CN109417861B - 用于机架冷却的技术 - Google Patents

用于机架冷却的技术 Download PDF

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Publication number
CN109417861B
CN109417861B CN201780038317.6A CN201780038317A CN109417861B CN 109417861 B CN109417861 B CN 109417861B CN 201780038317 A CN201780038317 A CN 201780038317A CN 109417861 B CN109417861 B CN 109417861B
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bracket
fan
rack
cooling
slot
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CN109417861A (zh
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M·J·阿迪莱塔
A·戈里乌斯
M·维尔德
M·T·克罗克
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Intel Corp
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Intel Corp
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Abstract

用于机架冷却的技术包括监测安装在机架中的托架的温度，并且基于托架的温度来控制机架的冷却系统。冷却系统包括冷却风扇阵列，可以控制冷却风扇阵列以冷却托架。另外，如果需要，可以调节位于受控冷却风扇阵列附近的一个或多个相邻冷却风扇阵列，以向托架提供附加的冷却。

Description

用于机架冷却的技术
相关申请的交叉引用
本申请要求享有以下申请的优先权：2016年12月31日提交的题为“TECHNOLOGIESFOR RACK COOLING”的美国实用专利申请第15/396,653号(该申请要求享有2016年7月22日提交的美国临时专利申请第62/365,969号的优先权)；2016年8月18日提交的美国临时专利申请第62/376,859号；以及2016年11月29日提交的美国临时专利申请第62/427,268号。
背景技术
典型的企业级数据中心可以包括数个到数百个机架或机柜，其中每个机架/机柜存放多个服务器。数据中心的各种服务器中的每个服务器可以经由一个或多个本地联网交换机、路由器和/或其他互连设备、电缆和/或接口可通信地彼此连接。特定数据中心的机架和服务器的数量以及数据中心设计的复杂度可能取决于数据中心的预期用途，以及数据中心旨在提供的服务质量。
数据中心的传统服务器是设计为安装到数据中心的对应机架中的自包含的计算设备。为此，典型的数据中心服务器包括具有对应安装机构(例如，支架)的壳体，以有助于将服务器安装到机架或机柜中。服务器的电气组件位于壳体内，并且壳体针对本地环境向电气组件提供一定量的保护。另外，典型的服务器通常包括其自己的外围组件或系统，例如，内部电源和内部冷却。
传统的机架系统是自包含的物理支持结构，包括许多预定义的服务器空间。服务器可以安装在每个预定义的服务器空间中。典型的机架系统通常包括外壳或壳体，预定义的服务器空间位于该外壳或壳体中。
附图说明
本文描述的概念在附图中通过示例的方式而非通过限制的方式示出。为了说明的简单和清楚，附图中示出的元素不一定按比例绘制。在认为适当的情况下，在附图中重复附图标记以指示对应或类似的元素。
图1是根据各种实施例的其中可以实现本文中描述的一种或多种技术的数据中心的概念性概述的图；
图2是图1的数据中心的机架的逻辑配置的示例实施例的图；
图3是根据各种实施例的其中可以实现本文中描述的一种或多种技术的另一数据中心的示例实施例的图；
图4是根据各种实施例的其中可以实现本文中描述的一种或多种技术的数据中心的另一示例实施例的图；
图5是表示可以在图1、图3和图4的数据中心的各种托架(sled)之中建立的链路层连接的连接方案的图；
图6是根据一些实施例的可以表示图1-4中描绘的机架中的任何特定的一个机架的架构的机架架构的图；
图7是可以与图6的机架架构一起使用的托架的示例实施例的图；
图8是用于对以扩展能力为特征的托架提供支持的机架架构的示例实施例的图；
图9是根据图8的机架架构实现的机架的示例实施例的图；
图10是设计用于与图9的机架结合使用的托架的示例实施例的图；
图11是根据各种实施例的其中可以实现本文中描述的一种或多种技术的数据中心的示例实施例的图；
图12是包括冷却控制器和若干机架的数据中心的至少一个实施例的简化框图；
图13是在图12的数据中心的机架中可使用的托架的顶侧的至少一个实施例的简化框图；
图14是图13的托架的底侧的至少一个实施例的简化框图；
图15是图12的数据中心的机架的至少一个实施例的侧透视图；
图16是图15的机架的正视图；
图17是使托架接纳在机架的对应托架槽中的图15的机架的另一侧透视图；
图18是图15的机架的托架和相关的风扇阵列的侧视图；
图19是可以由图12的数据中心的冷却控制器建立的环境的至少一个实施例的简化框图；
图20是使一对托架接纳在机架的对应托架槽中的图15的机架的侧视图；以及
图21是用于管理图12的数据中心的服务器机架的冷却的方法的至少一个实施例的简化流程图，该方法可以由图12和图19的冷却控制器执行。
具体实施方式
虽然本公开的概念易于具有各种修改和替代形式，但是其具体实施例已经通过示例的方式在附图中示出并且将在本文中详细描述。然而，应当理解，并不旨在将本公开的概念限制于所公开的特定形式，而是相反，意图是覆盖与本公开和所附权利要求一致的所有修改、等同物和替代方案。
说明书中对“一个实施例”、“实施例”、“说明性实施例”等的引用指示所描述的实施例可以包括特定特征、结构或特性，但是每个实施例可以一定或可以不一定包括该特定特征、结构或特性。此外，这些短语不一定指代同一实施例。此外，当结合实施例描述特定特征、结构或特性时，认为结合其他实施例实现这样的特征、结构或特性在本领域技术人员的知识范围内，而无论是否未明确描述。另外，应当意识到，以“至少一个A、B和C”的形式包括在列表中的项目可以表示(A)；(B)；(C)；(A和B)；(A和C)；(B和C)；或(A、B和C)。类似地，以“A、B或C中的至少一个”的形式列出的项目可以表示(A)；(B)；(C)；(A和B)；(A和C)；(B和C)；或(A、B和C)。
在一些情况下，所公开的实施例可以以硬件、固件、软件或其任何组合来实现。所公开的实施例还可以实现为由暂时性或非暂时性机器可读(例如，计算机可读)存储介质携带或存储在其上的指令，这些指令可以由一个或多个处理器读取和执行。机器可读存储介质可以体现为用于以机器可读形式存储或传输信息的任何存储设备、机构或其他物理结构(例如，易失性或非易失性存储器、介质盘或其他介质设备)。
在附图中，可以以特定布置和/或排序示出一些结构或方法特征。然而，应当意识到，可能不要求这样的特定布置和/或排序。而是，在一些实施例中，这些特征可以以不同于说明性附图中所示的方式和/或顺序来布置。另外，在特定附图中包含结构或方法特征并不意味着暗示在所有实施例中都要求这样的特征，并且在一些实施例中，可以不包括这些特征或者可以将这些特征与其他特征组合。
图1示出了根据各种实施例的数据中心100的概念性概述，该数据中心100通常可以表示其中/对其而言可以实现本文中描述的一种或多种技术的数据中心或其他类型的计算网络。如图1所示，数据中心100通常可以包含多个机架，其中的每个机架可以存放包括相应的一组物理资源的计算设备。在图1中描绘的特定非限制性示例中，数据中心100包含四个机架102A至102D，其存放包括相应的各组物理资源105A至105D的计算设备。根据该示例，数据中心100的共同的一组物理资源106包括分布在机架102A至102D之中的各组物理资源105A至105D。物理资源106可以包括多种类型的资源，例如，处理器、协处理器、加速器、现场可编程门阵列(FPGA)、存储器和存储装置。实施例不限于这些示例。
说明性数据中心100在许多方面不同于典型的数据中心。例如，在说明性实施例中，其上放置诸如CPU、存储器和其他组件之类的组件的电路板(“托架”)被设计用于提高的热性能。特别地，在说明性实施例中，托架比典型的板浅。换言之，托架从前到后更短，冷却风扇位于其中。这减少了空气必须穿过板上的组件的路径的长度。此外，托架上的组件与典型的电路板相比间隔得更远，并且这些组件被布置为减少或消除遮蔽(即，一个组件在另一组件的空气流动路径中)。在说明性实施例中，诸如处理器之类的处理组件位于托架的顶侧，而诸如双列直插存储器模块(DIMM)之类的附近存储器位于托架的底侧。由于该设计提供的增强的空气流动，组件可以以比典型系统高的频率和功率水平操作，从而提高性能。此外，托架被配置为与每个机架102A、102B、102C、102D中的电力和数据通信电缆盲配合，增强了机架被快速移除、升级、重新安装和/或更换的能力。类似地，位于托架上的个体组件(例如，处理器、加速器、存储器和数据存储驱动器)被配置为由于其彼此间隔增加而容易升级。在说明性实施例中，组件另外包括硬件证实特征以证明其真实性。
此外，在说明性实施例中，数据中心100利用支持多个其他网络架构(包括以太网和Omni-Path)的单个网络架构(“结构”)。在说明性实施例中，托架经由光纤耦合到交换机，光纤相比典型的双绞线布线(例如，类别5、类别5e、类别6等)提供更高的带宽和更低的延迟。由于高带宽、低延迟互连和网络架构，数据中心100可以在使用中将物理地分解的资源(例如，存储器、加速器(例如，图形加速器、FPGA、专用集成电路(ASIC)等)以及数据存储驱动器)池化，并且基于需要将其提供给计算资源(例如，处理器)，使得计算资源能够访问池化的资源，就好像这些资源在本地一样。说明性数据中心100另外接收各种资源的使用情况信息，基于过去的资源使用情况来预测不同类型的工作负荷的资源使用情况，并且基于该信息来动态地重新分配资源。
数据中心100的机架102A、102B、102C、102D可以包括促进将各种类型的维护任务自动化的物理设计特征。例如，数据中心100可以使用这样的机架来实现：这些机架被设计为是机器人化地访问的并且接受和存放可机器人化地操纵的资源托架。此外，在说明性实施例中，机架102A、102B、102C、102D包括集成电源，其接收比对电源而言典型的电压更大的电压。增加的电压使得电源能够向每个托架上的组件提供附加的电力，使得组件能够以高于典型频率的频率进行操作。
图2示出了数据中心100的机架202的示例性逻辑配置。如图2所示，机架202通常可以存放多个托架，其中的每个托架可以包括相应的一组物理资源。在图2中描绘的特定非限制性示例中，机架202存放包括相应的各组物理资源205-1至205-4的托架204-1至204-4，这些物理资源中的每个构成机架202中包括的共同的一组物理资源206的一部分。关于图1，如果机架202表示例如机架102A，则物理资源206可以对应于机架102A中包括的物理资源105A。在该示例的上下文中，物理资源105A因此可以由相应的各组物理资源组成，包括包含在机架202的托架204-1至204-4中的物理存储装置资源205-1、物理加速器资源205-2、物理存储器资源205-3和物理计算资源205-5。实施例不限于此示例。每个托架可以包含各种类型的物理资源(例如，计算、存储器、加速器、存储装置)中的每种类型的物理资源的池。通过使可机器人化地访问和可机器人化地操纵的托架包括分解的资源，每种类型的资源能够彼此独立地并且以其自己的优化刷新速率进行升级。
图3示出了根据各种实施例的数据中心300的示例，该数据中心300通常可以表示其中/对其而言可以实现本文中描述的一种或多种技术的数据中心。在图3中描绘的特定非限制性示例中，数据中心300包括机架302-1至302-32。在各种实施例中，数据中心300的机架可以以限定和/或容纳各种访问路径的方式来布置。例如，如图3所示，数据中心300的机架可以以限定和/或容纳访问路径311A、311B、311C和311D的方式来布置。在一些实施例中，这种访问路径的存在通常可以使得自动化维护设备(例如，机器人化维护设备)能够物理地访问存放在数据中心300的各种机架中的计算设备并执行自动化维护任务(例如，替换故障的托架，升级托架)。在各种实施例中，可以选择访问路径311A、311B、311C和311D的尺寸，机架302-1至302-32的尺寸和/或数据中心300的物理布局的一个或多个其他方面，以促进这种自动化操作。实施例不限于此上下文。
图4示出了根据各种实施例的数据中心400的示例，该数据中心400通常可以表示其中/对其而言可以实现本文中描述的一种或多种技术的数据中心。如图4所示，数据中心400可以以光结构412为特征。光结构412通常可以包括光信令介质(例如，光布线)和光交换基础设施的组合，数据中心400中的任何特定托架可以经由其向数据中心400中的其他托架中的每个托架发送信号(并且从数据中心400中的其他托架中的每个托架接收信号)。光结构412向任何给定托架提供的信令连接可以包括到同一机架中的其他托架和其他机架中的托架的连接。在图4中描绘的特定非限制性示例中，数据中心400包括四个机架402A至402D。机架402A至402D存放相应的托架对404A-1和404A-2、404B-1和404B-2、404C-1和404C-2以及404D-1和404D-2。因此，在该示例中，数据中心400包括总共八个托架。经由光结构412，每个这样的托架可以具有与数据中心400中的七个其他托架中的每个托架的信令连接。例如，经由光结构412，机架402A中的托架404A-1可以具有与机架402A中的托架404A-2以及分布在数据中心400的其他机架402B、402C和402D之中的六个其他托架404B-1、404B-2、404C-1、404C-2、404D-1和404D-2的信令连接。实施例不限于此示例。
图5示出了连接方案500的概述，该连接方案500通常可以表示在一些实施例中可以在数据中心(例如，图1、图3和图4的示例数据中心100、300和400中的任何一个)的各种托架之中建立的链路层连接。可以使用以双模光交换基础设施514为特征的光结构来实现连接方案500。双模光交换基础设施514通常可以包括能够根据多个链路层协议经由相同统一的一组光信令介质接收通信并且适当地交换这种通信的交换基础设施。在各种实施例中，可以使用一个或多个双模光交换机515来实现双模光交换基础设施514。在各种实施例中，双模光交换机515通常可以包括高基数交换机。在一些实施例中，双模光交换机515可以包括多层交换机，例如，四层交换机。在各种实施例中，双模光交换机515可以以集成硅光子为特征，与常规交换设备相比，使得双模光交换机515能够以显著减少的延迟交换通信。在一些实施例中，双模光交换机515可以以叶-脊架构构成叶交换机530，另外包括一个或多个双模光脊交换机520。
在各种实施例中，双模光交换机能够经由光结构的光信令介质接收携带互联网协议(IP分组)的以太网协议通信和根据第二、高性能计算(HPC)链路层协议(例如，Intel的Omni-Path架构、Infiniband)的通信两者。如图5关于具有与光结构的光信令连接的任何特定托架对504A和504B所反映的，连接方案500因此可以经由以太网链路和HPC链路两者对链路层连接提供支持。因此，单个高带宽、低延迟交换结构可以支持以太网通信和HPC通信两者。实施例不限于此示例。
图6示出了根据一些实施例的机架架构600的总体概述，该机架架构600可以表示图1至图4中描绘的机架中的任何特定的一个机架的架构。如图6所反映的，机架架构600通常可以以多个托架空间为特征，托架可以插入托架空间中，托架空间中的每个可以是经由机架访问区域601可机器人化地访问的。在图6中描绘的特定非限制性示例中，机架架构600以五个托架空间603-1至603-5为特征。托架空间603-1至603-5以相应的多目的连接器模块(MPCM)616-1至616-5为特征。
图7示出了托架704的示例，托架704可以表示这种类型的托架。如图7所示，托架704可以包括一组物理资源705以及MPCM 716，MPCM 716被设计为当托架704插入托架空间(例如，图6中的托架空间603-1至603-5中的任一个)时与配对MPCM耦合。托架704还可以以扩展连接器717为特征。扩展连接器717通常可以包括插口、槽或其他类型的连接元件，其能够接受一种或多种类型的扩展模块(例如，扩展托架718)。通过与扩展托架718上的配对连接器耦合，扩展连接器717可以为物理资源705提供对驻留在扩展托架718上的补充计算资源705B的访问。实施例不限于此上下文。
图8示出了机架架构800的示例，该机架架构800可以表示可以被实现以便对以扩展能力为特征的托架(例如，图7的托架704)提供支持的机架架构。在图8中描绘的特定非限制性示例中，机架架构800包括七个托架空间803-1至803-7，其以相应的MPCM 816-1至816-7为特征。托架空间803-1至803-7包括相应的主区域803-1A至803-7A和相应的扩展区域803-1B至803-7B。关于每个这样的托架空间，当对应的MPCM与插入的托架的配对MPCM耦合时，主区域通常可以构成托架空间中的物理地容纳插入的托架的区域。在插入的托架配置有扩展模块的情况下，扩展区域通常可以构成托架空间中的可以物理地容纳这种模块(例如，图7的扩展托架718)的区域。
图9示出了根据一些实施例的机架902的示例，该机架902可以表示根据图8的机架架构800实现的机架。在图9中描绘的特定非限制性示例中，机架902以七个托架空间903-1至903-7为特征，其包括相应的主区域903-1A至903-7A和相应的扩展区域903-1B至903-7B。在各种实施例中，可以使用空气冷却系统来实现机架902中的温度控制。例如，如图9中所反映的，机架902可以以多个风扇921为特征，多个风扇921通常布置为在各种托架空间903-1至903-7内提供空气冷却。在一些实施例中，托架空间的高度大于常规的“1U”服务器高度。在这样的实施例中，与常规机架配置中使用的风扇相比，风扇921通常可以包括相对慢的大直径冷却风扇。相对于以较高速度运行的较小直径的冷却风扇，以较低速度运行较大直径的冷却风扇可以增加风扇寿命，同时仍提供相同的冷却量。托架比常规的机架尺寸物理地更浅。此外，在每个托架上布置组件以减少热遮蔽(即，没有沿空气流动方向串联地布置)。因此，更宽、更浅的托架允许提高设备性能，因为由于改进的冷却，设备可以在更高的热封套(例如，250W)下操作(即，没有热遮蔽，设备之间有更多空间，对于较大的散热器有更多余地等)。
MPCM 916-1至916-7可以被配置为向插入的托架提供对由相应的电力模块920-1至920-7源送的电力的访问，其中的每个电力模块可以从外部电源924汲取电力。在各种实施例中，外部电源924可以向机架902输送交流(AC)电力，并且电力模块920-1至920-7可以被配置为将这种AC电力转换为直流(DC)电力以供源送至插入的托架。在一些实施例中，例如，电力模块920-1至920-7可以被配置为将277伏AC电力转换为12伏DC电力，以经由相应的MPCM 916-1至916-7提供给插入的托架。实施例不限于此示例。
MPCM 916-1至916-7还可以布置为向插入的托架提供与双模光交换基础设施914的光信令连接，双模光交换基础设施914可以与图5的双模光交换基础设施514相同或相似。在各种实施例中，包含在MPCM 916-1至916-7中的光连接器可以被设计为与插入的托架的MPCM中包含的配对光连接器耦合，以经由相应长度的通过光布线922-1至922-7向这种托架提供与双模光交换基础设施914的光信令连接。在一些实施例中，每个这种长度的光布线可以从其对应的MPCM延伸到在机架902的托架空间外部的光互连织机923。在各种实施例中，光互连织机923可以布置为穿过机架902的支撑柱或其他类型的负载承载元件。实施例不限于此上下文。由于插入的托架经由MPCM连接到光交换基础设施，因此可以节省典型地耗费在手动配置机架布线以容纳新插入的托架方面的资源。
图10示出了根据一些实施例的托架1004的示例，该托架1004可以表示设计用于与图9的机架902结合使用的托架。托架1004可以以MPCM 1016为特征，MPCM 1016包括光连接器1016A和电力连接器1016B，并且被设计为与将MPCM 1016插入到托架空间中相结合而与托架空间的配对MPCM耦合。将MPCM 1016与这样的配对MPCM耦合可以使电力连接器1016与配对MPCM中包括的电力连接器耦合。这通常可以使得托架1004的物理资源1005能够经由电力连接器1016和电力传输介质1024从外部源来源送电力，电力传输介质1024将电力连接器1016导通地耦合到物理资源1005。
托架1004还可以包括双模光网络接口电路1026。双模光网络接口电路1026通常可以包括能够根据图9的双模光交换基础设施914支持的多个链路层协议中的每个链路层协议通过光信令介质进行通信的电路。在一些实施例中，双模光网络接口电路1026能够进行以太网协议通信和根据第二、高性能协议的通信两者。在各种实施例中，双模光网络接口电路1026可以包括一个或多个光收发器模块1027，其中的每个光收发器模块1027能够通过一个或多个光通道中的每个光通道发送和接收光信号。实施例不限于此上下文。
将MPCM 1016与给定机架中的托架空间的配对MPCM耦合可以使光连接器1016A与配对MPCM中包括的光连接器耦合。这通常可以经由一组光通道1025中的每个光通道1025在托架的光布线与双模光网络接口电路1026之间建立光连接。双模光网络接口电路1026可以经由电信令介质1028与托架1004的物理资源1005进行通信。除了托架的尺寸和组件在托架上的布置用于提供改进的冷却并且使得能够在相对较高的热封套(例如，250W)下操作之外，如上面参考图9描述的，在一些实施例中，托架可以包括一个或多个附加特征以促进空气冷却，例如，布置为消散由物理资源1005产生的热量的热管和/或散热器。值得注意的是，尽管图10中所描绘的示例托架1004不以扩展连接器为特征，但是根据一些实施例以托架1004的设计元素为特征的任何给定托架也可以以扩展连接器为特征。实施例不限于此上下文。
图11示出了根据各种实施例的数据中心1100的示例，该数据中心1100通常可以表示其中/对其而言可以实现本文中描述的一种或多种技术的数据中心。如图11所反映的，可以实现物理基础设施管理框架1150A以促进管理数据中心1100的物理基础设施1100A。在各种实施例中，物理基础设施管理框架1150A的一个功能可以是管理数据中心1100内的自动化维护功能，例如，使用机器人化的维护设备来对物理基础设施1100A内的计算设备进行检修。在一些实施例中，物理基础设施1100A可以以高级遥测系统为特征，该高级遥测系统执行足够鲁棒以支持对物理基础设施1100A的远程自动化管理的遥测报告。在各种实施例中，由这种高级遥测系统提供的遥测信息可以支持诸如故障预测/预防能力和容量规划能力之类的特征。在一些实施例中，物理基础设施管理框架1150A还可以被配置为使用硬件证实技术来管理对物理基础设施组件的认证。例如，机器人可以在安装之前通过分析从与要安装的每个组件相关联的射频识别(RFID)标签收集的信息来验证组件的真实性。实施例不限于此上下文。
如图11所示，数据中心1100的物理基础设施1100A可以包括光结构1112，其可以包括双模光交换基础设施1114。光结构1112和双模光交换基础设施1114可以分别与图4的光结构412和图5的双模光交换基础设施514相同或相似，并且可以在数据中心1100的托架之中提供高带宽、低延迟、多协议连接。如上面参考图1讨论的，在各种实施例中，这种连接的可用性可以使得分解和动态地池化诸如加速器、存储器和存储装置之类的资源可行。在一些实施例中，例如，一个或多个池化加速器托架1130可以包括在数据中心1100的物理基础设施1100A之中，其中的每个池化加速器托架1130可以包括经由光结构1112和双模光交换基础设施1114而其他托架可全局访问的、加速器资源(例如，协处理器和/或FPGA)的池。
在另一示例中，在各种实施例中，一个或多个池化存储托架1132可以包括在数据中心1100的物理基础设施1100A之中，其中的每个池化存储托架1132可以包括经由光结构1112和双模光交换基础设施1114而可供其他托架全局访问的、存储资源的池。在一些实施例中，这种池化存储托架1132可以包括诸如固态驱动器(SSD)之类的固态存储设备的池。在各种实施例中，一个或多个高性能处理托架1134可以包括在数据中心1100的物理基础设施1100A之中。在一些实施例中，高性能处理托架1134可以包括高性能处理器的池，以及增强空气冷却以产生高达250W或更高的较高热封套的冷却特征。在各种实施例中，任何给定的高性能处理托架1134可以以扩展连接器1117为特征，该扩展连接器1117可以接受远存储器扩展托架，使得该高性能处理托架1134本地可用的远存储器从包括在该托架上的处理器和附近存储器分解。在一些实施例中，这样的高性能处理托架1134可以使用包括低延迟SSD存储装置的扩展托架而配置有远存储器。光基础设施允许一个托架上的计算资源利用远程加速器/FPGA、存储器和/或SSD资源，这些资源在位于数据中心中的相同机架或任何其他机架上的托架上分解。远程资源可以位于上面参考图5描述的脊-叶网络架构中的一次交换机跳跃外或两次交换机跳跃外。实施例不限于此上下文。
在各种实施例中，可以将一个或多个抽象层应用于物理基础设施1100A的物理资源，以便定义虚拟基础设施，例如，软件定义的基础设施1100B。在一些实施例中，可以分配软件定义的基础设施1100B的虚拟计算资源1136以支持云服务1140的提供。在各种实施例中，可以将特定的各组虚拟计算资源1136分组以供以SDI服务1138的形式提供给云服务1140。云服务1140的示例可以包括但不限于软件即服务(SaaS)服务1142、平台即服务(PaaS)服务1144以及基础设施即服务(IaaS)服务1146。
在一些实施例中，可以使用虚拟基础设施管理框架1150B来进行对软件定义的基础设施1100B的管理。在各种实施例中，虚拟基础设施管理框架1150B可以被设计为与管理将虚拟计算资源1136和/或SDI服务1138分配给云服务1140相结合地实现工作负载指纹识别技术和/或机器学习技术。在一些实施例中，虚拟基础设施管理框架1150B可以与执行这样的资源分配相结合地使用/咨询遥测数据。在各种实施例中，可以实现应用/服务管理框架1150C以便为云服务1140提供QoS管理能力。实施例不限于此上下文。
现在参考图12，在一些实施例中，数据中心100、300、400、1100中的每个可以体现为或以其他方式包括数据中心1200。数据中心1200包括冷却控制器1202和一个或多个机架1500。每个机架1500包括安装在其中的冷却系统1220和一个或多个托架1300。另外，在一些实施例中，每个机架1500可以包括一个或多个温度传感器1260。温度传感器1260可以体现为能够产生传感器数据的任何类型的传感器，该传感器数据指示安装在对应机架1500中的一个或多个服务器托架1300的温度。尽管在图12中每个机架1500仅包括单个温度传感器1260，但是应当理解，在其他实施例中，每个机架1500可以包括多个温度传感器1260。例如，每个机架1500可以包括用于每个托架1300或者用于机架1500的被配置为接纳托架1300的托架槽的温度传感器1260。
在使用中，冷却控制器1202被配置为监测数据中心1200的每个托架1300的温度，并且基于所确定的托架1300的温度来控制机架1500的冷却系统1220。为此，在机架1500包括温度传感器1260的那些实施例中，冷却控制器1202可以监测由每个托架1300的温度传感器1330(参见图13)和/或每个机架1500的温度传感器1260产生的传感器数据。如下面更详细地讨论的，每个机架1500的冷却系统1220体现为被配置用于冷却对应托架1300的风扇阵列。因此，冷却控制器1202可以控制风扇阵列的各个风扇的速度，以基于感测到的或确定的特定托架1300的温度来控制对应托架1300的温度。然而，由于托架1300和机架1500两者的敞开性质，如下面更详细地讨论的，冷却控制器1202还可以根据需要通过控制与当前冷却特定托架1300的风扇阵列相邻的其他风扇阵列来增强对特定托架1300的冷却。例如，冷却控制器1202可以增加相邻风扇阵列的风扇速度，以向特定托架1300提供附加的冷却。以这种方式，冷却控制器1202可以通过利用更冷的托架1300的风扇阵列来补偿“热”托架1300。
应该理解，图12中所示的数据中心1200是非限制性的，并且数据中心1200可以包括为了描述的清楚起见而未在图12中示出的附加设备和/或组件。例如，数据中心1200可以包括各种数据中心管理器、协调器和/或其他管理服务器或计算设备。另外，数据中心1200可以包括用于促进数据中心内通信的各种设备，例如，交换机或路由器。
冷却控制器1202可以体现为能够控制个体机架1500的冷却系统1220的任何类型的控制器、服务器或其他计算设备。在说明性实施例中，冷却控制器1202包括处理器1210、存储器1212、输入/输出(I/O)子系统1214和通信电路1216。在一些实施例中，冷却控制器1202的说明性组件中的一个或多个说明性组件可以并入另一组件中，或者以其他方式形成另一组件的一部分。例如，在一些实施例中，存储器1212或其部分可以并入处理器1210中。
处理器1210可以体现为能够执行本文描述的功能的任何类型的处理器。例如，处理器1210可以体现为(多个)单核或多核处理器、单插口或多插口处理器、数字信号处理器、图形处理器、微控制器或其他处理器或处理/控制电路。类似地，存储器1212可以体现为能够执行本文描述的功能的任何类型的易失性或非易失性存储器或数据存储装置。在操作中，存储器1212可以存储在冷却控制器1202的操作期间使用的各种数据和软件，例如，操作系统、应用、程序、库和驱动程序。存储器1212经由I/O子系统1214通信地耦合到处理器1210，I/O子系统1214可以体现为促进与处理器1210、存储器1212和冷却控制器1202的其他组件的输入/输出操作的电路和/或组件。例如，I/O子系统1214可以体现为或以其他方式包括存储器控制器中心、输入/输出控制中心、固件设备、通信链路(即，点对点链路、总线链路、电线、电缆、光导、印刷电路板迹线等)和/或促进输入/输出操作的其他组件和子系统。在一些实施例中，I/O子系统1214可以形成片上系统(SoC)的一部分并且与处理器1210、存储器1212和冷却控制器1202的其他组件一起合并在单个集成电路芯片上。
通信电路1216可以体现为能够实现冷却控制器1202与托架1300和机架1500之间的通信的任何类型的通信电路、设备或其集合。为此，通信电路1216可以被配置为使用任何一种或多种通信技术和相关联的协议(例如，以太网、
Figure GDA0002710013950000141
WiMAX、近场通信(NFC)等)来实现这种通信。
在一些实施例中，冷却控制器1202可以包括一个或多个外围设备1218，例如，常见地在计算设备中找到的那些外围设备。例如，外围设备1218可以包括键盘、鼠标、显示器等。
现在参考图13和图14，在一些实施例中，托架204-1至204-4、404A-1和404A-2、404B-1和404B-2、404C-1和404C-2以及404D-1和404D-2、504A和504B、704、1004中的每个可以体现为托架1300。如下面讨论的，托架1300被配置为安装在数据中心1200的对应机架1500(参见图14-20)中。在一些实施例中，托架1300可以被优化或以其他方式配置用于执行特定任务，例如，计算任务、加速任务、数据存储任务等。
说明性托架1300包括无机箱电路板基底1302，其支撑安装在其上的各种电气组件。应当理解，电路板基底1302是“无机箱”的，因为托架1300不包括壳体或外壳。而是，无机箱电路板基底1302对本地环境开放。无机箱电路板基底1302可以由能够支撑安装在其上的各种电气组件的任何材料形成。例如，在说明性实施例中，无机箱电路板基底1302由FR-4玻璃强化环氧树脂层压材料形成。当然，在其他实施例中，可以使用其他材料来形成无机箱电路板基底1302。
无机箱电路板基底1302包括多个特征，这些特征改进安装在无机箱电路板基底1302上的各种电气组件的热冷却特性。如所讨论的，无机箱电路板基底1302不包括壳体或外壳，其可以通过减少可能抑制空气流动的那些结构来改进通过托架1300的电气组件的空气流动。例如，因为没有将无机箱电路板基底1302放置在单独的壳体或外壳中，所以没有可能抑制跨电气组件的空气流动的、到无机箱电路板基底1302的背板(例如，机箱的背板)。另外，无机箱电路板基底1302具有被配置为减小跨安装到无机箱电路板基底1302的电气组件的空气流动路径的长度的几何形状。例如，说明性无机箱电路板基底1302的宽度1304大于无机箱电路板基底1302的深度1306。在一个特定实施例中，例如，与宽度约为17英寸且深度约为30英寸的典型的服务器相比，无机箱电路板基底1302的宽度约为21英寸并且深度约为9英寸。因此，从无机箱电路板基底1302的前边缘1310朝向后边缘1312延伸的空气流动路径1308具有相对于典型服务器更短的距离，这可以改进托架1300的热冷却特性。此外，尽管未在图13中示出，但是安装到无机箱电路板基底1302的各种电气组件安装在对应的位置，使得没有两个实质上产生热量的电气组件彼此遮蔽，如下面更详细地讨论的。即，没有在操作期间产生可观热量(即，大于标称热量)的两个电气组件沿着空气流动路径1308的方向(即，沿着从无机箱电路板基底1302的前边缘1310朝向后边缘1312延伸的方向)彼此呈一条直线地安装到无机箱电路板基底1302。
说明性托架1300包括安装到无机箱电路板基底1302的顶侧1350的一个或多个物理资源1320。当然，在其他实施例中，物理资源1320中的一个或多个可以安装到无机箱电路板基底1302的底侧1450。另外，尽管图13中示出了两个物理资源1320，但是应当理解，在其他实施例中，托架1300可以包括一个、两个或更多个物理资源1320。物理资源1320可以体现为能够取决于例如托架1300的类型或预期功能而执行各种任务(例如，计算功能和/或控制托架1300的功能)的任何类型的处理器、控制器或其他计算电路。例如，如下面更详细地讨论的，在托架1300体现为计算托架的实施例中，物理资源1320可以体现为高功率处理器，在托架1300体现为加速器托架的实施例中，物理资源1320可以体现为加速器协处理器或电路，和/或在托架1300体现为存储托架的实施例中，物理资源1320可以体现为存储控制器。
托架1300还包括一个或多个温度传感器1330和基板管理控制器1332。温度传感器1330可以体现为能够产生传感器数据的任何类型的传感器，该传感器数据指示托架1300和/或托架1300的特定电气组件的温度。例如，在一些实施例中，温度传感器1330中的一个或多个可以附接到或并入托架1300的电气组件。在一些实施例中，例如，每个物理资源1320可以包括附接到其上或嵌入其中的温度传感器1330，以用于感测个体物理资源1320的温度。
基板管理控制器1332可以体现为能够监测温度传感器1330并将传感器数据报告给冷却控制器1202的任何设备。例如，基板管理控制器1332可以体现为硬件、固件或软件。基板管理控制器1332被配置为从温度传感器1330捕获传感器数据并将传感器数据发送到冷却控制器1202。在说明性实施例中，基板管理控制器1332体现为能够通过带外信道(即，至少部分地专用于与基板管理控制器1332的功能相关的通信的信道)与温度传感器1330和冷却控制器1202通信的硬件。当然，在其他实施例中，基板管理控制器1332可以被配置为使用虚拟专用网络(VPN)通过建立的网络连接经由虚拟“带内”信道与冷却控制器1202进行通信。另外，在一些实施例中，基板管理控制器1332可以与诸如智能平台管理接口(IPMI)之类的一个或多个计算机接口规范兼容。应当理解，在一些实施例中，基板管理控制器1332的功能(包括通信)可以独立于托架1300的其余部分的操作来执行。
