CN109313625A - 数据中心的存储滑板 - Google Patents

数据中心的存储滑板 Download PDF

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Publication number
CN109313625A
CN109313625A CN201780038899.8A CN201780038899A CN109313625A CN 109313625 A CN109313625 A CN 109313625A CN 201780038899 A CN201780038899 A CN 201780038899A CN 109313625 A CN109313625 A CN 109313625A
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CN
China
Prior art keywords
memory
processing circuit
storage device
resource processing
storage
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Granted
Application number
CN201780038899.8A
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English (en)
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CN109313625B (zh
Inventor
S.C.米勒
M.克罗克
A.戈留斯
P.多米切尔
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Intel Corp
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Intel Corp
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Classifications

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Abstract

示例可以包括数据中心的机架的滑板，其包括物理存储资源。滑板包括存储装置阵列和存储器阵列。存储装置和存储器被直接耦合到存储资源处理电路，其本身被直接耦合到双模式光网络接口电路。双模式光网络接口电路可以具有等于或大于存储装置的带宽。

Description

数据中心的存储滑板
相关申请
本申请要求对先前提交的美国专利申请序列号为15/394321（2016年12月29日提交）的优先权，所述美国专利申请要求对2016年11月29日提交并指定序列号为62/427268的题为“Framework and Techniques for Pools of Configurable Computing Resources”的美国临时专利申请；2016年8月18日提交并指定序列号为62/376859的题为“Scalable SystemFramework Prime (SSFP) Omnibus Provisional II”的美国临时专利申请；以及2016年7月22日提交并指定序列号为62/365969的题为“Framework and Techniques for Pools ofConfigurable Computing Resources”的美国临时专利申请的权益。以上所有特此通过引用以其整体而被结合。
技术领域
本文描述的示例通常涉及数据中心，并且具体涉及用于耦合数据中心中的物理存储资源的存储滑板。
背景技术
联网的进步已能够实现可配置计算资源池的提升。可配置计算资源池可以从包括分解物理资源的物理基础设施来形成，例如，如在大型数据中心中所发现那样。物理基础设施可以包括具有处理器、存储器、存储装置、联网、功率、冷却等的多个资源。这些数据中心的管理实体可以聚合资源的选择以形成服务器和/或计算主机。随后可以分配这些主机以执行和/或托管系统SW（例如，OS、VM、容器、应用程序、或诸如此类）。数据中心中的数据存储量通常以指数级别持续增加，因此要求数据中心中的物理存储资源。本公开涉及此类物理存储资源。
附图说明
图1示出了第一示例数据中心。
图2示出了数据中心的第一示例机架。
图3示出了第二示例机架。
图4示出了第三示例机架。
图5示出了第一示例滑板。
图6示出了第二示例滑板。
图7示出了第三示例滑板。
图8示出了第四示例滑板。
图9示出了第五示例滑板。
图10示出了第六示例滑板。
图11示出了第二示例数据中心。
图12示出了示例计算平台。
具体实施方式
数据中心通常可以由大量机架组成，这些机架能包含许多类型的硬件或可配置资源（例如，处理单元、存储器、存储装置、加速器、连网、风扇/冷却模块、功率单元等）。在数据中心中部署的硬件或可配置资源的类型也可以被称为物理资源或解聚元件。要认识到，数据中心内的物理资源的大小和数量可以很大，例如，大约几十万的物理资源。而且，这些物理资源能被池化以形成用于大量和各种计算任务的虚拟计算平台。
这些物理资源经常被布置在数据中心内的机架中。本公开提供了布置成安放多个滑板的机架，其中每个滑板能安置多个物理资源。具体地，描述了用于将多个物理存储资源（例如，固态驱动器（SSD）或诸如此类）耦合到数据中心的滑板。滑板可以使用自动化技术（例如提供了机器人式耦合或操纵）耦合到机架。滑板可以容纳多个存储装置（例如，SSD或诸如此类），并且可以将存储装置耦合到数据中心中提供的光组构。此外，滑板可以适应存储装置的自动移除和/或安装。更具体地，如下面将更详细描述的，滑板可以适应存储装置的机器人式安装和/或移除。
滑板可以包括双模式光网络接口，其可操作以（例如，基于电信令）耦合到滑板上的存储装置并且（例如，基于光信令）耦合到数据中心中的光组构。下面将更详细地描述本公开的这个和其它特征。
现在参考附图，其中相似的引用标记通篇用于指的是相似的元件。在如下描述中，为了解释的目的，阐述了众多特定细节以便提供对其的透彻理解。然而，可以显然的是新颖的实施例能在没有这些特定细节的情况下被实践。在其它实例中，众所周知的结构和装置以框图形式被示出，以便促进其描述。意图是提供透彻描述使得充分描述在权利要求书的范围内的所有修改、等效方案和备选。
附加地，可以对变量进行参考，诸如“a”、“b”、“c”，它们用于标示可以实现多于一个组件的组件。重要的是要指出，不一定需要多个组件，并且进一步说，在实现多个组件的情况下，它们不必完全相同。相反，为了呈现的便捷和清晰起见，使用变量来引用附图中的组件。
图1图示了数据中心100的概念概述，数据中心100一般可代表在其中/对于其可根据各种实施例实现本文描述的一种或更多种技术的数据中心或其它类型的计算网络。如此图中所示的，数据中心100一般可包含多个机架，每一个机架都可以安置包括物理资源的相应集合的计算设备。在此图中描绘的具体非限制示例中，数据中心100包含两个机架102A至102B。这两个机架102A至102B中的每个一般都可安置多个滑板。如此图中所示，机架102A至102B中的每个分别包含四个滑板104A-1至104A-4和104B-1至104B-4。所描绘的滑板和机架安置包括物理资源105A/B的相应集合的计算设备。具体地说，描绘了物理资源105A-1至105A-4和105B-1至105B-4。数据中心100的物理资源106的聚合集合包括分布在机架102A至102B之间的物理资源105（例如，105A-1至105A-4和105B-1至105B-4）的各种集合。
物理资源106可以包括多种类型的资源，诸如例如处理器、协处理器、加速器、现场可编程门阵列（FPGA）、存储器和存储装置。实施例不限于这些示例。在此具体非限制性示例中，物理资源105A从而可以由安置在机架102A中的物理资源的相应集合构成，其包括在机架102A的滑板104A-1至104A-4中包括的物理存储资源105A-1、物理加速器资源105A-2、物理存储器资源105A和物理计算资源105A-4。在一些实现中，机架可以包括多个相似的物理资源。例如，描绘了机架102B，其包括容纳在机架102B的滑板104B-1至104B-4的每一个滑板中的物理存储资源。更确切地说，滑板104B-1至104B-4分别安置物理存储资源105B-1、物理存储资源105B-2、物理存储资源105B-3和物理存储资源105B-4。
要指出，实施例不限于此示例。而且，每个滑板可包含各种类型的物理资源（例如，计算、存储器、加速器、存储装置）中的每种的池。通过让机器人式可访问和机器人式可操纵的滑板包括解聚资源，每种类型的资源都能彼此独立地并且以它们自己的优化刷新率升级。
说明性数据中心100在许多方面不同于典型的数据中心。例如，在说明性实施例中，在其上放置组件（诸如CPU、存储器和其它组件）的电路板（“滑板”）被设计用于提高热性能。具体地说，在说明性实施例中，滑板比典型板更浅。换言之，滑板从前到后缩短，冷却风扇位于其中。这减小了空气必须穿过板上组件的路径的长度。另外，滑板上的组件比在典型电路板中的间隔得更远，并且这些组件被布置成降低或消除遮挡（即一个组件在另一组件的空气流动路径中）。在说明性实施例中，诸如处理器的处理组件位于滑板的顶侧上，而近存储器（诸如DIMM）位于滑板的底侧上。作为由此类设计提供的增强气流的结果，至少一些组件可以操作在比在典型系统中更高的频率和功率级下，由此增大性能。而且，滑板被配置成与每个机架102A至102B中的功率和数据通信电缆盲配合，增强它们被快速移除、升级、重新安装和/或替代的能力。类似地，位于滑板上的各个组件（诸如处理器、加速器、存储器和数据存储驱动器）被配置为由于它们彼此的增大间隔而容易被升级。在说明性实施例中，组件附加地包括用于证实它们的真实性的硬件证明特征。
此外，在说明性实施例中，数据中心100利用支持多个其它网络架构（包括以太网和全路径）的单个网络架构（“组构”）。在说明性实施例中，滑板经由光纤耦合到交换机，光纤提供比典型的双绞线布线（例如，类别5、类别5e、类别6等）更高的带宽和更低的时延。由于高带宽、低时延互连和网络架构，数据中心100在使用时可以池化资源，例如存储器、加速器（例如，图形加速器、FPGA、ASIC等）和物理上解聚的数据存储驱动器，并在需要的基础上将它们提供给计算资源（例如，处理器），使计算资源能够好像它们是本地的一样访问池化的资源。
