1235837 玖、發明說明： 【發明所屬之技術領域】 本發明係關於一種探針元件及其測試卡，特別係關於一 種可自動地調整施加於一待測積體電路元件之針壓及可自 動地中心對準的探針元件及其測試卡。 【先前技術】 般而〇，sa圓上之積體電路元件必須先行測試其電氣 特欧’以判疋積體電路元件是否良好。良好的積體電路將 被遥出以進行後續之封裝製程，而不良品將被捨棄以避免 增加額外的封裝成本。完成封裝之積體電路元件亦必須再 進行另-次電性測試以篩選出封裝不良品，進而提升最終 成品良率。 得統測試卡係㈣懸臂式探針及垂直式探針二種。懸 式探針係藉由—橫向懸臂提供探針針部在接觸-待測積 電路凡件時適當的縱向位移’以避免探針針部施加於該 Γ積體電路元件之針壓過大1而，由於懸臂式探針需 工間容納該橫向縣劈，而μ A — 、心#而此二間將限制懸臂式探針以對 鬲岔度訊號接點之待測積體 j檟體電路兀件之細間距排列，因 …、法應用於具有高资声士告 .^ ⑴度Λ唬接點之待測積體電路元件。 直式探針雖可以讲座古念 子應N W度訊號接點之待測 之細間距排列，並藉由奸“ 電路兀， f 猎由針體本身之彈性變形提供針尖在j 觸待測積體電路元件所需 少《 / 而之縱向位移。然而，當針辦太」 之雙形量過大時，相鄰合 體本/ TT ，+a接觸而發生短路或相互碰撞 秀闼專利唬us 5,914 理 u不種用以測試一待測積骨 職咖你旺珍科技_5_5.d〇c 1235837 電路元件之電氣特性的彈性薄膜測試組件。該彈性薄膜測 試組件係㈣數個探測端子設置於_黏彈性（如。禮ic) 層上，亚藉由該黏彈性層提供各探測端子適當之移動距 離，以便各捺測端子在接觸該待測積體電路元件之訊號塾 夺可刮破況號墊上之氧化層。惟，該黏彈性層提供之移動 距離並不均勻，在該黏彈性層中心部較大，而在周圍則相 對車又J >此，3亥複數個探測端子無法均勾地刮除訊號塾 上之氧化層，導致彼此之間的阻抗不同。此外，該黏彈性 ^^系-多層結構且由多種材料構成，不同材料之熱膨服係 數差異限制該彈性薄膜測試組件在高溫電性量測之應用。 【發明内容】 & 本發明之主要目的係提供一種可自動地調整施加於一待 測積體電路元件之針麼且可自動地中心對準的探針元件及 其/貝！| €式卡。 為了達成上述之目的，本發明之輕斜 ^ ^, 之铋針疋件包含一絕緣本 _、、>、一設置於該絕緣本體中之承載構件、一設置於該 承載構件中之探針以及一設置於該絕緣本體中且電氣連 該承載構件之電訊號導線。該錢構件之第_實施例為一 螺旋彈簧，其中該螺旋彈簧之内端係連接於該探針，而盆 外端連接於該絕緣本體。該承載構件 A ’、 示—貫施例係 複數個懸臂，其中該懸臂之—端係連接於該探針，而 一端則連接於該絕緣本體中之電訊號導線。 ’、 係以該探針為中心呈放射狀設置， °"禝個懸臂 一相鄰探針間之古备 相同。此外’該承載構件亦可包含至少—連接各懸臂= H:\Hu\Hyg\旺矽科技\907 ] 5\90715.doc -6- 1235837 接環。 本發明之測試卡包含一電路板及一探測頭。該電路板包 含複數個可電氣連接於一測試機台之測試接點以及複數個 可電氣連接該複數個測試接點至該電路板下表面之導電通 路。該探針座包含一絕緣本體、至少一設置於該絕緣本體 中之承載構件、一設置於該承載構件中之探針以及一設置 於該絕緣本體中且電氣連接該承載構件之電訊號導線，其 中該電訊號導線可電氣連接於該電路板之導電通路。 本發明之測試卡亦可包含一電路板、一探針座及一連接 該電路板及該探針座之介面板。該電路板包含至少一測試 接點，而該探針座包含-絕緣本體、至少—設置於該絕緣 本體中之承載構件、-設置於該承載構件中之探針以及一 設置於該絕緣本體中且電氣連接該承載構件之電訊號導 線。该介面板包含至少一 士/L罢认斗入 ^ °又置於該介面板上表面之第一訊 號接點，可電氣連接於嗜雷 、"電路板之測試接點以及至少一設 置於该介面板下表面之第二 虎接點，可電氣連接於該絕 緣本體中之電訊號導線。 及_ & 5明之探針元件係以具有縱向彈 及4買向弹性之承载構件承 之探針。由於該承載構件=接觸一待測積體電路元 瓦、隹，二 件之杈向彈性限制該探針實質上 了進仃縱向移動以避免探 、、 側向穩定度，因此該探針可=移動’可確保該探針 構件提供之㈣料 對準°再者，該承 元件，並自動地調整施力广彈性接觸該待測積㈣ 於該待測積體電路元 屬£ ΗΛΗ撕㈣旺矽科技\907丨5\907I5.doc I235837 【實施方式】 圖1例示本發明第一實施例之探針元件Η)。如圖i所示 該探針元件1〇包含一具有-圓形開口 Μ之絕緣本體12、 二設置於該開口 14中之承載構件2〇、-設置於該承載構 件2〇中之探針26以及—設置於該絕緣本體12中且電氣連 接該承載構件20之電訊號導線28。該承載構件2〇係一螺 旋彈赞，其内端22係連接於該探針26，而其外端Μ連接 於該絕緣本體12。當該探針26偏離中心時，該螺旋彈菩 之橫向弹性可自動地將該探針2 6推回中心位置，亦即，哕 Γ彈簧可限制並拘束該探針％實質上僅可進行縱_ 動，以避免習知技藝之探針因橫向移動所引起之缺點。 再者’當該探針26之針尖接觸一待測積電路元件時，节 螺旋彈性之縱向彈性可自動地調整該探針26施加於古亥待 測積體電路元件上之厭介& , Χ 之針壓。亦即，本發明藉由該彈性承載 冓件’該探針26與該待測積體電路元件之接觸不是奋破 該待測積體電路元件之硬接觸（hardeGntaet)，”彈性 2觸（soft咖⑽）。該探針26及該承載構件Μ係由彈 ¥電材料構成。較佳地，該探針26及該承載構件2 材貝係遥自銅、鎳、鈷、錫、硼、磷、鉻、鎢、鉬、鉍、 銦、铯、銻：金、銀、鍺、鈀、鉑、釕及其合金所組成之 弟亦即，藉由該探針26擷取一待測積體電路元件之電氣 °孔號’再經由該承載構件20及該電訊號導線28向外輸出。 圖2(a)例示本發明第二實施例之探針元件4〇a。如圖"° 斤丁 °亥奴針兀件40A包含一具有一四角形開口 44之 H:VHuVHyg\旺矽科技咖丨5\907〗5.d〇c 1235837 、、'體42、一 a又置於s玄開口 44中之承載構件50A、一設 置於該承載構件5GA中之探針％以及—設置於該絕緣本 體42中且電氣連接該承载構件5GA之電訊號導線58。該 1載構件5GA包含4個以該探針56為中心呈放射狀設置 之懸臂52 ’且二相鄰懸臂52間之夾角相同，實質上為％ 度亦即’ 4個懸臂52形成-「十字型」結構，而該探針 :則位於该「十字型」結構之中心處。該懸臂”之一端 =連接於4 &針56，而其另—端則連接於該絕緣本體^， 八中某-懸臂52係、電氣連接該電訊號導線58及該探針 圖2(b)例示本發明第三實施例之探針元件侧。相較力 圖2(a) ’圖2(b)所示之探針元件卿之承載構件湖係^ 4個懸臂52及4個懸臂54構成，且懸臂52與懸臂5“ 夾角約為45度。該電訊號導線^之一端係電氣連接於專 一懸臂52 ’以傳送測試訊號至該探針56或將該探針56揭 取自-待測積體電路元件之電氣訊號向外輸出。 圖2(C)例示本發明第三實施例之探針元件40C。相較於 圖勢圖2(c)所示之探針元件4〇c之承载構件⑽係由 ^下一個方形螺旋彈簧構成。該方形螺旋彈簧之内端係 連接於該探針56,而其外端則連接於該絕緣本體5佳 地’該探針56係㈣該方形螺旋彈簣之中心處。 導線58係電氣連接於上螺旋彈菁之外端，以傳送測心 至《針56或將該探針56擷取自—待測積體電路元件: 電氣讯號向外輸出。 H:\Hu\Hyg\ 旺矽科技\9〇715\90715.£}〇〇 1235837 圖3 (a)例示本發明第五每 张- _ 五'施例之探針元件60A。如圖3⑷ 所不，该探針元件60A包合一目+ 緣⑼AO /、有一六角形開口 04之絕 緣本體62、二設置於該開 番μ u 1 64中之承载構件70Α、一設 置於该承載構件70Α中 ^ φ η ^ + 76以及一設置於該絕緣本 =構1連接該承载構件7〇Α之電訊號導線心該 承載構件70Α係由6個縣劈7?爲^ # 74^、办 72及二連接各懸臂72之連接 % 74構成。各懸臂72之一 ‘係連接於該探針76，而苴另 一端則連接於該絕緣本體62，曰宜敢* /、 某一懸臂72電氣連接該 電^ 5虎導線7 8及該摄斜7 < ^ . 、 針76。该稷數個懸臂72係以該探針 76為中心呈放射狀設置，一 五一相郇懸臂72間之夾角相同，1235837 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a probe element and a test card thereof, and in particular, to an automatic adjustment of a needle pressure applied to a circuit element of a product under test and an automatic Center-aligned probe element and its test card. [Prior art] Generally, the integrated circuit components on the circle of sa must first test their electrical characteristics to determine whether the integrated circuit components are good. Good integrated circuits will be removed for subsequent packaging processes, and defective products will be discarded to avoid adding additional packaging costs. The integrated circuit components