JP2008506112A - 膜懸垂プローブを具えるプローブヘッド - Google Patents
膜懸垂プローブを具えるプローブヘッド Download PDFInfo
- Publication number
- JP2008506112A JP2008506112A JP2007520437A JP2007520437A JP2008506112A JP 2008506112 A JP2008506112 A JP 2008506112A JP 2007520437 A JP2007520437 A JP 2007520437A JP 2007520437 A JP2007520437 A JP 2007520437A JP 2008506112 A JP2008506112 A JP 2008506112A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- space transformer
- probe head
- contact
- membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
Description
Claims (19)
- (a)第一表面及びその反対側に第二表面を有し、該第一及び該第二表面のいずれか一方が歪んだ場合に、復元力を作用させることができる弾性膜と、
(b)第一端部及び第二端部を有するビーム、該ビームの該第一端部近傍にある検査対象のデバイスと接触するプローブ先端部、並びに、該ビームの該第二端部の近傍にあり、該弾性膜の該第一表面から露出しているビーム接触部を具える導電プローブとを具え、該ビームは該弾性膜の該第二表面を変形させるために移動することができることを特徴とするプローブヘッド。 - 請求項1に記載のプローブヘッドであって、前記ビームと前記弾性部材との間に配置されている絶縁部材を更に具え、該弾性部材の前記第二表面を変形させるために該ビームにより該絶縁部材を移動させることができるプローブヘッド。
- 請求項1に記載のプローブヘッドであって、前記ビーム接触部が、前記弾性膜の前記第一表面に対し少なくとも同一平面上にある前記ビームから突出しているプローブヘッド。
- (a)第一表面及びその反対側に第二表面を有し、該第一及び該第二表面のいずれか一方が歪んだ場合に、復元力を作用させることができる弾性膜と、
(b)第一端部、第二端部及び深さを有するビーム、該ビームの該第一端部近傍にあり、該ビームから第一方向に突出しているプローブ先端部、並びに、該ビームの該第二端部近傍にあり、該弾性部材の該第一表面と接触するように露出しているビーム接触部を具える導電プローブ、及び、
(c)該ビームと係合する第一表面及び該弾性部材の該第二表面と係合する第二表面を有する第一絶縁部材とを具え、該弾性部材の前記第二表面を変形させるために該ビームにより該第一絶縁部材を移動させることができることを特徴とするプローブヘッド。 - 請求項4に記載のプローブヘッドであって、前記ビーム接触部が、前記弾性部材の前記第一表面に対し少なくとも同一平面上にある前記ビームから前記第一方向とは反対の方向に突出しているプローブヘッド。
- 請求項4に記載のプローブヘッドであって、前記第一絶縁部材の前記第一表面近傍にある第一表面を有し、かつ、前記ビームの前記深さと近似した厚さを有する第二絶縁部材を更に具えるプローブヘッド。
- (a)露出した導電スペーストランスフォーマ接触部を含むスペーストランスフォーマ、及び、
(b)その第一表面が該スペーストランスフォーマの該表面及び反対側の第二表面により拘束され、該第二表面が歪められた場合に、復元力を作用させることができる弾性膜と、
(c)第一端部及び第二端部を有するビーム、該ビームの該第一端部近傍にあり、検査対象の装置と接触するプローブ先端部、並びに、該ビームの該第二端部近傍にあり、該スペーストランスフォーマ接触部と接触するように配置されているビーム接触部を具える導電プローブとを具え、該ビームは該弾性膜の該第二表面を変形させるために移動することができることを特徴とするプローブアセンブリ。 - 請求項7に記載のプローブアセンブリであって、前記ビームと前記弾性部材との間に配置されている第一絶縁部材を更に具え、該弾性部材の前記第二表面を変形させるために該ビームにより該第一絶縁部材を移動させることができるプローブアセンブリ。
- 請求項7に記載のプローブヘッドであって、前記ビーム接触部が、前記弾性膜の前記第一表面に対し少なくとも同一平面上にある前記ビームから突出しているプローブヘッド。
- (a)表面を有するスペーストランスフォーマであって、該表面から露出している導電スペーストランスフォーマ接触部を含むスペーストランスフォーマと、
(b)その第一表面が該スペーストランスフォーマ及び反対側の第二表面により拘束され、該第二表面が歪められた場合に、復元力を作用させることができる弾性膜と、
(c)第一端部、第二端部及び深さを有するビーム、該ビームの該第一端部近傍にあり、該ビームから突出するプローブ先端部、及び、該ビームの該第二端部近傍にあり、該スペーストランスフォーマ接触部と接触するように配置されているビーム接触部を具える導電プローブと、
(d)該ビームと係合する第一表面及び該弾性部材の該第二表面と係合する第二表面を有する第一絶縁部材とを具え、該弾性部材の前記第二表面を変形させるために該ビームにより該絶縁部材を移動させることができることを特徴とするプローブアセンブリ。 - 請求項10に記載のプローブヘッドであって、前記ビーム接触部が、前記弾性部材の前記第一表面に対し少なくとも同一平面上にある前記ビームから前記第一方向とは反対の方向に突出しているプローブヘッド。
- 請求項10に記載のプローブヘッドであって、前記第一絶縁部材の前記第一表面近傍にある第一表面を有し、かつ、前記ビームの前記深さと近似した厚さを有する第二絶縁部材を更に具えるプローブヘッド。
- 針カードプローブヘッド及び前記針カードプローブヘッドと向かい合うように配置されているスペーストランスフォーマ接触部を有するスペーストランスフォーマを含む、針カードプローブアセンブリのインダクタンスを減少させる方法であって、該方法は、
(a)前記スペーストランスフォーマから前記針カードプローブヘッドを取り外すステップと、
(b)前記スペーストランスフォーマを膜プローブヘッドに係合させるステップとを含み、該膜プローブヘッドは、
(i)その第一表面が該スペーストランスフォーマの該表面及び反対側の第二表面により拘束され、該第二表面が歪められた場合に、復元力を作用させることができる弾性膜と、
(ii)第一端部、第二端部及び深さを有するビーム、該ビームの該第一端部近傍にあり、該ビームから突出するプローブ先端部、並びに、該ビームの該第二端部近傍にあり、該スペーストランスフォーマ接触部と接触するように配置されているビーム接触部を具える導電プローと、
(iii)該ビームと係合する第一表面及び該弾性部材の該第二表面と係合する第二表面を有する第一絶縁部材とを具え、該弾性部材の前記第二表面を変形させるために該ビームにより該絶縁部材を移動させることができるものであることを特徴とする方法。 - 請求項13に記載の方法であって、前記ビーム接触部が、前記弾性部材の前記第一表面に対し少なくとも同一平面上にある前記ビームから前記第一方向とは反対の方向に突出することを含む方法。
- 請求項13に記載の方法であって、前記膜プローブヘッドが前記第一絶縁部材の前記第一表面近傍の第一表面と、前記ビームの前記深さと同様な厚さを有する第二絶縁部材を更に具えるものであることを含む方法。
- 請求項13に記載の方法であって、前記導電プローブはインダクタンスが1ナノヘンリ以下である単一の経路を有するものであることを含む方法。
- 請求項13に記載の方法であって、前記導電プローブはインダクタンスが0.5ナノヘンリ以下である単一の経路を有するものであることを含む方法。
- 請求項13に記載の方法であって、前記導電プローブはインダクタンスが0.25ナノヘンリ以下である単一の経路を有するものであることを含む方法。
- 請求項13に記載の方法であって、前記スペーストランスフォーマを前記膜プローブヘッドと係合させる前記ステップ(b)は、前記弾性膜及び前記導電プローブを具えるタイルを該スペーストランスフォーマの表面に貼り付けるステップを含む方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US58629904P | 2004-07-07 | 2004-07-07 | |
US60/586,299 | 2004-07-07 | ||
PCT/US2005/023806 WO2006017078A2 (en) | 2004-07-07 | 2005-07-05 | Probe head having a membrane suspended probe |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011241849A Division JP5374568B2 (ja) | 2004-07-07 | 2011-11-04 | 膜懸垂プローブを具えるプローブヘッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008506112A true JP2008506112A (ja) | 2008-02-28 |
JP4980903B2 JP4980903B2 (ja) | 2012-07-18 |
Family
ID=35839715
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007520437A Expired - Fee Related JP4980903B2 (ja) | 2004-07-07 | 2005-07-05 | 膜懸垂プローブを具えるプローブヘッド |
JP2011241849A Expired - Fee Related JP5374568B2 (ja) | 2004-07-07 | 2011-11-04 | 膜懸垂プローブを具えるプローブヘッド |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011241849A Expired - Fee Related JP5374568B2 (ja) | 2004-07-07 | 2011-11-04 | 膜懸垂プローブを具えるプローブヘッド |
Country Status (9)
Country | Link |
---|---|
US (2) | US7368927B2 (ja) |
EP (1) | EP1766426B1 (ja) |
JP (2) | JP4980903B2 (ja) |
KR (1) | KR101157449B1 (ja) |
CA (1) | CA2570886A1 (ja) |
DE (1) | DE202005021386U1 (ja) |
IL (1) | IL180188A0 (ja) |
TW (1) | TWI372249B (ja) |
WO (1) | WO2006017078A2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190112155A (ko) * | 2017-02-15 | 2019-10-02 | 테크노프로브 에스.피.에이. | 고주파수 어플리케이션을 위한 프로브 카드 |
JP2019211460A (ja) * | 2018-06-06 | 2019-12-12 | 中華精測科技股▲ふん▼有限公司Chunghwa Precisiontest Tech.Co.,Ltd | プローブカード装置及びその平板型信号授受構造 |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
US6578264B1 (en) * | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
AU2002327490A1 (en) * | 2001-08-21 | 2003-06-30 | Cascade Microtech, Inc. | Membrane probing system |
EP1766426B1 (en) * | 2004-07-07 | 2013-09-11 | Cascade Microtech, Inc. | Probe head having a membrane suspended probe |
JP5005195B2 (ja) * | 2005-07-13 | 2012-08-22 | 東京エレクトロン株式会社 | プローブカード製造方法 |
US7898272B2 (en) * | 2006-06-08 | 2011-03-01 | Nhk Spring Co., Ltd. | Probe card |