更确切地说，数据中心100可以以光组构112为特征。光组构112通常可以包括光信令介质（诸如光缆）和光交换基础设施的组合，经由其数据中心100中的任何具体滑板都能向数据中心100中的每一个其它滑板发送信号（并从其接收信号）。光组构112提供给任何给定滑板的信令连接性可以包括到同一机架中的其它滑板和其它机架中的滑板的连接性。在此图中描绘的具体非限制性示例中，数据中心100包括两个机架（例如，机架102A至102B），每个机架包括四个滑板（例如，分别为104A-1至104A-4和104B-1至104B-4）。因此，在此示例中，数据中心100包括总共八个滑板。经由光组构112，每个此类滑板可以具有与数据中心100中的七个其它滑板中的每一个的信令连接性。例如，经由光组构112，机架102A中的滑板104A-1可处理与机架102A中的滑板104A-2、104A-3和104A-4以及分布在数据中心100的其它机架102B之间的其它四个滑板104B-1、104B-2、104B-3和104B-4的信令连接性。实施例不限于此示例。
在各种实施例中，双模式光交换机（参考图5-10）可能能够经由光组构112的光信令介质接收携带因特网协议（IP分组）的以太网协议通信和根据第二高性能计算（HPC）链路层协议（例如英特尔的全路径架构的无限带）的通信。从而，如所描绘的，关于数据中心100中滑板的任何具体一对，经由光组构的信令连接性可以经由以太网链路和HPC链路提供对于链路层连接性的支持。从而，以太网和HPC通信都能由单个高带宽、低时延的交换机组构支持。实施例不限于此示例。然而，值得指出的是，双模式光交换机在单个滑板内提供用于单独的故障域。像这样，在滑板级能跨故障域写入信息，这与机架级相反以在滑板级提供数据丢失、损坏或故障缓解。
数据中心100的机架102A和102B可以包括促进各种类型维护任务的自动化的物理设计特征。例如，数据中心100可使用设计成被机器人式访问并且设计成安放和安置机器人式可操纵的资源滑板的机架来实现。而且，在说明性实施例中，机架102A和102B包括集成功率源，其接收比典型对于功率源的电压更大的电压。在具体示例中，每一个滑板都能包括关联的电源。增大的电压使功率源能够向每个滑板上的组件提供附加功率，使组件能够操作在高于典型频率的频率。
如所注释的，本公开提供了滑板，并且具体是包括和/或布置为包括物理存储资源的滑板。关于图5-10提供了此类滑板的示例。然而，之前关于图2-4描绘和描述了布置为容纳此类滑板的多个示例机架。
图2示出了根据一些实施例的机架架构200的一般概述，所述机架架构200可以表示图1中描绘的机架中的任何具体机架的架构。如本图中所反映的，机架架构200通常可以以滑板可以插入其中的多个滑板空间为特征，每个滑板空间可以经由机架访问区域201而机器人式可访问。在本图中描绘的具体非限制性示例中，机架架构200以五个滑板空间203-1至203-5为特征。滑板空间203-1至203-5以相应的多功能连接器模块（MPCM）216-1至216-5为特征。这些MPCM可被布置成接收滑板的对应MPCM（参考图5-10）以将滑板机械地、光地、和/或电地耦合到机架架构200，并具体将数据中心的光组构耦合到每个滑板空间203-1至203-5的关联功率源。
图3示出了可以表示机架架构的机架架构300的示例，所述机架架构可以被实现以便为以扩展能力为特征的滑板（例如参考图10）提供支持。在本图中描绘的具体非限制性示例中，机架架构300包括七个滑板空间303-1至303-7，其以相应的MPCM 316-1至316-7为特征。滑板空间303-1至303-7包括相应的主区域303-1A至303-7A和相应的扩展区域303-1B至303-7B。针对于每个此类滑板空间，当对应的MPCM与插入的滑板的对应物MPCM耦合时，主区域通常可以构成滑板空间的区域，其可以物理地容纳插入的滑板。扩展区域通常可以构成滑板空间的区域，在插入的滑板配置有此类模块的情况下，其可以物理地容纳扩展模块（例如容纳附加和/或补充物理资源以与主滑板的物理资源耦合）。
图4示出了根据一些实施例的机架402的示例，其可以表示根据图3的机架架构300实现的机架。在图4中描绘的具体非限制性示例中，机架402以七个滑板空间403-1至403-7为特征，其包括相应的主区域403-1A至403-7A和相应的扩展区域403-1B至403-7B。在各种实施例中，可以使用空气冷却系统来实现机架402中的温度控制。例如，如本图中所反映的，机架402可以以多个风扇419为特征，风扇419通常布置成在各种滑板空间403-1至403-7内提供空气冷却。在一些实施例中，滑板空间的高度大于常规的“1U”服务器高度。在此类实施例中，如与常规机架配置中使用的风扇相比，风扇419通常可以包括相对慢的大直径冷却风扇。相对于以较高速度运行的较小直径的冷却风扇，以较低的速度运行较大直径的冷却风扇可以增加风扇寿命，同时仍然提供相同的冷却量。滑板比常规的机架尺寸物理上更浅薄。此外，在每个滑板上布置组件以减少热遮蔽（即，不在空气流动方向上串联布置）。因此，更宽、更浅薄的滑板允许装置性能的增加，因为由于改进的冷却（即，没有热遮蔽、装置之间的更多空间、针对更大散热片（heatsink）的更多空间等），装置可以以更高的热封套（例如，250W）操作。
MPCM 416-1至416-7可以配置成为插入的滑板提供对由相应的功率模块420-1至420-7供应的功率的使用，每个功率模块可以从外部功率源421汲取功率。在各种实施例中，外部功率源421可以向机架402递送交流（AC）功率，并且功率模块420-1至420-7可以配置成将此类AC功率转换为要供应到插入的滑板的直流（DC）功率。在一些实施例中，例如，功率模块420-1至420-7可以配置成将277伏AC功率转换成12伏DC功率，以经由相应的MPCM 416-1至416-7提供给插入的滑板。实施例不限于此示例。
MPCM 416-1至416-7还可以被布置成为插入的滑板提供到光组构的光信令连接性，双模式光交换基础设施414可以与图1的光组构112相同（或与其类似）。在各种实施例中，包含在MPCM 416-1至416-7中的光连接器可以被设计成与插入的滑板的MPCM中包含的对应物光连接器耦合，以经由相应长度的光缆422-1至422-7为此类滑板提供到光组构412的光信令连接性。在一些实施例中，每个此类长度的光缆可以从其对应的MPCM延伸到在机架402的滑板空间外部的光互连织机(loom)423。在各种实施例中，光互连织机423可以布置成通过支撑柱或者机架402的其它类型的负荷承载元件。实施例不限于在此上下文中。由于插入的滑板经由MPCM连接到光交换基础设施，因此可以节省通常花费在手动配置机架缆线以容纳新插入的滑板的资源。
图5示出了滑板504的示例，其可以表示被设计以用于与根据一些实施例的机架（例如，根据机架架构200或300或机架402的机架）结合使用的滑板。滑板504可以以MPCM516为特征，MPCM 516包括光连接器516A和功率连接器516B，并且被设计成与滑板空间的对应物MPCM耦合（与将MPCM 516插入到该滑板空间中结合）。将MPCM 516与此类对应物MPCM耦合可以使功率连接器516与对应物MPCM中包括的功率连接器耦合。这通常可以使滑板504的物理存储资源505能够经由功率连接器516和功率传输介质524从外部源供应功率，功率传输介质524将功率连接器516导电地耦合到物理存储资源505。
物理存储资源505通常可包括可移除存储装置阵列533、存储资源处理电路535、和存储器阵列537。在一些示例中，可移除存储装置阵列533可以包括多个存储装置（例如，SSD或诸如此类）并且可以具有任何容量。在一些示例中，可移除存储装置阵列533可具有在0.5和2千兆兆字节之间的存储容量。更具体地，通过一些非限制性示例，可移除存储装置阵列533可以容纳在2和24个之间的可移除装置。在特定示例中，可移除存储驱动器阵列533可以容纳4个可移除驱动器（例如，参考图8）。在另一特定示例中，可移除存储驱动器阵列533可容纳16个可移除驱动器（例如，参考图9）。
仅出于说明目的，假设滑板可容纳16个可移除驱动器。在该示例中，其中可移除装置中的每一个提供32兆兆字节的容量，滑板504可以提供总共0.5千兆兆字节的容量。然而，在可移除装置中的每一个提供128兆兆字节的容量的情况下，滑板504可以提供总共2千兆兆字节的容量。
在一些示例中，存储器阵列537可以包括易失性和/或非易失性存储器。例如，存储器阵列537可以包括经由电信令介质528而被耦合到存储资源处理电路的多个双列直插式存储器模块（DIMM）。在一些示例中，存储器阵列537可以包括随机存取存储器（RAM）、动态RAM（DRAM）、同步DRAM（SDRAM）、双倍数据速率SDRAM、NAND存储器、NOR存储器、三维（3D）交叉点存储器、铁电存储器、氧化硅氮氧化硅（SONOS）存储器、聚合物存储器（诸如铁电聚合物存储器）、铁电晶体管随机存取存储器（FeTRAM或FeRAM）、纳米线、相变RAM（PRAM）、电阻RAM（RRAM）、磁阻RAM（MRAM）、自旋转移矩MRAM（STT-MRAM）存储器、非易失性静态RAM（nvSRAM）、导电桥接RAM（CBRAM）、纳米RAM（NRAM）、浮动结栅极RAM（FJG RAM）、或诸如此类。通过一些示例，存储器阵列537可以包括此类存储器模块的组合，例如，DRAM和3D交叉点存储器的组合。
滑板504还可以包括双模式光网络接口电路526。双模式光网络接口电路526通常可以包括能够根据由光组构（例如，图1的光组构112、图4的光组构414、或诸如此类）所支持的多个链路层协议中的每个通过光信令介质进行通信的电路。在一些实施例中，双模式光网络接口电路526可以具有以太网协议通信和根据第二高性能协议的通信二者的能力。在各种实施例中，双模式光网络接口电路526可以包括一个或多个光收发器模块527，每个光收发器模块527可以能够通过一个或多个光通道中的每个来传送和接收光信号。实施例不限于在此上下文中。
