CN109416561A - 用于数据中心计算滑板的存储器模块 - Google Patents
用于数据中心计算滑板的存储器模块 Download PDFInfo
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- CN109416561A CN109416561A CN201780038843.2A CN201780038843A CN109416561A CN 109416561 A CN109416561 A CN 109416561A CN 201780038843 A CN201780038843 A CN 201780038843A CN 109416561 A CN109416561 A CN 109416561A
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Abstract
示例可以包括用于包括物理计算资源的数据中心的机架的滑板。滑板包括处理器组件和单一存储器模块,该单一存储器模块包括存储器控制器和基于处理器组件的一些存储器。单一存储器模块能包括基于单一存储器模块以通信方式耦合到的处理器组件的核的数量的一些存储器。
Description
相关申请
本申请要求先前提交的2016年12月30日提交的美国专利申请序列号15/395,988的权益和优先权,该申请要求如下临时专利申请的权益:2016年11月29日提交的并指配了序列号62/427,268的标题为“Framework and Techniques for Pools of ConfigurableComputing Resources”的美国临时专利申请;2016年8月18日提交的并指配了序列号62/376,859的标题为“Scalable System Framework Prime(SSFP)Omnibus Provisional II”的美国临时专利申请;以及2016年7月22日提交的并指配了序列号62/365,969的标题为“Framework and Techniques for Pools of Configurable Computing Resources”的美国临时专利申请。上述申请全都由此通过引用以其整体结合在本文中。
技术领域
本文描述的示例通常涉及数据中心,并且具体地说,涉及包括数据中心中的物理计算资源的计算滑板。
背景技术
连网中的进步已经能够实现可配置计算资源池中的上升。可配置计算资源池可以由包括解聚物理资源的物理基础设施形成,例如,如在大型数据中心中发现的那样。物理基础设施能包括具有处理器、存储器、存储装置、连网、功率、冷却等的多个资源。这些数据中心的管理实体能聚合资源选择以形成服务器和/或计算主机。这些主机随后能被分配成执行和/或托管系统SW(例如,OS、VM、容器、应用等)。物理资源包括处理器,这些处理器经常与存储器一起安置在单个滑板上。本公开针对包括处理器和存储器的此类滑板。
附图说明
图1图示了第一示例数据中心。
图2图示了数据中心的第一示例机架。
图3图示了第二示例机架。
图4图示了第三示例机架。
图5图示了第一示例滑板。
图6图示了第二示例滑板。
图7图示了第三示例滑板。
图8A-8C图示了第四示例滑板的部分。
图9图示了第五示例滑板。
图10图示了第二示例数据中心。
具体实施方式
数据中心通常可以由大量机架组成,这些机架能包含许多类型的硬件或可配置资源(例如,处理单元、存储器、存储装置、加速器、连网、风扇/冷却模块、功率单元等)。在数据中心中部署的硬件或可配置资源的类型也可以被称为物理资源或解聚元件。要认识到,数据中心内的物理资源的大小和数量可以很大,例如,大约几十万的物理资源。而且,这些物理资源能被池化以形成用于大量和各种计算任务的虚拟计算平台。
这些物理资源经常被布置在数据中心内的机架中。本公开提供了布置成安放多个滑板的机架,其中每个滑板能安置多个物理资源。数据中心中的一些滑板能安置处理器组件,诸如中央处理单元(CPU)等。此类处理组件通常与存储器资源成对。例如,CPU能与存储器成对以促进操作(例如,执行指令,执行处理操作等)。要指出,用于与滑板上的处理组件成对的理想数量或量的存储器能取决于数据中心实现以及处理组件的特性,例如,处理核的数量。本公开提供了用于与滑板的处理器组件成对的具有具体数量的存储器的存储器模块。
现在参考附图,其中相似的引用标记通篇用于指的是相似的元件。在如下描述中,为了解释的目的,阐述了众多特定细节以便提供对其的透彻理解。然而,可以显然的是新颖的实施例能在没有这些特定细节的情况下被实践。在其它实例中,众所周知的结构和装置以框图形式被示出,以便促进其描述。意图是提供透彻描述使得充分描述在权利要求书的范围内的所有修改、等效方案和备选。
附加地,可以对变量进行参考,诸如“a”、“b”、“c”,它们用于标示可以实现多于一个组件的组件。重要的是要指出,不一定需要多个组件,并且进一步说,在实现多个组件的情况下,它们不必完全相同。相反,为了呈现的便捷和清晰起见,使用变量来引用附图中的组件。
图1图示了数据中心100的概念概述,数据中心100一般可代表在其中/对于其可根据各种实施例实现本文描述的一种或更多种技术的数据中心或其它类型的计算网络。如此图中所示的,数据中心100一般可包含多个机架,每一个机架都可以安置包括物理资源的相应集合的计算设备。在此图中描绘的具体非限制示例中,数据中心100包含两个机架102A至102B。这两个机架102A至102B中的每个一般都可安置多个滑板。如此图中所示,机架102A至102B中的每个分别包含四个滑板104A-1至104A-4和104B-1至104B-4。所描绘的滑板和机架安置包括物理资源105A/B的相应集合的计算设备。具体地说,描绘了物理资源105A-1至105A-4和105B-1至105B-4。数据中心100的物理资源106的聚合集合包括分布在机架102A至102B之间的物理资源105(例如,105A-1至105A-4和105B-1至105B-4)的各种集合。
物理资源106可以包括多种类型的资源,诸如例如处理器、协处理器、加速器、现场可编程门阵列(FPGA)、存储器和存储装置。实施例不限于这些示例。在此具体非限制性示例中,物理资源105A从而可以由安置在机架102A中的物理资源的相应集合构成,其包括在机架102A的滑板104A-1至104A-4中包括的物理存储资源105A-1、物理加速器资源105A-2、物理存储器资源105A和物理计算资源105A-4。在一些实现中,机架可以包括多个相似的物理资源。例如,描绘了机架102B,其包括安置在机架102B的滑板104B-1至104B-4的每一个滑板中的物理计算资源。更确切地说,滑板104B-1至104B-4分别安置物理计算资源105B-1、物理计算资源105B-2、物理计算资源105B-3和物理计算资源105B-4。
要指出,实施例不限于此示例。而且,每个滑板可包含各种类型的物理资源(例如,计算、存储器、加速器、存储装置)中的每种的池。通过让机器人可访问和机器人可操纵的滑板包括解聚资源,每种类型的资源都能彼此独立地并且以它们自己的优化刷新率升级。
说明性数据中心100在许多方面不同于典型的数据中心。例如,在说明性实施例中,在其上放置组件(诸如CPU、存储器和其它组件)的电路板(“滑板”)被设计用于提高热性能。具体地说,在说明性实施例中,滑板比典型板更浅。换言之,滑板从前到后缩短,冷却风扇位于其中。这减小了空气必须穿过板上组件的路径的长度。另外,滑板上的组件比在典型电路板中的间隔得更远,并且这些组件被布置成降低或消除遮挡(即一个组件在另一组件的空气流动路径中)。在说明性实施例中,诸如处理器的处理组件位于滑板的顶侧上,而存储器(例如,本文描绘的单一存储器模块(参考图6-7和图8A-8C))位于滑板的底侧上。作为由此类设计提供的增强气流的结果,至少一些组件可以操作在比在典型系统中更高的频率和功率级下,由此增大性能。而且,滑板被配置成与每个机架102A至102B中的功率和数据通信电缆盲配合,增强它们被快速移除、升级、重新安装和/或替代的能力。类似地,位于滑板上的各个组件(诸如处理器、加速器、存储器和数据存储驱动器)被配置为由于它们彼此的增大间隔而容易被升级。在说明性实施例中,组件附加地包括用于证实它们的真实性的硬件证明特征。
此外,在说明性实施例中,数据中心100利用支持多个其它网络架构(包括以太网和全路径)的单个网络架构(“组构”)。在说明性实施例中,滑板经由光纤耦合到交换机,光纤提供比典型的双绞线布线(例如,类别5、类别5e、类别6等)更高的带宽和更低的时延。由于高带宽、低时延互连和网络架构,数据中心100在使用时可以池化资源,例如存储器、加速器(例如,图形加速器、FPGA、ASIC等)和物理上解聚的数据存储驱动器,并在需要的基础上将它们提供给计算资源(例如,处理器),使计算资源能够好像它们是本地的一样访问池化的资源。
更确切地说,数据中心100可以以光组构112为特征。光组构112通常可以包括光信令介质(诸如光缆)和光交换基础设施的组合,经由其数据中心100中的任何具体滑板都能向数据中心100中的每一个其它滑板发送信号(并从其接收信号)。光组构112提供给任何给定滑板的信令连接性可以包括到同一机架中的其它滑板和其它机架中的滑板的连接性。在此图中描绘的具体非限制性示例中,数据中心100包括两个机架(例如,机架102A至102B),每个机架包括四个滑板(例如,分别为104A-1至104A-4和104B-1至104B-4)。因此,在此示例中,数据中心100包括总共八个滑板。经由光组构112,每个此类滑板可以具有与数据中心100中的七个其它滑板中的每一个的信令连接性。例如,经由光组构112,机架102A中的滑板104A-1可处理与机架102A中的滑板104A-2、104A-3和104A-4以及分布在数据中心100的其它机架102B之间的其它四个滑板104B-1、104B-2、104B-3和104B-4的信令连接性。实施例不限于此示例。
在各种实施例中,双模式光交换机(参考图5和图9)可能能够经由光组构112的光信令介质接收携带因特网协议(IP分组)的以太网协议通信和根据第二高性能计算(HPC)链路层协议(例如英特尔的全路径架构的无限带)的通信。从而,如所描绘的,关于数据中心100中滑板的任何具体一对,经由光组构的信令连接性可以经由以太网链路和HPC链路提供对于链路层连接性的支持。从而,以太网和HPC通信都能由单个高带宽、低时延的交换机组构支持。实施例不限于此示例。然而,值得指出的是,双模式光交换机在单个滑板内提供用于单独的故障域。像这样,在滑板级能跨故障域写入信息,这与机架级相反以在滑板级提供数据丢失、损坏或故障缓解。
数据中心100的机架102A和102B可以包括促进各种类型维护任务的自动化的物理设计特征。例如,数据中心100可使用设计成被机器人访问并且设计成安放和安置机器人可操纵的资源滑板的机架来实现。而且,在说明性实施例中,机架102A和102B包括集成功率源,其接收比典型对于功率源的电压更大的电压。在具体示例中,每一个滑板都能包括关联的电源。增大的电压使功率源能够向每个滑板上的组件提供附加功率,使组件能够操作在高于典型频率的频率。
如所指出的,本公开提供了安置物理计算资源(诸如处理器组件和存储器)的滑板。而且,本公开提供了一种单一存储器模块,其具有适合于其中实现滑板的数据中心的存储器容量的量或数量。关于图5-7、图8A-8C和图9提供了此类滑板的示例。然而,关于图2-4,首先给出了布置成安置此类滑板的多个示例机架。要指出,术语“单一”并且具体地说是“单一模块”或“单一存储器模块”并不意图是限制性的,而是相反依赖于如本文所描述和描绘的参考存储器模块封装。
图2图示了根据一些实施例可以代表在图1中描绘的机架中的任何具体机架的架构的机架架构200的一般概述。如此图中所反映的,机架架构200一般可以以滑板可被插入其中的多个滑板空间为特征,每个滑板空间可以经由机架接入区201机器人可访问。在此图中描绘的具体非限制性示例中,机架架构200以五个滑板空间203-1至203-5为特征。滑板空间203-1至203-5以相应的多目的连接器模块(MPCM)216-1至216-5为特征。这些MPCM可被布置成安放滑板的对应MPCM(例如,参考图5),以将滑板机械地、光地和/或电气地耦合到机架架构200,并且具体地说,以将数据中心的光组构耦合到用于每个滑板空间203-1至203-5的关联功率源。
图3图示了可以代表可以被实现以便提供对于以扩展能力为特征的滑板(例如参考图9)的支持的机架架构的机架架构300的示例。在此图中描绘的具体非限制性示例中,机架架构300包括七个滑板空间303-1到303-7,它们以相应的MPCM 316-1到316-7为特征。滑板空间303-1至303-7包括相应的主要区303-1A至303-7A和相应的扩展区303-1B至303-7B。关于每个此类滑板空间,当对应的MPCM与插入的滑板的配对MPCM耦合时,主要区通常可以构成物理地容纳插入的滑板的滑板空间的区。扩展区通常可以构成能物理地容纳扩展模块(例如,安置附加和/或追加物理资源以与主滑板的物理资源耦合)的滑板空间的区,假使插入的滑板配置有此类模块。
图4图示了根据一些实施例的机架402的示例,其可以代表根据图3的机架架构300实现的机架。在图4中描绘的具体非限制性示例中,机架402以七个滑板空间403-1至403-7为特征,这些空间包括相应的主要区403-1A至403-7A和相应的扩展区403-1B至403-7B。在各种实施例中,可以使用空气冷却系统来实现机架402中的温度控制。例如,如此图中所反映的,机架402可以以多个风扇419为特征,风扇通常布置成提供各种滑板空间403-1至403-7内的空气冷却。在一些实施例中,滑板空间的高度大于常规的“1U”服务器高度。在此类实施例中,风扇419通常可以包括与在常规机架配置中使用的风扇相比相对慢的、大直径冷却风扇。以较低速度运行较大直径冷却风扇相对于以较高速度运行较小直径冷却风扇可以增大风扇寿命,同时仍提供相同量的冷却。滑板比常规机架尺寸物理上更浅。另外,在每个滑板上布置组件以降低热遮挡(即,不在气流方向上串行布置)。因此,更宽、更浅的滑板允许装置性能中的增大,因为装置能由于改进的冷却(即,没有热遮挡、装置之间的更多空间、用于更大散热片的余地更多等)而在更高的热包围(例如,250W)下操作。
MPCM 416-1至416-7可以配置为给插入的滑板提供对由相应的功率模块420-1至420-7作为源的功率的访问,每个功率模块可以从外部功率源421汲取功率。在各种实施例中,外部功率源421可以向机架402输送交流电(AC)功率,并且功率模块420-1至420-7可以配置为将此类AC功率转换为直流电(DC)功率以对插入的滑板作为源。在一些实施例中,例如,功率模块420-1至420-7可以配置为将277伏AC功率转换成12伏DC功率,以用于经由相应的MPCM 416-1至416-7提供给插入的滑板。实施例不限于此示例。
MPCM 416-1至416-7还可布置成给插入的滑板提供到光组构的光信令连接性,光组构可以与图1的光组构112相同——或类似。在各种实施例中,包含在MPCM 416-1至416-7中的光连接器可以被设计成与包含在插入的滑板的MPCM中的配对光连接器耦合,以经由光缆422-1至422-7的相应长度给此类滑板提供到光组构412的光信令连接性。在一些实施例中,每个此类长度的光缆可以从其对应的MPCM延伸到在机架402的滑板空间外部的光互连织机423。在各种实施例中,光互连织机423可以布置成穿过机架402的支撑柱或其它类型承载元件。实施例不限于此上下文中。因为插入的滑板经由MPCM连接到光交换基础设施,因此能节省通常在人工配置机架布线以容纳新插入的滑板时花费的资源。
图5图示了滑板504的示例,其可以代表设计用于与根据一些实施例的机架(例如,根据机架架构200或300的机架或者机架402)结合使用的滑板。滑板504可以以MPCM 516为特征,MPCM 516包括光连接器516A和功率连接器516B,并且被设计成与滑板空间的配对MPCM耦合连同将MPCM 516插入到该滑板空间中。将MPCM 516与此类配对MPCM耦合可以使功率连接器516B与包括在配对MPCM中的功率连接器耦合。这一般可使滑板504的物理计算资源505能够经由功率连接器516B和将功率连接器516B导电地耦合到物理计算资源505的功率传输介质524以来自外部源的功率作为源。
物理计算资源505一般能包括任何数量的处理器组件和关联的存储器。例如,物理计算资源505包括处理器组件533-1和533-2以及存储器535-1和535-2。处理器组件533-1经由电信令介质528可操作地耦合到存储器535-1,而处理器组件533-2经由电信令介质528可操作地耦合到存储器535-2。
一般而言,处理器组件533-1能是多种处理器(诸如中央处理单元(CPU)、图形处理单元(GPU)、现场可编程门阵列(FPGA)等)中的任何一种。在此说明性示例中,处理器组件533-1和533-2能是包括多个处理核的中央处理单元。例如,处理组件533-1和533-2中的每个都能具有任何数量的核,甚至不同数量的核。作为特定示例,处理组件633-1和533-2中的每个都能具有2个核、4个核、8个核、12个核、24个核、32个核等。在此说明性示例中,处理器组件533-1和533-2被描绘为各包括4个核。确切地说,处理器组件533-1被描绘为包括4个核580-1,而处理器组件533-2被描绘为包括4个核580-2。然而,示例不限于此上下文。而且,处理组件533-1和533-2能是在多种装置制作节点(诸如例如7纳米(nm)节点、10nm节点、14nm节点、22nm、32nm、45nm节点等)中任一节点处制造的基于x86(例如,32位、64位等)的处理器。而且,处理组件能以具有各种引脚计数的多种封装类型中的任何一种进行打包。示例不限于此上下文。
如下面将更详细描述的,存储器535-1和535-2能被实施在球栅阵列(BGA)封装中,并且被称为“单一模块”或“单一存储器模块”。而且,单一存储器模块535-1和535-2中的每个都能包括控制器(例如,存储器控制器等)和存储器。例如,单一存储器模块535-1能包括控制器590-1和存储器592-1,而单一存储器模块535-2能包括控制器590-2和存储器592-2。一般而言,存储器535-1和存储器535-2(或更具体地说是存储器592-1和592-2)能是多种类型的存储器(包括易失性存储器、非易失性存储器等)中的任何一种。
在一些示例中,滑板502能包括两级存储器(有时称为“2LM”)。2LM架构的第一级能包括更小、更快的存储器,而第二级存储器能包括相对于第一级更大且更慢的存储器。在一些情况下,第一级存储器能被称为近存储器,而第二级存储器能被称为远存储器。对于一些示例,单一存储器模块535-1和535-2能被实现为用于对应处理器组件533-1和533-2的近存储器。
例如,单一存储器模块535-1和535-2(并且具体地说是存储器592-1和592-2)能由如下存储器实现:随机存取存储器(RAM)、动态RAM(DRAM)、同步DRAM(SDRAM)、双数据速率SDRAM、NAND存储器、NOR存储器、三维(3D)交叉点存储器、铁电存储器、硅氧化氮氧化硅(SONOS)存储器、聚合物存储器(诸如铁电聚合物存储器)、铁电晶体管随机存取存储器(FeTRAM或FeRAM)、纳米线、相变RAM(PRAM)、阻性RAM(RRAM)、磁阻RAM(MRAM)、自旋转移力矩MRAM(STT-MRAM)存储器、非易失性静态RAM(nvSRAM)、导电桥接RAM(CBRAM)、纳米RAM(NRAM)、浮动结栅RAM(FJG RAM)等。
单一存储器模块535-1和535-2能包括基于单一存储器模块耦合到的处理器组件533-1和533-2的一些存储器(例如,分别是存储器592-1和592-2)。例如,单一存储器模块535-1和535-2对于单一存储器模块535-1和535-2附连到的处理器组件533-1或533-2的每个核能包括2到4千兆字节(GB)之间的存储器。作为特定示例,处理器组件533-1和533-2中的每个都能包括32个核,而每个单一存储器模块包括96GB的存储器533-1和533-2,这相当于每个核3GB的存储器。
本公开能提供具有单一存储器模块(例如,单一存储器模块535-1和535-2等)的滑板,单一存储器模块布置和配置成在自主过程中诸如例如由在数据中心中操作机器人移除。示例不限于此上下文。
滑板504还可以包括双模式光网络接口电路526。双模式光网络接口电路526通常可以包括能够根据由光组构(例如,图1的光组构112、图4的光组构414等)支持的多个链路层协议中的每个在光信令介质上通信的电路。在一些实施例中,双模式光网络接口电路526可具有以太网协议通信和根据第二高性能协议的通信的能力。在各种实施例中,双模式光网络接口电路526可以包括一个或更多个光收发器模块527,每个光收发器模块可以能够在一个或更多个光信道中的每一个上传送和接收光信号。实施例不限于此上下文中。
将MPCM 516与给定机架中的滑板空间的配对MPCM耦合可以使光连接器516A与包括在配对MPCM中的光连接器耦合。这一般可经由光信道525的集合中的每个信道在滑板的光缆与双模式光网络接口电路526之间建立光连接性。对于一些示例,光信道525包括4条光纤信道。对于一些示例,每一条光信道都能提供20至220千兆字节每秒(GB/s)带宽。对于特定示例,每一条光信道都能提供50GB/s带宽。作为另一特定示例,每一条光信道都能提供200 GB/s带宽。双模式光网络接口电路526可以经由电信令介质528与滑板504的物理资源505通信。除了滑板的尺寸和滑板上的组件的布置提供改进的冷却并且能够实现在相对较高的热包围(例如,250W)下操作之外,如上面参考图4所描述的,在一些实施例中,滑板还可包括一个或更多个附加特征以促进空气冷却,诸如布置成耗散由物理资源505产生的热量的热导管和/或散热片。值得指出的是,尽管在图5中描绘的示例滑板504不以扩展连接器为特征,但是根据一些实施例,以滑板504的设计元件为特征的任何给定滑板也可以以扩展连接器为特征。实施例不限于此上下文中。
图6描绘了示例滑板604的透视图。要指出,示例滑板604未按比例描绘,并且具体地说,滑板604的特征以夸大形式描绘以促进理解。示例滑板604包括衬底640、处理器组件633-1和633-2以及单一存储器模块635-1和635-2。处理器组件633-1和633-2能是多种处理器组件中的任何一种,并且能类似于关于图5描绘和描述的处理器组件533-1和533-2。而且,滑板604能包括热耦合到处理器组件633-1和633-2的处理器组件散热片(参考图7),以在操作期间耗散由处理器组件633-1和633-2生成的热能。
单一存储器模块635-1和635-2能是封装在单一模块中并且耦合到处理器组件633-1和633-2中的相应处理器组件的存储器(例如,DRAM等)。一般而言,单一存储器模块635-1和635-2能被封装成适合于耦合到设置在衬底640上的插座(参考图8A-8C)的BGA封装。滑板604能包括热耦合到单一存储器模块635-1和635-2的单一模块散热片(参考图7),以在操作期间耗散由单一存储器模块635-1和635-2生成的热能。
一般而言,处理器组件633-1和633-2(以及关联的散热片)能被设置在衬底640的第一侧(例如,在此示例中是上表面)上。此外,单一存储器模块635-1和635-2能被设置在衬底640的第二侧(例如,在此示例中是下表面)上。要指出,处理器组件633-1和633-2以及单一存储器模块635-1和635-2分别耦合到的第一侧和第二侧或者衬底的第一表面和衬底640的第二表面能彼此相对。换言之,计算资源(例如,处理器组件等)能被设置在滑板604的上表面上,而用于处理器组件的存储器(例如,单一存储器模块等)能被设置在滑板604的下表面上。滑板604能进一步包括(未示出)电路板和/或连接组件以提供处理器组件与存储器以及滑板604的其它互连(例如,光互连等)之间的连接性。
图7描绘了示例滑板704的透视图。要指出,示例滑板704未按比例描绘。示例滑板704包括衬底704、处理器组件733-1和733-2(在此视图中被遮挡)、单一存储器模块735-1、单一存储器模块735-2(在此视图中被遮挡)、处理器组件散热片737-1和737-2、单一模块散热片739-1(未示出)和单一模块散热片739-2。
处理器组件733-1和733-2能是多种处理器组件中的任何一种,并且能类似关于图5描绘和描述的处理器组件533-1和533-2。而且,滑板704能包括热耦合到相应处理器组件733-1和733-2的处理器组件散热片737-1和737-2,以在操作期间耗散由处理器组件733-1和733-2生成的热能。要指出,处理器组件733-1和733-2被处理器组件散热片737-1和737-2从视图中遮挡。
单一存储器模块735-1和735-2能是封装在单一模块中并且耦合到处理器组件733-1和733-2中的相应处理器组件的存储器(例如,DRAM等)。一般而言,单一存储器模块735-1和735-2能被封装在适合于耦合到设置在衬底740上的插座(参考图8A-8C)的BGA封装中。例如,描绘了单一模块BGA封装750-1,其在一侧上包括存储器阵列752-1并且在面向衬底740的一侧上包括BGA触点(在此视图中被遮挡)。如上所述,单一存储器模块能包括部分基于单一存储器模块耦合到的处理器组件的核的数量的一些存储器。像这样,在此说明性示例中,存储器阵列752-1可能包括部分基于处理器组件733-1的核的数量的一些存储器(例如,DRAM的GB等)。
滑板704能包括分别热耦合到单一存储器模块735-1和735-2的单一模块散热片739-1(未示出)和739-2。单一模块散热片739-1和739-2能在操作期间耗散由单一存储器模块735-1和735-2生成的热能。
一般而言,散热片(例如,737-1、737-2、739-1、739-2等)能经由多种方法(诸如例如螺钉、压紧件、弹簧、框、按钮、导热膏、表面触点等)中的任何一种方法机械耦合到衬底740并且热耦合到有源组件(例如,处理器组件733-1、处理器组件733-2、单一存储器模块735-1、单一存储器模块735-2等)。
一般而言,处理器组件733-1和733-2以及关联的散热片737-1和737-2能被设置在衬底740的第一侧(例如,在此示例中是上表面)上。
而且,单一存储器模块735-1和735-2以及关联的散热片739-1和739-2能被设置在衬底740的第二侧(例如,在此示例中是下表面)上。要指出,处理器组件733-1和733-2以及单一存储器模块735-1和735-2分别耦合到的第一侧和第二侧或者衬底的第一表面和衬底的第二表面能彼此相对。换言之,计算资源(例如,处理器组件等)能被设置在滑板704的上表面上,而用于处理器组件的存储器(例如,单一存储器模块等)能被设置在滑板704的下表面上。滑板704能进一步包括(未示出)电路板和/或连接组件以提供处理器组件与存储器以及滑板704的其它互连(例如,光互连等)之间的连接性。
图8A-8C描绘了示例滑板804的透视图以及单一存储器模块的移除(或安装)。要指出,示例滑板804未按比例描绘,并且未描绘能在此类示例滑板上实现的所有元件。具体地说,此说明性示例描绘了包括衬底840的滑板804(或滑板804的一部分),并且以单一存储器模块为特征。更确切地说转到图8A,描绘了具有耦合到衬底840的单一模块散热片839的衬底840。具体地说,单一模块散热片839经由散热片紧固件862耦合到衬底840。在一些示例中,散热片紧固件862能布置和/或配置成提供散热片839到衬底840的自动移除和安装。例如,散热片839和紧固件862能布置和配置成由诸如机器人的自主设备移除。
更确切地说转到图8B,描绘了衬底840,其中移除了单一模块散热片839,使得图示了单一模块封装850。如所描绘的,单一模块封装850耦合到衬底840。单一模块封装经由铰链870和框872耦合到衬底840。在一些示例中,框架872能布置和/或配置成提供单一模块封装850到衬底840的自动移除和安装。例如,框架872能通过诸如机器人的自主设备关于铰链870被操纵。
更确切地说转到图8C,描绘了衬底840,其中移除了单一模块封装850,使得图示了BGA触点842。如所描绘的,BGA触点842被布置在衬底840上,以提供单一模块封装850与滑板804的对应处理器组件之间的电耦合。要指出,BGA触点842以布置(例如,行、列等)和按量描绘以促进理解。然而,在实践中,BGA阵列842能具有适合于将单一模块可操作地耦合到处理器组件的任何形状和数量的单独触点。示例不限于此上下文。
如上面所指出的,对于一些示例,滑板能被布置成收纳扩展滑板。图9图示了可以代表此种类型的滑板的滑板904的示例。如此图中所示,滑板904可包括物理资源905的集合以及MPCM 916,MPCM 916被设计成当滑板904被插入滑板空间(诸如图3的滑板空间303-1至303-7中的任一个)时与配对MPCM耦合。滑板904还能以双模式光网络接口电路926为特征,以将滑板904的组件耦合到数据中心的光组构。
滑板904还可以以扩展连接器917为特征。扩展连接器917一般可包括插座、插槽或者能够收纳一种或更多种类型的扩展模块(诸如扩展滑板918)的其它类型的连接元件。通过与扩展滑板918上的配对连接器耦合,扩展连接器917可以给物理资源905提供对驻留在扩展滑板918上的追加物理资源905B的访问。
例如,物理资源905能包括物理计算资源,诸如处理器组件933和单一存储器模块935。能经由扩展滑板918上的追加物理资源905B提供要包括在物理资源中的附加处理器组件(例如,协处理器、加速器、GPUS处理器等)或存储器(例如,远存储器等)。
图10图示了一般可以代表在其中/对于其可以根据各种实施例实现本文描述的一种或更多种技术的数据中心的数据中心1000的示例。如此图中所反映的,物理基础设施管理框架1050A可被实现成促进数据中心1000的物理基础设施1000A的管理。在各种实施例中,物理基础设施管理框架1050A的一个功能可以是管理数据中心1000内的自动维护功能,诸如使用机器人维护设备来服务物理基础设施1000A内的计算设备。在一些实施例中,物理基础设施1000A可以以先进的遥测系统为特征,该遥测系统执行足够健壮以支持物理基础设施1000A的远程自动化管理的遥测报告。在各种实施例中,由此类先进的遥测系统提供的遥测信息可以支持诸如故障预测/预防能力和容量规划能的特征。在一些实施例中,物理基础设施管理框架1050A还可以配置为使用硬件证明技术来管理物理基础设施组件的认证。例如,机器人可以在安装之前通过分析从与要安装的每个组件关联的射频标识(RFID)标签收集的信息来验证组件的真实性。实施例不限于此上下文中。
如此图所示,数据中心1000的物理基础设施1000A可以包括光组构1012,光组构1012可以包括双模式光交换基础设施1014。光组构1012和双模式光交换基础设施1014可以与图1的光组构102或图4的412相同或类似,并且可以在数据中心1000的滑板之间提供高带宽、低时延的多协议连接。如上面所论述的,参考图1,在各种实施例中,此类连接的可用性可使解聚和动态池化诸如加速器、存储器和存储装置之类的资源可行。在一些实施例中,例如,在数据中心1000的物理基础设施1000A之间可以包括一个或更多个池化的加速器滑板1030,其中每一个都可包括加速器资源(例如诸如协处理器和/或FPGA)池,该池可用于经由光组构1012和双模式光交换基础设施1014对其它滑板全局访问。
