KR100877124B1 - 에폭시 화합물의 제조방법, 에폭시수지 조성물 및 그용도, 및 자외선경화형 캔용 도료조성물 및 도장금속캔의제조방법 - Google Patents

에폭시 화합물의 제조방법, 에폭시수지 조성물 및 그용도, 및 자외선경화형 캔용 도료조성물 및 도장금속캔의제조방법 Download PDF

Info

Publication number
KR100877124B1
KR100877124B1 KR1020027013628A KR20027013628A KR100877124B1 KR 100877124 B1 KR100877124 B1 KR 100877124B1 KR 1020027013628 A KR1020027013628 A KR 1020027013628A KR 20027013628 A KR20027013628 A KR 20027013628A KR 100877124 B1 KR100877124 B1 KR 100877124B1
Authority
KR
South Korea
Prior art keywords
group
compound
epoxy compound
weight
alicyclic epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020027013628A
Other languages
English (en)
Korean (ko)
Other versions
KR20030007515A (ko
Inventor
다카이히데유키
Original Assignee
다이셀 가가꾸 고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001084195A external-priority patent/JP4663893B2/ja
Priority claimed from JP2001143835A external-priority patent/JP5226162B2/ja
Priority claimed from JP2001193430A external-priority patent/JP4795570B2/ja
Application filed by 다이셀 가가꾸 고교 가부시끼가이샤 filed Critical 다이셀 가가꾸 고교 가부시끼가이샤
Publication of KR20030007515A publication Critical patent/KR20030007515A/ko
Application granted granted Critical
Publication of KR100877124B1 publication Critical patent/KR100877124B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D407/00—Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group C07D405/00
    • C07D407/02—Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group C07D405/00 containing two hetero rings
    • C07D407/12—Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group C07D405/00 containing two hetero rings linked by a chain containing hetero atoms as chain links
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
    • C07D303/22—Ethers with hydroxy compounds containing no oxirane rings with monohydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D301/00—Preparation of oxiranes
    • C07D301/02—Synthesis of the oxirane ring
    • C07D301/03—Synthesis of the oxirane ring by oxidation of unsaturated compounds, or of mixtures of unsaturated and saturated compounds
    • C07D301/14—Synthesis of the oxirane ring by oxidation of unsaturated compounds, or of mixtures of unsaturated and saturated compounds with organic peracids, or salts, anhydrides or esters thereof
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/16—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by esterified hydroxyl radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Epoxy Resins (AREA)
  • Epoxy Compounds (AREA)
KR1020027013628A 2001-03-23 2002-03-22 에폭시 화합물의 제조방법, 에폭시수지 조성물 및 그용도, 및 자외선경화형 캔용 도료조성물 및 도장금속캔의제조방법 Expired - Fee Related KR100877124B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2001084195A JP4663893B2 (ja) 2001-03-23 2001-03-23 エポキシ化合物の製造方法
JPJP-P-2001-00084195 2001-03-23
JP2001143835A JP5226162B2 (ja) 2001-05-14 2001-05-14 液状エポキシ樹脂組成物及びその用途
JPJP-P-2001-00143835 2001-05-14
JP2001193430A JP4795570B2 (ja) 2001-06-26 2001-06-26 紫外線硬化型缶用塗料組成物及び塗装金属缶の製造方法
JPJP-P-2001-00193430 2001-06-26
PCT/JP2002/002778 WO2002076966A1 (en) 2001-03-23 2002-03-22 Process for producing epoxy compound, epoxy resin composition and use thereof, ultraviolet-curable can coating composition, and process for producing coated metal can

Publications (2)

Publication Number Publication Date
KR20030007515A KR20030007515A (ko) 2003-01-23
KR100877124B1 true KR100877124B1 (ko) 2009-01-07

Family

ID=27346334

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027013628A Expired - Fee Related KR100877124B1 (ko) 2001-03-23 2002-03-22 에폭시 화합물의 제조방법, 에폭시수지 조성물 및 그용도, 및 자외선경화형 캔용 도료조성물 및 도장금속캔의제조방법

Country Status (7)

Country Link
US (2) US20030059618A1 (enExample)
EP (2) EP1389615A4 (enExample)
KR (1) KR100877124B1 (enExample)
CN (1) CN1243744C (enExample)
CA (1) CA2439608A1 (enExample)
TW (1) TWI298065B (enExample)
WO (1) WO2002076966A1 (enExample)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030059618A1 (en) * 2001-03-23 2003-03-27 Hideyuke Takai Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can
KR100946609B1 (ko) * 2001-09-14 2010-03-09 스미또모 가가꾸 가부시끼가이샤 광반도체 봉지용 수지 조성물
EP1541567A4 (en) * 2002-09-05 2010-11-17 Daicel Chem PROCESS FOR THE PREPARATION OF DIEPOXY ALICYCLIC COMPOUNDS, CURABLE EPOXY RESIN COMPOSITIONS, EPOXY RESIN COMPOSITIONS FOR ENCAPSULATION OF ELECTRONIC COMPONENTS, STABILIZERS FOR ELECTRICALLY INSULATING OILS, AND EPOXY RESIN COMPOSITIONS FOR ELECTRO ISOLATION
JP2004099467A (ja) * 2002-09-05 2004-04-02 Daicel Chem Ind Ltd 脂環式エポキシ化合物の製造方法
JP2004210932A (ja) * 2002-12-27 2004-07-29 Daicel Chem Ind Ltd 硬化性樹脂組成物及び硬化物
TWI340763B (en) * 2003-02-20 2011-04-21 Nippon Kayaku Kk Seal agent for photoelectric conversion elements and photoelectric conversion elements using such seal agent
JP3797348B2 (ja) * 2003-02-24 2006-07-19 コニカミノルタホールディングス株式会社 活性エネルギー線硬化組成物
JP3973611B2 (ja) * 2003-08-25 2007-09-12 ダイセル化学工業株式会社 熱硬化型エポキシ樹脂組成物および透明材料
CN1875045A (zh) * 2003-11-03 2006-12-06 联合碳化化学及塑料技术公司 更韧的脂环族环氧树脂
WO2005090325A1 (ja) * 2004-03-18 2005-09-29 Daicel Chemical Industries, Ltd. 高純度脂環式 エポキシ化合物、その製造方法、硬化性エポキシ樹脂組成物、その硬化物、および用途
GB0412196D0 (en) * 2004-06-02 2004-07-07 Hexcel Composites Ltd Cure accelerators
WO2006054461A1 (ja) * 2004-11-18 2006-05-26 Konica Minolta Medical & Graphic, Inc. 活性光線硬化組成物、インク活性光線硬化型インク及び画像形成方法
KR101235529B1 (ko) * 2004-12-16 2013-02-21 가부시끼가이샤 다이셀 열경화성 에폭시 수지 조성물 및 그의 용도
JP4688503B2 (ja) * 2005-01-07 2011-05-25 ダイセル化学工業株式会社 高純度脂環式ジエポキシ化合物およびその製造方法
WO2006077693A1 (ja) * 2005-01-21 2006-07-27 Konica Minolta Medical & Graphic, Inc. 重合性活性光線硬化組成物、重合方法、活性光線硬化型インク及び画像形成方法、インクジェット記録装置並びにエポキシ化合物
JP4636469B2 (ja) * 2005-09-02 2011-02-23 ダイセル化学工業株式会社 体積型ホログラム記録用感光性組成物
JP5340726B2 (ja) * 2006-04-18 2013-11-13 株式会社ダイセル 環状オレフィン化合物の製造方法
DE602006013356D1 (de) * 2006-07-13 2010-05-12 Telecom Italia Spa Tintenstrahlpatrone mit einer aus einer härtbaren harzzusammensetzung hergestellten schicht
JP5226223B2 (ja) * 2007-01-31 2013-07-03 株式会社ダイセル 透明封止材料及び透明封止物
JP5226224B2 (ja) * 2007-01-31 2013-07-03 株式会社ダイセル 硬化性樹脂組成物及び光導波路
JP5289713B2 (ja) * 2007-02-01 2013-09-11 株式会社ダイセル 硬化性樹脂組成物及びその硬化物
JP5248787B2 (ja) * 2007-02-06 2013-07-31 株式会社ダイセル 光硬化性樹脂組成物及び塗装物
JP5154090B2 (ja) * 2007-02-10 2013-02-27 株式会社ダイセル 活性エネルギー線硬化型インク及び印刷物
JP5248790B2 (ja) * 2007-03-02 2013-07-31 株式会社ダイセル 繊維強化複合材料用エポキシ樹脂組成物及び繊維強化複合材料
JP5638812B2 (ja) 2010-02-01 2014-12-10 株式会社ダイセル 硬化性エポキシ樹脂組成物
ES2416466T3 (es) 2011-03-31 2013-08-01 Henkel Ag & Co. Kgaa Fórmula de una laca para la superficie interior de un bote o tarro
JP6005035B2 (ja) * 2011-04-08 2016-10-12 Ｊｘエネルギー株式会社 樹脂組成物、その硬化物及びそれを用いた光半導体装置
JPWO2013153988A1 (ja) * 2012-04-13 2015-12-17 株式会社ダイセル ジエポキシ化合物、及びその製造方法
KR20150090073A (ko) * 2012-11-27 2015-08-05 주식회사 다이셀 미세 구조체의 제조 방법 및 나노임프린트용 광경화성 조성물
DE102012223356A1 (de) 2012-12-17 2014-06-18 Henkel Ag & Co. Kgaa Verfahren zur Herstellung beschichteter Dosendeckel
DE102012223355A1 (de) 2012-12-17 2014-06-18 Henkel Ag & Co. Kgaa Hochvernetzende Lackformulierung für Doseninnenflächen
CN105308092B (zh) * 2013-10-30 2018-01-30 积水化学工业株式会社 有机el显示元件用密封剂
JP6204420B2 (ja) 2015-08-07 2017-09-27 株式会社ダイセル 硬化性組成物、及びそれを用いた光学素子
AR108133A1 (es) * 2016-04-15 2018-07-18 Valspar Sourcing Inc Composiciones de revestimiento que contienen copolímeros libres de estireno
WO2018015790A1 (en) * 2016-07-22 2018-01-25 Prysmian S.P.A. Optical fibre coated with a polyester coating
WO2018075762A1 (en) 2016-10-19 2018-04-26 Valspar Sourcing, Inc. Alkali-soluble resin additives and coating compositions including such additives
KR20190070913A (ko) 2016-10-21 2019-06-21 도레이 카부시키가이샤 에폭시 수지 조성물 및 이로부터 제조된 섬유 강화 복합 재료
US10191405B2 (en) * 2016-11-11 2019-01-29 Xerox Corporation Electrostatic charging member
TWI675074B (zh) * 2016-12-09 2019-10-21 南韓商Ｌｇ化學股份有限公司 封裝組成物
KR102118365B1 (ko) * 2017-04-21 2020-06-04 주식회사 엘지화학 유기전자소자 봉지용 조성물
CN117165157A (zh) 2017-09-01 2023-12-05 宣伟投资管理有限公司 多级聚合物胶乳、含有该胶乳的涂料及其涂布的制品
WO2019046700A1 (en) 2017-09-01 2019-03-07 Swimc Llc MULTI-STAGE POLYMER LATEX, COATING COMPOSITIONS CONTAINING SUCH LATEX, AND ARTICLES THEREOF
CN107734847A (zh) * 2017-10-16 2018-02-23 江苏赛博宇华科技有限公司 一种手机电路板
JP7009201B2 (ja) * 2017-12-21 2022-02-10 デクセリアルズ株式会社 化合物、カチオン硬化剤、及びカチオン硬化性組成物
ES2967433T3 (es) * 2018-01-19 2024-04-30 Prysmian Spa Fibra óptica con recubrimiento reticulado de poliéster
JP6606316B1 (ja) 2018-03-28 2019-11-13 日本板硝子株式会社 樹脂組成物の硬化物、積層体、及び樹脂組成物
CN109738257A (zh) * 2019-02-28 2019-05-10 山东科技大学 一种粉煤煤岩光片的制备方法
KR102895653B1 (ko) * 2019-05-02 2025-12-08 삼성디스플레이 주식회사 잉크 조성물, 이를 이용한 윈도우 및 이를 이용한 윈도우 제조 방법
ES2982344T3 (es) 2019-10-02 2024-10-15 Toray Industries Composición de resina de benzoxazina, producto preimpregnado y material compuesto reforzado con fibra

