WO2017070867A1 - 服务器的冷却系统及装置 - Google Patents

服务器的冷却系统及装置 Download PDF

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Publication number
WO2017070867A1
WO2017070867A1 PCT/CN2015/093102 CN2015093102W WO2017070867A1 WO 2017070867 A1 WO2017070867 A1 WO 2017070867A1 CN 2015093102 W CN2015093102 W CN 2015093102W WO 2017070867 A1 WO2017070867 A1 WO 2017070867A1
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WIPO (PCT)
Prior art keywords
module
housing
door
cooling liquid
buffer chamber
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PCT/CN2015/093102
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English (en)
French (fr)
Inventor
沈卫东
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曙光信息产业(北京)有限公司
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Application filed by 曙光信息产业(北京)有限公司 filed Critical 曙光信息产业(北京)有限公司
Priority to US15/771,643 priority Critical patent/US10757839B2/en
Priority to PCT/CN2015/093102 priority patent/WO2017070867A1/zh
Publication of WO2017070867A1 publication Critical patent/WO2017070867A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Definitions

  • the present invention relates to the field of servers, and in particular to a cooling system and apparatus for a server.
  • the current server field basically uses an air-cooling system to cool the heating elements.
  • air cooling in large data centers, relying solely on air cooling is insufficient to meet the heat dissipation requirements of high heat flux servers.
  • the heat is as high as 3,500 times. Therefore, the water cooling system has been put into the market from the early stage of its introduction.
  • Server giants such as Hewlett-Packard and IBM, as well as other companies focused on data center technology, have introduced water-cooling products.
  • An alternative is to use an insulating refrigerant to cool the server, taking advantage of the latent heat of vaporization while the refrigerant is boiling, according to the principle of phase-conversion heat. Since the latent heat of vaporization of the liquid is many times larger than that of the heat, the cooling effect of the phase change heat is superior to that of the water-cooled server. However, in the case of such a liquid-cooled server, if the sealing effect of the cooling device is poor, the refrigerant vapor is easily leaked and lost, thereby causing loss of the refrigerant and a decrease in the cooling capacity of the liquid cooling system.
  • the maintenance personnel must open the upper cover and take out the server immersed in the refrigerant to start maintenance.
  • the refrigerant tank is opened to directly contact the refrigerant with the atmosphere. This process not only causes the volatilization and waste of the refrigerant, but also increases the concentration of chemical reagents in the confined space, even if the refrigerant is for the environment and the human body. Harmless, it will also cause users to worry.
  • the present invention provides a cooling system and device for a server, which can automatically complete the removal and insertion of the heating element, avoid human labor, and prevent gas leakage after the cooling liquid is vaporized. And it has a buffer tank structure, which can recover refrigerant vapor, thereby improving the safety factor during operation, reducing the loss of refrigerant and saving cost.
  • a cooling system for a server is provided.
  • the system includes:
  • a condensing module located in the casing, wherein the condensing module contains a cooling material for cooling the vaporized cooling liquid;
  • a robot arm located in the housing for holding a heat generating component immersed in the cooling liquid, and the mechanical arm is configured to move in a three-dimensional space;
  • the buffer chamber is located in the housing and is disposed above the liquid level of the cooling liquid.
  • the opposite side of the buffer chamber is provided with a first door and a second door.
  • the first door is located on the outer surface of the casing, and the second door is Located in the housing; and,
  • a transfer module is disposed in the buffer chamber, and the transfer module is configured to transfer the heat generating component placed in the buffer chamber;
  • the control module is located outside the housing and is electrically connected to the robot arm and the buffer chamber for controlling the buffer chamber and the mechanical arm.
  • the control module includes an image display module, and the image display module is configured to display image information inside the housing.
  • the first door and the second door are not opened simultaneously.
  • the transfer module is configured to transfer the heating elements placed in the buffer bin in both directions.
  • the transmitting module comprises any one of the following:
  • the buffer bin further comprises:
  • a recovery module for recovering the cooling liquid in the buffer chamber.
  • control module is configured to control opening and closing of the first and second door of the buffer bin; and the control module is further configured to control the conveying direction of the transfer module.
  • the image display module is further for providing a user operation interface.
  • the cooling system further comprises: an image acquisition module electrically connected to the control module for acquiring image information in the housing.
  • a cooling device for a server is provided.
  • the device includes:
  • a condensing module located in the housing, and a chilling material contained in the condensing module
  • a robot arm located in the housing, the arm being configured to move in a three-dimensional space
  • the buffer chamber is located in the housing and is disposed above the liquid level of the cooling liquid.
  • the opposite side of the buffer chamber is provided with a first door and a second door.
  • the first door is located on the outer surface of the casing, and the second door is Located in the housing, the transfer chamber is provided with a transfer module;
  • the control module is located outside the housing and is electrically connected to the robot arm and the buffer chamber, wherein the control module includes an image display module.
  • the refrigerating material is used for cooling the chilled liquid after the endothermic gasification.
  • the first door and the second door are not opened simultaneously.
  • the transfer module is configured to transfer the heating elements placed in the buffer bin in both directions.
  • the transmitting module comprises any one of the following:
  • the buffer bin further comprises:
  • a recovery module for recovering the cooling liquid in the buffer chamber.
  • control module is configured to control opening and closing of the first and second door of the buffer bin; and the control module is further configured to control the conveying direction of the transfer module.
  • the device further comprises:
  • the image acquisition module is electrically connected to the control module for acquiring image information in the housing.
  • the image display module is for displaying image information.
  • FIG. 1 is a schematic diagram of a cooling system of a server according to an embodiment of the present invention.
  • the disclosed cooling system includes a sealed housing containing a cooling liquid, and a condensing module for cooling the vaporized cooling liquid, and a robotic arm for operating the heating element. Also included are buffer tanks for recovering and isolating the cooling liquid vapor, and control modules for controlling the robot arm and the buffer tank.
  • the cooling system 100 is an immersion cooling system, that is, the inside of the casing 101 of the cooling system 100 is filled with a cooling liquid, and the heat generating element 104 is immersed in the cooling liquid.
  • the number of heat generating elements 104 may be plural, and the number thereof may be adjusted according to actual needs and the internal space of the cooling system 100.
  • a condensing module 106 is disposed above the liquid level of the cooling liquid, the condensing module 106 is provided with a refrigerating material, and the condensing module 106 may be located at the inner side wall of the casing 101, or the upper wall, and any other operation that does not affect the mechanical arm 107 The location of the space.
  • the condensing module 106 can be a condensing coil into which cooling water can be placed.
  • the heat generating component 104 is exemplified by a server motherboard.
  • a plurality of server motherboards are immersed in the cooling liquid.
  • the CPU and other components on the motherboard will generate heat, and the generated heat will cause the cooling liquid to boil, generating bubbles and becoming refrigerant vapor.
  • the condensation module 106 since the condensing module 106 contains the refrigerating material, the condensing module can cool the vaporized cooling liquid, so that the steam is cooled on the outer surface of the condensing module and becomes droplets again. The droplets are dropped back into the cooling liquid by gravity, thereby completing the circulation of the entire cooling system.
  • the buffer chamber 102 is disposed on the upper left of the interior of the housing 101. Angle, in other embodiments, the buffer bin 102 can be located inside the housing 101 and located anywhere above the cooling liquid. In one embodiment, when the buffer chamber 102 is disposed on the side wall of the casing 101, the buffer chamber 102 is provided with two door doors on opposite sides, one door is disposed inside the casing 101, and one door is disposed outside the casing 101. surface. In other embodiments, the buffer chamber 102 may also be disposed on the upper wall of the casing 101, which is still provided with two warehouse doors, one of which is located on the outer surface of the casing 101 and one of which is located on either side of the other three sides of the buffer tank 102. Set on top.
  • the two bin doors of the buffer bin are not opened at the same time.
  • a transfer device (not shown) may also be provided in the buffer bin 102, which may include, but is not limited to, a conveyor belt, a tray.
  • the transmitting device has a dual direction transmission function.
  • the cooling system 100 has a robotic arm 107 that can be accurately positioned to operate at any point in the three dimensional space.
  • the robot arm 107 can be used to hold a heat generating component immersed in a cooling liquid and operate the heat generating component.
  • the robotic arm 107 can insert the server motherboard into the power source and the network module 105 to complete the docking of the server network and the power module.
  • the robotic arm 107 can also be used to automatically remove the failed server in the event of a server failure.
  • both the robotic arm 107 and the buffer bin 102 are controlled by a control module (not shown).
  • the control module has a display screen 103, and the display screen 103 can be disposed on the front panel of the housing 101, and an operator can issue an operation command to the control module through the display screen 103.
  • Operation instructions include but are not limited to: unplugging and inserting the server board.
  • the display screen 103 can also be used to display internal image information of the casing 101 acquired by an image acquisition module (not shown).
  • the operator can select the motherboard information to be extracted and the corresponding operation through the display screen 103, wherein the motherboard information can be the motherboard.
  • the location number, etc. can determine the location of the faulty motherboard location.
  • the control module will initiate an automated procedure, control the robot arm 107 to position, pull out the failed server, and move the failed server above the level of the cooling liquid.
  • the robotic arm 107 can also include a robot that can be used to unplug the motherboard in the server from the server.
  • the robot arm 107 causes the server to swing horizontally to the left and right, so that the residual cooling liquid on the main board is dripped back into the cooling liquid to recover the cooling liquid, thereby avoiding waste of the cooling liquid. Then, the robot arm 107 flips the server board to change the main board from the vertical direction to the horizontal direction and feeds it into the buffer bin 102.
  • control The module controls the buffer chamber 102 to open the right door in the interior of the housing 101, and the right door is well sealed. After the robot arm 107 feeds the main board horizontally into the buffer bin 102, the right door is closed.
  • the buffer chamber may further have a recovery device, and the recovery device may be a compressor, and the recovery device may be used for recovering refrigerant vapor or refrigerant liquid in the buffer chamber 102. . Subsequently, the left side door of the buffer bin 102 is opened, and the server board is transported out by the transfer device, and the operator can take out the main board for maintenance.
  • the robotic arm 107 and the buffer bin 102 are still controlled by the control module.
  • the operator can issue an operation instruction for inserting the server to the control module through the display screen 103.
  • the control module will control the buffer bin 102 to open the left door, and if the transfer module in the buffer bin is a tray, the tray will pop up as the left door is opened.
  • the server board is placed on the transport module and sent to the buffer bin 102.
  • the control module will control the buffer bin 102 to close the left door, then open the right door, and control the robot arm 107 to send the main board to the designated position, and plug it with the network module and the power module to complete the installation of the motherboard. process.
  • the present application provides a cooling system for a server.
  • the cooling system comprises: a housing having a cooling liquid therein; a condensation module located in the housing; a cooling material contained in the condensation module for cooling the vaporized cooling liquid; and a mechanical arm located in the housing For clamping a heating element immersed in a cooling liquid, and the mechanical arm is configured to move in a three-dimensional space;
  • the buffer chamber is located in the housing and is disposed above the liquid level of the cooling liquid, opposite sides of the buffer chamber Configuring a first door and a second door, the first door is located on the outer surface of the casing, and the second door is located in the casing;
  • the transfer chamber is provided with a transfer module, and the transfer module is used for transfer to the buffer a heating element;
  • a control module located outside the housing, electrically connected to the robot arm and the buffer chamber for controlling the buffer chamber and the robot arm; wherein the control module includes an image display module, and the image display module is configured to display image information inside the housing .
  • the present application also provides a cooling device for a server.
  • the device comprises: a housing having a cooling liquid therein; a condensation module located in the housing, the cooling module is provided with a cooling material; the mechanical arm is located in the housing, and the mechanical arm is configured to move in a three-dimensional space;
  • the buffer chamber is located in the housing and is disposed above the liquid level of the cooling liquid.
  • the opposite side of the buffer chamber is provided with a first door and a second door.
  • the first door is located on the outer surface of the casing, and the second door is Located in the housing, the transfer chamber is provided with a transfer module; the control module is located outside the housing, and is electrically connected with the mechanical arm and the buffer chamber, wherein
  • the module includes an image display module.
  • the mechanical arm and the control module can automatically complete the removal and insertion of the heating element, thereby avoiding labor.
  • the gas leakage after the cooling liquid is vaporized can be effectively prevented, thereby improving the safety factor during the operation.
  • the buffer tank can also recover the vapor of the cooling liquid and the cooling liquid, avoiding the waste of the cooling liquid and reducing the loss of the cooling liquid.
  • the display provided by the control module provides users with a friendly interface, making the operation more flexible, efficient and convenient.

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  • Physics & Mathematics (AREA)
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Abstract

本发明提出了一种服务器冷却系统及装置，该系统包括：纳有冷却液体的壳体，以及冷凝模块、机械臂、缓冲仓和控制模块。本申请的服务器冷却系统能够实现自动化完成发热元件的取出和放入，避免了冷却液体气化后的气体泄漏，提高了操作过程中的安全系数，并且减少了冷却液体的损耗。

Description

服务器的冷却系统及装置 技术领域
本发明涉及服务器领域，具体来说，涉及一种服务器的冷却系统及装置。
背景技术
当前的服务器领域基本上都是应用风冷系统为发热元件进行降温。但是，在大型数据中心中，仅依靠风冷已不足以满足高热流密度服务器对于散热的要求。近来，随着水冷系统的面世，以及其具有的显著的效果，即：它能把冷却剂直接导向热源，而不是像风冷那样间接制冷；以及，和风冷相比，每单位体积所传输的热量即散热效率高达3500倍。因此，水冷系统从面世初期即投入到了市场使用。惠普、IBM等服务器巨头和其他一些专注于数据中心技术的公司都先后推出过水冷散热产品。
目前，市面上的液冷服务器采用的制冷剂大多为水。但是，有杂质的水是一种良导体，会造成电路板短路。虽然目前的水冷散热器厂家保证其产品完全密封无泄漏，但这始终是一种隐患，使得大多数服务器厂家对这一技术望而却步。
一种替代方案是使用绝缘制冷剂来冷却服务器，根据相变换热的原理，利用制冷剂沸腾时的汽化潜热来带走热量。由于液体的汽化潜热比比热要大很多倍，因此相变换热的冷却效果较之水冷服务器更为优越。但是，这种液冷服务器一旦出现冷却装置密封效果不良的情况，制冷剂蒸汽便很容易的泄露和散失，从而造成制冷剂的损失以及液冷系统的冷却能力下降。而且，一旦浸没在缸体中的服务器发生故障需检修时，维护人员必须打开上盖板，拿出浸泡在制冷剂中的服务器才能开始维修。在此过程中，制冷剂槽体敞开，使制冷剂与大气直接接触，这个过程中不但会造成制冷剂的挥发和浪费，也会增加密闭空间内的化学试剂浓度，即使制冷剂对于环境和人体无害，也会令用户产生担忧。
针对相关技术中的问题，目前尚未提出有效的解决方案。
发明内容
针对相关技术中的问题，本发明提出一种服务器的冷却系统及装置，能够实现自动化完成发热元件的取出和放入，避免了人力劳动，能够防止冷却液体气化后的气体泄漏。并且具有缓冲仓结构，能回收制冷剂蒸汽，从而提高了操作过程中的安全系数，并减少了制冷剂的损耗，节省成本。
本发明的技术方案是这样实现的：
根据本发明的一个方面，提供了一种服务器的冷却系统。
该系统包括：
壳体，壳体中纳有冷却液体；
冷凝模块，位于壳体中，冷凝模块中纳有制冷材料，用于冷却气化后的冷却液体；
机械臂，位于壳体中，用于夹持浸没于冷却液体中的发热元件，并且，机械臂被配置为在三维空间内移动；
缓冲仓，位于壳体中，并被设置于冷却液体的液面上方，缓冲仓的相对侧配置有第一仓门和第二仓门，第一仓门位于壳体外表面上，第二仓门位于壳体中；以及，
缓冲仓中配置有传送模块，传送模块用于传送置于缓冲仓中的发热元件；
控制模块，位于壳体外，与机械臂以及缓冲仓电连接，用于控制缓冲仓以及机械臂；其中，控制模块包括图像显示模块，图像显示模块用于显示壳体内部图像信息。
优选地，第一仓门和第二仓门不同步开启。
优选地，传送模块被配置为双方向传送置于缓冲仓中的发热元件。
优选地，传送模块包括以下任意之一：
传送带、托盘。
优选地，缓冲仓进一步包括：
回收模块，用于回收缓冲仓内的冷却液体。
优选地，控制模块用于控制缓冲仓的第一仓门和第二仓门的开启和闭合；以及，控制模块进一步用于控制传送模块的传送方向。
优选地，图像显示模块进一步用于提供用户操作界面。
优选地，该冷却系统还包括：图像获取模块，与控制模块电连接，用于获取壳体内的图像信息。
根据本发明的另一方面，提供了一种服务器的冷却装置。
该装置包括：
壳体，壳体中纳有冷却液体；
冷凝模块，位于壳体中，冷凝模块中纳有制冷材料；
机械臂，位于壳体中，机械臂被配置为在三维空间内移动；
缓冲仓，位于壳体中，并被设置于冷却液体的液面上方，缓冲仓的相对侧配置有第一仓门和第二仓门，第一仓门位于壳体外表面上，第二仓门位于壳体中，缓冲仓中配置有传送模块；
控制模块，位于壳体外，与机械臂以及缓冲仓电连接，其中，控制模块包括图像显示模块。
优选地，制冷材料用于对吸热气化后的冷却液体进行冷却处理。
优选地，第一仓门和第二仓门不同步开启。
优选地，传送模块，用于双方向传送置于缓冲仓中的发热元件。
优选的，传送模块包括以下任意之一：
传送带、托盘。
优选地，缓冲仓进一步包括：
回收模块，用于回收缓冲仓内的冷却液体。
优选地，控制模块用于控制缓冲仓的第一仓门和第二仓门的开启和闭合；以及，控制模块进一步用于控制传送模块的传送方向。
优选地，该装置进一步包括：
图像获取模块，与控制模块电连接，用于获取壳体内的图像信息。
优选地，图像显示模块用于显示图像信息。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的 前提下，还可以根据这些附图获得其他的附图。
图1是根据本发明实施例的服务器的冷却系统的示意图；
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本发明保护的范围。
本发明的目的在于提供用于对服务器进行冷却的冷却系统以及装置。在一些实施例中，所公开的冷却系统包括纳有冷却液体的密封壳体，以及用于对气化后的冷却液体进行冷却处理的冷凝模块，以及用于对发热元件进行操作的机械臂，还包括用于回收以及隔离冷却液体蒸汽的缓冲仓以及控制机械臂和缓冲仓的控制模块。
如图1所示，示出了服务器的冷却系统100的一个优选的实施例。冷却系统100为浸没式冷却系统，即，冷却系统100的壳体101的内部纳有冷却液体，发热元件104浸没于冷却液体中。在本发明的一个优选的实施例中，发热元件104可以为多个，其数量可以根据实际需要以及冷却系统100的内部空间进行调整。冷却液体的液面上方设置有一个冷凝模块106，该冷凝模块106中纳有制冷材料，并且冷凝模块106可以位于壳体101的内部侧壁，或者上壁，以及其他任何不影响机械臂107操作的空间位置。在一个实施例中，冷凝模块106可以为冷凝盘管，冷凝盘管中可以纳有冷却水。
具体的，在一个实施例中，发热元件104以服务器主板为例，在本发明的冷却系统100对服务器主板进行冷却的过程中，多个服务器主板浸没于冷却液体中。在服务器启动后，主板上的CPU与其他元器件会发热，产生的热量使冷却液体沸腾，产生气泡，成为制冷剂蒸汽。蒸汽上升后，遇冷凝模块106，由于冷凝模块106中纳有制冷材料，冷凝模块可对气化后的冷却液体进行冷却，使蒸汽在冷凝模块的外表面上被冷却，重新变为液滴。液滴在重力作用下滴落回冷却液体中，从而完成整个冷却系统的循环。
在本发明的一个优选的实施例中，缓冲仓102设置于壳体101内部的左上 角，在其他实施例中，缓冲仓102可位于壳体101内部，且位于冷却液体上方的任意位置。在一个实施例中，当缓冲仓102设置于壳体101侧壁时，缓冲仓102相对侧设置有两个仓门，一个仓门设置于壳体101内部，一个仓门设置于壳体101外表面。在其他实施例中，缓冲仓102还可以设置于壳体101上壁，其仍设置有两个仓门，一个仓门位于壳体101外表面，一个仓门于缓冲仓102其他三面的任意一面之上设置。特别的，缓冲仓的两个仓门不同时开启。在一个实施例中，缓冲仓102中还可以设置有传送装置(未示出)，传送装置可以包括但是不限于：传送带、托盘。并且，传送装置具有双方向传输功能。在本发明的一个优选的实施例中，冷却系统100具有一可以精确地定位到三维空间上的任意一点进行作业的机械臂107。该机械臂107可用于夹持浸没于冷却液体中的发热元件，并对发热元件进行操作。在一个实施例中，机械臂107可以将服务器主板插入电源以及网络模块105中，完成服务器网络和电源模块的插接。在另一个实施例中，机械臂107还可用于在服务器出现故障的情况下，将故障服务器自动取出。
在一个实施例中，冷却系统100对故障服务器操作期间，机械臂107以及缓冲仓102均由控制模块进行控制(未示出)。控制模块中具有显示屏103，显示屏103可设置于壳体101前面板，操作人员可通过显示屏103对控制模块下达操作指令。操作指令包括但不限于：将服务器主板拔出、插入。此外，显示屏103还可用于显示由图像获取模块(未示出)获取的壳体101的内部图像信息。具体的，在本发明的一个优选的实施例中，在服务器出现故障需要拔出的情况下，操作人员可通过显示屏103选择需要拔出的主板信息以及相应操作，其中，主板信息可以为主板的位置编号等可以确定故障主板位置的信息。随后，控制模块将启动自动程序，控制机械臂107定位，拔出故障服务器，并将该故障服务器移动至冷却液体液面上方。在本发明的一个优选的实施例中，机械臂107还可以包括机械手，机械手可用于将服务器中的主板从服务器中拔出。随后，机械臂107带动服务器水平方向左右摇动，使主板上残留的冷却液体滴回至冷却液体中，以回收冷却液体，从而避免了冷却液体的浪费。然后，机械臂107将服务器主板翻转，使主板从垂直方向变为水平方向，送入缓冲仓102中。
具体的，在一个实施例中，在机械臂107将主板送入缓冲仓102时，控制 模块控制缓冲仓102打开位于壳体101内部的右侧仓门，右侧仓门密封性良好。在机械臂107将主板水平送入缓冲仓102之后，关闭右侧仓门。在本发明的一个可选的实施例中，缓冲仓中还可以具有一回收装置，回收装置可以为压缩机，该回收装置可用于对缓冲仓102内的制冷剂蒸汽或者是制冷剂液体进行回收。随后，打开缓冲仓102的左侧仓门，利用传送装置将服务器主板传送出，操作人员可拿出主板，进行检修。
在一个实施例中，冷却系统100对检修后的服务器或者新的服务器进行插入操作期间，机械臂107以及缓冲仓102仍由控制模块进行控制。操作人员可通过显示屏103对控制模块下达插入服务器的操作指令。控制模块将控制缓冲仓102打开左侧仓门，缓冲仓中的传送模块如果是托盘，该托盘将随着左侧仓门的开启而弹出。将服务器主板放置于传送模块上，送入缓冲仓102。控制模块将控制缓冲仓102关闭左侧仓门，随后打开右侧仓门，并控制机械臂107将主板送到指定位置，并将其与网络模块和电源模块进行插接，从而完成主板的安装过程。
因此，本申请提供一种服务器的冷却系统。该冷却系统包括：壳体，壳体中纳有冷却液体；冷凝模块，位于壳体中，冷凝模块中纳有制冷材料，用于冷却气化后的冷却液体；机械臂，位于壳体中，用于夹持浸泡于冷却液体中的发热元件，并且，机械臂被配置为在三维空间内移动；缓冲仓，位于壳体中，并被设置于冷却液体的液面上方，缓冲仓的相对侧配置有第一仓门和第二仓门，第一仓门位于壳体外表面上，第二仓门位于壳体中；以及，缓冲仓中配置有传送模块，传送模块用于传送置于缓冲仓中的发热元件；控制模块，位于壳体外，与机械臂以及缓冲仓电连接，用于控制缓冲仓以及机械臂；其中，控制模块包括图像显示模块，图像显示模块用于显示壳体内部图像信息。
在另一个实施例中，本申请还提供一种服务器的冷却装置。该装置包括：壳体，壳体中纳有冷却液体；冷凝模块，位于壳体中，冷凝模块中纳有制冷材料；机械臂，位于壳体中，机械臂被配置为在三维空间内移动；缓冲仓，位于壳体中，并被设置于冷却液体的液面上方，缓冲仓的相对侧配置有第一仓门和第二仓门，第一仓门位于壳体外表面上，第二仓门位于壳体中，缓冲仓中配置有传送模块；控制模块，位于壳体外，与机械臂以及缓冲仓电连接，其中，控 制模块包括图像显示模块。
综上所述，借助于本发明的上述技术方案，通过机械臂以及控制模块能够实现自动化完成发热元件的取出和放入，避免了人力劳动。并且通过设置于壳体内的双开门缓冲仓，能够有效地防止冷却液体气化后的气体泄漏，从而提高了操作过程中的安全系数。同时，缓冲仓还能够对冷却液体以及冷却液体的蒸气进行回收，避免了冷却液体的浪费，减少了冷却液体的损耗。此外，控制模块所提供的显示屏能够为用户提供友好的操作界面，使操作过程变得更加灵活、高效、便捷。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (17)

  1. 一种服务器的冷却系统，其特征在于，包括：
    壳体，所述壳体中纳有冷却液体；
    冷凝模块，位于所述壳体中，所述冷凝模块中纳有制冷材料，用于冷却气化后的所述冷却液体；
    机械臂，位于所述壳体中，用于夹持浸没于所述冷却液体中的发热元件，并且，所述机械臂被配置为在三维空间内移动；
    缓冲仓，位于所述壳体中，并被设置于所述冷却液体的液面上方，所述缓冲仓的相对侧配置有第一仓门和第二仓门，所述第一仓门位于所述壳体外表面上，所述第二仓门位于所述壳体中；以及，
    所述缓冲仓中配置有传送模块，所述传送模块用于传送置于缓冲仓中的发热元件；
    控制模块，位于所述壳体外，与所述机械臂以及缓冲仓电连接，用于控制所述缓冲仓以及所述机械臂；其中，所述控制模块包括图像显示模块，所述图像显示模块用于显示所述壳体内部图像信息。
  2. 根据权利要求1所述的系统，其特征在于，包括：
    所述第一仓门和所述第二仓门不同步开启。
  3. 根据权利要求1所述的系统，其特征在于，包括：
    所述传送模块被配置为双方向传送置于所述缓冲仓中的发热元件。
  4. 根据权利要求1所述的系统，其特征在于，所述传送模块包括以下任意之一：
    传送带、托盘。
  5. 根据权利要求1所述的系统，其特征在于，所述缓冲仓进一步包括：
    回收模块，用于回收所述缓冲仓内的冷却液体。
  6. 根据权利要求1所述的系统，其特征在于，所述控制模块用于控制所述缓冲仓的第一仓门和第二仓门的开启和闭合；以及，
    所述控制模块进一步用于控制所述传送模块的传送方向。
  7. 根据权利要求1所述的系统，其特征在于，包括：
    所述图像显示模块进一步用于提供用户操作界面。
  8. 根据权利要求1所述的系统，其特征在于，包括：
    图像获取模块，与所述控制模块电连接，用于获取所述壳体内的图像信息。
  9. 一种服务器的冷却装置，其特征在于，包括：
    壳体，所述壳体中纳有冷却液体；
    冷凝模块，位于所述壳体中，所述冷凝模块中纳有制冷材料；
    机械臂，位于所述壳体中，所述机械臂被配置为在三维空间内移动；
    缓冲仓，位于所述壳体中，并被设置于所述冷却液体的液面上方，所述缓冲仓的相对侧配置有第一仓门和第二仓门，所述第一仓门位于所述壳体外表面上，所述第二仓门位于所述壳体中，所述缓冲仓中配置有传送模块；
    控制模块，位于所述壳体外，与所述机械臂以及缓冲仓电连接，其中，所述控制模块包括图像显示模块。
  10. 根据权利要求9所述的装置，其特征在于，包括：
    所述制冷材料用于对吸热气化后的冷却液体进行冷却处理。
  11. 根据权利要求9所述的装置，其特征在于，包括：
    所述第一仓门和所述第二仓门不同步开启。
  12. 根据权利要求9所述的装置，其特征在于，包括：
    所述传送模块，用于双方向传送置于所述缓冲仓中的发热元件。
  13. 根据权利要求9所述的装置，其特征在于，所述传送模块包括以下任意之一：
    传送带、托盘。
  14. 根据权利要求9所述的装置，其特征在于，所述缓冲仓进一步包括：
    回收模块，用于回收所述缓冲仓内的冷却液体。
  15. 根据权利要求9所述的装置，其特征在于，所述控制模块用于控制所述缓冲仓的第一仓门和第二仓门的开启和闭合；以及，
    所述控制模块进一步用于控制所述传送模块的传送方向。
  16. 根据权利要求9所述的装置，其特征在于，进一步包括：
    图像获取模块，与所述控制模块电连接，用于获取壳体内的图像信息。
  17. 根据权利要求9所述的装置，其特征在于，所述图像显示模块用于显示所述图像信息。
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