TWI321820B (en) * | 2006-08-25 | 2010-03-11 | Star Techn Inc | Integrated circuits probing apparatus having a temperature-adjusting mechanism |
US7579826B2 (en) * | 2006-12-29 | 2009-08-25 | Soo Ho Lee | Test socket for semiconductor |
JP4157589B1 (ja) * | 2007-01-30 | 2008-10-01 | 京セラ株式会社 | プローブカード・アセンブリ用基板、プローブカード・アセンブリおよび半導体ウエハの検査方法 |
US8456184B2 (en) * | 2007-03-14 | 2013-06-04 | Nhk Spring Co., Ltd. | Probe card for a semiconductor wafer |
JP5714817B2 (ja) * | 2007-07-19 | 2015-05-07 | 日本発條株式会社 | プローブカード |
US20090027071A1 (en) * | 2007-07-23 | 2009-01-29 | Finsar Corporation | Probe tap |
US7688089B2 (en) * | 2008-01-25 | 2010-03-30 | International Business Machines Corporation | Compliant membrane thin film interposer probe for intergrated circuit device testing |
DE102008011240B4 (de) * | 2008-02-26 | 2016-11-17 | Airbus Ds Electronics And Border Security Gmbh | Vorrichtung zur Kontaktierung eines T/R-Moduls mit einer Testeinrichtung |
US7750651B2 (en) * | 2008-03-07 | 2010-07-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer level test probe card |
JP5276895B2 (ja) * | 2008-05-19 | 2013-08-28 | 新光電気工業株式会社 | プローブカード及びその製造方法 |
US7888957B2 (en) | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
US8410806B2 (en) * | 2008-11-21 | 2013-04-02 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
US7987591B2 (en) * | 2009-08-13 | 2011-08-02 | International Business Machines Corporation | Method of forming silicon chicklet pedestal |
TWI409463B (zh) * | 2009-10-23 | 2013-09-21 | King Yuan Electronics Co Ltd | 探針卡與其中之結構強化的測試插座 |
US20110147568A1 (en) * | 2009-12-18 | 2011-06-23 | Irvine Sensors Corporation | High density array module and connector |
US8487304B2 (en) | 2010-04-30 | 2013-07-16 | International Business Machines Corporation | High performance compliant wafer test probe |
US8970240B2 (en) * | 2010-11-04 | 2015-03-03 | Cascade Microtech, Inc. | Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same |
US9244099B2 (en) * | 2011-05-09 | 2016-01-26 | Cascade Microtech, Inc. | Probe head assemblies, components thereof, test systems including the same, and methods of operating the same |
JP5414739B2 (ja) * | 2011-05-25 | 2014-02-12 | 三菱電機株式会社 | 半導体テスト治具 |
US8525168B2 (en) * | 2011-07-11 | 2013-09-03 | International Business Machines Corporation | Integrated circuit (IC) test probe |
US20130069680A1 (en) * | 2011-09-16 | 2013-03-21 | Cascade Microtech, Inc. | Risers including a plurality of high aspect ratio electrical conduits and systems and methods of manufacture and use therof |
JP5687172B2 (ja) * | 2011-11-01 | 2015-03-18 | 三菱電機株式会社 | 半導体テスト治具およびそれを用いた耐圧測定方法 |
US8901948B2 (en) * | 2011-12-05 | 2014-12-02 | Winway Technology Co., Ltd. | Wafer probe card |
KR20140000561A (ko) * | 2012-06-25 | 2014-01-03 | 주식회사 세디콘 | 프로브 카드 |
WO2014099072A1 (en) * | 2012-09-26 | 2014-06-26 | The Trustees Of Columbia University In The City Of New York | Micro-device transfer for hybrid photonic and electronic integration using polydimethylsiloxane probes |
US9470715B2 (en) * | 2013-01-11 | 2016-10-18 | Mpi Corporation | Probe head |
TWM463903U (zh) | 2013-05-15 | 2013-10-21 | Star Techn Inc | 測試組件 |
US9435855B2 (en) | 2013-11-19 | 2016-09-06 | Teradyne, Inc. | Interconnect for transmitting signals between a device and a tester |
US9759745B2 (en) * | 2014-04-29 | 2017-09-12 | Taiwan Semiconductor Manufacturing Company Ltd. | Probe card |
US9594114B2 (en) | 2014-06-26 | 2017-03-14 | Teradyne, Inc. | Structure for transmitting signals in an application space between a device under test and test electronics |
US9733304B2 (en) * | 2014-09-24 | 2017-08-15 | Micron Technology, Inc. | Semiconductor device test apparatuses |
US10060963B2 (en) * | 2016-04-01 | 2018-08-28 | Formfactor Beaverton, Inc. | Probe systems, storage media, and methods for wafer-level testing over extended temperature ranges |
US10120020B2 (en) * | 2016-06-16 | 2018-11-06 | Formfactor Beaverton, Inc. | Probe head assemblies and probe systems for testing integrated circuit devices |
US9977052B2 (en) | 2016-10-04 | 2018-05-22 | Teradyne, Inc. | Test fixture |
US10677815B2 (en) | 2018-06-08 | 2020-06-09 | Teradyne, Inc. | Test system having distributed resources |
TWI704355B (zh) * | 2019-07-22 | 2020-09-11 | 旺矽科技股份有限公司 | 適用於具有傾斜導電接點之多待測單元的探針模組 |
JP7386327B2 (ja) * | 2019-08-28 | 2023-11-24 | 株式会社アドバンテスト | 回路および回路に連結されるアンテナを備える被試験デバイスを試験するための試験装置、自動試験装置および方法 |
US11363746B2 (en) | 2019-09-06 | 2022-06-14 | Teradyne, Inc. | EMI shielding for a signal trace |
TWI704358B (zh) * | 2019-09-16 | 2020-09-11 | 旺矽科技股份有限公司 | 適用於具有傾斜導電接點之多待測單元的探針模組 |
KR102271347B1 (ko) * | 2019-10-28 | 2021-06-30 | 주식회사 나노엑스 | 전기 소자 검사 장치용 프로브 헤드 |
US11862901B2 (en) | 2020-12-15 | 2024-01-02 | Teradyne, Inc. | Interposer |
KR102471772B1 (ko) * | 2020-12-23 | 2022-11-29 | 주식회사 에스디에이 | 프로브 카드 |
US11929197B2 (en) * | 2021-11-08 | 2024-03-12 | Honeywell Federal Manufacturing & Technologies, Llc | Geometrically stable nanohenry inductor |
TWI835474B (zh) * | 2022-12-20 | 2024-03-11 | 旭東機械工業股份有限公司 | 檢測探針卡上的螺絲的方法及其檢測設備 |
TWI836817B (zh) * | 2022-12-27 | 2024-03-21 | 旭東機械工業股份有限公司 | 檢測探針卡的探針長度、探針相對共面度、導板平整度的方法及其檢測設備 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6453429A (en) * | 1987-08-24 | 1989-03-01 | Mitsubishi Electric Corp | Device for testing semiconductor chip |
JP2000150594A (ja) * | 1998-11-05 | 2000-05-30 | Hitachi Ltd | 接続装置および押さえ部材付配線フィルムの製造方法並びに検査システムおよび半導体素子の製造方法 |
JP2001524258A (ja) * | 1995-05-26 | 2001-11-27 | フォームファクター,インコーポレイテッド | より大きな基板にばね接触子を定置させるための接触子担体(タイル) |
JP2001525118A (ja) * | 1996-08-08 | 2001-12-04 | カスケード マイクロテック インコーポレイテッド | 接点を局限擦過させる膜プローブシステム |
JP2002340933A (ja) * | 2001-05-17 | 2002-11-27 | Seiko Epson Corp | 半導体装置の検査治具およびその製造方法 |
JP2004171905A (ja) * | 2002-11-20 | 2004-06-17 | Dainippon Printing Co Ltd | 電子デバイス検査用コンタクトシートおよびその製造方法 |