将MPCM 516与给定机架中的滑板空间的对应物MPCM耦合可以使光连接器516A与对应物MPCM中包括的光连接器耦合。这通常可以经由光通道525集合中的每个在双模式光网络接口电路526和滑板的光缆之间建立光连接性。通过一些示例，光通道525包括4个光纤通道。通过一些示例，每个光通道可以提供在20和220千兆字节每秒（GB/s）之间的带宽。通过具体示例，每个光通道可以提供50GB/s的带宽。作为另一具体示例，每个光通道可以提供200GB/s的带宽。双模式光网络接口电路526可以经由电信令介质528与滑板504的物理资源505通信。除了用于提供改进的冷却并使能以相对较高的热封套（例如，250W）操作的滑板上的组件的布置和滑板的尺寸之外（如上面参考图4所描述的），在一些实施例中，滑板可包括一个或多个附加特征以促进空气冷却，例如热管和/或散热片（布置成耗散由物理资源505生成的热）。值得注意的是，尽管图5中描绘的示例滑板504没有以扩展连接器为特征，但以滑板504的设计元件为特征的任何给定滑板也可以根据一些实施例以扩展连接器为特征。实施例不限于在此上下文中。
存储资源处理电路535可以包括存储器控制器541和处理器逻辑543。存储器控制器541可以被配置为协调对可移除存储驱动器阵列533的装置和对存储器阵列537的访问（例如，写、读、或诸如此类）。在一些示例中，存储资源处理电路535可以为物理存储资源505提供高速缓存、条带化、池化、压缩、数据复制、精简置备、数据克隆、或其它数据管理技术。在一些示例中，可移除存储装置阵列533的各个装置可以经由各种总线和/或互连（诸如例如，外围组件互连快速（PCIe））中的任何一个而被耦合到存储资源处理电路535。具体地，耦合可移除存储装置阵列533和存储资源处理电路535的电信令介质528可以是4道PCIe总线，以提供符合非易失性存储器快速（NVMe）的逻辑装置互连能力。在一些示例中，电信令介质528可以根据各种互连标准进行操作，诸如例如，2015年12月发布的外围组件互连（PCI）快速基础规范，修订版3.1a（“PCI快速规范”或“PCIe规范“）；2015年10月发布的非易失性存储器快速（NVMe）规范，修订版1.2a（“NVM快速规范”或“NVMe规范”）。在一些示例中，电信令介质528可以基于将在2017年公布的所提议的PCIe标准进行操作，诸如，第四代PCIe标准（PCIe Gen4）。
作为具体示例，在可移除存储装置阵列533容纳16个存储装置的情况下，耦合可移除存储装置阵列533的电信令介质528可以提供16个PCIe Gen4 x4连接。作为另一示例，在可移除存储装置阵列533可容纳4个存储装置的情况下，耦合可移除存储装置阵列533的电信令介质528可提供4个PCIe Gen4 x4连接。
通过一些示例，耦合存储资源处理电路535和双模式光网络接口电路526的电信令介质528可以包括PCIe Gen4或其它接口系统，诸如例如专有接口。
处理逻辑543可以包括被配置为操纵通过电信令介质528所传送或接收的数据和/或数据流的各种计算机处理器中的任何一个。例如，处理逻辑543可以包括压缩逻辑，其被布置为压缩和解压缩在可移除存储驱动器阵列533和/或存储器阵列537中所指示的数据。作为另一示例，处理逻辑543可以包括加密逻辑，其被布置为加密和解密在可移除存储驱动器阵列533和/或存储器阵列537中所指示的数据。此外，作为另一示例，处理逻辑543可以包括压缩逻辑，其被布置为压缩和解压缩在可移除存储驱动器阵列533和/或存储器阵列537中所指示的数据。此外，应注意，尽管本文详述的许多示例将可移除存储驱动器阵列533引用为包括SSD，但阵列533的一些实施例可包括耦合到电信令介质928的非易失性存储器，例如耦合（例如，直接地、经由DIMM插槽、或诸如此类）到滑板504的处理器（例如，处理器逻辑543、或诸如此类）的非易失性存储器DIMM（例如，3D交叉点、nvSRAM、FeRAM、MRAM、PRAM、SONOS、RRAM、NRAM、FJG RAM、CBRAM、或诸如此类）。
通过一些示例，可移除存储驱动器阵列533和存储器阵列537可被拆分成可移除存储驱动器阵列和存储器阵列的子集或组。在此类示例中，可以提供多个存储资源处理电路535。图6描绘了此类示例滑板。更具体地转向图6，描绘了滑板604。通常，滑板604可包括与图5的滑板504类似的组件。但是，可移除存储驱动器阵列和存储器阵列被拆分成两个子集。具体地，滑板604包括物理存储资源605，其包括可移除存储驱动器阵列子集633-1到633-2、存储资源处理电路635-1到635-2、以及存储器阵列子集637-1到637-2。如所描绘的，存储资源处理电路635-1被可操作地耦合到可移除存储驱动器阵列子集633-1和存储器阵列子集637-1，而存储资源处理电路635-2被可操作地耦合到可移除存储驱动器阵列子集633-2和存储器阵列子集637-2。
存储资源处理电路635-1和635-2经由电信令介质628而被可操作地耦合到可移除存储驱动器阵列子集和存储器阵列子集。电信令介质638可以是用于提供符合NVMe的逻辑装置互连能力的任何信令介质（诸如例如，PCIe Gen4总线）。
存储资源处理电路635-1和635-2还经由电信令介质628而被可操作地耦合到双模式光网络接口电路626。注意，将双模式光网络接口电路耦合到存储资源处理电路635-1和635-2的电信令介质628可以是与将存储资源处理电路635-1和635-2耦合到可移除存储驱动器阵列子集和存储器阵列子集的电信令介质628不同的类型、配置、和或支持不同信令标准。示例不限于此上下文中。
此外，滑板604可以双模式光网络接口电路626为特征，其包括经由光通道625而被耦合到MPCM 616的光连接器616A的（一个或多个）光收发器模块627。另外，滑板604可以MPCM 616的功率连接器616B为特征，其用于经由功率传送介质624向滑板604的组件提供功率。
在一些实施例中，物理资源605可被拆分成多个故障域（fault domain）。在该说明性示例中，滑板604包括2个故障域607-1和607-2。具体地：故障域607-1包括存储资源处理电路635-1、可移除存储驱动器阵列子集633-1、和存储器阵列子集637-1；而故障域607-2包括存储资源处理电路635-2、可移除存储驱动器阵列子集633-2、和存储器阵列子集637-2。因此，在操作期间，故障域可以在滑板级别“故障切换（fail over）”到彼此以提供数据丢失的缓解。
如所注释的，可移除存储驱动器阵列可包括多个存储驱动器（例如，SSD、非易失性存储器模块、或诸如此类）。同样，存储器阵列可包括多个存储器模块（例如，DIMM、或诸如此类）。作为示例，描绘阵列的各个组件（例如，驱动器、模块等）的滑板在图7中被描绘。更具体地转向图7，描绘了滑板704。通常，滑板704可包括与图5的滑板504和图6的滑板604类似的组件。也就是说，滑板704被描绘为包括多个存储资源处理电路和阵列子集，如关于图6的滑板604所描绘的。
具体地，滑板704包括物理存储资源705，其包括可移除存储驱动器阵列子集733-1到733-2、存储资源处理电路735-1到735-2、以及存储器阵列子集737-1到737-2。如所描绘的，存储资源处理电路735-1被可操作地耦合到可移除存储驱动器阵列子集733-1和存储器阵列子集737-1，而存储资源处理电路735-2被可操作地耦合到可移除存储驱动器阵列子集733-2和存储器阵列子集737-2。
此外，可移除存储驱动器阵列子集733-1到733-2可包括存储装置753。例如，如所描绘的，可移除存储驱动器阵列子集733-1包括存储装置753-11到753-1X，而可移除存储驱动器阵列子集733-2包括存储装置753-21到753-2Y。类似地，存储器阵列子集737-1包括存储器模块757-11到757-1M，而存储器阵列子集737-2包括存储器模块757-21到757-2N。
通常，存储装置753-11至753-1X和753-21至753-2Y可以包括使用各种技术中的任何技术所实现的各种非易失性存储器存储装置的任何组合，例如，磁存储装置、半导体存储装置、相变存储器存储装置、全息数据存储装置、或诸如此类，并且可以包括通常被表征为SSD或DIMM的装置。存储器模块737-11至737-1M和737-21至737-2N可以包括使用各种技术中的任何技术所实现的存储器模块的任何组合，例如RAM、DRAM、DDRAM、同步DRAM、NAND存储器、NOR存储器、三维（3D）交叉点存储器、铁电存储器、氧化硅氮氧化硅（SONOS）存储器、聚合物存储器（例如铁电聚合物存储器）、铁电晶体管随机存取存储器（FeTRAM或FeRAM）、纳米线、相变存储器、磁阻随机存取存储器（MRAM）、自旋转移矩MRAM（STT-MRAM）存储器、或诸如此类。通过一些示例，存储器阵列737可以包括此类存储器模块的组合，例如，DRAM和3D交叉点存储器的组合。
存储资源处理电路735-1和735-2经由电信令介质728而被可操作地耦合到可移除存储驱动器阵列子集和存储器阵列子集。具体地，存储资源处理电路735-1经由电信号介质728而被可操作地耦合到可移除存储驱动器阵列子集733-1的存储驱动器753-11到753-1X以及存储器阵列子集737-1的存储器模块737-11到737-1M。类似地，存储资源处理电路735-2经由电信令介质728而被可操作地耦合到可移除存储驱动器阵列子集733-2的存储驱动器753-21到753-2Y以及存储器阵列子集737-2的存储器模块737-21到737-2N。
电信令介质738可以是用于提供符合NVMe的逻辑装置互连能力的任何信令介质（诸如例如，PCIe Gen4总线）。
存储资源处理电路735-1和735-2还经由电信令介质728而被可操作地耦合到双模式光网络接口电路726。注意，将双模式光网络接口电路耦合到存储资源处理电路735-1和735-2的电信令介质728可以是与将存储资源处理电路735-1和735-2耦合到可移除存储驱动器阵列子集和存储器阵列子集的电信令介质728不同的类型、配置、和或支持不同信令标准。示例不限于此上下文中。
