JP6625847B2 - Probe, probe assembly manufacturing method, and probe assembly - Google Patents

Description

  The present invention relates to a probe, a method for manufacturing a probe assembly, and a probe assembly.

  In a semiconductor device manufacturing process, a large number of semiconductor integrated circuits formed on each chip area of a semiconductor wafer (hereinafter, also simply referred to as “wafer”) are each separated before being separated into semiconductor chips. It is normal to undergo a test to see if it has been manufactured to specifications. That is, a semiconductor wafer as an object to be inspected in which a large number of semiconductor integrated circuits are built is measured by individual semiconductor integrated circuits (hereinafter, one semiconductor integrated circuit is also referred to as a “wafer chip”) on the semiconductor wafer. As a device, it undergoes an electrical test called a wafer test.

  In a wafer test, for example, a tester that supplies the power and signals required for the test to each device under test and measures its electrical characteristics, and electrically intervenes between the test head of the tester and the device under test Holds the wafer and one or more electrical connection devices that transmit necessary signals and power, and controls the relative positioning and connection between the device under test on the wafer and the probe on the electrical connection device. An inspection apparatus having a prober for performing the inspection is used. The electrical connection device includes, for example, a board such as a probe card, an insert ring, and a performance board, and a device in which the boards are functionally combined and integrated. An electrical connection device in which probes connected to the electrodes of the circuit are arranged will be referred to as a probe assembly. As this probe assembly, for example, a probe card has a large number of probes arranged on one side and electrically connected to a test head or an electrical connection device located on the test head side on the other side. (See, for example, Patent Document 1).

  As an example of the probe for the electrical test, a plate-shaped probe is known as a whole. For example, a mounting portion provided with a mounting end for mounting the probe assembly to the probe substrate and extending from the mounting end in a first direction away from the probe substrate, and a mounting portion and the first mounting portion. A probe base connected to the end of the mounting portion in the first direction so as to be continuous in the direction, and an arm provided to extend from the probe base in a second direction intersecting the first direction. A probe having a needle tip provided on an arm thereof and having a needle tip formed at a tip extending to a side opposite to a side where an attachment end of the attachment is located is known (see Patent Documents 1 and 2). See.).

  A probe assembly configured using the above-described probe includes a plurality of plate-shaped probes and a probe substrate that supports the probes. A plurality of mounting pads for fixing and supporting the probes, that is, a plurality of bonding pads are provided on a surface of the probe substrate on which the probes are mounted (hereinafter, also referred to as a “probe mounting surface”). In the probe assembly, a plurality of plate-shaped probes are joined upright to respective joining pads of a probe board by a heat-meltable joining material at an attachment portion thereof. As a result, the mounting portion of each probe is fixed to the bonding pad of the probe substrate, and is supported by the probe substrate in a cantilever shape.

  Then, in the wafer test of the semiconductor wafer to be inspected, the probe assembly is relatively approached while keeping the probe substrate and the wafer parallel with the side where the probe is attached facing the wafer. By doing so, the electrical characteristics test can be performed by bringing the probe tips of the probe assembly into contact with the electrode pads of the plurality of wafer chips formed on the semiconductor wafer from the probe tip side. The contact between the electrode pad of the wafer chip and the tip of the probe may be connected to all the wafer chips on the wafer in a single contact operation to conduct an electrical property test, or divided into multiple contact operations The electrical characteristics may be tested for each connection.

JP 2011-141219 A JP 2008-175762 A

  As described above, in the electrical test of a semiconductor wafer, a plurality of wafer chips on a semiconductor wafer are used in the probe assembly so that the probe assembly is preferably used for electrical connection with a wafer chip on the wafer. It is desirable that the tip of each probe contacts each of the electrode pads under uniform conditions.

  Usually, the electrode pads on the semiconductor wafer to be inspected are provided at a uniform height on the semiconductor wafer. As described above, the contact between the probe tip of the probe on the probe assembly and the electrode pad of the wafer chip on the wafer is performed by approaching the wafer and the probe substrate relatively in parallel while facing each other. In the probe assembly, it is preferable that the height positions of the tips of the plurality of probes on the probe substrate are equal to each other among the plurality of probes. That is, in the probe assembly, a virtual surface (hereinafter, also referred to as a “virtual contact surface”) including the tip points of the plurality of probes provided on the probe substrate may constitute one flat plane. preferable. When the flatness of the virtual contact surface is improved, the tips of the probe can be contacted under uniform conditions.

  Therefore, the plurality of plate-like probes attached to the probe substrate are manufactured so that the distance from the attachment end to the needle tip in the vertical direction of the side of the attachment end in the plane formed by the probes is equal.

  However, even if a plurality of probes having the same dimensions can be formed in such a manner, the height positions of the needle tips on the probe substrate may vary due to the influence of the state of attachment to the probe substrate or the shape of the probe substrate itself. there were.

  For example, in a bonding pad of a probe board for mounting a probe, there is a variation in shape and a variation in height on the probe board, and even if a plurality of probes are attached to the bonding pad of the probe board under similar conditions, In the manufactured probe assembly, the height position of the probe tip may vary.

  Even if the shape of the bonding pad and the height on the probe substrate are uniform, if there is undulation or warpage on the probe substrate, similarly, the height of the probe tip in the manufactured probe assembly is similarly determined. Sometimes the position varied.

  That is, in the probe assembly, the probe depends on the shape of the probe substrate and the bonding pad, and the height position of the probe tip sometimes varies. In order to suppress this variation, it is effective to improve the flatness of the probe mounting surface of the probe substrate, but in recent years, in order to increase the number of wafer chips that can be measured at one time, the probe substrate has been increased in size. There is also a problem that it becomes difficult to increase the flatness of the probe mounting surface as the size increases.

  Also, when bonding the probe to the probe substrate, the probe is held by using the above-mentioned heat-meltable bonding material while holding the probe so that the position of the probe tip with respect to the probe substrate is at a predetermined height. However, in this case, if the flatness of the probe mounting surface of the probe board is low, the mounting end of the probe mounting section may be inclined and joined to the probe board, or the mounting end may float from the probe board. May be bonded to the bonding pad.

  If the probes are attached to the bonding pads of the probe board in such a state, the bonding state or bonding strength of the probes varies among a plurality of probes, which may reduce the reliability of the probe assembly.

  Accordingly, there is a need for a technique for suppressing variations in the height position of the needle tip among a plurality of probes in a probe assembly. And the technology that suppresses the variation of the height position of the probe tip of the probe can adjust the needle tip height position of each probe without reducing the mounting strength between the probe and the bonding pad of the probe board. It is preferable that

  The present invention has been made in view of the above problems in the probe and the probe assembly.

  That is, an object of the present invention is to provide a probe provided with a mechanism for adjusting a height position of a needle tip.

  Another object of the present invention is to provide a method of manufacturing a probe assembly that is effective in reducing the variation in the position of the probe tip.

  It is another object of the present invention to provide a probe assembly in which variation in the position of the probe tip is reduced.

  Other objects and advantages of the present invention will become apparent from the following description.

A first aspect of the present invention provides:
A generally plate-shaped probe,
A mounting portion having a mounting end;
A probe base connected to an end of the mounting portion so as to be continuous with the mounting portion in a first direction intersecting a line tangent to the mounting end in plan view;
An arm portion extending from the probe base in a second direction intersecting the first direction;
A needle tip portion provided at the arm portion and having a needle tip formed at a tip extending to a side opposite to a side where the attachment end of the attachment portion is located,
The mounting portion,
A pedestal portion having the mounting end;
A column connecting the opposite ends of the base and the probe base,
The present invention relates to a probe, which has a columnar portion extending from an end of the probe base facing the pedestal portion toward the pedestal portion and having a gap formed between the tip portion and the pedestal portion.

  In the first aspect of the present invention, the pedestal portion of the mounting portion may be configured such that a portion connected to the support is located on a vertical direction of a straight line in contact with the mounting end from the mounting end in plan view. preferable.

  In the first aspect of the present invention, the pedestal portion of the mounting portion has a portion opposed to a tip portion of the columnar portion, which is located on a vertical direction of a straight line in contact with the mounting end from the mounting end in plan view. Is preferred.

In the first aspect of the present invention, a plurality of the columnar portions of the attachment portion are provided with the support column interposed therebetween,
It is preferable that a plurality of pedestal portions of the mounting portion are provided with a plurality of portions facing the tip portions of the plurality of columnar portions with a portion connected to the support pillar interposed therebetween.

In the first aspect of the present invention, the pedestal portion of the attachment portion has a shape with a rounded portion so that a portion facing a tip portion of the columnar portion is convex or concave in plan view,
The columnar portion of the attachment portion is rounded so that a tip portion of the columnar portion extending toward the pedestal portion is concave or convex so as to conform to the shape of the opposing pedestal portion in plan view. It is preferred to have the shape provided with.

In the first aspect of the present invention, the pedestal portion of the mounting portion has a substantially square shape with the mounting end as one side in a plan view, and the pedestal portion is provided on a mounting end opposite side which is a side facing the mounting end. It has a part connected to the support,
It is preferable that a portion facing the tip end of the columnar portion is provided on a mounting end side, which is a side connecting between the mounting end and each end of the mounting end opposite side.