that have been packaged must also be subjected to another electrical test to screen out defective packages, thereby improving the final product yield. There are two types of test cards: a cantilever probe and a vertical probe. The cantilever probe is provided by a lateral cantilever to provide a proper longitudinal displacement of the probe pin when contacting the circuit of the product under test. Because the cantilever probe needs a workshop to accommodate the horizontal cross-section, and μ A — ， 心 #, and these two rooms will limit the cantilever probe to the circuit of the signal to be measured. The fine-pitch arrangement of the pieces is due to the fact that the method is applied to circuit components under test with highly qualified contacts. Although the straight type probe can be used to teach the fine pitch of the NW-degree signal contacts to be tested, and through the "circuit", f is provided by the elastic deformation of the needle itself to provide the tip of the probe to the measured product. The circuit components require less "/ and longitudinal displacement. However, when the amount of double shape of the needle is too large", the adjacent combination of / TT, + a contacts and a short circuit occurs or collides with each other. Patent 5,914 reason u It is not a kind of flexible thin film test module for testing the electrical characteristics of a component under test. _5_5.d〇c 1235837 Circuit components. The elastic thin film test module is provided with a plurality of detection terminals arranged on a layer of viscoelasticity (such as ceremonial ic), and the viscoelastic layer provides a proper moving distance of each detection terminal so that each test terminal is in contact with the waiting Signals from the test circuit components snatch the oxide layer on the condition pad. However, the moving distance provided by the viscoelastic layer is not uniform. It is large in the center of the viscoelastic layer, and is relatively opposite to the vehicle. J > Therefore, the multiple detection terminals of the three layers cannot scrape signals evenly. The oxide layer on top causes different impedances between each other. In addition, the viscoelastic system is a multilayer structure and is composed of a variety of materials. The difference in thermal expansion coefficient of different materials limits the application of the elastic film test module to high-temperature electrical measurement. [Summary of the invention] & The main object of the present invention is to provide a probe element and its / shell which can automatically adjust the needle applied to a circuit element to be measured and can be automatically center aligned! | € card. In order to achieve the above-mentioned object, the light oblique ^ ^, bismuth needle element of the present invention includes an insulating substrate, a bearing member provided in the insulating body, and a probe member provided in the bearing member. And an electric signal wire disposed in the insulating body and electrically connected to the bearing member. The first embodiment of the money member is a coil spring, wherein the inner end of the coil spring is connected to the probe, and the outer end of the basin is connected to the insulating body. The load-bearing member A ′ and the illustrated embodiment are a plurality of cantilevers, wherein one end of the cantilever is connected to the probe, and one end is connected to an electrical signal wire in the insulating body. ′, It is arranged radially with the probe as the center, and the cantilever is the same between adjacent probes. In addition, the load-bearing member may also include at least—connecting each cantilever = H: \ Hu \ Hyg \ Wang Si Technology \ 907] 5 \ 90715.doc -6- 1235837 connecting ring. The test card of the present invention includes a circuit board and a probe. The circuit board includes a plurality of test contacts that can be electrically connected to a test machine and a plurality of conductive paths that can electrically connect the plurality of test contacts to the lower surface of the circuit board. The probe base includes an insulating body, at least one supporting member disposed in the insulating body, a probe disposed in the supporting member, and an electrical signal wire disposed in the insulating body and electrically connected to the supporting member. The electrical signal wire can be electrically connected to the conductive path of the circuit board. The test card of the present invention may also include a circuit board, a probe base, and an interface panel connecting the circuit board and the probe base. The circuit board includes at least one test contact, and the probe base includes-an insulating body, at least-a supporting member disposed in the insulating body,-a probe disposed in the supporting member, and an insulating body. And the electrical signal wires of the bearing member are electrically connected. The interface board includes at least one driver / L to identify the first signal contact placed on the upper surface of the interface board, which can be electrically connected to the thunderstorm, the test contact of the circuit board and at least one The second tiger contact on the lower surface of the interface board can be electrically connected to the electrical signal wire in the insulating body. And _ &5; the probe element is a probe supported by a bearing member with longitudinal elasticity and 4 buying elasticity. Because the load-bearing member = contacts one of the integrated circuit element tiles and slats, the bidirectional elasticity of the two pieces restricts the probe from moving substantially longitudinally to avoid probing and lateral stability, so the probe can = “Move” can ensure that the material provided by the probe member is aligned. Moreover, the supporting element automatically adjusts the force and elastic contact with the product under test. The circuit element of the product under test belongs to \ 907 丨 5 \ 907I5.doc I235837 [Embodiment] Fig. 1 illustrates a probe element 第一) of the first embodiment of the present invention. As shown in FIG. I, the probe element 10 includes an insulating body 12 having a circular opening M, two carrying members 20 provided in the opening 14, and probes 26 provided in the carrying member 20. And—an electrical signal wire 28 disposed in the insulating body 12 and electrically connected to the bearing member 20. The load bearing member 20 is a screw-like elastic member, and an inner end 22 thereof is connected to the probe 26 and an outer end M thereof is connected to the insulating body 12. When the probe 26 deviates from the center, the lateral elasticity of the spiral bomb can automatically push the probe 26 back to the center position, that is, the 弹簧 Γ spring can limit and restrain the probe. _ To avoid the disadvantages caused by the lateral movement of the probe of the conventional technique. Furthermore, when the needle tip of the probe 26 contacts a circuit component to be tested, the longitudinal elasticity of the spiral elasticity of the knot can automatically adjust the wear resistance of the probe 26 applied to the circuit component of the test target. Needle pressure of X. That is, according to the present invention, the contact between the probe 26 and the circuit element under test by the elastic bearing member 'is not a hard contact (hardeGntaet) of the circuit element under test. Cao). The probe 26 and the bearing member M are made of elastic materials. Preferably, the probe 26 and the bearing member 2 are made of copper, nickel, cobalt, tin, boron, and phosphorus. , Chromium, tungsten, molybdenum, bismuth, indium, cesium, antimony: younger brothers composed of gold, silver, germanium, palladium, platinum, ruthenium and their alloys, that is, a probe 26 circuit is captured by the probe 26 The electrical angle of the element is output to the outside through the supporting member 20 and the electric signal wire 28. Fig. 2 (a) illustrates the probe element 40a of the second embodiment of the present invention. ° The helium needle element 40A includes a H with a quadrangular opening 44: VHuVHyg \ Wang Si Technology Co. 5 \ 907〗 5.doc 1235837, 'body 42, and a are placed in the suan opening 44 again. A load bearing member 50A, a probe provided in the load bearing member 5GA, and-a signal signal guide provided in the insulating body 