MX2021003178A - Plataforma de enfriamiento por inmersion liquida. - Google Patents
Plataforma de enfriamiento por inmersion liquida.Info
- Publication number
- MX2021003178A MX2021003178A MX2021003178A MX2021003178A MX2021003178A MX 2021003178 A MX2021003178 A MX 2021003178A MX 2021003178 A MX2021003178 A MX 2021003178A MX 2021003178 A MX2021003178 A MX 2021003178A MX 2021003178 A MX2021003178 A MX 2021003178A
- Authority
- MX
- Mexico
- Prior art keywords
- pressure
- immersion cooling
- liquid immersion
- liquid phase
- dielectric fluid
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/189—Power distribution
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
La presente invención se refiere a un sistema de enfriamiento por inmersión líquida de dos fases, en el cual los componentes de ordenador que generan calor causan que un fluido dieléctrico en su fase líquida vaporicen. El vapor dieléctrico es entonces condensado nuevamente en una fase de líquido y usado para enfriar los componentes de ordenador. Usando un recipiente de presión controlada y controlador de presión, el sistema descrito puede ser operado a menos de presión ambiental. Controlando la presión en la cual el sistema opera, el usuario puede influenciar la temperatura en la cual el fluido dieléctrico vaporiza y de este modo logra desempeño incrementado de un componente de ordenador dado. Utilizando brazos robóticos y componentes informáticos dentro de la ranura, un sistema informático auto-reparable puede ser creado.
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862733430P | 2018-09-19 | 2018-09-19 | |
US201862746254P | 2018-10-16 | 2018-10-16 | |
US16/165,594 US11102912B2 (en) | 2018-09-19 | 2018-10-19 | Liquid immersion cooling platform |
US201862768633P | 2018-11-16 | 2018-11-16 | |
US16/283,181 US10477726B1 (en) | 2018-09-19 | 2019-02-22 | Liquid immersion cooling platform |
US201962815682P | 2019-03-08 | 2019-03-08 | |
US201962875222P | 2019-07-17 | 2019-07-17 | |
US201962897457P | 2019-09-09 | 2019-09-09 | |
PCT/US2019/051924 WO2020061305A1 (en) | 2018-09-19 | 2019-09-19 | Liquid immersion cooling platform |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2021003178A true MX2021003178A (es) | 2021-08-11 |
Family
ID=69887800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2021003178A MX2021003178A (es) | 2018-09-19 | 2019-09-19 | Plataforma de enfriamiento por inmersion liquida. |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP3854188A4 (es) |
JP (1) | JP2022501728A (es) |
KR (2) | KR20230106730A (es) |
CN (1) | CN113056964B (es) |
AU (1) | AU2019343158A1 (es) |
CA (1) | CA3113646A1 (es) |
MX (1) | MX2021003178A (es) |
TW (1) | TW202020385A (es) |
WO (1) | WO2020061305A1 (es) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI807318B (zh) | 2021-05-07 | 2023-07-01 | 緯穎科技服務股份有限公司 | 具有浸沒式冷卻系統的電子設備及其操作方法 |
TWI804864B (zh) * | 2021-05-10 | 2023-06-11 | 新加坡商鴻運科股份有限公司 | 浸沒式冷卻槽、浸沒式冷卻裝置及浸沒式液冷設備 |
TWI796929B (zh) * | 2021-07-21 | 2023-03-21 | 台達電子工業股份有限公司 | 浸入式冷卻系統 |
US11818864B2 (en) * | 2021-08-16 | 2023-11-14 | Quanta Computer Inc. | Tiered immersion cooling system |
CN114594837B (zh) * | 2022-03-14 | 2024-04-16 | 英业达科技有限公司 | 一种cpu液冷板 |
TWI795259B (zh) * | 2022-04-01 | 2023-03-01 | 英業達股份有限公司 | 浸沒式相變機台之運作參數設定方法 |
TWI816445B (zh) * | 2022-04-07 | 2023-09-21 | 緯穎科技服務股份有限公司 | 密封機構及其兩相式水冷散熱裝置 |
CN117009154A (zh) * | 2022-04-28 | 2023-11-07 | 富联精密电子(天津)有限公司 | 验证方法、开发板、验证系统及计算机可读存储介质 |
CN117013685A (zh) * | 2022-04-28 | 2023-11-07 | 富联精密电子(天津)有限公司 | 浸没式液冷柜的管理板的管理方法及其设备 |
TWI808780B (zh) * | 2022-06-08 | 2023-07-11 | 英業達股份有限公司 | 機櫃液冷系統 |
CH718486A2 (it) * | 2022-07-15 | 2022-11-15 | Associazione The World Peace Factory | Macchina per l'estrazione di criptovalute. |
CN117794201B (zh) * | 2024-02-26 | 2024-05-10 | 西安晶世电子科技有限公司 | 一种用于双转换在线式ups散热装置 |
Family Cites Families (33)
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CA1098187A (en) * | 1977-02-23 | 1981-03-24 | George F. Mitchell, Jr. | Vaporization cooled and insulated electrical inductive apparatus |
US5143096A (en) * | 1991-02-04 | 1992-09-01 | The Boc Group, Inc. | Method and apparatus for expanding cellular materials |
JP2596255B2 (ja) * | 1991-05-15 | 1997-04-02 | 日本電気株式会社 | 液体冷媒循環システム |
US5343885A (en) * | 1992-03-04 | 1994-09-06 | Baxter International Inc. | Vacuum air lock for a closed perimeter solvent conservation system |
US6330152B1 (en) * | 2000-06-08 | 2001-12-11 | Lockheed Corp | Apparatus facilitating use of cots electronics in harsh environments |
US7908874B2 (en) * | 2006-05-02 | 2011-03-22 | Raytheon Company | Method and apparatus for cooling electronics with a coolant at a subambient pressure |
US7403392B2 (en) * | 2006-05-16 | 2008-07-22 | Hardcore Computer, Inc. | Liquid submersion cooling system |
CN101073727B (zh) * | 2006-05-19 | 2010-09-29 | 黄樟焱 | 带有超声波清洗装置的微孔陶瓷过滤器 |
US9854715B2 (en) * | 2011-06-27 | 2017-12-26 | Ebullient, Inc. | Flexible two-phase cooling system |
US8867209B2 (en) * | 2011-07-21 | 2014-10-21 | International Business Machines Corporation | Two-phase, water-based immersion-cooling apparatus with passive deionization |
CN104115578A (zh) * | 2011-08-05 | 2014-10-22 | 绿色革命冷却股份有限公司 | 流体浸没式冷却系统的硬驱动器散热 |
US9451726B2 (en) * | 2012-09-25 | 2016-09-20 | Liquidcool Solutions, Inc. | Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices |
US9231491B2 (en) * | 2012-12-07 | 2016-01-05 | Stored Energy Systems | Cabinet-based DC power systems |
US9464854B2 (en) * | 2013-02-01 | 2016-10-11 | Dell Products, Lp | Techniques for controlling vapor pressure in an immersion cooling tank |
US9921622B2 (en) * | 2013-02-01 | 2018-03-20 | Dell Products, L.P. | Stand alone immersion tank data center with contained cooling |
US9049800B2 (en) * | 2013-02-01 | 2015-06-02 | Dell Products L.P. | Immersion server, immersion server drawer, and rack-mountable immersion server drawer-based cabinet |
US9335802B2 (en) * | 2013-02-01 | 2016-05-10 | Dell Products, L.P. | System for cooling hard disk drives using vapor momentum driven by boiling of dielectric liquid |
US11408681B2 (en) * | 2013-03-15 | 2022-08-09 | Nortek Air Solations Canada, Iac. | Evaporative cooling system with liquid-to-air membrane energy exchanger |
US9408332B2 (en) * | 2014-06-24 | 2016-08-02 | David Lane Smith | System and method for fluid cooling of electronic devices installed in a sealed enclosure |
WO2017040217A1 (en) * | 2015-08-28 | 2017-03-09 | Miyoshi Mark | Immersion cooling system with low fluid loss |
GB2542844B (en) * | 2015-10-01 | 2021-06-16 | Iceotope Group Ltd | An immersion cooling system |
US10128006B2 (en) * | 2015-10-12 | 2018-11-13 | Westinghouse Electric Company Llc | Cryogenic system for spent nuclear fuel pool emergency cooling and safety system |
WO2017070867A1 (zh) * | 2015-10-28 | 2017-05-04 | 曙光信息产业(北京)有限公司 | 服务器的冷却系统及装置 |
US10217556B2 (en) * | 2015-11-03 | 2019-02-26 | Carte International Inc. | Fault-tolerant power transformer design and method of fabrication |
JP6690314B2 (ja) * | 2016-03-10 | 2020-04-28 | 富士通株式会社 | 電子機器 |
JP2017163065A (ja) * | 2016-03-11 | 2017-09-14 | 富士通株式会社 | 電子機器 |
GB2549946A (en) * | 2016-05-03 | 2017-11-08 | Bitfury Group Ltd | Immersion cooling |
US10034407B2 (en) * | 2016-07-22 | 2018-07-24 | Intel Corporation | Storage sled for a data center |
US10405459B2 (en) * | 2016-08-04 | 2019-09-03 | Hamilton Sundstrand Corporation | Actuated immersion cooled electronic assemblies |
CN106255387B (zh) * | 2016-08-31 | 2019-05-03 | 深圳绿色云图科技有限公司 | 散热系统及数据中心 |
IL269230B2 (en) * | 2017-03-09 | 2023-09-01 | Zuta Car Ltd | Thermal regulation systems and methods |
JP7070102B2 (ja) * | 2018-03-09 | 2022-05-18 | 富士通株式会社 | 電子装置 |
JP7052558B2 (ja) * | 2018-05-22 | 2022-04-12 | 富士通株式会社 | 電子装置及びダミーユニット |
-
2019
- 2019-09-19 TW TW108133797A patent/TW202020385A/zh unknown
- 2019-09-19 MX MX2021003178A patent/MX2021003178A/es unknown
- 2019-09-19 KR KR1020237022475A patent/KR20230106730A/ko active Search and Examination
- 2019-09-19 CA CA3113646A patent/CA3113646A1/en active Pending
- 2019-09-19 WO PCT/US2019/051924 patent/WO2020061305A1/en unknown
- 2019-09-19 CN CN201980076151.6A patent/CN113056964B/zh active Active
- 2019-09-19 AU AU2019343158A patent/AU2019343158A1/en active Pending
- 2019-09-19 JP JP2021516354A patent/JP2022501728A/ja active Pending
- 2019-09-19 KR KR1020217011338A patent/KR102552473B1/ko active IP Right Grant
- 2019-09-19 EP EP19863896.7A patent/EP3854188A4/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2022501728A (ja) | 2022-01-06 |
CA3113646A1 (en) | 2020-03-26 |
WO2020061305A1 (en) | 2020-03-26 |
KR20230106730A (ko) | 2023-07-13 |
CN113056964B (zh) | 2024-04-12 |
AU2019343158A1 (en) | 2021-05-13 |
EP3854188A1 (en) | 2021-07-28 |
TW202020385A (zh) | 2020-06-01 |
KR20210065967A (ko) | 2021-06-04 |
EP3854188A4 (en) | 2022-06-22 |
CN113056964A (zh) | 2021-06-29 |
KR102552473B1 (ko) | 2023-07-11 |
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