此外，滑板704可以双模式光网络接口电路726为特征，其包括经由光通道725而被耦合到MPCM 716的光连接器716A的（一个或多个）光收发器模块727。另外，滑板704可以MPCM 716的功率连接器716B为特征，其用于经由功率传送介质724向滑板704的组件提供功率。
在一些示例中，可以关于光通道的带宽来描述物理存储资源的带宽。例如，在一些实现中，可移除存储驱动器阵列和/或存储器阵列的带宽可以与将滑板耦合到数据中心的光组构的光通道的带宽相关地量化。在图8和9中描绘了滑板的两个此类示例，其中与光通道有关地描述物理资源的带宽。
更具体地转向图8，示出了滑板804。通常，滑板804可包括与图7的滑板704类似的组件。也就是说，滑板804包括物理存储资源805，其包括可移除存储驱动器阵列子集833-1到833-2、存储资源处理电路835-1到835-2、以及存储器阵列子集837-1到837-2。如所描绘的，存储资源处理电路835-1被可操作地耦合到可移除存储驱动器阵列子集833-1和存储器阵列子集837-1，而存储资源处理电路835-2被可操作地耦合到可移除存储驱动器阵列子集833-2和存储器阵列子集837-2。
在所描绘的示例中，可移除存储驱动器阵列子集833-1到833-2可包括存储装置851。例如，如所描绘的，可移除存储驱动器阵列子集833-1包括两个存储装置853-11和853-12，而可移除存储驱动器阵列子集833-2包括两个存储装置853-21到853-22。因此，可移除存储驱动器阵列（包括可移除存储驱动器阵列子集833-1和833-2两者）包括四个单独的存储装置。
此外，在所描绘的示例中，存储器阵列子集837-1和837-2中的每个可以包括六个存储器模块。具体地，存储器阵列子集837-1包括存储器模块857-11到857-16，而存储器阵列子集837-2包括存储器模块857-21到857-26。
通常，存储装置853-11至853-12和853-21至853-22可以包括使用各种技术中的任何技术所实现的各种非易失性存储器存储装置的任何组合，例如，磁存储装置、半导体存储装置、相变存储器存储装置、全息数据存储装置、或诸如此类，并且可以包括通常被表征为SSD或DIMM的装置。
存储器模块837-11至837-16和837-21至837-26可以包括使用各种技术中的任何技术所实现的存储器模块的任何组合，例如RAM、DRAM、DDRAM、同步DRAM、NAND存储器、NOR存储器、三维（3D）交叉点存储器、铁电存储器、氧化硅氮氧化硅（SONOS）存储器、聚合物存储器（例如铁电聚合物存储器）、铁电晶体管随机存取存储器（FeTRAM或FeRAM）、纳米线、相变存储器、磁阻随机存取存储器（MRAM）、自旋转移矩MRAM（STT-MRAM）存储器、或诸如此类。通过一些示例，存储器阵列837可以包括此类存储器模块的组合。例如，存储器模块857-11到857-14和857-21到857-24可以包括DRAM DIMM，而857-15到857-16和857-25到857-26可以包括（3D）交叉点DIMM。通过一些示例，存储器阵列837-1和837-2的一部分可以分别在存储资源处理电路835-1和835-2内被实现。例如，存储器模块857-15至857-16和857-25至857-26可以在相应的存储资源处理电路835-1和835-2内被实现。
存储资源处理电路835-1和835-2经由电信令介质828而被可操作地耦合到可移除存储驱动器阵列子集和存储器阵列子集。具体地，存储资源处理电路835-1经由电信号介质828而被可操作地耦合到可移除存储驱动器阵列子集833-1的存储驱动器853-11到853-12以及存储器阵列子集837-1的存储器模块837-11到837-16。类似地，存储资源处理电路835-2经由电信令介质828而被可操作地耦合到可移除存储驱动器阵列子集833-2的存储驱动器853-21到853-22以及存储器阵列子集837-2的存储器模块837-21到837-26。
电信令介质838可以是用于提供符合NVMe的逻辑装置互连能力的任何信令介质（诸如例如，PCIe Gen4总线）。通常，物理存储资源805可被描述或者可以具有特定带宽。换句话说，物理存储资源805可以在给定时间内处理指定量或数量的数据（例如，读数据、写数据、读和写数据、或诸如此类）。通常，物理存储资源的带宽是存储装置853-11到853-12和853-21到853-22、存储器模块857-11到857-16和857-21到857-26、存储资源处理电路835-1和835-2、以及耦合这些组件的电信令介质828的带宽的函数。在一些示例中，带宽可以由特定组件（例如，可移除存储驱动器阵列子集833-1和833-2）来定义。在一些示例中，带宽可以由所有组件来共同定义。在一些示例中，带宽可以由有限组件（例如，具有最小带宽的组件、或诸如此类）来定义。作为示例，存储资源处理电路835-1和835-2可以被配置为分别同时对存储装置853-11至853-12和853-21至853-22进行读和/或写数据。因此，物理存储资源805的带宽可以由每个存储装置的带宽之和来定义。作为另一示例，存储资源处理电路835-1和835-2可以被配置为分别对存储装置853-11至853-12和853-21至853-22以及分别对存储器模块857-11至857-16和857-21至857-26进行读和/或写数据。因此，物理存储资源805的带宽可以由每个存储装置和存储器模块的带宽之和来定义。在一些示例中，存储装置853-11至853-12和853-21至853-22中的每个可以具有在500兆字节每秒（MB/s）和20GB/s之间的带宽。在一些示例中，每个存储器模块可以具有在4GB/s和40GB/s之间的带宽。
存储资源处理电路835-1和835-2还经由电信令介质828而被可操作地耦合到双模式光网络接口电路826。注意，将双模式光网络接口电路826耦合到存储资源处理电路835-1和835-2的电信令介质828可以是与将存储资源处理电路835-1和835-2耦合到可移除存储驱动器阵列子集和存储器阵列子集的电信令介质828不同的类型、配置、和或支持不同信令标准。示例不限于此上下文中。在一些示例中，物理存储资源的带宽可以由将双模式光网络接口电路826耦合到存储资源处理电路835-1和835-2的电信令介质828的带宽来定义。
此外，滑板804可以双模式光网络接口电路826为特征，其包括经由光通道825而被耦合到MPCM 816的光连接器816A的（一个或多个）光收发器模块827。另外，滑板804可以MPCM 816的功率连接器816B为特征，其用于经由功率传送介质824向滑板804的组件提供功率。光信令介质825可包括多个光通道。每个光通道可以具有特定带宽。在一些示例中，光通道825可以具有在20和80GB/s之间的带宽。
通过一些示例，光通道825的带宽可以对应于、大体上等于、等于、或者在物理存储资源805的带宽的阈值百分比（例如，2％、5％、10％、或诸如此类）内。例如，在一些实现中，光通道825的带宽可以大体上等于存储装置853-11至853-12和853-21至853-22的组合带宽。在一些实现中，光通道825的带宽可以大体上等于存储装置853-11至853-12和853-21至853-22以及存储器模块857-11至857-16和857-21至857-26的组合带宽。在一些实现中，光通道825的带宽可以大体上等于存储器模块857-11至857-16和857-21至857-26的组合带宽。在一些实现中，光通道825的带宽可以大体上等于将存储资源处理电路835-1和835-2耦合到双模式光网络接口电路826的电信令介质的组合带宽。
更具体地转向图9，示出了滑板904。通常，滑板904可包括与图7的滑板704类似的组件。也就是说，滑板904包括物理存储资源905，其包括可移除存储驱动器阵列子集933-1到933-2、存储资源处理电路935-1到935-2、以及存储器阵列子集937-1到937-2。如所描绘的，存储资源处理电路935-1被可操作地耦合到可移除存储驱动器阵列子集933-1和存储器阵列子集937-1，而存储资源处理电路935-2被可操作地耦合到可移除存储驱动器阵列子集933-2和存储器阵列子集937-2。
在所描绘的示例中，可移除存储驱动器阵列子集933-1到933-2可包括存储装置951。例如，如所描绘的，可移除存储驱动器阵列子集933-1包括八个存储装置953-11和953-18，而可移除存储驱动器阵列子集933-2包括八个存储装置953-21到953-28。因此，可移除存储驱动器阵列（包括可移除存储驱动器阵列子集933-1和933-2两者）包括16个单独的存储装置。
此外，在所描绘的示例中，存储器阵列子集937-1和937-2中的每个可以包括六个存储器模块。具体地，存储器阵列子集937-1包括存储器模块957-11到957-16，而存储器阵列子集937-2包括存储器模块957-21到957-26。
通常，存储装置953-11至953-18和953-21至953-28可以包括使用各种技术中的任何技术所实现的各种非易失性存储器存储装置的任何组合，例如，磁存储装置、半导体存储装置、相变存储器存储装置、全息数据存储装置、或诸如此类，并且可以包括通常被表征为SSD或DIMM的装置。
存储器模块937-11至937-16和937-21至937-26可以包括使用各种技术中的任何技术所实现的存储器模块的任何组合，例如RAM、DRAM、DDRAM、同步DRAM、NAND存储器、NOR存储器、三维（3D）交叉点存储器、铁电存储器、氧化硅氮氧化硅（SONOS）存储器、聚合物存储器（例如铁电聚合物存储器）、铁电晶体管随机存取存储器（FeTRAM或FeRAM）、纳米线、相变存储器、磁阻随机存取存储器（MRAM）、自旋转移矩MRAM（STT-MRAM）存储器、或诸如此类。通过一些示例，存储器阵列937可以包括此类存储器模块的组合。例如，存储器模块957-11到957-14和957-21到957-24可以包括DRAM DIMM，而957-15到957-16和957-25到957-26可以包括3D交叉点DIMM。
