CN106884157B - 混合型陶瓷喷淋头 - Google Patents

混合型陶瓷喷淋头 Download PDF

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Publication number
CN106884157B
CN106884157B CN201611008058.6A CN201611008058A CN106884157B CN 106884157 B CN106884157 B CN 106884157B CN 201611008058 A CN201611008058 A CN 201611008058A CN 106884157 B CN106884157 B CN 106884157B
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China
Prior art keywords
floral disc
ceramic
gas
hole
spray head
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Chinese (zh)
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CN106884157A (zh
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穆罕默德·萨布里
拉姆吉斯汗·拉奥·林加帕里
卡尔·F·利泽
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Novellus Systems Inc
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Novellus Systems Inc
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563Gas nozzles
    • C23C16/45565Shower nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Cleaning In General (AREA)
CN201611008058.6A 2011-03-04 2012-03-02 混合型陶瓷喷淋头 Active CN106884157B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161449537P 2011-03-04 2011-03-04
US61/449,537 2011-03-04
CN201280011733.4A CN103403843B (zh) 2011-03-04 2012-03-02 混合型陶瓷喷淋头

Related Parent Applications (1)

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CN201280011733.4A Division CN103403843B (zh) 2011-03-04 2012-03-02 混合型陶瓷喷淋头

Publications (2)

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CN106884157A CN106884157A (zh) 2017-06-23
CN106884157B true CN106884157B (zh) 2019-06-21

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CN201280011733.4A Active CN103403843B (zh) 2011-03-04 2012-03-02 混合型陶瓷喷淋头
CN201611008058.6A Active CN106884157B (zh) 2011-03-04 2012-03-02 混合型陶瓷喷淋头

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CN201280011733.4A Active CN103403843B (zh) 2011-03-04 2012-03-02 混合型陶瓷喷淋头

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US (2) US9441296B2 (enExample)
JP (1) JP5933602B2 (enExample)
KR (2) KR101843609B1 (enExample)
CN (2) CN103403843B (enExample)
SG (2) SG10201602599XA (enExample)
TW (2) TWI566295B (enExample)
WO (1) WO2012122054A2 (enExample)

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* Cited by examiner, † Cited by third party
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