Family Cites Families (238)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1337866A (en) | 1917-09-27 | 1920-04-20 | Griffiths Ethel Grace | System for protecting electric cables |
US2142625A (en) | 1932-07-06 | 1939-01-03 | Hollandsche Draad En Kabelfab | High tension cable |
US2376101A (en) | 1942-04-01 | 1945-05-15 | Ferris Instr Corp | Electrical energy transmission |
US2389668A (en) | 1943-03-04 | 1945-11-27 | Barnes Drill Co | Indexing mechanism for machine tables |
US3193712A (en) | 1962-03-21 | 1965-07-06 | Clarence A Harris | High voltage cable |
US3230299A (en) | 1962-07-18 | 1966-01-18 | Gen Cable Corp | Electrical cable with chemically bonded rubber layers |
US3176091A (en) | 1962-11-07 | 1965-03-30 | Helmer C Hanson | Controlled multiple switching unit |
US3401126A (en) | 1965-06-18 | 1968-09-10 | Ibm | Method of rendering noble metal conductive composition non-wettable by solder |
US3429040A (en) * | 1965-06-18 | 1969-02-25 | Ibm | Method of joining a component to a substrate |
US3445770A (en) | 1965-12-27 | 1969-05-20 | Philco Ford Corp | Microelectronic test probe with defect marker access |
US3442831A (en) | 1966-04-21 | 1969-05-06 | Borden Co | Vinyl chloride polymerization process and latex |
US3484679A (en) | 1966-10-03 | 1969-12-16 | North American Rockwell | Electrical apparatus for changing the effective capacitance of a cable |
US3441315A (en) | 1967-07-07 | 1969-04-29 | Artnell Co | Seat and method for manufacturing the same |
US3609539A (en) | 1968-09-28 | 1971-09-28 | Ibm | Self-aligning kelvin probe |
US3595228A (en) | 1968-11-27 | 1971-07-27 | Robert C Simon | Flow line break alarm device |
US3541222A (en) | 1969-01-13 | 1970-11-17 | Bunker Ramo | Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making |
NL7003475A (ja) * | 1969-03-28 | 1970-09-30 | ||
US3596228A (en) | 1969-05-29 | 1971-07-27 | Ibm | Fluid actuated contactor |
US3654585A (en) | 1970-03-11 | 1972-04-04 | Brooks Research And Mfg Inc | Coordinate conversion for the testing of printed circuit boards |
US3740900A (en) | 1970-07-01 | 1973-06-26 | Signetics Corp | Vacuum chuck assembly for semiconductor manufacture |
US3700998A (en) | 1970-08-20 | 1972-10-24 | Computer Test Corp | Sample and hold circuit with switching isolation |
US3714572A (en) | 1970-08-21 | 1973-01-30 | Rca Corp | Alignment and test fixture apparatus |
US3680037A (en) | 1970-11-05 | 1972-07-25 | Tech Wire Prod Inc | Electrical interconnector |
US3710251A (en) | 1971-04-07 | 1973-01-09 | Collins Radio Co | Microelectric heat exchanger pedestal |
GB1387587A (en) * | 1971-07-22 | 1975-03-19 | Plessey Co Ltd | Electrical interconnectors and connector assemblies |
US3829076A (en) | 1972-06-08 | 1974-08-13 | H Sofy | Dial index machine |
US3858212A (en) | 1972-08-29 | 1974-12-31 | L Tompkins | Multi-purpose information gathering and distribution system |
US3952156A (en) | 1972-09-07 | 1976-04-20 | Xerox Corporation | Signal processing system |
CA970849A (en) | 1972-09-18 | 1975-07-08 | Malcolm P. Macmartin | Low leakage isolating transformer for electromedical apparatus |
US3806801A (en) | 1972-12-26 | 1974-04-23 | Ibm | Probe contactor having buckling beam probes |
US3839672A (en) | 1973-02-05 | 1974-10-01 | Belden Corp | Method and apparatus for measuring the effectiveness of the shield in a coaxial cable |
US3849728A (en) | 1973-08-21 | 1974-11-19 | Wentworth Labor Inc | Fixed point probe card and an assembly and repair fixture therefor |
US3936743A (en) * | 1974-03-05 | 1976-02-03 | Electroglas, Inc. | High speed precision chuck assembly |
US3971610A (en) | 1974-05-10 | 1976-07-27 | Technical Wire Products, Inc. | Conductive elastomeric contacts and connectors |
US3976959A (en) | 1974-07-22 | 1976-08-24 | Gaspari Russell A | Planar balun |
US3970934A (en) | 1974-08-12 | 1976-07-20 | Akin Aksu | Printed circuit board testing means |
US4038599A (en) | 1974-12-30 | 1977-07-26 | International Business Machines Corporation | High density wafer contacting and test system |
US4038894A (en) | 1975-07-18 | 1977-08-02 | Springfield Tool And Die, Inc. | Piercing apparatus |
SE407115B (sv) | 1975-10-06 | 1979-03-12 | Kabi Ab | Forfarande och metelektroder for studium av enzymatiska och andra biokemiska reaktioner |
US3992073A (en) | 1975-11-24 | 1976-11-16 | Technical Wire Products, Inc. | Multi-conductor probe |
US4049252A (en) | 1976-02-04 | 1977-09-20 | Bell Theodore F | Index table |
US4008900A (en) * | 1976-03-15 | 1977-02-22 | John Freedom | Indexing chuck |
US4099120A (en) | 1976-04-19 | 1978-07-04 | Akin Aksu | Probe head for testing printed circuit boards |
US4027935A (en) | 1976-06-21 | 1977-06-07 | International Business Machines Corporation | Contact for an electrical contactor assembly |
US4115735A (en) | 1976-10-14 | 1978-09-19 | Faultfinders, Inc. | Test fixture employing plural platens for advancing some or all of the probes of the test fixture |
US4093988A (en) | 1976-11-08 | 1978-06-06 | General Electric Company | High speed frequency response measurement |
US4312117A (en) * | 1977-09-01 | 1982-01-26 | Raytheon Company | Integrated test and assembly device |
US4184729A (en) * | 1977-10-13 | 1980-01-22 | Bunker Ramo Corporation | Flexible connector cable |
US4135131A (en) | 1977-10-14 | 1979-01-16 | The United States Of America As Represented By The Secretary Of The Army | Microwave time delay spectroscopic methods and apparatus for remote interrogation of biological targets |
DE2849119A1 (de) | 1978-11-13 | 1980-05-14 | Siemens Ag | Verfahren und schaltungsanordnung zur daempfungsmessung, insbesondere zur ermittlung der daempfungs- und/oder gruppenlaufzeitverzerrung eines messobjektes |