存储资源处理电路935-1和935-2经由电信令介质928而被可操作地耦合到可移除存储驱动器阵列子集和存储器阵列子集。具体地，存储资源处理电路935-1经由电信号介质928而被可操作地耦合到可移除存储驱动器阵列子集933-1的存储驱动器953-11到953-18以及存储器阵列子集937-1的存储器模块937-11到937-16。类似地，存储资源处理电路935-2经由电信令介质928而被可操作地耦合到可移除存储驱动器阵列子集933-2的存储驱动器953-21到953-28以及存储器阵列子集937-2的存储器模块937-21到937-26。
电信令介质928可以是用于提供符合NVMe的逻辑装置互连能力的任何信令介质（诸如例如，PCIe Gen4总线）。通常，物理存储资源905可被描述或者可以具有特定带宽。换句话说，物理存储资源905可以在给定时间内处理指定量或数量的数据（例如，读数据、写数据、读和写数据、或诸如此类）。通常，物理存储资源的带宽是存储装置953-11到953-18和953-21到953-28、存储器模块957-11到957-16和957-21到957-26、存储资源处理电路935-1和935-2、以及耦合这些组件的电信令介质928的带宽的函数。在一些示例中，带宽可以由特定组件（例如，可移除存储驱动器阵列子集933-1和933-2）来定义。在一些示例中，带宽可以由所有组件来共同定义。在一些示例中，带宽可以由有限组件（例如，具有最小带宽的组件、或诸如此类）来定义。作为示例，存储资源处理电路935-1和935-2可以被配置为分别同时对存储装置953-11至953-18和953-21至953-28进行读和/或写数据。因此，物理存储资源905的带宽可以由每个存储装置的带宽之和来定义。作为另一示例，存储资源处理电路935-1和935-2可以被配置为分别对存储装置953-11至953-18和953-21至953-28以及分别对存储器模块957-11至957-16和957-21至957-26进行读和/或写数据。因此，物理存储资源905的带宽可以由每个存储装置和存储器模块的带宽之和来定义。在一些示例中，存储装置953-11至953-18和953-21至953-2228中的每个可以具有在500兆字节每秒（MB/s）和20GB/s之间的带宽。在一些示例中，每个存储器模块可以具有在4GB/s和40GB/s之间的带宽。
存储资源处理电路935-1和935-2还经由电信令介质928而被可操作地耦合到双模式光网络接口电路926。注意，将双模式光网络接口电路926耦合到存储资源处理电路935-1和935-2的电信令介质928可以是与将存储资源处理电路935-1和935-2耦合到可移除存储驱动器阵列子集和存储器阵列子集的电信令介质928不同的类型、配置、和或支持不同信令标准。示例不限于此上下文中。在一些示例中，物理存储资源的带宽可以由将双模式光网络接口电路926耦合到存储资源处理电路935-1和935-2的电信令介质928的带宽来定义。
此外，滑板904可以双模式光网络接口电路926为特征，其包括经由光通道925而被耦合到MPCM 916的光连接器916A的（一个或多个）光收发器模块927。另外，滑板904可以MPCM 916的功率连接器916B为特征，其用于经由功率传送介质924向滑板904的组件提供功率。光信令介质925可包括多个光通道。每个光通道可以具有特定带宽。在一些示例中，光通道925可以具有在20和80GB/s之间的带宽。
通过一些示例，光通道925的带宽可以小于物理存储资源905的带宽。例如，在一些实现中，光通道925的带宽可以小于存储装置953-11至953-12和953-21至953-22的组合带宽。在一些实现中，光通道925的带宽可以小于存储装置953-11至953-12和953-21至953-22以及存储器模块957-11至957-16和957-21至957-26的组合带宽。在一些实现中，光通道925的带宽可以小于存储器模块957-11至957-16和957-21至957-26的组合带宽。在一些实现中，光通道925的带宽可以小于将存储资源处理电路935-1和935-2耦合到双模式光网络接口电路926的电信令介质的组合带宽。
应注意，本文描绘的滑板704、804和904可不一定包括所描绘的存储器模块和存储装置，而是可以包括插座和/或连接器模块，其中此类存储器模块和存储装置可例如由数据中心操作员或诸如此类来添加到滑板。
如上所注释的，通过一些示例，滑板可被布置成接受扩展滑板。图10示出了可以表示这种类型的滑板的滑板1004的示例。如本图中所示，滑板1004可以包括物理资源1005的集合、以及被设计成当滑板1004被插入到滑板空间（诸如图3的滑板空间303-1至303-7中的任何一个）中时与对应物MPCM耦合的MPCM 1016。滑板1004还可以双模式光网络接口电路1026为特征，以将滑板1004的组件耦合到数据中心的光组构。
滑板1004还可以扩展连接器1017为特征。扩展连接器1017通常可以包括插座、插槽或其它类型的连接元件，其能够接受一种或多种类型的扩展模块，诸如扩展滑板1018。通过与扩展滑板1018上的对应物连接器耦合，扩展连接器1017可以向物理资源1005提供对驻留在扩展滑板1018上的补充物理资源1005B的访问。
例如，物理资源1005可以包括物理存储资源，诸如可移除存储驱动器阵列和存储资源处理电路，而对应于要被包括在物理资源中的存储器阵列的存储器模块可以经由扩展滑板1018上的补充物理资源1005B来提供。
图11示出了根据各种实施例的数据中心1100的示例，所述数据中心1100通常可以表示在其中/针对其可实现本文描述的一种或多种技术的数据中心。如本图中反映的，可以实现物理基础设施管理框架1150A以促进管理数据中心1100的物理基础设施1100A。在各种实施例中，物理基础设施管理框架1150A的一个功能可以将要管理数据中心1100内的自动化维护功能，例如使用机器人维护设备来服务物理基础设施1100A内的计算设备。在一些实施例中，物理基础设施1100A可以以先进的遥测系统为特征，所述遥测系统执行遥测报告，所述遥测报告足够鲁棒以支持物理基础设施1100A的远程自动化管理。在各种实施例中，由此类先进的遥测系统提供的遥测信息可以支持诸如故障预测/预防能力和容量规划能力的特征。在一些实施例中，物理基础设施管理框架1150A还可以配置成使用硬件证明技术来管理物理基础设施组件的认证。例如，机器人可以在安装之前通过分析从与要安装的每个组件关联的射频标识（RFID）标签收集的信息来验证组件的可靠性。实施例不限于在此上下文中。
如本图中所示的，数据中心1100的物理基础设施1100A可以包括光组构1112，其可以包括双模式光交换基础设施1114。光组构1112和双模式光交换基础设施1114可以与图1的光组构112或图4的412相同（或与其类似），并且可以在数据中心1100的滑板之间提供高带宽、低时延、多协议连接性。如上面所讨论的，参考图1，在各种实施例中，此类连接性的可用性可以使解聚和动态地池化诸如加速器、存储器和存储的资源可行。在一些实施例中，例如，一个或多个池化加速器滑板1130可以包括在数据中心1100的物理基础设施1100A之间，每个物理基础设施1100A可以包括加速器资源池 - 例如协处理器和/或FPGA - 例如-其经由光组构1112和双模式光交换基础设施1114对其它滑板是可用全局可访问。
在另一示例中，在各种实施例中，一个或多个池化存储滑板1132可以包括在数据中心1100的物理基础设施1100A之间，每个物理基础设施1100A可以包括可用于经由光组构1112和双模式光交换基础设施1114对其它滑板全局可访问的存储资源池。在一些实施例中，此类池化存储滑板1132可以包括固态存储装置（例如固态驱动器（SSD））的池。在各种实施例中，一个或多个高性能处理滑板1134可以包括在数据中心1100的物理基础设施1100A之间。在一些实施例中，高性能处理滑板1134可以包括高性能处理器池以及冷却特征（其增强空气冷却以产生高达250W或更高的较高热封套）。在各种实施例中，任何给定的高性能处理滑板1134可以以扩展连接器1117为特征，所述扩展连接器1117可以接受远存储器扩展滑板，使得对该高性能处理滑板1134本地可用的远存储器从包括在该滑板上的近存储器以及处理器中解聚。在一些实施例中，此类高性能处理滑板1134可以被配置有远存储器（使用包括低时延SSD存储装置的扩展滑板）。光基础设施允许一个滑板上的计算资源以利用远程加速器/FPGA、存储器和/或SSD资源（其在位于相同机架或数据中心中的任何其它机架上的滑板上解聚）。脊-叶网络架构中，远程资源可以位于距一个交换机跳或距两个交换机跳的距离。实施例不限于在此上下文中。
在各种实施例中，可以将一个或多个抽象的层应用于物理基础设施1100A的物理资源，以便定义虚拟基础设施，例如软件定义的基础设施1100B。在一些实施例中，可以分配软件定义的基础设施1100B的虚拟计算资源1136以支持云服务1140的预备。在各种实施例中，可以对虚拟计算资源1136的具体集合进行分组以用于为云服务1140作预备（以SDI服务1138的形式）。云服务1140的示例可以包括-但不限于-软件即服务（SaaS）服务1142、平台即服务（PaaS）服务1144，以及基础设施即服务（IaaS）服务1146。
在一些实施例中，可以使用虚拟基础设施管理框架1150B来进行软件定义的基础设施1100B的管理。在各种实施例中，虚拟基础设施管理框架1150B可以被设计成结合管理到云服务1140的虚拟计算资源1136和/或SDI服务1138的分配来实现工作负荷指纹识别技术和/或机器学习技术。在一些实施例中，虚拟基础设施管理框架1150B可以结合执行此类资源分配来使用/咨询遥测数据。在各种实施例中，可以实现应用/服务管理框架1150C，以便为云服务1140提供服务质量（QoS）管理能力。实施例不限于此上下文中。
图12示出了示例计算平台3000。在一些示例中，如本图中所示，计算平台3000可以包括处理组件3040、其它平台组件3050或通信接口3060中的任何一个。根据一些示例，计算平台3000可以托管数据中心（诸如本文描绘的数据中心）的物理存储资源。计算平台3000可以是单个物理服务器或组成逻辑服务器，其包括来自可配置物理资源池的物理资源的组合。
根据一些示例，处理组件3040可以包括各种硬件元件、软件元件、或两者的组合。硬件元件的示例可以包括装置、逻辑装置、组件、处理器、微处理器、电路、处理器电路、电路元件（例如，晶体管、电阻器、电容器、电感器等）、集成电路、专用集成电路（ASIC）、可编程逻辑装置（PLD）、数字信号处理器（DSP）、现场可编程门阵列（FPGA）、存储器单元、逻辑门、寄存器、半导体装置、芯片、微芯片、芯片集等。软件元素的示例可以包括软件组件、程序、应用、计算机程序、应用程序、装置驱动、系统程序、软件开发程序、机器程序、操作系统软件、中间件、固件、软件模块、例程、子例程、功能、方法、过程、软件接口、应用程序接口（API）、指令集、计算代码、计算机代码、代码段、计算机代码段、字、值、符号、或其任何组合。确定是否使用硬件元件和/或软件元件来实现示例可以根据任何数量的因素而变化，所述因素是诸如期望的计算速率、功率级别、热容差、处理周期预算、输入数据速率、输出数据速率、存储器资源、数据总线速度和其它设计或性能约束，如对于给定示例所期望的。
在一些示例中，其它平台组件3050可以包括公共计算元件，诸如一个或多个处理器、多核处理器、协处理器、存储器单元、芯片集、控制器、外围装置、接口、振荡器、定时装置、视频卡、音频卡、多媒体输入/输出（I/O）组件（例如，数字显示器）、功率供应等。存储器单元的示例可以包括但不限于采用一种或多种较高速存储器单元的形式的各种类型的计算机可读和机器可读存储介质，诸如只读存储器（ROM）、随机存取存储器（RAM）、动态RAM（DRAM）、双倍数据速率DRAM（DDRAM）、同步DRAM（SDRAM）、静态RAM（SRAM）、可编程ROM（PROM）、可擦除可编程ROM（EPROM）、电可擦除可编程ROM（EEPROM）、闪速存储器、聚合物存储器（诸如铁电聚合物存储器）、奥式存储器、相变或铁电存储器、氧化硅氮氧化硅（SONOS）存储器、磁卡或光卡、装置阵列（诸如独立盘冗余阵列（RAID）驱动器）、固态存储器装置（例如，USB存储器）、固态驱动器（SSD）和适合于存储信息的任何其它类型的存储介质。
在一些示例中，其它平台组件3050可以包括物理存储资源105A-1、105B-1至105B-4、505、605、705、805、905和/或1005。
在一些示例中，通信接口3060可以包括用于支持通信接口的逻辑和/或特征。对于这些示例，通信接口3060可以包括一个或多个通信接口，其根据各种通信协议或标准来操作以通过直接或网络通信链路进行通信。直接通信可以经由在一个或多个行业标准（包括后代和变体）（诸如与PCIe规范相关联的那些）中描述的通信协议或标准的使用而发生。网络通信可以经由通信协议或标准（诸如由IEEE所发布的一个或多个以太网标准中描述的那些）的使用而发生。例如，一个此类以太网标准可以包括IEEE 802.3。网络通信也可以根据一个或多个OpenFlow规范（例如OpenFlow硬件抽象API规范）而发生。网络通信也可根据Infiniband架构规范或TCP/IP协议而发生。
可以使用分立电路、专用集成电路（ASIC）、逻辑门和/或单芯片架构的任何组合来实现计算平台3000的组件和特征。此外，可以使用微控制器、可编程逻辑阵列和/或微处理器或适合适当的前述的任何组合来实现计算平台1000的特征。注意，硬件、固件和/或软件元件可以在本文中被统称或单独称为“逻辑”或“电路”。
应当理解，本图的框图中示出的示范性计算平台3000可以表示许多潜在实现的一个功能描述性示例。因此，附图中描绘的框功能的划分、省略或包含未推断用于实现这些功能的硬件组件、电路、软件和/或元件将必须被划分、省略或包括在实施例中。
至少一个示例的一个或多个方面可以由存储在至少一个机器可读介质上的代表性指令来实现，所述至少一个机器可读介质表示处理器内的各种逻辑，所述代表性指令当由机器、计算装置或系统读时促使所述机器、计算装置或系统制造用于执行本文描述的技术的逻辑。已知为“IP核”的此类表示可被存储在有形的机器可读介质上，并被供应给各种顾客或制作设施以加载到实际制作逻辑或处理器的制造机器中。
可以使用硬件元件、软件元件、或两者的组合来实现各种示例。在一些示例中，硬件元件可以包括装置、组件、处理器、微处理器、电路、电路元件（例如，晶体管、电阻器、电容器、电感器等）、集成电路、专用集成电路（ASIC）、可编程逻辑制作（PLD）、数字信号处理器（DSP）、现场可编程门阵列（FPGA）、存储器单元、逻辑门、寄存器、半导体装置、芯片、微芯片、芯片集等。在一些示例中，软件元素可以包括软件组件、程序、应用、计算机程序、应用程序、系统程序、机器程序、操作系统软件、中间件、固件、软件模块、例程、子例程、功能、方法、过程、软件接口、应用程序接口（API）、指令集、计算代码、计算机代码、代码段、计算机代码段、字、值、符号、或其任何组合。确定是否使用硬件元件和/或软件元件来实现示例可以根据任何数量的因素而变化，所述因素是诸如期望的计算速率、功率级别、热容差、处理周期预算、输入数据速率、输出数据速率、存储器资源、数据总线速度和其它设计或性能约束，如对于给定实现所期望的。
一些示例可以包括制品或至少一种计算机可读介质。计算机可读介质可以包括用于存储逻辑的非暂态存储介质。在一些示例中，非暂态存储介质可以包括能够存储电子数据的一种或多种类型的计算机可读存储介质，包括易失性存储器或非易失性存储器、可移除或不可移除存储器、可擦除或不可擦除存储器、可写或可重写的内存等。在一些示例中，逻辑可以包括各种软件元件，诸如软件组件、程序、应用、计算机程序、应用程序、系统程序、机器程序、操作系统软件、中间件、固件、软件模块、例程、子例程、功能、方法、过程、软件接口、API、指令集、计算代码、计算机代码、代码段、计算机代码段、字、值、符号、或其任何组合。
根据一些示例，计算机可读介质可以包括用于存储或维持指令的非暂态存储介质，所述指令在由机器、计算装置或系统执行时促使所述机器、计算装置或系统执行根据所描述的示例的方法和/或操作。指令可以包括任何合适类型的代码，诸如源代码、经编译代码、经解译代码、可执行代码、静态代码、动态代码、和诸如此类。可以根据预定义的计算机语言、方式或语法来实现指令以用于指示机器、计算装置或系统执行某一功能。可以使用任何合适的高级、低级、面向对象、可视、经编译和/或经解译的编程语言来实现指令。
可以使用表述“在一个示例中”或“示例”连同其衍生物来描述一些示例。这些术语意味着与示例一起被描述的特定特征、结构或特性被包含在至少一个示例中。说明书中的各种位置中出现的短语“在一个示例中”不必都指同一示例。
可以使用表述“耦合”和“连接”连同它们的派生词来描述一些示例。这些术语不必意指为对于彼此的同义词。例如，使用术语“连接”和/或“耦合”的描述可指示两个或更多个元件与彼此直接物理或电气接触中。然而，术语“耦合”还可以意味着两个或更多个元件与彼此不是直接接触，但仍还与彼此合作或交互。
以下示例属于本文所公开的技术的附加示例
强调的是，提供公开的摘要以符合37 C.F.R.节1.72（b），其要求允许读者快速探知本技术公开的本质的摘要。在理解公开的摘要将不会被用于解释或限制权利要求的范围或意义的情况下，提交该公开的摘要。另外，在前述的具体实施方式中，可以看到，出于将公开合理化的目的而将各种特征一起分组在单个示例中。公开的这种方法将不被解释为反映如下意图：要求保护的示例需要比在每项权利要求中确切叙述的特征更多的特征。而是，如下面的权利要求反映的，发明的主题在于少于单个公开的示例的所有特征。因此，下面的权利要求特此被合并入具体实施方式中，其中每项权利要求独自作为单独的示例。在随附的权利要求中，术语“包含”和“其中”分别被用作相应术语“包括”和“其中”的通俗易懂的等效词。此外，术语“第一”、“第二”、“第三”等仅仅被用作标签，并非旨在将数字要求强加到它们的对象上。
尽管已采用特定于结构特征和/或方法论动作的语言描述了本主题，但要理解，随附权利要求中定义的主题不一定限于以上描述的特定特征或动作。相反，以上描述的特定特征和动作被公开为实现权利要求的示例形式。
本公开可以采用各种实施例中的任何实施例来实现，诸如例如，示例实施例的以下非穷举列表。
示例1. 一种用于数据中心的滑板的设备，包括：框架，所述框架耦合到数据中心的机架，所述框架被布置为接收多个存储装置；存储器插座的群组，所述存储器插座的群组用于接收多个存储器模块，所述存储器模块包括三维（3D）交叉点存储器和不同于所述3D交叉点存储器的另一类型的计算机可读存储器的组合；至少一个存储资源处理电路，所述至少一个存储资源处理电路用于耦合到所述多个存储装置和所述多个存储器模块；以及双模式光网络接口，所述双模式光网络接口被可操作地耦合到所述至少一个存储资源处理电路以将所述多个存储装置耦合到网络组构。
示例2. 如示例1所述的设备，所述至少一个存储资源处理电路是多个存储资源处理电路，包括：第一存储资源处理电路，所述第一存储资源处理电路被耦合到所述多个存储装置的第一子集和所述多个存储器模块的第一子集；以及第二存储资源处理电路，所述第二存储资源处理电路被耦合到所述多个存储装置的第二子集和所述多个存储器模块的第二子集。
示例3. 如示例2所述的设备，包括：所述第一存储资源处理电路、所述多个存储装置的所述第一子集、和与第一故障域对应的所述多个存储器模块的所述第一子集、以及所述第二存储资源处理电路、所述多个存储装置的所述第二子集、和与第二故障域对应的所述多个存储器模块的所述第二子集。
示例4. 如示例2所述的设备，所述双模式光网络接口用于提供大体上等于所述多个存储装置的带宽的带宽。
示例5. 如示例4所述的设备，所述多个存储装置包括在2和8个之间的存储装置。
示例6. 如示例2所述的设备，所述双模式光网络接口用于提供大于所述多个存储装置的带宽的带宽。
示例7. 如示例6所述的设备，所述多个存储装置包括在8和24个之间的存储装置。
示例8. 如示例2所述的设备，所述双模式光网络接口用于提供小于所述多个存储装置的带宽的带宽。
示例9. 如示例1至8中任一项所述的设备，所述双模式网络接口包括多个光通道。
示例10. 如示例9所述的设备，其中所述多个光通道中的每个的数据带宽在30和220Gb/s之间。
示例11. 如示例1至8中任一项所述的设备，所述至少一个存储资源处理电路中的每个包括存储器控制器。
示例12. 如示例1至8中任一项所述的设备，所述至少一个存储资源处理电路中的每个包括存储器控制器；以及处理电路，所述处理电路用于对所述至少一个存储资源处理电路和所述双模式光网络接口之间的数据流应用至少一个处理操作。
