MX2022010488A - Métodos y aparatos de prueba que utilizan servidores simulados. - Google Patents

Métodos y aparatos de prueba que utilizan servidores simulados.

Info

Publication number
MX2022010488A
MX2022010488A MX2022010488A MX2022010488A MX2022010488A MX 2022010488 A MX2022010488 A MX 2022010488A MX 2022010488 A MX2022010488 A MX 2022010488A MX 2022010488 A MX2022010488 A MX 2022010488A MX 2022010488 A MX2022010488 A MX 2022010488A
Authority
MX
Mexico
Prior art keywords
testing methods
phase
systems
apparatuses
immersion cooling
Prior art date
Application number
MX2022010488A
Other languages
English (en)
Inventor
John David Enright
Jacob Mertel
Original Assignee
Tmgcore Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tmgcore Inc filed Critical Tmgcore Inc
Publication of MX2022010488A publication Critical patent/MX2022010488A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Tests Of Circuit Breakers, Generators, And Electric Motors (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)

Abstract

La presente solicitud pertenece a métodos y aparatos de prueba útiles en sistemas de enfriamiento por inmersión en líquido de dos fases. Tales sistemas enfrían el calor que generan componentes de computadora, lo cual provoca que un fluido dieléctrico en su fase líquida se vaporice. Después, el vapor dieléctrico se condensa en una fase líquida y se utiliza para enfriar los componentes de computadora. Utilizando los métodos y aparatos de prueba en el presente documento, uno puede diseñar y probar componentes y sistemas más eficientes. Más específicamente, dichos uno o más elementos de calentamiento son tanto pasivos como inteligentes. Se pueden utilizar para imitar la carga de energía de un servidor que se utiliza en la prueba de carga del enfriamiento por inmersión en líquido de dos fases de modo que no se requieran servidores reales para probar varios aspectos de las unidades de enfriamiento por inmersión en líquido de dos fases.
MX2022010488A 2020-02-25 2021-02-25 Métodos y aparatos de prueba que utilizan servidores simulados. MX2022010488A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202062981098P 2020-02-25 2020-02-25
US17/136,113 US11064634B1 (en) 2020-02-25 2020-12-29 Testing methods and apparatuses using simulated servers
PCT/US2021/019668 WO2021173833A1 (en) 2020-02-25 2021-02-25 Testing methods and apparatuses using simulated servers

Publications (1)

Publication Number Publication Date
MX2022010488A true MX2022010488A (es) 2023-01-05

Family

ID=76764434

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2022010488A MX2022010488A (es) 2020-02-25 2021-02-25 Métodos y aparatos de prueba que utilizan servidores simulados.

Country Status (10)

Country Link
US (2) US11064634B1 (es)
EP (1) EP4111289A4 (es)
JP (1) JP2023515814A (es)
KR (1) KR20230092822A (es)
CN (1) CN115668098A (es)
AU (1) AU2021226571A1 (es)
CA (1) CA3169502A1 (es)
MX (1) MX2022010488A (es)
TW (1) TW202147973A (es)
WO (1) WO2021173833A1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11528827B2 (en) * 2020-01-10 2022-12-13 Liquidstack Holding B.V. Method and system for in-situ measuring of a heat transfer fluid in a device for immersion cooling and device for immersion cooling
CN113766804B (zh) * 2021-08-12 2023-06-20 中国电子科技集团公司电子科学研究院 一种机载沉浸式电子散热测试模块

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7301468B2 (en) * 2004-08-03 2007-11-27 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for real time monitoring of an electric furnace heating coil
EP2122260A2 (en) * 2007-02-20 2009-11-25 Thermoceramix, Inc. Gas heating apparatus and methods
US7957144B2 (en) * 2007-03-16 2011-06-07 International Business Machines Corporation Heat exchange system for blade server systems and method
JP5722710B2 (ja) * 2011-06-16 2015-05-27 株式会社アドバンテスト 基板組立体及び電子部品試験装置
GB2542844B (en) * 2015-10-01 2021-06-16 Iceotope Group Ltd An immersion cooling system
US10238010B2 (en) * 2015-12-21 2019-03-19 Dell Products, L.P. Rackmount appliance for server and rack liquid management and water control policy execution
US11102912B2 (en) * 2018-09-19 2021-08-24 TMGCore, LLC Liquid immersion cooling platform

Also Published As

Publication number Publication date
CA3169502A1 (en) 2021-09-02
US11064634B1 (en) 2021-07-13
KR20230092822A (ko) 2023-06-26
TW202147973A (zh) 2021-12-16
WO2021173833A1 (en) 2021-09-02
US20210337704A1 (en) 2021-10-28
CN115668098A (zh) 2023-01-31
US11224144B2 (en) 2022-01-11
AU2021226571A1 (en) 2022-10-13
JP2023515814A (ja) 2023-04-14
EP4111289A4 (en) 2024-04-03
EP4111289A1 (en) 2023-01-04

Similar Documents

Publication Publication Date Title
MX2022010488A (es) Métodos y aparatos de prueba que utilizan servidores simulados.
Domairry et al. Squeezing Cu–water nanofluid flow analysis between parallel plates by DTM-Padé Method
Gandomkar et al. Local thermal non-equilibrium in porous media with heat conduction
Howatson Engineering tables and data
MX2021003178A (es) Plataforma de enfriamiento por inmersion liquida.
MX2021003176A (es) Plataforma de enfriamiento por inmersion liquida.
Zhu et al. Simulation of steady-state operation of an ejector-assisted loop heat pipe with a flat evaporator for application in electronic cooling
Baş et al. Novel approach to transient thermal stress in an annular fin
Ghaffari et al. Two-phase closed-loop thermosyphon filled with a dielectric liquid for electronics cooling applications
Ebenezer et al. Study and analysis of the effect of harmonics on the hot spot temperature of a distribution transformer using finite-volume method
Theuri et al. Thermodynamic analysis of variable viscosity MHD unsteady generalized Couette flow with permeable walls
Thompson et al. Ultrahigh thermal conductivity of three-dimensional flat-plate oscillating heat pipes for electromagnetic launcher cooling
Ryms et al. Adapting the pinch point analysis to improve the ORC design process
Baïri et al. Thermal design of a spherical electronic device naturally cooled by means of water–copper nanofluid saturated porous media
Austbø et al. Optimal distribution of temperature driving forces in low‐temperature heat transfer
Wang et al. Numerical modeling of quench cooling using Eulerian two-fluid method
Septiadi et al. Thermal resistance analysis of central processing unit cooling system based on cascade straight heat pipe
Sakhno et al. Using the finite element method for calculating transformers for resistance welding machines
Yang et al. Effect of non-condensable gas on a collapsing cavitation bubble near solid wall investigated by multicomponent thermal MRT-LBM
Amalfi et al. The future of data center cooling: Passive two-phase cooling
Parent et al. Boiling and Condensation of a Dielectric Liquid in a Closed Enclosure for Electronics Cooling Applications
Ponomarev et al. Experimental modelling of evaporation and boiling processes in a two-phase thermosyphon
Catano et al. Experimental identification of evaporator dynamics for vapor compression refrigeration cycle during phase transition
Han et al. Buoyancy-driven convection heat transfer of copper–water nanofluid in a square enclosure under the different periodic oscillating boundary temperature waves
CN206807971U (zh) 一种节能系统