KR20150038497A - 재구성된 웨이퍼-레벨 마이크로전자 패키지 - Google Patents

재구성된 웨이퍼-레벨 마이크로전자 패키지 Download PDF

Info

Publication number
KR20150038497A
KR20150038497A KR1020157005269A KR20157005269A KR20150038497A KR 20150038497 A KR20150038497 A KR 20150038497A KR 1020157005269 A KR1020157005269 A KR 1020157005269A KR 20157005269 A KR20157005269 A KR 20157005269A KR 20150038497 A KR20150038497 A KR 20150038497A
Authority
KR
South Korea
Prior art keywords
microelectronic
conductive
package
elements
semiconductor die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020157005269A
Other languages
English (en)
Korean (ko)
Inventor
일야스 모하메드
Original Assignee
인벤사스 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 인벤사스 코포레이션 filed Critical 인벤사스 코포레이션
Publication of KR20150038497A publication Critical patent/KR20150038497A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/652—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/823—Interconnections through encapsulations, e.g. pillars through molded resin on a lateral side a chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/22—Configurations of stacked chips the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/26—Configurations of stacked chips the stacked chips being of the same size without any chips being laterally offset, e.g. chip stacks having a rectangular shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/271—Configurations of stacked chips the chips having passive surfaces facing each other, i.e. in a back-to-back arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips

Landscapes

  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1020157005269A 2012-07-31 2013-07-31 재구성된 웨이퍼-레벨 마이크로전자 패키지 Withdrawn KR20150038497A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/563,085 2012-07-31
US13/563,085 US9391008B2 (en) 2012-07-31 2012-07-31 Reconstituted wafer-level package DRAM
PCT/US2013/052883 WO2014022485A1 (en) 2012-07-31 2013-07-31 Reconstituted wafer-level microelectronic package

Publications (1)

Publication Number Publication Date
KR20150038497A true KR20150038497A (ko) 2015-04-08

Family

ID=48980322

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157005269A Withdrawn KR20150038497A (ko) 2012-07-31 2013-07-31 재구성된 웨이퍼-레벨 마이크로전자 패키지

Country Status (7)

Country Link
US (2) US9391008B2 (enExample)
EP (1) EP2880684B1 (enExample)
JP (1) JP2015523740A (enExample)
KR (1) KR20150038497A (enExample)
CN (1) CN104685624B (enExample)
TW (1) TWI538118B (enExample)
WO (1) WO2014022485A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102053349B1 (ko) * 2013-05-16 2019-12-06 삼성전자주식회사 반도체 패키지
TWI584387B (zh) * 2014-08-15 2017-05-21 矽品精密工業股份有限公司 封裝結構之製法
US9679873B2 (en) * 2015-06-18 2017-06-13 Qualcomm Incorporated Low profile integrated circuit (IC) package comprising a plurality of dies
US9601467B1 (en) 2015-09-03 2017-03-21 Invensas Corporation Microelectronic package with horizontal and vertical interconnections
IT201700055983A1 (it) 2017-05-23 2018-11-23 St Microelectronics Srl Procedimento per produrre dispositivi a semiconduttore, dispositivo a semiconduttore e circuito corrispondenti
US10141259B1 (en) * 2017-12-22 2018-11-27 Micron Technology, Inc. Semiconductor devices having electrically and optically conductive vias, and associated systems and methods

Family Cites Families (572)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1439262B2 (de) 1963-07-23 1972-03-30 Siemens AG, 1000 Berlin u. 8000 München Verfahren zum kontaktieren von halbleiterbauelementen durch thermokompression
US3358897A (en) 1964-03-31 1967-12-19 Tempress Res Co Electric lead wire bonding tools
US3430835A (en) 1966-06-07 1969-03-04 Westinghouse Electric Corp Wire bonding apparatus for microelectronic components
US3623649A (en) 1969-06-09 1971-11-30 Gen Motors Corp Wedge bonding tool for the attachment of semiconductor leads
DE2119567C2 (de) 1970-05-05 1983-07-14 International Computers Ltd., London Elektrische Verbindungsvorrichtung und Verfahren zu ihrer Herstellung
DE2228703A1 (de) 1972-06-13 1974-01-10 Licentia Gmbh Verfahren zum herstellen einer vorgegebenen lotschichtstaerke bei der fertigung von halbleiterbauelementen
JPS5150661A (enExample) 1974-10-30 1976-05-04 Hitachi Ltd
US4067104A (en) 1977-02-24 1978-01-10 Rockwell International Corporation Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components
US4213556A (en) 1978-10-02 1980-07-22 General Motors Corporation Method and apparatus to detect automatic wire bonder failure
US4327860A (en) 1980-01-03 1982-05-04 Kulicke And Soffa Ind. Inc. Method of making slack free wire interconnections
US4422568A (en) 1981-01-12 1983-12-27 Kulicke And Soffa Industries, Inc. Method of making constant bonding wire tail lengths
US4437604A (en) 1982-03-15 1984-03-20 Kulicke & Soffa Industries, Inc. Method of making fine wire interconnections
JPS59189069A (ja) 1983-04-12 1984-10-26 Alps Electric Co Ltd 電気部品の端子のハンダ塗布装置
JPS59189069U (ja) 1983-06-02 1984-12-14 昭和アルミニウム株式会社 冷却装置
JPS61125062A (ja) 1984-11-22 1986-06-12 Hitachi Ltd ピン取付け方法およびピン取付け装置
US4604644A (en) 1985-01-28 1986-08-05 International Business Machines Corporation Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
US4642889A (en) 1985-04-29 1987-02-17 Amp Incorporated Compliant interconnection and method therefor
JP2608701B2 (ja) 1985-09-19 1997-05-14 三菱電機株式会社 保護装置の点検回路
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US4924353A (en) 1985-12-20 1990-05-08 Hughes Aircraft Company Connector system for coupling to an integrated circuit chip
US4716049A (en) 1985-12-20 1987-12-29 Hughes Aircraft Company Compressive pedestal for microminiature connections
JPS62158338A (ja) 1985-12-28 1987-07-14 Tanaka Denshi Kogyo Kk 半導体装置
US4793814A (en) 1986-07-21 1988-12-27 Rogers Corporation Electrical circuit board interconnect
US4695870A (en) 1986-03-27 1987-09-22 Hughes Aircraft Company Inverted chip carrier
JPS62226307A (ja) 1986-03-28 1987-10-05 Toshiba Corp ロボツト装置
US4771930A (en) 1986-06-30 1988-09-20 Kulicke And Soffa Industries Inc. Apparatus for supplying uniform tail lengths
JPS6397941A (ja) 1986-10-14 1988-04-28 Fuji Photo Film Co Ltd 感光材料
US4955523A (en) 1986-12-17 1990-09-11 Raychem Corporation Interconnection of electronic components
DE3703694A1 (de) 1987-02-06 1988-08-18 Dynapert Delvotec Gmbh Ball-bondverfahren und vorrichtung zur durchfuehrung derselben
KR970003915B1 (ko) 1987-06-24 1997-03-22 미다 가쓰시게 반도체 기억장치 및 그것을 사용한 반도체 메모리 모듈
JP2642359B2 (ja) 1987-09-11 1997-08-20 株式会社日立製作所 半導体装置
US5138438A (en) 1987-06-24 1992-08-11 Akita Electronics Co. Ltd. Lead connections means for stacked tab packaged IC chips
US4804132A (en) 1987-08-28 1989-02-14 Difrancesco Louis Method for cold bonding
US4845354A (en) 1988-03-08 1989-07-04 International Business Machines Corporation Process control for laser wire bonding
JPH01313969A (ja) 1988-06-13 1989-12-19 Hitachi Ltd 半導体装置
US4998885A (en) 1989-10-27 1991-03-12 International Business Machines Corporation Elastomeric area array interposer
US5077598A (en) 1989-11-08 1991-12-31 Hewlett-Packard Company Strain relief flip-chip integrated circuit assembly with test fixturing
US5095187A (en) 1989-12-20 1992-03-10 Raychem Corporation Weakening wire supplied through a wire bonder
AU637874B2 (en) 1990-01-23 1993-06-10 Sumitomo Electric Industries, Ltd. Substrate for packaging a semiconductor device
AU645283B2 (en) 1990-01-23 1994-01-13 Sumitomo Electric Industries, Ltd. Substrate for packaging a semiconductor device
US5948533A (en) 1990-02-09 1999-09-07 Ormet Corporation Vertically interconnected electronic assemblies and compositions useful therefor
US5376403A (en) 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5083697A (en) 1990-02-14 1992-01-28 Difrancesco Louis Particle-enhanced joining of metal surfaces
US4975079A (en) 1990-02-23 1990-12-04 International Business Machines Corp. Connector assembly for chip testing
US4999472A (en) 1990-03-12 1991-03-12 Neinast James E Electric arc system for ablating a surface coating
US5241456A (en) * 1990-07-02 1993-08-31 General Electric Company Compact high density interconnect structure
US5148266A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5679977A (en) 1990-09-24 1997-10-21 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
US5067382A (en) 1990-11-02 1991-11-26 Cray Computer Corporation Method and apparatus for notching a lead wire attached to an IC chip to facilitate severing the wire
KR940001149B1 (ko) 1991-04-16 1994-02-14 삼성전자 주식회사 반도체 장치의 칩 본딩 방법
JPH04346436A (ja) 1991-05-24 1992-12-02 Fujitsu Ltd バンプ製造方法とバンプ製造装置
US5316788A (en) 1991-07-26 1994-05-31 International Business Machines Corporation Applying solder to high density substrates
US5203075A (en) 1991-08-12 1993-04-20 Inernational Business Machines Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
US5133495A (en) 1991-08-12 1992-07-28 International Business Machines Corporation Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween
WO1993004375A1 (en) 1991-08-23 1993-03-04 Nchip, Inc. Burn-in technologies for unpackaged integrated circuits
US5220489A (en) 1991-10-11 1993-06-15 Motorola, Inc. Multicomponent integrated circuit package
US5238173A (en) 1991-12-04 1993-08-24 Kaijo Corporation Wire bonding misattachment detection apparatus and that detection method in a wire bonder
JP2931936B2 (ja) 1992-01-17 1999-08-09 株式会社日立製作所 半導体装置用リードフレームの製造方法及び半導体装置用リードフレーム並びに樹脂封止型半導体装置
US5241454A (en) * 1992-01-22 1993-08-31 International Business Machines Corporation Mutlilayered flexible circuit package
US5831836A (en) 1992-01-30 1998-11-03 Lsi Logic Power plane for semiconductor device
US5222014A (en) 1992-03-02 1993-06-22 Motorola, Inc. Three-dimensional multi-chip pad array carrier
US5438224A (en) 1992-04-23 1995-08-01 Motorola, Inc. Integrated circuit package having a face-to-face IC chip arrangement
US5494667A (en) 1992-06-04 1996-02-27 Kabushiki Kaisha Hayahibara Topically applied hair restorer containing pine extract
US5977618A (en) 1992-07-24 1999-11-02 Tessera, Inc. Semiconductor connection components and methods with releasable lead support
US6054756A (en) 1992-07-24 2000-04-25 Tessera, Inc. Connection components with frangible leads and bus
US5915752A (en) 1992-07-24 1999-06-29 Tessera, Inc. Method of making connections to a semiconductor chip assembly
US20050062492A1 (en) 2001-08-03 2005-03-24 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
US5371654A (en) 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US6295729B1 (en) 1992-10-19 2001-10-02 International Business Machines Corporation Angled flying lead wire bonding process
JP2716336B2 (ja) 1993-03-10 1998-02-18 日本電気株式会社 集積回路装置
JPH06268101A (ja) 1993-03-17 1994-09-22 Hitachi Ltd 半導体装置及びその製造方法、電子装置、リ−ドフレ−ム並びに実装基板
US5340771A (en) 1993-03-18 1994-08-23 Lsi Logic Corporation Techniques for providing high I/O count connections to semiconductor dies
US20030048108A1 (en) 1993-04-30 2003-03-13 Beaman Brian Samuel Structural design and processes to control probe position accuracy in a wafer test probe assembly
US7368924B2 (en) 1993-04-30 2008-05-06 International Business Machines Corporation Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof
US5811982A (en) 1995-11-27 1998-09-22 International Business Machines Corporation High density cantilevered probe for electronic devices
JPH06333931A (ja) 1993-05-20 1994-12-02 Nippondenso Co Ltd 半導体装置における微細電極の製造方法
JP2981385B2 (ja) 1993-09-06 1999-11-22 シャープ株式会社 チップ部品型ｌｅｄの構造及びその製造方法
US5346118A (en) 1993-09-28 1994-09-13 At&T Bell Laboratories Surface mount solder assembly of leadless integrated circuit packages to substrates
US6835898B2 (en) 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US5455390A (en) 1994-02-01 1995-10-03 Tessera, Inc. Microelectronics unit mounting with multiple lead bonding
CN1117395C (zh) 1994-03-18 2003-08-06 日立化成工业株式会社 半导体组件的制造方法及半导体组件
US5802699A (en) 1994-06-07 1998-09-08 Tessera, Inc. Methods of assembling microelectronic assembly with socket for engaging bump leads
US5615824A (en) 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
JPH07335783A (ja) 1994-06-13 1995-12-22 Fujitsu Ltd 半導体装置及び半導体装置ユニット
US5468995A (en) 1994-07-05 1995-11-21 Motorola, Inc. Semiconductor device having compliant columnar electrical connections
US5688716A (en) 1994-07-07 1997-11-18 Tessera, Inc. Fan-out semiconductor chip assembly
US6828668B2 (en) 1994-07-07 2004-12-07 Tessera, Inc. Flexible lead structures and methods of making same
US5518964A (en) 1994-07-07 1996-05-21 Tessera, Inc. Microelectronic mounting with multiple lead deformation and bonding
US6117694A (en) 1994-07-07 2000-09-12 Tessera, Inc. Flexible lead structures and methods of making same
US6177636B1 (en) 1994-12-29 2001-01-23 Tessera, Inc. Connection components with posts
US5989936A (en) 1994-07-07 1999-11-23 Tessera, Inc. Microelectronic assembly fabrication with terminal formation from a conductive layer
US5656550A (en) 1994-08-24 1997-08-12 Fujitsu Limited Method of producing a semicondutor device having a lead portion with outer connecting terminal
US5659952A (en) 1994-09-20 1997-08-26 Tessera, Inc. Method of fabricating compliant interface for semiconductor chip
US5541567A (en) 1994-10-17 1996-07-30 International Business Machines Corporation Coaxial vias in an electronic substrate
US5495667A (en) 1994-11-07 1996-03-05 Micron Technology, Inc. Method for forming contact pins for semiconductor dice and interconnects
US6826827B1 (en) 1994-12-29 2004-12-07 Tessera, Inc. Forming conductive posts by selective removal of conductive material
US5736074A (en) 1995-06-30 1998-04-07 Micro Fab Technologies, Inc. Manufacture of coated spheres
US5971253A (en) 1995-07-31 1999-10-26 Tessera, Inc. Microelectronic component mounting with deformable shell terminals
US5872051A (en) 1995-08-02 1999-02-16 International Business Machines Corporation Process for transferring material to semiconductor chip conductive pads using a transfer substrate
US5810609A (en) 1995-08-28 1998-09-22 Tessera, Inc. Socket for engaging bump leads on a microelectronic device and methods therefor
US5766987A (en) 1995-09-22 1998-06-16 Tessera, Inc. Microelectronic encapsulation methods and equipment
US6211572B1 (en) 1995-10-31 2001-04-03 Tessera, Inc. Semiconductor chip package with fan-in leads
JPH09134934A (ja) 1995-11-07 1997-05-20 Sumitomo Metal Ind Ltd 半導体パッケージ及び半導体装置
JP3332308B2 (ja) 1995-11-07 2002-10-07 新光電気工業株式会社 半導体装置及びその製造方法
US5718361A (en) 1995-11-21 1998-02-17 International Business Machines Corporation Apparatus and method for forming mold for metallic material
US5731709A (en) 1996-01-26 1998-03-24 Motorola, Inc. Method for testing a ball grid array semiconductor device and a device for such testing
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
JP3146345B2 (ja) 1996-03-11 2001-03-12 アムコー テクノロジー コリア インコーポレーティド バンプチップスケール半導体パッケージのバンプ形成方法
US6000126A (en) 1996-03-29 1999-12-14 General Dynamics Information Systems, Inc. Method and apparatus for connecting area grid arrays to printed wire board
US6821821B2 (en) 1996-04-18 2004-11-23 Tessera, Inc. Methods for manufacturing resistors using a sacrificial layer
DE19618227A1 (de) 1996-05-07 1997-11-13 Herbert Streckfus Gmbh Verfahren und Vorrichtung zum Verlöten von elektronischen Bauelementen auf einer Leiterplatte
KR100186333B1 (ko) 1996-06-20 1999-03-20 문정환 칩 사이즈 반도체 패키지 및 그 제조방법
JPH1012769A (ja) 1996-06-24 1998-01-16 Ricoh Co Ltd 半導体装置およびその製造方法
JPH10135220A (ja) 1996-10-29 1998-05-22 Taiyo Yuden Co Ltd バンプ形成方法
JPH10135221A (ja) 1996-10-29 1998-05-22 Taiyo Yuden Co Ltd バンプ形成方法
US6492719B2 (en) * 1999-07-30 2002-12-10 Hitachi, Ltd. Semiconductor device
US5976913A (en) 1996-12-12 1999-11-02 Tessera, Inc. Microelectronic mounting with multiple lead deformation using restraining straps
US6054337A (en) 1996-12-13 2000-04-25 Tessera, Inc. Method of making a compliant multichip package
US6121676A (en) 1996-12-13 2000-09-19 Tessera, Inc. Stacked microelectronic assembly and method therefor
US6225688B1 (en) 1997-12-11 2001-05-01 Tessera, Inc. Stacked microelectronic assembly and method therefor
US6133072A (en) 1996-12-13 2000-10-17 Tessera, Inc. Microelectronic connector with planar elastomer sockets
JP3400279B2 (ja) 1997-01-13 2003-04-28 株式会社新川 バンプ形成方法
US5898991A (en) 1997-01-16 1999-05-04 International Business Machines Corporation Methods of fabrication of coaxial vias and magnetic devices
US5839191A (en) 1997-01-24 1998-11-24 Unisys Corporation Vibrating template method of placing solder balls on the I/O pads of an integrated circuit package
JPH1118364A (ja) 1997-06-27 1999-01-22 Matsushita Electric Ind Co Ltd キャプスタンモータ
CN1167131C (zh) 1997-08-19 2004-09-15 株式会社日立制作所 基底基板及制作用来装载多个半导体裸芯片器件的构造体的方法
CA2213590C (en) 1997-08-21 2006-11-07 Keith C. Carroll Flexible circuit connector and method of making same
JP3859318B2 (ja) 1997-08-29 2006-12-20 シチズン電子株式会社 電子回路のパッケージ方法
US6525414B2 (en) 1997-09-16 2003-02-25 Matsushita Electric Industrial Co., Ltd. Semiconductor device including a wiring board and semiconductor elements mounted thereon
JP3937265B2 (ja) 1997-09-29 2007-06-27 エルピーダメモリ株式会社 半導体装置
JP3262531B2 (ja) 1997-10-02 2002-03-04 インターナショナル・ビジネス・マシーンズ・コーポレーション 曲げられたフライング・リード・ワイヤ・ボンデイング・プロセス
JP2978861B2 (ja) 1997-10-28 1999-11-15 九州日本電気株式会社 モールドｂｇａ型半導体装置及びその製造方法
US6038136A (en) 1997-10-29 2000-03-14 Hestia Technologies, Inc. Chip package with molded underfill
JP3393800B2 (ja) 1997-11-05 2003-04-07 新光電気工業株式会社 半導体装置の製造方法
JPH11219984A (ja) 1997-11-06 1999-08-10 Sharp Corp 半導体装置パッケージおよびその製造方法ならびにそのための回路基板
US6222136B1 (en) 1997-11-12 2001-04-24 International Business Machines Corporation Printed circuit board with continuous connective bumps
US6002168A (en) 1997-11-25 1999-12-14 Tessera, Inc. Microelectronic component with rigid interposer
US6038133A (en) 1997-11-25 2000-03-14 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module and method for producing the same
JPH11163022A (ja) 1997-11-28 1999-06-18 Sony Corp 半導体装置、その製造方法及び電子機器
US6124546A (en) 1997-12-03 2000-09-26 Advanced Micro Devices, Inc. Integrated circuit chip package and method of making the same
US6260264B1 (en) 1997-12-08 2001-07-17 3M Innovative Properties Company Methods for making z-axis electrical connections
US6052287A (en) 1997-12-09 2000-04-18 Sandia Corporation Silicon ball grid array chip carrier
US5973391A (en) 1997-12-11 1999-10-26 Read-Rite Corporation Interposer with embedded circuitry and method for using the same to package microelectronic units
JPH11220082A (ja) 1998-02-03 1999-08-10 Oki Electric Ind Co Ltd 半導体装置
JP3536650B2 (ja) 1998-02-27 2004-06-14 富士ゼロックス株式会社 バンプ形成方法および装置
JPH11260856A (ja) 1998-03-11 1999-09-24 Matsushita Electron Corp 半導体装置及びその製造方法並びに半導体装置の実装構造
KR100260997B1 (ko) 1998-04-08 2000-07-01 마이클 디. 오브라이언 반도체패키지
US6329224B1 (en) 1998-04-28 2001-12-11 Tessera, Inc. Encapsulation of microelectronic assemblies
US6180881B1 (en) * 1998-05-05 2001-01-30 Harlan Ruben Isaak Chip stack and method of making same
JPH11330134A (ja) 1998-05-12 1999-11-30 Hitachi Ltd ワイヤボンディング方法およびその装置並びに半導体装置
KR100266693B1 (ko) 1998-05-30 2000-09-15 김영환 적층가능한 비지에이 반도체 칩 패키지 및 그 제조방법
KR100265563B1 (ko) 1998-06-29 2000-09-15 김영환 볼 그리드 어레이 패키지 및 그의 제조 방법
US6414391B1 (en) 1998-06-30 2002-07-02 Micron Technology, Inc. Module assembly for stacked BGA packages with a common bus bar in the assembly
US6164523A (en) 1998-07-01 2000-12-26 Semiconductor Components Industries, Llc Electronic component and method of manufacture
US6399426B1 (en) 1998-07-21 2002-06-04 Miguel Albert Capote Semiconductor flip-chip package and method for the fabrication thereof
US5854507A (en) 1998-07-21 1998-12-29 Hewlett-Packard Company Multiple chip assembly
US6515355B1 (en) 1998-09-02 2003-02-04 Micron Technology, Inc. Passivation layer for packaged integrated circuits
JP2000091383A (ja) 1998-09-07 2000-03-31 Ngk Spark Plug Co Ltd 配線基板
US6194250B1 (en) 1998-09-14 2001-02-27 Motorola, Inc. Low-profile microelectronic package
US6158647A (en) 1998-09-29 2000-12-12 Micron Technology, Inc. Concave face wire bond capillary
US6684007B2 (en) 1998-10-09 2004-01-27 Fujitsu Limited Optical coupling structures and the fabrication processes
US6268662B1 (en) 1998-10-14 2001-07-31 Texas Instruments Incorporated Wire bonded flip-chip assembly of semiconductor devices
JP3407275B2 (ja) 1998-10-28 2003-05-19 インターナショナル・ビジネス・マシーンズ・コーポレーション バンプ及びその形成方法
US6332270B2 (en) 1998-11-23 2001-12-25 International Business Machines Corporation Method of making high density integral test probe
KR100502222B1 (ko) 1999-01-29 2005-07-18 마츠시타 덴끼 산교 가부시키가이샤 전자부품의 실장방법 및 그 장치
US6206273B1 (en) 1999-02-17 2001-03-27 International Business Machines Corporation Structures and processes to create a desired probetip contact geometry on a wafer test probe
KR100319609B1 (ko) 1999-03-09 2002-01-05 김영환 와이어 어래이드 칩 사이즈 패키지 및 그 제조방법
US6177729B1 (en) 1999-04-03 2001-01-23 International Business Machines Corporation Rolling ball connector
US6211574B1 (en) 1999-04-16 2001-04-03 Advanced Semiconductor Engineering Inc. Semiconductor package with wire protection and method therefor
JP2000323516A (ja) 1999-05-14 2000-11-24 Fujitsu Ltd 配線基板の製造方法及び配線基板及び半導体装置
US6258625B1 (en) 1999-05-18 2001-07-10 International Business Machines Corporation Method of interconnecting electronic components using a plurality of conductive studs
US6376769B1 (en) * 1999-05-18 2002-04-23 Amerasia International Technology, Inc. High-density electronic package, and method for making same
JP3398721B2 (ja) 1999-05-20 2003-04-21 アムコー テクノロジー コリア インコーポレーティド 半導体パッケージ及びその製造方法
US6228687B1 (en) 1999-06-28 2001-05-08 Micron Technology, Inc. Wafer-level package and methods of fabricating
TW417839U (en) 1999-07-30 2001-01-01 Shen Ming Tung Stacked memory module structure and multi-layered stacked memory module structure using the same
US6168965B1 (en) 1999-08-12 2001-01-02 Tower Semiconductor Ltd. Method for making backside illuminated image sensor
JP4526651B2 (ja) 1999-08-12 2010-08-18 富士通セミコンダクター株式会社 半導体装置
JP2010192928A (ja) 1999-08-12 2010-09-02 Fujitsu Semiconductor Ltd 半導体装置及びその製造方法
EP2081419B1 (en) 1999-09-02 2013-08-07 Ibiden Co., Ltd. Printed circuit board and method of manufacturing printed circuit board
US6867499B1 (en) 1999-09-30 2005-03-15 Skyworks Solutions, Inc. Semiconductor packaging
JP3513444B2 (ja) 1999-10-20 2004-03-31 株式会社新川 ピン状ワイヤ等の形成方法
JP2001127246A (ja) 1999-10-29 2001-05-11 Fujitsu Ltd 半導体装置
US6362525B1 (en) 1999-11-09 2002-03-26 Cypress Semiconductor Corp. Circuit structure including a passive element formed within a grid array substrate and method for making the same
JP3619410B2 (ja) 1999-11-18 2005-02-09 株式会社ルネサステクノロジ バンプ形成方法およびそのシステム
JP3798597B2 (ja) 1999-11-30 2006-07-19 富士通株式会社 半導体装置
JP3566156B2 (ja) 1999-12-02 2004-09-15 株式会社新川 ピン状ワイヤ等の形成方法
KR100426494B1 (ko) 1999-12-20 2004-04-13 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 이것의 제조방법
US6790757B1 (en) 1999-12-20 2004-09-14 Agere Systems Inc. Wire bonding method for copper interconnects in semiconductor devices
KR20010061849A (ko) 1999-12-29 2001-07-07 박종섭 웨이퍼 레벨 패키지
JP2001196407A (ja) 2000-01-14 2001-07-19 Seiko Instruments Inc 半導体装置および半導体装置の形成方法
US6710454B1 (en) 2000-02-16 2004-03-23 Micron Technology, Inc. Adhesive layer for an electronic apparatus having multiple semiconductor devices
JP2001339011A (ja) 2000-03-24 2001-12-07 Shinko Electric Ind Co Ltd 半導体装置およびその製造方法
JP3980807B2 (ja) 2000-03-27 2007-09-26 株式会社東芝 半導体装置及び半導体モジュール
