TWI437376B - A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method - Google Patents

A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method Download PDF

Info

Publication number
TWI437376B
TWI437376B TW098120060A TW98120060A TWI437376B TW I437376 B TWI437376 B TW I437376B TW 098120060 A TW098120060 A TW 098120060A TW 98120060 A TW98120060 A TW 98120060A TW I437376 B TWI437376 B TW I437376B
Authority
TW
Taiwan
Prior art keywords
stages
stage
liquid immersion
immersion area
optical system
Prior art date
Application number
TW098120060A
Other languages
English (en)
Chinese (zh)
Other versions
TW200944963A (en
Inventor
柴崎祐一
Original Assignee
尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 尼康股份有限公司 filed Critical 尼康股份有限公司
Publication of TW200944963A publication Critical patent/TW200944963A/zh
Application granted granted Critical
Publication of TWI437376B publication Critical patent/TWI437376B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70653—Metrology techniques
    • G03F7/70666—Aerial image, i.e. measuring the image of the patterned exposure light at the image plane of the projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Liquid Crystal (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Eyeglasses (AREA)
  • Prostheses (AREA)
  • Optics & Photonics (AREA)
TW098120060A 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method TWI437376B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004025837 2004-02-02
JP2004300566 2004-10-14

Publications (2)

Publication Number Publication Date
TW200944963A TW200944963A (en) 2009-11-01
TWI437376B true TWI437376B (zh) 2014-05-11

Family

ID=34829444

Family Applications (14)

Application Number Title Priority Date Filing Date
TW098120060A TWI437376B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW107106822A TW201823875A (zh) 2004-02-02 2005-02-02 載台驅動方法及載台裝置、曝光裝置、及元件製造方法
TW098120058A TWI437375B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW104127655A TWI578114B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW098120057A TWI437374B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW106100843A TWI627511B (zh) 2004-02-02 2005-02-02 Stage driving method, stage device, exposure device, and component manufacturing method
TW098120061A TWI436170B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW103100487A TWI564673B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW104118470A TWI596440B (zh) 2004-02-02 2005-02-02 Stage driving method and stage apparatus, exposure apparatus, and device manufacturing method
TW094103146A TWI390358B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW098115103A TWI443475B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW101146582A TWI498680B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW101103185A TWI521312B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW101103186A TWI499870B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method

Family Applications After (13)

Application Number Title Priority Date Filing Date
TW107106822A TW201823875A (zh) 2004-02-02 2005-02-02 載台驅動方法及載台裝置、曝光裝置、及元件製造方法
TW098120058A TWI437375B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW104127655A TWI578114B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW098120057A TWI437374B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW106100843A TWI627511B (zh) 2004-02-02 2005-02-02 Stage driving method, stage device, exposure device, and component manufacturing method
TW098120061A TWI436170B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW103100487A TWI564673B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW104118470A TWI596440B (zh) 2004-02-02 2005-02-02 Stage driving method and stage apparatus, exposure apparatus, and device manufacturing method
TW094103146A TWI390358B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW098115103A TWI443475B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW101146582A TWI498680B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW101103185A TWI521312B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
TW101103186A TWI499870B (zh) 2004-02-02 2005-02-02 A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method

Country Status (11)

Country Link
US (15) US7589822B2 (enExample)
EP (9) EP2980834B1 (enExample)
JP (16) JP4910394B2 (enExample)
KR (16) KR101476015B1 (enExample)
CN (1) CN101685263B (enExample)
AT (1) ATE493753T1 (enExample)
DE (1) DE602005025596D1 (enExample)
IL (7) IL226838A (enExample)
SG (5) SG185343A1 (enExample)
TW (14) TWI437376B (enExample)
WO (1) WO2005074014A1 (enExample)

Families Citing this family (198)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG121822A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US10503084B2 (en) 2002-11-12 2019-12-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9482966B2 (en) 2002-11-12 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
SG139733A1 (en) 2003-04-11 2008-02-29 Nikon Corp Apparatus having an immersion fluid system configured to maintain immersion fluid in a gap adjacent an optical assembly
TWI543235B (zh) * 2003-06-19 2016-07-21 尼康股份有限公司 A method of manufacturing an exposure apparatus and an element
SG145780A1 (en) * 2003-08-29 2008-09-29 Nikon Corp Exposure apparatus and device fabricating method
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US20070030467A1 (en) * 2004-02-19 2007-02-08 Nikon Corporation Exposure apparatus, exposure method, and device fabricating method
JP4220423B2 (ja) * 2004-03-24 2009-02-04 株式会社東芝 レジストパターン形成方法
WO2005093792A1 (ja) * 2004-03-25 2005-10-06 Nikon Corporation 露光装置及び露光方法、並びにデバイス製造方法
KR101245070B1 (ko) * 2004-06-21 2013-03-18 가부시키가이샤 니콘 노광 장치 및 그 부재의 세정 방법, 노광 장치의 메인터넌스 방법, 메인터넌스 기기, 그리고 디바이스 제조 방법
WO2006041100A1 (ja) 2004-10-15 2006-04-20 Nikon Corporation 露光装置及びデバイス製造方法
US7119876B2 (en) * 2004-10-18 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101318037B1 (ko) * 2004-11-01 2013-10-14 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
TWI649790B (zh) * 2004-11-18 2019-02-01 日商尼康股份有限公司 位置測量方法、位置控制方法、測量方法、裝載方法、曝光方法及曝光裝置、及元件製造方法
KR20070100865A (ko) * 2004-12-06 2007-10-12 가부시키가이샤 니콘 기판 처리 방법, 노광 방법, 노광 장치 및 디바이스 제조방법
US7528931B2 (en) 2004-12-20 2009-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20070258068A1 (en) * 2005-02-17 2007-11-08 Hiroto Horikawa Exposure Apparatus, Exposure Method, and Device Fabricating Method
USRE43576E1 (en) * 2005-04-08 2012-08-14 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
WO2006118258A1 (ja) 2005-04-28 2006-11-09 Nikon Corporation 露光方法及び露光装置、並びにデバイス製造方法
WO2007018127A1 (ja) * 2005-08-05 2007-02-15 Nikon Corporation ステージ装置及び露光装置
SG170060A1 (en) * 2005-09-09 2011-04-29 Nikon Corp Exposure apparatus, exposure method, and device production method
US7633073B2 (en) 2005-11-23 2009-12-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7871933B2 (en) * 2005-12-01 2011-01-18 International Business Machines Corporation Combined stepper and deposition tool
US8953148B2 (en) 2005-12-28 2015-02-10 Nikon Corporation Exposure apparatus and making method thereof
EP1975982A1 (en) 2005-12-28 2008-10-01 Nikon Corporation Pattern formation method and pattern formation apparatus, exposure metho and exposure apparatus, and device manufacturing method
WO2007080523A1 (en) * 2006-01-10 2007-07-19 Koninklijke Philips Electronics N.V. Maglev object positioning apparatus and method for positioning an object and maintaining position with high stability
EP1983555B1 (en) 2006-01-19 2014-05-28 Nikon Corporation Movable body drive method, movable body drive system, pattern formation method, pattern forming apparatus, exposure method, exposure apparatus and device manufacturing method
EP3267259A1 (en) 2006-02-21 2018-01-10 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
KR101495471B1 (ko) * 2006-02-21 2015-02-23 가부시키가이샤 니콘 패턴 형성 장치, 마크 검출 장치, 노광 장치, 패턴 형성 방법, 노광 방법 및 디바이스 제조 방법
JP5115859B2 (ja) 2006-02-21 2013-01-09 株式会社ニコン パターン形成装置、露光装置及び露光方法、並びにデバイス製造方法
JP5077770B2 (ja) 2006-03-07 2012-11-21 株式会社ニコン デバイス製造方法、デバイス製造システム及び測定検査装置
US7230676B1 (en) * 2006-03-13 2007-06-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7310132B2 (en) * 2006-03-17 2007-12-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7760324B2 (en) * 2006-03-20 2010-07-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI454859B (zh) 2006-03-30 2014-10-01 尼康股份有限公司 移動體裝置、曝光裝置與曝光方法以及元件製造方法
SG175671A1 (en) 2006-05-18 2011-11-28 Nikon Corp Exposure method and apparatus, maintenance method and device manufacturing method
CN102109773A (zh) 2006-05-22 2011-06-29 株式会社尼康 曝光方法、曝光装置以及维修方法
KR20090023331A (ko) 2006-05-23 2009-03-04 가부시키가이샤 니콘 메인터넌스 방법, 노광 방법 및 장치, 그리고 디바이스 제조 방법
WO2007139017A1 (ja) * 2006-05-29 2007-12-06 Nikon Corporation 液体回収部材、基板保持部材、露光装置、及びデバイス製造方法
EP2037487A4 (en) 2006-06-09 2014-07-02 Nikon Corp APPARATUS WITH MOBILE BODY, APPARATUS AND METHOD FOR EXPOSURE, AND METHOD FOR MANUFACTURING DEVICES
CN100456138C (zh) * 2006-06-13 2009-01-28 上海微电子装备有限公司 浸没式光刻机浸液流场维持系统
WO2008001871A1 (en) 2006-06-30 2008-01-03 Nikon Corporation Maintenance method, exposure method and apparatus and device manufacturing method
US8570484B2 (en) * 2006-08-30 2013-10-29 Nikon Corporation Immersion exposure apparatus, device manufacturing method, cleaning method, and cleaning member to remove foreign substance using liquid
EP2990872B1 (en) 2006-08-31 2017-12-13 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
EP2071611B1 (en) 2006-08-31 2019-05-01 Nikon Corporation Mobile body drive system and mobile body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision method
KR101585370B1 (ko) 2006-08-31 2016-01-14 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법
TWI622084B (zh) 2006-09-01 2018-04-21 Nikon Corp Mobile body driving method, moving body driving system, pattern forming method and device, exposure method and device, component manufacturing method, and correction method
CN101405837B (zh) 2006-09-01 2012-08-29 株式会社尼康 移动体驱动方法、图案形成方法、曝光方法以及组件制造方法
US7872730B2 (en) * 2006-09-15 2011-01-18 Nikon Corporation Immersion exposure apparatus and immersion exposure method, and device manufacturing method
KR101419196B1 (ko) 2006-09-29 2014-07-15 가부시키가이샤 니콘 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
US20080158531A1 (en) * 2006-11-15 2008-07-03 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP5055971B2 (ja) 2006-11-16 2012-10-24 株式会社ニコン 表面処理方法及び表面処理装置、露光方法及び露光装置、並びにデバイス製造方法
US7973910B2 (en) * 2006-11-17 2011-07-05 Nikon Corporation Stage apparatus and exposure apparatus
JP5089143B2 (ja) * 2006-11-20 2012-12-05 キヤノン株式会社 液浸露光装置
US20080156356A1 (en) 2006-12-05 2008-07-03 Nikon Corporation Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus, and device fabricating method
JP2009033111A (ja) * 2007-05-28 2009-02-12 Nikon Corp 露光装置、デバイス製造方法、洗浄装置、及びクリーニング方法並びに露光方法
US8164736B2 (en) 2007-05-29 2012-04-24 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
US7737515B2 (en) * 2007-06-20 2010-06-15 New Jersey Institute Of Technology Method of assembly using array of programmable magnets
JP5630634B2 (ja) * 2007-07-13 2014-11-26 株式会社ニコン 露光方法及び装置、並びにデバイス製造方法
US9025126B2 (en) 2007-07-31 2015-05-05 Nikon Corporation Exposure apparatus adjusting method, exposure apparatus, and device fabricating method
US8421994B2 (en) 2007-09-27 2013-04-16 Nikon Corporation Exposure apparatus
US8279399B2 (en) * 2007-10-22 2012-10-02 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
WO2009060585A1 (ja) * 2007-11-07 2009-05-14 Nikon Corporation 露光装置及び露光方法、並びにデバイス製造方法
SG185261A1 (en) 2007-12-11 2012-11-29 Nikon Corp Movable body apparatus, exposure apparatus and pattern formation apparatus, and device manufacturing method
US20090153824A1 (en) * 2007-12-17 2009-06-18 Kla-Tencor Corporation Multiple chuck scanning stage
US8964166B2 (en) 2007-12-17 2015-02-24 Nikon Corporation Stage device, exposure apparatus and method of producing device
KR20100102580A (ko) * 2007-12-17 2010-09-24 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
TWI547769B (zh) * 2007-12-28 2016-09-01 尼康股份有限公司 An exposure apparatus, a moving body driving system, a pattern forming apparatus, and an exposure method, and an element manufacturing method
US8237916B2 (en) * 2007-12-28 2012-08-07 Nikon Corporation Movable body drive system, pattern formation apparatus, exposure apparatus and exposure method, and device manufacturing method
US8269945B2 (en) * 2007-12-28 2012-09-18 Nikon Corporation Movable body drive method and apparatus, exposure method and apparatus, pattern formation method and apparatus, and device manufacturing method
JP5369443B2 (ja) 2008-02-05 2013-12-18 株式会社ニコン ステージ装置、露光装置、露光方法、及びデバイス製造方法
KR20100124245A (ko) 2008-02-08 2010-11-26 가부시키가이샤 니콘 위치 계측 시스템 및 위치 계측 방법, 이동체 장치, 이동체 구동 방법, 노광 장치 및 노광 방법, 패턴 형성 장치, 그리고 디바이스 제조 방법
JP2009218564A (ja) * 2008-02-12 2009-09-24 Canon Inc 露光装置及びデバイス製造方法
US20100039628A1 (en) * 2008-03-19 2010-02-18 Nikon Corporation Cleaning tool, cleaning method, and device fabricating method
US8358401B2 (en) 2008-04-11 2013-01-22 Nikon Corporation Stage apparatus, exposure apparatus and device manufacturing method
US8654306B2 (en) * 2008-04-14 2014-02-18 Nikon Corporation Exposure apparatus, cleaning method, and device fabricating method
US8817236B2 (en) 2008-05-13 2014-08-26 Nikon Corporation Movable body system, movable body drive method, pattern formation apparatus, pattern formation method, exposure apparatus, exposure method, and device manufacturing method
US8228482B2 (en) 2008-05-13 2012-07-24 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8786829B2 (en) 2008-05-13 2014-07-22 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
CN102037312B (zh) * 2008-05-22 2014-01-22 麦克罗尼克迈达塔有限责任公司 用于工件上先后形成的层之间的重叠补偿的方法和装置
US9176393B2 (en) * 2008-05-28 2015-11-03 Asml Netherlands B.V. Lithographic apparatus and a method of operating the apparatus
US20100165309A1 (en) * 2008-07-10 2010-07-01 Nikon Corporation Deformation measuring apparatus, exposure apparatus, jig for the deformation measuring apparatus, position measuring method and device fabricating method
JPWO2010050240A1 (ja) * 2008-10-31 2012-03-29 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
EP2189849B1 (en) 2008-11-21 2015-12-16 ASML Netherlands B.V. A lithographic apparatus provided with a swap bridge
EP2196857A3 (en) 2008-12-09 2010-07-21 ASML Netherlands BV Lithographic apparatus and device manufacturing method
US9062260B2 (en) 2008-12-10 2015-06-23 Chevron U.S.A. Inc. Removing unstable sulfur compounds from crude oil
US8902402B2 (en) * 2008-12-19 2014-12-02 Nikon Corporation Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
US8760629B2 (en) * 2008-12-19 2014-06-24 Nikon Corporation Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body
US8773635B2 (en) * 2008-12-19 2014-07-08 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8599359B2 (en) 2008-12-19 2013-12-03 Nikon Corporation Exposure apparatus, exposure method, device manufacturing method, and carrier method
US8896806B2 (en) * 2008-12-29 2014-11-25 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US20100196832A1 (en) * 2009-01-30 2010-08-05 Nikon Corporation Exposure apparatus, exposing method, liquid immersion member and device fabricating method
WO2010103822A1 (ja) 2009-03-10 2010-09-16 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
US8202671B2 (en) 2009-04-28 2012-06-19 Nikon Corporation Protective apparatus, mask, mask forming apparatus, mask forming method, exposure apparatus, device fabricating method, and foreign matter detecting apparatus
WO2010125813A1 (ja) * 2009-04-30 2010-11-04 株式会社ニコン 露光方法及びデバイス製造方法、並びに重ね合わせ誤差計測方法
TW201115047A (en) * 2009-05-07 2011-05-01 Nikon Corp Vibration control apparatus, vibration control method, exposure apparatus, and device manufacturing method
WO2010131490A1 (ja) 2009-05-15 2010-11-18 株式会社ニコン 露光装置及びデバイス製造方法
US20100323303A1 (en) * 2009-05-15 2010-12-23 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, and device fabricating method
US8970820B2 (en) 2009-05-20 2015-03-03 Nikon Corporation Object exchange method, exposure method, carrier system, exposure apparatus, and device manufacturing method
US8792084B2 (en) * 2009-05-20 2014-07-29 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
IT1399285B1 (it) * 2009-07-03 2013-04-11 Applied Materials Inc Sistema di lavorazione substrato
KR101670640B1 (ko) * 2009-08-07 2016-10-28 가부시키가이샤 니콘 이동체 장치, 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
US20110032495A1 (en) 2009-08-07 2011-02-10 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8514395B2 (en) 2009-08-25 2013-08-20 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US8493547B2 (en) 2009-08-25 2013-07-23 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US20110102761A1 (en) * 2009-09-28 2011-05-05 Nikon Corporation Stage apparatus, exposure apparatus, and device fabricating method
US20110096306A1 (en) * 2009-09-28 2011-04-28 Nikon Corporation Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method
US20110096318A1 (en) * 2009-09-28 2011-04-28 Nikon Corporation Exposure apparatus and device fabricating method
US20110096312A1 (en) * 2009-09-28 2011-04-28 Nikon Corporation Exposure apparatus and device fabricating method
US20110199591A1 (en) * 2009-10-14 2011-08-18 Nikon Corporation Exposure apparatus, exposing method, maintenance method and device fabricating method
TWI603155B (zh) 2009-11-09 2017-10-21 尼康股份有限公司 曝光裝置、曝光方法、曝光裝置之維修方法、曝光裝置之調整方法、以及元件製造方法
US20110123913A1 (en) * 2009-11-19 2011-05-26 Nikon Corporation Exposure apparatus, exposing method, and device fabricating method
US20110128523A1 (en) * 2009-11-19 2011-06-02 Nikon Corporation Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method
DE102009054653A1 (de) * 2009-12-15 2011-06-16 Carl Zeiss Smt Gmbh Spiegel für den EUV-Wellenlängenbereich, Substrat für einen solchen Spiegel, Verwendung einer Quarzschicht für ein solches Substrat, Projektionsobjektiv für die Mikrolithographie mit einem solchen Spiegel oder einem solchen Substrat und Projetktionsbelichtungsanlage für die Mikrolithographie mit einem solchen Projektionsobjektiv
KR20120112615A (ko) 2009-12-28 2012-10-11 가부시키가이샤 니콘 액침 부재, 액침 부재의 제조 방법, 노광 장치, 및 디바이스 제조 방법
CN102714141B (zh) 2010-01-08 2016-03-23 株式会社尼康 液浸构件、曝光装置、曝光方法及元件制造方法
JP2011156678A (ja) * 2010-01-29 2011-08-18 Sony Corp ３次元造形装置、３次元造形物の製造方法及び３次元造形物
KR20120116329A (ko) 2010-02-20 2012-10-22 가부시키가이샤 니콘 광원 최적화 방법, 노광 방법, 디바이스 제조 방법, 프로그램, 노광 장치, 리소그래피 시스템, 광원 평가 방법 및 광원 변조 방법
US20110222031A1 (en) * 2010-03-12 2011-09-15 Nikon Corporation Liquid immersion member, exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
NL2006506A (en) * 2010-04-28 2011-10-31 Asml Netherlands Bv A component of an immersion system, an immersion lithographic apparatus and a device manufacturing method.
US20120013864A1 (en) 2010-07-14 2012-01-19 Nikon Corporation Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
US8937703B2 (en) 2010-07-14 2015-01-20 Nikon Corporation Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
US20120013863A1 (en) 2010-07-14 2012-01-19 Nikon Corporation Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
US20120012191A1 (en) 2010-07-16 2012-01-19 Nikon Corporation Liquid recovery apparatus, exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
US20120019804A1 (en) 2010-07-23 2012-01-26 Nikon Corporation Cleaning method, cleaning apparatus, device fabricating method, program, and storage medium
US20120019803A1 (en) 2010-07-23 2012-01-26 Nikon Corporation Cleaning method, liquid immersion member, immersion exposure apparatus, device fabricating method, program, and storage medium
US20120019802A1 (en) 2010-07-23 2012-01-26 Nikon Corporation Cleaning method, immersion exposure apparatus, device fabricating method, program, and storage medium
US8418773B2 (en) 2010-09-10 2013-04-16 Jason Cerrano Fire-fighting control system
JP5510299B2 (ja) * 2010-12-13 2014-06-04 ウシオ電機株式会社 露光装置および露光方法
EP2469339B1 (en) * 2010-12-21 2017-08-30 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US20120162619A1 (en) 2010-12-27 2012-06-28 Nikon Corporation Liquid immersion member, immersion exposure apparatus, exposing method, device fabricating method, program, and storage medium
US20120188521A1 (en) 2010-12-27 2012-07-26 Nikon Corporation Cleaning method, liquid immersion member, immersion exposure apparatus, device fabricating method, program and storage medium
US9030057B2 (en) 2011-06-24 2015-05-12 Nikon Corporation Method and apparatus to allow a plurality of stages to operate in close proximity
US20130016329A1 (en) 2011-07-12 2013-01-17 Nikon Corporation Exposure apparatus, exposure method, measurement method, and device manufacturing method
US9329496B2 (en) 2011-07-21 2016-05-03 Nikon Corporation Exposure apparatus, exposure method, method of manufacturing device, program, and storage medium
US9256137B2 (en) 2011-08-25 2016-02-09 Nikon Corporation Exposure apparatus, liquid holding method, and device manufacturing method
US20130050666A1 (en) 2011-08-26 2013-02-28 Nikon Corporation Exposure apparatus, liquid holding method, and device manufacturing method
US8794610B2 (en) * 2011-09-20 2014-08-05 Mitutoyo Corporation Two-dimension precision transfer equipment, three-dimension precision transfer equipment, and coordinate measuring machine
NL2009345A (en) * 2011-09-28 2013-04-02 Asml Netherlands Bv Method of applying a pattern to a substrate, device manufacturing method and lithographic apparatus for use in such methods.
WO2013073538A1 (ja) 2011-11-17 2013-05-23 株式会社ニコン エンコーダ装置、移動量計測方法、光学装置、並びに露光方法及び装置
US20130135594A1 (en) 2011-11-25 2013-05-30 Nikon Corporation Liquid immersion member, immersion exposure apparatus, exposure method, device manufacturing method, program, and recording medium
US20130169944A1 (en) 2011-12-28 2013-07-04 Nikon Corporation Exposure apparatus, exposure method, device manufacturing method, program, and recording medium
US9207549B2 (en) 2011-12-29 2015-12-08 Nikon Corporation Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement
CN103199046B (zh) * 2012-01-05 2015-09-09 沈阳新松机器人自动化股份有限公司 晶圆缺口边缘中心预对准方法
US9268231B2 (en) 2012-04-10 2016-02-23 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
US9323160B2 (en) 2012-04-10 2016-04-26 Nikon Corporation Liquid immersion member, exposure apparatus, exposure method, device fabricating method, program, and recording medium
CN104364881A (zh) * 2012-04-13 2015-02-18 株式会社尼康 移动体装置、曝光装置以及器件制造方法
US9823580B2 (en) 2012-07-20 2017-11-21 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
WO2014054690A1 (ja) 2012-10-02 2014-04-10 株式会社ニコン 露光装置及び露光方法、並びにデバイス製造方法
US9568828B2 (en) 2012-10-12 2017-02-14 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
US9494870B2 (en) 2012-10-12 2016-11-15 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
US9772564B2 (en) * 2012-11-12 2017-09-26 Nikon Corporation Exposure apparatus and exposure method, and device manufacturing method
WO2014080957A1 (ja) 2012-11-20 2014-05-30 株式会社ニコン 露光装置、移動体装置、及びデバイス製造方法
EP3866184B1 (en) 2012-11-30 2024-10-09 Nikon Corporation Carrier system, exposure apparatus and carry-in method
KR101450713B1 (ko) * 2012-12-05 2014-10-16 세메스 주식회사 기판 처리 장치
WO2014096299A1 (en) * 2012-12-20 2014-06-26 Asml Netherlands B.V. Lithographic apparatus and table for use in such an apparatus
US9720331B2 (en) 2012-12-27 2017-08-01 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
US9651873B2 (en) 2012-12-27 2017-05-16 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
JP6119242B2 (ja) 2012-12-27 2017-04-26 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
US9352073B2 (en) 2013-01-22 2016-05-31 Niko Corporation Functional film
US9057955B2 (en) 2013-01-22 2015-06-16 Nikon Corporation Functional film, liquid immersion member, method of manufacturing liquid immersion member, exposure apparatus, and device manufacturing method
JP5979302B2 (ja) 2013-02-28 2016-08-24 株式会社ニコン 摺動膜、摺動膜が形成された部材、及びその製造方法
JP5344105B1 (ja) 2013-03-08 2013-11-20 ウシオ電機株式会社 光配向用偏光光照射装置及び光配向用偏光光照射方法
JP6178092B2 (ja) * 2013-03-28 2017-08-09 株式会社荏原製作所 ステージ装置及び電子線応用装置
KR101794744B1 (ko) 2013-08-14 2017-12-01 에프이아이 컴파니 하전 입자 비임 시스템용 회로 프로브
WO2015052781A1 (ja) 2013-10-08 2015-04-16 株式会社ニコン 液浸部材、露光装置及び露光方法、並びにデバイス製造方法
US9927726B2 (en) * 2013-10-09 2018-03-27 Asml Netherlands B.V. Polarization independent interferometer
US20150187540A1 (en) * 2013-12-27 2015-07-02 Canon Kabushiki Kaisha Drawing apparatus and method of manufacturing article
JP6481242B2 (ja) * 2014-10-29 2019-03-13 新シコー科技株式会社 レンズ駆動装置、カメラ装置及び電子機器
CN107278279B (zh) 2015-02-23 2020-07-03 株式会社尼康 基板处理系统及基板处理方法、以及组件制造方法
CN111158220A (zh) 2015-02-23 2020-05-15 株式会社尼康 测量装置及方法、光刻系统、曝光装置及方法
TWI693477B (zh) 2015-02-23 2020-05-11 日商尼康股份有限公司 測量裝置、微影系統及曝光裝置、以及元件製造方法
US9927723B2 (en) * 2015-03-24 2018-03-27 Applied Materials, Inc. Apparatus and methods for on-the-fly digital exposure image data modification
EP3291011B1 (en) 2015-03-25 2025-11-05 Nikon Corporation Layout method, mark detection method, exposure method, measurement device, exposure apparatus, and device manufacturing method
TW201643558A (zh) * 2015-03-31 2016-12-16 尼康股份有限公司 曝光裝置、平面顯示器之製造方法、元件製造方法、及曝光方法
JP6700932B2 (ja) * 2016-04-20 2020-05-27 キヤノン株式会社 検出装置、検出方法、プログラム、リソグラフィ装置、および物品製造方法
JP6353487B2 (ja) * 2016-05-26 2018-07-04 株式会社サーマプレシジョン 投影露光装置及びその投影露光方法
KR102488153B1 (ko) * 2016-05-31 2023-01-12 가부시키가이샤 니콘 마크 검출 장치 및 마크 검출 방법, 계측 장치, 노광 장치 및 노광 방법, 및, 디바이스 제조 방법
JP6929024B2 (ja) * 2016-07-06 2021-09-01 キヤノン株式会社 光学装置、露光装置及び物品の製造方法
KR102566162B1 (ko) * 2016-08-23 2023-08-10 삼성전자주식회사 웨이퍼 검사 장치 및 이를 이용한 웨이퍼 검사 방법
KR102556130B1 (ko) 2016-09-27 2023-07-14 가부시키가이샤 니콘 결정 방법 및 장치, 프로그램, 정보 기록 매체, 노광 장치, 레이아웃 정보 제공 방법, 레이아웃 방법, 마크 검출 방법, 노광 방법, 그리고 디바이스 제조 방법
WO2018141713A1 (en) * 2017-02-03 2018-08-09 Asml Netherlands B.V. Exposure apparatus
US11125814B2 (en) * 2017-02-22 2021-09-21 Sintokogio, Ltd. Test system
US10009119B1 (en) * 2017-03-06 2018-06-26 The Boeing Company Bandgap modulation for underwater communications and energy harvesting
CN119620563A (zh) 2017-07-14 2025-03-14 Asml荷兰有限公司 量测设备和衬底平台输送装置系统
JP6985102B2 (ja) * 2017-10-31 2021-12-22 株式会社ディスコ レーザー加工装置
JP7060995B2 (ja) * 2018-03-30 2022-04-27 キヤノン株式会社 ステージ装置、リソグラフィ装置、および物品の製造方法
CN112204707B (zh) * 2018-05-31 2024-07-23 应用材料公司 数字光刻系统的多基板处理
JP2020022010A (ja) * 2018-07-30 2020-02-06 キヤノン株式会社 清掃装置及び清掃方法
CN110773513B (zh) * 2018-07-30 2022-12-20 佳能株式会社 清洁设备和清洁设备的控制方法
CN110858551B (zh) * 2018-08-24 2025-02-14 禾宬科技有限公司 半导体清洗装置及方法
TWI721307B (zh) * 2018-09-21 2021-03-11 禾宬科技有限公司 半導體清洗裝置及方法
CN113490886A (zh) * 2019-02-28 2021-10-08 Asml荷兰有限公司 平台系统和光刻装置
KR20220011903A (ko) 2020-07-22 2022-02-03 삼성전자주식회사 식기 세척기
US11094499B1 (en) * 2020-10-04 2021-08-17 Borries Pte. Ltd. Apparatus of charged-particle beam such as electron microscope comprising sliding specimen table within objective lens
JP7631148B2 (ja) * 2021-08-26 2025-02-18 株式会社Ｓｃｒｅｅｎホールディングス 描画装置および描画方法
KR20240058311A (ko) * 2022-10-26 2024-05-03 삼성전자주식회사 기판 처리 장치

Family Cites Families (345)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US478661A (en) 1892-07-12 Henri tudor
US723963A (en) * 1902-10-01 1903-03-31 Howard H Willson Temporary binder.
GB1242527A (en) 1967-10-20 1971-08-11 Kodak Ltd Optical instruments
US3626560A (en) 1970-06-04 1971-12-14 Cogsdill Tool Prod Sizing and finishing device for external surfaces
US4026653A (en) 1975-05-09 1977-05-31 Bell Telephone Laboratories, Incorporated Proximity printing method
US4341164A (en) 1980-06-13 1982-07-27 Charles H. Ruble Folding camp table
US4346164A (en) 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
US4509852A (en) 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
JPS57117238A (en) 1981-01-14 1982-07-21 Nippon Kogaku Kk <Nikon> Exposing and baking device for manufacturing integrated circuit with illuminometer
JPS57153433A (en) 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
US4465363A (en) 1981-11-27 1984-08-14 Hoechst Aktiengesellschaft Cleaning device for cleaning the peripheral surface of a photoconductive drum in an electrophotographic copier
JPS58202448A (ja) 1982-05-21 1983-11-25 Hitachi Ltd 露光装置
JPS5919912A (ja) 1982-07-26 1984-02-01 Hitachi Ltd 液浸距離保持装置
JPS59228356A (ja) 1983-06-09 1984-12-21 Matsushita Electric Ind Co Ltd 空気電池の収納ケ−ス
DD221563A1 (de) 1983-09-14 1985-04-24 Mikroelektronik Zt Forsch Tech Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur
US4650983A (en) 1983-11-07 1987-03-17 Nippon Kogaku K. K. Focusing apparatus for projection optical system
DD224448A1 (de) 1984-03-01 1985-07-03 Zeiss Jena Veb Carl Einrichtung zur fotolithografischen strukturuebertragung
JPS6122249A (ja) 1984-07-11 1986-01-30 Tokyo Keiki Co Ltd 超音波探傷器
US4780617A (en) 1984-08-09 1988-10-25 Nippon Kogaku K.K. Method for successive alignment of chip patterns on a substrate
JPS6144429A (ja) 1984-08-09 1986-03-04 Nippon Kogaku Kk <Nikon> 位置合わせ方法、及び位置合せ装置
JPS6265326A (ja) 1985-09-18 1987-03-24 Hitachi Ltd 露光装置
JPS62121417A (ja) 1985-11-22 1987-06-02 Hitachi Ltd 液浸対物レンズ装置
JPS63157419A (ja) 1986-12-22 1988-06-30 Toshiba Corp 微細パタ−ン転写装置
JP2940553B2 (ja) 1988-12-21 1999-08-25 株式会社ニコン 露光方法
JP2897355B2 (ja) 1990-07-05 1999-05-31 株式会社ニコン アライメント方法，露光装置，並びに位置検出方法及び装置
US5121256A (en) 1991-03-14 1992-06-09 The Board Of Trustees Of The Leland Stanford Junior University Lithography system employing a solid immersion lens
JPH04305917A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JPH04305915A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JP3200874B2 (ja) 1991-07-10 2001-08-20 株式会社ニコン 投影露光装置
US5243195A (en) 1991-04-25 1993-09-07 Nikon Corporation Projection exposure apparatus having an off-axis alignment system and method of alignment therefor
JPH0562877A (ja) 1991-09-02 1993-03-12 Yasuko Shinohara 光によるｌｓｉ製造縮小投影露光装置の光学系
JP3203719B2 (ja) 1991-12-26 2001-08-27 株式会社ニコン 露光装置、その露光装置により製造されるデバイス、露光方法、およびその露光方法を用いたデバイス製造方法
JPH05304072A (ja) 1992-04-08 1993-11-16 Nec Corp 半導体装置の製造方法
US5469963A (en) 1992-04-08 1995-11-28 Asyst Technologies, Inc. Sealable transportable container having improved liner
JPH06124873A (ja) * 1992-10-09 1994-05-06 Canon Inc 液浸式投影露光装置
JP2753930B2 (ja) 1992-11-27 1998-05-20 キヤノン株式会社 液浸式投影露光装置
JP3316833B2 (ja) 1993-03-26 2002-08-19 株式会社ニコン 走査露光方法、面位置設定装置、走査型露光装置、及び前記方法を使用するデバイス製造方法
KR100300618B1 (ko) 1992-12-25 2001-11-22 오노 시게오 노광방법,노광장치,및그장치를사용하는디바이스제조방법
JPH06208058A (ja) 1993-01-13 1994-07-26 Olympus Optical Co Ltd 顕微鏡対物レンズ
US5591958A (en) 1993-06-14 1997-01-07 Nikon Corporation Scanning exposure method and apparatus
JP3412704B2 (ja) 1993-02-26 2003-06-03 株式会社ニコン 投影露光方法及び装置、並びに露光装置
JP3747958B2 (ja) 1995-04-07 2006-02-22 株式会社ニコン 反射屈折光学系
JP3747951B2 (ja) 1994-11-07 2006-02-22 株式会社ニコン 反射屈折光学系
JP3635684B2 (ja) 1994-08-23 2005-04-06 株式会社ニコン 反射屈折縮小投影光学系、反射屈折光学系、並びに投影露光方法及び装置
JPH09311278A (ja) 1996-05-20 1997-12-02 Nikon Corp 反射屈折光学系
US5636066A (en) 1993-03-12 1997-06-03 Nikon Corporation Optical apparatus
JP3265503B2 (ja) 1993-06-11 2002-03-11 株式会社ニコン 露光方法及び装置
US5534970A (en) 1993-06-11 1996-07-09 Nikon Corporation Scanning exposure apparatus
EP0631340B1 (en) 1993-06-18 2001-11-21 Hitachi Maxell Ltd. Organic electrolytic solution cell
JP3212199B2 (ja) 1993-10-04 2001-09-25 旭硝子株式会社 平板型陰極線管
JPH07220990A (ja) 1994-01-28 1995-08-18 Hitachi Ltd パターン形成方法及びその露光装置
US5874820A (en) 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
US6989647B1 (en) 1994-04-01 2006-01-24 Nikon Corporation Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device
US5528118A (en) 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
US7365513B1 (en) 1994-04-01 2008-04-29 Nikon Corporation Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device
JP3395801B2 (ja) 1994-04-28 2003-04-14 株式会社ニコン 反射屈折投影光学系、走査型投影露光装置、及び走査投影露光方法
JP3555230B2 (ja) 1994-05-18 2004-08-18 株式会社ニコン 投影露光装置
JPH07335748A (ja) 1994-06-07 1995-12-22 Miyazaki Oki Electric Co Ltd 半導体素子の製造方法
US5715064A (en) * 1994-06-17 1998-02-03 International Business Machines Corporation Step and repeat apparatus having enhanced accuracy and increased throughput
KR0124189B1 (ko) * 1994-07-29 1997-11-25 배순훈 다중광학계를 갖춘 광픽업장치
USRE38438E1 (en) 1994-08-23 2004-02-24 Nikon Corporation Catadioptric reduction projection optical system and exposure apparatus having the same
JPH0883753A (ja) 1994-09-13 1996-03-26 Nikon Corp 焦点検出方法
US5623853A (en) 1994-10-19 1997-04-29 Nikon Precision Inc. Precision motion stage with single guide beam and follower stage
JPH08136475A (ja) 1994-11-14 1996-05-31 Kawasaki Steel Corp 板状材の表面観察装置
JP3387075B2 (ja) 1994-12-12 2003-03-17 株式会社ニコン 走査露光方法、露光装置、及び走査型露光装置
JPH08171054A (ja) 1994-12-16 1996-07-02 Nikon Corp 反射屈折光学系
US5677758A (en) 1995-02-09 1997-10-14 Mrs Technology, Inc. Lithography System using dual substrate stages
US6008500A (en) 1995-04-04 1999-12-28 Nikon Corporation Exposure apparatus having dynamically isolated reaction frame
DE69604524T2 (de) * 1995-04-25 2000-04-13 Canon K.K., Tokio/Tokyo Abtastbelichtungsapparat und Belichtungsverfahren unter Verwendung desselben
JPH08316124A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
JPH08316125A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
US5751404A (en) * 1995-07-24 1998-05-12 Canon Kabushiki Kaisha Exposure apparatus and method wherein alignment is carried out by comparing marks which are incident on both reticle stage and wafer stage reference plates
JP3526042B2 (ja) 1995-08-09 2004-05-10 株式会社ニコン 投影露光装置
JPH0954443A (ja) * 1995-08-18 1997-02-25 Nikon Corp 露光方法及び装置
JPH09232213A (ja) 1996-02-26 1997-09-05 Nikon Corp 投影露光装置
US5964441A (en) 1996-04-01 1999-10-12 Lear Corporation Linkage assembly with extruded hole member
JPH103039A (ja) 1996-06-14 1998-01-06 Nikon Corp 反射屈折光学系
JPH1020195A (ja) 1996-06-28 1998-01-23 Nikon Corp 反射屈折光学系
US5825043A (en) * 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
CN1244018C (zh) 1996-11-28 2006-03-01 株式会社尼康 曝光方法和曝光装置
JP4029180B2 (ja) * 1996-11-28 2008-01-09 株式会社ニコン 投影露光装置及び投影露光方法
JP4029181B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 投影露光装置
JP4029182B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 露光方法
JP4029183B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 投影露光装置及び投影露光方法
US5815246A (en) 1996-12-24 1998-09-29 U.S. Philips Corporation Two-dimensionally balanced positioning device, and lithographic device provided with such a positioning device
DE69717975T2 (de) 1996-12-24 2003-05-28 Asml Netherlands B.V., Veldhoven In zwei richtungen ausgewogenes positioniergerät, sowie lithographisches gerät mit einem solchen positioniergerät
JPH10209039A (ja) 1997-01-27 1998-08-07 Nikon Corp 投影露光方法及び投影露光装置
JP3612920B2 (ja) 1997-02-14 2005-01-26 ソニー株式会社 光学記録媒体の原盤作製用露光装置
US6262796B1 (en) 1997-03-10 2001-07-17 Asm Lithography B.V. Positioning device having two object holders
JPH10255319A (ja) 1997-03-12 1998-09-25 Hitachi Maxell Ltd 原盤露光装置及び方法
JP3747566B2 (ja) 1997-04-23 2006-02-22 株式会社ニコン 液浸型露光装置
JP3817836B2 (ja) 1997-06-10 2006-09-06 株式会社ニコン 露光装置及びその製造方法並びに露光方法及びデバイス製造方法
JPH1116816A (ja) 1997-06-25 1999-01-22 Nikon Corp 投影露光装置、該装置を用いた露光方法、及び該装置を用いた回路デバイスの製造方法
US5900354A (en) 1997-07-03 1999-05-04 Batchelder; John Samuel Method for optical inspection and lithography
IL135139A0 (en) 1997-09-19 2001-05-20 Nikon Corp Stage apparatus, scanning type exposure apparatus, and device produced with the same
JP2000106340A (ja) 1997-09-26 2000-04-11 Nikon Corp 露光装置及び走査露光方法、並びにステージ装置
JP4210871B2 (ja) 1997-10-31 2009-01-21 株式会社ニコン 露光装置
WO1999027568A1 (en) 1997-11-21 1999-06-03 Nikon Corporation Projection aligner and projection exposure method
JPH11176727A (ja) * 1997-12-11 1999-07-02 Nikon Corp 投影露光装置
KR20010033118A (ko) 1997-12-18 2001-04-25 오노 시게오 스테이지 장치 및 노광장치
JP4264676B2 (ja) * 1998-11-30 2009-05-20 株式会社ニコン 露光装置及び露光方法
US6897963B1 (en) 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus
US6208407B1 (en) 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
AU2747999A (en) 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
JP2000058436A (ja) 1998-08-11 2000-02-25 Nikon Corp 投影露光装置及び露光方法
WO2000017916A1 (en) 1998-09-17 2000-03-30 Nikon Corporation Method of adjusting optical projection system
AU2041000A (en) 1998-12-02 2000-06-19 Kensington Laboratories, Inc. Specimen holding robotic arm end effector
JP2000187338A (ja) * 1998-12-24 2000-07-04 Canon Inc 露光装置およびデバイス製造方法
JP2000216082A (ja) * 1999-01-27 2000-08-04 Nikon Corp ステ―ジ装置および露光装置
WO2000055891A1 (en) 1999-03-12 2000-09-21 Nikon Corporation Exposure device, exposure method, and device manufacturing method
JP4365934B2 (ja) 1999-05-10 2009-11-18 キヤノン株式会社 露光装置、半導体製造装置およびデバイス製造方法
JP4504479B2 (ja) 1999-09-21 2010-07-14 オリンパス株式会社 顕微鏡用液浸対物レンズ
JP2001118773A (ja) 1999-10-18 2001-04-27 Nikon Corp ステージ装置及び露光装置
WO2001035168A1 (en) 1999-11-10 2001-05-17 Massachusetts Institute Of Technology Interference lithography utilizing phase-locked scanning beams
TW546551B (en) 1999-12-21 2003-08-11 Asml Netherlands Bv Balanced positioning system for use in lithographic apparatus
TWI223734B (en) 1999-12-21 2004-11-11 Asml Netherlands Bv Crash prevention in positioning apparatus for use in lithographic projection apparatus
EP1111471B1 (en) 1999-12-21 2005-11-23 ASML Netherlands B.V. Lithographic projection apparatus with collision preventing device
US6995930B2 (en) 1999-12-29 2006-02-07 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
US7187503B2 (en) 1999-12-29 2007-03-06 Carl Zeiss Smt Ag Refractive projection objective for immersion lithography
JP2001267239A (ja) 2000-01-14 2001-09-28 Nikon Corp 露光方法及び装置、並びにデバイス製造方法
JP2001241439A (ja) 2000-02-25 2001-09-07 Canon Inc 静圧軸受を備えた移動装置
JP2001313250A (ja) 2000-02-25 2001-11-09 Nikon Corp 露光装置、その調整方法、及び前記露光装置を用いるデバイス製造方法
KR20010085493A (ko) 2000-02-25 2001-09-07 시마무라 기로 노광장치, 그 조정방법, 및 상기 노광장치를 이용한디바이스 제조방법
KR100945707B1 (ko) * 2000-02-28 2010-03-05 가부시키가이샤 니콘 스테이지장치와 홀더, 및 주사형 노광장치 그리고 노광장치
US6426790B1 (en) 2000-02-28 2002-07-30 Nikon Corporation Stage apparatus and holder, and scanning exposure apparatus and exposure apparatus
JP2002014005A (ja) 2000-04-25 2002-01-18 Nikon Corp 空間像計測方法、結像特性計測方法、空間像計測装置及び露光装置
US20020041377A1 (en) 2000-04-25 2002-04-11 Nikon Corporation Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method
KR100833275B1 (ko) 2000-05-03 2008-05-28 에이에스엠엘 유에스, 인크. 정화 가스를 이용한 비접촉식 시일
TW591653B (en) * 2000-08-08 2004-06-11 Koninkl Philips Electronics Nv Method of manufacturing an optically scannable information carrier
JP4405071B2 (ja) 2000-10-23 2010-01-27 パナソニック株式会社 送り装置及びそれを具備する光ディスク原盤記録装置
KR100866818B1 (ko) 2000-12-11 2008-11-04 가부시키가이샤 니콘 투영광학계 및 이 투영광학계를 구비한 노광장치
JP2002305140A (ja) 2001-04-06 2002-10-18 Nikon Corp 露光装置及び基板処理システム
WO2002091078A1 (en) 2001-05-07 2002-11-14 Massachusetts Institute Of Technology Methods and apparatus employing an index matching medium
JP2002339853A (ja) * 2001-05-16 2002-11-27 Nissan Motor Co Ltd 充電ステーション
KR100423783B1 (ko) * 2001-06-13 2004-03-22 제일모직주식회사 인조 대리석의 제조 공정
US6788385B2 (en) 2001-06-21 2004-09-07 Nikon Corporation Stage device, exposure apparatus and method
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
JPWO2003010802A1 (ja) * 2001-07-26 2004-11-18 株式会社ニコン ステージ装置、露光装置及び露光方法、並びにデバイス製造方法
US6680774B1 (en) 2001-10-09 2004-01-20 Ultratech Stepper, Inc. Method and apparatus for mechanically masking a workpiece
US6665054B2 (en) 2001-10-22 2003-12-16 Nikon Corporation Two stage method
US7134668B2 (en) 2001-10-24 2006-11-14 Ebara Corporation Differential pumping seal apparatus
JP2003249443A (ja) * 2001-12-21 2003-09-05 Nikon Corp ステージ装置、ステージ位置管理方法、露光方法及び露光装置、並びにデバイス製造方法
WO2003065427A1 (en) * 2002-01-29 2003-08-07 Nikon Corporation Exposure device and exposure method
US20050003048A1 (en) * 2002-02-11 2005-01-06 Edizone, Lc Electrolyte-containing orally soluble films
DE10229249A1 (de) 2002-03-01 2003-09-04 Zeiss Carl Semiconductor Mfg Refraktives Projektionsobjektiv mit einer Taille
US7190527B2 (en) 2002-03-01 2007-03-13 Carl Zeiss Smt Ag Refractive projection objective
US7154676B2 (en) 2002-03-01 2006-12-26 Carl Zeiss Smt A.G. Very-high aperture projection objective
US7092069B2 (en) 2002-03-08 2006-08-15 Carl Zeiss Smt Ag Projection exposure method and projection exposure system
DE10210899A1 (de) 2002-03-08 2003-09-18 Zeiss Carl Smt Ag Refraktives Projektionsobjektiv für Immersions-Lithographie
DE10229818A1 (de) 2002-06-28 2004-01-15 Carl Zeiss Smt Ag Verfahren zur Fokusdetektion und Abbildungssystem mit Fokusdetektionssystem
TW200305927A (en) * 2002-03-22 2003-11-01 Nippon Kogaku Kk Exposure apparatus, exposure method and manufacturing method of device
CN1650401B (zh) 2002-04-09 2010-04-21 株式会社尼康 曝光方法与曝光装置、以及器件的制造方法
KR20040104691A (ko) 2002-05-03 2004-12-10 칼 짜이스 에스엠테 아게 높은 개구를 갖는 투영 대물렌즈
JP4360064B2 (ja) * 2002-06-10 2009-11-11 株式会社ニコン ステージ装置および露光装置
TWI249082B (en) 2002-08-23 2006-02-11 Nikon Corp Projection optical system and method for photolithography and exposure apparatus and method using same
TW559895B (en) * 2002-09-27 2003-11-01 Taiwan Semiconductor Mfg Exposure system and exposure method thereof
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US7383843B2 (en) 2002-09-30 2008-06-10 Lam Research Corporation Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
US6954993B1 (en) 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
US7367345B1 (en) 2002-09-30 2008-05-06 Lam Research Corporation Apparatus and method for providing a confined liquid for immersion lithography
US6988326B2 (en) 2002-09-30 2006-01-24 Lam Research Corporation Phobic barrier meniscus separation and containment
US6788477B2 (en) 2002-10-22 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for method for immersion lithography
SG121818A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
SG121822A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
KR100588124B1 (ko) 2002-11-12 2006-06-09 에이에스엠엘 네델란즈 비.브이. 리소그래피장치 및 디바이스제조방법
US7110081B2 (en) 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1420300B1 (en) 2002-11-12 2015-07-29 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
DE60335595D1 (de) 2002-11-12 2011-02-17 Asml Netherlands Bv Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung
US7372541B2 (en) 2002-11-12 2008-05-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1420299B1 (en) 2002-11-12 2011-01-05 ASML Netherlands B.V. Immersion lithographic apparatus and device manufacturing method
CN101424881B (zh) 2002-11-12 2011-11-30 Asml荷兰有限公司 光刻投射装置
DE10253679A1 (de) 2002-11-18 2004-06-03 Infineon Technologies Ag Optische Einrichtung zur Verwendung bei einem Lithographie-Verfahren, insbesondere zur Herstellung eines Halbleiter-Bauelements, sowie optisches Lithographieverfahren
SG131766A1 (en) 2002-11-18 2007-05-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE10258718A1 (de) 2002-12-09 2004-06-24 Carl Zeiss Smt Ag Projektionsobjektiv, insbesondere für die Mikrolithographie, sowie Verfahren zur Abstimmung eines Projektionsobjektives
DE10257766A1 (de) 2002-12-10 2004-07-15 Carl Zeiss Smt Ag Verfahren zur Einstellung einer gewünschten optischen Eigenschaft eines Projektionsobjektivs sowie mikrolithografische Projektionsbelichtungsanlage
EP1571697A4 (en) 2002-12-10 2007-07-04 Nikon Corp EXPOSURE SYSTEM AND DEVICE PRODUCTION METHOD
JP4701606B2 (ja) * 2002-12-10 2011-06-15 株式会社ニコン 露光方法及び露光装置、デバイス製造方法
JP4645027B2 (ja) * 2002-12-10 2011-03-09 株式会社ニコン 露光装置及び露光方法、デバイス製造方法
JP4232449B2 (ja) 2002-12-10 2009-03-04 株式会社ニコン 露光方法、露光装置、及びデバイス製造方法
EP1429190B1 (en) 2002-12-10 2012-05-09 Canon Kabushiki Kaisha Exposure apparatus and method
JP4352874B2 (ja) 2002-12-10 2009-10-28 株式会社ニコン 露光装置及びデバイス製造方法
DE60326384D1 (de) 2002-12-13 2009-04-09 Koninkl Philips Electronics Nv Flüssigkeitsentfernung in einem verfahren und einer einrichtung zum bestrahlen von flecken auf einer schicht
ATE335272T1 (de) 2002-12-19 2006-08-15 Koninkl Philips Electronics Nv Verfahren und anordnung zum bestrahlen einer schicht mittels eines lichtpunkts
AU2003295177A1 (en) 2002-12-19 2004-07-14 Koninklijke Philips Electronics N.V. Method and device for irradiating spots on a layer
US7010958B2 (en) 2002-12-19 2006-03-14 Asml Holding N.V. High-resolution gas gauge proximity sensor
US6781670B2 (en) 2002-12-30 2004-08-24 Intel Corporation Immersion lithography
TWI247339B (en) 2003-02-21 2006-01-11 Asml Holding Nv Lithographic printing with polarized light
JP4604452B2 (ja) * 2003-02-26 2011-01-05 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
US7206059B2 (en) 2003-02-27 2007-04-17 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US6943941B2 (en) 2003-02-27 2005-09-13 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US7029832B2 (en) 2003-03-11 2006-04-18 Samsung Electronics Co., Ltd. Immersion lithography methods using carbon dioxide
US20050164522A1 (en) 2003-03-24 2005-07-28 Kunz Roderick R. Optical fluids, and systems and methods of making and using the same
WO2004090956A1 (ja) 2003-04-07 2004-10-21 Nikon Corporation 露光装置及びデバイス製造方法
JP4488004B2 (ja) 2003-04-09 2010-06-23 株式会社ニコン 液浸リソグラフィ流体制御システム
CN1771463A (zh) 2003-04-10 2006-05-10 株式会社尼康 用于沉浸光刻装置收集液体的溢出通道
JP4656057B2 (ja) 2003-04-10 2011-03-23 株式会社ニコン 液浸リソグラフィ装置用電気浸透素子
CN101061429B (zh) 2003-04-10 2015-02-04 株式会社尼康 包括用于沉浸光刻装置的真空清除的环境系统
KR101323993B1 (ko) 2003-04-10 2013-10-30 가부시키가이샤 니콘 액침 리소그래피 장치용 운반 영역을 포함하는 환경 시스템
EP2161621B1 (en) 2003-04-11 2018-10-24 Nikon Corporation Cleanup method for optics in an immersion lithography apparatus, and corresponding immersion lithography apparatus
WO2004092830A2 (en) 2003-04-11 2004-10-28 Nikon Corporation Liquid jet and recovery system for immersion lithography
SG139733A1 (en) 2003-04-11 2008-02-29 Nikon Corp Apparatus having an immersion fluid system configured to maintain immersion fluid in a gap adjacent an optical assembly
KR101369582B1 (ko) 2003-04-17 2014-03-04 가부시키가이샤 니콘 액침 리소그래피에서 이용하기 위한 오토포커스 소자의 광학적 배열
JP4146755B2 (ja) 2003-05-09 2008-09-10 松下電器産業株式会社 パターン形成方法
JP4025683B2 (ja) 2003-05-09 2007-12-26 松下電器産業株式会社 パターン形成方法及び露光装置
TWI295414B (en) 2003-05-13 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
WO2004102646A1 (ja) * 2003-05-15 2004-11-25 Nikon Corporation 露光装置及びデバイス製造方法
TWI282487B (en) 2003-05-23 2007-06-11 Canon Kk Projection optical system, exposure apparatus, and device manufacturing method
TWI424470B (zh) 2003-05-23 2014-01-21 尼康股份有限公司 A method of manufacturing an exposure apparatus and an element
JP2004349645A (ja) 2003-05-26 2004-12-09 Sony Corp 液浸差動排液静圧浮上パッド、原盤露光装置および液侵差動排液による露光方法
TWI347741B (en) 2003-05-30 2011-08-21 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1486827B1 (en) 2003-06-11 2011-11-02 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4054285B2 (ja) 2003-06-12 2008-02-27 松下電器産業株式会社 パターン形成方法
JP4084710B2 (ja) 2003-06-12 2008-04-30 松下電器産業株式会社 パターン形成方法
US6867844B2 (en) 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
TWI543235B (zh) 2003-06-19 2016-07-21 尼康股份有限公司 A method of manufacturing an exposure apparatus and an element
JP4084712B2 (ja) 2003-06-23 2008-04-30 松下電器産業株式会社 パターン形成方法
JP4029064B2 (ja) 2003-06-23 2008-01-09 松下電器産業株式会社 パターン形成方法
JP2005019616A (ja) 2003-06-25 2005-01-20 Canon Inc 液浸式露光装置
JP4343597B2 (ja) 2003-06-25 2009-10-14 キヤノン株式会社 露光装置及びデバイス製造方法
EP1498778A1 (en) 2003-06-27 2005-01-19 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
DE60308161T2 (de) 2003-06-27 2007-08-09 Asml Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
US6809794B1 (en) 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
JP3862678B2 (ja) 2003-06-27 2006-12-27 キヤノン株式会社 露光装置及びデバイス製造方法
EP1494074A1 (en) 2003-06-30 2005-01-05 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7236232B2 (en) 2003-07-01 2007-06-26 Nikon Corporation Using isotopically specified fluids as optical elements
JP4697138B2 (ja) 2003-07-08 2011-06-08 株式会社ニコン 液浸リソグラフィ装置、液浸リソグラフィ方法、デバイス製造方法
SG109000A1 (en) 2003-07-16 2005-02-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7384149B2 (en) 2003-07-21 2008-06-10 Asml Netherlands B.V. Lithographic projection apparatus, gas purging method and device manufacturing method and purge gas supply system
EP1500982A1 (en) 2003-07-24 2005-01-26 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7309345B2 (en) * 2003-07-25 2007-12-18 Boston Scientific-Scimed, Inc. Method and system for delivering an implant utilizing a lumen reducing member
US7006209B2 (en) 2003-07-25 2006-02-28 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
US7326522B2 (en) 2004-02-11 2008-02-05 Asml Netherlands B.V. Device manufacturing method and a substrate
JP4492239B2 (ja) 2003-07-28 2010-06-30 株式会社ニコン 露光装置及びデバイス製造方法、並びに露光装置の制御方法
EP1503244A1 (en) 2003-07-28 2005-02-02 ASML Netherlands B.V. Lithographic projection apparatus and device manufacturing method
CN104122760B (zh) 2003-07-28 2017-04-19 株式会社尼康 曝光装置、器件制造方法
US7175968B2 (en) 2003-07-28 2007-02-13 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a substrate
US7779781B2 (en) 2003-07-31 2010-08-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005057294A (ja) 2003-08-07 2005-03-03 Asml Netherlands Bv インタフェースユニット、該インタフェースユニットを含むリソグラフィ投影装置、及びデバイス製造方法
US7061578B2 (en) 2003-08-11 2006-06-13 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
US7579135B2 (en) 2003-08-11 2009-08-25 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography apparatus for manufacture of integrated circuits
US7700267B2 (en) 2003-08-11 2010-04-20 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion fluid for immersion lithography, and method of performing immersion lithography
US7085075B2 (en) 2003-08-12 2006-08-01 Carl Zeiss Smt Ag Projection objectives including a plurality of mirrors with lenses ahead of mirror M3
US6844206B1 (en) 2003-08-21 2005-01-18 Advanced Micro Devices, Llp Refractive index system monitor and control for immersion lithography
TWI263859B (en) 2003-08-29 2006-10-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US6954256B2 (en) 2003-08-29 2005-10-11 Asml Netherlands B.V. Gradient immersion lithography
US7070915B2 (en) 2003-08-29 2006-07-04 Tokyo Electron Limited Method and system for drying a substrate
TWI245163B (en) 2003-08-29 2005-12-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7014966B2 (en) 2003-09-02 2006-03-21 Advanced Micro Devices, Inc. Method and apparatus for elimination of bubbles in immersion medium in immersion lithography systems
KR20170070264A (ko) 2003-09-03 2017-06-21 가부시키가이샤 니콘 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법
JP4378136B2 (ja) 2003-09-04 2009-12-02 キヤノン株式会社 露光装置及びデバイス製造方法
JP3870182B2 (ja) 2003-09-09 2007-01-17 キヤノン株式会社 露光装置及びデバイス製造方法
US6961186B2 (en) 2003-09-26 2005-11-01 Takumi Technology Corp. Contact printing using a magnified mask image
EP1519231B1 (en) 2003-09-29 2005-12-21 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7158211B2 (en) 2003-09-29 2007-01-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1519230A1 (en) 2003-09-29 2005-03-30 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7369217B2 (en) 2003-10-03 2008-05-06 Micronic Laser Systems Ab Method and device for immersion lithography
JP2005136374A (ja) 2003-10-06 2005-05-26 Matsushita Electric Ind Co Ltd 半導体製造装置及びそれを用いたパターン形成方法
EP1524557A1 (en) 2003-10-15 2005-04-20 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1524558A1 (en) 2003-10-15 2005-04-20 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7678527B2 (en) 2003-10-16 2010-03-16 Intel Corporation Methods and compositions for providing photoresist with improved properties for contacting liquids
US7411653B2 (en) 2003-10-28 2008-08-12 Asml Netherlands B.V. Lithographic apparatus
US7352433B2 (en) 2003-10-28 2008-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005159322A (ja) 2003-10-31 2005-06-16 Nikon Corp 定盤、ステージ装置及び露光装置並びに露光方法
EP1685446A2 (en) 2003-11-05 2006-08-02 DSM IP Assets B.V. A method and apparatus for producing microchips
US7924397B2 (en) 2003-11-06 2011-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Anti-corrosion layer on objective lens for liquid immersion lithography applications
JP2005150290A (ja) 2003-11-13 2005-06-09 Canon Inc 露光装置およびデバイスの製造方法
EP1531362A3 (en) 2003-11-13 2007-07-25 Matsushita Electric Industrial Co., Ltd. Semiconductor manufacturing apparatus and pattern formation method
JP4295712B2 (ja) 2003-11-14 2009-07-15 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及び装置製造方法
US7545481B2 (en) 2003-11-24 2009-06-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8854602B2 (en) 2003-11-24 2014-10-07 Asml Netherlands B.V. Holding device for an optical element in an objective
DE10355301B3 (de) 2003-11-27 2005-06-23 Infineon Technologies Ag Verfahren zur Abbildung einer Struktur auf einen Halbleiter-Wafer mittels Immersionslithographie
US7125652B2 (en) 2003-12-03 2006-10-24 Advanced Micro Devices, Inc. Immersion lithographic process using a conforming immersion medium
JP2005175016A (ja) 2003-12-08 2005-06-30 Canon Inc 基板保持装置およびそれを用いた露光装置ならびにデバイス製造方法
JP2005175034A (ja) 2003-12-09 2005-06-30 Canon Inc 露光装置
EP1697798A2 (en) 2003-12-15 2006-09-06 Carl Zeiss SMT AG Projection objective having a high aperture and a planar end surface
US7385764B2 (en) 2003-12-15 2008-06-10 Carl Zeiss Smt Ag Objectives as a microlithography projection objective with at least one liquid lens
JP4308638B2 (ja) 2003-12-17 2009-08-05 パナソニック株式会社 パターン形成方法
US20050185269A1 (en) 2003-12-19 2005-08-25 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
US7460206B2 (en) 2003-12-19 2008-12-02 Carl Zeiss Smt Ag Projection objective for immersion lithography
WO2005059645A2 (en) 2003-12-19 2005-06-30 Carl Zeiss Smt Ag Microlithography projection objective with crystal elements
JP2005183656A (ja) * 2003-12-19 2005-07-07 Canon Inc 露光装置
JP4323946B2 (ja) 2003-12-19 2009-09-02 キヤノン株式会社 露光装置
US7589818B2 (en) 2003-12-23 2009-09-15 Asml Netherlands B.V. Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus
US7394521B2 (en) 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE10360788A1 (de) 2003-12-23 2005-07-28 Marconi Communications Gmbh Optisches Kommunikationsnetz und Komponente dafür
US7119884B2 (en) 2003-12-24 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20050147920A1 (en) 2003-12-30 2005-07-07 Chia-Hui Lin Method and system for immersion lithography
US7088422B2 (en) 2003-12-31 2006-08-08 International Business Machines Corporation Moving lens for immersion optical lithography
JP4371822B2 (ja) 2004-01-06 2009-11-25 キヤノン株式会社 露光装置
JP4429023B2 (ja) 2004-01-07 2010-03-10 キヤノン株式会社 露光装置及びデバイス製造方法
US20050153424A1 (en) 2004-01-08 2005-07-14 Derek Coon Fluid barrier with transparent areas for immersion lithography
KR101150037B1 (ko) 2004-01-14 2012-07-02 칼 짜이스 에스엠티 게엠베하 반사굴절식 투영 대물렌즈
CN101793993B (zh) 2004-01-16 2013-04-03 卡尔蔡司Smt有限责任公司 光学元件、光学布置及系统
WO2005069078A1 (en) 2004-01-19 2005-07-28 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus with immersion projection lens
EP1706793B1 (en) 2004-01-20 2010-03-03 Carl Zeiss SMT AG Exposure apparatus and measuring device for a projection lens
US7026259B2 (en) 2004-01-21 2006-04-11 International Business Machines Corporation Liquid-filled balloons for immersion lithography
US7391501B2 (en) 2004-01-22 2008-06-24 Intel Corporation Immersion liquids with siloxane polymer for immersion lithography
US8054947B2 (en) * 2004-02-02 2011-11-08 Eicon Networks Corporation Apparatus and method for multiplexing communication signals
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
WO2005076321A1 (ja) 2004-02-03 2005-08-18 Nikon Corporation 露光装置及びデバイス製造方法
JP2007520893A (ja) 2004-02-03 2007-07-26 ロチェスター インスティテュート オブ テクノロジー 流体を使用したフォトリソグラフィ法及びそのシステム
EP1716454A1 (en) 2004-02-09 2006-11-02 Carl Zeiss SMT AG Projection objective for a microlithographic projection exposure apparatus
US7050146B2 (en) 2004-02-09 2006-05-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN101727021A (zh) 2004-02-13 2010-06-09 卡尔蔡司Smt股份公司 微平版印刷投影曝光装置的投影物镜
JP2007523383A (ja) 2004-02-18 2007-08-16 コーニング インコーポレイテッド 深紫外光による大開口数結像のための反射屈折結像光学系
JP2005236087A (ja) 2004-02-20 2005-09-02 Nikon Corp 露光装置
JP2005259789A (ja) 2004-03-09 2005-09-22 Nikon Corp 検知システム及び露光装置、デバイス製造方法
US20050205108A1 (en) 2004-03-16 2005-09-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for immersion lithography lens cleaning
JP2005268700A (ja) 2004-03-22 2005-09-29 Nikon Corp ステージ装置及び露光装置
US7027125B2 (en) 2004-03-25 2006-04-11 International Business Machines Corporation System and apparatus for photolithography
JP2005285881A (ja) * 2004-03-29 2005-10-13 Nikon Corp ステージ装置及び露光装置
US7084960B2 (en) 2004-03-29 2006-08-01 Intel Corporation Lithography using controlled polarization
US7034917B2 (en) 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7227619B2 (en) 2004-04-01 2007-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7295283B2 (en) 2004-04-02 2007-11-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7712905B2 (en) 2004-04-08 2010-05-11 Carl Zeiss Smt Ag Imaging system with mirror group
US7898642B2 (en) 2004-04-14 2011-03-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7271878B2 (en) 2004-04-22 2007-09-18 International Business Machines Corporation Wafer cell for immersion lithography
US7244665B2 (en) 2004-04-29 2007-07-17 Micron Technology, Inc. Wafer edge ring structures and methods of formation
US7379159B2 (en) 2004-05-03 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8054448B2 (en) 2004-05-04 2011-11-08 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US20060244938A1 (en) 2004-05-04 2006-11-02 Karl-Heinz Schuster Microlitographic projection exposure apparatus and immersion liquid therefore
US7091502B2 (en) 2004-05-12 2006-08-15 Taiwan Semiconductor Manufacturing, Co., Ltd. Apparatus and method for immersion lithography
KR20170129271A (ko) 2004-05-17 2017-11-24 칼 짜이스 에스엠티 게엠베하 중간이미지를 갖는 카타디옵트릭 투사 대물렌즈
US7616383B2 (en) 2004-05-18 2009-11-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7486381B2 (en) 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005119368A2 (en) 2004-06-04 2005-12-15 Carl Zeiss Smt Ag System for measuring the image quality of an optical imaging system
JP4913041B2 (ja) 2004-06-04 2012-04-11 カール・ツァイス・エスエムティー・ゲーエムベーハー 強度変化の補償を伴う投影系及びそのための補償素子
US7057702B2 (en) 2004-06-23 2006-06-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7463330B2 (en) 2004-07-07 2008-12-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP3919782B2 (ja) * 2004-10-08 2007-05-30 キヤノン株式会社 露光装置及びデバイス製造方法
WO2006041100A1 (ja) 2004-10-15 2006-04-20 Nikon Corporation 露光装置及びデバイス製造方法
US7119876B2 (en) 2004-10-18 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7700365B2 (en) 2004-10-29 2010-04-20 Mayo Foundation For Medical Education And Research Vitamin D deficiencies
US7583357B2 (en) 2004-11-12 2009-09-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7403261B2 (en) 2004-12-15 2008-07-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102004061462A1 (de) * 2004-12-17 2006-07-06 Delphi Technologies, Inc., Troy Verfahren und Vorrichtung zur Motorsteuerung bei einem Kraftfahrzeug
US7528931B2 (en) 2004-12-20 2009-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
SG124351A1 (en) 2005-01-14 2006-08-30 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7161659B2 (en) 2005-04-08 2007-01-09 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
KR20090023331A (ko) 2006-05-23 2009-03-04 가부시키가이샤 니콘 메인터넌스 방법, 노광 방법 및 장치, 그리고 디바이스 제조 방법
JP4442904B2 (ja) * 2006-07-21 2010-03-31 キヤノン株式会社 露光装置及びデバイス製造方法
JP5304072B2 (ja) 2007-07-18 2013-10-02 ヤマハ株式会社 力覚制御装置、鍵盤楽器、力覚制御方法およびプログラム
TWI452546B (zh) * 2012-12-28 2014-09-11 Univ Chienkuo Technology Hybrid large - scale collapse model

Also Published As

Publication number Publication date
KR101187618B1 (ko) 2012-10-08
US9684248B2 (en) 2017-06-20
US9632431B2 (en) 2017-04-25
JP5344061B2 (ja) 2013-11-20
US7589822B2 (en) 2009-09-15
US20100182584A1 (en) 2010-07-22
CN101685263B (zh) 2013-04-17
IL226838A (en) 2015-09-24
IL177221A0 (en) 2006-12-10
KR20120099508A (ko) 2012-09-10
TW200944962A (en) 2009-11-01
IL226839A (en) 2015-10-29
TWI578114B (zh) 2017-04-11
TWI498680B (zh) 2015-09-01
EP1713113A1 (en) 2006-10-18
JPWO2005074014A1 (ja) 2007-09-13
US8045136B2 (en) 2011-10-25
KR101590742B1 (ko) 2016-02-01
KR20150120530A (ko) 2015-10-27
EP2267759A2 (en) 2010-12-29
JP2014212330A (ja) 2014-11-13
EP2267759B1 (en) 2014-11-26
US20110025998A1 (en) 2011-02-03
TW201535072A (zh) 2015-09-16
US20110058149A1 (en) 2011-03-10
US8736808B2 (en) 2014-05-27
JP2011211222A (ja) 2011-10-20
US10007196B2 (en) 2018-06-26
HK1151631A1 (en) 2012-02-03
KR101824373B1 (ko) 2018-01-31
KR20120092676A (ko) 2012-08-21
DE602005025596D1 (de) 2011-02-10
HK1221071A1 (en) 2017-05-19
JP2010098332A (ja) 2010-04-30
KR101698290B1 (ko) 2017-01-19
EP1713113A4 (en) 2007-05-02
JP2012142604A (ja) 2012-07-26
US20090296067A1 (en) 2009-12-03
KR20060120693A (ko) 2006-11-27
KR20110036122A (ko) 2011-04-06
KR20110036121A (ko) 2011-04-06
TWI596440B (zh) 2017-08-21
JP2013145918A (ja) 2013-07-25
KR101187615B1 (ko) 2012-10-08
TWI443475B (zh) 2014-07-01
US10139737B2 (en) 2018-11-27
US8724079B2 (en) 2014-05-13
TW201716884A (zh) 2017-05-16
HK1151144A1 (en) 2012-01-20
KR20110025884A (ko) 2011-03-11
US20070127006A1 (en) 2007-06-07
JP5287932B2 (ja) 2013-09-11
JP5488741B2 (ja) 2014-05-14
HK1151630A1 (en) 2012-02-03
EP2287893A2 (en) 2011-02-23
KR20110038141A (ko) 2011-04-13
US8705002B2 (en) 2014-04-22
TW201418906A (zh) 2014-05-16
JP5287896B2 (ja) 2013-09-11
US20190086815A1 (en) 2019-03-21
JP2015222427A (ja) 2015-12-10
EP2287894A2 (en) 2011-02-23
KR101288139B1 (ko) 2013-07-19
TWI521312B (zh) 2016-02-11
JP2015135967A (ja) 2015-07-27
KR101539877B1 (ko) 2015-07-28
TW200537254A (en) 2005-11-16
SG185342A1 (en) 2012-11-29
JP2010098333A (ja) 2010-04-30
IL226839A0 (en) 2013-07-31
JP5333622B2 (ja) 2013-11-06
JP2016106257A (ja) 2016-06-16
TW201229690A (en) 2012-07-16
IL177221A (en) 2013-07-31
US20090231564A1 (en) 2009-09-17
JP2012142603A (ja) 2012-07-26
TW200944960A (en) 2009-11-01
EP2980834A1 (en) 2016-02-03
KR20110038140A (ko) 2011-04-13
US20070211235A1 (en) 2007-09-13
JP6222301B2 (ja) 2017-11-01
TWI390358B (zh) 2013-03-21
US20110051104A1 (en) 2011-03-03
JP2016184181A (ja) 2016-10-20
US8547528B2 (en) 2013-10-01
WO2005074014A1 (ja) 2005-08-11
KR20170007548A (ko) 2017-01-18
US20150378267A1 (en) 2015-12-31
TW200944963A (en) 2009-11-01
JP4952803B2 (ja) 2012-06-13
JP5761430B2 (ja) 2015-08-12
IL226840A0 (en) 2013-07-31
EP2960927A3 (en) 2016-03-16
EP2287893A3 (en) 2012-10-31
ATE493753T1 (de) 2011-01-15
SG152291A1 (en) 2009-05-29
CN101685263A (zh) 2010-03-31
TWI499870B (zh) 2015-09-11
US20110051105A1 (en) 2011-03-03
JP5930083B2 (ja) 2016-06-08
KR20110137389A (ko) 2011-12-22
JP5287897B2 (ja) 2013-09-11
JP4952802B2 (ja) 2012-06-13
HK1219172A1 (en) 2017-03-24
JP2014099631A (ja) 2014-05-29
JP2011124606A (ja) 2011-06-23
HK1139469A1 (en) 2010-09-17
KR20140098165A (ko) 2014-08-07
KR101191061B1 (ko) 2012-10-15
JP2017151479A (ja) 2017-08-31
TW201229689A (en) 2012-07-16
TW200944964A (en) 2009-11-01
TWI437375B (zh) 2014-05-11
TWI564673B (zh) 2017-01-01
TWI627511B (zh) 2018-06-21
KR20150016413A (ko) 2015-02-11
TW201544916A (zh) 2015-12-01
JP2011097112A (ja) 2011-05-12
KR101673826B1 (ko) 2016-11-07
US20090296069A1 (en) 2009-12-03
JP5630557B2 (ja) 2014-11-26
KR101187616B1 (ko) 2012-10-05
KR101187614B1 (ko) 2012-10-08
JP5935929B2 (ja) 2016-06-15
IL226841A (en) 2015-09-24
IL226838A0 (en) 2013-07-31
EP2960927B1 (en) 2016-11-16
EP3139401A1 (en) 2017-03-08
EP2287894A3 (en) 2012-11-07
EP1713113B1 (en) 2010-12-29
HK1217249A1 (en) 2016-12-30
IL226840A (en) 2015-10-29
HK1093606A1 (en) 2007-03-02
KR101476015B1 (ko) 2014-12-23
US20120212713A1 (en) 2012-08-23
EP2284866A3 (en) 2012-11-07
KR20120099792A (ko) 2012-09-11
JP6327385B2 (ja) 2018-05-23
EP2267759A3 (en) 2012-10-31
KR20180011877A (ko) 2018-02-02
TWI437374B (zh) 2014-05-11
KR101235523B1 (ko) 2013-02-20
EP2284866A2 (en) 2011-02-16
EP2284866B1 (en) 2016-04-20
SG195559A1 (en) 2013-12-30
US9665016B2 (en) 2017-05-30
EP2998982B1 (en) 2017-08-09
TW200944961A (en) 2009-11-01
KR20140002077A (ko) 2014-01-07
EP2998982A1 (en) 2016-03-23
SG152294A1 (en) 2009-05-29
JP4910394B2 (ja) 2012-04-04
SG185343A1 (en) 2012-11-29
KR101276423B1 (ko) 2013-06-19
US20150192865A1 (en) 2015-07-09
US8711328B2 (en) 2014-04-29
EP2980834B1 (en) 2016-10-12
KR101276512B1 (ko) 2013-06-24
EP2287893B1 (en) 2016-04-20
US20070247607A1 (en) 2007-10-25
TW201316142A (zh) 2013-04-16
TWI436170B (zh) 2014-05-01
EP2960927A2 (en) 2015-12-30
IL226841A0 (en) 2013-07-31
JP6052439B2 (ja) 2016-12-27
TW201823875A (zh) 2018-07-01
EP2287894B1 (en) 2016-09-28
US8553203B2 (en) 2013-10-08

Similar Documents

Publication Publication Date Title
TWI437376B (zh) A stage driving method and a stage apparatus, an exposure apparatus, and an element manufacturing method
CN100552879C (zh) 载台驱动方法及载台装置、曝光装置、及元件制造方法
HK1139469B (en) Exposure apparatus and device manufacturing method

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees