MX2021003178A - Plataforma de enfriamiento por inmersion liquida. - Google Patents

Plataforma de enfriamiento por inmersion liquida.

Info

Publication number
MX2021003178A
MX2021003178A MX2021003178A MX2021003178A MX2021003178A MX 2021003178 A MX2021003178 A MX 2021003178A MX 2021003178 A MX2021003178 A MX 2021003178A MX 2021003178 A MX2021003178 A MX 2021003178A MX 2021003178 A MX2021003178 A MX 2021003178A
Authority
MX
Mexico
Prior art keywords
pressure
immersion cooling
liquid immersion
liquid phase
dielectric fluid
Prior art date
Application number
MX2021003178A
Other languages
English (en)
Inventor
John David Enright
Jacob Mertel
Original Assignee
Tmgcore Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/165,594 external-priority patent/US11102912B2/en
Application filed by Tmgcore Llc filed Critical Tmgcore Llc
Publication of MX2021003178A publication Critical patent/MX2021003178A/es

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/189Power distribution
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La presente invención se refiere a un sistema de enfriamiento por inmersión líquida de dos fases, en el cual los componentes de ordenador que generan calor causan que un fluido dieléctrico en su fase líquida vaporicen. El vapor dieléctrico es entonces condensado nuevamente en una fase de líquido y usado para enfriar los componentes de ordenador. Usando un recipiente de presión controlada y controlador de presión, el sistema descrito puede ser operado a menos de presión ambiental. Controlando la presión en la cual el sistema opera, el usuario puede influenciar la temperatura en la cual el fluido dieléctrico vaporiza y de este modo logra desempeño incrementado de un componente de ordenador dado. Utilizando brazos robóticos y componentes informáticos dentro de la ranura, un sistema informático auto-reparable puede ser creado.
MX2021003178A 2018-09-19 2019-09-19 Plataforma de enfriamiento por inmersion liquida. MX2021003178A (es)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US201862733430P 2018-09-19 2018-09-19
US201862746254P 2018-10-16 2018-10-16
US16/165,594 US11102912B2 (en) 2018-09-19 2018-10-19 Liquid immersion cooling platform
US201862768633P 2018-11-16 2018-11-16
US16/283,181 US10477726B1 (en) 2018-09-19 2019-02-22 Liquid immersion cooling platform
US201962815682P 2019-03-08 2019-03-08
US201962875222P 2019-07-17 2019-07-17
US201962897457P 2019-09-09 2019-09-09
PCT/US2019/051924 WO2020061305A1 (en) 2018-09-19 2019-09-19 Liquid immersion cooling platform

Publications (1)

Publication Number Publication Date
MX2021003178A true MX2021003178A (es) 2021-08-11

Family

ID=69887800

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2021003178A MX2021003178A (es) 2018-09-19 2019-09-19 Plataforma de enfriamiento por inmersion liquida.

Country Status (9)

Country Link
EP (1) EP3854188A4 (es)
JP (1) JP2022501728A (es)
KR (2) KR20230106730A (es)
CN (1) CN113056964B (es)
AU (1) AU2019343158A1 (es)
CA (1) CA3113646A1 (es)
MX (1) MX2021003178A (es)
TW (1) TW202020385A (es)
WO (1) WO2020061305A1 (es)

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TWI796929B (zh) * 2021-07-21 2023-03-21 台達電子工業股份有限公司 浸入式冷卻系統
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CN114594837B (zh) * 2022-03-14 2024-04-16 英业达科技有限公司 一种cpu液冷板
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TWI816445B (zh) * 2022-04-07 2023-09-21 緯穎科技服務股份有限公司 密封機構及其兩相式水冷散熱裝置
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Also Published As

Publication number Publication date
JP2022501728A (ja) 2022-01-06
CA3113646A1 (en) 2020-03-26
WO2020061305A1 (en) 2020-03-26
KR20230106730A (ko) 2023-07-13
CN113056964B (zh) 2024-04-12
AU2019343158A1 (en) 2021-05-13
EP3854188A1 (en) 2021-07-28
TW202020385A (zh) 2020-06-01
KR20210065967A (ko) 2021-06-04
EP3854188A4 (en) 2022-06-22
CN113056964A (zh) 2021-06-29
KR102552473B1 (ko) 2023-07-11

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