在另一示例中,在各种实施例中,在数据中心1000的物理基础设施1000A之间可以包括一个或更多个池化的存储滑板1032,其每个都可包括存储资源池,其可用于经由光组构1012和双模式光交换基础设施1014对其它滑板可全局访问。在一些实施例中,此类池化的存储滑板1032可以包括固态存储装置(诸如固态驱动器(SSD))池。在各种实施例中,在数据中心1000的物理基础设施1000A之间可以包括一个或更多个高性能处理滑板1034。在一些实施例中,高性能处理滑板1034可包括高性能处理器池,以及增强空气冷却以产出高达250W或更高的更高热包围的冷却特征。在各种实施例中,任何给定的高性能处理滑板1034可以以扩展连接器1017为特征,该扩展连接器1117能接受远存储器扩展滑板,使得对该高性能处理滑板1034本地可用的远存储器从包括在该滑板上的处理器和存储器解聚。在一些实施例中,此类高性能处理滑板1034可以使用包括低时延的SSD存储装置的扩展滑板配置有远存储器。光基础设施允许一个滑板上的计算资源利用远程加速器/FPGA、存储器和/或SSD资源,这些资源在位于同一机架上或数据中心中的任何其它机架上的滑板上解聚。在脊-叶网络架构中,远程资源能定位于远到一个交换机跳或远到两个交换机跳。实施例不限于此上下文中。
在各种实施例中,可以将一个或更多个抽象层应用于物理基础设施1000A的物理资源,以便定义虚拟基础设施,诸如软件定义的基础设施1000B。在一些实施例中,软件定义的基础设施1000B的虚拟计算资源1036可被分配成支持云服务1040的提供。在各种实施例中,虚拟计算资源集1036的具体集合可被编组以用于以SDI服务1038的形式提供给云服务1040。云服务1040的示例可以包括但不限于软件即服务(SaaS)服务1042、平台即服务(PaaS)服务1044和基础设施即服务(IaaS)服务1046。
在一些实施例中,可以使用虚拟基础设施管理框架1050B进行软件定义的基础设施1000B的管理。在各种实施例中,虚拟基础设施管理框架1050B可以被设计成实现工作负荷指纹技术和/或机器学习技术结合管理虚拟计算资源1036和/或SDI服务1038向云服务1040的分配。在一些实施例中,虚拟基础设施管理框架1050B可以结合执行此类资源分配使用/咨询遥测数据。在各种实施例中,可以实现应用/服务管理框架1050C,以便提供对于云服务1040的QoS管理能力。实施例不限于此上下文中。
至少一个实施例的一个或更多方面可由存储在表示处理器内各种逻辑的至少一个机器可读介质上的代表性指令实现,所述指令当由机器、计算装置或系统读取时使机器、计算装置或系统制造用于执行本文描述的技术的逻辑。称为“IP核”的此类表示可存储在有形机器可读介质上,并供应给各种消费者或制造设施,以加载到实际上制作逻辑或处理器的制造机器中。
各种示例可使用硬件元件、软件元件或二者的组合来实现。在一些示例中,硬件元件可包括装置、组件、处理器、微处理器、电路、电路元件(例如晶体管、电阻器、电容器、电感器等等)、集成电路、专用集成电路(ASIC)、可编程逻辑装置(PLD)、数字信号处理器(DSP)、现场可编程门阵列(FPGA)、存储器单元、逻辑门、寄存器、半导体器件、芯片、微芯片、芯片集等等。在一些示例中,软件元件可包括软件组件、程序、应用、计算机程序、应用程序、系统程序、机器程序、操作系统软件、中间件、固件、软件模块、例程、子例程、功能、方法、过程、软件接口、应用程序接口(API)、指令集、计算代码、计算机代码、代码段、计算机代码段、字、值、符号或它们的任何组合。确定是否使用硬件元件和/或软件元件实现示例可按照任何数量的因素改变,诸如期望的计算速率、功率级、耐热性、处理循环预算、输入数据速率、输出数据速率、存储器资源、数据总线速度以及其它设计或性能约束,如给定实现所期望的。
一些示例可包括制品或至少一个计算机可读介质。计算机可读介质可包括存储逻辑的非暂态存储介质。在一些示例中,非暂态存储介质可包括能够存储电子数据的一种或更多种类型的计算机可读存储介质,包括易失性存储器或非易失性存储器、可拆卸或不可拆卸存储器、可擦除或不可擦除存储器、可写或可重写存储器等等。在一些示例中,逻辑可包括各种软件元件,诸如软件组件、程序、应用、计算机程序、应用程序、系统程序、机器程序、操作系统软件、中间件、固件、软件模块、例程、子例程、功能、方法、过程、软件界面、API、指令集、计算代码、计算机代码、代码段、计算机代码段、字、值、符号或它们的任何组合。
根据一些示例,计算机可读介质可包括存储或维持指令的非暂态存储介质,所述指令当由机器、计算装置或系统执行时使机器、计算装置或系统执行按照所描述的示例的方法和/或操作。指令可包括任何适合类型的代码,诸如源代码、编译代码、解释代码、可执行代码、静态代码、动态代码等。指令可根据用于指示机器、计算装置或系统执行某一功能的预先定义的计算机语言、方式或句法实现。指令可使用任何适合的高级、低级、面向对象、可视、编译和/或解释的编程语言实现。
一些示例可使用表述“在一个示例中”或“示例”连同它们的派生词进行描述。这些术语意味着,结合该示例描述的具体特征、结构或特性被包括在至少一个示例中。在说明书中各处中出现的短语“在一个示例中”不一定全都指的是同一示例。
一些实施例可使用表述“耦合”和“连接”以及它们的派生词进行描述。这些术语不一定意图作为彼此的同义词。例如,使用术语“连接”和/或“耦合”的描述可以指示,两个或更多个元件彼此直接物理接触或电气接触。然而,术语“耦合”还可意味着,两个或更多个元件彼此不直接接触,但彼此仍协同操作或交互作用。
要强调的是,提供了公开的摘要以符合37 C.F.R.章节1.72(b),其要求将允许读者快速查明技术公开的性质的摘要。摘要伴有如下理解被提交:它不会用于解释或限制权利要求书的范围或意义。此外,在前述具体实施方式中,能看到,各种特征被一起组合在单个示例中,以用于使本公开流线化的目的。公开的此方法不解释为反映要求权利的示例需要比在每个权利要求中明确记载的特征更多的特征的意图。而是,如下面的权利要求书所反映的,发明的主题在于比单个公开示例的所有特征少。从而,如下权利要求书由此被结合到具体实施方式中,其中每个权利要求都代表它自己作为单独示例。在所附权利要求书中,术语“包括(include)”和“在其中(in which)”分别被用作相应术语“包括(comprise)”和“其中(wherein)”的简明英语等效词。而且,术语“第一”、“第二”、“第三”等等仅仅用作标记,并不意图在它们的对象上施加数字要求。
尽管已经用对结构特征和/或方法动作特定的语言描述了主题,但要理解到,在所附权利要求书中定义的主题不一定局限于上面描述的特定特征或动作。而是,上面描述的特定特征和动作作为实现权利要求书的示例形式公开。
本公开能在多种实施例(诸如例如,如下示例实施例的非穷举列表)的任何实施例中实现。
示例1一种用于安置数据中心的物理计算资源的滑板的设备,所述设备包括:衬底;第一插座,用于安放处理器组件,所述第一插座设置在所述衬底的第一表面上;以及第一存储器插座,用于安放存储器模块,所述第一存储器插座设置在与所述衬底的第一表面不同的所述衬底的第二表面上,所述第一存储器插座用于将所述存储器模块耦合到所述处理器组件。
示例2。如示例1的设备,其中所述第一存储器插座被配置为安放单一存储器模块。
示例3。如示例2的设备,包括所述处理器组件和所述单一存储器模块。
示例4。如示例3的设备,所述单一存储器模块包括部分基于所述处理器组件的核的数量的一些存储器。
示例5。如示例3的设备,包括机械地耦合到所述衬底并且热耦合到所述处理器组件的处理器组件散热片。
示例6。如示例5的设备,包括机械地耦合到所述衬底并且热耦合到所述单一存储器模块的单一存储器模块散热片。
示例7。如示例6的设备,包括可拆卸地机械耦合到所述衬底的所述单一存储器模块散热片。
示例8。如示例7的设备,包括耦合到所述衬底的铰链和耦合到所述铰链的框,所述框和铰链用于将所述单一存储器模块可拆卸地机械耦合到所述衬底。
示例9。如示例8的设备,所述框和铰链用于将所述单一存储器模块和所述单一存储器模块散热片可拆卸地机械耦合到所述衬底。
示例10。如示例2的设备,包括:第二插座,用于安放处理器组件,所述第二插座设置在所述衬底的所述第一表面上;以及第二存储器插座,用于安放单一存储器模块,所述第二存储器插座设置在所述衬底的所述第二表面上,所述第二存储器插座将所述第二存储器插座的所述单一存储器模块耦合到所述第二插座的所述处理器组件。
示例11。如示例1至10中任一示例的设备,所述第一存储器插座包括球栅阵列(BGA)插座。
示例12。如示例1至10中任一示例的设备,所述第一表面和所述第二表面彼此相对。
示例13。如示例3的设备,所述处理器组件包括2到32个之间的核。
示例14。如示例13的设备,所述一些存储器包括每核1到4千兆字节之间的存储器。
示例15。如示例2至10中任一示例的设备,所述单一存储器模块包括动态随机存取存储器(DRAM)或三维(3D)交叉点存储器。
示例16一种用于数据中心的系统,包括:机架,包括多个滑板空间;以及至少一个滑板,经由所述多个滑板空间之一与所述机架耦合,所述滑板包括:衬底;第一插座,用于安放处理器组件,所述第一插座设置在所述衬底的第一表面上;以及第一存储器插座,用于安放存储器模块,所述第一存储器插座设置在与所述衬底的第一表面不同的所述衬底的第二表面上,所述第一存储器插座将所述存储器模块耦合到所述处理器组件。
示例17。如示例16的系统,其中所述第一存储器插座被配置为安放单一存储器模块。
示例18。如示例17的系统,所述滑板包括所述处理器组件和所述单一存储器模块。
示例19。如示例18的系统,所述单一存储器模块包括部分基于所述处理器组件的核的数量的一些存储器。
示例20。如示例18的系统,滑板包括机械地耦合到所述衬底并且热耦合到所述处理器组件的处理器组件散热片。
示例21。如示例20的系统,滑板包括机械地耦合到所述衬底并且热耦合到所述单一存储器模块的单一存储器模块散热片。
示例22。如示例21的系统,所述滑板包括可拆卸地机械耦合到所述衬底的所述单一存储器模块散热片。示例23示例22的系统,所述滑板包括耦合到所述衬底的铰链和耦合到所述铰链的框,所述框和铰链用于将所述单一存储器模块可拆卸地机械耦合到所述衬底。
示例24。如示例23的系统,所述框和铰链将所述单一存储器模块和所述单一存储器模块散热片可拆卸地机械耦合到所述衬底。
示例25。如示例17的系统,滑板包括:第二插座,用于安放处理器组件,第二插座设置在衬底的第一表面上;以及第二存储器插座,用于安放单一存储器模块,所述第二存储器插座设置在所述衬底的所述第二表面上,所述第二存储器插座将所述第二存储器插座的所述单一存储器模块耦合到所述第二插座的所述处理器组件。
示例26。如示例17至25中任一示例的系统,所述第一存储器插座包括球栅阵列(BGA)插座。
示例27。如示例17至25中任一示例的系统,所述第一表面和所述第二表面彼此相对。
示例28。如示例18的系统,所述处理器组件包括2到32个之间的核。
示例29。如示例28的系统,所述一些存储器包括每核1到4千兆字节之间的存储器。
示例30。如示例17至25中任一示例的系统,存储器模块包括动态随机存取存储器(DRAM)或三维(3D)交叉点存储器。
示例31一种用于数据中心中的物理资源滑板的设备,包括:衬底,可安装在数据中心的机架的滑板空间内;多个插座,耦合到所述衬底,所述多个插座中的每个都安放处理器组件;以及用于所述多个插座中的每个插座的存储器模块,所述存储器模块以通信方式耦合到相应插座,以将所述存储器模块耦合到由所述插座安放的处理器组件,每一个所述存储器模块包括:部分基于所述处理器组件的核的数量的一些存储器;以及存储器控制器,将所述一些存储器耦合到处理器组件。
示例32。如示例31的设备,其中多个存储器模块包括单一存储器模块。
示例33。如示例32的设备,包括多个处理器组件。
示例34。如示例33的设备,包括机械耦合到衬底的多个处理器组件散热片,多个处理器组件散热片中的每个都热耦合到多个处理器组件中的相应一个。
示例35。如示例34的设备,包括机械耦合到所述衬底的多个单一存储器模块散热片,所述多个单一存储器模块散热片中的每个都热耦合到所述多个单一存储器模块中的相应一个。
示例36。如示例35的设备,包括可拆卸地机械耦合到衬底的多个单一存储器模块散热片。
示例37。如示例36的设备,包括耦合到所述衬底的铰链和耦合到所述铰链的框,所述框和铰链用于将多个单一存储器模块可拆卸地机械耦合到所述衬底。
示例38。如示例37的设备,所述框和铰链用于将多个单一存储器模块和多个单一存储器模块散热片可拆卸地机械耦合到所述衬底。
示例39。如示例32至38中任一示例的设备,所述多个插座设置在所述衬底的第一表面上,并且所述多个单一存储模块设置在所述衬底的第二表面上。
示例40。如示例39的设备,第一表面与第二表面相对。
示例41。如示例32至38中任一示例的设备,多个处理器组件中的每个都包括2到32个之间的核。
示例42。如示例41的设备,所述一些存储器包括每核1到4千兆字节之间的存储器。
示例43。如示例32至38中任一示例的设备,存储器包括动态随机存取存储器(DRAM)或三维(3D)交叉点存储器。
示例44。一种用于数据中心的机架的滑板的方法,该方法包括:在第一插座处安放处理器组件,第一插座设置在滑板的衬底的第一表面上;在第一存储器插座处安放存储器模块,第一存储器插座设置在与第一表面不同的衬底的第二表面上;以及经由第一插座和第一存储器插座将存储器模块耦合到处理器组件。
