JP2001525118A - 接点を局限擦過させる膜プローブシステム - Google Patents
接点を局限擦過させる膜プローブシステムInfo
- Publication number
- JP2001525118A JP2001525118A JP50968198A JP50968198A JP2001525118A JP 2001525118 A JP2001525118 A JP 2001525118A JP 50968198 A JP50968198 A JP 50968198A JP 50968198 A JP50968198 A JP 50968198A JP 2001525118 A JP2001525118 A JP 2001525118A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- contacts
- probe assembly
- pad
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- 239000000523 sample Substances 0.000 title claims abstract description 74
- 230000033001 locomotion Effects 0.000 claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 238000012360 testing method Methods 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
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- 229910000629 Rh alloy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- DAQWSROBHHTPDO-UHFFFAOYSA-N [Ni].[Rh] Chemical compound [Ni].[Rh] DAQWSROBHHTPDO-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- -1 gold are preferred) Chemical class 0.000 description 1
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- 238000009413 insulation Methods 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.電気的デバイスを検査するプローブアセンブリにおいて、 (a)非圧縮性材料から成る前方支持体と、 (b)前記前方支持体に対し、上にある関係に位置する中心区域を有する可 撓性膜組立体と、 (c)前記中心区域に配置された複数個の剛強接点であって、各前記接点は ビームと接触部とを有し、各前記接触部は前記デバイス上の対応するパッドに 押圧掛合するよう適切な位置に配置されており、各前記ビームは前記中心区域 内に延びる対応する可撓性導体に電気的に接続されている複数個の剛強接点と 、 (d)各前記接点と、前記支持体との間に介挿された弾性部材を有する圧力 制御機構と、 (e)対応する前記接触部がそれぞれの前記パッドに押圧掛合するように置 かれた時、各前記ビームを押圧して傾動させ、各前記ビームの異なる部分を前 記前方支持体に対し、異なる距離動かし、前記傾動に従って、対応する前記パ ッドを横切って横方向の擦過運動を各前記接点に行わせるため、各前記接点を 駆動するよう各前記接点に対し局限して作用する運動制御機構とを具え、 各前記ビームが機械的歪みを受けないで、各前記ビームが前記傾動から復帰 し得るよう前記弾性部材を位置させたことを特徴とするプローブアセンブリ。 2.前記ビームの各1個が他のビームから独立して傾動し得るよう構成した請求 項1に記載のプローブアセンブリ。 3.後方ベースを設け、前記接触部のそれぞれと、対応する前記パッドとの間の 押圧掛合に応動して、前記デバイスに平行な位置に向け、前記後方ベースに対 し相対的に前記前方支持体を自動的に傾動させ得るよう、前記後方ベースに前 記前方支持体を傾動可能に結合した請求項1に記載のプローブアセンブリ。 4.対応する前記ビーム上の中心を外れた位置に固着された接触突起に、各前記 接点の前記接触部が含まれるよう構成した請求項1に記載のプローブアセンブ リ。 5.前記接点を対をなして設け、各前記対の接点のそれぞれの前記横方向の擦過 運動を反対方向にした請求項1に記載のプローブアセンブリ。 6.各前記接触部が対応する前記パッドに接触した後の各前記接点の横方向の前 記擦過運動の距離は、各接点がこの接触後、前記支持体と、対応する前記パッ ドとの間の間隔を減らすように移動する距離によって一様に定まっている請求 項1に記載のプローブアセンブリ。 7.前記弾性部材が単一の構造である請求項1に記載のプローブアセンブリ。 8.前記接点が列と、行とに配置されている請求項1に記載のプローブアセンブ リ。 9.各前記ビームが対応する前記可撓性導体に対し、重複する関係に結合されて いる請求項1に記載のプローブアセンブリ。 10.前記可撓性膜組立体が前記中心区域に沿ってほぼ連続的である請求項1に記 載のプローブアセンブリ。 11.各前記接点を前記可撓性膜組立体の連続部分によって支持した請求項1に記 載のプローブアセンブリ。 12.電気デバイスを検査するにあたり、 (a)非圧縮性材料から成る前方支持体を設け、 (b)前記前方支持体に対し、上にある関係に位置する中心区域を有する可 撓性膜組立体を設け、 (c)前記中心区域に配置された複数個の剛強接点であって、各前記接点は ビームと接触部とを有し、各前記接触部は前記デバイス上の対応するパッドに 押圧掛合するよう適切な位置に配置されており、各前記ビームは前記中心区域 内に延びる対応する可撓性導体に電気的に接続されている複数個の剛強接点を 設け、 (d)各前記接点と、前記支持体との間に介挿された弾性部材を有する圧力 制御機構を設け、 (e)対応する前記接触部がそれぞれの前記パッドに押圧掛合するように置 かれた時、各前記ビームを押圧して傾動させ、各前記ビームの異なる部分を前 記前方支持体に対し、異なる距離動かし、前記傾動に従って、対応する前記パ ッドを横切って横方向の擦過運動に各前記接点を駆動すると共に、更に、各前 記ビームが機械的歪みを受けないように、各前記接点が前記傾動から復帰し得 るよう前記弾性部材により前記傾動に弾性的に対向させることを特徴とする電 気デバイスの検査方法。 