JP2001274196A (ja) 2000-03-28 2001-10-05 Rohm Co Ltd 半導体装置
KR100583491B1 (ko) 2000-04-07 2006-05-24 앰코 테크놀로지 코리아 주식회사 반도체패키지 및 그 제조방법
US6578754B1 (en) 2000-04-27 2003-06-17 Advanpack Solutions Pte. Ltd. Pillar connections for semiconductor chips and method of manufacture
US6531335B1 (en) 2000-04-28 2003-03-11 Micron Technology, Inc. Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods
JP2001326236A (ja) 2000-05-12 2001-11-22 Nec Kyushu Ltd 半導体装置の製造方法
JP2001326304A (ja) 2000-05-15 2001-11-22 Toshiba Corp 半導体装置及びその製造方法
US6522018B1 (en) 2000-05-16 2003-02-18 Micron Technology, Inc. Ball grid array chip packages having improved testing and stacking characteristics
US6647310B1 (en) 2000-05-30 2003-11-11 Advanced Micro Devices, Inc. Temperature control of an integrated circuit
US6531784B1 (en) 2000-06-02 2003-03-11 Amkor Technology, Inc. Semiconductor package with spacer strips
US6560117B2 (en) 2000-06-28 2003-05-06 Micron Technology, Inc. Packaged microelectronic die assemblies and methods of manufacture
US6476583B2 (en) 2000-07-21 2002-11-05 Jomahip, Llc Automatic battery charging system for a battery back-up DC power supply
SE517086C2 (sv) 2000-08-08 2002-04-09 Ericsson Telefon Ab L M Förfarande för säkring av lodkulor och eventuella komponenter, vilka är fästa på en och samma sida av ett substrat
US20020020898A1 (en) * 2000-08-16 2002-02-21 Vu Quat T. Microelectronic substrates with integrated devices
US6462575B1 (en) 2000-08-28 2002-10-08 Micron Technology, Inc. Method and system for wafer level testing and burning-in semiconductor components
JP3874062B2 (ja) 2000-09-05 2007-01-31 セイコーエプソン株式会社 半導体装置
US6507104B2 (en) 2000-09-07 2003-01-14 Siliconware Precision Industries Co., Ltd. Semiconductor package with embedded heat-dissipating device
US7009297B1 (en) 2000-10-13 2006-03-07 Bridge Semiconductor Corporation Semiconductor chip assembly with embedded metal particle
US6423570B1 (en) 2000-10-18 2002-07-23 Intel Corporation Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby
JP4505983B2 (ja) 2000-12-01 2010-07-21 日本電気株式会社 半導体装置
JP3798620B2 (ja) 2000-12-04 2006-07-19 富士通株式会社 半導体装置の製造方法
TW511405B (en) 2000-12-27 2002-11-21 Matsushita Electric Industrial Co Ltd Device built-in module and manufacturing method thereof
KR100393102B1 (ko) 2000-12-29 2003-07-31 앰코 테크놀로지 코리아 주식회사 스택형 반도체패키지
AUPR244801A0 (en) 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd A method and apparatus (WSM01)
US6388322B1 (en) 2001-01-17 2002-05-14 Aralight, Inc. Article comprising a mechanically compliant bump
US6653170B1 (en) 2001-02-06 2003-11-25 Charles W. C. Lin Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit
JP2002280414A (ja) 2001-03-22 2002-09-27 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP2002289769A (ja) 2001-03-26 2002-10-04 Matsushita Electric Ind Co Ltd 積層型半導体装置およびその製造方法
SG108245A1 (en) 2001-03-30 2005-01-28 Micron Technology Inc Ball grid array interposer, packages and methods
US7115986B2 (en) 2001-05-02 2006-10-03 Micron Technology, Inc. Flexible ball grid array chip scale packages
US6825552B2 (en) 2001-05-09 2004-11-30 Tessera, Inc. Connection components with anisotropic conductive material interconnection
TW544826B (en) 2001-05-18 2003-08-01 Nec Electronics Corp Flip-chip-type semiconductor device and manufacturing method thereof
US6930256B1 (en) 2002-05-01 2005-08-16 Amkor Technology, Inc. Integrated circuit substrate having laser-embedded conductive patterns and method therefor
US6754407B2 (en) 2001-06-26 2004-06-22 Intel Corporation Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board
US20030006494A1 (en) 2001-07-03 2003-01-09 Lee Sang Ho Thin profile stackable semiconductor package and method for manufacturing
US6486545B1 (en) * 2001-07-26 2002-11-26 Amkor Technology, Inc. Pre-drilled ball grid array package
US6451626B1 (en) 2001-07-27 2002-09-17 Charles W.C. Lin Three-dimensional stacked semiconductor package
US6765287B1 (en) 2001-07-27 2004-07-20 Charles W. C. Lin Three-dimensional stacked semiconductor package
JP4023159B2 (ja) 2001-07-31 2007-12-19 ソニー株式会社 半導体装置の製造方法及び積層半導体装置の製造方法
US6550666B2 (en) 2001-08-21 2003-04-22 Advanpack Solutions Pte Ltd Method for forming a flip chip on leadframe semiconductor package
US7605479B2 (en) 2001-08-22 2009-10-20 Tessera, Inc. Stacked chip assembly with encapsulant layer
US7176506B2 (en) 2001-08-28 2007-02-13 Tessera, Inc. High frequency chip packages with connecting elements
US20030057544A1 (en) 2001-09-13 2003-03-27 Nathan Richard J. Integrated assembly protocol
JP2005506690A (ja) 2001-10-09 2005-03-03 テッセラ，インコーポレイテッド 積層パッケージ
US6977440B2 (en) 2001-10-09 2005-12-20 Tessera, Inc. Stacked packages
JP2003122611A (ja) 2001-10-11 2003-04-25 Oki Electric Ind Co Ltd データ提供方法及びサーバ装置
JP4257771B2 (ja) 2001-10-16 2009-04-22 シンジーテック株式会社 導電性ブレード
US20030094666A1 (en) 2001-11-16 2003-05-22 R-Tec Corporation Interposer
JP3875077B2 (ja) 2001-11-16 2007-01-31 富士通株式会社 電子デバイス及びデバイス接続方法
JP2003174124A (ja) 2001-12-04 2003-06-20 Sainekkusu:Kk 半導体装置の外部電極形成方法
KR100435813B1 (ko) * 2001-12-06 2004-06-12 삼성전자주식회사 금속 바를 이용하는 멀티 칩 패키지와 그 제조 방법
JP3507059B2 (ja) 2002-06-27 2004-03-15 沖電気工業株式会社 積層マルチチップパッケージ
JP2003197669A (ja) 2001-12-28 2003-07-11 Seiko Epson Corp ボンディング方法及びボンディング装置
TW584950B (en) 2001-12-31 2004-04-21 Megic Corp Chip packaging structure and process thereof
JP3935370B2 (ja) 2002-02-19 2007-06-20 セイコーエプソン株式会社 バンプ付き半導体素子の製造方法、半導体装置及びその製造方法、回路基板並びに電子機器
SG115456A1 (en) 2002-03-04 2005-10-28 Micron Technology Inc Semiconductor die packages with recessed interconnecting structures and methods for assembling the same
US6653723B2 (en) 2002-03-09 2003-11-25 Fujitsu Limited System for providing an open-cavity low profile encapsulated semiconductor package
KR100452819B1 (ko) 2002-03-18 2004-10-15 삼성전기주식회사 칩 패키지 및 그 제조방법
US6979230B2 (en) 2002-03-20 2005-12-27 Gabe Cherian Light socket
US7323767B2 (en) 2002-04-25 2008-01-29 Micron Technology, Inc. Standoffs for centralizing internals in packaging process
US7633765B1 (en) 2004-03-23 2009-12-15 Amkor Technology, Inc. Semiconductor package including a top-surface metal layer for implementing circuit features
US7078822B2 (en) 2002-06-25 2006-07-18 Intel Corporation Microelectronic device interconnects
JP2004031751A (ja) 2002-06-27 2004-01-29 Rb Controls Co ケーシングの防水構造
JP2004047702A (ja) 2002-07-11 2004-02-12 Toshiba Corp 半導体装置積層モジュール
US6756252B2 (en) 2002-07-17 2004-06-29 Texas Instrument Incorporated Multilayer laser trim interconnect method
US6987032B1 (en) 2002-07-19 2006-01-17 Asat Ltd. Ball grid array package and process for manufacturing same
AU2003265417A1 (en) 2002-08-16 2004-03-03 Tessera, Inc. Microelectronic packages with self-aligning features
TW549592U (en) 2002-08-16 2003-08-21 Via Tech Inc Integrated circuit package with a balanced-part structure
US6740546B2 (en) 2002-08-21 2004-05-25 Micron Technology, Inc. Packaged microelectronic devices and methods for assembling microelectronic devices
US6964881B2 (en) 2002-08-27 2005-11-15 Micron Technology, Inc. Multi-chip wafer level system packages and methods of forming same
JP3765778B2 (ja) 2002-08-29 2006-04-12 ローム株式会社 ワイヤボンディング用キャピラリ及びこれを用いたワイヤボンディング方法
JP2004095799A (ja) * 2002-08-30 2004-03-25 Toshiba Corp 半導体装置およびその製造方法
US7294928B2 (en) 2002-09-06 2007-11-13 Tessera, Inc. Components, methods and assemblies for stacked packages
US7246431B2 (en) 2002-09-06 2007-07-24 Tessera, Inc. Methods of making microelectronic packages including folded substrates
US7071547B2 (en) 2002-09-11 2006-07-04 Tessera, Inc. Assemblies having stacked semiconductor chips and methods of making same
US7229906B2 (en) 2002-09-19 2007-06-12 Kulicke And Soffa Industries, Inc. Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
KR20050071524A (ko) 2002-09-30 2005-07-07 어드밴스드 인터커넥트 테크놀로지스 리미티드 블럭 몰드 조립체용 열 강화 패키지
US7045884B2 (en) 2002-10-04 2006-05-16 International Rectifier Corporation Semiconductor device package
US7057269B2 (en) 2002-10-08 2006-06-06 Chippac, Inc. Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package
US6989122B1 (en) 2002-10-17 2006-01-24 National Semiconductor Corporation Techniques for manufacturing flash-free contacts on a semiconductor package
TW567601B (en) 2002-10-18 2003-12-21 Siliconware Precision Industries Co Ltd Module device of stacked semiconductor package and method for fabricating the same
TWI221664B (en) 2002-11-07 2004-10-01 Via Tech Inc Structure of chip package and process thereof
JP2004172157A (ja) 2002-11-15 2004-06-17 Shinko Electric Ind Co Ltd 半導体パッケージおよびパッケージスタック半導体装置
JP2004172477A (ja) 2002-11-21 2004-06-17 Kaijo Corp ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法及び半導体製造装置
JP4464041B2 (ja) 2002-12-13 2010-05-19 キヤノン株式会社 柱状構造体、柱状構造体を有する電極、及びこれらの作製方法
KR100621991B1 (ko) 2003-01-03 2006-09-13 삼성전자주식회사 칩 스케일 적층 패키지
JP2004221257A (ja) 2003-01-14 2004-08-05 Seiko Epson Corp ワイヤボンディング方法及びワイヤボンディング装置
JP2006518944A (ja) 2003-02-25 2006-08-17 テッセラ，インコーポレイテッド バンプを有するボールグリッドアレー
TW583757B (en) 2003-02-26 2004-04-11 Advanced Semiconductor Eng A structure of a flip-chip package and a process thereof
US20040217471A1 (en) 2003-02-27 2004-11-04 Tessera, Inc. Component and assemblies with ends offset downwardly
JP3885747B2 (ja) 2003-03-13 2007-02-28 株式会社デンソー ワイヤボンディング方法
JP2004343030A (ja) 2003-03-31 2004-12-02 North:Kk 配線回路基板とその製造方法とその配線回路基板を備えた回路モジュール
JP2004319892A (ja) 2003-04-18 2004-11-11 Renesas Technology Corp 半導体装置の製造方法
JP4199588B2 (ja) 2003-04-25 2008-12-17 テセラ・インターコネクト・マテリアルズ，インコーポレイテッド 配線回路基板の製造方法、及び、この配線回路基板を用いた半導体集積回路装置の製造方法
JP2004327855A (ja) 2003-04-25 2004-11-18 Nec Electronics Corp 半導体装置およびその製造方法
DE10320646A1 (de) 2003-05-07 2004-09-16 Infineon Technologies Ag Elektronisches Bauteil, sowie Systemträger und Nutzen zur Herstellung desselben
JP4145730B2 (ja) 2003-06-17 2008-09-03 松下電器産業株式会社 半導体内蔵モジュール
US20040262728A1 (en) 2003-06-30 2004-12-30 Sterrett Terry L. Modular device assemblies
KR100604821B1 (ko) 2003-06-30 2006-07-26 삼성전자주식회사 적층형 볼 그리드 어레이 패키지 및 그 제조방법
JP2005033141A (ja) 2003-07-11 2005-02-03 Sony Corp 半導体装置及びその製造方法、疑似ウェーハ及びその製造方法、並びに半導体装置の実装構造
US7227095B2 (en) 2003-08-06 2007-06-05 Micron Technology, Inc. Wire bonders and methods of wire-bonding
KR100537892B1 (ko) * 2003-08-26 2005-12-21 삼성전자주식회사 칩 스택 패키지와 그 제조 방법
KR100546374B1 (ko) 2003-08-28 2006-01-26 삼성전자주식회사 센터 패드를 갖는 적층형 반도체 패키지 및 그 제조방법
US7372151B1 (en) 2003-09-12 2008-05-13 Asat Ltd. Ball grid array package and process for manufacturing same
US7061096B2 (en) 2003-09-24 2006-06-13 Silicon Pipe, Inc. Multi-surface IC packaging structures and methods for their manufacture
WO2005031861A1 (en) 2003-09-26 2005-04-07 Tessera, Inc. Structure and method of making capped chips including a flowable conductive medium
US7462936B2 (en) 2003-10-06 2008-12-09 Tessera, Inc. Formation of circuitry with modification of feature height
JP4272968B2 (ja) 2003-10-16 2009-06-03 エルピーダメモリ株式会社 半導体装置および半導体チップ制御方法
JP4167965B2 (ja) 2003-11-07 2008-10-22 テセラ・インターコネクト・マテリアルズ，インコーポレイテッド 配線回路用部材の製造方法
KR100564585B1 (ko) 2003-11-13 2006-03-28 삼성전자주식회사 이중 스택된 ｂｇａ 패키지 및 다중 스택된 ｂｇａ 패키지
TWI227555B (en) 2003-11-17 2005-02-01 Advanced Semiconductor Eng Structure of chip package and the process thereof
KR100621992B1 (ko) 2003-11-19 2006-09-13 삼성전자주식회사 이종 소자들의 웨이퍼 레벨 적층 구조와 방법 및 이를이용한 시스템-인-패키지
JP2005183923A (ja) 2003-11-28 2005-07-07 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
US7345361B2 (en) 2003-12-04 2008-03-18 Intel Corporation Stackable integrated circuit packaging
JP2005175019A (ja) 2003-12-08 2005-06-30 Sharp Corp 半導体装置及び積層型半導体装置
US8970049B2 (en) 2003-12-17 2015-03-03 Chippac, Inc. Multiple chip package module having inverted package stacked over die
DE10360708B4 (de) 2003-12-19 2008-04-10 Infineon Technologies Ag Halbleitermodul mit einem Halbleiterstapel, Umverdrahtungsplatte, und Verfahren zur Herstellung derselben
JP4334996B2 (ja) 2003-12-24 2009-09-30 株式会社フジクラ 多層配線板用基材、両面配線板およびそれらの製造方法
US7495644B2 (en) 2003-12-26 2009-02-24 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing display device
US6917098B1 (en) 2003-12-29 2005-07-12 Texas Instruments Incorporated Three-level leadframe for no-lead packages
US6900530B1 (en) 2003-12-29 2005-05-31 Ramtek Technology, Inc. Stacked IC
US8207604B2 (en) 2003-12-30 2012-06-26 Tessera, Inc. Microelectronic package comprising offset conductive posts on compliant layer
WO2005065207A2 (en) 2003-12-30 2005-07-21 Tessera, Inc. Microelectronic packages and methods therefor
US7709968B2 (en) 2003-12-30 2010-05-04 Tessera, Inc. Micro pin grid array with pin motion isolation
JP2005203497A (ja) 2004-01-14 2005-07-28 Toshiba Corp 半導体装置およびその製造方法
US20050173807A1 (en) 2004-02-05 2005-08-11 Jianbai Zhu High density vertically stacked semiconductor device
US8399972B2 (en) 2004-03-04 2013-03-19 Skyworks Solutions, Inc. Overmolded semiconductor package with a wirebond cage for EMI shielding
US7095105B2 (en) 2004-03-23 2006-08-22 Texas Instruments Incorporated Vertically stacked semiconductor device
JP4484035B2 (ja) 2004-04-06 2010-06-16 セイコーエプソン株式会社 半導体装置の製造方法
US8092734B2 (en) 2004-05-13 2012-01-10 Aptina Imaging Corporation Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers
US7629695B2 (en) 2004-05-20 2009-12-08 Kabushiki Kaisha Toshiba Stacked electronic component and manufacturing method thereof
US6962864B1 (en) 2004-05-26 2005-11-08 National Chung Cheng University Wire-bonding method for chips with copper interconnects by introducing a thin layer
US7233057B2 (en) 2004-05-28 2007-06-19 Nokia Corporation Integrated circuit package with optimized mold shape
TWI255022B (en) 2004-05-31 2006-05-11 Via Tech Inc Circuit carrier and manufacturing process thereof
US7453157B2 (en) 2004-06-25 2008-11-18 Tessera, Inc. Microelectronic packages and methods therefor
TWI250596B (en) * 2004-07-23 2006-03-01 Ind Tech Res Inst Wafer-level chip scale packaging method
JP4385329B2 (ja) 2004-10-08 2009-12-16 Ｏｋｉセミコンダクタ株式会社 半導体装置の製造方法
EP2014406A3 (de) 2004-11-02 2010-06-02 HID Global GmbH Verlegevorrichtung, Kontaktiervorrichtung, Zustellsystem, Verlege- und Kontaktiereinheit Herstellungsanlage, Verfahren zur herstellung und eine Transpondereinheit
WO2006052616A1 (en) 2004-11-03 2006-05-18 Tessera, Inc. Stacked packaging improvements
US7750483B1 (en) 2004-11-10 2010-07-06 Bridge Semiconductor Corporation Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal
US7268421B1 (en) 2004-11-10 2007-09-11 Bridge Semiconductor Corporation Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond
KR100674926B1 (ko) 2004-12-08 2007-01-26 삼성전자주식회사 메모리 카드 및 그 제조 방법
JP4504798B2 (ja) 2004-12-16 2010-07-14 パナソニック株式会社 多段構成半導体モジュール
JP2006186086A (ja) 2004-12-27 2006-07-13 Itoo:Kk プリント基板のはんだ付け方法およびブリッジ防止用ガイド板
DE102005006333B4 (de) 2005-02-10 2007-10-18 Infineon Technologies Ag Halbleiterbauteil mit mehreren Bondanschlüssen und gebondeten Kontaktelementen unterschiedlicher Metallzusammensetzung und Verfahren zur Herstellung desselben
DE102005006995B4 (de) 2005-02-15 2008-01-24 Infineon Technologies Ag Halbleiterbauteil mit Kunstoffgehäuse und Außenanschlüssen sowie Verfahren zur Herstellung desselben
KR100867038B1 (ko) * 2005-03-02 2008-11-04 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조방법
KR100630741B1 (ko) 2005-03-04 2006-10-02 삼성전자주식회사 다중 몰딩에 의한 적층형 반도체 패키지 및 그 제조방법
US7939934B2 (en) 2005-03-16 2011-05-10 Tessera, Inc. Microelectronic packages and methods therefor
US7371676B2 (en) 2005-04-08 2008-05-13 Micron Technology, Inc. Method for fabricating semiconductor components with through wire interconnects
TWI284394B (en) 2005-05-12 2007-07-21 Advanced Semiconductor Eng Lid used in package structure and the package structure of having the same
JP2006324553A (ja) 2005-05-20 2006-11-30 Renesas Technology Corp 半導体装置及びその製造方法
US7216794B2 (en) 2005-06-09 2007-05-15 Texas Instruments Incorporated Bond capillary design for ribbon wire bonding
JP4322844B2 (ja) 2005-06-10 2009-09-02 シャープ株式会社 半導体装置および積層型半導体装置
US20100078795A1 (en) 2005-07-01 2010-04-01 Koninklijke Philips Electronics, N.V. Electronic device
US7476608B2 (en) 2005-07-14 2009-01-13 Hewlett-Packard Development Company, L.P. Electrically connecting substrate with electrical device
TWI263313B (en) * 2005-08-15 2006-10-01 Phoenix Prec Technology Corp Stack structure of semiconductor component embedded in supporting board
SG130055A1 (en) 2005-08-19 2007-03-20 Micron Technology Inc Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
SG130066A1 (en) 2005-08-26 2007-03-20 Micron Technology Inc Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
JP5522561B2 (ja) 2005-08-31 2014-06-18 マイクロン テクノロジー， インク． マイクロ電子デバイスパッケージ、積重ね型マイクロ電子デバイスパッケージ、およびマイクロ電子デバイスを製造する方法
US7675152B2 (en) 2005-09-01 2010-03-09 Texas Instruments Incorporated Package-on-package semiconductor assembly
US7504716B2 (en) 2005-10-26 2009-03-17 Texas Instruments Incorporated Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking
US8810031B2 (en) * 2005-10-26 2014-08-19 Industrial Technology Research Institute Wafer-to-wafer stack with supporting pedestal
JP2007123595A (ja) 2005-10-28 2007-05-17 Nec Corp 半導体装置及びその実装構造
WO2007052199A1 (en) 2005-11-01 2007-05-10 Nxp B.V. Methods of packaging a semiconductor die and package formed by the methods
JP4530975B2 (ja) 2005-11-14 2010-08-25 株式会社新川 ワイヤボンディング方法
JP2007142042A (ja) 2005-11-16 2007-06-07 Sharp Corp 半導体パッケージとその製造方法，半導体モジュール，および電子機器
US7344917B2 (en) 2005-11-30 2008-03-18 Freescale Semiconductor, Inc. Method for packaging a semiconductor device
US7307348B2 (en) 2005-12-07 2007-12-11 Micron Technology, Inc. Semiconductor components having through wire interconnects (TWI)
US8058101B2 (en) 2005-12-23 2011-11-15 Tessera, Inc. Microelectronic packages and methods therefor
US7378726B2 (en) * 2005-12-28 2008-05-27 Intel Corporation Stacked packages with interconnecting pins
JP4530984B2 (ja) 2005-12-28 2010-08-25 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
US20070190747A1 (en) 2006-01-23 2007-08-16 Tessera Technologies Hungary Kft. Wafer level packaging to lidded chips
JP2007208159A (ja) 2006-02-06 2007-08-16 Hitachi Ltd 半導体装置
SG135074A1 (en) 2006-02-28 2007-09-28 Micron Technology Inc Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
JP2007234845A (ja) 2006-03-01 2007-09-13 Nec Corp 半導体装置
US7390700B2 (en) 2006-04-07 2008-06-24 Texas Instruments Incorporated Packaged system of semiconductor chips having a semiconductor interposer
US7759782B2 (en) 2006-04-07 2010-07-20 Tessera, Inc. Substrate for a microelectronic package and method of fabricating thereof
JP5598787B2 (ja) 2006-04-17 2014-10-01 マイクロンメモリジャパン株式会社 積層型半導体装置の製造方法
US7242081B1 (en) 2006-04-24 2007-07-10 Advanced Semiconductor Engineering Inc. Stacked package structure
US7659612B2 (en) 2006-04-24 2010-02-09 Micron Technology, Inc. Semiconductor components having encapsulated through wire interconnects (TWI)
US7780064B2 (en) 2006-06-02 2010-08-24 Asm Technology Singapore Pte Ltd Wire bonding method for forming low-loop profiles
JP4961848B2 (ja) 2006-06-12 2012-06-27 日本電気株式会社 金属ポストを有する配線基板、半導体装置及び半導体装置モジュールの製造方法
US7967062B2 (en) 2006-06-16 2011-06-28 International Business Machines Corporation Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof
US20070290325A1 (en) 2006-06-16 2007-12-20 Lite-On Semiconductor Corporation Surface mounting structure and packaging method thereof
CN101449375B (zh) 2006-06-29 2012-01-18 英特尔公司 用于集成电路封装中的无导线连接的设备、系统和方法
KR100792352B1 (ko) 2006-07-06 2008-01-08 삼성전기주식회사 패키지 온 패키지의 바텀기판 및 그 제조방법
KR100800478B1 (ko) 2006-07-18 2008-02-04 삼성전자주식회사 적층형 반도체 패키지 및 그의 제조방법
US20080023805A1 (en) 2006-07-26 2008-01-31 Texas Instruments Incorporated Array-Processed Stacked Semiconductor Packages
JP5132101B2 (ja) 2006-07-27 2013-01-30 新光電気工業株式会社 スタックパッケージ構造体及びその製造に用いる単体パッケージと、それらの製造方法
US8048479B2 (en) 2006-08-01 2011-11-01 Qimonda Ag Method for placing material onto a target board by means of a transfer board
JP2008039502A (ja) 2006-08-03 2008-02-21 Alps Electric Co Ltd 接触子およびその製造方法
US7486525B2 (en) 2006-08-04 2009-02-03 International Business Machines Corporation Temporary chip attach carrier
US7425758B2 (en) 2006-08-28 2008-09-16 Micron Technology, Inc. Metal core foldover package structures
KR20080020069A (ko) 2006-08-30 2008-03-05 삼성전자주식회사 반도체 패키지 및 그 제조방법
KR100891516B1 (ko) 2006-08-31 2009-04-06 주식회사 하이닉스반도체 적층 가능한 에프비지에이 타입 반도체 패키지와 이를이용한 적층 패키지
KR100770934B1 (ko) 2006-09-26 2007-10-26 삼성전자주식회사 반도체 패키지와 그를 이용한 반도체 시스템 패키지
TWI336502B (en) 2006-09-27 2011-01-21 Advanced Semiconductor Eng Semiconductor package and semiconductor device and the method of making the same
US7901989B2 (en) 2006-10-10 2011-03-08 Tessera, Inc. Reconstituted wafer level stacking
TWI312561B (en) 2006-10-27 2009-07-21 Advanced Semiconductor Eng Structure of package on package and method for fabricating the same
KR100817073B1 (ko) * 2006-11-03 2008-03-26 삼성전자주식회사 휨방지용 보강부재가 기판에 연결된 반도체 칩 스택 패키지
US8193034B2 (en) 2006-11-10 2012-06-05 Stats Chippac, Ltd. Semiconductor device and method of forming vertical interconnect structure using stud bumps
JP4274290B2 (ja) 2006-11-28 2009-06-03 国立大学法人九州工業大学 両面電極構造の半導体装置の製造方法
US8598717B2 (en) 2006-12-27 2013-12-03 Spansion Llc Semiconductor device and method for manufacturing the same
JP2008166439A (ja) 2006-12-27 2008-07-17 Spansion Llc 半導体装置およびその製造方法
KR100757345B1 (ko) 2006-12-29 2007-09-10 삼성전자주식회사 플립 칩 패키지 및 그의 제조 방법
US20080156518A1 (en) 2007-01-03 2008-07-03 Tessera, Inc. Alignment and cutting of microelectronic substrates
TWI332702B (en) 2007-01-09 2010-11-01 Advanced Semiconductor Eng Stackable semiconductor package and the method for making the same
JP5347222B2 (ja) 2007-01-10 2013-11-20 富士通株式会社 半導体装置の製造方法
US7719122B2 (en) 2007-01-11 2010-05-18 Taiwan Semiconductor Manufacturing Co., Ltd. System-in-package packaging for minimizing bond wire contamination and yield loss
KR100827667B1 (ko) * 2007-01-16 2008-05-07 삼성전자주식회사 기판 내에 반도체 칩을 갖는 반도체 패키지 및 이를제조하는 방법
JP5120266B6 (ja) 2007-01-31 2018-06-27 富士通セミコンダクター株式会社 半導体装置及びその製造方法
JP4823089B2 (ja) 2007-01-31 2011-11-24 株式会社東芝 積層型半導体装置の製造方法
US8685792B2 (en) 2007-03-03 2014-04-01 Stats Chippac Ltd. Integrated circuit package system with interposer
EP2575166A3 (en) 2007-03-05 2014-04-09 Invensas Corporation Chips having rear contacts connected by through vias to front contacts
US7517733B2 (en) 2007-03-22 2009-04-14 Stats Chippac, Ltd. Leadframe design for QFN package with top terminal leads
WO2008117488A1 (ja) 2007-03-23 2008-10-02 Sanyo Electric Co., Ltd 半導体装置およびその製造方法
TWI335070B (en) 2007-03-23 2010-12-21 Advanced Semiconductor Eng Semiconductor package and the method of making the same
US20100103634A1 (en) 2007-03-30 2010-04-29 Takuo Funaya Functional-device-embedded circuit board, method for manufacturing the same, and electronic equipment
JP4926787B2 (ja) 2007-03-30 2012-05-09 アオイ電子株式会社 半導体装置の製造方法
US7589394B2 (en) 2007-04-10 2009-09-15 Ibiden Co., Ltd. Interposer
JP5003260B2 (ja) 2007-04-13 2012-08-15 日本電気株式会社 半導体装置およびその製造方法
US7994622B2 (en) 2007-04-16 2011-08-09 Tessera, Inc. Microelectronic packages having cavities for receiving microelectric elements
KR20080094251A (ko) 2007-04-19 2008-10-23 삼성전자주식회사 웨이퍼 레벨 패키지 및 그 제조방법
JP5601751B2 (ja) 2007-04-26 2014-10-08 スパンション エルエルシー 半導体装置
US20080284045A1 (en) 2007-05-18 2008-11-20 Texas Instruments Incorporated Method for Fabricating Array-Molded Package-On-Package
JP2008306128A (ja) 2007-06-11 2008-12-18 Shinko Electric Ind Co Ltd 半導体装置およびその製造方法
KR100865125B1 (ko) 2007-06-12 2008-10-24 삼성전기주식회사 반도체 패키지 및 그 제조방법
TW200908819A (en) 2007-06-15 2009-02-16 Ngk Spark Plug Co Wiring substrate with reinforcing member
US7944034B2 (en) 2007-06-22 2011-05-17 Texas Instruments Incorporated Array molded package-on-package having redistribution lines
JP5179787B2 (ja) 2007-06-22 2013-04-10 ラピスセミコンダクタ株式会社 半導体装置及びその製造方法
US7911805B2 (en) 2007-06-29 2011-03-22 Tessera, Inc. Multilayer wiring element having pin interface
SG148901A1 (en) 2007-07-09 2009-01-29 Micron Technology Inc Packaged semiconductor assemblies and methods for manufacturing such assemblies
KR20090007120A (ko) 2007-07-13 2009-01-16 삼성전자주식회사 봉지부를 통하여 재배선을 달성하는 웨이퍼 레벨 적층형패키지 및 그 제조방법
US7781877B2 (en) * 2007-08-07 2010-08-24 Micron Technology, Inc. Packaged integrated circuit devices with through-body conductive vias, and methods of making same
JP2009044110A (ja) 2007-08-13 2009-02-26 Elpida Memory Inc 半導体装置及びその製造方法
SG150396A1 (en) 2007-08-16 2009-03-30 Micron Technology Inc Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods
JP2009064966A (ja) 2007-09-06 2009-03-26 Shinko Electric Ind Co Ltd 多層配線基板及びその製造方法ならびに半導体装置
US8039960B2 (en) 2007-09-21 2011-10-18 Stats Chippac, Ltd. Solder bump with inner core pillar in semiconductor package
JP2009088254A (ja) 2007-09-28 2009-04-23 Toshiba Corp 電子部品パッケージ及び電子部品パッケージの製造方法
EP2637202A3 (en) 2007-09-28 2014-03-12 Tessera, Inc. Flip chip interconnection with etched posts on a microelectronic element joined to etched posts on a substrate by a fusible metal and corresponding manufacturing method
US7777351B1 (en) 2007-10-01 2010-08-17 Amkor Technology, Inc. Thin stacked interposer package
KR20090033605A (ko) 2007-10-01 2009-04-06 삼성전자주식회사 적층형 반도체 패키지, 그 형성방법 및 이를 구비하는전자장치
US20090091009A1 (en) 2007-10-03 2009-04-09 Corisis David J Stackable integrated circuit package
US8008183B2 (en) 2007-10-04 2011-08-30 Texas Instruments Incorporated Dual capillary IC wirebonding
US7834464B2 (en) * 2007-10-09 2010-11-16 Infineon Technologies Ag Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
TWI360207B (en) 2007-10-22 2012-03-11 Advanced Semiconductor Eng Chip package structure and method of manufacturing
TWI389220B (zh) 2007-10-22 2013-03-11 矽品精密工業股份有限公司 半導體封裝件及其製法
FR2923081B1 (fr) * 2007-10-26 2009-12-11 3D Plus Procede d'interconnexion verticale de modules electroniques 3d par des vias.
JP2009123863A (ja) 2007-11-14 2009-06-04 Tessera Interconnect Materials Inc バンプ構造形成方法及びバンプ構造
US20090127686A1 (en) 2007-11-21 2009-05-21 Advanced Chip Engineering Technology Inc. Stacking die package structure for semiconductor devices and method of the same
JP2009135398A (ja) 2007-11-29 2009-06-18 Ibiden Co Ltd 組合せ基板
KR100886100B1 (ko) 2007-11-29 2009-02-27 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
US7902644B2 (en) 2007-12-07 2011-03-08 Stats Chippac Ltd. Integrated circuit package system for electromagnetic isolation
US7964956B1 (en) 2007-12-10 2011-06-21 Oracle America, Inc. Circuit packaging and connectivity
US8390117B2 (en) 2007-12-11 2013-03-05 Panasonic Corporation Semiconductor device and method of manufacturing the same
JP2009158593A (ja) 2007-12-25 2009-07-16 Tessera Interconnect Materials Inc バンプ構造およびその製造方法
US20090170241A1 (en) 2007-12-26 2009-07-02 Stats Chippac, Ltd. Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier
US20090166873A1 (en) * 2007-12-27 2009-07-02 Advanced Chip Engineering Technology Inc. Inter-connecting structure for semiconductor device package and method of the same
WO2009096950A1 (en) 2008-01-30 2009-08-06 Kulicke And Soffa Industries, Inc. Wire loop and method of forming the wire loop
US8120186B2 (en) 2008-02-15 2012-02-21 Qimonda Ag Integrated circuit and method
US8258015B2 (en) 2008-02-22 2012-09-04 Stats Chippac Ltd. Integrated circuit package system with penetrable film adhesive
US7956456B2 (en) 2008-02-27 2011-06-07 Texas Instruments Incorporated Thermal interface material design for enhanced thermal performance and improved package structural integrity
KR101501739B1 (ko) * 2008-03-21 2015-03-11 삼성전자주식회사 반도체 패키지 제조 방법
US7919871B2 (en) 2008-03-21 2011-04-05 Stats Chippac Ltd. Integrated circuit package system for stackable devices
US8072079B2 (en) * 2008-03-27 2011-12-06 Stats Chippac, Ltd. Through hole vias at saw streets including protrusions or recesses for interconnection
JP5043743B2 (ja) 2008-04-18 2012-10-10 ラピスセミコンダクタ株式会社 半導体装置の製造方法
US7741156B2 (en) * 2008-05-27 2010-06-22 Stats Chippac, Ltd. Semiconductor device and method of forming through vias with reflowed conductive material
KR20090123680A (ko) 2008-05-28 2009-12-02 주식회사 하이닉스반도체 적층 반도체 패키지
US8093704B2 (en) 2008-06-03 2012-01-10 Intel Corporation Package on package using a bump-less build up layer (BBUL) package
US8021907B2 (en) * 2008-06-09 2011-09-20 Stats Chippac, Ltd. Method and apparatus for thermally enhanced semiconductor package
EP2308087B1 (en) * 2008-06-16 2020-08-12 Tessera, Inc. Stacking of wafer-level chip scale packages having edge contacts
US7932170B1 (en) 2008-06-23 2011-04-26 Amkor Technology, Inc. Flip chip bump structure and fabrication method
US7969009B2 (en) * 2008-06-30 2011-06-28 Qualcomm Incorporated Through silicon via bridge interconnect
TWI473553B (zh) 2008-07-03 2015-02-11 日月光半導體製造股份有限公司 晶片封裝結構
US7859033B2 (en) 2008-07-09 2010-12-28 Eastman Kodak Company Wafer level processing for backside illuminated sensors
JP5339800B2 (ja) 2008-07-10 2013-11-13 三菱電機株式会社 半導体装置の製造方法
TWI372453B (en) 2008-09-01 2012-09-11 Advanced Semiconductor Eng Copper bonding wire, wire bonding structure and method for processing and bonding a wire
SG158823A1 (en) 2008-07-18 2010-02-26 United Test & Assembly Ct Ltd Packaging structural member
US8004093B2 (en) 2008-08-01 2011-08-23 Stats Chippac Ltd. Integrated circuit package stacking system
TW201007924A (en) 2008-08-07 2010-02-16 Advanced Semiconductor Eng Chip package structure
US20100044860A1 (en) 2008-08-21 2010-02-25 Tessera Interconnect Materials, Inc. Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer
KR100997793B1 (ko) * 2008-09-01 2010-12-02 주식회사 하이닉스반도체 반도체 패키지 및 이의 제조 방법
KR20100033012A (ko) 2008-09-19 2010-03-29 주식회사 하이닉스반도체 반도체 패키지 및 이를 갖는 적층 반도체 패키지
US7842541B1 (en) 2008-09-24 2010-11-30 Amkor Technology, Inc. Ultra thin package and fabrication method
US8237257B2 (en) * 2008-09-25 2012-08-07 King Dragon International Inc. Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same
US8063475B2 (en) 2008-09-26 2011-11-22 Stats Chippac Ltd. Semiconductor package system with through silicon via interposer
JPWO2010041630A1 (ja) 2008-10-10 2012-03-08 日本電気株式会社 半導体装置及びその製造方法
JP5185062B2 (ja) 2008-10-21 2013-04-17 パナソニック株式会社 積層型半導体装置及び電子機器
MY149251A (en) 2008-10-23 2013-07-31 Carsem M Sdn Bhd Wafer-level package using stud bump coated with solder
KR101461630B1 (ko) 2008-11-06 2014-11-20 삼성전자주식회사 실장 높이는 축소되나, 솔더 접합 신뢰도는 개선되는 웨이퍼 레벨 칩 온 칩 패키지와, 패키지 온 패키지 및 그 제조방법
TW201023308A (en) 2008-12-01 2010-06-16 Advanced Semiconductor Eng Package-on-package device, semiconductor package and method for manufacturing the same
KR101011863B1 (ko) 2008-12-02 2011-01-31 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
US7642128B1 (en) 2008-12-12 2010-01-05 Stats Chippac, Ltd. Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
US7898083B2 (en) 2008-12-17 2011-03-01 Texas Instruments Incorporated Method for low stress flip-chip assembly of fine-pitch semiconductor devices
US8012797B2 (en) 2009-01-07 2011-09-06 Advanced Semiconductor Engineering, Inc. Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries
TWI499024B (zh) 2009-01-07 2015-09-01 日月光半導體製造股份有限公司 堆疊式多封裝構造裝置、半導體封裝構造及其製造方法
JP2010199528A (ja) 2009-01-27 2010-09-09 Tatsuta System Electronics Kk ボンディングワイヤ
JP2010177597A (ja) 2009-01-30 2010-08-12 Sanyo Electric Co Ltd 半導体モジュールおよび携帯機器
US20100200981A1 (en) 2009-02-09 2010-08-12 Advanced Semiconductor Engineering, Inc. Semiconductor package and method of manufacturing the same
US9142586B2 (en) 2009-02-24 2015-09-22 Taiwan Semiconductor Manufacturing Company, Ltd. Pad design for backside illuminated image sensor
JP2010206007A (ja) 2009-03-04 2010-09-16 Nec Corp 半導体装置及びその製造方法
JPWO2010101163A1 (ja) 2009-03-04 2012-09-10 日本電気株式会社 機能素子内蔵基板及びそれを用いた電子デバイス
US8106498B2 (en) 2009-03-05 2012-01-31 Stats Chippac Ltd. Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereof
US8258010B2 (en) 2009-03-17 2012-09-04 Stats Chippac, Ltd. Making a semiconductor device having conductive through organic vias
US20100244276A1 (en) 2009-03-25 2010-09-30 Lsi Corporation Three-dimensional electronics package
US8194411B2 (en) * 2009-03-31 2012-06-05 Hong Kong Applied Science and Technology Research Institute Co. Ltd Electronic package with stacked modules with channels passing through metal layers of the modules
US20100289142A1 (en) 2009-05-15 2010-11-18 Il Kwon Shim Integrated circuit packaging system with coin bonded interconnects and method of manufacture thereof
US8020290B2 (en) 2009-06-14 2011-09-20 Jayna Sheats Processes for IC fabrication
TWI379367B (en) 2009-06-15 2012-12-11 Kun Yuan Technology Co Ltd Chip packaging method and structure thereof
US20100327419A1 (en) 2009-06-26 2010-12-30 Sriram Muthukumar Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
JP5214554B2 (ja) 2009-07-30 2013-06-19 ラピスセミコンダクタ株式会社 半導体チップ内蔵パッケージ及びその製造方法、並びに、パッケージ・オン・パッケージ型半導体装置及びその製造方法
US20110209908A1 (en) * 2009-08-06 2011-09-01 Advanced Chip Engineering Technology Inc. Conductor package structure and method of the same
US7923304B2 (en) 2009-09-10 2011-04-12 Stats Chippac Ltd. Integrated circuit packaging system with conductive pillars and method of manufacture thereof
US8264091B2 (en) 2009-09-21 2012-09-11 Stats Chippac Ltd. Integrated circuit packaging system with encapsulated via and method of manufacture thereof
US8390108B2 (en) 2009-12-16 2013-03-05 Stats Chippac Ltd. Integrated circuit packaging system with stacking interconnect and method of manufacture thereof
US8169065B2 (en) 2009-12-22 2012-05-01 Epic Technologies, Inc. Stackable circuit structures and methods of fabrication thereof
TWI392066B (zh) 2009-12-28 2013-04-01 矽品精密工業股份有限公司 封裝結構及其製法
US9496152B2 (en) 2010-03-12 2016-11-15 STATS ChipPAC Pte. Ltd. Carrier system with multi-tier conductive posts and method of manufacture thereof
US7928552B1 (en) 2010-03-12 2011-04-19 Stats Chippac Ltd. Integrated circuit packaging system with multi-tier conductive interconnects and method of manufacture thereof
KR101667656B1 (ko) * 2010-03-24 2016-10-20 삼성전자주식회사 패키지-온-패키지 형성방법
US8624374B2 (en) 2010-04-02 2014-01-07 Advanced Semiconductor Engineering, Inc. Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof
US8278746B2 (en) 2010-04-02 2012-10-02 Advanced Semiconductor Engineering, Inc. Semiconductor device packages including connecting elements
US8564141B2 (en) * 2010-05-06 2013-10-22 SK Hynix Inc. Chip unit and stack package having the same
US8217502B2 (en) 2010-06-08 2012-07-10 Stats Chippac Ltd. Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereof
US8330272B2 (en) 2010-07-08 2012-12-11 Tessera, Inc. Microelectronic packages with dual or multiple-etched flip-chip connectors
KR20120007839A (ko) 2010-07-15 2012-01-25 삼성전자주식회사 적층형 반도체 패키지의 제조방법
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
US8847376B2 (en) * 2010-07-23 2014-09-30 Tessera, Inc. Microelectronic elements with post-assembly planarization
KR101683814B1 (ko) * 2010-07-26 2016-12-08 삼성전자주식회사 관통 전극을 구비하는 반도체 장치
US8580607B2 (en) 2010-07-27 2013-11-12 Tessera, Inc. Microelectronic packages with nanoparticle joining
US8304900B2 (en) 2010-08-11 2012-11-06 Stats Chippac Ltd. Integrated circuit packaging system with stacked lead and method of manufacture thereof
US8518746B2 (en) * 2010-09-02 2013-08-27 Stats Chippac, Ltd. Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die
US20120063090A1 (en) 2010-09-09 2012-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Cooling mechanism for stacked die package and method of manufacturing the same
US8409922B2 (en) 2010-09-14 2013-04-02 Stats Chippac, Ltd. Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect
US20120080787A1 (en) 2010-10-05 2012-04-05 Qualcomm Incorporated Electronic Package and Method of Making an Electronic Package
US8618646B2 (en) 2010-10-12 2013-12-31 Headway Technologies, Inc. Layered chip package and method of manufacturing same
JP2012104790A (ja) 2010-10-12 2012-05-31 Elpida Memory Inc 半導体装置
CN102024782B (zh) * 2010-10-12 2012-07-25 北京大学 三维垂直互联结构及其制作方法
US8263435B2 (en) * 2010-10-28 2012-09-11 Stats Chippac, Ltd. Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias
US8697492B2 (en) 2010-11-02 2014-04-15 Tessera, Inc. No flow underfill
US8525318B1 (en) 2010-11-10 2013-09-03 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
KR101075241B1 (ko) 2010-11-15 2011-11-01 테세라, 인코포레이티드 유전체 부재에 단자를 구비하는 마이크로전자 패키지
US8502387B2 (en) 2010-12-09 2013-08-06 Stats Chippac Ltd. Integrated circuit packaging system with vertical interconnection and method of manufacture thereof
US8853558B2 (en) 2010-12-10 2014-10-07 Tessera, Inc. Interconnect structure
KR101215271B1 (ko) 2010-12-29 2012-12-26 앰코 테크놀로지 코리아 주식회사 반도체 패키지 구조물 및 반도체 패키지 구조물의 제조 방법
US20120184116A1 (en) 2011-01-18 2012-07-19 Tyco Electronics Corporation Interposer
US8618659B2 (en) 2011-05-03 2013-12-31 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
KR101128063B1 (ko) 2011-05-03 2012-04-23 테세라, 인코포레이티드 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리
US8476115B2 (en) 2011-05-03 2013-07-02 Stats Chippac, Ltd. Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material
US9006031B2 (en) * 2011-06-23 2015-04-14 Stats Chippac, Ltd. Semiconductor device and method of forming EWLB package with standoff conductive layer over encapsulant bumps
US8487421B2 (en) * 2011-08-01 2013-07-16 Tessera, Inc. Microelectronic package with stacked microelectronic elements and method for manufacture thereof
US8937309B2 (en) * 2011-08-08 2015-01-20 Micron Technology, Inc. Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
US20130037929A1 (en) 2011-08-09 2013-02-14 Kay S. Essig Stackable wafer level packages and related methods
US20130049218A1 (en) 2011-08-31 2013-02-28 Zhiwei Gong Semiconductor device packaging having pre-encapsulation through via formation
KR101800440B1 (ko) * 2011-08-31 2017-11-23 삼성전자주식회사 다수의 반도체 칩들을 가진 반도체 패키지 및 그 형성 방법
US9177832B2 (en) * 2011-09-16 2015-11-03 Stats Chippac, Ltd. Semiconductor device and method of forming a reconfigured stackable wafer level package with vertical interconnect
KR101906408B1 (ko) 2011-10-04 2018-10-11 삼성전자주식회사 반도체 패키지 및 그 제조 방법
US9105483B2 (en) 2011-10-17 2015-08-11 Invensas Corporation Package-on-package assembly with wire bond vias
US9105552B2 (en) 2011-10-31 2015-08-11 Taiwan Semiconductor Manufacturing Company, Ltd. Package on package devices and methods of packaging semiconductor dies
KR101297015B1 (ko) 2011-11-03 2013-08-14 주식회사 네패스 리드프레임을 이용한 팬-아웃 반도체 패키지 제조방법, 이에 의한 반도체 패키지 및 패키지 온 패키지
US8912651B2 (en) 2011-11-30 2014-12-16 Taiwan Semiconductor Manufacturing Company, Ltd. Package-on-package (PoP) structure including stud bulbs and method
US8680684B2 (en) 2012-01-09 2014-03-25 Invensas Corporation Stackable microelectronic package structures
US9258922B2 (en) 2012-01-18 2016-02-09 Taiwan Semiconductor Manufacturing Company, Ltd. PoP structures including through-assembly via modules
US9349706B2 (en) 2012-02-24 2016-05-24 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8372741B1 (en) 2012-02-24 2013-02-12 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US20130234317A1 (en) 2012-03-09 2013-09-12 Taiwan Semiconductor Manufacturing Company, Ltd. Packaging Methods and Packaged Semiconductor Devices
US9082763B2 (en) 2012-03-15 2015-07-14 Taiwan Semiconductor Manufacturing Company, Ltd. Joint structure for substrates and methods of forming
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9171790B2 (en) 2012-05-30 2015-10-27 Taiwan Semiconductor Manufacturing Company, Ltd. Package on package devices and methods of packaging semiconductor dies
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US8828860B2 (en) 2012-08-30 2014-09-09 International Business Machines Corporation Double solder bumps on substrates for low temperature flip chip bonding
KR101419597B1 (ko) 2012-11-06 2014-07-14 앰코 테크놀로지 코리아 주식회사 반도체 디바이스 및 그 제조 방법
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US8940630B2 (en) 2013-02-01 2015-01-27 Invensas Corporation Method of making wire bond vias and microelectronic package having wire bond vias
US9136254B2 (en) 2013-02-01 2015-09-15 Invensas Corporation Microelectronic package having wire bond vias and stiffening layer
US9299670B2 (en) * 2013-03-14 2016-03-29 Freescale Semiconductor, Inc. Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end

Also Published As

Publication number Publication date
EP2880684B1 (en) 2018-12-19
TW201411785A (zh) 2014-03-16
CN104685624B (zh) 2018-02-02
CN104685624A (zh) 2015-06-03
US9391008B2 (en) 2016-07-12
TWI538118B (zh) 2016-06-11
US9917073B2 (en) 2018-03-13
EP2880684A1 (en) 2015-06-10
WO2014022485A1 (en) 2014-02-06
US20140035153A1 (en) 2014-02-06
US20160307878A1 (en) 2016-10-20
JP2015523740A (ja) 2015-08-13

Similar Documents

Publication Publication Date Title
US7763963B2 (en) Stacked package semiconductor module having packages stacked in a cavity in the module substrate
US7687899B1 (en) Dual laminate package structure with embedded elements
US8110910B2 (en) Stack package
KR101024424B1 (ko) 마이크로일렉트로닉 장치 패키지, 적층 마이크로일렉트로닉장치 패키지, 및 마이크로일렉트로닉 장치 제조 방법
US7829990B1 (en) Stackable semiconductor package including laminate interposer
US9876002B2 (en) Microelectronic package with stacked microelectronic units and method for manufacture thereof
KR20170075125A (ko) 반도체 패키지 및 제조 방법
CN107731761A (zh) 底部半导体封装件及其制造方法
US9917073B2 (en) Reconstituted wafer-level package dram with conductive interconnects formed in encapsulant at periphery of the package
US20080258288A1 (en) Semiconductor device stack package, electronic apparatus including the same, and method of manufacturing the same
KR20010063236A (ko) 적층 패키지와 그 제조 방법
US12506099B2 (en) Semiconductor package and manufacturing method thereof
US20250391816A1 (en) Method of Forming Stacked Chip Packages Using Chip Couplers
KR100851108B1 (ko) 웨이퍼 레벨 시스템 인 패키지 및 그 제조 방법
KR20010073946A (ko) 딤플 방식의 측면 패드가 구비된 반도체 소자 및 그제조방법
KR20000072995A (ko) 적층형 반도체 칩 패키지와 그 제조 방법
KR20110038561A (ko) 멀티칩 모듈들을 위한 개선된 전기적 연결들

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000