42 and electrically connected to the load bearing member 5GA 58. The 1-carrying member 5GA includes 4 cantilever arms 52 'radially disposed with the probe 56 as the center, and the included angle between two adjacent cantilever arms 52 is the same, which is essentially a degree of degree, that is, 4 cantilever arms 52 are formed- "Cross-shaped" structure, and the probe: is located at the center of the "Cross-shaped" structure. One end of the "cantilever" = connected to 4 & pin 56, and the other end of the cantilever is connected to the insulating body ^, a certain eight-cantilever 52 series, electrically connected to the electrical signal wire 58 and the probe Figure 2 (b ) Exemplifies the probe element side of the third embodiment of the present invention. Compared with the bearing system of the probe element shown in Fig. 2 (a) 'Fig. 2 (b), the system is composed of 4 cantilever arms 52 and 4 cantilever arms 54. The angle between the cantilever 52 and the cantilever 5 "is about 45 degrees. One end of the electric signal wire ^ is electrically connected to a dedicated cantilever 52 'to transmit a test signal to the probe 56 or to extract the probe 56 from an electrical signal of a circuit component under test to be output to the outside. FIG. 2 (C) illustrates a probe element 40C according to a third embodiment of the present invention. Compared to the figure 2 (c), the bearing member 〇 of the probe element 40c is composed of the next square coil spring. The inner end of the square spiral spring is connected to the probe 56, and the outer end of the square spiral spring is connected to the insulating body 5. The probe 56 is located at the center of the square spiral spring. The lead 58 is electrically connected to the outer end of the upper spiral elastic core to transmit the heart to the "needle 56 or to retrieve the probe 56 from the circuit component under test: the electrical signal is output to the outside. H: \ Hu \ Hyg \ Wang Silicon Technology \ 9〇715 \ 90715. £} 〇〇 1235837 FIG. 3 (a) illustrates the fifth probe element 60A of the fifth-_fifth embodiment of the present invention. As shown in Fig. 3⑷, the probe element 60A includes one head + edge⑼AO /, an insulating body 62 having a hexagonal opening 04, two bearing members 70A provided in the opening fan u 64, and one provided in the In the bearing member 70A, ^ φ η ^ + 76 and an electrical signal core provided in the insulating structure = connecting the bearing member 70A. The bearing member 70A is divided into 7 by 6 counties as # 74 ^, Office 72 and the second connection 74 of each cantilever 72 constitute. One of the cantilevers 72 is connected to the probe 76, and the other end is connected to the insulating body 62. It should be said that a cantilever 72 is electrically connected to the electrical wires 718 and the oblique 7 < ^., Pin 76. The plurality of cantilever arms 72 are arranged radially with the probe 76 as the center. The angles between the one and five-phase cantilever arms 72 are the same.
實質上為60度。 U 圖3⑻例示本發明第六實施例之探針元件刪。相較於 圖3⑷，_ 3(b)所示之探針元件峨之承載構件侧係由 上：下二個六角形螺旋彈簧構成。該六角形螺旋彈簧之内 端係連接於該探針76,而其外端則連接於該絕緣本體^。 較佳地，該探針76係位於該六角形螺旋彈簧之中心處。該 電訊號導線78係電氣連接於上螺旋彈簧之外端，以傳送測 試訊號至該探針76或將該探針76擷取自—待測積體電路 元件之電氣訊號向外輸出。 圖4例不本發明第七實施例之探針元件80。如圖4所 示，該探針元件80包含一具有一三角形開口 84之絕緣本 體82、一设置於該開口 84中之承載構件9〇、一設置於該 承載構件90中之掩针％以及一設置於該絕緣本豸η中且 電氣連接該承載構件9()之電訊號導線98。該承載構件糾 H:\Hu\Hyg\ 旺矽科技\9〇715\90715.doc -10- 1235837 係由3個懸臂92及二連接各懸臂92之連接環94構成。各 懸臂92之一端係連接於該探針96，而其另一端則連接於 該絕緣本體82，其中某一懸臂92電氣連接該電訊號導線 98及該探針96。該複數個懸臂92係以該探針％為中心呈 放射狀設置，且二相鄰懸臂92間之夾角相同，實質上為 120 度。 圖5係本發明第一實施例之測試卡100之剖面示意圖。 該測試卡1〇〇包含一電路板11〇及一探針座14〇。該電路 板no包含複數個設置於其上表面112之測試接點116以 及複數個設置於其内部之導電通路118(請參考圖8)。令 複數個測試接點116係以一間距122分隔且可電氣連接= 一測試機台（未顯示於圖5中），而該導電通路118係用 以電氣連接該複數個測試接點11 6至該電路板丨丨〇之下表 面 114 。 & 圖6係本發明第一實施例之探針座14〇之俯視圖。如圖 6所示，該探針座14〇包含複數個如圖丨所示之探針元件 i〇j複數個焊墊144以及複數條電氣連接該電訊號導線28 與違焊塾144之導線146 (為清晰起見，目6僅例示二條 導線146)。該複數個探針元件1〇之排列方式可設計以對 應於該待測積體電路元件1 70之焊墊1 72。例如，以3χ6 之陣列方式排列，如圖7所示。 圖8係本發明第一實施例之測試卡1〇〇之作用示意圖。 如圖8所示，該電路板11〇係由四層積層板12〇構成且該 導電通路118之間距由該上表面112向下表面ιΐ4漸縮。 H:\Hu\Hyg\ 旺石夕科技\9〇715\9〇715如 _ 1235837 該探針座140之焊墊144之位置係對應於該電路板n〇之 導電通路11 8，因此可電氣連接該探針元件丨〇之電訊號導 線28及該電路板110之導電通路U8。該探針座14〇之探 針26係以一間距142設置，其中間距142係對應分隔該待 測積體電路元件170之焊墊172的間距。