KR100265287B1 - 반도체소자 제조용 식각설비의 멀티챔버 시스템 - Google Patents

반도체소자 제조용 식각설비의 멀티챔버 시스템 Download PDF

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Publication number
KR100265287B1
KR100265287B1 KR1019980014228A KR19980014228A KR100265287B1 KR 100265287 B1 KR100265287 B1 KR 100265287B1 KR 1019980014228 A KR1019980014228 A KR 1019980014228A KR 19980014228 A KR19980014228 A KR 19980014228A KR 100265287 B1 KR100265287 B1 KR 100265287B1
Authority
KR
South Korea
Prior art keywords
wafer
transfer
chamber
semiconductor device
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019980014228A
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English (en)
Korean (ko)
Other versions
KR19990080759A (ko
Inventor
김기상
정규찬
곽규환
Original Assignee
윤종용
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=19536537&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100265287(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 윤종용, 삼성전자주식회사 filed Critical 윤종용
Priority to KR1019980014228A priority Critical patent/KR100265287B1/ko
Priority to JP10293387A priority patent/JPH11307614A/ja
Priority to TW087117504A priority patent/TW502284B/zh
Priority to DE19964479A priority patent/DE19964479B4/de
Priority to DE29924811U priority patent/DE29924811U1/de
Priority to DE19901426A priority patent/DE19901426B4/de
Priority to US09/237,229 priority patent/US6503365B1/en
Publication of KR19990080759A publication Critical patent/KR19990080759A/ko
Application granted granted Critical
Publication of KR100265287B1 publication Critical patent/KR100265287B1/ko
Priority to US10/298,605 priority patent/US6930050B2/en
Priority to US11/167,175 priority patent/US20050236092A1/en
Priority to US11/246,591 priority patent/US20060026857A1/en
Priority to JP2006270706A priority patent/JP2007036284A/ja
Priority to JP2009062953A priority patent/JP5134575B2/ja
Priority to US12/425,426 priority patent/US20090203211A1/en
Priority to US12/512,106 priority patent/US7776226B2/en
Priority to JP2012137348A priority patent/JP5491579B6/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1019980014228A 1998-04-21 1998-04-21 반도체소자 제조용 식각설비의 멀티챔버 시스템 Expired - Lifetime KR100265287B1 (ko)

Priority Applications (15)

Application Number Priority Date Filing Date Title
KR1019980014228A KR100265287B1 (ko) 1998-04-21 1998-04-21 반도체소자 제조용 식각설비의 멀티챔버 시스템
JP10293387A JPH11307614A (ja) 1998-04-21 1998-10-15 半導体素子製造用エッチング設備のマルチチャンバーシステム
TW087117504A TW502284B (en) 1998-04-21 1998-10-22 Multichamber system of etching facility for manufacturing semiconductor device
DE19901426A DE19901426B4 (de) 1998-04-21 1999-01-18 Mehrkammersystem einer Ätzeinrichtung zur Herstellung von Halbleiterbauelementen
DE19964479A DE19964479B4 (de) 1998-04-21 1999-01-18 Mehrkammersystem einer Ätzeinrichtung zur Herstellung von Halbleiterbauelementen
DE29924811U DE29924811U1 (de) 1998-04-21 1999-01-18 Mehrkammersystem einer Ätzeinrichtung zur Herstellung von Halbleiterbauelementen
US09/237,229 US6503365B1 (en) 1998-04-21 1999-01-26 Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturing
US10/298,605 US6930050B2 (en) 1998-04-21 2002-11-19 Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturing
US11/167,175 US20050236092A1 (en) 1998-04-21 2005-06-28 Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturing
US11/246,591 US20060026857A1 (en) 1998-04-21 2005-10-11 Multi-chambers system having compact installation set-up for an etching facility for semiconductor device manufacturing
JP2006270706A JP2007036284A (ja) 1998-04-21 2006-10-02 半導体装置素子の製造方法
JP2009062953A JP5134575B2 (ja) 1998-04-21 2009-03-16 マルチ−チャンバーシステムで半導体素子を製造する方法
US12/425,426 US20090203211A1 (en) 1998-04-21 2009-04-17 Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturing
US12/512,106 US7776226B2 (en) 1998-04-21 2009-07-30 Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturing
JP2012137348A JP5491579B6 (ja) 1998-04-21 2012-06-18 マルチ−チャンバーシステムで半導体素子を製造する方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019980014228A KR100265287B1 (ko) 1998-04-21 1998-04-21 반도체소자 제조용 식각설비의 멀티챔버 시스템

Publications (2)

Publication Number Publication Date
KR19990080759A KR19990080759A (ko) 1999-11-15
KR100265287B1 true KR100265287B1 (ko) 2000-10-02

Family

ID=19536537

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980014228A Expired - Lifetime KR100265287B1 (ko) 1998-04-21 1998-04-21 반도체소자 제조용 식각설비의 멀티챔버 시스템

Country Status (5)

Country Link
US (5) US6503365B1 (enExample)
JP (3) JPH11307614A (enExample)
KR (1) KR100265287B1 (enExample)
DE (2) DE19901426B4 (enExample)
TW (1) TW502284B (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100440762B1 (ko) * 2001-08-30 2004-07-21 주성엔지니어링(주) 적층식 다중 클러스터 장비
KR101120497B1 (ko) 2002-11-15 2012-02-29 외를리콘 솔라 아게, 트뤼프바흐 2차원 확장 기판의 진공처리용 장치 및 그기판의 제조방법
KR20220037657A (ko) * 2020-09-18 2022-03-25 세메스 주식회사 기판 처리 장치 및 이를 구비하는 기판 처리 시스템
KR102510315B1 (ko) 2022-12-27 2023-03-15 주식회사 우원기술 로드락 장치 및 이를 이용한 반도체 제조 시스템
WO2023172283A1 (en) * 2022-03-11 2023-09-14 Applied Materials, Inc. Modular multi-chamber processing tool having link chamber for ultra high vacuum processes

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KR100265287B1 (ko) * 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
JP4330703B2 (ja) * 1999-06-18 2009-09-16 東京エレクトロン株式会社 搬送モジュール及びクラスターシステム
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KR100422467B1 (ko) * 2001-05-09 2004-03-12 삼성전자주식회사 반도체장치 제조설비
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US7776226B2 (en) 2010-08-17
US20090291558A1 (en) 2009-11-26
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US20050236092A1 (en) 2005-10-27
US6930050B2 (en) 2005-08-16
US20090203211A1 (en) 2009-08-13
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JP2012186506A (ja) 2012-09-27
JP5491579B2 (ja) 2014-05-14
TW502284B (en) 2002-09-11
KR19990080759A (ko) 1999-11-15
DE19901426A1 (de) 1999-11-04
US6503365B1 (en) 2003-01-07
JP5134575B2 (ja) 2013-01-30
US20030073323A1 (en) 2003-04-17

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