示例45。如示例44的方法,包括在第一存储器插座处安放单一存储器模块。
示例46。如示例45的方法,所述单一存储器模块包括部分基于所述处理器组件的核的数量的一些存储器。
示例47。如示例45的方法,滑板包括机械地耦合到所述衬底并且热耦合到所述处理器组件的处理器组件散热片。
示例48。如示例47的方法,滑板包括机械地耦合到所述衬底并且热耦合到所述单一存储器模块的单一存储器模块散热片。
示例49。如示例48的方法,包括从衬底移除单一存储器模块散热片。
示例50。如示例48的方法,所述滑板包括耦合到所述衬底的铰链和耦合到所述铰链的框,所述框和铰链用于将所述单一存储器模块可拆卸地机械耦合到所述衬底。
示例51。如示例50的方法,所述框和铰链用于将所述单一存储器模块和所述单一存储器模块散热片可拆卸地机械耦合到所述衬底。
示例52。如示例50的方法,包括:在第二插座处安放处理器组件,第二插座设置在滑板的衬底的第一表面上;在第二存储器插座处安放存储器模块,第二存储器插座设置在衬底的第二表面上;以及经由第二插座和第二存储器插座将存储器模块耦合到处理器组件。
示例53。如示例45至52中任一示例的方法,所述第一存储器插座包括球栅阵列(BGA)插座。
示例54。如示例45至52中任一示例的方法,所述第一表面和所述第二表面彼此相对。
示例55。如示例44的方法,所述处理器组件包括2到32个之间的核。
示例56。如示例55的方法,所述一些存储器包括每核1到4千兆字节之间的存储器。
示例57。如示例45至52中任一示例的方法,存储器模块包括动态随机存取存储器(DRAM)或三维(3D)交叉点存储器。
Claims (25)
1.一种用于安置数据中心的物理计算资源的滑板的设备,所述设备包括:
衬底;
第一插座,用于安放处理器组件,所述第一插座设置在所述衬底的第一表面上;以及
第一存储器插座,用于安放存储器模块,所述第一存储器插座设置在与所述衬底的第一表面不同的所述衬底的第二表面上,所述第一存储器插座用于将所述存储器模块耦合到所述处理器组件。
2.如权利要求1所述的设备,其中所述第一存储器插座被配置为安放单一存储器模块。
3.如权利要求2所述的设备,包括所述处理器组件和所述单一存储器模块。
4.如权利要求3所述的设备,所述单一存储器模块包括部分基于所述处理器组件的核的数量的一些存储器。
5. 如权利要求3所述的设备,包括:
处理器组件散热片,机械地耦合到所述衬底并且热耦合到所述处理器组件;以及
单一存储器模块散热片,机械地耦合到所述衬底并且热耦合到近存储器单一模块。
6.如权利要求5所述的设备,包括可拆卸地机械耦合到所述衬底的所述单一存储器模块散热片。
7.如权利要求6所述的设备,包括耦合到所述衬底的铰链和耦合到所述铰链的框,所述框和铰链用于将所述单一存储器模块可拆卸地机械耦合到所述衬底。
8.如权利要求7所述的设备,所述框和铰链用于将所述单一存储器模块和所述单一存储器模块散热片可拆卸地机械耦合到所述衬底。
9. 如权利要求1所述的设备,包括:
第二插座,用于安放处理器组件,所述第二插座设置在所述衬底的所述第一表面上;以及
第二存储器插座,用于安放单一存储器模块,所述第二存储器插座设置在所述衬底的所述第二表面上,所述第二存储器插座用于将所述第二存储器插座的所述单一存储器模块耦合到所述第二插座的所述处理器组件。
10.如权利要求1至9中任一项所述的设备,所述第一存储器插座包括球栅阵列(BGA)插座。
11.如权利要求1至9中任一项所述的设备,所述第一表面和所述第二表面彼此相对。
12.如权利要求2所述的设备,所述处理器组件包括2到32个之间的核。
13.如权利要求12所述的设备,所述一些存储器包括每核1到4千兆字节之间的存储器。
14.如权利要求1至9中任一项所述的设备,所述单一存储器模块包括动态随机存取存储器(DRAM)或三维(3D)交叉点存储器。
15. 一种用于数据中心的系统,包括:
包括多个滑板空间的机架;以及
至少一个滑板,经由所述多个滑板空间之一与所述机架耦合,所述滑板包括:
衬底;
第一插座,用于安放处理器组件,所述第一插座设置在所述衬底的第一表面上;以及
第一存储器插座,用于安放存储器模块,所述第一存储器插座设置在与所述衬底的第一表面不同的所述衬底的第二表面上,所述第一存储器插座将所述存储器模块耦合到所述处理器组件。
16.如权利要求15所述的系统,其中所述第一存储器插座被配置为安放单一存储器模块。
17.如权利要求16所述的系统,所述滑板包括所述处理器组件和所述单一存储器模块。
18.如权利要求17所述的系统,所述单一存储器模块包括部分基于所述处理器组件的核的数量的一些存储器。
19. 如权利要求18所述的系统,所述滑板包括:
处理器组件散热片,机械地耦合到所述衬底并且热耦合到所述处理器组件;以及
单一存储器模块散热片,机械地耦合到所述衬底并且热耦合到所述单一存储器模块。
20.如权利要求19所述的系统,所述滑板包括可拆卸地机械耦合到所述衬底的所述单一存储器模块散热片。
21.如权利要求20所述的系统,所述滑板包括耦合到所述衬底的铰链和耦合到所述铰链的框,所述框和铰链用于将所述单一存储器模块可拆卸地机械耦合到所述衬底。
22.如权利要求21所述的系统,所述框和铰链用于将所述单一存储器模块和所述单一存储器模块散热片可拆卸地机械耦合到所述衬底。
23.一种用于数据中心中的物理资源滑板的设备,包括:
衬底,可安装在数据中心的机架的滑板空间内;
多个插座,耦合到所述衬底,所述多个插座中的每个用于安放处理器组件;以及
用于所述多个插座中的每个插座的单一存储器模块,所述单一存储器模块以通信方式耦合到相应插座,以将所述单一存储器模块耦合到由所述插座安放的处理器组件,所述单一存储器模块中的每个包括:
部分基于所述处理器组件的核的数量的一些存储器;以及
存储器控制器,用于将所述一些存储器耦合到处理器组件。
24.如权利要求23所述的设备,包括机械耦合到所述衬底的多个单一存储器模块散热片,所述多个单一存储器模块散热片中的每个都热耦合到所述多个单一存储器模块中的相应一个。
25.如权利要求23所述的设备,所述多个插座设置在所述衬底的第一表面上,并且所述多个单一存储模块设置在所述衬底的第二表面上,所述第一表面与所述第二表面相对。
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