  In the first aspect of the present invention, the pedestal portion of the mounting portion has a substantially square shape with the mounting end as one side in plan view, and a substantially square shape formed by the pedestal portion of the mounting portion in plan view. Preferably has a substantially trapezoidal shape.

  In the first aspect of the present invention, it is preferable that the width of the narrowest part of the support of the mounting portion is not less than 1.5 times and not more than twice the thickness of the support.

  In the first aspect of the present invention, a corner portion of the support extending from the pedestal portion, which is formed at a coupling portion with the pedestal portion, is formed to be rounded so as to be concave toward an inner side of the support. Preferably.

  In the first aspect of the present invention, it is preferable that a bonding layer made of a conductive and thermally fusible bonding material is provided on at least one side surface of the mounting portion.

A second aspect of the present invention provides an arrangement step of using the probe of the first aspect of the present invention, contacting the attachment end of the attachment portion on a substrate, and disposing the probe on the substrate,
Bending adjustment of the column of the mounting portion of the probe, a position adjustment step of adjusting the height position of the needle tip with respect to the substrate,
By heating and melting the conductive and heat-fusible bonding material, the probe is mounted on the substrate, and the bonding material is disposed in the gap between the tip portion of the columnar portion and the pedestal portion, A method of manufacturing a probe assembly, comprising: a step of joining a tip portion of the columnar portion and the pedestal portion to position the needle tip at a height position adjusted by the position adjusting step. About.

  In the second aspect of the present invention, the abutting of the mounting end of the mounting portion on the substrate in the arranging step includes holding the probe at a probe base and moving the probe onto the substrate while maintaining the posture of the probe. Preferably, this is done by pressing the mounting end.

  In the second aspect of the present invention, it is preferable that the bending deformation of the column in the position adjusting step is performed by changing a direction of a probe base with respect to the pedestal portion in a state where the mounting end is in contact with a substrate. .

  In the second aspect of the present invention, the bending deformation of the column in the position adjusting step is performed while the highly flat surface faces in parallel to the substrate while the mounting end is in contact with the substrate. It is preferable to perform this by pressing the needle tip closely.

  A third aspect of the present invention relates to a probe assembly, wherein a plurality of probes according to the first aspect of the present invention are mounted on a substrate.

  According to a first aspect of the present invention, there is provided a probe including a mechanism for adjusting a height position of a needle tip.

  Further, according to the second aspect of the present invention, there is provided a method of manufacturing a probe assembly that is effective in reducing the variation in the position of the probe tip.

  Further, according to the third aspect of the present invention, there is provided a probe assembly in which variation in the position of the probe tip is reduced.

FIG. 2 is a diagram illustrating a probe according to the first embodiment of the present invention. FIG. 4 is a diagram illustrating a probe that is a first modification of the first embodiment of the present invention. FIG. 3 is an enlarged view showing a mounting portion of the probe shown in FIG. 2. FIG. 3 is a diagram illustrating a state in which a bonding layer is arranged in the probe 1 according to the first embodiment of the present invention. It is a figure explaining the manufacturing method of the probe assembly of a 2nd embodiment of the present invention. It is a figure showing a probe assembly of a 3rd embodiment of the present invention.

  The probe according to the embodiment of the present invention is a plate-shaped probe as a whole, and is attached to the probe substrate and supported in a cantilever shape as described above. The probe according to the embodiment of the present invention is used in a method for manufacturing a probe assembly such as a probe card, which is another embodiment of the present invention, and a probe assembly according to still another embodiment of the present invention is used. Constitute. A probe assembly according to still another embodiment of the present invention may be used as an electrical connection device having a probe according to an embodiment of the present invention for an electrical test of a semiconductor wafer or the like to be inspected. Can be.

  At this time, in the conventional probe assembly, depending on the shape and height of the probe mounting surface and the bonding pad on the probe board, there is a possibility that the height positions of the probe tips of the probes may vary among a plurality of probes. is there. In order to solve such a problem, the probe according to the embodiment of the present invention is configured to include therein a mechanism capable of adjusting the height position of the needle tip. Therefore, in the probe assembly according to still another embodiment of the present invention, the height position of the needle tip can be adjusted between a plurality of probes due to the effect of the mechanism for adjusting the position of the probe according to the embodiment of the present invention. Can be suppressed. The method of manufacturing a probe assembly according to another embodiment of the present invention is effective in providing a probe assembly in which variations in the height position of the needle tip among a plurality of probes are suppressed.

  Hereinafter, a probe according to an embodiment of the present invention, a method for manufacturing a probe assembly according to another embodiment of the present invention, and a probe assembly according to still another embodiment of the present invention will be described with reference to the drawings. In the description of the drawings, common components will be denoted by the same reference numerals, and redundant description will be omitted as much as possible.

Embodiment 1 FIG.
<Probe>
FIG. 1 is a diagram showing a probe according to a first embodiment of the present invention.

  The probe 1 according to the first embodiment of the present invention shown in FIG. 1 is a plate-shaped probe as a whole.

  The probe 1 according to the first embodiment of the present invention includes a mounting portion 2 having a mounting end 2a, and a mounting portion 2 in a first direction intersecting a straight line contacting with the mounting end 2a in a plane formed by the probe 1. A probe base 3 connected to the end of the mounting portion 2 on the distal end side in the first direction, and an arm provided to extend from the probe base 3 in a second direction intersecting the first direction. The needle tip 5a is formed at the tip of the part 4 and the arm 4 at the tip opposite to the probe base 3 and extending to the side opposite to the side where the attachment end 2a of the attachment 2 is located. It is configured to include the needle tip 5.

  In the probe 1 according to the first embodiment of the present invention shown in FIG. 1, the above-described first direction is a direction perpendicular to a straight line that is in contact with the mounting end 2a in the plane formed by the probe 1 (hereinafter, referred to as a direction). Such a direction is referred to as a “perpendicular direction of the mounting end”, and the second direction is a direction parallel to a straight line contacting the mounting end 2a in the plane formed by the probe 1 (hereinafter, this direction is referred to as a vertical direction). Such a direction is also referred to as a “parallel direction of the mounting end”), so that the first direction and the second direction are substantially orthogonal to each other. The needle tip 5 extends from the arm 4 in the first direction. In FIG. 1, the first direction is the vertical direction in the figure, and the second direction is the horizontal direction in the figure.

  In the probe 1, the mounting part 2, the probe base 3, the arm part 4, and the needle tip part 5 constitute a main body of the probe 1. In the probe 1 shown in FIG. 1, the width of the main body of the probe 1 in the second direction can be, for example, 2 mm or more and 4 mm or less, that is, 2 mm to 4 mm, and the width in the first direction is, for example, 1 mm to 3 mm. It can be. The thickness of the main body of the probe 1, that is, the thickness of the mounting portion 2, the probe base 3, the arm portion 4, and the needle tip portion 5 can be, for example, 20 μm to 100 μm.

  The probe 1 having the attachment part 2, the probe base part 3, the arm part 4, and the needle tip part 5 as a main body is used in the configuration of a probe assembly according to a third embodiment of the present invention described later, and is an object to be inspected. It is suitably used for an electrical test (for example, a wafer test) of a semiconductor wafer or the like. Therefore, each part (the mounting part 2, the probe base 3, the arm part 4, and the needle tip part 5) constituting the main body of the probe 1 has a spring property and a conductive property so as to be suitable for the configuration of the probe 1. Is desirable. In addition, these components 2, 3, 4, and 5 are heat-resistant so that there is no problem such as deformation or deterioration even if there is a heating process in the manufacturing process of the probe assembly or the inspection using the same. It is preferably formed of a material having such properties as to improve the fatigue strength by heat treatment.

  Each part (the mounting part 2, the probe base 3, the arm part 4, and the needle tip part 5) constituting the main body of the probe 1 can be formed using, for example, at least one of nickel (Ni) and a nickel alloy. That is, the probe 1 of the first embodiment of the present invention is preferably configured using at least one of nickel and a nickel alloy.

  As the above-mentioned nickel alloy constituting each of the constituent parts 2, 3, 4, and 5 of the probe 1, specifically, a nickel-phosphorus alloy (Ni-P), a nickel-boron alloy (Ni-B), Select from the group consisting of nickel-cobalt alloy (Ni-Co), nickel-titanium (Ni-Ti), nickel-copper (Ni-Cu), nickel-chromium (Ni-Cr) and nickel-molybdenum (Ni-Mo) Preferably, at least one of them is used.

  By configuring the probe 1 using the above-described materials, it is possible to have both spring properties, conductivity, and heat resistance, and furthermore, the fatigue strength is improved by heat treatment, and the probe according to the third embodiment of the present invention described below. It can be used for the configuration of an assembly, and can be suitably used for an electrical test of a semiconductor wafer or the like as an inspection object.

  Hereinafter, each part constituting the main body of the probe 1 according to the first embodiment of the present invention will be described in more detail.

  As will be described later, the mounting portion 2 of the probe 1 is used to construct a probe assembly (not shown in FIG. 1) according to another embodiment of the present invention. (Not shown). The mounting portion 2 is used for mounting the probe 1 on the probe substrate, and the position of the needle tip 5a of the needle tip portion 5, more specifically, the height position of the mounting portion 2 from the mounting end 2a. Is configured to be adjustable. That is, the probe 1 has the mounting portion 2 as a mechanism for adjusting the height position of the needle tip 5a. Here, the height position of the probe tip 5a from the mounting end 2a of the probe 1 refers to the height position from the mounting end 2a to the needle tip 5a in the vertical direction of the mounting end 2a in the plane formed by the probe 1 ( Hereinafter, also referred to as “probe upper needle tip height position”).

