CN1243744C - 环氧化合物的制造方法 - Google Patents
环氧化合物的制造方法 Download PDFInfo
- Publication number
- CN1243744C CN1243744C CNB028007492A CN02800749A CN1243744C CN 1243744 C CN1243744 C CN 1243744C CN B028007492 A CNB028007492 A CN B028007492A CN 02800749 A CN02800749 A CN 02800749A CN 1243744 C CN1243744 C CN 1243744C
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- CN
- China
- Prior art keywords
- compound
- weight
- epoxy compound
- acid
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D407/00—Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group C07D405/00
- C07D407/02—Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group C07D405/00 containing two hetero rings
- C07D407/12—Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group C07D405/00 containing two hetero rings linked by a chain containing hetero atoms as chain links
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
- C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
- C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
- C07D303/22—Ethers with hydroxy compounds containing no oxirane rings with monohydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D301/00—Preparation of oxiranes
- C07D301/02—Synthesis of the oxirane ring
- C07D301/03—Synthesis of the oxirane ring by oxidation of unsaturated compounds, or of mixtures of unsaturated and saturated compounds
- C07D301/14—Synthesis of the oxirane ring by oxidation of unsaturated compounds, or of mixtures of unsaturated and saturated compounds with organic peracids, or salts, anhydrides or esters thereof
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
- C07D303/16—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by esterified hydroxyl radicals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Epoxy Resins (AREA)
- Epoxy Compounds (AREA)
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP84195/2001 | 2001-03-23 | ||
| JP84195/01 | 2001-03-23 | ||
| JP2001084195A JP4663893B2 (ja) | 2001-03-23 | 2001-03-23 | エポキシ化合物の製造方法 |
| JP2001143835A JP5226162B2 (ja) | 2001-05-14 | 2001-05-14 | 液状エポキシ樹脂組成物及びその用途 |
| JP143835/01 | 2001-05-14 | ||
| JP143835/2001 | 2001-05-14 | ||
| JP193430/01 | 2001-06-26 | ||
| JP193430/2001 | 2001-06-26 | ||
| JP2001193430A JP4795570B2 (ja) | 2001-06-26 | 2001-06-26 | 紫外線硬化型缶用塗料組成物及び塗装金属缶の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100668235A Division CN1325559C (zh) | 2001-03-23 | 2002-03-22 | 环氧树脂组合物、可紫外线固化型罐头用涂料组合物、及用途 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1458927A CN1458927A (zh) | 2003-11-26 |
| CN1243744C true CN1243744C (zh) | 2006-03-01 |
Family
ID=27346334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB028007492A Expired - Fee Related CN1243744C (zh) | 2001-03-23 | 2002-03-22 | 环氧化合物的制造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20030059618A1 (enExample) |
| EP (2) | EP1389615A4 (enExample) |
| KR (1) | KR100877124B1 (enExample) |
| CN (1) | CN1243744C (enExample) |
| CA (1) | CA2439608A1 (enExample) |
| TW (1) | TWI298065B (enExample) |
| WO (1) | WO2002076966A1 (enExample) |
Families Citing this family (49)
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| US20030059618A1 (en) * | 2001-03-23 | 2003-03-27 | Hideyuke Takai | Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can |
| EP1426394A4 (en) * | 2001-09-14 | 2010-11-03 | Sumitomo Chemical Co | Resin composition for optical-semiconductor encapsulation |
| EP1541567A4 (en) * | 2002-09-05 | 2010-11-17 | Daicel Chem | PROCESS FOR THE PREPARATION OF DIEPOXY ALICYCLIC COMPOUNDS, CURABLE EPOXY RESIN COMPOSITIONS, EPOXY RESIN COMPOSITIONS FOR ENCAPSULATION OF ELECTRONIC COMPONENTS, STABILIZERS FOR ELECTRICALLY INSULATING OILS, AND EPOXY RESIN COMPOSITIONS FOR ELECTRO ISOLATION |
| JP2004099467A (ja) * | 2002-09-05 | 2004-04-02 | Daicel Chem Ind Ltd | 脂環式エポキシ化合物の製造方法 |
| JP2004210932A (ja) * | 2002-12-27 | 2004-07-29 | Daicel Chem Ind Ltd | 硬化性樹脂組成物及び硬化物 |
| TWI340763B (en) * | 2003-02-20 | 2011-04-21 | Nippon Kayaku Kk | Seal agent for photoelectric conversion elements and photoelectric conversion elements using such seal agent |
| JP3797348B2 (ja) * | 2003-02-24 | 2006-07-19 | コニカミノルタホールディングス株式会社 | 活性エネルギー線硬化組成物 |
| JP3973611B2 (ja) * | 2003-08-25 | 2007-09-12 | ダイセル化学工業株式会社 | 熱硬化型エポキシ樹脂組成物および透明材料 |
| KR20060113912A (ko) * | 2003-11-03 | 2006-11-03 | 유니온 카바이드 케미칼즈 앤드 플라스틱스 테크날러지 코포레이션 | 강한 인성의 지환족 에폭시드 수지 |
| US20070179256A1 (en) * | 2004-03-18 | 2007-08-02 | Kyuhei Kitao | High-purity alicyclic epoxy compound, process for production of the same, curable epoxy resin composition, cured product thereof, and application thereof |
| GB0412196D0 (en) * | 2004-06-02 | 2004-07-07 | Hexcel Composites Ltd | Cure accelerators |
| EP1829936A4 (en) * | 2004-11-18 | 2008-08-27 | Konica Minolta Med & Graphic | ACTIALLY HARDENABLE COMPOSITION, ACTIALLY HARDENABLE INK AND IMAGING METHOD |
| US7825197B2 (en) * | 2004-12-16 | 2010-11-02 | Daicel Chemical Industries, Ltd. | Composition containing cycloaliphatic epoxide, polyol oligomer, curing agent and curing accelerator |
| JP4688503B2 (ja) * | 2005-01-07 | 2011-05-25 | ダイセル化学工業株式会社 | 高純度脂環式ジエポキシ化合物およびその製造方法 |
| EP1840148A1 (en) * | 2005-01-21 | 2007-10-03 | Konica Minolta Medical & Graphic, Inc. | Polymerizable actinic radiation curable composition, polymerization method, actinic radiation curable ink and image formation method, and ink jet recording apparatus and epoxy compound |
| JP4636469B2 (ja) * | 2005-09-02 | 2011-02-23 | ダイセル化学工業株式会社 | 体積型ホログラム記録用感光性組成物 |
| WO2007119743A1 (ja) * | 2006-04-18 | 2007-10-25 | Daicel Chemical Industries, Ltd. | 環状オレフィン化合物の製造方法 |
| US8197033B2 (en) | 2006-07-13 | 2012-06-12 | Telecom Italia S.P.A. | Ink jet cartridge comprising a layer made by a curable resin composition |
| JP5226224B2 (ja) * | 2007-01-31 | 2013-07-03 | 株式会社ダイセル | 硬化性樹脂組成物及び光導波路 |
| JP5226223B2 (ja) * | 2007-01-31 | 2013-07-03 | 株式会社ダイセル | 透明封止材料及び透明封止物 |
| JP5289713B2 (ja) * | 2007-02-01 | 2013-09-11 | 株式会社ダイセル | 硬化性樹脂組成物及びその硬化物 |
| JP5248787B2 (ja) * | 2007-02-06 | 2013-07-31 | 株式会社ダイセル | 光硬化性樹脂組成物及び塗装物 |
| JP5154090B2 (ja) * | 2007-02-10 | 2013-02-27 | 株式会社ダイセル | 活性エネルギー線硬化型インク及び印刷物 |
| JP5248790B2 (ja) * | 2007-03-02 | 2013-07-31 | 株式会社ダイセル | 繊維強化複合材料用エポキシ樹脂組成物及び繊維強化複合材料 |
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| WO2013153988A1 (ja) * | 2012-04-13 | 2013-10-17 | 株式会社ダイセル | ジエポキシ化合物、及びその製造方法 |
| JPWO2014084030A1 (ja) * | 2012-11-27 | 2017-01-05 | 株式会社ダイセル | 微細構造体の製造方法及びナノインプリント用光硬化性組成物 |
| DE102012223355A1 (de) | 2012-12-17 | 2014-06-18 | Henkel Ag & Co. Kgaa | Hochvernetzende Lackformulierung für Doseninnenflächen |
| DE102012223356A1 (de) | 2012-12-17 | 2014-06-18 | Henkel Ag & Co. Kgaa | Verfahren zur Herstellung beschichteter Dosendeckel |
| CN105308092B (zh) * | 2013-10-30 | 2018-01-30 | 积水化学工业株式会社 | 有机el显示元件用密封剂 |
| JP6204420B2 (ja) * | 2015-08-07 | 2017-09-27 | 株式会社ダイセル | 硬化性組成物、及びそれを用いた光学素子 |
| AR108133A1 (es) | 2016-04-15 | 2018-07-18 | Valspar Sourcing Inc | Composiciones de revestimiento que contienen copolímeros libres de estireno |
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| KR102118365B1 (ko) | 2017-04-21 | 2020-06-04 | 주식회사 엘지화학 | 유기전자소자 봉지용 조성물 |
| DE112018004897T5 (de) | 2017-09-01 | 2020-06-10 | Swimc Llc | Mehrstufige, polymere latizes, diese latizes enthaltende beschichtungszusammensetzungen und damit beschichtete artikel |
| CA3073845A1 (en) | 2017-09-01 | 2019-03-07 | Swimc Llc | Multi-stage polymeric latexes, coating compositions containing such latexes, and articles coated therewith |
| CN107734847A (zh) * | 2017-10-16 | 2018-02-23 | 江苏赛博宇华科技有限公司 | 一种手机电路板 |
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| CN111655646B (zh) * | 2018-01-19 | 2022-08-12 | 普睿司曼股份公司 | 具有交联聚酯涂层的光纤 |
| US11912870B2 (en) * | 2018-03-28 | 2024-02-27 | Nippon Sheet Glass Company, Limited | Cured product of resin composition, laminate, and resin composition |
| CN109738257A (zh) * | 2019-02-28 | 2019-05-10 | 山东科技大学 | 一种粉煤煤岩光片的制备方法 |
| KR102895653B1 (ko) * | 2019-05-02 | 2025-12-08 | 삼성디스플레이 주식회사 | 잉크 조성물, 이를 이용한 윈도우 및 이를 이용한 윈도우 제조 방법 |
| WO2021064458A1 (en) | 2019-10-02 | 2021-04-08 | Toray Industries, Inc. | Benzoxazine resin composition, prepreg, and fiber-reinforced composite material |
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-
2002
- 2002-03-20 US US10/103,645 patent/US20030059618A1/en not_active Abandoned
- 2002-03-21 TW TW91105417A patent/TWI298065B/zh not_active IP Right Cessation
- 2002-03-22 WO PCT/JP2002/002778 patent/WO2002076966A1/ja not_active Ceased
- 2002-03-22 EP EP02708643A patent/EP1389615A4/en not_active Withdrawn
- 2002-03-22 EP EP20080015089 patent/EP2031006A1/en not_active Withdrawn
- 2002-03-22 CA CA 2439608 patent/CA2439608A1/en not_active Abandoned
- 2002-03-22 KR KR1020027013628A patent/KR100877124B1/ko not_active Expired - Fee Related
- 2002-03-22 CN CNB028007492A patent/CN1243744C/zh not_active Expired - Fee Related
-
2004
- 2004-07-01 US US10/883,162 patent/US7786224B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1389615A1 (en) | 2004-02-18 |
| TWI298065B (enExample) | 2008-06-21 |
| KR20030007515A (ko) | 2003-01-23 |
| KR100877124B1 (ko) | 2009-01-07 |
| EP2031006A1 (en) | 2009-03-04 |
| CN1458927A (zh) | 2003-11-26 |
| CA2439608A1 (en) | 2002-10-03 |
| US20030059618A1 (en) | 2003-03-27 |
| EP1389615A4 (en) | 2005-09-07 |
| US7786224B2 (en) | 2010-08-31 |
| WO2002076966A1 (en) | 2002-10-03 |
| US20040242839A1 (en) | 2004-12-02 |
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