13.前記接点のうちの一層短い接点の直ぐ近くにある一層大きな接点が傾動する 時より一層遅く、前記一層短い接点を傾動させるよう押圧する請求項12に記 載の方法。 14.それぞれの前記接触部と、対応する前記パッドとの間の押圧掛合に応動して 、前記デバイスに平行な位置に向け、前記後方支持体に対し相対的に、前記前 方支持体を自動的に傾動させ得る後方支持体を前記前方支持体に傾動可能に結 合する請求項12に記載の方法。 15.前記接点を対をなして設け、各前記対の前記接点がそれぞれの前記横方向の 擦過運動を互いに反対方向に行うようこれ等接点を駆動する請求項12に記載 の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/695,077 US5914613A (en) | 1996-08-08 | 1996-08-08 | Membrane probing system with local contact scrub |
US08/695,077 | 1996-08-08 | ||
PCT/US1997/008292 WO1998007040A1 (en) | 1996-08-08 | 1997-05-02 | Membrane probing system with local contact scrub |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006005111A Division JP4237761B2 (ja) | 1996-08-08 | 2006-01-12 | 電気デバイスの検査方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001525118A true JP2001525118A (ja) | 2001-12-04 |
JP3942042B2 JP3942042B2 (ja) | 2007-07-11 |
Family
ID=24791467
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50968198A Expired - Fee Related JP3942042B2 (ja) | 1996-08-08 | 1997-05-02 | 接点を局所的に擦過させる膜プローブシステム |
JP2006005111A Expired - Lifetime JP4237761B2 (ja) | 1996-08-08 | 2006-01-12 | 電気デバイスの検査方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006005111A Expired - Lifetime JP4237761B2 (ja) | 1996-08-08 | 2006-01-12 | 電気デバイスの検査方法 |
Country Status (9)
Country | Link |
---|---|
US (8) | US5914613A (ja) |
EP (1) | EP0929819B1 (ja) |
JP (2) | JP3942042B2 (ja) |
KR (1) | KR100312835B1 (ja) |
AT (1) | ATE254289T1 (ja) |
AU (1) | AU3007797A (ja) |
DE (2) | DE69726169T2 (ja) |
ES (1) | ES2210530T3 (ja) |
WO (1) | WO1998007040A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005070050A (ja) * | 2003-08-25 | 2005-03-17 | Delaware Capital Formation Inc | 半導体回路のための検査インタフェースシステムと半導体パッケージを検査するためのコンタクタ |
JP2008506112A (ja) * | 2004-07-07 | 2008-02-28 | カスケード マイクロテック インコーポレイテッド | 膜懸垂プローブを具えるプローブヘッド |
WO2009090907A1 (ja) * | 2008-01-17 | 2009-07-23 | Alps Electric Co., Ltd. | プローブカードおよびその製造方法 |
KR102532503B1 (ko) * | 2022-09-01 | 2023-05-17 | 주식회사 프로이천 | 프로브니들 |
Families Citing this family (104)
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US5729150A (en) | 1995-12-01 | 1998-03-17 | Cascade Microtech, Inc. | Low-current probe card with reduced triboelectric current generating cables |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
US5914613A (en) * | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US6034533A (en) | 1997-06-10 | 2000-03-07 | Tervo; Paul A. | Low-current pogo probe card |
JP3693218B2 (ja) * | 1998-03-09 | 2005-09-07 | 富士通株式会社 | 半導体装置用コンタクタ |
US6256882B1 (en) * | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
JP3730428B2 (ja) * | 1998-12-22 | 2006-01-05 | 富士通株式会社 | 半導体装置試験用コンタクタの製造方法 |
US6578264B1 (en) | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
EP1210208A4 (en) * | 1999-07-21 | 2005-07-06 | Cascade Microtech Inc | MEMBRANE CONTROL SYSTEM |
