流路径1208的方向与另一存储器设备在直线上对齐。另外，类似于计算托架1400，存储托架2500的存储器设备1320在说明性实施例中体现为双列直插式存储器模块(DIMM)，如图24所示的。DIMM存储器设备1320安装到无底盘电路板基板1202的底侧1350，以使得存储器设备1350的纵向轴线1900与无底盘电路板基板1202基本上平行的侧边缘1902和气流路径1208。
返回参考图28，存储控制器2520中的每一个包括固定到其上的散热器2800。如以上讨论的，由于存储托架2500的无底盘电路板基板1202的改善的热冷却特性，散热器2800中的任何一个都不包括附接到其上的冷却风扇。换言之，散热器2800中的每一个都体现为无风扇散热器。
应当领会，各种托架1200、1400、2000、2500可以具有与本文在其他实施例中描述的说明性实施例不同的配置和拓扑。因此，应当领会，图12、图13、图14、图20和图25所示的组件图仅是对应托架的说明性逻辑表示，而不是限制性的。例如，虽然托架1200、1400、2000、2500的特定组件已经描述为安装在无底盘电路板基板1202的顶侧1250或底侧1350上，但是在其他实施例中，这样的组件可以安装在无底盘电路板基板1202的另一侧上。
示例
以下提供了本文公开的技术的说明性示例。这些技术的实施例可以包括以下描述的示例中的任何一个或多个以及所述示例的任何组合。
示例1包括一种用于数据中心的机架中的操作的托架，所述托架包括：无底盘电路板基板，其具有顶侧和与所述顶侧相对的底侧；一个或多个物理资源，其耦合到所述无底盘电路板基板的所述顶侧；以及一个或多个存储器设备，其耦合到所述无底盘电路板基板的所述底侧，其中，所述一个或多个存储器设备中的每一个电耦合到所述一个或多个物理资源中的至少一个。
示例2包括示例1的主题，并且其中，所述无底盘电路板基板由FR-4材料形成。
示例3包括示例1和2中任一项的主题，并且其中，所述无底盘电路板基板暴露于所述本地环境。
示例4包括示例1-3中任一项的主题，并且其中，所述无底盘电路板不包括背板。
示例5包括示例1-4中任一项的主题，并且其中，所述无底盘电路板不包括用于在所述服务器托架的操作期间冷却所述一个或多个物理资源或所述一个或多个存储器设备的主动冷却系统。
示例6包括示例1-5中任一项的主题，并且还包括多个电气组件，包括所述一个或多个物理资源和所述一个或多个存储器设备，其中，在所述托架的操作期间所述托架的任何电气组件都不由所述托架的主动冷却系统进行冷却。
示例7包括示例1-6中任一项的主题，并且其中，所述无底盘电路板基板不包括用于向所述一个或多个物理资源或所述一个或多个存储器设备供电的电源。
示例8包括示例1-7中任一项的主题，并且还包括电力连接器，其用于与所述机架的对应电力连接器配对，以向所述托架的所述电气组件提供电力。
示例9包括示例1-8中任一项的主题，并且还包括多个电气组件，包括所述一个或多个物理资源和所述一个或多个存储器设备，其耦合到所述无底盘电路板基板，其中，所述托架的任何电气组件都不在所述托架的操作期间从所述托架的电源接收电力。
示例10包括示例1-9中任一项的主题，并且还包括多个电气组件，包括所述一个或多个物理资源和所述一个或多个存储器设备，其耦合到所述无底盘电路板基板，其中，所述多个电气组件中的在操作期间产生非标称热量的任何两个电气组件都不在沿着从所述无底盘电路板基板的前边缘延伸到所述无底盘电路板基板的后边缘的方向上彼此遮蔽。
示例11包括示例1-10中任一项的主题，并且其中，所述无底盘电路板基板具有矩形形状，所述矩形形状具有宽度和深度，并且所述无底盘电路板基板的所述宽度大于所述无底盘电路板的所述深度。
实施例12包括实施例1-11中任一项的主题，并且其中，所述宽度约为二十一英寸并且所述深度约为九英寸。