該探針26係以尖 端電氣接觸該焊墊172以擷取該待測積體電路元件17〇之 電氣特性，而該尖端可在接觸該焊墊172時，刺破該焊塾 表面之氧化物以避免該氧化物之阻抗產生量測誤差。 圖9例示本發明第二實施例之探針座15〇。如圖9所示， 該探針座150係由複數個如圖丨所示之探針元件構成， 其中各楝針元件1 〇另包含一電氣連接於該電訊號導線28 之焊墊30。該焊墊30之位置可設計以對應於該電路板i i 〇 之V電通路118，因此可電氣連接該電訊號導線28及導電 通路118。相較於圖6所示之探針座14〇，探針座15〇所佔 用之空間明顯地較小。 圖1 〇係本發明第二實施例之測試卡2〇〇之剖面示意圖。 该測試卡200包含一印刷電路板220、一介面板230及一 探針座15〇(圖9所示者）等三件組件。該印刷電路板220包 含複數個測試接點222及複數條電氣連接該測試接點222 至一測試機台（未顯示於圖10)之導線224。該介面板230 包含之上表面232設置複數個訊號接點234，其間距大約 等於该印刷電路板220上之測試接點222之間距。該介面 板230之下表面236設置複數個訊號接點238，其間距小 於設置於其上表面232之訊號接點234之間距。 H:\Hu\Hyg\ 旺矽科技\907丨5\9〇7丨5(1此 -12- 1235837 該探針座15〇之銲墊3〇的位置係對應於該介面板23〇 之訊號接點238,以電氣連接該探針元件1()之電訊號導線 28及該訊號接點238。此外，該測試卡2〇〇亦可以圖^所 示之探針座I40替代探針座150,其中該探針座14〇之焊 整144的位置係對應於該介面板23〇之訊號接點以 電氣連接該探針元# 1G之電訊號導線28及該訊號接點 238 〇 圖11例示本發明第三實施例之探針座24〇。如圖n所 示，該探針座240係由複數個如圖2(a)所示之探針元件4〇A 構成，其中該探針元件40A之排列方式可設計以對應於一 待測積體電路it件之焊墊。此外’該探針座24q亦可以圖 2(b)之探針元件4〇B或圖2(c)之探針元件4〇c。該探針座 240與一電路板之接合可選擇性地採用圖6或圖$之設 計，以電氣連接該電訊號導線58至該電路板之焊墊。 圖12例示本發明第四實施例之探針座25〇。如圖12所 示，該探針座240係由複數個如圖3(a)所示之探針元件6〇A 構成，其中該探針元件60A之排列方式可設計以對應於一 待測積體電路元件之焊墊。此外，該探針座25〇亦可以圖 3(b)之探針元件6〇B構成，亦即採用二螺旋彈簧構成之承 載構件70B。該探針座250與一電路板之接合亦可選擇性 地採用圖6或圖9之設計，以電氣連接該電訊號導線78 至該電路板之焊墊。 圖13例示本發明第五實施例之探針座26〇。如圖a所 不，該探針座240係由複數個如圖4所示之探針元件8〇 H:\Hu\Hyg\ 旺矽科技\907丨5\9〇715如 -13 - 1235837 構成’其中該探針元件80之排列方式亦可設計以對應於一 待测積體電路元件之焊墊。該探針座26〇與一電路板之接 a亦可述擇性地採用圖6或圖9之設計，以電氣連接該電 訊號導線98至該電路板之焊墊。 相車父於習知技藝，本發明具有下列優點： L由於承載構件之橫向彈性限制探針實質上僅可進行縱向 移動以避免探針之橫向移動，因此本發明之探針元件可 確保探針之側向穩定度以使探針自動中心對準，而探針 座之探針彼此不會接觸發生短路且彼此不會產生碰撞等 作動干擾。 2·由於承載構件提供之縱向彈性可使各探針獨立地進行縱 向移動以補償積體電路之焊墊之水平高度差異，並避免 探針座之探針在接觸焊墊之瞬間因針壓不平均而造成焊 墊之損壞。 3 .承載構件之縱向及橫向彈性可吸收探針在運動過程中產 生之扭應力及彎曲應力，以減少探針之疲勞及翹曲變 形。因此，相較於習知之垂直式探針在接觸一待測積體 電路元件時產生之針體變形，本發明之探針元件藉由該 承載構件可提昇探針之壽命。 4·由於承載構件之彈性可個別地設計，因此探針座之探針 可以不同針壓施加於待測積體電路元件上。例如，待測 積體電路元件之周圍可設計成具有較小之針壓，而中心 處則具有較大針壓以減少探針與待測積體電路元件間之 不平衡接觸壓力。 H:\Hu\Hyg\ 旺矽科技\90715\90715.doc -14- 1235837 本發明之技術内容及技術特點巳揭示如上，然而熟悉本 項技藝之人士仍可能基於本發明之教示及揭示而作種種不 背離本發明精神之替換及修飾。因此，本發明之保護範圍 應不限於實施例所揭示者，而應包括各種不背離本發明之 替換及修飾，並為本發明之申請專利範圍所涵蓋。 【圖式簡要說明】 圖1例示本發明第一實施例之探針元件； 圖2(a)例示本發明第二實施例之探針元件； 圖2(b)例示本發明第三實施例之探針元件； 圖2(c)例示本發明第四實施例之探針元件； 圖3(a)例示本發明第五實施例之探針元件； 圖3(b)例示本發明第六實施例之探針元件； 圖4例示本發明第七實施例之探針元件； 圖5係本發明第一實施例之測試卡之剖面示意圖； 圖6係本發明第一實施例之探針座之俯視圖； 圖7係本發明第一實施例之探針座之示意圖； 圖8係本發明第一實施例之測試卡之作用示意圖； 圖9係本發明第二實施例之探針座之示意圖； 圖1 0係本發明第二實施例之測試卡之剖面示意圖； 圖11係本發明第三實施例之探針座之示意圖； 圖12係本發明第四實施例之探針座之示意圖；以及 圖1 3係本發明第五實施例之探針座之示意圖。 【元件符號說明】 10 I朱針元件 12絕緣本體 H:\Hu\Hyg\ 旺矽科技\90715\90715.doc -15 - 1235837 14 開口 20 承載構件 22 内端 24 外端 26 探針 28 電訊號導線 30 焊墊 40A探針元件 40B 探針元件 40C 探針元件 42 絕緣本體 44 開口 50A 承載構件 50B 承載構件 50C 承載構件 52 懸臂 56 探針 58 電訊號導線 60A 探針元件 60B 探針元件 62 絕緣本體 64 開口 70A 承載構件 70B 承載構件 72 懸臂 74 連接環 76 探針 78 電訊號導線 80 探針元件 82 絕緣本體 84 開口 90 承載構件 92 懸臂 94 連接環 96 探針 98 電訊號導線 100 測試卡 110 電路板 112 上表面 114 下表面 116 測試接點 118 導電通路 120 積層板 122 間距 140 探針座 142 間距 144 焊墊 146 導線 H :\Hu\Hyg\旺矽科技\90715\907 丨 5. doc -16- 1235837 150 探針座 170 待測積體電路元件 172 焊墊 200 測試卡 222 測試接點 224 導線 230 介面板 232 上表面 234 訊號接點 236 下表面 238 訊號接點 240 探針座 250 探針座 260 探針座 H:\Hu\Hyg\旺石夕科技\90715\90715.doc - 17 _It is substantially 60 degrees. U FIG. 3A illustrates a probe element deletion of a sixth embodiment of the present invention. Compared to Fig. 3 (a), the bearing member side of the probe element E shown in Fig. 3 (b) is composed of two upper and lower hexagonal coil springs. An inner end of the hexagonal coil spring is connected to the probe 76, and an outer end thereof is connected to the insulating body ^. Preferably, the probe 76 is located at the center of the hexagonal coil spring. The electric signal wire 78 is electrically connected to the outer end of the upper coil spring, so as to transmit a test signal to the probe 76 or to extract the probe 76 from the electrical signal of the circuit component under test to be output to the outside. FIG. 4 illustrates a probe element 80 according to a seventh embodiment of the present invention. As shown in FIG. 4, the probe element 80 includes an insulating body 82 having a triangular opening 84, a carrying member 90 provided in the opening 84, a pin percentage provided in the carrying member 90, and a An electric signal wire 98 disposed in the insulating substrate 豸 η and electrically connected to the carrying member 9 (). The bearing member H: \ Hu \ Hyg \ Wang Si Technology \ 9〇715 \ 90715.doc -10- 1235837 is composed of three cantilever arms 92 and two connecting rings 94 connecting each cantilever arm 92. One end of each cantilever 92 is connected to the probe 96, and the other end thereof is connected to the insulating body 82. One of the cantilevers 92 is electrically connected to the electrical signal wire 98 and the probe 96. The plurality of cantilever arms 92 are arranged radially with the probe% as the center, and the angle between two adjacent cantilever arms 92 is the same, which is substantially 120 degrees. FIG. 5 is a schematic cross-sectional view of a test card 100 according to the first embodiment of the present invention. The test card 100 includes a circuit board 110 and a probe base 14. The circuit board no includes a plurality of test contacts 116 provided on the upper surface 112 thereof and a plurality of conductive paths 118 provided inside thereof (refer to FIG. 8). Let the plurality of test contacts 116 be separated by a pitch 122 and be electrically connectable = a test machine (not shown in FIG. 5), and the conductive path 118 is used to electrically connect the plurality of test contacts 116 to The lower surface 114 of the circuit board 丨 丨 〇. & Fig. 6 is a plan view of a probe holder 14o according to the first embodiment of the present invention. As shown in FIG. 6, the probe base 14o includes a plurality of probe elements i0j as shown in FIG. 丨, a plurality of solder pads 144, and a plurality of electrical wires 146 electrically connecting the electrical signal wire 28 and the solder joint 144. (For clarity, head 6 only illustrates two wires 146). The arrangement of the plurality of probe elements 10 can be designed to correspond to the pads 72 of the integrated circuit element 1 70 to be tested. For example, it is arranged in an array of 3 × 6, as shown in FIG. 7. FIG. 8 is a schematic diagram of the function of the test card 100 according to the first embodiment of the present invention. As shown in FIG. 8, the circuit board 110 is composed of a four-layer laminated board 120 and the distance between the conductive paths 118 is gradually reduced from the upper surface 112 to the lower surface ι4. H: \ Hu \ Hyg \ Wangshixi Technology \ 9〇715 \ 9〇715 such as _ 1235837 The position of the solder pad 144 of the probe holder 140 corresponds to the conductive path 11 8 of the circuit board n0, so it can be electrically The electrical signal wire 28 connected to the probe element 〇 and the conductive path U8 of the circuit board 110. The probes 26 of the probe base 14 are arranged at a pitch 142, wherein the pitch 142 corresponds to the pitch of the bonding pads 172 separating the integrated circuit component 170 to be tested. The probe 26 electrically contacts the solder pad 172 with a tip to capture the electrical characteristics of the integrated circuit element 17. The tip can pierce the oxide on the surface of the solder pad when it contacts the solder pad 172. To avoid measurement errors caused by the impedance of the oxide. FIG. 9 illustrates a probe holder 15 of a second embodiment of the present invention. As shown in FIG. 9, the probe base 150 is composed of a plurality of probe elements as shown in FIG. 丨, wherein each pin element 10 further includes a solder pad 30 electrically connected to the electrical signal wire 28. The position of the bonding pad 30 can be designed to correspond to the V electrical path 118 of the circuit board i i 〇, so the electrical signal wire 28 and the conductive path 118 can be electrically connected. Compared to the probe base 14 shown in Fig. 6, the space occupied by the probe base 150 is significantly smaller. FIG. 10 is a schematic cross-sectional view of a test card 200 according to a second embodiment of the present invention. The test card 200 includes three components, such as a printed circuit board 220, an interface panel 230, and a probe base 150 (shown in FIG. 9). The printed circuit board 220 includes a plurality of test contacts 222 and a plurality of wires 224 electrically connecting the test contacts 222 to a test machine (not shown in FIG. 10). The interface panel 230 includes a plurality of signal contacts 234 disposed on the upper surface 232, and the distance between the signal contacts 230 is approximately equal to the distance between the test contacts 222 on the printed circuit board 220. A plurality of signal contacts 238 are disposed on the lower surface 236 of the interface board 230, and the spacing is smaller than the distance between the signal contacts 234 disposed on the upper surface 232 thereof. H: \ Hu \ Hyg \ Wang Silicon Technology \ 907 丨 5 \ 9〇7 丨 5 (1-12-1235837 The position of the pad 3 of the probe holder 15o corresponds to the signal of the interface board 23o The contact point 238 is used to electrically connect the electrical signal wire 28 of the probe element 1 () and the signal contact point 238. In addition, the test card 2000 can also replace the probe base 150 with the probe base I40 shown in FIG. Wherein, the position of the welding 144 of the probe base 14 is corresponding to the signal contact of the interface panel 23 and is used to electrically connect the electrical signal wire 28 of the probe element # 1G and the signal contact 238. The probe base 24 of the third embodiment of the present invention. As shown in FIG. N, the probe base 240 is composed of a plurality of probe elements 40A as shown in FIG. 2 (a), wherein the probe element The arrangement of 40A can be designed to correspond to a solder pad of an integrated circuit of an object to be measured. In addition, the probe holder 24q can also be used for the probe element 40B of FIG. 2 (b) or the probe of FIG. 2 (c). The needle element 40c. The connection of the probe base 240 to a circuit board can optionally adopt the design of Fig. 6 or Fig. $ To electrically connect the electrical signal wire 58 to the pad of the circuit board. Fig. 12 illustrates this Invention Fourth Embodiment Probe base 25. As shown in FIG. 12, the probe base 240 is composed of a plurality of probe elements 60A as shown in FIG. 3 (a), and the arrangement of the probe elements 60A can be designed. A solder pad corresponding to an integrated circuit component to be measured is provided. In addition, the probe holder 25 can also be formed by the probe component 60B of FIG. 3 (b), that is, a bearing member 70B composed of two coil springs. The connection between the probe base 250 and a circuit board can also optionally adopt the design of Fig. 6 or Fig. 9 to electrically connect the electrical signal wire 78 to the pad of the circuit board. Fig. 13 illustrates a fifth embodiment of the present invention. The probe base 26. As shown in Figure a, the probe base 240 is composed of a plurality of probe elements as shown in FIG. 4: 80H: \ Hu \ Hyg \ Wang Si Technology \ 907 丨 5 \ 9〇 715 such as -13-1235837 constitutes' where the arrangement of the probe element 80 can also be designed to correspond to a pad of a circuit component to be tested. The connection of the probe holder 26 to a circuit board can also be described The design of Fig. 6 or Fig. 9 is used selectively to electrically connect the electric signal wire 98 to the solder pad of the circuit board. According to the conventional technique, the present invention has the following advantages : L Due to the lateral elasticity of the load-bearing member, the probe can only be moved in the longitudinal direction to avoid the lateral movement of the probe. Therefore, the probe element of the present invention can ensure the lateral stability of the probe to automatically center the probe. , And the probes of the probe base will not contact each other to cause short circuit and no interference with each other. 2 · Due to the longitudinal elasticity provided by the bearing member, each probe can be independently moved longitudinally to compensate for the welding of the integrated circuit The level and height of the pads are different, and to avoid damage to the pads due to uneven needle pressure when the probes of the probe holder contact the pads. 3. The longitudinal and transverse elasticity of the bearing member can absorb the torsional stress and bending stress of the probe during the movement to reduce the fatigue and warping deformation of the probe. Therefore, compared with the conventional deformation of the needle body when a conventional vertical probe contacts a circuit element of a product to be measured, the probe element of the present invention can improve the life of the probe by the supporting member. 