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3075955A (en) * 1960-03-31 1963-01-29 Union Carbide Corp Polyepoxy sulfones
GB2008593A (en) * 1977-11-26 1979-06-06 Akzo Nv Process for the preparation of epoxides
JPS58172387A (ja) * 1982-03-26 1983-10-11 バイエル・アクチエンゲゼルシヤフト ２，２−ジシクロヘキセニルプロパンジエポキシドの製造方法
EP0844262A2 (en) * 1996-11-26 1998-05-27 Asahi Denka Kogyo Kabushiki Kaisha Energy beam curable epoxy resin composition, stereolithographic resin composition and stereolithographic method
JPH11255863A (ja) * 1998-03-06 1999-09-21 Asahi Denka Kogyo Kk 硬化性組成物

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE523503A (enExample) * 1952-11-03
DE1418465A1 (de) 1959-03-16 1968-10-03 Wacker Chemie Gmbh Verfahren zur Herstellung von Peressigsaeureloesungen
US3271371A (en) * 1960-03-31 1966-09-06 Union Carbide Corp Cured diepoxy sulfone and polyfunctional amine compositions
GB996064A (en) * 1960-08-24 1965-06-23 Union Carbide Corp Improvements in and relating to epoxy resins
US3278456A (en) * 1960-12-27 1966-10-11 Union Carbide Corp Diepoxide compositions
JPS5010636B2 (enExample) 1971-08-20 1975-04-23
IT1009956B (it) * 1973-06-12 1976-12-20 Gen Electric Liquido impregnante costituito da estere stabilizzato
JPS5335999A (en) * 1976-09-16 1978-04-03 Nissin Electric Co Ltd Capacitor
JPS543006A (en) 1977-06-07 1979-01-11 Daicel Chem Ind Ltd Preparation of peracetic acid solution
JPS59136321A (ja) * 1983-01-26 1984-08-04 Nitto Electric Ind Co Ltd 光半導体封止用エポキシ樹脂組成物
JPS61213204A (ja) * 1985-03-19 1986-09-22 Sanyo Kokusaku Pulp Co Ltd 紫外線硬化樹脂組成物
JPH02169620A (ja) * 1988-12-22 1990-06-29 Mitsui Petrochem Ind Ltd 硬化用エポキシ樹脂組成物、ならびに、この組成物からなる透明樹脂板、半導体装置用透明窓材および液晶パネル用透明基板
US5378736A (en) * 1990-05-30 1995-01-03 Daicel Chemical Industries, Ltd. Composition comprising novel alicyclic compound, process for preparation thereof, curable composition, and photo-polymerizable composition
JPH04325519A (ja) * 1991-04-25 1992-11-13 Nippon Paint Co Ltd 尿素系触媒性硬化剤およびそれを含む樹脂組成物
JPH05239043A (ja) * 1991-10-03 1993-09-17 Daicel Chem Ind Ltd 酢酸とシクロヘキセンオキシドの分離方法
EP0859021A3 (en) * 1991-10-31 1998-11-11 Daicel Chemical Industries, Ltd. Epoxidised compositions
JP2537583B2 (ja) * 1992-01-23 1996-09-25 住友ベークライト株式会社 液状エポキシ樹脂組成物
JPH05279451A (ja) * 1992-03-31 1993-10-26 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びその硬化物
JPH0745126A (ja) * 1993-07-28 1995-02-14 Meidensha Corp 含浸用樹脂組成物
JPH07196774A (ja) * 1993-12-28 1995-08-01 Sumitomo Bakelite Co Ltd 液状エポキシ樹脂組成物
JP3841858B2 (ja) * 1995-11-01 2006-11-08 凸版印刷株式会社 多層プリント配線板用絶縁層樹脂組成物
JPH09176288A (ja) * 1995-12-28 1997-07-08 Hitachi Ltd エポキシ樹脂組成物および絶縁スペーサ
JPH09255764A (ja) 1996-03-26 1997-09-30 Nitto Denko Corp 光半導体封止用エポキシ樹脂組成物硬化体およびそれを用いた光半導体装置
JPH10158581A (ja) 1996-12-05 1998-06-16 Kansai Paint Co Ltd 紫外線硬化型缶用塗料組成物
JP3409648B2 (ja) * 1997-06-16 2003-05-26 東洋インキ製造株式会社 紫外線硬化型樹脂組成物
JPH11106474A (ja) * 1997-10-03 1999-04-20 Hitachi Chem Co Ltd 半導体封止用液状エポキシ樹脂組成物
JPH11152441A (ja) * 1997-11-21 1999-06-08 Kansai Paint Co Ltd 紫外線硬化型缶用塗料組成物
WO1999041296A1 (en) * 1998-02-11 1999-08-19 Rensselaer Polytechnic Institute Photopolymerizable compositions containing cycloaliphatic epoxyalcohol monomers
CA2269378C (en) * 1998-04-17 2008-04-01 Ajinomoto Co., Inc. Curable resin composition
JP2886853B1 (ja) * 1998-06-08 1999-04-26 関西ペイント株式会社 カチオン重合性塗料組成物
US6287748B1 (en) * 1998-07-10 2001-09-11 Dsm N.V. Solid imaging compositions for preparing polyethylene-like articles
US6210790B1 (en) * 1998-07-15 2001-04-03 Rensselaer Polytechnic Institute Glass-like composites comprising a surface-modified colloidal silica and method of making thereof
JP4124295B2 (ja) 1998-08-20 2008-07-23 株式会社Ａｄｅｋａ 硬化性組成物
JP4274444B2 (ja) 1998-12-10 2009-06-10 株式会社Ａｄｅｋａ オレフィン化合物の製造方法
DE10001228B4 (de) * 2000-01-13 2007-01-04 3M Espe Ag Polymerisierbare Zubereitungen auf der Basis von siliziumhaltigen Epoxiden
US6566029B2 (en) * 2000-12-13 2003-05-20 Fuji Photo Film Co., Ltd. Lithographic printing plate precursor
US20030059618A1 (en) * 2001-03-23 2003-03-27 Hideyuke Takai Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can
JP4795570B2 (ja) * 2001-06-26 2011-10-19 ダイセル化学工業株式会社 紫外線硬化型缶用塗料組成物及び塗装金属缶の製造方法
JP4743736B2 (ja) * 2001-08-31 2011-08-10 株式会社Adeka 光学的立体造形用樹脂組成物およびこれを用いた光学的立体造形方法
JP2003109780A (ja) * 2001-09-28 2003-04-11 Hitachi Unisia Automotive Ltd 車両用ランプ点灯装置
JP2004099467A (ja) * 2002-09-05 2004-04-02 Daicel Chem Ind Ltd 脂環式エポキシ化合物の製造方法
JP2004182648A (ja) * 2002-12-03 2004-07-02 Daicel Chem Ind Ltd 脂環式ジエポキシ化合物の製造方法
JP2004204228A (ja) * 2002-12-13 2004-07-22 Daicel Chem Ind Ltd 硬化性エポキシ樹脂組成物および硬化物
JP2004262874A (ja) * 2003-03-03 2004-09-24 Daicel Chem Ind Ltd ジエポキシシクロオクタン類の製造方法
JP4426324B2 (ja) * 2004-01-21 2010-03-03 ダイセル化学工業株式会社 非エステル型エポキシ樹脂および樹脂組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3075955A (en) * 1960-03-31 1963-01-29 Union Carbide Corp Polyepoxy sulfones
GB2008593A (en) * 1977-11-26 1979-06-06 Akzo Nv Process for the preparation of epoxides
JPS58172387A (ja) * 1982-03-26 1983-10-11 バイエル・アクチエンゲゼルシヤフト ２，２−ジシクロヘキセニルプロパンジエポキシドの製造方法
EP0844262A2 (en) * 1996-11-26 1998-05-27 Asahi Denka Kogyo Kabushiki Kaisha Energy beam curable epoxy resin composition, stereolithographic resin composition and stereolithographic method
JPH11255863A (ja) * 1998-03-06 1999-09-21 Asahi Denka Kogyo Kk 硬化性組成物