示例13包括示例1-12中任一项的主题，并且还包括网络接口控制器，其耦合到所述无底盘电路板基板的所述顶侧。
示例14包括示例1-13中任一项的主题，并且其中，所述网络接口控制器包括光学通信器。
示例15包括示例1-14中任一项的主题，并且还包括固定到所述无底盘电路板基板的所述顶侧的光学数据连接器，其中，所述光学数据连接器用于与所述机架的对应光学数据连接器配对并且电耦合到所述网络接口控制器。
示例16包括示例1-15中任一项的主题，并且还包括(i)固定到所述无底盘电路板基板的所述顶侧的第一扩展连接器以及(ii)具有与所述第一扩展连接器配对的第二扩展连接器的扩展无底盘电路板基板，其中，所述扩展无底盘电路板基板包括可由所述无底盘电路板基板的托架控制器使用的一个或多个物理资源。
示例17包括示例1-16中任一项的主题，并且其中，所述扩展无底盘电路板基板的所述一个或多个物理资源包括存储器。
示例18包括示例1-17中任一项的主题，并且其中，所述扩展无底盘电路板基板的所述一个或多个物理资源包括加速器电路。
示例19包括示例1-18中任一项的主题，并且其中，所述加速器电路包括以下各项中的一项：现场可编程门阵列、专用集成电路、安全协处理器、图形处理单元、机器学习电路、或专用处理器。
示例20包括示例1-19中任一项的主题，并且其中，无底盘电路板基板还包括一个或多个安装特征件，其用于与机器人的安装臂配对以允许将所述托架自动安装到所述机架中。
示例21包括示例1-20中任一项的主题，并且其中，所述一个或多个物理资源包括两个或更多个处理器，并且每个处理器以至少250瓦的额定功率操作。
示例22包括示例1-21中任一项的主题，并且其中，每个处理器以至少350瓦的额定功率操作。
示例23包括示例1-22中任一项的主题，并且还包括耦合到每个处理器的散热器，其中，每个散热器具有宽度并且所述散热器的所述宽度的总和大于所述无底盘电路板基板的所述宽度的一半。
示例24包括示例1-23中任一项的主题，并且还包括耦合到每个处理器的散热器，其中，每个散热器的宽度大于所述无底盘电路板基板的宽度的四分之一。
示例25包括示例1-24中任一项的主题，并且其中，还包括耦合到每个处理器的无风扇散热器。
示例26包括示例1-25中任一项的主题，并且其中，所述一个或多个存储器设备包括双列直插式存储器模块，其具有与所述无底盘电路板基板的侧边缘平行的纵向轴线。
示例27包括示例1-26中任一项的主题，并且还包括处理器到处理器互连，其中，每个处理器通信地耦合到所述处理器到处理器互连以与每个其他处理器通信。
示例28包括示例1-27中任一项的主题，并且其中，每个托架控制器是加速器电路。
示例29包括示例1-28中任一项的主题，并且其中，每个加速器电路包括以下各项中的一项：现场可编程门阵列、专用集成电路、安全协处理器、图形处理单元、机器学习电路或专用处理器。
示例30包括示例1-29中任一项的主题，并且其中，所述一个或多个物理资源包括四个或更多个加速器电路。
示例31包括示例1-30中任一项的主题，并且还包括固定到所述无底盘电路板基板的存储笼和多个固态驱动器，其中，所述存储笼包括多个安装槽，并且每个固态驱动器固定在所述存储笼的对应安装槽中。
示例32包括示例1-31中任一项的主题，并且其中，每个安装槽包括多个驱动引导件，所述多个驱动引导件合作以定义对应槽的访问开口，并且其中，每个访问开口背对所述无底盘电路板基板。
示例33包括示例1-32中任一项的主题，并且其中，每个固态驱动器以垂直朝向固定在所述对应安装槽中。
示例34包括示例1-33中任一项的主题，并且其中，存储笼包括十六个安装槽。
示例35包括示例1-34中任一项的主题，并且其中，每个托架控制器包括存储控制器，其用于控制对所述多个固态驱动器中的数据的存储和取回。
示例36包括示例1-35中任一项的主题，并且其中，每个存储控制器包括将以大约75瓦的额定功率操作的处理器。
示例37包括示例1-36中任一项的主题，并且还包括控制器到控制器互连，其中，每个存储控制器通信地耦合到所述控制器到控制器互连以与每个其他服务器控制器通信。
示例38包括一种用于数据中心的机架中的操作的计算托架，所述计算托架包括：无底盘电路板基板，其具有顶侧和与所述顶侧相对的底侧；多个处理器，其耦合到所述无底盘电路板基板的所述顶侧；以及多个存储器设备，其耦合到所述无底盘电路板基板的所述底侧，其中，所述多个存储器设备中的每一个电耦合到所述多个处理器中的至少一个。
示例39包括示例38的主题，并且其中，每个处理器以至少350瓦的额定功率操作。
示例40包括示例38和39中任一项的主题，并且还包括耦合到每个处理器的散热器，其中，每个散热器具有宽度，并且所述散热器的所述宽度的总和大于所述无底盘电路板基板的宽度的一半。
示例41包括示例38-40中任一项的主题，并且还包括耦合到每个处理器的散热器，其中，每个散热器的宽度大于所述无底盘电路板基板的宽度的四分之一。
示例42包括示例38-41中任一项的主题，并且其中，还包括耦合到每个处理器的无风扇散热器。
示例43包括示例38-42中任一项的主题，并且其中，所述多个存储器设备包括双列直插式存储器模块，其具有与所述无底盘电路板基板的侧边缘平行的纵向轴线。
示例44包括示例38-43中任一项的主题，并且还包括处理器到处理器互连，其中，每个处理器通信地耦合到处理器到处理器互连以与每个其他处理器通信。
示例45包括示例38-44中任一项的主题，并且还包括多个电气组件，包括所述多个处理器和所述多个存储器设备，其耦合到所述无底盘电路板基板，其中，所述多个电气组件中的在操作期间产生非标称热量的任何两个电气组件都不在沿着从所述无底盘电路板基板的前边缘延伸到所述无底盘电路板基板的后边缘的方向上彼此遮蔽。
示例46包括示例38-45中任一项的主题，并且还包括(i)固定到所述无底盘电路板基板的所述顶侧的第一扩展连接器以及(ii)具有与所述第一扩展连接器配对的第二扩展连接器的扩展无底盘电路板基板，其中，所述扩展无底盘电路板基板包括可由所述无底盘电路板基板的托架控制器使用的一个或多个物理资源。
示例47包括示例38-46中任一项的主题，并且其中，所述扩展无底盘电路板基板的所述一个或多个物理资源包括存储器或加速器电路。
示例48包括一种用于数据中心的机架中的操作的加速器托架，所述加速器托架包括：无底盘电路板基板，其具有顶侧和与所述顶侧相对的底侧；多个加速器电路，其耦合到所述无底盘电路板基板的所述顶侧；以及多个存储器设备，其耦合到所述无底盘电路板基板的所述底侧，其中，所述多个存储器设备中的每一个电耦合到所述多个加速器电路中的至少一个。
示例49包括示例48的主题，并且其中，每个加速器电路包括以下各项中的一项：现场可编程门阵列、专用集成电路、安全协处理器、图形处理单元、机器学习电路、或专用处理器。
示例50包括示例48和49中任一项的主题，并且其中，多个物理资源包括四个或更多个加速器电路。
示例51包括示例48-50中任一项的主题，并且其中，还包括耦合到每个加速器电路的无风扇散热器。
示例52包括示例48-51中任一项的主题，并且还包括多个电气组件，包括多个物理资源和所述多个存储器设备，其耦合到所述无底盘电路板基板，其中，所述多个电气组件中的在操作期间产生非标称热量的任何两个电气组件都不在沿着从所述无底盘电路板基板的前边缘延伸到所述无底盘电路板基板的后边缘的方向上彼此遮蔽。
示例53包括一种用于数据中心的机架中的操作的存储托架，所述存储托架包括：无底盘电路板基板，其具有顶侧和与所述顶侧相对的底侧；固定在所述无底盘电路板基板上的存储笼和多个固态驱动器，其中，所述存储笼包括多个安装槽，并且每个固态驱动器固定在所述存储笼的对应安装槽中；一个或多个存储控制器，其耦合到所述无底盘电路板基板的所述顶侧，其中，所述一个或多个存储控制器控制对所述多个固态驱动器中的数据的存储和取回；以及一个或多个存储器设备，其耦合到所述无底盘电路板基板的所述底侧，其中，所述一个或多个存储器设备中的每一个电耦合到所述一个或多个存储控制器中的至少一个，以在所述存储托架的操作期间存储用于对应存储控制器的数据。
示例54包括示例53的主题，并且其中，每个安装槽包括多个驱动引导件，其合作以定义对应槽的访问开口，并且其中，每个访问开口背对所述无底盘电路板基板。
示例55包括示例53和54中任一项的主题，并且其中，每个固态驱动器以垂直朝向固定在对应安装槽中。
实施例56包括实施例53-55中任一项的主题，并且其中，储存笼包括十六个安装槽。
示例57包括示例53-56中任一项的主题，并且其中，每个存储控制器包括将以大约70瓦的额定功率操作的处理器。
示例58包括示例53-57中任一项的主题，并且还包括控制器到控制器互连，其中，每个存储控制器通信地耦合到控制器到控制器互连以与每个其它存储控制器通信。
示例59包括示例53-58中任一项的主题，并且还包括多个电气组件，包括所述一个或多个存储控制器和所述一个或多个存储器设备，其耦合到所述无底盘电路板基板，其中，所述多个电气组件中的在操作期间产生非标称热量的任何两个电气组件都不在沿着从所述无底盘电路板基板的前边缘延伸到所述无底盘电路板基板的后边缘的方向上彼此遮蔽。

Claims (25)

1.一种用于数据中心的机架中的操作的托架，所述托架包括：
无底盘电路板基板，其具有顶侧和与所述顶侧相对的底侧；
一个或多个物理资源，其耦合到所述无底盘电路板基板的所述顶侧；以及
一个或多个存储器设备，其耦合到所述无底盘电路板基板的所述底侧，其中，所述一个或多个存储器设备中的每一个电耦合到所述一个或多个物理资源中的至少一个。
2.如权利要求1所述的托架，其中，所述无底盘电路板基板暴露于所述本地环境。
3.如权利要求1所述的托架，还包括多个电气组件，包括所述一个或多个物理资源和所述一个或多个存储器设备，其耦合到所述无底盘电路板基板，其中，在所述托架的操作期间所述托架的任何电气组件都不由所述托架的主动冷却系统进行冷却。
4.如权利要求3所述的托架，还包括电力连接器，其用于与所述机架的对应电力连接器配对，以向所述托架的所述电气组件提供电力。
5.如权利要求1所述的托架，还包括多个电气组件，包括所述一个或多个物理资源和所述一个或多个存储器设备，其耦合到所述无底盘电路板基板，其中，在所述托架的操作期间所述托架的任何电气组件都不从所述托架的电源接收电力。
6.如权利要求1所述的托架，还包括多个电气组件，包括所述一个或多个物理资源和所述一个或多个存储器设备，其耦合到所述无底盘电路板基板，其中，所述多个电气组件中的在操作期间产生非标称热量的任何两个电气组件都不在沿着从所述无底盘电路板基板的前边缘延伸到所述无底盘电路板基板的后边缘的方向上彼此遮蔽。
7.如权利要求1所述的托架，其中，所述无底盘电路板基板具有矩形形状，所述矩形形状具有宽度和深度，并且所述无底盘电路板基板的所述宽度大于所述无底盘电路板的所述深度。
8.如权利要求7所述的托架，其中，所述宽度约为二十一英寸并且所述深度约为九英寸。
9.如权利要求1所述的托架，还包括网络接口控制器，其耦合到所述无底盘电路板基板的所述顶侧。
10.如权利要求9所述的托架，还包括固定到所述无底盘电路板基板的所述顶侧的光学数据连接器，其中，所述光学数据连接器用于与所述机架的对应光学数据连接器配对并且电耦合到所述网络接口控制器。
11.如权利要求1所述的托架，还包括(i)固定到所述无底盘电路板基板的所述顶侧的第一扩展连接器以及(ii)具有与所述第一扩展连接器配对的第二扩展连接器的扩展无底盘电路板基板，其中，所述扩展无底盘电路板基板包括可由所述无底盘电路板基板的托架控制器使用的一个或多个物理资源。
12.如权利要求1所述的托架，其中，无底盘电路板基板还包括一个或多个安装特征件，其用于与机器人的安装臂配对以允许将所述托架自动安装到所述机架中。
13.如权利要求1所述的托架，其中，所述一个或多个存储器设备包括双列直插式存储器模块，其具有与所述无底盘电路板基板的侧边缘平行的纵向轴线。
14.如权利要求1所述的托架，还包括控制器到控制器互连，其中，每个服务器控制器通信地耦合到所述控制器到控制器互连以与每个其他服务器控制器通信。
15.一种用于数据中心的机架中的操作的计算托架，所述计算托架包括：
无底盘电路板基板，其具有顶侧和与所述顶侧相对的底侧；
多个处理器，其耦合到所述无底盘电路板基板的所述顶侧；以及
多个存储器设备，其耦合到所述无底盘电路板基板的所述底侧，其中，所述多个存储器设备中的每一个电耦合到所述多个处理器中的至少一个。
16.如权利要求15所述的计算托架，还包括耦合到每个处理器的散热器，其中，每个散热器具有宽度，并且所述散热器的所述宽度的总和大于所述无底盘电路板基板的宽度的一半。
17.如权利要求15所述的计算托架，其中，还包括耦合到每个处理器的无风扇散热器。
18.如权利要求15所述的计算托架，其中，所述多个存储器设备包括双列直插式存储器模块，其具有与所述无底盘电路板基板的侧边缘平行的纵向轴线。
19.如权利要求15所述的计算托架，还包括多个电气组件，包括所述多个处理器和所述多个存储器设备，其耦合到所述无底盘电路板基板，其中，所述多个电气组件中的在操作期间产生非标称热量的任何两个电气组件都不在沿着从所述无底盘电路板基板的前边缘延伸到所述无底盘电路板基板的后边缘的方向上彼此遮蔽。
20.一种用于数据中心的机架中的操作的加速器托架，所述加速器托架包括：
无底盘电路板基板，其具有顶侧和与所述顶侧相对的底侧；
多个加速器电路，其耦合到所述无底盘电路板基板的所述顶侧；以及
多个存储器设备，其耦合到所述无底盘电路板基板的所述底侧，其中，所述多个存储器设备中的每一个电耦合到所述多个加速器电路中的至少一个。
21.如权利要求20所述的加速器托架，其中，还包括耦合到每个加速器电路的无风扇散热器。
22.如权利要求20所述的加速器托架，还包括多个电气组件，包括多个处理器和所述多个存储器设备，其耦合到所述无底盘电路板基板，其中，所述多个电气组件中的在操作期间产生非标称热量的任何两个电气组件都不在沿着从所述无底盘电路板基板的前边缘延伸到所述无底盘电路板基板的后边缘的方向上彼此遮蔽。
23.一种用于数据中心的机架中的操作的存储托架，所述存储托架包括：
无底盘电路板基板，其具有顶侧和与所述顶侧相对的底侧；
固定在所述无底盘电路板基板上的存储笼和多个固态驱动器，其中，所述存储笼包括多个安装槽，并且每个固态驱动器固定在所述存储笼的对应安装槽中；
一个或多个存储控制器，其耦合到所述无底盘电路板基板的所述顶侧，其中，所述一个或多个存储控制器控制对所述多个固态驱动器中的数据的存储和取回；以及
一个或多个存储器设备，其耦合到所述无底盘电路板基板的所述底侧，其中，所述一个或多个存储器设备中的每一个电耦合到所述一个或多个存储控制器中的至少一个。
24.如权利要求23所述的存储托架，其中，每个安装槽包括多个驱动引导件，其合作以定义对应槽的访问开口，并且其中，每个访问开口背对所述无底盘电路板基板。
25.如权利要求23所述的存储托架，还包括多个电气组件，包括所述一个或多个存储控制器和所述一个或多个存储器设备，其耦合到所述无底盘电路板基板，其中，所述多个电气组件中的在操作期间产生非标称热量的任何两个电气组件都不在沿着从所述无底盘电路板基板的前边缘延伸到所述无底盘电路板基板的后边缘的方向上彼此遮蔽。
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