  Specifically, as shown in FIG. 1, the mounting portion 2 of the probe 1 has the mounting end 2a described above, and extends upward from the mounting end 2a in the vertical direction in the drawing, which is the first direction. It has a pedestal portion 11 provided. The mounting portion 2 extends upward from the upper end of the pedestal portion 11 in the first direction, up and down, so that the probe base 3 is connected to the mounting portion 2 in the first direction, up and down. And a support 12 for connecting the pedestal 11 and the probe base 3 to opposite ends. Further, the mounting portion 2 is provided so as to extend from the end of the probe base 3 facing the pedestal portion 11 toward the pedestal portion 11, and is connected to the probe base 3 at one tip portion on the probe base 3 side. The other end portion 14 has a columnar portion 13 not connected to the pedestal portion 11, but having a gap formed with the pedestal portion 11.

  That is, as shown in FIG. 1, the mounting portion 2 of the probe 1 supports the probe base 3 on the pedestal portion 11 by connecting the probe base 3 to the pedestal portion 11 having the mounting end 2a. It has a column 12 and a columnar portion 13 extending from the probe base 3 toward the pedestal portion 11 and having a gap with the pedestal portion 11 formed at the distal end portion 14. In addition, the gap between the tip portion of the columnar portion 13 and the pedestal portion 11 is hereinafter also referred to as “gap portion”.

  The support column 12 of the mounting portion 2 can be bent and deformed in a plane formed by the plate-shaped probe 1, and this bending deformation can tilt the direction of the probe base 3 with respect to the base 11 in the plane formed by the probe 1. it can.

  The width of the support 12 in plan view may be constant over the entire length of the support 12 or may be indefinite. In the case where the width is constant, bending deformation is likely to occur over the entire length of the column 12, and in the case where the width is indeterminate, bending deformation is likely to occur in a portion having the narrowest width. In the first embodiment shown in FIG. 1, the column 12 has the narrowest end on the pedestal portion 11 side, and has a wider width toward the probe base 3 side. Each corner 15 is formed at an acute angle. For this reason, the column 12 is easily bent and deformed at the connection portion with the pedestal portion 11. In this manner, it is preferable to provide one of the narrowest portions on the column 12 because the portion functions as a fulcrum of bending deformation, so that movement can be easily controlled. Further, since the narrowest portion is provided at the end of the column 12 on the pedestal portion 11 side, the distance from the narrowest portion to the gap between the columnar portion 13 and the pedestal portion 11 can be shortened. . Thus, the variation width of the gap with respect to the movable range of the probe needle tip height position can be reduced, so that even if the gap varies, the setting can be made so that the bonding material can enter the gap by capillary action.

  Note that the shape of the support 12 is not limited to this. For example, the width of the end on the probe base 3 side may be the narrowest, and the width may be increased toward the pedestal 11 side. The width may be narrowest and widen toward the pedestal 11 side and the probe base 3 side. The width of the narrowest portion of the support 12 is based on the thickness of the main body of the probe 1 including the mounting portion 2, the probe base 3, the arm 4, and the needle tip 5, that is, based on the ratio to the plate thickness of the support 12. The thickness is preferably 1.5 times or more and 2 times or less, that is, 1.5 times to 2 times the plate thickness. By setting the width of the column 12 to such a width, bending deformation can be caused in a plane formed by the plate-shaped probe 1 and appropriate strength can be provided.

  Further, it is preferable that the column 12 is formed so as to be more easily bent and deformed than the arm portion 4. That is, if the strut 12 is configured to be more easily bent and deformed than the arm 4 when a force is applied to the needle tip 5 in a direction within the plane formed by the probe 1, as described later, the needle tip 5 When the height of the needle tip 5a is adjusted by applying a force to the arm 4 and bending the column 12, the deformation of the arm 4 can be suppressed, and the positioning accuracy of the needle tip height is improved. be able to.

  As will be described later, a bending deformation is applied to the support 12 of the mounting portion 2 in a plane formed by the plate-like probe 1 for the purpose of adjusting and positioning the needle tip 5a. It is preferable to have a structure capable of suppressing damage due to bending deformation as well as making it easier.

  FIG. 2 is a view showing a probe which is a first modification of the first embodiment of the present invention.

  FIG. 3 is an enlarged view showing a mounting portion of the probe shown in FIG.

  A probe 40 according to a first modification of the first embodiment of the present invention shown in FIGS. 2 and 3 has a structure in which a support 42 of a mounting portion 41 and a pedestal 43 are joined together as shown in FIG. It has a similar structure except that it is different from the probe 1 of the first embodiment of the present invention. Therefore, in the description of the probe 40 using FIGS. 2 and 3, the same reference numerals are given to the components common to the probe 1, and the overlapping description will be omitted.

  As shown in FIG. 2, in a probe 40 which is a first modification of the first embodiment of the present invention, the mounting portion 41 has a mounting end 2a to a probe board (not shown) and has the mounting end 2a. And a pedestal 43 provided so as to extend upward in the vertical direction in the drawing, which is the first direction, and the pedestal 43 so that the probe base 3 is connected to the mounting portion 41 in the vertical direction which is the first direction. A column 42 extending upward from the upper side end in the first direction, the up and down direction, and connecting the pedestal 43 and the opposing ends of the probe base 3 to each other, and the end of the probe base 3 facing the pedestal 43. The base portion is provided so as to extend toward the pedestal portion 43, and is connected to the probe base portion 3 at one end portion on the probe base portion 3 side and is not connected to the pedestal portion 43 at the other end portion 14. 43 Configured to have a columnar portion 13 a gap is formed between the.

  Then, as shown in FIGS. 2 and 3, in the probe 40, the corner 45 formed at the connecting portion between the upper end of the pedestal 43 and the column 42, that is, from the upper end of the pedestal 43. The corner 45 of the base of the protruding column 42 is not formed in a sharply bent shape, but is formed in a rounded and bent shape, and the inside of the pedestal portion 43 and the column 42 is formed. The structure is concave to the side.

  As described above, since the corner 45 formed at the joint portion with the pedestal 43 is formed to have a rounded and concave structure, a plate-like shape for adjusting the position of the needle tip 5 a with respect to the support 42 is provided. When bending deformation is applied in the plane formed by the probe 1, such bending deformation is likely to occur, and concentration of stress on the corner 45 due to bending deformation is reduced, and damage to the joint portion with the pedestal portion 43 is prevented. Can be suppressed.

  Next, the pedestal portion 11 of the mounting portion 2 has a first peripheral portion 11a serving as the mounting end 2a and a second peripheral portion 11a that bulges to one side of the mounting end 2a and connects both ends thereof in an outer shape in plan view. Peripheral portion 11b. The first peripheral portion 11a (attachment end 2a) is a portion to be joined to the bonding pad of the probe board, and the second peripheral portion 11b is a portion 2b to be joined to the support 12 (hereinafter, also referred to as a "support connection portion"). ) And a portion 2c (hereinafter, also referred to as a “columnar portion facing portion”) facing the tip of the columnar portion 13 with a gap.

  The first peripheral portion 11a (the mounting end 2a) is linear as shown in FIG. 1, but may have irregularities. In that case, the plurality of protruding ends of the irregularities are brought into contact with the bonding pad to be bonded.

  When the column connecting portion 2b is located on the second peripheral portion 11b and vertically above the first peripheral portion 11a (the mounting end 2a), the strength of the column during the bonding step to the probe substrate or after the bonding is increased. It is more preferable that the first peripheral portion 11a be located vertically from the center of the first peripheral portion 11a.

  The columnar portion facing portion 2c can be provided between the column connecting portion 2b and the first peripheral portion 11a on the second peripheral portion 11b, and may be provided on the left and right peripheral edges of the column connecting portion 2b. However, it may be provided only on one peripheral edge. It is preferable that the columnar portion facing portion 2c is located near the end of the first peripheral portion 11a because the joining material easily enters the gap between the columnar portion 13 and the tip portion 14.

  Further, it is preferable that the columnar portion opposing portion 2c be positioned vertically above the first peripheral portion 11a in terms of strength after bonding to the probe substrate.

  The shape of the pedestal portion 11 in a plan view is, for example, a substantially arc shape such as a semicircle, a semi-ellipse, and an arc with a linear portion as the first peripheral portion 11a, or a substantially polygonal shape such as a triangle, a quadrangle, a pentagon, and a trapezoid. can do.

  When the pedestal portion 11 has a substantially square shape in plan view, one side of the substantially square shape is the mounting end 2a to form the first peripheral portion 11a, and the other three sides are the second peripheral portion. 11b. The second peripheral portion 11b includes a first side 11e facing the first peripheral portion 11a (hereinafter, also referred to as “attachment end side”), and both ends of the first peripheral portion 11a and the first side 11e. It has a second side 11c and a third side 11d (hereinafter, these are also referred to as "attachment end sides") connecting the spaces. The first side 11e has a column connecting portion 2b, and the second and third sides 11c and 11d have a columnar portion facing portion 2c.

  As described above, when the pedestal portion 11 has a substantially square shape in plan view, the columnar portion facing portion 2c can be provided on the mounting end side edges 11c and 11d which are sides rising from both ends of the mounting end 2a. Thereby, one end of the gap between the columnar portion 13 and the pedestal portion 11 is provided at a position close to the mounting end 2a, so that the joining material can easily enter the gap, which is preferable.

  As shown in FIG. 1, the substantially square base 11 can be substantially trapezoidal in plan view. In this case, the longer base (lower bottom) of the substantially trapezoidal shape serves as the mounting end 2a to form the first peripheral portion 11a, and the shorter base (upper bottom) and the two legs of the substantially trapezoidal shape are formed. The second peripheral portion 11b is formed. The upper bottom forms a first side (attachment end side) 11e of the second peripheral portion 11b, and the two legs have second and third sides (attachment end side) 11c of the second peripheral portion, 11d. The first side 11e has a column connecting portion 2b, and the second and third sides 11c and 11d have a columnar portion facing portion 2c. The second peripheral portion 11b, that is, the first to third sides 11e, 11c, 11d are located on the vertical direction from the first peripheral portion 11a.

  By forming the pedestal portion 11 in such a substantially trapezoidal shape, the column-facing portion 2c and the column connecting portion 2b can be formed vertically from the mounting end 2a while securing the length of the mounting end 2a. Thereby, the probe 1 can be firmly joined to the probe substrate, and the strength during and after the joining process can be improved.

  Next, the columnar portion 13 of the mounting portion 2 extends from the end of the probe base 3 facing the pedestal portion 11 toward the second peripheral portion 11b of the pedestal portion 11 in plan view, A shape in which one end is connected to the probe base 3 and the other end 14 is not in contact with the second peripheral portion 11b, and a gap is formed between the second peripheral portion 11b and the second peripheral portion 11b. You are. One or more pillars 13 can be provided at the end of the probe base 3 facing the pedestal 11. The columnar portion 13 functions to limit the movable range when adjusting the height position of the needle tip 5a, and when mounting the probe 1 on the probe board, the tip portion 14 is attached to the pedestal portion 11. The stylus 12 serves to fix the state where the column 12 is bent and deformed in a plane for the purpose of adjusting the height of the needle tip, and to strengthen the connection strength between the probe base and the pedestal. For this reason, it is preferable in terms of strength that the columnar portion 13 has a width wider than the width of the narrowest portion of the column 12 in plan view. Further, when the columnar portions 13 are provided on both sides of the column 12, the columnar portions 13 are coupled to the pedestal portion 11 on both sides of the column 12 having a structure that can be bent in a plane. This is preferable because the connection strength between the probe and the probe base 3 is increased. The width of the gap formed between the distal end portion 14 of the columnar portion 13 and the columnar portion facing portion 2c on the second peripheral portion 11b of the pedestal portion 11 will be described later when the probe 1 is mounted on the probe board. It is preferable that the width is such that the heat-fusible bonding material is melted to be in a liquid state and can enter the gap by capillary action. That is, it is preferable that the gap is of a size that can efficiently join and firmly fix the tip portion 14 of the columnar portion 13 and the pedestal portion 11 by using a hot-melted liquid joining material.

  The width of the gap is preferably formed to be substantially uniform. Further, when the support 12 is deformed in the plane forming the probe, it is preferable to make the tip portion 14 of the column 13 and the column-facing portion 2c of the pedestal 11 contact in the entire area. In the above, the edge shape of the tip portion 14 of the columnar portion 13 and the edge shape of the columnar portion opposing portion 2c of the pedestal portion 11 correspond to the most bendable portion of the column (the center in the width direction of the narrowest portion of the column). ) Preferably has a shape that coincides with the rotation operation with the fulcrum. Specifically, the edge shape of the distal end portion 14 of the columnar portion 13 and the edge shape of the columnar portion opposing portion 2c of the pedestal portion 11 may both be formed linearly in plan view. Also, one may be formed as a convex curve and the other as a concave curve. In that case, it is more preferable that the curvature of each curve is the same. It is more preferable that the columnar portion facing portion 2c of the pedestal portion 11 has a convex curve, and the tip portion 14 of the columnar portion 13 has a concave curve. Further, it is more preferable that the tangents of these curves become closer to the vertical direction of the mounting end 2a as the distance from the fulcrum increases. In this case, the change in the width of the gap with respect to the length of the curve can be reduced, and the width of the gap far from the fulcrum can also be reduced.

  In the mounting portion 2 of the probe 1 having the above configuration, as shown in FIG. 1, for example, the pedestal portion 11 has a substantially trapezoidal shape, and two columnar portions 13 are sandwiched by the column 12, that is, one on each side of the column. Can be provided one by one. That is, as described above, the pedestal portion 11 includes the first peripheral portion 11a that is the longer base of the substantially trapezoidal shape and the first side of the second peripheral portion 11b that is the shorter base of the substantially trapezoidal shape. 11e and a second side 11c and a third side 11d of a second peripheral portion 11b which is a substantially trapezoidal leg, and the columnar portion 13 has a first columnar portion 13a and a second columnar portion 13b. Can be configured. The first columnar portion 13a, the column 12, and the second columnar portion 13b are provided in the second direction, that is, in the left-right direction in the drawing, so as to be separated from each other in this order. As a result, in plan view, the first columnar portion 13a extends toward the second side 11c of the pedestal portion 11, and the distal end portion 14 faces the second side 11c, and the second columnar portion 13b is configured to extend toward the third side 11d of the pedestal portion 11, and the distal end portion 14 thereof is opposed to the third side 11d. Then, between the distal end portion 14 of the first columnar portion 13a and the second side 11c of the pedestal portion 11 opposed thereto, and between the distal end portion 14 of the second columnar portion 13b and the pedestal portion 11 opposed thereto. It is configured such that a gap is formed between each of the three sides 11d. Hereinafter, a gap portion on the needle tip side with respect to the support 12 (a gap between the first columnar portion 13a and the second side 11c in the figure) is also referred to as an "inner gap portion". On the other hand, the gap (the gap between the second columnar portion 13b and the third side 11d in the figure) on the side opposite to the needle tip is also referred to as “outer gap”.

  The pedestal portion 11 of the mounting portion 2 has a rounded shape such that the second side 11c and the third side 11d are convex toward the outside, respectively, and the first and second bases 11c and 11d have the same shape. Each of the columnar portions 13a and 13b has a rounded shape so that each tip portion 14 is concave toward the inner side so as to follow the shape of the second side 11c or the third side 11d of the pedestal portion 11. It has a part. In this example, the outlines of the second side 11c and the third side 11d, and the outlines of the tip portions 14 of the first and second columnar portions 13a and 13b are curves each having the same curvature. ing. The respective curves of the distal end portions 14 of the opposing columnar portions 13a and 13b and the mounting end sides 11c and 11d of the pedestal portion 11 are rotated about the center in the width direction of the portion where the width of the column 12 is the narrowest. It has a shape that overlaps when it is made to work. The outlines of the second and third sides 11c and 11d and the outline of the tip portion 14 of the columnar portion 13 are farther from the fulcrum as the position is closer to the mounting end 2a. Then, the tangents of these outlines are shaped such that the closer to the mounting end 2a, the closer to the vertical direction of the mounting end 2a. In the embodiment shown in FIG. 1, the columnar portions 13a and 13b and the pedestal portion 11 are symmetrical with respect to a vertical line passing through the center of the mounting end 2a.

  As described above, when the columnar portions 13a and 13b are provided on both left and right sides of the column 12, and a gap is formed between the tip portion 14 of each columnar portion 13a and 13b and the second peripheral portion 11b, 12 can be bent to the left and right in a plane, so that the maximum interval of the gap with respect to the movable width of the probe tip 5a at the height above the probe can be reduced, which is preferable. In setting the interval of the gap, the interval of the gap on the other side in a state where the column 12 is bent and deformed until the gap on one side comes into contact is the interval at which the molten bonding material can enter by capillary action. It is more preferable to set so that

  As a result, when the bonding layer 7 is melted and the probe 1 is bonded and fixedly attached to the probe substrate 21, the position of the probe 12 is adjusted by bending and deforming the column 12 in the plane formed by the probe 1 in the position adjusting step. In each of the probe 1 and the probe 1 whose position has not been adjusted, the gap formed between the tip portion 14 of the columnar portion 13 and the pedestal portion 11 has a liquid melted by capillary action. Can enter the gap.

  Next, as shown in FIG. 1, the probe base 3 of the mounting part 2 of the probe 1 according to the first embodiment of the present invention is connected to the mounting part 2 in the up-down direction which is the first direction. Through this, it is connected to the end of the mounting portion 2 in the first direction.

  In the probe 1 shown in FIG. 1 and the like, the width of the probe base 3 in the left-right direction, which is the above-described second direction, is larger than that of the support 12 of the mounting portion 2. Therefore, the probe base 3 can have the columnar portion 13 of the mounting portion 2 arranged at the end on the pedestal portion 11 side so as to be separated from the support 12.

  In the probe base 3, a plurality of holes penetrating in the thickness direction can be arranged at intervals in the vertical direction which is the first direction.

  The arm 4 of the probe 1 according to the first embodiment of the present invention is provided so as to extend from the probe base 3 in a second direction intersecting the first direction, as shown in FIG. That is, it is provided so as to extend in the left-right direction from the probe base 3 connected so as to be connected to the mounting portion 2 in the up-down direction.

  As shown in FIG. 1, the arm portion 4 is formed by two arms 4 a and 4 b spaced from each other in a vertical direction, which is a first direction, but includes a single arm or three or more arms. It may be formed.

  The arm portion 4 is a portion for elastically supporting the needle tip 5, and when the needle tip 5a is pressed against the electrode pad of the device under measurement, the arms 4a and 4b are elastically deformed.

  As shown in FIG. 1, the needle tip 5 of the probe 1 according to the first embodiment of the present invention is provided at the tip of the arm 4 opposite to the probe base 3.

  The needle tip 5 extends to the side of the arm 4 opposite to the side where the mounting end 2a of the mounting part 2 is located, and the needle tip 5a is formed at the tip protruding upward in the drawing. The upper end of the tip 5a of the tip 5 having the smallest cross-sectional area is pressed against an electrode pad (not shown) on a semiconductor wafer (not shown) which is an object to be inspected, and each semiconductor integrated circuit of the semiconductor wafer is pressed. Is connected to an electric circuit of the inspection apparatus via a probe assembly provided with the probe 1.

  The tip 5a is made of the same material as the body of the probe 1 such as the tip 5 and the arm 4, and can be formed integrally with the body of the probe. However, in view of improving durability, the pyramid-shaped needle tip 5a is formed of a high-hardness metal material such as cobalt, rhodium, or an alloy thereof, and this needle tip 5a is embedded in the tip of the needle tip 5. Preferably, it is formed. The dimension in the thickness direction of the portion having the largest cross-sectional area of the needle tip 5a can be, for example, 5 μm to 20 μm.

  In the plate-like probe 1 according to the first embodiment of the present invention, a bonding layer 7 made of a conductive and heat-fusible bonding material is disposed on at least one side surface of the mounting portion 2.

  FIG. 4 is a diagram illustrating a state in which the bonding layer is arranged in the probe 1 according to the first embodiment of the present invention.

  As shown in FIG. 4, in the plate-like probe 1 according to the first embodiment of the present invention, one side of the mounting portion 2 including the pedestal portion 11, the support 12, and the columnar portion 13 is electrically conductive and heat-fusible. Can be arranged and provided.

  The thickness of the bonding layer 7 can be, for example, 20 μm to 50 μm.

  In addition, as shown in FIG. 4, the bonding layer 7 is arranged so as to include a part of the probe base 3 on the pedestal 11 side, including the lower end of the probe base 3 together with the mounting part 2 of the probe 1. May be done.

  As shown in FIG. 4, the bonding layer 7 has a similar shape corresponding to the shape of each part of the mounting part 2. That is, the bonding layer 7 is configured to include portions of the same shape corresponding to the pedestal 11, the support 12, and the column 13 of the attachment 2. Then, between the tip portion of the portion corresponding to the first columnar portion 13a in the bonding layer 7 and the portion corresponding to the second side 11c of the pedestal portion 11 opposed thereto, and to the second columnar portion 13b. As in the case of the mounting portion 2, a gap is formed between the tip portion of the corresponding portion and the portion corresponding to the third side 11d of the pedestal portion 11 opposed thereto.

  The bonding material forming the bonding layer 7 is preferably a solder material. Since the bonding material is a solder material, the bonding layer 7 can have a heat melting property. Then, by heating and melting the bonding layer 7, the probe 1 is bonded to the probe substrate of the probe assembly by using the mounting end 2 a of the mounting portion 2 to be electrically connected, and realizes a firm fixation. can do.

  The bonding material forming the bonding layer 7 is tin (Sn), tin-bismuth alloy (Sn-Bi), tin-antimony alloy (Sn-Sb), tin-silver alloy (Sn-Ag), tin-silver-copper It is preferably formed using at least one selected from the group consisting of an alloy (Sn-Ag-Cu) and a gold-tin alloy (Au-Sn). By forming the bonding material using the above-described material, the probe 1 is bonded to the probe substrate of the probe assembly by using the mounting end 2 a of the mounting portion 2 to be electrically connected and firmly fixed. Can be realized.

  At this time, in the probe 1 according to the first embodiment of the present invention, a layer of the adjusting material (which adjusts the wetting angle of the bonding material forming the bonding layer 7) is provided on the surface of the region of the mounting portion 2 where the bonding layer 7 is provided. (Not shown) can be provided. That is, a layer of the adjusting material can be arranged between the mounting portion 2 and the bonding layer 7.

  Such an adjusting material is formed using at least one selected from the group consisting of gold (Au), rhodium (Rh), copper (Cu), nickel (Ni), palladium (Pd), and cobalt (Co). It is preferred that it is. In particular, it is preferably formed using gold.

  When the adjustment material layer is formed using, for example, the above-described materials, the thickness of the adjustment material layer can be, for example, about 1 μm.

  In the probe 1 according to the first embodiment of the present invention, the bonding layer 7 is heated and melted, and the probe assembly is bonded to the probe substrate using the mounting end 2a. At this time, by providing the layer of the adjusting material as described above on the mounting portion 2, the bonding by the bonding layer 7 is further strengthened, and stronger fixing and low-resistance electrical connection can be realized. .

  In the probe 1, when the bonding layer 7 is heated and melted and the probe assembly is mounted on the probe board using the mounting end 2a of the mounting portion 2, the mounting portion 2 is adjusted as described above. By providing the material layer, it becomes easy for the molten liquid bonding material to enter the gap between the tip portion 14 of the columnar portion 13 and the pedestal portion 11 by capillary action. As a result, by using the molten liquid bonding material, the tip portion 14 of the columnar portion 13 and the pedestal portion 11 can be efficiently bonded, and the mutual fixing can be performed more firmly.

  The probe 1 according to the first embodiment of the present invention having the above configuration can be attached to a probe board to form a probe assembly according to the third embodiment of the present invention. Then, when attaching the plurality of probes 1 to the probe substrate, the position of the needle tip 5a of the needle tip 5 can be adjusted using the attachment portion 2 in each probe 1.

  The adjustable range of the height position of the probe 1 can be determined in consideration of, for example, the flatness of the probe substrate and the allowable range of the height position of the probe tip in the probe card. Here, the adjustable range of the height position of the probe 1 means that when the columnar portion 13 is formed on both sides of the column 12, the tip portion 14 of the columnar portion 13a forming the inner gap portion and the pedestal portion 11 are in contact with each other. From the height of the needle tip 5a when the column 12 is bent and deformed in the plane formed by the probe 1 until the tip portion 14 of the columnar portion 13b forming the outer gap portion and the pedestal portion 11 come into contact with each other. 12 is the range up to the height position of the needle tip 5a when bending deformation is performed. The height position of the needle tip in a state where the column is not bent and deformed is defined as 0, the direction in which the needle tip 5a is pushed is expressed as minus, and the direction in which the needle tip 5a is pulled up is expressed as plus. For example, when the probe substrate according to the first embodiment of the present invention has a swell of ± X μm from the center value, and the allowable range from the design value of the height position of the probe tip 5a on the probe substrate is ± Y μm ( However, X> Y), the probe 1 adjusts the height position of the needle tip 5a to ± (XY) μm or more by adjusting the position of the needle tip 5a of the needle tip 5 using the mounting part 2. It is good to constitute so that it may be in the range of. For example, it can be set within a range of ± (XY) μm to ± X μm. The height position adjustment range of the needle tip 5a is determined by the interval and position of the gap between the tip portion 14 of the columnar portion 13 and the second peripheral portion 11b of the pedestal portion 11, the length of the arm portion 4, the position of the column 12, and the like. By changing, it can be set in a predetermined range.

  Therefore, in the probe assembly according to another embodiment of the present invention, it is possible to adjust the respective positions of the tips of the plurality of probes, that is, the respective height positions of the tips 5a of the probes 1 on the probe substrate. The difference in height position among the plurality of probes 1 can be set within an allowable range.

  That is, the probe 1 of the first embodiment of the present invention is a probe provided with a mechanism for adjusting the height position of the needle tip 5a. By using the probe 1 of the first embodiment of the present invention, a plurality of probes are provided. A probe assembly according to another embodiment of the present invention, in which the variation in the position of the needle tip is reduced.

  Hereinafter, a method for manufacturing the probe assembly according to the second embodiment of the present invention, which is performed using the probe 1 according to the first embodiment of the present invention, will be described.

Embodiment 2 FIG.
<Method of manufacturing probe assembly>
FIG. 5 is a diagram illustrating a method for manufacturing a probe assembly according to the second embodiment of the present invention.

  FIG. 5 illustrates a part of a probe board 21 constituting a probe assembly and a part of the probe board 21 of the present invention shown in FIG. 4 attached thereto in order to explain a method of manufacturing a probe assembly according to a second embodiment of the present invention. 1 shows a probe 1 according to one embodiment.

  In the method for manufacturing a probe assembly according to the second embodiment of the present invention, as shown in FIG. 5, a probe assembly is manufactured using the probe 1 according to the first embodiment of the present invention. At this time, known components such as a probe board 21 to which the probe 1 is attached and a wiring board (not shown) configured by disposing the probe board 21 on the lower surface side can be used. . Therefore, in the method of manufacturing the probe assembly according to the second embodiment of the present invention, as shown in FIG. A probe assembly can be manufactured using a known method except for the method of adjusting the position of the needle tip 5a of the needle tip 5 of the probe 1.

  Therefore, in the following description of the method of manufacturing the probe assembly according to the second embodiment of the present invention, mainly the method of attaching the probe 1 of the first embodiment of the present invention to the probe substrate 21, particularly, A method for adjusting the position of the needle tip 5a of the needle tip 5 of the probe 1 in the assembly will be described. In the description of the method of manufacturing the probe assembly according to the second embodiment of the present invention with reference to FIG. 5, the same reference numerals are given to the components such as the probe 1 which are common to those described with reference to FIG. However, overlapping description will be omitted as much as possible.

  The method for manufacturing a probe assembly according to the second embodiment of the present invention includes the following arrangement step, position adjustment step, and attachment step.

  In the disposing step, the mounting end 2 a of the mounting portion 2 of the probe 1 is brought into contact with the probe substrate 21 which is a substrate constituting the probe assembly, and the probe 1 is disposed on the probe substrate 21. It is a process.

  In the position adjusting step, the column 12 of the mounting portion 2 of the probe 1 is bent and deformed in the plane formed by the plate-shaped probe 1 in a state where the probe 1 is arranged on the probe substrate 21 in the above-described arrangement step. The height of the tip 5a of the tip 5 at the tip of the arm 4 is changed in a first direction perpendicular to the mounting end 2a, so that the height of the tip 5a with respect to the probe substrate is changed. This is a step of adjusting and holding the probe 1 in that state. Here, the height position of the probe tip 5a with respect to the probe board 21 refers to the height position from the reference plane to the probe tip 5a in a direction perpendicular to the reference plane of the probe board. A surface serving as a height reference in the thickness direction of the probe substrate 21 such as a design reference surface of the substrate 21, a design surface of the probe mounting surface, and a mounting surface of the probe substrate 21 to the probe assembly can be used. (Hereinafter, such a height position of the probe tip 5a with respect to the probe substrate is also referred to as a “probe substrate needle position”.)

  In the mounting step, the columnar portion 13 of the mounting portion 2 and the pedestal portion 11 are fixed while the probe needle height position of the probe 1 on the probe board is adjusted by the above-described position adjusting step, and the probe 1 is connected to the probe board 21. This is the process of mounting on top.

  Hereinafter, each of the above-described steps constituting the method of manufacturing the probe assembly according to the second embodiment of the present invention will be described in more detail.

(Placement process)
In the above-described arrangement step, the probe substrate 21 is used as a substrate to which the probe 1 is attached. The probe substrate 21 used is, for example, a ceramic substrate formed in a circular flat plate shape of ceramic, and a flexible flat plate formed in a circular flat plate shape of an electrically insulating resin such as a polyimide resin and laminated on the upper surface of the ceramic substrate. And a multilayer sheet. The probe board 21 is fixed to the wiring board so that its lower surface faces the upper surface of the wiring board, and has a plurality of internal wirings 22 electrically connected to tester lands of the wiring board. A plurality of bonding pads 23 electrically connected to the internal wirings 22 are provided on the upper surface. Therefore, a plurality of mounting pads for fixing and supporting the probe 1, that is, a plurality of bonding pads 23 are provided on the upper surface (probe mounting surface) of the probe substrate 21.

  When the probe 1 according to the first embodiment of the present invention is mounted on the probe board 21 to manufacture a probe assembly, in this arrangement step, the probe 1 is used and the mounting portion of the probe 1 is mounted on the probe board 21. The probe 1 is mounted on the upper surface of the probe board 21 with the mounting end 2a included in the second pedestal portion 11 abutting.

  As described above, a plurality of bonding pads 23 for fixing and supporting the probe 1 are provided on the upper surface of the probe substrate 21. Therefore, one of the probes 1 is held perpendicularly to the probe board 21 while the mounting end 2a of the mounting portion 2 abuts on the corresponding one bonding pad 23 of the probe board 21 over the entire width thereof. You. This holding state is maintained until the next position adjustment step.

  This arrangement step can be performed while supporting an arbitrary portion of the probe 1. For example, if the arrangement step is performed while supporting the pedestal portion 11 or the probe base 3, the column 12 does not hinder the bending deformation in the plane. This is preferable because it can be supported without deformation of the arm portion 4. It is also preferable because it does not hinder the joining with the joining material in the later attaching step.

  If the bonding pad is inclined when the mounting end 2a is brought into contact with the bonding pad 23, the probe 1 is rotated in the plane formed by the probe 1 in accordance with the inclination so that the mounting end 2a follows the bonding pad 23. Alternatively, the mounting end 2a may be made to follow the bonding pad 23 by utilizing the bending deformation of the support 12 by pressing the probe 1.

  For example, when performing the placement process while supporting the pedestal portion 11, the probe 1 is supported (for example, pinched) by the portion of the pedestal portion 11, and while the probe 1 is perpendicular to the probe board 21, the mounting end 2 a is It is brought into contact with the bonding pad 23 and the state is maintained. At this time, in the case where the upper surface of the bonding pad 23 is inclined, the pedestal portion 11 is rotated in a plane formed by keeping the pedestal portion 11 perpendicular to the probe board, and the mounting end 2a is moved over the entire width of the bonding pad. 23.

  When the placement step is performed while supporting the probe base 3, the probe 1 is supported (for example, pinched) by the probe base 3, the plane formed by the probe 1 is perpendicular to the probe substrate 21, and While maintaining the arm portion 4 in a predetermined direction with respect to the probe board 21, the mounting end 2a is pressed against the bonding pad 23, and that state is maintained. At this time, if the upper surface of the bonding pad 23 is inclined, the support column 12 bends and deforms in the plane formed by the inclination, so that the mounting end 2a is held at the full width while holding the arm portion 4 in the correct direction. It can be brought into contact with the bonding pad 23. When the probe base 3 is held in this manner, the probe 1 is pressed against the bonding pad while supporting the probe 1 in the correct posture with respect to the probe substrate 21, and the mounting end 2 a is inclined according to the shape of the bonding pad 23. This is preferable because the probe holding operation in the arrangement step is simplified.

(Position adjustment process)
Next, before the mounting step of fixing and attaching the probe 1 to the probe board 21, the position adjusting step of adjusting the height position of the needle tip 5 a of the needle tip 5 of the probe 1 with respect to the probe board 21. Can be provided.

  In the above-described arrangement step, the probe 1 is held on one corresponding bonding pad 23 of the probe substrate 21 in a direction perpendicular to the reference surface of the probe substrate 21. At this time, in the probe 1, the bottom of the mounting end 2 a of the mounting portion 2 is kept in contact with the bonding pad 23. In this state, the height position of the needle tip 5a with respect to the probe board 21 is inspected, and if the result is within the allowable range, the process proceeds to the next mounting step. If the position is outside the allowable range, the height position of the needle tip 5a with respect to the probe board 21 is adjusted by the mechanism for adjusting the height position of the needle tip 5a by the mounting part 2, and the adjusted state is maintained. Move on to the next mounting process.

  The adjustment of the height position of the needle tip 5a is performed by bending and deforming the column 12 in the plane. When the height position of the needle tip 5a is lower than the allowable range (closer to the probe board 21 side). While the mounting end 2a of the pedestal portion 11 is kept in close contact with the bonding pad 23, the portion (probe base 3, arm portion 4, or needle tip portion 5) of the support 12 of the mounting portion 2 on the needle tip 5a side. By applying force, the support 12 is bent and deformed in the plane formed by the plate-like probe 1, whereby the needle tip 5a of the needle tip 5 is pulled upward to adjust the height of the needle tip 5a to a higher position. It can be carried out.

  When the height position of the needle tip 5 a is higher than the allowable range (far from the probe board 21), the support end 12 a of the mounting portion 2 is A force is applied to the portion (probe base 3, arm 4, or needle tip 5) on the tip 5a side to bend the support column 12 in the plane formed by the plate-like probe 1, thereby causing the tip portion to be bent. The adjustment of lowering the height position of the needle tip 5a by pushing down the needle tip 5a of No. 5 can be performed.

  It is more preferable that the portion for applying the force for adjusting the height be the probe base 3 because the position of the needle tip 5 a can be changed without deforming the arm 4. In this case, it is preferable to apply a force so that the probe base is rotated about the most bendable portion of the support column around the fulcrum so that the support column is bent and deformed in the plane formed by the support column. For example, when the probe 1 is held while supporting the probe base 3, the support 12 is bent and deformed in the plane formed by the probe 1 while the mounting end 2 a is in contact with the bonding pad 23. By changing the direction of the held probe base 3 within the plane formed by the probe 1, the height position of the needle tip 5a is set within an allowable range, and the probe base 3 is held so as to maintain that state.

  In the position adjustment step, the height positions of the needle tips 5a of the plurality of probes 1 can be simultaneously adjusted. For example, when the height position of the probe tip 5a with respect to the probe board in the plurality of probes 1 exceeds the allowable range, the plurality of probes 1 are perpendicular to the probe board, and the mounting ends 2a of the pedestal portion 11 correspond to each other. In a state of being held in contact with the bonding pad 23, a needle height adjusting plate having a highly flat surface is placed with the highly flat surface facing in parallel with the probe mounting surface of the probe board. It is relatively approached until a predetermined interval is reached, and that state is maintained. Thereby, the plurality of probes 1 in which the height position of the needle tip 5a exceeds the allowable range are bent and deformed in the plane formed by the respective columns 12, and the height position of the needle tip 5a is within the allowable range. It is maintained in the state where it fits.

  The inspection of the height position of the needle tip 5a in the position adjustment step can be performed using image processing technology or sensor technology.

(Installation process)
Next, in the mounting step, in the above-described position adjusting step, the probe 1 is moved so that the probe tip 21 a is at a predetermined height position with respect to the probe substrate while the probe 1 is in contact with the mounting end 2 a against the bonding pad 23. In the state held above, the bonding material was heated and melted, and the probe 1 was fixed and mounted on the probe substrate 21, and the columnar portion 13 and the pedestal portion 11 were bonded, and adjusted by the position adjusting step. The needle tip 5a is positioned at the position.

  More specifically, in the probe 1 held in the above-described position adjustment step, the bonding layer 7 arranged on the side surface of the mounting portion 2 is melted by heating. That is, using the probe 1 provided with the bonding layer 7 on the mounting portion 2, the bottom of the mounting end 2 a of the mounting portion 2 is kept in contact with the bonding pad 23, and the bonding layer 7 is heated in this state. Then, the bonding layer 7 is melted. As a result, the melt of the bonding material forming the bonding layer 7 is transferred between the bonding pad 23 of the probe substrate 21 and the mounting end 2 a of the mounting portion 2 of the probe 1, and the corner 15 between the bonding pad 23 and the pedestal 11. The gap is maintained between the tip portion 14 of the columnar portion 13 and the columnar portion facing portion 2c of the pedestal portion 11. Then, when the heating of the bonding layer 7 is stopped, the temperature of the melted bonding material decreases and solidifies. As a result, the probe 1 is connected to the bonding pad 23 and the probe by the solidified material of the bonding material existing between the bonding pad 23 and the corner 15 of the base between the bonding pad 23 and the mounting end 2a of the mounting portion 2. It is firmly fixed to the substrate 21. Further, the columnar portion 13 and the pedestal portion 11 are joined by the solidified material of the bonding material existing in the gap between the distal end portion 14 of the columnar portion 13 and the columnar portion facing portion 2c of the pedestal portion 11, and the probe 1 The probe base 3 is firmly fixed to the pedestal 11 with the position of the needle tip 5a positioned at the position adjusted in the position adjustment step.

  In the probe 1, since the melting point of the joining material constituting the probe 1 is set sufficiently lower than the melting point of the constituent material of the attaching portion 2, the joining layer 7 melts, but the attaching portion 2 does not soften or melt. Can heat the bonding layer.

  At this time, as a method of heating the bonding layer 7, for example, a method of irradiating a laser beam can be used. By using a laser beam, the bonding layer 7 of the probe 1 can be locally heated, and unnecessary heating of other portions of the probe 1 can be avoided. In addition, the response of the temperature increase and the cooling corresponding to the heating start and the heating stop can be improved, and the bonding layer 7 can be efficiently heated.

  That is, as described above, the mounting portion 2 of the probe 1 includes the pedestal portion 11 including the mounting end 2a, the support column 12, and the columnar portion 13. Then, a bonding layer 7 made of a bonding material having conductivity and heat melting property is arranged on one side surface of the mounting portion 2. In the mounting portion 2 having such a structure, a gap is formed between the tip portion 14 of the columnar portion 13 and the pedestal portion 11 as described above. The width of the gap is set to a width that allows a liquid bonding material formed by hot-melting the heat-fusible bonding material to enter the gap by a capillary phenomenon. That is, the gap is set to such a size that the tip of the columnar portion 13 and the pedestal portion 11 can be efficiently joined and firmly fixed using a hot-melted liquid joining material.

  Further, in the probe 1, as described above, the column 12 of the mounting portion 2 is subjected to bending deformation in the plane formed by the plate-like probe 1, and the position of the needle tip 5a of the needle tip 5 is moved up and down. The shape of the distal end portion of the columnar portion 13 and the pedestal portion 11 is selected so that the variation in the width of the gap between the distal end portion 14 of the columnar portion 13 and the pedestal portion 11 is kept small even if . For example, as described above, the pedestal portion 11 has a substantially trapezoidal shape in plan view, and each of its hypotenuses has a shape with a radius so as to be convex toward the outside, The distal end portion 14 of the columnar portion 13 has a rounded portion so as to be concave toward the inner side so as to follow the shape of the oblique side of the pedestal portion 11.

  As a result, when the bonding layer 7 is melted and the probe 1 is bonded and fixedly attached to the probe substrate 21, the position of the probe 12 is adjusted by bending and deforming the column 12 in the plane formed by the probe 1 in the position adjusting step. In each of the probe 1 and the probe 1 whose position has not been adjusted, the gap formed between the tip portion 14 of the columnar portion 13 and the pedestal portion 11 has a liquid melted by capillary action. Can enter the gap.

  In particular, as described above, when the layer of the adjusting material for adjusting the wetting angle of the bonding material forming the bonding layer 7 is provided on the surface of the region where the bonding layer 7 of the mounting portion 2 is provided, the molten material is melted. Capillary phenomenon of the bonding material occurs more efficiently, and the bonding material is more likely to enter the gap.

  The above-described arrangement step, position adjustment step, and mounting step are performed in order for each of one or more probes 1 and are repeated, so that all the probes 1 may be mounted on the probe substrate 21. Alternatively, these three steps may be sequentially performed on all the probes.

  In the above-described second embodiment, the case where the bonding material is laminated on the mounting portion 2 of the probe 1 has been described. However, for example, the bonding material may be separately supplied when the probe 1 is mounted in the mounting process. Good.

  The holding operation and the joining operation of the probe 1 can be performed by an automatically controlled device.

  As described above, in the method of manufacturing the probe assembly according to the second embodiment of the present invention including the arrangement step, the position adjusting step, and the attaching step, the mounting portion of the probe 1 according to the first embodiment of the present invention is used. 2 is used for attachment to the probe substrate 21 and as a mechanism for adjusting the height position of the needle tip 5a. Then, the mounting portion 2 is firmly fixed to the bonding pad 23 of the probe substrate 21 to support the probe 1 in a cantilever shape on the probe substrate 21 in a correct posture, and to mount the probe 1 on the probe substrate of the probe tip 5 a of the probe 1. By adjusting the height position of the probe 1, it is possible to provide a probe assembly in which errors and variations in the height position of the probe tip 5 a of the probe 1 are suppressed. That is, the method for manufacturing a probe assembly according to the second embodiment of the present invention is a method for manufacturing a probe assembly that uses the probe 1 and is effective in reducing errors and variations in the height position of the probe tip 5a of the probe 1. .

Embodiment 3 FIG.
<Probe assembly>
Next, a probe assembly according to a third embodiment of the present invention will be described.

  The probe assembly according to the third embodiment of the present invention is manufactured by the method for manufacturing a probe assembly according to the second embodiment of the present invention.

  Therefore, the probe assembly according to the third embodiment of the present invention is manufactured by using the probe according to the first embodiment of the present invention and by the method for manufacturing a probe assembly according to the second embodiment of the present invention. Therefore, the description thereof will be made with reference to FIGS. 1 to 5 and the like showing the probe and the like of the first embodiment of the present invention, and the same reference numerals will be given to the common components, and redundant description will be omitted as much as possible. I will.

  FIG. 6 is a view showing a probe assembly according to a third embodiment of the present invention. This probe assembly is an example of a probe card.

  FIG. 6 shows a probe assembly 31 according to a third embodiment of the present invention, and also shows a probe 1 and a probe board 21 of the first embodiment of the present invention, which constitute the probe assembly 31. 1 to 5 used for the description of 21, the arrangement of the probe 1 and the probe substrate 21 is shown upside down for convenience.

  As shown in FIG. 6, a probe assembly 31 according to a third embodiment of the present invention includes a reinforcing member 32 having a flat lower surface, a circular flat plate-shaped wiring board 33 held on the lower surface of the reinforcing member 32, and a wiring board. A probe plate 21 of a circular flat plate shape arranged on the lower surface of the substrate 33, a plurality of probes 1 of the first embodiment of the present invention arranged on the lower surface of the probe substrate 21, and the probe substrate 21 are attached to the wiring substrate 33. And a mounting ring 34.

  The reinforcing member 32 is a known member made of a metal material such as a stainless steel plate (see, for example, JP-A-2008-145238). Such a reinforcing member 32 includes an outer annular portion, an inner attaching portion extending in the circumferential direction inside the annular portion, a plurality of connecting portions that integrally connect the annular portion and the attaching portion, and a radius from the annular portion. A plurality of extensions extending outward in the direction. In the example shown in FIG. 6, the reinforcing member 32 is shown in a state in which an inner portion protrudes upward from an annular portion having substantially the same diameter as the probe substrate 21.

  For example, as described in the above-mentioned Japanese Patent Application Laid-Open No. 2008-145238, an annular thermal deformation suppressing member for suppressing thermal deformation of the reinforcing member 32 above the reinforcing member 32, or covering a space above the wiring board. A cover may be provided, or the above-described cover may be provided on the thermal deformation suppressing member.

  In the example shown in FIG. 6, the wiring board 33 is a known printed wiring board manufactured in a disk shape by using an electrically insulating resin such as an epoxy resin containing glass. Such a wiring board 33 is electrically connected to an electric circuit of a test apparatus for inspecting an object to be inspected such as a semiconductor wafer, that is, an electric circuit for test so as to transfer a test signal to the electric circuit for test. A plurality of tester lands (not shown) are provided on the outer peripheral edge of the upper surface, and a plurality of conductive paths (not shown) connected to the tester lands are provided inside.

  The wiring board 33 further has a plurality of terminals (not shown) electrically connected to the probe board 21 on a lower surface. Each terminal is electrically connected to the above-described conductive path.

  In the example shown in FIG. 6, the probe substrate 21 is formed of a ceramic flat plate made of ceramic as described above, and a circular flat plate made of an electrically insulating resin such as a polyimide resin. A flexible multilayer sheet 36 laminated on the lower surface of the substrate 35.

  Such a probe board 21 has a plurality of internal wires (not shown in FIG. 6) electrically connected to terminals on the lower surface of the wiring board 33, for example, as shown in FIG. The probe substrate 21 has, on its lower surface, a plurality of bonding pads 23 electrically connected to the above-described internal wiring 22. Therefore, on the lower surface of the probe board 21, a plurality of mounting pads for fixing and supporting the probe 1, that is, a plurality of bonding pads 23 are provided.

  The probe assembly 31 according to the third embodiment of the present invention is manufactured by the above-described method for manufacturing a probe assembly according to the second embodiment of the present invention, and each probe 1 is attached to the bonding pad 23 at least in a state of extending downward. Installed.

  The reinforcing member 32 and the wiring board 33 are coaxially coupled by a plurality of screw members (not shown) in a state where the lower surface of the reinforcing member 32 and the upper surface of the wiring board 33 are in contact with each other. On the other hand, the probe board 21 is attached to the lower surface of the wiring board 33 by using the attachment ring 34 and a plurality of screw members (not shown) so that the probe 1 faces downward.

  In the probe assembly 31, an electric connector is arranged between the wiring board 33 and the probe board 21, and the conductive path of the wiring board 33 and the internal wiring 22 of the probe board 21 are electrically connected by the electric connector. You may.

  In the probe assembly 31, the probe 1 is the probe 1 according to the first embodiment of the present invention described with reference to FIGS. 1 and 4 as described above. The probe assembly 31 of the third embodiment of the present invention uses the probe 1 and the probe board 21 by the method of manufacturing the probe assembly of the second embodiment of the present invention described with reference to FIG. It is manufactured by attaching the probe 1 to.

  Therefore, in the probe assembly 31, the probe 1 is firmly fixed to the bonding pad 23 of the probe substrate 21 by the pedestal portion 11 and the bonding layer 7 of the mounting portion 2 as described above, The stylus tip 5a is adjusted and positioned on the probe substrate 21 using the support 12 and the bonding layer 7 of the mounting portion 2 of the probe 1 while being supported in a beam shape.

  As described above, the probe assembly 31 according to the third embodiment of the present invention is a probe assembly in which errors and variations in the height position of the probe tip are reduced.

  It should be noted that the present invention is not limited to the above embodiments, and can be variously modified and implemented without departing from the spirit of the present invention.

  ADVANTAGE OF THE INVENTION According to the probe and probe assembly of this invention, a test object can be inspected on optimal conditions, and an accurate test with respect to a test object can be performed.

  In addition, the probe and probe assembly of the present invention can be used for consumer electronic devices such as liquid crystal TVs and liquid crystal display devices of portable electronic devices, for which it is strongly required to improve the efficiency of the inspection process, and hence the productivity and the inspection accuracy. It is particularly effective for inspecting semiconductor wafers for use in equipment.

1, 40 Probe 2, 41 Attachment part 2a Attachment end 3 Probe base 4 Arm part 4a, 4b Arm 5 Needle tip 5a Needle tip 7 Bonding layer 11, 43 Base part 11a First peripheral part 11b Second peripheral part 11c Second side 11d Third side 11e First side 12, 42 Column 13 Column 13a First column 13b Second column 14 Tip 21 Probe board 22 Internal wiring 23 Bonding pad 31 Probe assembly 32 Reinforcing member 33 Wiring board 34 Mounting ring 35 Ceramic board 36 Flexible multilayer sheet

Claims (15)

An upright plate-shaped probe which is joined upright on a substrate by a joining material having conductivity and heat melting property,
And a mounting portion provided to extend in a direction away from the front Kimoto plate from the mounting end having a mounting end comprising a peripheral portion which is brought into contact with the substrate during the bonding,
A probe base connected in a first direction intersecting a straight line where the mounting end and the substrate are in contact with each other in a plan view by the plate shape and connected to the mounting portion;
An arm portion extending in a second direction intersecting with the first direction from the probe base in plan view by the plate shape;
In the arm portion, extending in a direction away from the substrate, having a needle tip portion formed with a needle tip at the tip,
The mounting portion,
A pedestal portion having a first peripheral portion serving as the mounting end, and a second peripheral portion connected to the first peripheral portion and facing the probe base;
A column connecting the second peripheral portion of the pedestal portion and the probe base;
It has a columnar portion extending from the probe base toward the pedestal portion at a distance from the support, and having a gap formed between the tip portion and the second peripheral portion of the pedestal portion. Probe to do.   A portion of the pedestal portion, which is connected to the support in the second peripheral portion, is vertically above a straight line between the mounting end and the substrate in the first peripheral portion, in a plan view of the plate shape. The probe according to claim 1, wherein the probe is located within a range.   A portion of the pedestal portion facing the tip portion of the columnar portion in the second peripheral portion is a plate-like planar view, and is a straight line where the mounting end and the substrate are in contact with the first peripheral portion in the first peripheral portion. The probe according to claim 1, wherein the probe is located within a range in a vertical direction.   A plurality of the columnar portions are provided with the column interposed therebetween, and a portion of the second peripheral portion of the pedestal portion facing a tip portion of the plurality of columnar portions sandwiches a portion connected to the column. The probe according to any one of claims 1 to 3, wherein a plurality of probes are provided. A portion of the pedestal portion facing the tip portion of the columnar portion in the second peripheral portion has a shape with a roundness so as to be convex or concave in plan view by the plate shape,
The tip portion of the columnar portion has a rounded shape so as to be concave or convex so as to conform to the shape of the second peripheral portion of the opposing pedestal portion in plan view. The probe according to any one of claims 1 to 4, characterized in that: The pedestal portion has a substantially square shape having the mounting edge of the first peripheral portion as one side and another three sides at the second peripheral portion in plan view of the plate shape. Having a portion connected to the support on the opposite side of the mounting end,
6. A portion facing a tip portion of the columnar portion on a side of the mounting end, which is a side connecting between the mounting end and each end of the opposite side of the mounting end. Or the probe according to claim 1.   The probe according to claim 6, wherein the substantially square shape of the pedestal portion formed by the plate shape in plan view is substantially trapezoidal.   The width of the narrowest part of the support in plan view due to the plate shape is not less than 1.5 times and not more than 2 times the plate thickness of the support, according to any one of claims 1 to 7, wherein Probe as described.   A corner of the support, which is formed at a joint portion of the pedestal portion with the second peripheral edge, is formed to be rounded so as to be concave toward an inner side of the support. Item 9. The probe according to any one of items 1 to 8.   The bonding layer comprising a bonding material having conductivity and heat melting property is provided on at least one of the plate-like surfaces of the mounting portion in a plan view, according to any one of claims 1 to 9, wherein Probe as described. An arrangement step of using the probe according to any one of claims 1 to 10, abutting the attachment end of the attachment portion on a substrate, and disposing the probe on the substrate,
Bending adjustment of the column of the mounting portion of the probe, a position adjustment step of adjusting the height position of the needle tip with respect to the substrate,
By heating and melting the conductive and heat-fusible bonding material, the probe is mounted on the substrate, and the bonding material is disposed in the gap between the tip portion of the columnar portion and the pedestal portion, A method of manufacturing a probe assembly, comprising: a step of joining a tip portion of the columnar portion and the pedestal portion to position the needle tip at a height position adjusted by the position adjusting step. . Contact to the substrate of the mounting end of the attachment portion in the arranging step is to hold the probe in the probe base, carried out by pressing the mounting end to said substrate while maintaining the posture of the probe The method for manufacturing a probe assembly according to claim 11, wherein: The bending deformation of the column in the position adjustment step,
Method for manufacturing a probe assembly according to claim 11, characterized in that by changing the orientation of the probe base relative to said base portion of said mounting end being in contact on the substrate. The bending deformation of the column in the position adjustment step,
Claims, characterized in that to perform by pressing said mounting end being in contact on the substrate by a high flatness of the surface relatively close the allowed while facing each other parallel to the substrate needlepoint 12. The method for manufacturing a probe assembly according to item 11.   A probe assembly comprising a plurality of probes according to any one of claims 1 to 10 mounted on a substrate.

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