Also Published As

Publication number Publication date
US20040242839A1 (en) 2004-12-02
WO2002076966A1 (en) 2002-10-03
TWI298065B (enExample) 2008-06-21
US20030059618A1 (en) 2003-03-27
CN1243744C (zh) 2006-03-01
CN1458927A (zh) 2003-11-26
EP1389615A4 (en) 2005-09-07
CA2439608A1 (en) 2002-10-03
US7786224B2 (en) 2010-08-31
KR20030007515A (ko) 2003-01-23
EP1389615A1 (en) 2004-02-18
EP2031006A1 (en) 2009-03-04

Similar Documents

Publication Publication Date Title
KR100877124B1 (ko) 에폭시 화합물의 제조방법, 에폭시수지 조성물 및 그용도, 및 자외선경화형 캔용 도료조성물 및 도장금속캔의제조방법
CN1325559C (zh) 环氧树脂组合物、可紫外线固化型罐头用涂料组合物、及用途
JP5226162B2 (ja) 液状エポキシ樹脂組成物及びその用途
JP5248787B2 (ja) 光硬化性樹脂組成物及び塗装物
JP2011509339A (ja) 複合材料用の高Ｔｇエポキシ系
EP3431470B1 (en) Epoxy compound, curable composition, cured product, method for producing epoxy compound, and reactive diluent
WO2017159637A1 (ja) エポキシ化合物、硬化性組成物、硬化物、エポキシ化合物の製造方法および反応性希釈剤
EP2995632A1 (en) Curable epoxy resin composition and cured product thereof, diolefin compound and production method therefor, and production method for diepoxy compound
JP4329879B2 (ja) 活性エネルギー線硬化性組成物及びその製造方法
JP5301997B2 (ja) 液状エポキシ樹脂組成物及びエポキシ樹脂硬化物
JP4795570B2 (ja) 紫外線硬化型缶用塗料組成物及び塗装金属缶の製造方法
JP6644659B2 (ja) エポキシ化合物、硬化性組成物、硬化物、エポキシ化合物の製造方法および反応性希釈剤
JP4786200B2 (ja) 紫外線硬化型缶用塗料組成物、塗装金属板、および塗装金属缶
JPWO2004029126A1 (ja) カチオン重合型組成物用硬化促進剤
US3472796A (en) Tetracyclo epoxy ether monomer and compositions
WO2014181699A1 (ja) 硬化性エポキシ樹脂組成物及びその硬化物
JP2023145203A (ja) エポキシ化合物、硬化性組成物および硬化物
WO2025100400A1 (ja) エポキシ化合物製品
JPH10212335A (ja) アルケニルサリチル酸構造を有する新規エポキシ樹脂
Verschueren et al. Cycloaliphatic epoxide resins for cationic UV-Cure
WO2023190191A1 (ja) エポキシ樹脂組成物、封止材および画像表示装置
JPWO2001047907A1 (ja) 脂環式エポキシ含有エステル及びその製造方法
JP2000044670A (ja) オキセタニル基を有する化合物およびそれを成分とする硬化性組成物

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

J201 Request for trial against refusal decision
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PB0901 Examination by re-examination before a trial

St.27 status event code: A-6-3-E10-E12-rex-PB0901

B701 Decision to grant
PB0701 Decision of registration after re-examination before a trial

St.27 status event code: A-3-4-F10-F13-rex-PB0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20121130

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20131210

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

FPAY Annual fee payment

Payment date: 20141205

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20151201

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20161227

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20161227

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000