GB2480152B - Cooling method and cooling system for electronic device - Google Patents

Cooling method and cooling system for electronic device

Info

Publication number
GB2480152B
GB2480152B GB1107469.7A GB201107469A GB2480152B GB 2480152 B GB2480152 B GB 2480152B GB 201107469 A GB201107469 A GB 201107469A GB 2480152 B GB2480152 B GB 2480152B
Authority
GB
United Kingdom
Prior art keywords
evaporator
refrigerant
electronic device
cooling
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB1107469.7A
Other versions
GB201107469D0 (en
GB2480152A (en
Inventor
Yasuhiro Kashirajima
Junichi Ito
Yasuhiko Inadomi
Masakatsu Senda
Ryoji Shimokawa
Noboru Oshima
Takumi Sugiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Plant Technologies Ltd
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Publication of GB201107469D0 publication Critical patent/GB201107469D0/en
Publication of GB2480152A publication Critical patent/GB2480152A/en
Application granted granted Critical
Publication of GB2480152B publication Critical patent/GB2480152B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/30—Control or safety arrangements for purposes related to the operation of the system, e.g. for safety or monitoring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/70—Control systems characterised by their outputs; Constructional details thereof
    • F24F11/72—Control systems characterised by their outputs; Constructional details thereof for controlling the supply of treated air, e.g. its pressure
    • F24F11/74—Control systems characterised by their outputs; Constructional details thereof for controlling the supply of treated air, e.g. its pressure for controlling air flow rate or air velocity
    • F24F11/76—Control systems characterised by their outputs; Constructional details thereof for controlling the supply of treated air, e.g. its pressure for controlling air flow rate or air velocity by means responsive to temperature, e.g. bimetal springs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F2110/00—Control inputs relating to air properties
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/06—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the arrangements for the supply of heat-exchange fluid for the subsequent treatment of primary air in the room units
    • F24F3/065—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the arrangements for the supply of heat-exchange fluid for the subsequent treatment of primary air in the room units with a plurality of evaporators or condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical & Material Sciences (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Air Conditioning Control Device (AREA)

Abstract

A cooling method for an electronic device, comprising: naturally circulating a refrigerant between: an evaporator which vaporizes the refrigerant by heat exchange with exhaust hot air from the electronic device, and cools the exhaust hot air; and one of a cooling tower and a condenser which is placed at a position higher than the evaporator, and liquefies the vaporized refrigerant; and valve-controlling a flow rate of a refrigerant liquid to be supplied to the evaporator so that an air temperature after heat has been exchanged for cooling by the evaporator becomes a temperature suited to an operating environment of the electronic device, wherein one of a condensation temperature and a condensation pressure of a refrigerant gas in one of the cooling tower and the condenser do not fluctuate even when the flow rate of the refrigerant liquid to be supplied to the evaporator is valve-controlled.
GB1107469.7A 2010-05-06 2011-05-04 Cooling method and cooling system for electronic device Expired - Fee Related GB2480152B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010106788A JP2011237887A (en) 2010-05-06 2010-05-06 Cooling method and cooling system for electronic equipment

Publications (3)

Publication Number Publication Date
GB201107469D0 GB201107469D0 (en) 2011-06-15
GB2480152A GB2480152A (en) 2011-11-09
GB2480152B true GB2480152B (en) 2012-11-21

Family

ID=44203182

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1107469.7A Expired - Fee Related GB2480152B (en) 2010-05-06 2011-05-04 Cooling method and cooling system for electronic device

Country Status (6)

Country Link
US (1) US20110271695A1 (en)
JP (1) JP2011237887A (en)
CN (1) CN102245006A (en)
GB (1) GB2480152B (en)
NL (1) NL2006727C2 (en)
SG (1) SG176365A1 (en)

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SG10201507946QA (en) 2010-06-23 2015-10-29 Inertech Ip Llc Space-saving high-density modular data center and an energy-efficient cooling system
JP2014509726A (en) 2011-03-02 2014-04-21 イナーテック アイピー エルエルシー High density modular data pod system and energy efficient cooling system to save space
US8711563B2 (en) * 2011-10-25 2014-04-29 International Business Machines Corporation Dry-cooling unit with gravity-assisted coolant flow
CN104220955B (en) * 2012-04-02 2017-07-28 富士通株式会社 Modular type data center
WO2013171803A1 (en) * 2012-05-18 2013-11-21 三菱電機株式会社 Heat pump device
CN103429022B (en) * 2012-05-23 2016-09-07 华为技术有限公司 A kind of container data center
WO2013186904A1 (en) * 2012-06-14 2013-12-19 富士通株式会社 Dew condensation detection device, cooling system, and method for controlling cooling medium flow rate
JP5902053B2 (en) * 2012-06-28 2016-04-13 株式会社日立製作所 Cooling system and cooling method
US20140209288A1 (en) * 2013-01-28 2014-07-31 Alcatel-Lucent Usa, Inc. Cooling technique
CN103278029B (en) * 2013-06-03 2015-10-21 上海华虹宏力半导体制造有限公司 The heat-exchange system of the board of high temperature semiconductors technique and method
WO2015075916A1 (en) * 2013-11-20 2015-05-28 日本電気株式会社 Electronic apparatus enclosure device and electronic apparatus cooling system
JP6282186B2 (en) * 2014-07-02 2018-02-21 株式会社日立製作所 Method for detecting refrigerant leakage in cooling system
CN105430997B (en) * 2014-09-22 2019-03-12 中国移动通信集团广东有限公司 A kind of heat pipe internal-circulation type secondary refrigerant loop server cabinet cooling system
WO2016057854A1 (en) 2014-10-08 2016-04-14 Inertech Ip Llc Systems and methods for cooling electrical equipment
US10375901B2 (en) 2014-12-09 2019-08-13 Mtd Products Inc Blower/vacuum
US20180054919A1 (en) * 2015-03-13 2018-02-22 Nec Corporation Refrigerant supply device, phase-change cooling apparatus equipped with the same, and method of supplying refrigerant
US11609035B2 (en) * 2015-12-21 2023-03-21 Nec Corporation Refrigerant circulating apparatus and method of circulating refrigerant
EP3430327A1 (en) 2016-03-16 2019-01-23 Inertech IP LLC System and methods utilizing fluid coolers and chillers to perform in-series heat rejection and trim cooling
JP6980969B2 (en) * 2016-04-13 2021-12-15 富士通株式会社 Data center and data center control method
JP6790690B2 (en) * 2016-10-04 2020-11-25 富士通株式会社 Information processing system and control method of information processing system
US10123461B2 (en) * 2017-04-05 2018-11-06 Google Llc Cooling electronic devices in a data center with cooling units mounted in bays of a server rack frame assembly
CN107473294B (en) * 2017-08-31 2024-01-26 上海晟兰石化工程技术有限公司 Treatment process and treatment system for tower bottom liquid of acrylonitrile recovery tower
WO2019070498A2 (en) * 2017-10-05 2019-04-11 Ice Qube, Inc. Miniaturized closed-loop cooling system
CN108055813B (en) * 2017-12-28 2020-09-29 北京百度网讯科技有限公司 Refrigerating system and refrigerating method of data center
JP7066438B2 (en) * 2018-02-13 2022-05-13 東京エレクトロン株式会社 Cooling system
CN108990392B (en) * 2018-09-06 2023-08-18 郑州云海信息技术有限公司 Many cold sources modularization data center
CN110440522B (en) * 2019-06-28 2021-01-05 安徽国际商务职业学院 Cooling device for electronic component processing
US11997830B2 (en) * 2020-10-29 2024-05-28 Nvidia Corporation Intelligent radiator-assisted power and coolant distribution unit for datacenter cooling systems
CN112954955B (en) * 2021-01-25 2024-07-05 华为数字能源技术有限公司 Cooling system and data center
KR102507362B1 (en) * 2021-06-17 2023-03-09 주식회사 삼화에이스 Data center local cooling system with pre-cooling chiller
CN113573545B (en) * 2021-06-25 2024-03-26 华为数字能源技术有限公司 Refrigerating system and data center
CN115077131B (en) * 2022-04-29 2024-07-05 浙江中广电器集团股份有限公司 Air source heat pump system with economizer and exhaust gas temperature control method
WO2024040144A1 (en) * 2022-08-18 2024-02-22 University Of Florida Research Foundation, Inc. Variable air variable refrigerant flow (vavrf)

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US20090201645A1 (en) * 2008-02-13 2009-08-13 Hitachi Plant Technologies, Ltd. Cooling system for electronic equipment
JP2009193246A (en) * 2008-02-13 2009-08-27 Hitachi Plant Technologies Ltd Cooling system for electronic equipment
EP2333439A2 (en) * 2009-12-01 2011-06-15 Hitachi Plant Technologies, Ltd. Cooling method and cooling system of electronic device

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US20090201645A1 (en) * 2008-02-13 2009-08-13 Hitachi Plant Technologies, Ltd. Cooling system for electronic equipment
JP2009193246A (en) * 2008-02-13 2009-08-27 Hitachi Plant Technologies Ltd Cooling system for electronic equipment
EP2333439A2 (en) * 2009-12-01 2011-06-15 Hitachi Plant Technologies, Ltd. Cooling method and cooling system of electronic device

Also Published As

Publication number Publication date
JP2011237887A (en) 2011-11-24
GB201107469D0 (en) 2011-06-15
NL2006727A (en) 2011-11-08
NL2006727C2 (en) 2012-08-14
SG176365A1 (en) 2011-12-29
GB2480152A (en) 2011-11-09
CN102245006A (en) 2011-11-16
US20110271695A1 (en) 2011-11-10

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20140220 AND 20140226

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20200504