JP2019516195A - 液浸冷却 - Google Patents
液浸冷却 Download PDFInfo
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- JP2019516195A JP2019516195A JP2018558298A JP2018558298A JP2019516195A JP 2019516195 A JP2019516195 A JP 2019516195A JP 2018558298 A JP2018558298 A JP 2018558298A JP 2018558298 A JP2018558298 A JP 2018558298A JP 2019516195 A JP2019516195 A JP 2019516195A
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- heat transfer
- transfer fluid
- vapor
- tank
- electronic device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Glass Compositions (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
Description
本出願は、2016年5月3日に出願された英国特許出願第1607662.2号の利益を主張するものであり、当該出願の全体が参照により本明細書に組み込まれるものとする。
Claims (14)
- 電子装置を含むシステムを液浸冷却する方法であって、
液体状態の伝熱流体を保持し且つ液体伝熱流体の表面の上に凝縮器に接続された蒸気空間を含む圧力密閉タンクに電子装置を入れることと、
前記電子装置を動作させて熱を発生させ、前記伝熱流体の一部を蒸発させて伝熱流体蒸気を前記凝縮器に流入させることと、
前記伝熱流体蒸気を前記凝縮器で凝縮して伝熱流体凝縮物を生成することと、
前記伝熱流体凝縮物を前記タンクに戻すことと、
前記電子装置による電力消費を増加させて発生する熱を増加させ、前記伝熱流体蒸気の上昇した圧力を生じることと
を含み、前記上昇した圧力は前記凝縮器の効率を向上させて前記システムを平衡状態にする、方法。 - 前記電子装置による電力消費を低減して発生する熱を減少させ、前記伝熱流体蒸気の圧力の低下を引き起こすことをさらに含み、低い圧力は前記伝熱流体の沸点を低下させ、前記システムを平衡に戻す、請求項1に記載の方法。
- 前記低減された電力消費は、前記タンクの内部にある程度の減圧を生じさせる、請求項2に記載の方法。
- 前記電子装置による電力消費は実質的にゼロまで低減され、前記タンク内の前記伝熱流体蒸気の圧力は約0.4バール(絶対)まで低減される、請求項3に記載の方法。
- 前記凝縮物を前記タンクに戻す前に、前記凝縮物を濾過して水分および金属粒子の少なくとも一方を除去することをさらに含む、請求項1に記載の方法。
- 前記伝熱流体が誘電性流体を含む、請求項1に記載の方法。
- 前記タンク内の凝縮管によって、前記伝熱流体蒸気の一部を凝縮することをさらに含む、請求項1に記載の方法。
- 乾燥剤によって、前記タンクの前記蒸気空間内の空気から水分を除去することをさらに含む、請求項1に記載の方法。
- 電子装置の液浸冷却のための装置であって、
前記電子装置を浸すことができる液体形態の伝熱流体を保持し且つ液体伝熱流体の表面の上に蒸気空間を含む圧力密閉タンクと、
伝熱流体蒸気を受け入れるための前記蒸気空間に接続された入口と、密閉可能な蒸気出口と、凝縮物出口とを有する凝縮器と、
それを通って凝縮した伝熱流体が前記凝縮物出口から前記タンクに戻ることができる凝縮物戻りラインと
を備える装置。 - 水分および金属粒子の少なくとも一方を除去するための前記凝縮物戻りライン内のフィルターをさらに備える、請求項9に記載の装置。
- 前記伝熱流体蒸気を凝縮するための前記タンク内の手段をさらに備える、請求項9に記載の装置。
- 前記凝縮するための手段は、凝縮管群を含む、請求項11に記載の装置。
- 前記タンクの前記蒸気空間内の空気から水分を除去するのを補助するための乾燥剤をさらに含む、請求項9に記載の装置。
- 電子装置の液浸冷却を開始する方法であって、
前記方法は、液体形態の伝熱流体を保持し且つ液体伝熱流体の表面の上に蒸気空間を含む圧力密閉タンク内に前記電子装置を浸すことを含み、前記蒸気空間は凝縮器に接続され、前記凝縮器は前記タンクの上方に配置され、蒸気出口を密閉するように動作可能な弁を備えた蒸気出口を含み、
前記方法は、
前記電子装置の動作を開始して熱を発生させ、前記伝熱流体の一部を蒸発させ、前記蒸気空間内で伝熱流体蒸気を生成することと、
前記弁を開け、実質的に全ての空気が前記蒸気空間から追い出されるまで、生成された前記伝熱流体蒸気が空気を前記蒸気空間から前記凝縮器へと追いやり、前記蒸気出口から追い出すことを可能にすることと、
前記弁を閉じることと、
前記電子装置の動作を継続して熱を発生させ、前記伝熱流体蒸気を生成することと、
前記伝熱流体蒸気を前記凝縮器で凝縮して伝熱流体凝縮物を生成することと、
前記伝熱流体凝縮物をタンクに戻すことと
を含む方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1607662.2 | 2016-05-03 | ||
GB1607662.2A GB2549946A (en) | 2016-05-03 | 2016-05-03 | Immersion cooling |
PCT/IB2017/000711 WO2017191508A1 (en) | 2016-05-03 | 2017-05-02 | Immersion cooling |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2019516195A true JP2019516195A (ja) | 2019-06-13 |