4. Since the elasticity of the bearing member can be individually designed, the probes of the probe holder can be applied to the circuit components of the product to be measured with different needle pressures. For example, the circuit component of the integrated circuit under test can be designed with a smaller needle pressure and a larger needle pressure at the center to reduce the unbalanced contact pressure between the probe and the circuit component under test. H: \ Hu \ Hyg \ Wang Silicon Technology \ 90715 \ 90715.doc -14-1235837 The technical content and technical features of the present invention are disclosed as above, however, those skilled in the art may still make based on the teaching and disclosure of the present invention. Various substitutions and modifications may be made without departing from the spirit of the invention. Therefore, the protection scope of the present invention should not be limited to those disclosed in the embodiments, but should include various substitutions and modifications that do not depart from the present invention, and are covered by the patent application scope of the present invention. [Brief Description of the Drawings] Fig. 1 illustrates a probe element of the first embodiment of the present invention; Fig. 2 (a) illustrates a probe element of the second embodiment of the present invention; Fig. 2 (b) illustrates a third embodiment of the present invention Probe element; Figure 2 (c) illustrates the probe element of the fourth embodiment of the present invention; Figure 3 (a) illustrates the probe element of the fifth embodiment of the present invention; Figure 3 (b) illustrates the sixth embodiment of the present invention Fig. 4 illustrates a probe element of a seventh embodiment of the present invention; Fig. 5 is a schematic cross-sectional view of a test card of the first embodiment of the present invention; Fig. 6 is a plan view of a probe base of the first embodiment of the present invention Figure 7 is a schematic diagram of the probe base of the first embodiment of the present invention; Figure 8 is a schematic diagram of the function of the test card of the first embodiment of the present invention; Figure 9 is a schematic view of the probe base of the second embodiment of the present invention; 10 is a schematic cross-sectional view of a test card of the second embodiment of the present invention; FIG. 11 is a schematic view of a probe base of the third embodiment of the present invention; FIG. 12 is a schematic view of a probe base of the fourth embodiment of the present invention; 1 3 is a schematic view of a probe holder according to a fifth embodiment of the present invention. [Explanation of component symbols] 10 I Zhu needle component 12 Insulating body H: \ Hu \ Hyg \ Wang Silicon Technology \ 90715 \ 90715.doc -15-1235837 14 Opening 20 Carrying member 22 Inner end 24 Outer end 26 Probe 28 Electrical signal Lead wire 30 Welding pad 40A Probe element 40B Probe element 40C Probe element 42 Insulating body 44 Opening 50A Carrying member 50B Carrying member 50C Carrying member 52 Cantilever 56 Probe 58 Electrical signal wire 60A Probe element 60B Probe element 62 Insulating body 64 open 70A load bearing member 70B load bearing member 72 cantilever 74 connection ring 76 probe 78 electrical signal wire 80 probe element 82 insulating body 84 open 90 load bearing member 92 cantilever 94 connection ring 96 probe 98 electrical signal wire 100 test card 110 circuit board 112 upper surface 114 lower surface 116 test contacts 118 conductive paths 120 laminated board 122 pitch 140 probe base 142 pitch 144 solder pad 146 wire H: \ Hu \ Hyg \ Wang Si Technology \ 90715 \ 907 丨 5.doc -16- 1235837 150 Probe base 170 Integrated circuit component to be tested 172 Solder pad 200 Test card 222 Test contact 224 Lead 230 Interface board 232 Upper surface 234 Signal Contact 236 Lower surface 238 Signal contact 240 Probe holder 250 Probe holder 260 Probe holder H: \ Hu \ Hyg \ Wangshixi Technology \ 90715 \ 90715.doc-17 _