托架1300还包括安装到无机箱电路板基底1302的顶侧1350的一个或多个附加物理资源1336。在说明性实施例中，附加物理资源包括网络接口控制器(NIC)、主机结构接口(HFI)和/或其他通信电路。当然，取决于托架1300的类型和功能，在其他实施例中，物理资源1336可以包括附加或其他的电气组件、电路和/或设备。当然，在其他实施例中，附加物理资源1336中的一些或全部可以安装到无机箱电路板基底1302的底侧1450。
物理资源1320经由输入/输出(I/O)子系统1322通信地耦合到基板管理控制器1332和/或附加物理资源1336。I/O子系统1322可以体现为用于促进与物理资源1320、基板管理控制器1332、附加物理资源1336和/或托架1300的其他组件的输入/输出操作的电路和/或组件。例如，I/O子系统1322可以体现为或以其他方式包括存储器控制器中心、输入/输出控制中心、集成传感器中心、固件设备、通信链路(例如，点对点链路、总线链路、电线、电缆、光导、印刷电路板迹线等)和/或促进输入/输出操作的其他组件和子系统。在说明性实施例中，I/O子系统1322体现为或以其他方式包括双倍数据速率4(DDR4)数据总线或DDR5数据总线。
托架1300还包括电力连接器1340，其被配置为当托架1300安装在机架1500中时与机架1500的对应电力连接器配合。托架1300经由电力连接器1340从机架1500的电源接收电力，以向托架1300的各种电气组件供应电力。即，托架1300不包括任何用于向托架1300的电气组件提供电力的本地电源(即，板载电源)。排除本地或板载电源促进减少无机箱电路板基底1302的总体占用面积，这可以增加安装在无机箱电路板基底1302上的各种电气组件的热冷却特性，如上面讨论的。
除了缺少本地或板载电源之外，还应当理解，说明性托架1300还不包括用于冷却托架1300的电气组件的本地或板载冷却系统。即，托架1300不包括板载风扇或其他有源冷却设备或系统。例如，虽然物理资源1320可以包括散热器或其他无源冷却设备，但物理资源1320的散热器不包括附接到其上的风扇。另外，因为无机箱电路板基底1302不包括壳体或外壳，所以没有风扇或其他有源冷却系统如在标准服务器中典型的那样附接到壳体。而是，如下面讨论的，托架1300经由机架1500的冷却系统1220接收冷却，如下面更详细地讨论的。
现在参考图14，除了安装在无机箱电路板基底1302的顶侧1350上的物理资源1336之外，托架1300还包括安装到无机箱电路板基底的底侧1450的一个或多个存储器设备1420。即，无机箱电路板基底1302体现为双面电路板。在一些实施例中，托架1300还可以包括一个或多个温度传感器1330，其安装到无机箱电路板基底1302的顶侧1350或者安装到被安装在其上的电气组件。物理资源1320经由I/O子系统1322通信地耦合到存储器设备1420。例如，物理资源1320和存储器设备1420可以通过延伸穿过无机箱电路板基底1302的一个或多个通孔通信地耦合。在一些实施例中，每个物理资源1320可以通信地耦合到一组不同的一个或多个存储器设备1420。可替代地，在其他实施例中，每个物理资源1320可以通信地耦合到每个存储器设备1420。
存储器设备1420可以体现为能够在托架1300的操作期间存储用于物理资源1320的数据的任何类型的存储器设备。例如，在说明性实施例中，存储器设备1420体现为双列直插式存储器模块(DIMM)，其可以支持DDR、DDR2、DDR3、DDR4或DDR5随机存取存储器(RAM)。当然，在其他实施例中，存储器设备1420可以利用其他存储器技术，包括易失性和/或非易失性存储器。例如，易失性存储器的类型可以包括但不限于数据速率同步动态RAM(DDRSDRAM)、静态随机存取存储器(SRAM)、晶闸管RAM(T-RAM)或零电容器RAM(Z-RAM)。非易失性存储器的类型可以包括字节或块可寻址类型的非易失性存储器。字节或块可寻址类型的非易失性存储器可以包括但不限于3维(3-D)交叉点存储器、使用硫属化物相变材料(例如，硫属化物玻璃)的存储器、多阈值级别NAND闪速存储器、NOR闪速存储器、单级或多级相变存储器(PCM)、电阻式存储器、纳米线存储器、铁电晶体管随机存取存储器(FeTRAM)、包含忆阻器技术的磁阻随机存取存储器(MRAM)存储器、或自旋转移扭矩MRAM(STT-MRAM)或上述中的任一个的组合，或其他非易失性存储器类型。
应当理解，在其他实施例中，托架1300可以具有与本文描述的说明性实施例不同的配置和拓扑。因此，应该理解，图13和图14中所示的组件图仅是托架1300的说明性逻辑表示，并不是限制性的。例如，虽然托架1300的特定组件已经描述为安装在无机箱电路板基底1302的顶侧1350或底侧1450，但是在其他实施例中这些组件可以安装在无机箱电路板基底1302的另一侧。
现在参考图15-17，在一些实施例中，上面讨论的机架102A至102D、202、302-1至302-32、402A至402D、902中的每个可以体现为机架1500。说明性机架1500包括垂直布置的两个细长支撑柱1502、1504。例如，细长支撑柱1502、1504可以在展开时从数据中心1200的地面向上延伸。机架1500还包括细长支撑臂1512的一个或多个水平对1510，其被配置为支撑托架1300，如下面讨论的。细长支撑臂1512的每个对1510包括从细长支撑柱1502向外延伸的细长支撑臂1512和从细长支撑柱1504向外延伸的对应细长支撑臂1512。作为说明性示例，细长支撑臂1512的一个说明性对1510在图15中以虚线椭圆标示。
细长支撑臂1512的每个对1510限定机架1500的托架槽1520，其被配置为接纳托架1300。为此，每个细长支撑臂1512包括固定到或以其他方式安装到对应细长支撑臂1512的顶侧1532的电路板引导件1530。例如，在说明性实施例中，每个电路板引导件1530相对于对应细长支撑柱1502、1504安装在对应细长支撑臂1512的远端。为了图清楚起见，并未在每幅图中标示每个电路板引导件1530。
说明性机架1500包括细长支撑臂1512的七个对1510，其限定对应的七个托架槽1520，每个托架槽1520被配置为接纳和支撑对应托架1300，如上面讨论的。当然，在其他实施例中，机架1500可以包括附加的或更少的细长支撑臂1512的对1510(即，附加的或更少的托架槽1520)。应当理解，因为托架1300是无机箱的，所以托架1300相对于典型的服务器具有总体降低的高度。因此，在一些实施例中，每个托架槽1520的高度可以短于典型服务器的高度(例如，短于单个等级单元，“1U”)。即，细长支撑臂1512的每个对1510之间的垂直距离可以小于标准等级单元“1U”。另外，由于托架槽1520的高度相对减小，所以机架1500的总体高度可以短于传统机架外壳的高度。例如，在一些实施例中，细长支撑柱1502、1504中的每个可以具有6英尺或更短的长度。再次，在其他实施例中，机架1500可以具有不同的尺寸。此外，应当理解，机架1500不包括任何壁、外壳等。而是，机架1500是无外壳的机架，其向本地环境开放。当然，在一些情况下，在机架1500在数据中心1200中形成行末端机架的那些情形中，端板可以附接到细长支撑柱1502、1504中的一个。
如图16所示，说明性机架1500还包括用于细长支撑臂1512的每个对1510的交叉支撑臂1550。每个交叉支撑臂1550包括固定到细长支撑柱1502的远端1552和固定到细长支撑柱1504的相对远端1554，使得每个交叉支撑臂1550在水平方向上在细长支撑柱1502、1504之间延伸。当然，在其他实施例中，机架1500可以包括附加的交叉支撑臂1550。例如，在说明性实施例中，机架1500包括朝向细长支撑柱1502的顶部定位的附加的交叉支撑臂1550，其用于支撑风扇阵列1580，如下面更详细地讨论的。
每个交叉支撑臂1550包括支撑平台1560，对应光数据连接器1534安装在支撑平台1560上。每个光数据连接器1534与对应托架槽1520相关联，并且被配置为当服务器托架1300被接纳在对应托架槽1520中时与托架1300的光数据连接器配合。
说明性机架1500还包括与每个托架槽1520相关联的电源1570。每个电源1570固定到细长支撑臂1512的对1510的、限定对应托架槽1520的细长支撑臂1512中的一个。例如，如图16所示，机架1500可以包括耦合或固定到从细长支撑柱1502延伸的每个细长支撑臂1512的电源1570。每个电源1570包括电力连接器1572，其被配置为当托架1300被接纳在对应托架槽1520中时与托架1300的电力连接器1340配合，如图17所示。如上面讨论的，托架1300不包括任何板载电源，并且因此，当安装到机架1500时，电源1570向对应托架1300提供电力。
如上面讨论的，机架1500还包括冷却系统1220。在说明性实施例中，冷却系统1220体现为多个风扇阵列1580，其中的每个风扇阵列1580包括成行布置的多个风扇。如图16所示，每个风扇阵列1580在细长支撑柱1502、1504之间以水平线对齐。在说明性实施例中，风扇阵列1580经由夹子或类似的安装机构固定到交叉支撑臂1550。每个风扇阵列1580与机架1500的托架槽1520中的不同的一个托架槽相关联，并且是可控的以向接纳在其对应托架槽1520中的托架1300提供冷却。
如图18所示，每个风扇阵列1580在这样的位置耦合到对应交叉支撑臂1550：使得风扇阵列1580向无机箱电路板基底1302的顶侧1350和底侧1450上的电气组件提供冷却。例如，如图18所示，每个风扇阵列1580的至少一部分被放置在当托架1300被接纳在与特定风扇阵列1580相关联的托架槽1520中时由托架1300的无机箱电路板基底1302限定的平面1800上方。另外，每个风扇阵列1580的至少一部分位于平面1800下方。在说明性实施例中，例如，风扇阵列1580的大约80％可以位于平面1800上方，并且风扇阵列1580的大约20％可以位于平面1800下方。另外，在一些实施例中，由于安装的托架1300之间的垂直距离增加，风扇阵列1580的风扇的直径可以大于典型的服务器。
在操作中，风扇阵列1580沿着空气流动路径1308抽吸空气以冷却位于无机箱电路板基底1302的顶侧1350和底侧1450上的电气组件。然而，如下面更详细地讨论的，由特定风扇阵列1580提供的冷却可以根据需要由相邻风扇阵列1580增强。
现在参考图19，在使用中，冷却控制器1202可以建立环境1900。说明性环境1900包括通信器1902、温度分析器1904、冷却系统控制器1906和冷却增强器1908。环境1900的各种组件可以体现为硬件、固件、软件或其组合。因此，在一些实施例中，环境1900的组件中的一个或多个组件可以体现为电路或电气设备的集合(例如，通信器电路1902、温度分析器电路1904、冷却系统控制器电路1906和冷却增强器电路1908等)。应当理解，在这样的实施例中，通信器电路1902、温度分析器电路1904、冷却系统控制器电路1906和/或冷却增强器电路1908中的一个或多个可以形成处理器1210、I/O子系统1214、通信电路1216和/或冷却控制器1202的其他组件中的一个或多个的一部分。另外，在一些实施例中，环境1900的说明性组件中的一个或多个说明性组件可以形成另一组件的一部分和/或说明性组件中的一个或多个说明性组件可以彼此独立。
如上面讨论的，可以体现为硬件、固件、软件、虚拟化硬件、仿真架构和/或其组合的通信器1902被配置为与托架1300和机架1500通信。特别地，通信器1902从托架1300的温度传感器1330(例如，从基板管理控制器1332)和/或从机架1500的温度传感器1260接收传感器数据，并将控制信号发送到机架1500的冷却系统1220以控制其操作。为此，通信器1902可以使用任何合适的通信协议和/或技术。
如上面讨论的，同样可以体现为硬件、固件、软件、虚拟化硬件、仿真架构和/或其组合的温度分析器1904被配置为分析从温度传感器1260、1330接收的传感器数据，并且基于此确定一个或多个托架1300的温度。另外，温度分析器1904被配置为分析所确定的温度以确定对应托架1300的冷却参数。例如，温度分析器1904可以确定与其中接纳或安装特定的托架1300的托架槽1520相关联的风扇阵列1580的风扇速度。为此，温度分析器1904可以包括托架温度比较器1910，其被配置为将所确定的托架1300的温度与参考阈值进行比较。另外或可替代地，在一些实施例中，托架温度比较器1910可以被配置为通过在一段时间内分析托架1300的温度来执行一定量的温度预测，以预测托架1300的未来温度。在这样的实施例中，温度分析器1904可以基于特定托架1300的预测温度来确定冷却参数。
如上面讨论的，同样可以体现为硬件、固件、软件、虚拟化硬件、仿真架构和/或其组合的冷却系统控制器1906被配置为基于来自温度分析器1904(例如，基于所确定的冷却参数)和/或冷却增强器1908的指引来控制冷却系统1220的操作，如下面讨论的。为此，说明性冷却系统控制器1906包括风扇速度控制器1920，其被配置为控制与其中接纳或安装特定托架1300的托架槽1520相关联的风扇阵列1580的风扇的风扇速度。
如上面讨论的，同样可以体现为硬件、固件、软件、虚拟化硬件、仿真架构和/或其组合的冷却增强器1908被配置为确定对特定托架1300的冷却是否要求增强。即，冷却增强器1908被配置为确定托架1300是否正在“热”运行，并且如果托架1300正在“热”运行，则尝试通过控制一个或多个相邻风扇阵列1580来补充由托架1300的相关联的风扇阵列1580提供的对该托架1300的冷却。例如，在其中没有托架1300安装在相邻托架槽1520中的实施例中，可以关闭相邻托架槽1520的相关联的风扇阵列1580。在这样的实施例中，冷却增强器1908可以被配置为控制打开相邻托架槽1520的风扇阵列1580，以向“热”托架1300提供附加的冷却。在其中存在托架1300安装在相邻托架槽1520中的其他实施例中，冷却增强器1908可以被配置为调节相邻托架槽1520的风扇阵列1580的风扇速度，以增加对“热”托架1300的冷却。以这种方式，冷却增强器1908可以增强对特定托架1300的冷却。
图20中示出了增强对托架1300A的冷却的示例。在说明性示例中，托架1300A被接纳在机架1500的托架槽1520A中。另外，另一托架1300B被接纳在下部相邻托架槽1520B中，并且没有托架1300被接纳在上部相邻托架槽1520C中。在正常操作期间，与托架槽1520A相关联的风扇阵列1580A向托架1300A提供足够的冷却。然而，如果冷却增强器1908确定由风扇阵列1580A提供的对托架1300A的冷却要求增强，则冷却增强器1908可以增加相邻风扇阵列1580B和1580C的风扇速度。例如，冷却增强器1908可以增加风扇阵列1580B的风扇速度和/或打开风扇阵列1580C(其当前可以关闭，因为没有托架1300安装在托架槽1520C中)。应当理解，因为机架1500和托架1300是敞开的(即，机架1500和托架1300都不包括阻挡空气流动的外壳)，所以在冷却托架1300A时，通过风扇阵列1580B的操作提供的空气流动1308B和通过风扇阵列1580C的操作提供的空气流动1308C可以补充由风扇阵列1580A提供的空气流动1308A。
返回参考图19，应当理解，在一些情况下，由于相邻风扇阵列1580的当前操作，冷却增强器1908可能不能增强风扇阵列1580的冷却。因此，在一些实施例中，冷却增强器1908可以被配置为确定是否可以增强由特定风扇阵列1580提供的冷却。为此，冷却增强器1908可以包括风扇速度确定器1930。风扇速度确定器1930被配置为确定任何相邻风扇阵列1580的当前风扇速度，并且将当前风扇速度与参考阈值进行比较以确定是否可以增加相邻风扇阵列1580的风扇速度。即，在一些情况下，由特定风扇阵列1580提供的冷却可能不会增强，因为相邻风扇阵列1580已经以最大风扇速度操作。当然，应该理解，通过使托架1300在倾向于“热”运行的特定机架1500以及倾向于“冷却”运行的托架1300中交错或分布，可以增加对托架1300的冷却的效率。
现在参考图21，在使用中，冷却控制器1202可以执行方法2100，用于管理对安装在数据中心1200的机架1500中的服务器托架1300的冷却。方法2100开始于框2102，其中冷却控制器1202监测托架1300的温度。为此，在框2104中，冷却控制器1202可以接收指示每个被监测托架1300的温度的传感器数据。如上面讨论的，冷却控制器1202可以从托架1300的温度传感器1330(例如，从基板管理控制器1332)和/或从机架1500的温度传感器1260接收这样的传感器数据。在框2106中，冷却控制器1202可以基于接收到的传感器数据来确定每个被监测托架1300的温度。
随后，在框2108中，冷却控制器1202基于所确定的安装在对应机架1500中的托架1300的温度来控制每个机架1500的冷却系统1220。为此，在框2110中，冷却控制器1202控制每个机架1500的每个风扇阵列1580的风扇速度以控制被监测托架1300的温度，如上面讨论的。
在框2112中，冷却控制器1202分析所确定的每个被监测托架1300的温度，以确定对被监测托架1300中的任一个的冷却是否要求增强。即，冷却控制器1202确定任何托架1300是否正在“热”运行。为此，在框2114中，冷却控制器1202可以将每个被监测服务器托架1300的温度与参考阈值进行比较。另外或可替代地，在框2116中，冷却控制器1202可以将每个托架1300的温度与相邻托架1300(即，安装在相邻托架槽1520中的托架1300)的温度进行比较。如果例如特定托架1300的温度高于参考阈值和/或高于相邻托架1300的温度达参考量，则冷却控制器1202可以确定应当增强对特定托架1300的冷却。
在框2118中，冷却控制器1202基于在框2112中执行的分析来确定任何托架1300是否要求增强的冷却。如果不要求增强的冷却，则方法2100循环回到框2102，其中冷却控制器1202继续监测托架1300的温度。然而，如果冷却控制器1202确定应该增强对特定托架1300的冷却，则方法2100前进到框2120。在框2120中，冷却控制器1202确定是否可以增强对特定托架1300(即，确定为“热”运行的托架1300)的冷却。为此，在框2122中，冷却控制器1202确定一个或多个相邻风扇阵列1580(即，与其中接纳所识别的服务器托架1300的托架槽1520相邻的托架槽1520的风扇阵列1580)的风扇速度。在框2124中，冷却控制器1202将所确定的相邻风扇阵列1580的风扇速度与参考阈值进行比较，以确定是否可以增强对所识别的托架1300的冷却。即，冷却控制器1202确定是否可以增加相邻风扇阵列1580的风扇速度。
在框2126中，冷却控制器基于在框2120中执行的确定来确定是否增强对所识别的托架1300的冷却。如果不增强对所识别的托架1300的冷却，则方法2100循环回到框2102，其中冷却控制器1202继续监测托架1300的温度。然而，如果冷却控制器1202确定增强对所识别的服务器托架1300的冷却，则方法2100前进到框2128。在框2128中，冷却控制器1202调节(多个)相邻风扇阵列1580的风扇速度。具体地，在框2130中，冷却控制器1202可以增加(多个)相邻风扇阵列1580的风扇速度。在调节相邻风扇阵列1580的风扇速度之后，方法2100循环回到框2102，其中冷却控制器1202继续监测托架1300的温度。
示例
以下提供本文公开的技术的说明性示例。这些技术的实施例可以包括下面描述的示例中的任何一个或多个以及其任何组合。
示例1包括一种数据中心的冷却控制器，该冷却控制器包括：一个或多个处理器；一个或多个存储器设备，其中存储有多个指令，该多个指令当由一个或多个处理器执行时，使得冷却控制器：监测指示安装在机架的第一托架槽中的第一托架的温度的传感器数据；以及基于托架的温度来控制机架的冷却系统，以控制托架的温度。
示例2包括示例1的主题，并且其中，监测指示第一托架的温度的传感器数据包括：从第一托架的温度传感器接收指示第一托架的温度的传感器数据。
示例3包括示例1和2中任一项的主题，并且其中，监测指示第一托架的温度的传感器数据包括：从机架的温度传感器接收指示第一托架的温度的传感器数据。
示例4包括示例1-3中任一项的主题，并且其中，控制机架的冷却系统包括：控制机架的第一托架槽的风扇阵列的风扇速度，以冷却托架。
示例5包括示例1-4中任一项的主题，并且其中，该多个指令当由一个或多个处理器执行时，还使得冷却控制器基于第一托架的温度来确定由第一托架槽的风扇阵列提供的对第一托架的冷却是否要求增强。
示例6包括示例1-5中任一项的主题，并且其中，确定对第一托架的冷却是否要求增强包括：将第一托架的温度与参考阈值温度进行比较。
示例7包括示例1-6中任一项的主题，并且其中，确定对第一托架的冷却是否要求增强包括：将第一托架的温度与第二托架的温度进行比较，第二托架被安装在机架的与第一托架槽相邻的第二托架槽中。
示例8包括示例1-7中任一项的主题，并且其中，该多个指令当由一个或多个处理器执行时，还使得冷却控制器响应于确定对第一托架的冷却要求增强而调节与第一托架槽相邻的第二托架槽的一个或多个风扇阵列的风扇速度。
示例9包括示例1-8中任一项的主题，并且其中，该多个指令当由一个或多个处理器执行时，还使得冷却控制器响应于确定对第一托架的冷却要求增强而基于与第一托架槽相邻的第二托架槽的风扇阵列的风扇速度来确定是否增强对第一托架的冷却。
示例10包括示例1-9中任一项的主题，并且其中，该多个指令当由一个或多个处理器执行时，还使得冷却控制器响应于确定增强对第一托架的冷却而调节第二托架槽的风扇阵列的风扇速度，以增强对第一托架槽的冷却。
示例11包括示例1-10中任一项的主题，并且其中，调节第二托架槽的风扇阵列的风扇速度包括增加风扇速度。
示例12包括一种用于管理对数据中心的服务器机架的冷却的方法，该方法包括：由数据中心的冷却控制器监测指示安装在机架的第一托架槽中的第一托架的温度的传感器数据，其中，托架包括无机箱电路板基底；以及基于托架的温度来控制机架的冷却系统，以控制托架的温度。
示例13包括示例12的主题，并且其中，监测指示第一托架的温度的传感器数据包括：从第一托架的温度传感器接收指示第一托架的温度的传感器数据。
示例14包括示例12和13中任一项的主题，并且其中，监测指示第一托架的温度的传感器数据包括：从机架的温度传感器接收指示第一托架的温度的传感器数据。
示例15包括示例12-14中任一项的主题，并且其中，控制机架的冷却系统包括：控制机架的第一托架槽的风扇阵列的风扇速度，以冷却托架。
示例16包括示例12-15中任一项的主题，并且还包括：基于第一托架的温度来确定由第一托架槽的风扇阵列提供的对第一托架的冷却是否要求增强。
示例17包括示例12-16中任一项的主题，并且其中，确定对第一托架的冷却是否要求增强包括：将第一托架的温度与参考阈值温度进行比较。
示例18包括示例12-17中任一项的主题，并且其中，确定对第一托架的冷却是否要求增强包括：将第一托架的温度与第二托架的温度进行比较，第二托架被安装在机架的与第一托架槽相邻的第二托架槽中。
示例19包括示例12-18中任一项的主题，并且还包括：响应于确定对第一托架的冷却要求增强，调节与第一托架槽相邻的第二托架槽的风扇阵列的风扇速度。
示例20包括示例12-19中任一项的主题，并且还包括：响应于确定对第一托架的冷却要求增强，基于与第一托架槽相邻的第二托架槽的风扇阵列的风扇速度来确定是否增强对第一托架的冷却。
示例21包括示例12-20中任一项的主题，并且还包括：响应于确定增强对第一托架的冷却，调节第二托架槽的风扇阵列的风扇速度，以增强对第一托架槽的冷却。
示例22包括示例12-21中任一项的主题，并且其中，调节第二托架槽的风扇阵列的风扇速度包括增加风扇速度。
示例23包括一种或多种机器可读存储介质，包括存储在其上的多个指令，该多个指令响应于被执行而使得数据中心的冷却控制器执行示例12-22中任一项的方法。
示例24包括一种冷却控制器，其包括：通信电路，该通信电路用于接收指示安装在机架的第一托架槽中的第一托架的温度的传感器数据，其中，托架包括无机箱电路板基底；以及用于基于托架的温度来控制机架的冷却系统以控制托架的温度的单元。
示例25包括示例24的主题，并且其中，通信电路用于从第一托架的温度传感器接收传感器数据。
示例26包括示例24和25中任一项的主题，并且其中，通信电路用于从机架的温度传感器接收传感器数据。
示例27包括示例24-26中任一项的主题，并且其中，用于控制机架的冷却系统的单元包括：用于控制机架的第一托架槽的风扇阵列的风扇速度以冷却托架的单元。
示例28包括示例24-27中任一项的主题，并且还包括：用于基于第一托架的温度来确定由第一托架槽的风扇阵列提供的对第一托架的冷却是否要求增强的单元。
示例29包括示例24-28中任一项的主题，并且其中，用于确定对第一托架的冷却是否要求增强的单元包括：用于将第一托架的温度与参考阈值温度进行比较的单元。
示例30包括示例24-29中任一项的主题，并且其中，用于确定对第一托架的冷却是否要求增强的单元包括：用于将第一托架的温度与第二托架的温度进行比较的单元，第二托架被安装在机架的与第一托架槽相邻的第二托架槽中。
示例31包括示例24-30中任一项的主题，并且还包括：用于响应于确定对第一托架的冷却要求增强而调节与第一托架槽相邻的第二托架槽的风扇阵列的风扇速度的单元。
示例32包括示例24-31中任一项的主题，并且还包括：用于响应于确定对第一托架的冷却要求增强而基于与第一托架槽相邻的第二托架槽的风扇阵列的风扇速度来确定是否增强对第一托架的冷却的单元。
示例33包括示例24-32中任一项的主题，并且还包括：用于响应于确定增强对第一托架的冷却而调节第二托架槽的风扇阵列的风扇速度以增强对第一托架槽的冷却的单元。
示例34包括示例24-33中任一项的主题，并且其中，用于调节第二托架槽的风扇阵列的风扇速度的单元包括用于增加风扇速度的单元。
示例35包括一种支持多个托架的机架，该机架包括：两个细长支撑柱，其垂直地延伸；多对细长支撑臂，其中，每对细长支撑臂包括从两个细长支撑柱中的第一支撑柱向外延伸的第一支撑臂和从两个细长支撑柱中的第二支撑柱向外延伸的第二支撑臂，其中，每对细长支撑臂限定用于接纳对应托架的托架槽；以及冷却系统，其包括多个风扇阵列，其中，每个风扇阵列包括多个风扇并且与不同的托架槽相关联，其中，每个风扇阵列是可控的，以向被接纳在对应托架槽中的服务器托架提供冷却。
示例36包括示例35的主题，并且其中，每个风扇阵列的每个风扇被放置为使得：每个风扇的至少第一部分被放置在当对应托架被接纳在对应风扇阵列与其相关联的托架槽中时由对应托架的无机箱电路板基底限定的平面上方，并且每个风扇的第二部分被放置在平面下方。
示例37包括示例35和36中任一项的主题，并且其中，每个风扇的大约80％被放置在平面上方，并且每个风扇的大约20％被放置在平面下方。
示例38包括示例35-37中任一项的主题，并且还包括：多个交叉支撑臂，其中，每个交叉支撑臂与不同的托架槽相关联，并且包括耦合到第一支撑柱的第一端、耦合到第二支撑柱的第二端以及支撑平台，并且其中，每个风扇阵列耦合到多个交叉支撑臂中的至少一个交叉支撑臂。
示例39包括示例35-38中任一项的主题，并且其中，每个细长支撑臂包括附接到对应细长支撑臂的顶侧的电路板引导件，其中，每个电路板引导件包括电路板槽，用于当对应托架被接纳在对应托架槽中时接纳对应托架的无机箱电路板基底的侧边缘，并且其中，每个风扇阵列的每个风扇被放置为使得：每个风扇的至少第一部分被放置在当对应托架被接纳在对应风扇阵列与其相关联的对应托架槽中时由对应托架的无机箱电路板基底限定的平面上方，并且每个风扇的第二部分被放置在平面下方。
示例40包括示例35-39中任一项的主题，并且其中，每个风扇的大约80％被放置在平面上方，并且每个风扇的大约20％被放置在平面下方。

Claims (27)

1.一种数据中心的冷却控制器，所述冷却控制器包括：
一个或多个处理器；
一个或多个存储器设备，其中存储有多个指令，所述多个指令当由所述一个或多个处理器执行时，使得所述冷却控制器：
监测指示安装在机架的第一托架槽中的第一托架的温度的传感器数据；以及
基于所述第一托架的温度来控制所述机架的冷却系统，以控制所述第一托架的温度；
将所述第一托架的温度与第二托架的温度进行比较，所述第二托架被安装在所述机架的与所述第一托架槽相邻的第二托架槽中；
响应于确定所述第一托架的温度是否大于所述第二托架的温度达到一参考量，确定由所述第一托架槽的风扇阵列提供的对所述第一托架的冷却是否要求增强。
2.根据权利要求1所述的冷却控制器，其中，控制所述机架的冷却系统包括：控制所述机架的第一托架槽的风扇阵列的风扇速度，以冷却所述托架。
3.根据权利要求2所述的冷却控制器，其中，所述第一托架包括无机箱电路板基底，所述无机箱电路板基底没有被包封在专用于容纳所述第一托架的托架机箱内。
4.根据权利要求1所述的冷却控制器，其中，确定对所述第一托架的冷却是否要求增强包括：将所述第一托架的温度与参考阈值温度进行比较。
5.根据权利要求3所述的冷却控制器，响应于确定对所述第一托架的冷却要求增强，确定所述第二托架槽的一个或多个风扇阵列的当前风扇速度。
6.根据权利要求5所述的冷却控制器，进一步包括：将所述第二托架槽的一个或多个风扇阵列的当前风扇速度与参考风扇速度阈值进行比较。
7.根据权利要求6所述的冷却控制器，进一步包括：响应于确定所述第二托架槽的一个或多个风扇阵列的当前风扇速度小于所述参考风扇速度阈值，调节所述第二托架槽的所述一个或多个风扇阵列的风扇速度，以增强对所述第一托架槽的冷却。
8.一种用于管理对数据中心的机架的冷却的方法，所述方法包括：
由所述数据中心的冷却控制器监测指示安装在机架的第一托架槽中的第一托架的温度的传感器数据，其中，所述托架包括无机箱电路板基底；
基于所述第一托架的温度来控制所述机架的冷却系统，以控制所述第一托架的温度；
将所述第一托架的温度与第二托架的温度进行比较，所述第二托架被安装在所述机架的与所述第一托架槽相邻的第二托架槽中；
响应于确定所述第一托架的温度是否大于所述第二托架的温度达到一参考量，确定由所述第一托架槽的风扇阵列提供的对所述第一托架的冷却是否要求增强。
9.根据权利要求8所述的方法，其中，控制所述机架的冷却系统包括：控制所述机架的第一托架槽的风扇阵列的风扇速度，以冷却所述托架。
10.根据权利要求8所述的方法，其中所述无机箱电路板基底没有被包封在专用于容纳所述第一托架的托架机箱内。
11.根据权利要求8所述的方法，其中，确定对所述第一托架的冷却是否要求增强包括：将所述第一托架的温度与参考阈值温度或第二托架的温度进行比较，所述第二托架被安装在所述机架的与所述第一托架槽相邻的第二托架槽中。
12.根据权利要求10所述的方法，还包括：响应于确定对所述第一托架的冷却要求增强，确定所述第二托架槽的一个或多个风扇阵列的当前风扇速度。
13.根据权利要求12所述的方法，还包括：将所述第二托架槽的一个或多个风扇阵列的当前风扇速度与参考风扇速度阈值进行比较，响应于确定所述第二托架槽的一个或多个风扇阵列的当前风扇速度小于所述参考风扇速度阈值，调节所述第二托架槽的一个或多个风扇阵列的风扇速度，以增强对所述第一托架槽的冷却。
14.一种数据中心的冷却控制器，所述冷却控制器包括：
用于监测指示安装在机架的第一托架槽中的第一托架的温度的传感器数据的单元，其中，所述第一托架包括无机箱电路板基底；
用于基于所述第一托架的温度来控制所述机架的冷却系统以控制所述第一托架的温度的单元；
用于将所述第一托架的温度与第二托架的温度进行比较的单元，所述第二托架被安装在所述机架的与所述第一托架槽相邻的第二托架槽中；
用于响应于确定所述第一托架的温度是否大于所述第二托架的温度达到一参考量，确定由所述第一托架槽的风扇阵列提供的对所述第一托架的冷却是否要求增强的单元。
15.根据权利要求14所述的冷却控制器，其中，用于控制所述机架的冷却系统的单元包括：用于控制所述机架的第一托架槽的风扇阵列的风扇速度以冷却所述托架的单元。
16.根据权利要求15所述的冷却控制器，其中，所述无机箱电路板基底没有被包封在专用于容纳所述第一托架的托架机箱内。
17.根据权利要求14所述的冷却控制器，其中，用于确定对所述第一托架的冷却是否要求增强的单元包括：用于将所述第一托架的温度与参考阈值温度进行比较的单元。
18.根据权利要求16所述的冷却控制器，其中，用于确定对所述第一托架的冷却是否要求增强的单元包括：用于确定所述第二托架槽的一个或多个风扇阵列的当前风扇速度的单元。
19.根据权利要求18所述的冷却控制器，还包括：用于将所述第二托架槽的一个或多个风扇阵列的当前风扇速度与参考风扇速度阈值进行比较的单元。
20.根据权利要求19所述的冷却控制器，还包括：用于响应于确定所述第二托架槽的一个或多个风扇阵列的当前风扇速度小于所述参考风扇速度阈值，调节所述第二托架槽的所述一个或多个风扇阵列的风扇速度，以增强对所述第一托架槽的冷却的单元。
21.一种支持多个托架的机架，所述机架包括：
两个细长支撑柱，其垂直地延伸；
多对细长支撑臂，其中，每对细长支撑臂包括从所述两个细长支撑柱中的第一支撑柱向外延伸的第一支撑臂和从所述两个细长支撑柱中的第二支撑柱向外延伸的第二支撑臂，其中，每对细长支撑臂限定用于接纳对应托架的托架槽；以及
冷却系统，其包括多个风扇阵列，其中，每个风扇阵列包括多个风扇并且与不同的托架槽相关联，其中，每个风扇阵列是可控的，以向被接纳在对应托架槽中的服务器托架提供冷却；以及
冷却控制器，包括：
通信电路，用于接收指示安装在机架的第一托架槽中的第一托架的温度的传感器数据；
用于基于所述第一托架的温度来控制所述机架的冷却系统以控制所述第一托架的温度的单元；
用于将所述第一托架的温度与第二托架的温度进行比较的单元，所述第二托架被安装在所述机架的与所述第一托架槽相邻的第二托架槽中；
用于响应于确定所述第一托架的温度是否大于所述第二托架的温度达到一参考量，确定由所述第一托架槽的风扇阵列提供的对所述第一托架的冷却是否要求增强的单元。
22.根据权利要求21所述的机架，其中，每个风扇阵列的每个风扇被放置为使得：每个风扇的至少第一部分被放置在当对应托架被接纳在对应风扇阵列与其相关联的所述托架槽中时由所述对应托架的无机箱电路板基底限定的平面上方，并且每个风扇的第二部分被放置在所述平面下方。
23.根据权利要求22所述的机架，其中，每个风扇的大约80％被放置在所述平面上方，并且每个风扇的大约20％被放置在所述平面下方。
24.根据权利要求21所述的机架，还包括：多个交叉支撑臂，其中，每个交叉支撑臂与不同的托架槽相关联，并且包括耦合到所述第一支撑柱的第一端、耦合到所述第二支撑柱的第二端以及支撑平台，并且
其中，每个风扇阵列耦合到所述多个交叉支撑臂中的至少一个交叉支撑臂。
25.根据权利要求21所述的机架，其中，每个细长支撑臂包括附接到对应细长支撑臂的顶侧的电路板引导件，其中，每个电路板引导件包括电路板槽，用于当对应托架被接纳在对应托架槽中时接纳所述对应托架的无机箱电路板基底的侧边缘，并且
其中，每个风扇阵列的每个风扇被放置为使得：每个风扇的至少第一部分被放置在当所述对应托架被接纳在对应风扇阵列与其相关联的所述对应托架槽中时由所述对应托架的无机箱电路板基底限定的平面上方，并且每个风扇的第二部分被放置在所述平面下方。
26.根据权利要求21所述的机架，进一步包括：
用于响应于确定对所述第一托架的冷却要求增强，确定所述第二托架槽的一个或多个风扇阵列的当前风扇速度的单元；
用于将所述第二托架槽的一个或多个风扇阵列的当前风扇速度与参考风扇速度阈值进行比较的单元；
用于响应于确定所述第二托架槽的一个或多个风扇阵列的当前风扇速度小于所述参考风扇速度阈值，调节所述第二托架槽的所述一个或多个风扇阵列的风扇速度，以增强对所述第一托架槽的冷却的单元。
27.一种机器可读存储介质，包括存储在其上的多个指令，所述多个指令在被执行时使得冷却控制器执行根据权利要求8-13中任一项所述的方法。
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