US6468098B1 (en) | 1999-08-17 | 2002-10-22 | Formfactor, Inc. | Electrical contactor especially wafer level contactor using fluid pressure |
US6838890B2 (en) * | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
US6426638B1 (en) * | 2000-05-02 | 2002-07-30 | Decision Track Llc | Compliant probe apparatus |
WO2001084900A1 (en) * | 2000-05-02 | 2001-11-08 | Thomas Di Stefano | Connector apparatus |
FR2811084B1 (fr) * | 2000-06-29 | 2002-10-25 | Bioalliance Pharma | Methode d'identification d'une caracteristique biologique fonctionnelle d'une matiere vivante |
US6462568B1 (en) * | 2000-08-31 | 2002-10-08 | Micron Technology, Inc. | Conductive polymer contact system and test method for semiconductor components |
JP2002082130A (ja) * | 2000-09-06 | 2002-03-22 | Hitachi Ltd | 半導体素子検査装置及びその製造方法 |
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JP2005140677A (ja) * | 2003-11-07 | 2005-06-02 | Japan Electronic Materials Corp | プローブシート及びこれを用いたプローブシートユニット |
DE112004002554T5 (de) | 2003-12-24 | 2006-11-23 | Cascade Microtech, Inc., Beaverton | Active wafer probe |
TWI235837B (en) * | 2004-03-10 | 2005-07-11 | Mjc Probe Inc | Probe device and probe card using the same |
US7759949B2 (en) * | 2004-05-21 | 2010-07-20 | Microprobe, Inc. | Probes with self-cleaning blunt skates for contacting conductive pads |
US9097740B2 (en) * | 2004-05-21 | 2015-08-04 | Formfactor, Inc. | Layered probes with core |
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US7733101B2 (en) * | 2004-05-21 | 2010-06-08 | Microprobe, Inc. | Knee probe having increased scrub motion |
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US20060052075A1 (en) | 2004-09-07 | 2006-03-09 | Rajeshwar Galivanche | Testing integrated circuits using high bandwidth wireless technology |
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US7279920B2 (en) | 2005-04-06 | 2007-10-09 | Texas Instruments Incoporated | Expeditious and low cost testing of RFID ICs |
US7292055B2 (en) * | 2005-04-21 | 2007-11-06 | Endicott Interconnect Technologies, Inc. | Interposer for use with test apparatus |
US7096133B1 (en) | 2005-05-17 | 2006-08-22 | National Semiconductor Corporation | Method of establishing benchmark for figure of merit indicative of amplifier flicker noise |
US7733287B2 (en) | 2005-07-29 | 2010-06-08 | Sony Corporation | Systems and methods for high frequency parallel transmissions |
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1996
- 1996-08-08 US US08/695,077 patent/US5914613A/en not_active Expired - Lifetime
-
1997
- 1997-05-02 ES ES97924735T patent/ES2210530T3/es not_active Expired - Lifetime
- 1997-05-02 AT AT97924735T patent/ATE254289T1/de not_active IP Right Cessation
- 1997-05-02 WO PCT/US1997/008292 patent/WO1998007040A1/en active IP Right Grant
- 1997-05-02 DE DE69726169T patent/DE69726169T2/de not_active Expired - Lifetime
- 1997-05-02 DE DE29724050U patent/DE29724050U1/de not_active Expired - Lifetime
- 1997-05-02 EP EP97924735A patent/EP0929819B1/en not_active Expired - Lifetime
- 1997-05-02 AU AU30077/97A patent/AU3007797A/en not_active Abandoned
- 1997-05-02 JP JP50968198A patent/JP3942042B2/ja not_active Expired - Fee Related
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1998
- 1998-10-16 US US09/174,384 patent/US6307387B1/en not_active Expired - Lifetime
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1999
- 1999-02-08 KR KR1019997001052A patent/KR100312835B1/ko not_active IP Right Cessation
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2000
- 2000-10-10 US US09/686,353 patent/US6437584B1/en not_active Expired - Fee Related
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2002
- 2002-05-20 US US10/152,228 patent/US6927585B2/en not_active Expired - Fee Related
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2005
- 2005-06-17 US US11/155,986 patent/US7109731B2/en not_active Expired - Fee Related
-
2006
- 2006-01-12 JP JP2006005111A patent/JP4237761B2/ja not_active Expired - Lifetime
- 2006-05-25 US US11/441,673 patent/US7550983B2/en not_active Expired - Fee Related
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2007
- 2007-08-29 US US11/897,397 patent/US7541821B2/en not_active Expired - Fee Related
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2009
- 2009-03-20 US US12/383,209 patent/US7893704B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005070050A (ja) * | 2003-08-25 | 2005-03-17 | Delaware Capital Formation Inc | 半導体回路のための検査インタフェースシステムと半導体パッケージを検査するためのコンタクタ |
JP2008506112A (ja) * | 2004-07-07 | 2008-02-28 | カスケード マイクロテック インコーポレイテッド | 膜懸垂プローブを具えるプローブヘッド |
JP2012068256A (ja) * | 2004-07-07 | 2012-04-05 | Cascade Microtech Inc | 膜懸垂プローブを具えるプローブヘッド |
WO2009090907A1 (ja) * | 2008-01-17 | 2009-07-23 | Alps Electric Co., Ltd. | プローブカードおよびその製造方法 |
KR102532503B1 (ko) * | 2022-09-01 | 2023-05-17 | 주식회사 프로이천 | 프로브니들 |
Also Published As
Publication number | Publication date |
---|---|
JP3942042B2 (ja) | 2007-07-11 |
ES2210530T3 (es) | 2004-07-01 |
US5914613A (en) | 1999-06-22 |
EP0929819A1 (en) | 1999-07-21 |
US7550983B2 (en) | 2009-06-23 |
EP0929819A4 (ja) | 1999-08-11 |
JP4237761B2 (ja) | 2009-03-11 |
US6927585B2 (en) | 2005-08-09 |
US20070296431A1 (en) | 2007-12-27 |
US7109731B2 (en) | 2006-09-19 |
US20050231223A1 (en) | 2005-10-20 |
DE69726169T2 (de) | 2004-08-26 |
AU3007797A (en) | 1998-03-06 |
US6437584B1 (en) | 2002-08-20 |
KR20000029882A (ko) | 2000-05-25 |
US7541821B2 (en) | 2009-06-02 |
EP0929819B1 (en) | 2003-11-12 |
US20060214676A1 (en) | 2006-09-28 |
US20090224783A1 (en) | 2009-09-10 |
US7893704B2 (en) | 2011-02-22 |
KR100312835B1 (ko) | 2001-11-03 |
WO1998007040A1 (en) | 1998-02-19 |
JP2006177971A (ja) | 2006-07-06 |
US20020135388A1 (en) | 2002-09-26 |
ATE254289T1 (de) | 2003-11-15 |
DE69726169D1 (de) | 2003-12-18 |
US6307387B1 (en) | 2001-10-23 |
DE29724050U1 (de) | 2000-01-27 |
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