示例13. 如示例1至8中任一项所述的设备，包括所述多个存储器模块。
示例14. 如示例1至8中任一项所述的设备，包括所述多个存储装置。
示例15. 如示例14所述的设备，其中所述多个存储装置是固态驱动器或非易失性存储器模块。
示例16. 如示例1至8中任一项所述的设备，所述框架包括成对布置的多个可移除存储装置安装插槽，所述多个可移除存储装置安装插槽的每对用于接收所述多个存储装置之一。
示例17. 如示例16所述的设备，所述多个可移除存储装置安装插槽的每对之一被部署在所述框架的下部，并且所述多个可移除存储装置安装插槽的每对的另一个被部署在所述框架的上部，以垂直地保留所述多个存储装置中的每个。
示例18. 如示例17所述的设备，所述多个可移除存储装置安装插槽的每对与所述多个可移除存储装置安装插槽的另一对被间隔开足以机器人式地插入和移除所述多个存储装置的距离。
示例19. 一种用于数据中心的机架的系统，包括：机架，所述机架包括各自布置为接受滑板的多个滑板空间；以及至少一个滑板，所述至少一个滑板包括：框架，所述框架耦合到数据中心的机架，所述框架被布置为接收多个存储装置；存储器插座的群组，所述存储器插座的群组用于接收多个存储器模块，所述存储器模块包括三维（3D）交叉点存储器和不同于所述3D交叉点存储器的另一类型的计算机可读存储器的组合；至少一个存储资源处理电路，所述至少一个存储资源处理电路用于耦合到所述多个存储装置和所述多个存储器模块；以及双模式光网络接口，所述双模式光网络接口被可操作地耦合到所述至少一个存储资源处理电路以将所述多个存储装置耦合到网络组构。
示例20. 如示例19所述的系统，所述至少一个存储资源处理电路是多个存储资源处理电路，包括：第一存储资源处理电路，所述第一存储资源处理电路被耦合到所述多个存储装置的第一子集和所述多个存储器模块的第一子集；以及第二存储资源处理电路，所述第二存储资源处理电路被耦合到所述多个存储装置的第二子集和所述多个存储器模块的第二子集。
示例21. 如示例20所述的系统，包括：所述第一存储资源处理电路、所述多个存储装置的所述第一子集、和与第一故障域对应的所述多个存储器模块的所述第一子集、以及所述第二存储资源处理电路、所述多个存储装置的所述第二子集、和与第二故障域对应的所述多个存储器模块的所述第二子集。
示例22. 如示例20所述的系统，所述双模式光网络接口用于提供大体上等于所述多个存储装置的带宽的带宽。
示例23. 如示例22所述的系统，所述多个存储装置包括在2和8个之间的存储装置。
示例24. 如示例20所述的系统，所述双模式光网络接口用于提供大于所述多个存储装置的带宽的带宽。
示例25. 如示例24所述的系统，所述多个存储装置包括在8和24个之间的存储装置。
示例26. 如示例20所述的系统，所述双模式光网络接口用于提供小于所述多个存储装置的带宽的带宽。
示例27. 如示例18至26中任一项所述的系统，所述双模式网络接口包括多个光通道。
示例28. 如示例27所述的系统，其中所述多个光通道中的每个的数据带宽在30和220Gb/s之间。
示例29. 如示例18至26中任一项所述的系统，所述至少一个存储资源处理电路中的每个包括存储器控制器。
示例30. 如示例18至26中任一项所述的系统，所述至少一个存储资源处理电路中的每个包括存储器控制器；以及处理电路，所述处理电路用于对所述至少一个存储资源处理电路和所述双模式光网络接口之间的数据流应用至少一个处理操作。
示例31. 如示例18至26中任一项所述的系统，包括所述多个存储器模块。
示例32. 如示例18至26中任一项所述的系统，包括所述多个存储装置。
示例33. 如示例30所述的系统，其中所述多个存储装置是固态驱动器或非易失性存储器模块。
示例34. 如示例18至26中任一项所述的系统，所述框架包括成对布置的多个可移除存储装置安装插槽，所述多个可移除存储装置安装插槽的每对用于接收所述多个存储装置之一。
示例35. 如示例34所述的系统，所述多个可移除存储装置安装插槽的每对之一被部署在所述框架的下部，并且所述多个可移除存储装置安装插槽的每对的另一个被部署在所述框架的上部，以垂直地保留所述多个存储装置中的每个。
示例36. 如示例35所述的系统，所述多个可移除存储装置安装插槽的每对与所述多个可移除存储装置安装插槽的另一对被间隔开足以机器人式地插入和移除所述多个存储装置的距离。
示例37. 一种用于数据中心的滑板的设备，包括：框架，所述框架耦合到数据中心的机架，所述框架被布置为接收多个存储装置；存储器插座的群组，所述存储器插座的群组用于接收第一类型的存储器的多个存储器模块；至少一个存储资源处理电路，所述至少一个存储资源处理电路用于耦合到所述多个存储装置和所述多个存储器模块，所述至少一个存储资源处理电路包括不同于所述第一类型的存储器的第二类型的存储器的存储器阵列；以及双模式光网络接口，所述双模式光网络接口被可操作地耦合到所述至少一个存储资源处理电路以将所述多个存储装置耦合到网络组构。
示例38. 如示例37所述的设备，其中所述第一类型的存储器是动态随机存取存储器（DRAM）。
示例39. 如示例38所述的设备，其中所述第二类型的存储器是三维（3D）交叉点存储器。
示例40. 如示例39所述的设备，所述至少一个存储资源处理电路是多个存储资源处理电路，包括：第一存储资源处理电路，所述第一存储资源处理电路被耦合到所述多个存储装置的第一子集和所述多个存储器模块的第一子集；以及第二存储资源处理电路，所述第二存储资源处理电路被耦合到所述多个存储装置的第二子集和所述多个存储器模块的第二子集。
示例41. 如示例39所述的设备，包括：所述第一存储资源处理电路、所述多个存储装置的所述第一子集、和与第一故障域对应的所述多个存储器模块的所述第一子集、以及所述第二存储资源处理电路、所述多个存储装置的所述第二子集、和与第二故障域对应的所述多个存储器模块的所述第二子集。
示例42. 如示例39所述的设备，所述双模式光网络接口用于提供大体上等于所述多个存储装置的带宽的带宽。
示例43. 如示例42所述的设备，所述多个存储装置包括在2和8个之间的存储装置。
示例44. 如示例39所述的设备，所述双模式光网络接口用于提供大于所述多个存储装置的带宽的带宽。
示例45. 如示例44所述的设备，所述多个存储装置包括在8和24个之间的存储装置。
示例46. 如示例39所述的设备，所述双模式光网络接口用于提供小于所述多个存储装置的带宽的带宽。
示例47. 如示例37至46中任一项所述的设备，所述双模式网络接口包括多个光通道。
示例48. 如示例47所述的设备，其中所述多个光通道中的每个的数据带宽在30和220Gb/s之间。
示例49. 如示例37至46中任一项所述的设备，所述至少一个存储资源处理电路中的每个包括存储器控制器。
示例50. 如示例37至46中任一项所述的设备，所述至少一个存储资源处理电路中的每个包括存储器控制器；以及处理电路，所述处理电路用于对所述至少一个存储资源处理电路和所述双模式光网络接口之间的数据流应用至少一个处理操作。
示例51. 如示例37至46中任一项所述的设备，包括所述多个存储器模块。
示例52. 如示例37至46中任一项所述的设备，包括所述多个存储装置。
示例53. 如示例52所述的设备，其中所述多个存储装置是固态驱动器或非易失性存储器模块。
示例54. 如示例37至46中任一项所述的设备，所述框架包括成对布置的多个可移除存储装置安装插槽，所述多个可移除存储装置安装插槽的每对用于接收所述多个存储装置之一。
示例55. 如示例54所述的设备，所述多个可移除存储装置安装插槽的每对之一被部署在所述框架的下部，并且所述多个可移除存储装置安装插槽的每对的另一个被部署在所述框架的上部，以垂直地保留所述多个存储装置中的每个。
示例56. 如示例55所述的设备，所述多个可移除存储装置安装插槽的每对与所述多个可移除存储装置安装插槽的另一对被间隔开足以机器人式地插入和移除所述多个存储装置的距离。
示例57. 一种用于数据中心的滑板的设备，包括：框架，所述框架耦合到数据中心的机架，所述框架被布置为接收多个存储装置；存储器插座的群组，所述存储器插座的群组用于接收第一类型的存储器的多个存储器模块；至少一个存储资源处理部件，所述至少一个存储资源处理部件用于耦合到所述多个存储装置和所述多个存储器模块，所述至少一个存储资源处理电路包括不同于所述第一类型的存储器的第二类型的存储器的存储器阵列；以及双模式光网络接口部件，所述双模式光网络接口被可操作地耦合到所述至少一个存储资源处理电路以将所述多个存储装置耦合到网络组构。
示例58. 如示例57所述的设备，其中所述第一类型的存储器是动态随机存取存储器（DRAM）。
示例59. 如示例58所述的设备，其中所述第二类型的存储器是三维（3D）交叉点存储器。
示例60. 如示例59所述的设备，所述至少一个存储资源处理电路部件是多个存储资源处理电路部件，包括：第一存储资源处理电路部件，所述第一存储资源处理电路部件被耦合到所述多个存储装置的第一子集和所述多个存储器模块的第一子集；以及第二存储资源处理电路部件，所述第二存储资源处理电路部件被耦合到所述多个存储装置的第二子集和所述多个存储器模块的第二子集。
示例61. 如示例59所述的设备，包括：所述第一存储资源处理电路部件、所述多个存储装置的所述第一子集、和与第一故障域对应的所述多个存储器模块的所述第一子集、以及所述第二存储资源处理电路部件、所述多个存储装置的所述第二子集、和与第二故障域对应的所述多个存储器模块的所述第二子集。
示例62. 如示例59所述的设备，所述双模式光网络接口部件用于提供大体上等于所述多个存储装置的带宽的带宽。
示例63. 如示例62所述的设备，所述多个存储装置包括在2和8个之间的存储装置。
示例64. 如示例59所述的设备，所述双模式光网络接口部件用于提供大于所述多个存储装置的带宽的带宽。
示例65. 如示例64所述的设备，所述多个存储装置包括在8和24个之间的存储装置。
示例66. 如示例59所述的设备，所述双模式光网络接口部件用于提供小于所述多个存储装置的带宽的带宽。
示例67. 如示例57至66中任一项所述的设备，所述双模式网络接口部件包括多个光通道。
示例68. 如示例67所述的设备，其中所述多个光通道中的每个的数据带宽在30和220Gb/s之间。
示例69. 如示例57至66中任一项所述的设备，所述至少一个存储资源处理电路部件中的每个包括存储器控制器。
示例70. 如示例57至66中任一项所述的设备，所述至少一个存储资源处理电路部件中的每个包括存储器控制器；以及处理电路，所述处理电路用于对所述至少一个存储资源处理电路和所述双模式光网络接口之间的数据流应用至少一个处理操作。
示例71. 一种用于数据中心的机架的滑板的方法，包括：在存储器插座的群组处接收多个存储器模块，所述存储器模块包括三维（3D）交叉点存储器和不同于所述3D交叉点存储器的另一类型的计算机可读存储器的组合；经由至少一个存储资源处理电路将多个存储装置耦合到所述多个存储器模块；以及经由被耦合到所述至少一个存储资源处理电路的双模式光网络接口将所述多个存储装置耦合到网络组构。
示例72. 如示例71所述的方法，所述机架包括各自布置为接收所述滑板的多个滑板空间。
示例73. 如示例72所述的方法，所述滑板包括布置为接收所述多个存储装置的框架。
示例74. 如示例71所述的方法，所述至少一个存储资源处理电路是多个存储资源处理电路，所述方法包括：经由所述多个存储资源处理电路中的第一存储资源处理电路而耦合到所述多个存储装置的第一子集和所述多个存储器模块的第一子集；以及经由所述多个存储资源处理电路中的第二存储资源处理电路而耦合到所述多个存储装置的第二子集和所述多个存储器模块的第二子集。
示例75. 如示例74所述的方法，包括：所述第一存储资源处理电路、所述多个存储装置的所述第一子集、和与第一故障域对应的所述多个存储器模块的所述第一子集、以及所述第二存储资源处理电路、所述多个存储装置的所述第二子集、和与第二故障域对应的所述多个存储器模块的所述第二子集。
示例76. 如示例74所述的方法，包括经由所述双模式光网络接口而提供大体上等于所述多个存储装置的带宽的带宽。
示例77. 如示例76所述的方法，所述多个存储装置包括在2和8个之间的存储装置。
示例78. 如示例74所述的方法包括经由所述双模式光网络接口而提供大于所述多个存储装置的带宽的带宽。
示例79. 如示例78所述的方法，所述多个存储装置包括在8和24个之间的存储装置。
示例80. 如示例74所述的方法，包括经由所述双模式光网络接口而提供小于所述多个存储装置的带宽的带宽。
示例81. 如示例71至80中任一项所述的方法，所述双模式网络接口包括多个光通道。
示例82. 如示例81所述的方法，其中所述多个光通道中的每个的数据带宽在30和220Gb/s之间。
示例83. 如示例71至78中任一项所述的方法，所述至少一个存储资源处理电路中的每个包括存储器控制器。
示例84. 如示例71至80中任一项所述的方法，所述至少一个存储资源处理电路中的每个包括存储器控制器；以及处理电路，所述处理电路用于对所述至少一个存储资源处理电路和所述双模式光网络接口之间的数据流应用至少一个处理操作。
示例85. 如示例71至80所述的方法，其中所述多个存储装置是固态驱动器或非易失性存储器模块。
示例86. 如示例73中任一项所述的方法，所述框架包括成对布置的多个可移除存储装置安装插槽，所述多个可移除存储装置安装插槽的每对用于接收所述多个存储装置之一。
示例87. 如示例86所述的方法，所述多个可移除存储装置安装插槽的每对之一被部署在所述框架的下部，并且所述多个可移除存储装置安装插槽的每对的另一个被部署在所述框架的上部，以垂直地保留所述多个存储装置中的每个。
示例88. 如示例87所述的方法，所述多个可移除存储装置安装插槽的每对与所述多个可移除存储装置安装插槽的另一对被间隔开足以机器人式地插入和移除所述多个存储装置的距离。

Claims (25)

1.一种用于数据中心的滑板的设备，包括：
框架，所述框架耦合到数据中心的机架，所述框架被布置为接收多个存储装置；
存储器插座的群组，所述存储器插座的群组用于接收多个存储器模块，所述存储器模块包括三维（3D）交叉点存储器和不同于所述3D交叉点存储器的另一类型的计算机可读存储器的组合；
至少一个存储资源处理电路，所述至少一个存储资源处理电路用于耦合到所述多个存储装置和所述多个存储器模块；以及
双模式光网络接口，所述双模式光网络接口被可操作地耦合到所述至少一个存储资源处理电路以将所述多个存储装置耦合到网络组构。
2.如权利要求1所述的设备，所述至少一个存储资源处理电路是多个存储资源处理电路，包括：
第一存储资源处理电路，所述第一存储资源处理电路被耦合到所述多个存储装置的第一子集和所述多个存储器模块的第一子集；以及
第二存储资源处理电路，所述第二存储资源处理电路被耦合到所述多个存储装置的第二子集和所述多个存储器模块的第二子集。
3.如权利要求2所述的设备，包括：所述第一存储资源处理电路、所述多个存储装置的所述第一子集、和与第一故障域对应的所述多个存储器模块的所述第一子集、以及所述第二存储资源处理电路、所述多个存储装置的所述第二子集、和与第二故障域对应的所述多个存储器模块的所述第二子集。
4.如权利要求3所述的设备，所述双模式光网络接口用于提供大体上等于所述多个存储装置的带宽的带宽。
5.如权利要求3所述的设备，所述双模式光网络接口用于提供大于所述多个存储装置的带宽的带宽。
6.如权利要求1所述的设备，所述多个存储装置包括在4和24个之间的存储装置。
7.如权利要求1所述的设备，所述双模式网络接口包括多个光通道，其中所述多个光通道中的每个的数据带宽在30和220千兆字节每秒（Gb/s）之间。
8. 如权利要求1所述的设备，所述至少一个存储资源处理电路中的每个包括：
存储器控制器；以及
处理电路，所述处理电路用于对所述至少一个存储资源处理电路和所述双模式光网络接口之间的数据流应用至少一个处理操作。
9.如权利要求1所述的设备，包括所述多个存储器模块和所述多个存储装置。
10. 一种用于数据中心的机架的系统，包括：
机架，所述机架包括被布置为接受滑板的多个滑板空间；以及
至少一个滑板，所述至少一个滑板包括：
框架，所述框架耦合到数据中心的机架，所述框架被布置为接收多个存储装置；
存储器插座的群组，所述存储器插座的群组用于接收多个存储器模块，所述存储器模块包括三维（3D）交叉点存储器和不同于所述3D交叉点存储器的另一类型的计算机可读存储器的组合；
至少一个存储资源处理电路，所述至少一个存储资源处理电路用于耦合到所述多个存储装置和所述多个存储器模块；以及
双模式光网络接口，所述双模式光网络接口被可操作地耦合到所述至少一个存储资源处理电路以将所述多个存储装置耦合到网络组构。
11.如权利要求10所述的系统，所述至少一个存储资源处理电路是多个存储资源处理电路，包括：
第一存储资源处理电路，所述第一存储资源处理电路被耦合到所述多个存储装置的第一子集和所述多个存储器模块的第一子集；以及
第二存储资源处理电路，所述第二存储资源处理电路被耦合到所述多个存储装置的第二子集和所述多个存储器模块的第二子集。
12.如权利要求11所述的系统，所述双模式光网络接口用于提供大体上等于所述多个存储装置的带宽的带宽。
13.如权利要求11所述的系统，所述双模式光网络接口用于提供大于所述多个存储装置的带宽的带宽。
14.如权利要求10所述的系统，所述多个存储装置包括在4和24个之间的存储装置。
15. 如权利要求10所述的系统，所述至少一个存储资源处理电路中的每个包括：
存储器控制器；以及
处理电路，所述处理电路用于对所述至少一个存储资源处理电路和所述双模式光网络接口之间的数据流应用至少一个处理操作。
16.如权利要求10所述的系统，包括所述多个存储器模块和所述多个存储装置。
17.如权利要求16所述的系统，其中所述多个存储装置是固态驱动器。
18.如权利要求10所述的系统，所述框架包括成对布置的多个可移除存储装置安装插槽，所述多个可移除存储装置安装插槽的每对用于接收所述多个存储装置之一。
19.如权利要求18所述的系统，所述多个可移除存储装置安装插槽的每对之一被部署在所述框架的下部，并且所述多个可移除存储装置安装插槽的每对的另一个被部署在所述框架的上部，以垂直地保留所述多个存储装置中的每个。
20.如权利要求19所述的系统，所述多个可移除存储装置安装插槽的每对与所述多个可移除存储装置安装插槽的另一对被间隔开足以机器人式地插入和移除所述多个存储装置的距离。
21.一种用于数据中心的滑板的设备，包括：
框架，所述框架耦合到数据中心的机架，所述框架被布置为接收多个存储装置；
存储器插座的群组，所述存储器插座的群组用于接收第一类型的存储器的多个存储器模块；
至少一个存储资源处理电路，所述至少一个存储资源处理电路用于耦合到所述多个存储装置和所述多个存储器模块，所述至少一个存储资源处理电路包括与所述第一类型的存储器不同的第二类型的存储器的存储器阵列；以及
双模式光网络接口，所述双模式光网络接口被可操作地耦合到所述至少一个存储资源处理电路以将所述多个存储装置耦合到网络组构。
22.如权利要求21所述的设备，其中所述第一类型的存储器是动态随机存取存储器（DRAM），并且所述第二类型的存储器是三维（3D）交叉点存储器。
23.一种用于数据中心的机架的滑板的方法，包括：
在存储器插座的群组处接收包括三维（3D）交叉点存储器和不同于所述3D交叉点存储器的另一类型的计算机可读存储器的组合的多个存储器模块；
经由至少一个存储资源处理电路而将多个存储装置耦合到所述多个存储器模块；以及
经由被耦合到所述至少一个存储资源处理电路的双模式光网络接口而将所述多个存储装置耦合到网络组构。
24. 如权利要求23所述的方法，所述至少一个存储资源处理电路是多个存储资源处理电路，所述方法包括：
经由所述多个存储资源处理电路中的第一存储资源处理电路而耦合到所述多个存储装置的第一子集和所述多个存储器模块的第一子集；以及
经由所述多个存储资源处理电路中的第二存储资源处理电路而耦合到所述多个存储装置的第二子集和所述多个存储器模块的第二子集。
25.如权利要求24所述的方法，包括所述第一存储资源处理电路、所述多个存储装置的所述第一子集、和与第一故障域对应的所述多个存储器模块的所述第一子集、以及所述第二存储资源处理电路、所述多个存储装置的所述第二子集、和与第二故障域对应的所述多个存储器模块的所述第二子集。
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