JP2009276090A - Probe card equipped with interposer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card, equipped with an interposer for relaying electrical connection by being interposed between an electronic device which is an object to be inspected and a test board. <P>SOLUTION: The interposer 1 is equipped with a first interposer 1a arranged on the facing side to the test board, wherein a base material is formed of a rigid material; the second interposer 1b, arranged on the facing side to the electronic device, wherein the base material is formed of an organic material; the first middle electrode 1ab arranged opposite to the arrangement of the second interposer, on the side of the first interposer facing the second interposer; the second middle electrode 1ba, arranged opposite to arrangement of the first middle electrode, on the side of the second interposer facing to the first interposer; and a spiral contactor 22, provided on either electrode of the first middle electrode and the second middle electrode. This probe card is equipped, with the interposer fixed thereto by an insulating adhesive 5. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a probe card provided with an interposer that relays electrical connection between an electronic device to be inspected and a test board, and in particular, an electronic device such as an IC or LSI, and further a chip shape, The present invention also relates to a probe card including an interposer corresponding to a wafer-like electronic device.

  A semiconductor device (electronic device) such as a liquid crystal panel, IC, or LSI is generally formed in a rectangular shape, and a large number of electrodes are provided on the entire surface or the edge thereof. Such an electronic device is subjected to quality control so as to eliminate defective products from mass-produced products by performing an electrical test on a single product or a wafer in the manufacturing process.

In order to conduct an electrical test of these electronic devices, a tester is prepared that combines a drive circuit for operating the electronic device, a signal processing circuit unique to the test, a measuring means, a pass / fail judgment display means, and the like.
In the inspection stage, inspection is performed by checking the electrical continuity (hereinafter simply referred to as “continuity”) between the inspector and the device under test, and after inspection, the continuity is released and the device under test is removed from the inspector. Finish and provide for shipping.

  This inspector uses a probe card in which a large number of probes corresponding to the arrangement and pitch (hereinafter also referred to as “electrode arrangement”) of fine electrodes of an electronic device are used, and this is sent to the inspection position. There are known devices in which each electrode of a device is brought into contact with a measuring device and an electronic device is inspected by a probe card for inspection.

In this inspection device, probe cards having tens to tens of thousands of probes are arranged facing each other so as to sandwich the electronic device, and probes corresponding to all the electrodes of one electronic device are arranged. Are collectively brought into contact with the electronic device electrode.
The probe stage surrounding the electronic device is provided so as to be movable up and down, and a large number of probes fixed to the stage are brought into contact with the electronic device electrode by the raising and lowering operation of the stage.

  On the other hand, as an ultra-small FPC (flexible printed circuit board) connector that can be used for multifunctional, highly functional and ultra-miniaturized electronic devices such as mobile phones, it is connected by a micro connector provided on the connection terminal of the printed circuit board. There is known a spiral contactor in which a connection terminal of an FPC printed circuit board includes a plurality of spiral contacts (hereinafter also simply referred to as “SC”) having spiral portions from a base end portion toward a center portion ( For example, see Patent Document 1).

FIG. 10 is a configuration diagram of an interposer according to a conventional example.
As shown in FIG. 10, the interposer 121 mediates electrical connection by interposing between the device 131 and the mounting board type inspector 100 that performs the operation test by mounting the device 131 to be inspected on the simulator. To do. Electrodes 121a to 121h corresponding to the arrangement of the electrodes 131a to 131h of the device 131 are configured by spiral contacts SC on the device contact surface of the interposer 121, and electrodes 101A to 101H are disposed on the contact surface of the interposer 121 with the inspection device 100. The electrodes 121A to 121H corresponding to the arrangement of the electrodes are configured by spiral contacts SC, and are custom-made according to the difference in the electrode arrangement depending on the type of the device 131. The spiral contacts SC are resistant to the urging force. When a pressing force is applied, it is compressed flatly, and in the open state, the central portion rises in a conical shape and returns to its original position.

Since the SC has a conical shape in the open state, the conical bulge is restored again when the SC is released from the pressure contact state with the flat connection terminal.
Then, if the flat connection terminal with which the SC comes into contact comes into pressure contact with the SC again, it is possible to conduct again, so that the SC maintains elastic contact with the electronic component having the flat connection terminal or land. The contacted state and the released state are repeated detachably.
Further, since the SC is not soldered when debugging the computer program IC while mounting it, it is useful as a connector member that can be easily attached to and detached from the mounting board.

JP 2007-298476 A

  However, conventional high-priced interposers that are made only of monolithic ceramics in pursuit of high accuracy and interposers that are made by laminating thin-film organic materials on monolithic ceramics are expensive in terms of yield and cost reduction is desired. It was. As described above, it is an object of the present invention to provide a probe card having a good point of each interposer, heat resistance and mechanical strength to avoid thermal shrinkage, and a high-accuracy and high-yield interposer.

  A probe card comprising an interposer according to claim 1 is a probe card comprising an interposer that relays electrical connection between an electronic device to be inspected and a test board, the interposer Are arranged on the side facing the test board, the first interposer having a base material made of a rigid material, and the second interposer arranged on the side facing the electronic device, and the base material made of an organic material. The first interposer, the first interposer on the side facing the second interposer of the first interposer, and the first intermediate electrode disposed to face the arrangement of the electrodes of the second interposer, and the second interposer A second intermediate electrode disposed on the side facing the first interposer and opposed to the arrangement of the first intermediate electrode; A spiral contact provided on one of the first intermediate electrode and the second intermediate electrode, wherein the first and second interposers are electrically connected via the intermediate electrode. It is connected and further fixed by an insulating adhesive. The insulating adhesive may be any adhesive that can be used as an adhesive, and may be, for example, a resin material such as an epoxy resin.

  The invention according to claim 2 is a probe card comprising the interposer according to claim 1, wherein the first interposer includes the first intermediate electrode disposed at one end, and the first intermediate electrode. And a first outer electrode disposed at the other end electrically extended from the first outer electrode, wherein a spiral contact is provided on the first outer electrode.

  A third aspect of the present invention is a probe card comprising the interposer according to the first aspect, wherein the first outer electrode is electrically extended from the first intermediate electrode to increase the inter-electrode pitch. And arranged at the other end.

  The invention according to claim 4 is a probe card comprising the interposer according to claim 1, wherein the second interposer includes the second intermediate electrode disposed at one end and the second intermediate electrode. And a second outer electrode disposed on the other end with a reduced pitch between the electrodes, and a spiral contact is provided on the second outer electrode.

  The invention according to claim 5 is a probe card comprising the interposer according to claim 1, wherein the rigid material is a ceramic material.

  The invention according to claim 6 is a probe card comprising the interposer according to claim 1, wherein the organic material is polyimide.

  The invention according to claim 7 is a probe card comprising the interposer according to claim 1, wherein the spiral contact provided on either the first intermediate electrode or the second intermediate electrode And a connection terminal provided on any one of the first intermediate electrode and the second intermediate electrode are connected by metal fusion.

  According to an eighth aspect of the present invention, there is provided a probe card comprising the interposer according to the seventh aspect, wherein the connection terminal is in a solder ball shape or a land shape.

  The invention according to claim 9 is a probe card comprising the interposer according to claim 1, wherein the first interposer and the test board are electrically connected through the respective electrodes, and further a fixture. It is characterized by being fixed integrally by.

  The invention according to claim 10 is a probe card comprising the interposer according to claim 1, wherein a location where the first and second interposers are fixed by an insulating adhesive is the position of the electrode. It is characterized by at least three places.

  The invention according to claim 11 is a probe card comprising the interposer according to claim 4, wherein there is a step around the second outer electrode that is cut to the periphery of the second interposer. It is formed.

  The invention according to claim 12 is a probe card comprising the interposer according to claim 4, wherein, in the second outer electrode, the spiral contact is formed by laminating metal plating. It is mounted on.

  According to the first aspect of the present invention, the spiral contact is provided on one of the first intermediate electrode and the second intermediate electrode to insulate the first interposer from the second interposer. The first interposer formed of a rigid material such as ceramic and the second interposer formed of a flexible organic material can be integrated by being fixed by the adhesive. This clearly improves yield and increases costs compared to conventional interposers that are made only of high-priced multilayer ceramics that pursue high precision, and interposers that are formed by laminating thin film organic materials on multilayer ceramics. It was possible to suppress the probe card, which had the advantages of each interposer, had heat resistance and mechanical strength, and had a high accuracy and high yield interposer.

  According to the invention according to claim 2, by providing the spiral contact on the first outer electrode, it is possible to easily attach and detach the test board without being scratched without being soldered. The probe card can be inspected with the electrode stably and with high accuracy, has heat resistance and mechanical strength to avoid thermal shrinkage, and can be a probe card with an interposer with high accuracy and high yield.

  According to the third aspect of the present invention, the first outer electrode is electrically extended from the first intermediate electrode, and the pitch between the electrodes is enlarged to be disposed at the other end, thereby providing an electronic device to be inspected. Since the pitch between the probes that are in electrical contact with the test board can be greatly enlarged with respect to the test board, it is possible to further measure an electronic device that supports multiple electrodes.

  According to the fourth aspect of the present invention, the spiral contact is provided on the second outer electrode that is electrically extended from the second intermediate electrode and reduced in pitch between the electrodes and disposed at the other end. Since the pitch between the test boards can be greatly reduced with respect to the electronic device to be inspected, it is possible to further measure an electronic device that supports multiple electrodes.

  According to the invention which concerns on Claim 5, since the heat resistance and mechanical strength are high by forming the base material of a 1st interposer with a rigid material with a ceramic material, heat shrinkage can be avoided and high precision Can be maintained.

  According to the invention which concerns on Claim 6, by forming the base material of a 2nd interposer with organic materials, such as a polyimide, workability and a softness | flexibility are high, and even if there exists mechanical contraction, it can absorb flexibly. It is possible to prevent cracks from running on electrodes such as solder balls due to expansion and contraction on the connection surface.

  According to the invention which concerns on Claim 7, the metal material which comprises the contact part of a spiral contactor is an alloy by Sn, Ag, Cu, and has the property of carrying out metal fusion also at the temperature of about 150 degreeC lower than melting | fusing point. By applying, it becomes possible to obtain a more reliable thermal connection state, and when pressed, the corners of the spiral contactors slide while in contact with each other, removing the surface oxide film on the connection terminals and renewing In addition to being in contact with the generation surface, the pressing force in the state of being cut into this connection terminal is 0.05 to 1 N (0.005 to 0.1 kgf), the temperature is 20 to 250 ° C., and the pressing time is 1 to 3 minutes. By fusing, different metals can be fused.

  According to the invention according to claim 8, by making the connection terminal connected to the spiral contact with a solder ball shape or a land shape, fusion between different metals can be performed, and the spiral contact is Since it is connected by tearing the oxide film of the solder ball shape or land shape electrode, and further connected through the urging force of the spiral contact, even if there is undulation on the contact surface of the spiral contact, A stable and highly accurate connection with the electrode of an electronic device can be maintained.

  According to the invention of claim 9, the first interposer and the test board are electrically connected through the respective electrodes, and further fixed integrally with the screw-shaped fixture, so that the first interposer of the first interposer is connected. Without soldering the electrodes to the test board electrodes, the test board can be easily attached to and detached from the test board without any damage, and has high heat resistance and mechanical strength to avoid thermal shrinkage. It was possible to make a probe card with

  According to the invention which concerns on Claim 10, the location which fixes the 1st, 2nd interposer with insulating adhesives, such as an epoxy resin, is made into at least 3 places among the arrangement positions of an electrode, The 1st, 2nd interposer By applying a resin material using a dispenser at a position where the electrode is originally disposed, the first and second interposers can be fixed. In addition, a joint surface can be stabilized by apply | coating to at least 3 places. In other words, an epoxy resin for adhesion is applied to the dummy electrode. Accordingly, an unused or dummy electrode can be appropriately selected as a resin bonding portion, which is preferable because of its flexibility.

  According to the eleventh aspect of the present invention, the interposer is in contact with the electrode of the electronic device to be measured other than the measurement location by forming a stepped portion around the second outer electrode. Can be avoided.

  According to the twelfth aspect of the present invention, a step as if cut around the second outer electrode is formed by being placed on a fairly high raising base formed by laminating metal plating. In addition, the interposer can be prevented from coming into contact with the electrodes of the electronic device under measurement other than the measurement location.

Hereinafter, embodiments of an interposer according to the present invention will be described in detail with reference to the drawings.
In the following, parts having the same configuration are denoted by the same reference numerals throughout the drawings to avoid redundant description.
<First Embodiment>
FIG. 1: shows the outline of the interposer which has a disk shape for demonstrating the 1st Embodiment of this invention, (a) is the 1st interposer (MLC: Multilayer Ceramic) which comprises an interposer, and a 2nd interposer (MLO: Multilayer
(B) is a schematic view of the first interposer and the second interposer shown in (a) joined to each other and attached to a test board. It is.

As shown in FIGS. 1A and 1B, the probe card 3 relays an electrical test by being interposed between a chip (electronic device) 2a constituting a wafer 2 to be inspected and a test board. An interposer 1 is provided.
The interposer 1 is disposed on the side facing the test board 4 and is disposed on the side facing the first interposer 1a whose base material is formed of a rigid material such as ceramic and the chip (electronic device) 2a. And a second interposer 1b made of polyimide, which is an organic material. Details will be described with reference to FIG.

FIG. 2 is an enlarged cross-sectional view of the interposer shown in FIG. 1 and is a schematic cross-sectional view for explaining the features.
As shown in FIG. 2, on the side of the first interposer 1a facing the second interposer 1b, the first interposer 1b is disposed opposite to the arrangement of the electrodes of the second interposer 1b (second intermediate electrode 1ba). The intermediate electrode (spiral contact) 1ab of the second interposer 1b is disposed on the side facing the first interposer 1a of the second interposer 1b so as to face the arrangement of the first intermediate electrode 1ab of the first interposer 1a. A second intermediate electrode (land-like connection terminal) 1ba, and the first interposer 1a and the second interposer 1b are electrically connected via the first intermediate electrode 1ab and the second intermediate electrode 1ba. ing. Further, an insulating adhesive 5 using an epoxy resin is applied to the entire surface between the first interposer 1a and the second interposer 1b so that the first interposer 1a and the second interposer 1b are integrated. Is stuck. The spiral contact 22 (shown in FIG. 8) may be provided on either the first intermediate electrode 1ab or the second intermediate electrode 1ba. In the present embodiment, the spiral contact (shown in FIG. 8) is provided on the first intermediate electrode 1ab. A spiral contact 22 is arranged.

  The first interposer 1a includes a first intermediate electrode 1ab disposed at one end and a first outer electrode 1aa disposed at the other end electrically extended from the first intermediate electrode 1ab. The spiral contact 22 is provided on the first intermediate electrode 1ab.

  The second interposer 1b includes a second intermediate electrode 1ba disposed at one end, and a second outer electrode 1bb disposed at the other end electrically extended from the second intermediate electrode 1ba, A spiral contact (shown in FIG. 9) 23 is provided on the second outer electrode 1bb.

  Around the second outer electrode 1bb, a step 1af is formed around the second interposer 1b. This can prevent the interposer from contacting the electrodes of the electronic device to be inspected other than the measurement location.

  When the spiral contact 22 provided in one of the first interposer 1a and the second interposer 1b and the connection terminal facing the spiral contact 22 are heated and pressurized for a predetermined time. Metal fusion occurs and is firmly joined. In other words, the metal material constituting the contact portion of the spiral contactor is an alloy of Sn, Ag, and Cu, so that the metal can be fused even at a temperature of about 150 ° C., which is lower than the melting point. It becomes possible to obtain a thermal connection state, and when pressed, the corners of the spiral contacts slide while in contact with each other, and the surface oxide film on the connection terminals is removed to come into contact with a new generation surface. , The pressing force in the cut state in this connection terminal is 0.05 to 1 N (0.005 to 0.1 kgf), the temperature is 20 to 250 ° C., the pressing time is 1 to 3 minutes, and the metal-to-metal bonding The bonding strength can be increased.

FIG. 3 is a schematic configuration diagram showing a probe card formed by fixing the interposer shown in FIG. 2 to a test board with a fixture.
As shown in FIG. 3, the first interposer 1 a and the test board 4 are integrally fixed by a screw-like fixing tool 6, so that they are electrically connected through the respective electrodes, and the probe card 3 is formed. The

With this probe card 3, the chip 2a on the wafer 2 is measured.
As shown in FIG. 3, the spiral contact 23 provided on the second outer electrode 1bb which is a probe of the probe card 3 is a chip 2a on the wafer 2 which is driven vertically and horizontally by a driving means (not shown). In contact with a solder ball-shaped connection terminal (electrode) 2aa.

  As described above, the spiral contact 22 is provided on one of the first intermediate electrode 1ab and the second intermediate electrode 1ba, and an insulating adhesive is provided between the first interposer 1a and the second interposer 1b. By fixing at 5, the first interposer 1 a formed of a rigid material such as ceramic and the second interposer 1 b formed of a flexible organic material can be integrated. This clearly improves the yield and increases the cost compared to conventional interposers that are made only of high-priced multilayer ceramics that pursue high precision and interposers that are formed by laminating thin film organic materials on multilayer ceramics. Thus, the interposer 1 having high accuracy and high yield having the advantages of the respective interposers could be obtained.

  Further, by providing the spiral contact 22 on the first intermediate electrode 1ab, the second intermediate electrode 1ba, which is a land-shaped connection terminal, and the spiral contact 22 of the first intermediate electrode 1a, The oxide film of the land-shaped second intermediate electrode 1ba is connected while being cut and further connected through the biasing force of the spiral contact 22 so that a good connection can be maintained. The second intermediate electrode 1ba of the second interposer 1b has been described as an example of a land shape, but may be a solder ball.

  Furthermore, by providing the second outer electrode 1bb with a spiral contact 23 as a probe, even when there is a undulation on the surface in contact with the probe, an electronic device equipped with multiple electrodes, further a chip shape, In addition, it is possible to perform a stable and highly accurate inspection with electrodes provided on a wafer-like electronic device, a test board, or the like.

  And by forming the base material of the 1st interposer 1a with a ceramic material as a rigid material, since heat resistance and mechanical strength are high, thermal shrinkage can be avoided and high precision can be maintained.

  In addition, by forming the base material of the second interposer 1b from an organic material such as polyimide, the workability and flexibility are high, and even if there is mechanical shrinkage, it can be absorbed flexibly, and the expansion and contraction at the connection surface is achieved. It is possible to prevent cracks from running on electrodes such as solder balls.

  Then, the first interposer 1a and the test board 4 are electrically connected through the respective electrodes including the spiral contact 22 and further fixed integrally with the screw-shaped fixing tool 6 so that the debugging is in progress. The computer program IC or the like can be mounted without soldering, and can be easily attached to and detached from the probe card or the test board without being damaged.

<Second Embodiment>
Next, a second embodiment will be described.
4 and 5 are schematic views of an interposer for explaining a second embodiment of the present invention. The second embodiment differs from the first embodiment in two points, and the first is the structure of the via 11ac of the first interposer. The second is the difference in the position to apply the resin on the joint surface between the first interposer and the second interposer. 4 and 5, the same reference numerals are given to the same components as those in FIGS. 1 to 3, and the description thereof is omitted.
The via 1ac shown in FIG. 2 is linearly formed between the first intermediate electrode 1ab and the first outer electrode 1aa, but as shown in FIG. 4, the first intermediate electrode 11ab in the present embodiment is used. The fan-out structure is enlarged by the wiring 11ae running in the horizontal direction as it goes from the first to the first outer electrode 11aa. Further, the pitch of each via 11ac may be configured to be different depending on the design.

  Further, as shown in FIG. 4, in the interposer 11, the place where the first interposer 11 a and the second interposer 1 b are fixed by the insulating adhesive 15 is the junction of the first interposer 11 a and the second interposer 1 b. There were four locations near the corner of the surface. Note that stable bonding is possible at three or more locations. Moreover, the application | coating location of the insulating adhesive 15 is not limited to corner vicinity, It can set suitably.

  Further, as shown in FIG. 5, in the interposer 11, the first interposer 11a and the second interposer 1b are fixed to each other by the insulating adhesive 25 at the positions of the first intermediate electrode 11ab and the second intermediate electrode 11ba. Four locations were arranged. Thus, by applying the insulating adhesive 25 to the place where the electrode of the first interposer 11a and the electrode of the second interposer 1b are disposed using the dispenser (not shown), the first The interposer 11a and the second interposer 1b can be fixed. In addition, a joint surface can be stabilized by apply | coating to at least 3 places. An epoxy resin for adhesion was applied to such a dummy electrode. Thereby, an unused or dummy electrode can be appropriately selected as a bonding portion of the insulating adhesive 25, which is preferable because of its flexibility.

<Third Embodiment>
6 and 7 are schematic views showing an interposer for explaining a third embodiment of the present invention. The third embodiment differs from the first embodiment in that, in the third embodiment, in the second outer electrode 11bb of the second interposer, the spiral contact 23 is formed by laminating metal plating. It is a point placed on the formed raising base 11bd.
As shown in FIGS. 6 and 7, the second interposer is flat without the step 1af shown in FIG. However, the second outer electrode 11bb is provided with a multi-layer metal plating, and the spiral contact 23 is characteristically raised from the surroundings to generate a step.
Then, the spiral contact 23 provided on the second outer electrode 11bb is in contact with the electrode 2aa of a part of the wafers 2a or 2b for each chip 2a or all of the electrodes 2aa of the wafer 2. The probe card 3 can perform chip-by-chip measurement, wafer batch measurement, partial batch measurement, or the like.
In this way, by placing the spiral contact 23 on the considerably raised raising base 11bd formed by laminating metal plating, there is a stepped portion around the second outer electrode 11bb. Without forming 1bf (see FIG. 2), the interposer 21 can be prevented from contacting the solder ball electrode (connection terminal) 2aa of the electronic device to be inspected other than the measurement location.

Here, the spiral contacts 22 and 23 will be described again. These spiral contacts 22 and 23 are commonly applied to all the embodiments.
8 and 9 are schematic diagrams for explaining the shapes of the spiral contacts 22 and 23. FIG.
8A is a plan view, FIG. 8B is a sectional view taken along the line AA in FIG. 8A, FIG. 9A is a plan view, and FIG. 8B is a front view.
As shown in FIG. 8, the spiral contact 22 is provided with a spiral base at a position spaced apart by 180 degrees, and has a spiral portion 22c that is parallel to each other with the center of the tip 22a being the same. A protrusion 22d directed upward is provided at the tip. The feature of the spiral contact 22 is that the protrusion 22d moves vertically up and down while rotating slightly at the center of the convex shape. For this reason, by using the spiral contact 22 as an electrode, it can be moved vertically up and down, and can be a highly accurate contact having both a spring property and an oxide film tearing function, and is suitable as a relay contact of an interposer. It is. Of course, it is suitable not only as a relay function but also as a probe.

  As shown in FIG. 9, the spiral contactor 23 is formed of a convex spiral body (spiral), and is formed so that the width becomes narrower from the root 23b to the tip 23a. Thus, the narrower the width is, the closer to the tip 23a, the concentration of bending stress is prevented and the bending stress is dispersed. The spiral contact 23 is formed by metal plating, and the corners at both ends, which is a feature of metal plating, are acute.

  The preferred embodiments have been described above. However, the present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the gist of the present invention. For example, in the first to third embodiments, the functions of the embodiments can be applied to each other in common. In these three embodiments, metal fusion also functions in common. That is, fusion between different metals can be applied between the spiral contactor and the connection terminal by heating and pressurizing for a predetermined time when the joining surface is fixed by the insulating adhesive. Furthermore, the spiral contact 22 is applied between the interposers and the spiral contact 23 is applied to the electronic device to be inspected. However, the present invention is not limited to this, and either type can be used as appropriate. I do not care. Moreover, although the fixing tool 6 demonstrated the example fixed with the screw, it is not restricted to this, What is necessary is just a removable fixing tool.

BRIEF DESCRIPTION OF THE DRAWINGS The outline of the interposer which has a disk shape for demonstrating the 1st Embodiment of this invention is shown, (a) is vertical in the thickness direction the disk shape which shows the 1st interposer and 2nd interposer which comprise an interposer. (B) is a schematic view in which the first interposer and the second interposer shown in (a) are joined and attached to a test board. FIG. 2 is a cross-sectional view schematically illustrating an enlarged cross-section of the interposer illustrated in FIG. 1 and explaining features. It is a schematic block diagram which shows the probe card formed by fixing the interposer shown in FIG. 2 to a test board with a fixing tool. It is the schematic which shows the interposer for demonstrating the 2nd Embodiment of this invention. It is the schematic which shows the interposer for demonstrating the 2nd Embodiment of this invention. It is the schematic which shows the interposer for demonstrating the 3rd Embodiment of this invention. It is the schematic which shows the interposer for demonstrating the 3rd Embodiment of this invention. It is the schematic explaining the shape of a spiral contactor. It is the schematic explaining the shape of a spiral contactor. It is a block diagram of the interposer which concerns on a prior art example.

Explanation of symbols

1, 11, 21 Interposer 1a First interposer 1b Second interposer 1aa First outer electrode 1ab First intermediate electrode 1ba Second intermediate electrode 1bb Second outer electrode 1ac, 1bc Via 1ad Raising platform 1af Step 2 Wafer (electronic device)
2a Chip 3 Probe card 4 Test board 5 Insulating adhesive (epoxy resin)
6 Fixing tool

Claims (12)

A probe card having an interposer that relays electrical connection between an electronic device to be inspected and a test board,
The interposer is
A first interposer disposed on a side facing the test board and having a base material formed of a rigid material;
A second interposer disposed on the side facing the electronic device and having a base material formed of an organic material;
A first intermediate electrode disposed on the side of the first interposer opposite to the second interposer, opposite the electrode arrangement of the second interposer;
A second intermediate electrode disposed on the side of the second interposer opposite to the first interposer, opposite to the arrangement of the first intermediate electrode;
A spiral contact provided on one of the first intermediate electrode and the second intermediate electrode, and
A probe card comprising an interposer, wherein the first and second interposers are electrically connected via the intermediate electrode and further fixed by an insulating adhesive. The first interposer includes the first intermediate electrode disposed at one end, and a first outer electrode disposed at the other end electrically extended from the first intermediate electrode,
The probe card having an interposer according to claim 1, wherein a spiral contact is provided on the first outer electrode.   2. The probe having an interposer according to claim 1, wherein the first outer electrode is electrically extended from the first intermediate electrode and is disposed at the other end with an inter-electrode pitch enlarged. card. The second interposer includes the second intermediate electrode disposed at one end and a second outer electrode electrically extended from the second intermediate electrode and disposed at the other end with a reduced pitch between the electrodes. An electrode,
The probe card having an interposer according to claim 1, wherein a spiral contact is provided on the second outer electrode.   The probe card having an interposer according to claim 1, wherein the rigid material is a ceramic material.   The probe card with an interposer according to claim 1, wherein the organic material is polyimide.   The spiral contact provided on one of the first intermediate electrode and the second intermediate electrode, and the connection provided on either the first intermediate electrode or the second intermediate electrode The probe card having an interposer according to claim 1, wherein the terminal is connected by metal fusion.   The probe card having an interposer according to claim 7, wherein the connection terminal has a solder ball shape or a land shape.   2. The probe card having an interposer according to claim 1, wherein the first interposer and the test board are electrically connected through the respective electrodes, and are further fixed integrally by a fixture. 3. .   2. The probe card having an interposer according to claim 1, wherein the first and second interposers are fixed to each other by an insulating adhesive at at least three of the electrode arrangement positions.   5. The probe card having an interposer according to claim 4, wherein a step is formed around the second outer electrode so as to be cut to the periphery of the second interposer.   5. The probe card with an interposer according to claim 4, wherein in the second outer electrode, the spiral contact is placed on a raising base formed by laminating metal plating.