US4383217A (en) | 1979-01-02 | 1983-05-10 | Shiell Thomas J | Collinear four-point probe head and mount for resistivity measurements |
US4287473A (en) | 1979-05-25 | 1981-09-01 | The United States Of America As Represented By The United States Department Of Energy | Nondestructive method for detecting defects in photodetector and solar cell devices |
FI58719C (fi) | 1979-06-01 | 1981-04-10 | Instrumentarium Oy | Diagnostiseringsanordning foer broestkancer |
US4277741A (en) | 1979-06-25 | 1981-07-07 | General Motors Corporation | Microwave acoustic spectrometer |
US4327180A (en) | 1979-09-14 | 1982-04-27 | Board Of Governors, Wayne State Univ. | Method and apparatus for electromagnetic radiation of biological material |
US4284033A (en) | 1979-10-31 | 1981-08-18 | Rca Corporation | Means to orbit and rotate target wafers supported on planet member |
US4330783A (en) | 1979-11-23 | 1982-05-18 | Toia Michael J | Coaxially fed dipole antenna |
US4284682A (en) | 1980-04-30 | 1981-08-18 | Nasa | Heat sealable, flame and abrasion resistant coated fabric |
US4357575A (en) | 1980-06-17 | 1982-11-02 | Dit-Mco International Corporation | Apparatus for use in testing printed circuit process boards having means for positioning such boards in proper juxtaposition with electrical contacting assemblies |
US4552033A (en) | 1980-07-08 | 1985-11-12 | Gebr. Marzhauser Wetzlar oHG | Drive system for a microscope stage or the like |
US4376920A (en) | 1981-04-01 | 1983-03-15 | Smith Kenneth L | Shielded radio frequency transmission cable |
US4425395A (en) | 1981-04-30 | 1984-01-10 | Fujikura Rubber Works, Ltd. | Base fabrics for polyurethane-coated fabrics, polyurethane-coated fabrics and processes for their production |
US4401945A (en) | 1981-04-30 | 1983-08-30 | The Valeron Corporation | Apparatus for detecting the position of a probe relative to a workpiece |
US4453142A (en) | 1981-11-02 | 1984-06-05 | Motorola Inc. | Microstrip to waveguide transition |
DE3202461C1 (de) | 1982-01-27 | 1983-06-09 | Fa. Carl Zeiss, 7920 Heidenheim | Befestigung von Mikroskopobjektiven |
US4528504A (en) | 1982-05-27 | 1985-07-09 | Harris Corporation | Pulsed linear integrated circuit tester |
US4468629A (en) | 1982-05-27 | 1984-08-28 | Trw Inc. | NPN Operational amplifier |
US4705447A (en) | 1983-08-11 | 1987-11-10 | Intest Corporation | Electronic test head positioner for test systems |
US4487996A (en) | 1982-12-02 | 1984-12-11 | Electric Power Research Institute, Inc. | Shielded electrical cable |
US4581679A (en) | 1983-05-31 | 1986-04-08 | Trw Inc. | Multi-element circuit construction |
JPS59226167A (ja) | 1983-06-04 | 1984-12-19 | Dainippon Screen Mfg Co Ltd | 基板表面処理装置 |
FR2547945B1 (fr) | 1983-06-21 | 1986-05-02 | Raffinage Cie Francaise | Nouvelle structure de cable electrique et ses applications |
US4588950A (en) | 1983-11-15 | 1986-05-13 | Data Probe Corporation | Test system for VLSI digital circuit and method of testing |
JPS60136006U (ja) | 1984-02-20 | 1985-09-10 | 株式会社 潤工社 | フラツトケ−ブル |
US4646005A (en) | 1984-03-16 | 1987-02-24 | Motorola, Inc. | Signal probe |
US4722846A (en) * | 1984-04-18 | 1988-02-02 | Kikkoman Corporation | Novel variant and process for producing light colored soy sauce using such variant |
US4649339A (en) * | 1984-04-25 | 1987-03-10 | Honeywell Inc. | Integrated circuit interface |
US4697143A (en) | 1984-04-30 | 1987-09-29 | Cascade Microtech, Inc. | Wafer probe |
JPS60235304A (ja) | 1984-05-08 | 1985-11-22 | 株式会社フジクラ | 直流電力ケ−ブル |
US4636722A (en) * | 1984-05-21 | 1987-01-13 | Probe-Rite, Inc. | High density probe-head with isolated and shielded transmission lines |
US4515133A (en) | 1984-05-31 | 1985-05-07 | Frank Roman | Fuel economizing device |
DK291184D0 (da) | 1984-06-13 | 1984-06-13 | Boeegh Petersen Allan | Fremgangsmaade og indretning til test af kredsloebsplader |
US4755747A (en) | 1984-06-15 | 1988-07-05 | Canon Kabushiki Kaisha | Wafer prober and a probe card to be used therewith |
DE3428087A1 (de) | 1984-07-30 | 1986-01-30 | Kraftwerk Union AG, 4330 Mülheim | Konzentrisches dreileiterkabel |
US4593243A (en) | 1984-08-29 | 1986-06-03 | Magnavox Government And Industrial Electronics Company | Coplanar and stripline probe card apparatus |
NL8403755A (nl) | 1984-12-11 | 1986-07-01 | Philips Nv | Werkwijze voor de vervaardiging van een meerlaags gedrukte bedrading met doorverbonden sporen in verschillende lagen en meerlaags gedrukte bedrading vervaardigd volgens de werkwijze. |
US4713347A (en) | 1985-01-14 | 1987-12-15 | Sensor Diagnostics, Inc. | Measurement of ligand/anti-ligand interactions using bulk conductance |
JPS61164338A (ja) * | 1985-01-17 | 1986-07-25 | Riken Denshi Kk | 多重演算型d/a変換器 |
US4651115A (en) | 1985-01-31 | 1987-03-17 | Rca Corporation | Waveguide-to-microstrip transition |
US4744041A (en) | 1985-03-04 | 1988-05-10 | International Business Machines Corporation | Method for testing DC motors |
US4691163A (en) | 1985-03-19 | 1987-09-01 | Elscint Ltd. | Dual frequency surface probes |
US4755746A (en) | 1985-04-24 | 1988-07-05 | Prometrix Corporation | Apparatus and methods for semiconductor wafer testing |
US4684883A (en) | 1985-05-13 | 1987-08-04 | American Telephone And Telegraph Company, At&T Bell Laboratories | Method of manufacturing high-quality semiconductor light-emitting devices |
FR2585513B1 (fr) | 1985-07-23 | 1987-10-09 | Thomson Csf | Dispositif de couplage entre un guide d'onde metallique, un guide d'onde dielectrique et un composant semi-conducteur, et melangeur utilisant ce dispositif de couplage |
DE3531893A1 (de) * | 1985-09-06 | 1987-03-19 | Siemens Ag | Verfahren zur bestimmung der verteilung der dielektrizitaetskonstanten in einem untersuchungskoerper sowie messanordnung zur durchfuehrung des verfahrens |