Family
ID=56234264
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018558298A Pending JP2019516195A (ja) | 2016-05-03 | 2017-05-02 | 液浸冷却 |
Country Status (13)
Country | Link |
---|---|
US (2) | US10206307B2 (ja) |
EP (1) | EP3453235B1 (ja) |
JP (1) | JP2019516195A (ja) |
KR (2) | KR102425144B1 (ja) |
CN (1) | CN108141991B (ja) |
CA (1) | CA3022767A1 (ja) |
DK (1) | DK3453235T3 (ja) |
ES (1) | ES2880481T3 (ja) |
GB (1) | GB2549946A (ja) |
IL (2) | IL293689A (ja) |
RU (1) | RU2746576C2 (ja) |
SG (2) | SG11201809682UA (ja) |
WO (1) | WO2017191508A1 (ja) |
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2017
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- 2017-05-02 IL IL293689A patent/IL293689A/en unknown
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- 2017-05-02 CN CN201780002638.0A patent/CN108141991B/zh active Active
- 2017-05-02 EP EP17734451.2A patent/EP3453235B1/en active Active
- 2017-05-02 KR KR1020187035010A patent/KR102425144B1/ko active IP Right Grant
- 2017-05-02 KR KR1020227025171A patent/KR20220108193A/ko not_active Application Discontinuation
- 2017-05-02 IL IL262645A patent/IL262645B/en unknown
- 2017-05-02 SG SG10202010879WA patent/SG10202010879WA/en unknown
- 2017-05-02 US US15/584,670 patent/US10206307B2/en active Active
- 2017-05-02 CA CA3022767A patent/CA3022767A1/en active Pending
- 2017-05-02 JP JP2018558298A patent/JP2019516195A/ja active Pending
- 2017-05-02 ES ES17734451T patent/ES2880481T3/es active Active
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- 2017-05-02 RU RU2018142335A patent/RU2746576C2/ru active
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2019
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Also Published As
Publication number | Publication date |
---|---|
KR20220108193A (ko) | 2022-08-02 |
CA3022767A1 (en) | 2017-11-09 |
IL262645A (en) | 2018-12-31 |
US10206307B2 (en) | 2019-02-12 |
SG11201809682UA (en) | 2018-11-29 |
EP3453235A1 (en) | 2019-03-13 |
IL262645B (en) | 2022-07-01 |
SG10202010879WA (en) | 2020-12-30 |
DK3453235T3 (da) | 2021-07-26 |
US20190223316A1 (en) | 2019-07-18 |
EP3453235B1 (en) | 2021-04-21 |
CN108141991A (zh) | 2018-06-08 |
GB2549946A (en) | 2017-11-08 |
KR20190019928A (ko) | 2019-02-27 |
CN108141991B (zh) | 2020-11-06 |
WO2017191508A1 (en) | 2017-11-09 |
RU2018142335A (ru) | 2020-06-04 |
ES2880481T3 (es) | 2021-11-24 |
RU2746576C2 (ru) | 2021-04-15 |
US20170325355A1 (en) | 2017-11-09 |
KR102425144B1 (ko) | 2022-07-29 |
GB201607662D0 (en) | 2016-06-15 |
RU2018142335A3 (ja) | 2020-10-02 |
IL293689A (en) | 2022-08-01 |
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