JP2016504751A5 - - Google Patents

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Publication number
JP2016504751A5
JP2016504751A5 JP2015536868A JP2015536868A JP2016504751A5 JP 2016504751 A5 JP2016504751 A5 JP 2016504751A5 JP 2015536868 A JP2015536868 A JP 2015536868A JP 2015536868 A JP2015536868 A JP 2015536868A JP 2016504751 A5 JP2016504751 A5 JP 2016504751A5
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JP
Japan
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standoff
thin
conductive material
height
chip
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JP2015536868A
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Japanese (ja)
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JP2016504751A (ja
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Priority claimed from US13/844,638 external-priority patent/US9171794B2/en
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JP2015536868A 2012-10-09 2013-10-09 ポリマー内への薄型チップの埋込み Pending JP2016504751A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261711629P 2012-10-09 2012-10-09
US61/711,629 2012-10-09
US13/844,638 US9171794B2 (en) 2012-10-09 2013-03-15 Embedding thin chips in polymer
US13/844,638 2013-03-15
PCT/US2013/064152 WO2014059032A1 (en) 2012-10-09 2013-10-09 Embedding thin chips in polymer

Publications (2)

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JP2016504751A JP2016504751A (ja) 2016-02-12
JP2016504751A5 true JP2016504751A5 (https=) 2016-10-13

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JP2015536868A Pending JP2016504751A (ja) 2012-10-09 2013-10-09 ポリマー内への薄型チップの埋込み

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US (3) US9171794B2 (https=)
EP (1) EP2907159A4 (https=)
JP (1) JP2016504751A (https=)
KR (1) KR20150067302A (https=)
CN (1) CN104798196A (https=)
WO (1) WO2014059032A1 (https=)

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