US4746857A (en) | 1985-09-13 | 1988-05-24 | Danippon Screen Mfg. Co. Ltd. | Probing apparatus for measuring electrical characteristics of semiconductor device formed on wafer |
US4749942A (en) | 1985-09-26 | 1988-06-07 | Tektronix, Inc. | Wafer probe head |
JPH0326643Y2 (ja) | 1985-09-30 | 1991-06-10 | ||
US5829128A (en) * | 1993-11-16 | 1998-11-03 | Formfactor, Inc. | Method of mounting resilient contact structures to semiconductor devices |
US5476211A (en) * | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
US5917707A (en) * | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US6043563A (en) * | 1997-05-06 | 2000-03-28 | Formfactor, Inc. | Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals |
US4727319A (en) | 1985-12-24 | 1988-02-23 | Hughes Aircraft Company | Apparatus for on-wafer testing of electrical circuits |
DE3785681T2 (de) * | 1986-01-24 | 1993-08-12 | Fuji Photo Film Co Ltd | Blattfilmkassette und vorrichtung zum beladen von blattfilmen. |
JP2609232B2 (ja) * | 1986-09-04 | 1997-05-14 | 日本ヒューレット・パッカード株式会社 | フローテイング駆動回路 |
US4673839A (en) | 1986-09-08 | 1987-06-16 | Tektronix, Inc. | Piezoelectric pressure sensing apparatus for integrated circuit testing stations |
US4904933A (en) * | 1986-09-08 | 1990-02-27 | Tektronix, Inc. | Integrated circuit probe station |
US4754239A (en) | 1986-12-19 | 1988-06-28 | The United States Of America As Represented By The Secretary Of The Air Force | Waveguide to stripline transition assembly |
US4727637A (en) | 1987-01-20 | 1988-03-01 | The Boeing Company | Computer aided connector assembly method and apparatus |
US4711563A (en) | 1987-02-11 | 1987-12-08 | Lass Bennett D | Portable collapsible darkroom |
US5082627A (en) * | 1987-05-01 | 1992-01-21 | Biotronic Systems Corporation | Three dimensional binding site array for interfering with an electrical field |
EP0298219A3 (en) * | 1987-06-08 | 1990-08-01 | Tektronix Inc. | Method and apparatus for testing unpackaged integrated circuits in a hybrid circuit environment |
US4912399A (en) * | 1987-06-09 | 1990-03-27 | Tektronix, Inc. | Multiple lead probe for integrated circuits in wafer form |
US4894612A (en) * | 1987-08-13 | 1990-01-16 | Hypres, Incorporated | Soft probe for providing high speed on-wafer connections to a circuit |
US5084671A (en) * | 1987-09-02 | 1992-01-28 | Tokyo Electron Limited | Electric probing-test machine having a cooling system |
JP2554669Y2 (ja) * | 1987-11-10 | 1997-11-17 | 博 寺町 | 回転位置決め装置 |
US4891584A (en) * | 1988-03-21 | 1990-01-02 | Semitest, Inc. | Apparatus for making surface photovoltage measurements of a semiconductor |
US5003253A (en) * | 1988-05-20 | 1991-03-26 | The Board Of Trustees Of The Leland Stanford Junior University | Millimeter-wave active probe system |
US4983910A (en) * | 1988-05-20 | 1991-01-08 | Stanford University | Millimeter-wave active probe |
US4987100A (en) * | 1988-05-26 | 1991-01-22 | International Business Machines Corporation | Flexible carrier for an electronic device |
US4991290A (en) * | 1988-07-21 | 1991-02-12 | Microelectronics And Computer Technology | Flexible electrical interconnect and method of making |
US4906920A (en) * | 1988-10-11 | 1990-03-06 | Hewlett-Packard Company | Self-leveling membrane probe |
US4893914A (en) * | 1988-10-12 | 1990-01-16 | The Micromanipulator Company, Inc. | Test station |
US4998062A (en) * | 1988-10-25 | 1991-03-05 | Tokyo Electron Limited | Probe device having micro-strip line structure |
US4904935A (en) * | 1988-11-14 | 1990-02-27 | Eaton Corporation | Electrical circuit board text fixture having movable platens |
US5089774A (en) * | 1989-12-26 | 1992-02-18 | Sharp Kabushiki Kaisha | Apparatus and a method for checking a semiconductor |
JPH03209737A (ja) * | 1990-01-11 | 1991-09-12 | Tokyo Electron Ltd | プローブ装置 |
US5187443A (en) * | 1990-07-24 | 1993-02-16 | Bereskin Alexander B | Microwave test fixtures for determining the dielectric properties of a material |
US5280156A (en) * | 1990-12-25 | 1994-01-18 | Ngk Insulators, Ltd. | Wafer heating apparatus and with ceramic substrate and dielectric layer having electrostatic chucking means |
US5097101A (en) * | 1991-02-05 | 1992-03-17 | Tektronix, Inc. | Method of forming a conductive contact bump on a flexible substrate and a flexible substrate |
US5487999A (en) * | 1991-06-04 | 1996-01-30 | Micron Technology, Inc. | Method for fabricating a penetration limited contact having a rough textured surface |
US5229782A (en) * | 1991-07-19 | 1993-07-20 | Conifer Corporation | Stacked dual dipole MMDS feed |
US5177438A (en) * | 1991-08-02 | 1993-01-05 | Motorola, Inc. | Low resistance probe for semiconductor |
US5180977A (en) * | 1991-12-02 | 1993-01-19 | Hoya Corporation Usa | Membrane probe contact bump compliancy system |
US5389885A (en) * | 1992-01-27 | 1995-02-14 | Everett Charles Technologies, Inc. | Expandable diaphragm test modules and connectors |
TW212252B (ja) * | 1992-05-01 | 1993-09-01 | Martin Marietta Corp | |
US6295729B1 (en) * | 1992-10-19 | 2001-10-02 | International Business Machines Corporation | Angled flying lead wire bonding process |
US5371654A (en) * | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
US5684669A (en) * | 1995-06-07 | 1997-11-04 | Applied Materials, Inc. | Method for dechucking a workpiece from an electrostatic chuck |
US5395253A (en) * | 1993-04-29 | 1995-03-07 | Hughes Aircraft Company | Membrane connector with stretch induced micro scrub |
JPH0714898A (ja) * | 1993-06-23 | 1995-01-17 | Mitsubishi Electric Corp | 半導体ウエハの試験解析装置および解析方法 |
JP3346838B2 (ja) * | 1993-06-29 | 2002-11-18 | 有限会社創造庵 | 回転運動機構 |
US5412866A (en) * | 1993-07-01 | 1995-05-09 | Hughes Aircraft Company | Method of making a cast elastomer/membrane test probe assembly |
JP3442822B2 (ja) * | 1993-07-28 | 2003-09-02 | アジレント・テクノロジー株式会社 | 測定用ケーブル及び測定システム |
JP2710544B2 (ja) * | 1993-09-30 | 1998-02-10 | インターナショナル・ビジネス・マシーンズ・コーポレイション | プローブ構造、プローブ構造の形成方法 |
US5884398A (en) * | 1993-11-16 | 1999-03-23 | Form Factor, Inc. | Mounting spring elements on semiconductor devices |
US6482013B2 (en) * | 1993-11-16 | 2002-11-19 | Formfactor, Inc. | Microelectronic spring contact element and electronic component having a plurality of spring contact elements |
US6525555B1 (en) * | 1993-11-16 | 2003-02-25 | Formfactor, Inc. | Wafer-level burn-in and test |
US6029344A (en) * | 1993-11-16 | 2000-02-29 | Formfactor, Inc. | Composite interconnection element for microelectronic components, and method of making same |
US5601740A (en) * | 1993-11-16 | 1997-02-11 | Formfactor, Inc. | Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires |
US5878486A (en) * | 1993-11-16 | 1999-03-09 | Formfactor, Inc. | Method of burning-in semiconductor devices |
US6023103A (en) * | 1994-11-15 | 2000-02-08 | Formfactor, Inc. | Chip-scale carrier for semiconductor devices including mounted spring contacts |
US6836962B2 (en) * | 1993-11-16 | 2005-01-04 | Formfactor, Inc. | Method and apparatus for shaping spring elements |
US6184053B1 (en) * | 1993-11-16 | 2001-02-06 | Formfactor, Inc. | Method of making microelectronic spring contact elements |
US6442831B1 (en) * | 1993-11-16 | 2002-09-03 | Formfactor, Inc. | Method for shaping spring elements |
US5798652A (en) * | 1993-11-23 | 1998-08-25 | Semicoa Semiconductors | Method of batch testing surface mount devices using a substrate edge connector |
US20020011859A1 (en) * | 1993-12-23 | 2002-01-31 | Kenneth R. Smith | Method for forming conductive bumps for the purpose of contrructing a fine pitch test device |
US5481938A (en) * | 1994-05-02 | 1996-01-09 | General Motors Corporation | Position control apparatus for steering column |
US5715819A (en) * | 1994-05-26 | 1998-02-10 | The Carolinas Heart Institute | Microwave tomographic spectroscopy system and method |
US5704355A (en) * | 1994-07-01 | 1998-01-06 | Bridges; Jack E. | Non-invasive system for breast cancer detection |
GB9417450D0 (en) * | 1994-08-25 | 1994-10-19 | Symmetricom Inc | An antenna |
US5488954A (en) * | 1994-09-09 | 1996-02-06 | Georgia Tech Research Corp. | Ultrasonic transducer and method for using same |
US5481196A (en) * | 1994-11-08 | 1996-01-02 | Nebraska Electronics, Inc. | Process and apparatus for microwave diagnostics and therapy |
US5529504A (en) * | 1995-04-18 | 1996-06-25 | Hewlett-Packard Company | Electrically anisotropic elastomeric structure with mechanical compliance and scrub |
US5720098A (en) * | 1995-05-12 | 1998-02-24 | Probe Technology | Method for making a probe preserving a uniform stress distribution under deflection |
US6042712A (en) * | 1995-05-26 | 2000-03-28 | Formfactor, Inc. | Apparatus for controlling plating over a face of a substrate |
US6685817B1 (en) * | 1995-05-26 | 2004-02-03 | Formfactor, Inc. | Method and apparatus for controlling plating over a face of a substrate |
US6002109A (en) * | 1995-07-10 | 1999-12-14 | Mattson Technology, Inc. | System and method for thermal processing of a semiconductor substrate |
US5742174A (en) | 1995-11-03 | 1998-04-21 | Probe Technology | Membrane for holding a probe tip in proper location |
JP3838381B2 (ja) * | 1995-11-22 | 2006-10-25 | 株式会社アドバンテスト | プローブカード |
DE19605598C1 (de) * | 1996-02-15 | 1996-10-31 | Singulus Technologies Gmbh | Vorrichtung zum Greifen und Halten von Substraten |
US5726211A (en) * | 1996-03-21 | 1998-03-10 | International Business Machines Corporation | Process for making a foamed elastometric polymer |
US5869974A (en) * | 1996-04-01 | 1999-02-09 | Micron Technology, Inc. | Micromachined probe card having compliant contact members for testing semiconductor wafers |
US5869326A (en) * | 1996-09-09 | 1999-02-09 | Genetronics, Inc. | Electroporation employing user-configured pulsing scheme |
WO1998011446A1 (en) * | 1996-09-13 | 1998-03-19 | International Business Machines Corporation | Integrated compliant probe for wafer level test and burn-in |
US6181149B1 (en) * | 1996-09-26 | 2001-01-30 | Delaware Capital Formation, Inc. | Grid array package test contactor |
US5883522A (en) * | 1996-11-07 | 1999-03-16 | National Semiconductor Corporation | Apparatus and method for retaining a semiconductor wafer during testing |
US6690185B1 (en) * | 1997-01-15 | 2004-02-10 | Formfactor, Inc. | Large contactor with multiple, aligned contactor units |
US6019612A (en) * | 1997-02-10 | 2000-02-01 | Kabushiki Kaisha Nihon Micronics | Electrical connecting apparatus for electrically connecting a device to be tested |
US6520778B1 (en) * | 1997-02-18 | 2003-02-18 | Formfactor, Inc. | Microelectronic contact structures, and methods of making same |
JP2934202B2 (ja) * | 1997-03-06 | 1999-08-16 | 山一電機株式会社 | 配線基板における導電バンプの形成方法 |
JPH1123615A (ja) * | 1997-05-09 | 1999-01-29 | Hitachi Ltd | 接続装置および検査システム |
AU8280398A (en) * | 1997-06-30 | 1999-01-19 | Formfactor, Inc. | Sockets for semiconductor devices with spring contact elements |
US6013586A (en) * | 1997-10-09 | 2000-01-11 | Dimension Polyant Sailcloth, Inc. | Tent material product and method of making tent material product |
US6287776B1 (en) * | 1998-02-02 | 2001-09-11 | Signature Bioscience, Inc. | Method for detecting and classifying nucleic acid hybridization |
US6181144B1 (en) * | 1998-02-25 | 2001-01-30 | Micron Technology, Inc. | Semiconductor probe card having resistance measuring circuitry and method fabrication |
US6181416B1 (en) * | 1998-04-14 | 2001-01-30 | Optometrix, Inc. | Schlieren method for imaging semiconductor device properties |
US6720501B1 (en) * | 1998-04-14 | 2004-04-13 | Formfactor, Inc. | PC board having clustered blind vias |
TW440699B (en) * | 1998-06-09 | 2001-06-16 | Advantest Corp | Test apparatus for electronic parts |
US6256882B1 (en) * | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
GB2342148B (en) * | 1998-10-01 | 2000-12-20 | Nippon Kokan Kk | Method and apparatus for preventing snow from melting and for packing snow in artificial ski facility |
US6175228B1 (en) * | 1998-10-30 | 2001-01-16 | Agilent Technologies | Electronic probe for measuring high impedance tri-state logic circuits |
US6169410B1 (en) * | 1998-11-09 | 2001-01-02 | Anritsu Company | Wafer probe with built in RF frequency conversion module |
US6672875B1 (en) * | 1998-12-02 | 2004-01-06 | Formfactor, Inc. | Spring interconnect structures |
US6206273B1 (en) * | 1999-02-17 | 2001-03-27 | International Business Machines Corporation | Structures and processes to create a desired probetip contact geometry on a wafer test probe |
AU5586000A (en) * | 1999-02-22 | 2000-09-14 | Paul Bryant | Programmable active microwave ultrafine resonance spectrometer (pamurs) method and systems |
US6448865B1 (en) * | 1999-02-25 | 2002-09-10 | Formfactor, Inc. | Integrated circuit interconnect system |
US6218910B1 (en) * | 1999-02-25 | 2001-04-17 | Formfactor, Inc. | High bandwidth passive integrated circuit tester probe card assembly |
US6539531B2 (en) * | 1999-02-25 | 2003-03-25 | Formfactor, Inc. | Method of designing, fabricating, testing and interconnecting an IC to external circuit nodes |
US6208225B1 (en) * | 1999-02-25 | 2001-03-27 | Formfactor, Inc. | Filter structures for integrated circuit interfaces |
US6538538B2 (en) * | 1999-02-25 | 2003-03-25 | Formfactor, Inc. | High frequency printed circuit board via |
US6499121B1 (en) * | 1999-03-01 | 2002-12-24 | Formfactor, Inc. | Distributed interface for parallel testing of multiple devices using a single tester channel |
US6419500B1 (en) * | 1999-03-08 | 2002-07-16 | Kulicke & Soffa Investment, Inc. | Probe assembly having floatable buckling beam probes and apparatus for abrading the same |
US6400166B2 (en) * | 1999-04-15 | 2002-06-04 | International Business Machines Corporation | Micro probe and method of fabricating same |
US6340895B1 (en) * | 1999-07-14 | 2002-01-22 | Aehr Test Systems, Inc. | Wafer-level burn-in and test cartridge |
US6713374B2 (en) * | 1999-07-30 | 2004-03-30 | Formfactor, Inc. | Interconnect assemblies and methods |
US6352454B1 (en) * | 1999-10-20 | 2002-03-05 | Xerox Corporation | Wear-resistant spring contacts |
US6339338B1 (en) * | 2000-01-18 | 2002-01-15 | Formfactor, Inc. | Apparatus for reducing power supply noise in an integrated circuit |
US6838890B2 (en) * | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
US6509751B1 (en) * | 2000-03-17 | 2003-01-21 | Formfactor, Inc. | Planarizer for a semiconductor contactor |
US6677744B1 (en) * | 2000-04-13 | 2004-01-13 | Formfactor, Inc. | System for measuring signal path resistance for an integrated circuit tester interconnect structure |
US6379130B1 (en) * | 2000-06-09 | 2002-04-30 | Tecumseh Products Company | Motor cover retention |
JP2002022775A (ja) * | 2000-07-05 | 2002-01-23 | Ando Electric Co Ltd | 電気光学プローブおよび磁気光学プローブ |
JP2002039091A (ja) * | 2000-07-21 | 2002-02-06 | Minebea Co Ltd | 送風機 |
GB0021975D0 (en) * | 2000-09-07 | 2000-10-25 | Optomed As | Filter optic probes |
JP4071629B2 (ja) * | 2000-12-22 | 2008-04-02 | 東京エレクトロン株式会社 | プローブカートリッジアッセンブリ―並びに多プローブアッセンブリー |
US7006046B2 (en) * | 2001-02-15 | 2006-02-28 | Integral Technologies, Inc. | Low cost electronic probe devices manufactured from conductive loaded resin-based materials |
US6512482B1 (en) * | 2001-03-20 | 2003-01-28 | Xilinx, Inc. | Method and apparatus using a semiconductor die integrated antenna structure |
US6856150B2 (en) * | 2001-04-10 | 2005-02-15 | Formfactor, Inc. | Probe card with coplanar daughter card |
US6525552B2 (en) * | 2001-05-11 | 2003-02-25 | Kulicke And Soffa Investments, Inc. | Modular probe apparatus |
US6729019B2 (en) * | 2001-07-11 | 2004-05-04 | Formfactor, Inc. | Method of manufacturing a probe card |
CA2353024C (en) * | 2001-07-12 | 2005-12-06 | Ibm Canada Limited-Ibm Canada Limitee | Anti-vibration and anti-tilt microscope stand |
US6862727B2 (en) * | 2001-08-24 | 2005-03-01 | Formfactor, Inc. | Process and apparatus for adjusting traces |
US6678876B2 (en) * | 2001-08-24 | 2004-01-13 | Formfactor, Inc. | Process and apparatus for finding paths through a routing space |
US6714828B2 (en) * | 2001-09-17 | 2004-03-30 | Formfactor, Inc. | Method and system for designing a probe card |
US6906540B2 (en) * | 2001-09-20 | 2005-06-14 | Wentworth Laboratories, Inc. | Method for chemically etching photo-defined micro electrical contacts |
US7071714B2 (en) * | 2001-11-02 | 2006-07-04 | Formfactor, Inc. | Method and system for compensating for thermally induced motion of probe cards |
US6655961B2 (en) * | 2001-12-03 | 2003-12-02 | Richard Day Cottrell | Modified dental implant fixture |
US6806697B2 (en) * | 2002-04-05 | 2004-10-19 | Agilent Technologies, Inc. | Apparatus and method for canceling DC errors and noise generated by ground shield current in a probe |
US7343185B2 (en) * | 2002-06-21 | 2008-03-11 | Nir Diagnostics Inc. | Measurement of body compounds |
US6987483B2 (en) * | 2003-02-21 | 2006-01-17 | Kyocera Wireless Corp. | Effectively balanced dipole microstrip antenna |
US6838885B2 (en) * | 2003-03-05 | 2005-01-04 | Murata Manufacturing Co., Ltd. | Method of correcting measurement error and electronic component characteristic measurement apparatus |
US7002133B2 (en) * | 2003-04-11 | 2006-02-21 | Hewlett-Packard Development Company, L.P. | Detecting one or more photons from their interactions with probe photons in a matter system |
KR100523139B1 (ko) * | 2003-06-23 | 2005-10-20 | 주식회사 하이닉스반도체 | 웨이퍼 테스트시 사용되는 프로빙 패드의 수를 감소시키기위한 반도체 장치 및 그의 테스팅 방법 |
US7286013B2 (en) * | 2003-09-18 | 2007-10-23 | Avago Technologies Wireless Ip (Singapore) Pte Ltd | Coupled-inductance differential amplifier |
EP1766426B1 (en) * | 2004-07-07 | 2013-09-11 | Cascade Microtech, Inc. | Probe head having a membrane suspended probe |
US7001785B1 (en) * | 2004-12-06 | 2006-02-21 | Veeco Instruments, Inc. | Capacitance probe for thin dielectric film characterization |
US7005879B1 (en) * | 2005-03-01 | 2006-02-28 | International Business Machines Corporation | Device for probe card power bus noise reduction |
-
2005
- 2005-07-05 EP EP05764375.1A patent/EP1766426B1/en not_active Not-in-force
- 2005-07-05 DE DE202005021386U patent/DE202005021386U1/de not_active Expired - Lifetime
- 2005-07-05 JP JP2007520437A patent/JP4980903B2/ja not_active Expired - Fee Related
- 2005-07-05 WO PCT/US2005/023806 patent/WO2006017078A2/en active Application Filing
- 2005-07-05 CA CA002570886A patent/CA2570886A1/en not_active Abandoned
- 2005-07-05 KR KR1020077001093A patent/KR101157449B1/ko active IP Right Grant
- 2005-07-05 US US11/175,600 patent/US7368927B2/en active Active
- 2005-07-07 TW TW094122944A patent/TWI372249B/zh not_active IP Right Cessation
-
2006
- 2006-12-19 IL IL180188A patent/IL180188A0/en unknown
-
2008
- 2008-03-10 US US12/075,341 patent/US7514944B2/en not_active Expired - Fee Related
-
2011
- 2011-11-04 JP JP2011241849A patent/JP5374568B2/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6453429A (en) * | 1987-08-24 | 1989-03-01 | Mitsubishi Electric Corp | Device for testing semiconductor chip |
JP2001524258A (ja) * | 1995-05-26 | 2001-11-27 | フォームファクター,インコーポレイテッド | より大きな基板にばね接触子を定置させるための接触子担体(タイル) |
JP2001525118A (ja) * | 1996-08-08 | 2001-12-04 | カスケード マイクロテック インコーポレイテッド | 接点を局限擦過させる膜プローブシステム |
JP2000150594A (ja) * | 1998-11-05 | 2000-05-30 | Hitachi Ltd | 接続装置および押さえ部材付配線フィルムの製造方法並びに検査システムおよび半導体素子の製造方法 |
JP2002340933A (ja) * | 2001-05-17 | 2002-11-27 | Seiko Epson Corp | 半導体装置の検査治具およびその製造方法 |
JP2004171905A (ja) * | 2002-11-20 | 2004-06-17 | Dainippon Printing Co Ltd | 電子デバイス検査用コンタクトシートおよびその製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190112155A (ko) * | 2017-02-15 | 2019-10-02 | 테크노프로브 에스.피.에이. | 고주파수 어플리케이션을 위한 프로브 카드 |
KR102522524B1 (ko) * | 2017-02-15 | 2023-04-14 | 테크노프로브 에스.피.에이. | 고주파수 어플리케이션을 위한 프로브 카드 |
JP2019211460A (ja) * | 2018-06-06 | 2019-12-12 | 中華精測科技股▲ふん▼有限公司Chunghwa Precisiontest Tech.Co.,Ltd | プローブカード装置及びその平板型信号授受構造 |
Also Published As
Publication number | Publication date |
---|---|
IL180188A0 (en) | 2007-06-03 |
DE202005021386U1 (de) | 2007-11-29 |
EP1766426A4 (en) | 2011-07-06 |
WO2006017078A3 (en) | 2008-08-07 |
KR20070053696A (ko) | 2007-05-25 |
JP2012068256A (ja) | 2012-04-05 |
EP1766426B1 (en) | 2013-09-11 |
US7368927B2 (en) | 2008-05-06 |
TW200606436A (en) | 2006-02-16 |
WO2006017078A2 (en) | 2006-02-16 |
US20080157795A1 (en) | 2008-07-03 |
JP5374568B2 (ja) | 2013-12-25 |
TWI372249B (en) | 2012-09-11 |
JP4980903B2 (ja) | 2012-07-18 |
KR101157449B1 (ko) | 2012-06-22 |
US7514944B2 (en) | 2009-04-07 |
EP1766426A2 (en) | 2007-03-28 |
US20060006889A1 (en) | 2006-01-12 |
CA2570886A1 (en) | 2006-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4980903B2 (ja) | 膜懸垂プローブを具えるプローブヘッド | |
US5828226A (en) | Probe card assembly for high density integrated circuits | |
KR100920777B1 (ko) | 프로브 카드 | |
US5189363A (en) | Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester | |
JP3727540B2 (ja) | 隆起した接触要素を有するウェハのプロービングを行うためのプローブカード | |
US7423439B2 (en) | Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device | |
US20060170440A1 (en) | Vertical probe card, probes for vertical probe card and method of making the same | |
US6861858B2 (en) | Vertical probe card and method for using the same | |
US20160334465A1 (en) | Method of replacing an existing contact of a wafer probing assembly | |
US20080029763A1 (en) | Transmission Circuit, Connecting Sheet, Probe Sheet, Probe Card, Semiconductor Inspection System and Method of Manufacturing Semiconductor Device | |
JP2003207523A (ja) | コンタクタ及びその製造方法並びにコンタクト方法 | |
JPH09281144A (ja) | プローブカードとその製造方法 | |
KR20050084326A (ko) | 프로브 카드 조립체의 과이동을 제한하기 위한 방법 및장치 | |
KR100980369B1 (ko) | 프로브 카드의 프로브 니들 구조체와 그 제조 방법 | |
US8001685B2 (en) | Method for manufacturing probe card needles | |
US20220326280A1 (en) | Probe assembly for test and burn-in having a compliant contact element | |
JP2001099863A (ja) | プローブ及びそれを用いたプローブカード | |
JPH08285890A (ja) | プローブカード | |
KR100515235B1 (ko) | 마이크로 제조기술을 이용한 프로브 카드의 니들, 그제조방법 및 이 니들로 구현된 프로브 카드 | |
JP4750820B2 (ja) | プローブカード | |
KR100446551B1 (ko) | 화산형 프로브, 이의 제조방법 및 이를 구비한프로브카드 | |
JPH06230032A (ja) | プローブ基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080313 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101130 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110228 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110307 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110516 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20110705 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111104 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20111111 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120214 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120221 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120403 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120419 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150427 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4980903 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |