JP2012104790A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2012104790A JP2012104790A JP2010280391A JP2010280391A JP2012104790A JP 2012104790 A JP2012104790 A JP 2012104790A JP 2010280391 A JP2010280391 A JP 2010280391A JP 2010280391 A JP2010280391 A JP 2010280391A JP 2012104790 A JP2012104790 A JP 2012104790A
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- Prior art keywords
- semiconductor device
- wiring board
- adhesive member
- semiconductor chip
- wiring
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 163
- 239000000853 adhesive Substances 0.000 claims abstract description 78
- 230000001070 adhesive effect Effects 0.000 claims abstract description 78
- 230000002093 peripheral effect Effects 0.000 claims abstract description 63
- 229910000679 solder Inorganic materials 0.000 description 46
- 239000000758 substrate Substances 0.000 description 25
- 238000007789 sealing Methods 0.000 description 20
- 238000000034 method Methods 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
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- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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Abstract
【解決手段】本発明の半導体装置は、配線基板2と、配線基板2の一面に接着部材10を介して搭載された半導体チップ3と、配線基板2の他面に形成され、半導体チップ3と電気的に接続された外部電極5とを有し、接着部材10の周端部10aが外部電極5と重ならない位置に配置されていることを特徴とする。
【選択図】図1
Description
図1は第1の実施例の半導体装置の概略構成を示す平面図で、図2はその断面図である。
次に、第2の実施例について説明するが、第1の実施例と同じ構成要素については同じ符号を用いることにする。図5は第2の実施例の半導体装置の概略構成を示す平面図、図6はその断面図である。
次に、第3の実施例について説明するが、第1の実施例と同じ構成要素については同じ符号を用いることにする。図9は第3の実施例の半導体装置の概略構成を示す平面図、図10はその断面図である。
次に、第4の実施例について説明するが、第1の実施例と同じ構成要素については同じ符号を用いることにする。図11は第4の実施例の半導体装置の概略構成を示す平面図である。図12の(a)は図11の半導体装置のコーナ部に対応する断面図、(b)はそのコーナ部以外の断面図である。
前記配線基板の一面に接着部材を介して搭載された半導体チップと、前記配線基板の他面に形成され、前記半導体チップと電気的に接続された外部電極とを有し、前記接着部材の周端部は前記外部電極と重ならない位置に配置されていることを特徴とする半導体装置。
2 配線基板
2a 開口部
2b 配線基板の外周端部
3 半導体チップ
3a 半導体チップの周端部
4 封止体
5 半田ボール
6 絶縁基材
7 絶縁膜
8 接続パッド
9 ランド
10 接着部材
10a 接着部材の周端部
11 電極パッド
12 導電性ワイヤ
13 製品形成部
14 ダイシングライン
15 印刷用マスク
15a 開口部
16 スキージ
17 ダイシングテープ
18 ダイシングブレード
Claims (6)
- 配線基板と、
前記配線基板の一面に接着部材を介して搭載された半導体チップと、
前記配線基板の他面に形成され、前記半導体チップと電気的に接続された外部電極とを有し、
前記接着部材の周端部は前記外部電極と重ならない位置に配置されていることを特徴とする半導体装置。 - 請求項1に記載の半導体装置であって、
前記接着部材の周端部が、前記半導体チップの周端部より外方に張り出すように配置されている半導体装置。 - 請求項1または2に記載の半導体装置であって、
前記外部電極は導電性のボールであり、かつ前記配線基板の他面に格子状に配設されている半導体装置。 - 請求項3に記載の半導体装置であって、
前記格子状に配設された導電性ボールの一群が占める領域のコーナ部に対応する、前記接着部材の周端部の部位が、前記配線基板の外周端部の近傍の位置に配されており、該コーナ部に対応する部位以外の前記接着部材の周端部が前記領域の内側に位置し、前記導電性ボールの間の位置に配置されている半導体装置。 - 請求項1乃至4のいずれか1項に記載の半導体装置であって、
前記半導体チップの、電極パッドを含む回路が形成された一面とは反対側の他面が前記配線基板の一面に接着されている半導体装置。 - 請求項1乃至4のいずれか1項に記載の半導体装置であって、
前記配線基板は前記配線基板の両面を貫通する開口部を有し、
電極パッドを含む回路が形成された前記半導体チップの一面における該電極パッドが前記開口部から露出するように、該一面が前記配線基板の一面に接着されている半導体装置。
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JP2010280391A JP2012104790A (ja) | 2010-10-12 | 2010-12-16 | 半導体装置 |
US12/976,220 US20120086111A1 (en) | 2010-10-12 | 2010-12-22 | Semiconductor device |
US14/279,852 US20140252613A1 (en) | 2010-10-12 | 2014-05-16 | Semiconductor device |
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