JP6689294B2 - 金誘電体接合部の信頼性を向上させたディスクドライブヘッドサスペンション構造 - Google Patents
金誘電体接合部の信頼性を向上させたディスクドライブヘッドサスペンション構造 Download PDFInfo
- Publication number
- JP6689294B2 JP6689294B2 JP2017565147A JP2017565147A JP6689294B2 JP 6689294 B2 JP6689294 B2 JP 6689294B2 JP 2017565147 A JP2017565147 A JP 2017565147A JP 2017565147 A JP2017565147 A JP 2017565147A JP 6689294 B2 JP6689294 B2 JP 6689294B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- dielectric layer
- dielectric
- seed
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000725 suspension Substances 0.000 title description 13
- 239000004020 conductor Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 230000009972 noncorrosive effect Effects 0.000 claims description 10
- 238000005260 corrosion Methods 0.000 claims description 8
- 230000007797 corrosion Effects 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49025—Making disc drive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Description
［関連出願の相互参照］
本願は、２０１５年６月３０日に出願された「金誘電体接合部の信頼性を向上させたディスクドライブヘッドサスペンション構造」という発明の名称の米国仮特許出願第６２／１８６，７２１号の優先権を主張し、あらゆる目的でその全体が言及によって本明細書に組み込まれる。
本願は、２０１５年６月３０日に出願された「金誘電体接合部の信頼性を向上させたディスクドライブヘッドサスペンション構造」という発明の名称の米国仮特許出願第６２／１８６，７２１号の優先権を主張し、あらゆる目的でその全体が言及によって本明細書に組み込まれる。
本発明は、概してディスクドライブヘッドサスペンション及びフレクシャに関する。本発明の実施形態は、金（及び他の耐食性材料）誘電体インターフェイスを有する構造及び製造方法に関する。
一体型リード又は無線のディスクドライブヘッドサスペンション及びフレクシャは、銅又は銅合金のなどの比較的より腐食性のある導体の表面にめっき又は塗布される金及び／又はニッケルなどの比較的非腐食性の材料を有する構造を一般に含む。金は、ポリイミド又は他の誘電体層の開口部を介して導体上にめっきされることがある。これらのタイプの構造では、金めっきのエッジ部が誘電体との接合部又はインターフェイスを形成することが可能である。Ｙｏｎｅｋｕｒａ等の特許文献１は、例えば、図１９Ｃにおいてこのタイプの構造を有する「裏側アクセス」フレクシャ端子を開示している。配線層上の端子面は、金属層及び絶縁層における貫通孔により露出され、端子面は金めっきされている。
残念なことに、これらのタイプの構造における金めっきと誘電体層との間の接合部は、分離しやすい。金めっきと誘電体との間に形成される任意の空隙又は隙間は、湿気又は他の物質による導体へのアクセスを可能にし、導体は望ましくない腐食を受けやすくなる。ゆえに、金と誘電体との接合部の信頼性を向上させた、改善された構造が引き続き求められている。効率的に製造されることができるこれらのタイプの構造は特に望ましいものである。
本発明の実施形態は、誘電体層、導体層、誘電体層と導体層との間のシード層、及び導体層のシード層側上の非腐食層を含む、端子パッド又はフライングトレースなどの部分を備えた、ディスクドライブヘッドサスペンション又はフレクシャを含む。シード層は、誘電体層のエッジ部を越えて延びるストリップを有する。非腐食層は、シード層のストリップの上に延び、誘電体層のエッジ部と接触する。他の実施形態では、シード層と反対の誘電体層の側上にベース層を含む。
図１は、本発明の実施形態による非腐食材料の誘電体インターフェイス又は接合部を有する一体型リードサスペンション又はフレクシャ８の部分１０の図である。図示されるように、部分１０は、ステンレス鋼などのばね用金属であり得るベース層１２と、ベース層表面上のポリイミド又は他の誘電体層１４とを含む。導体層１６は、ベース層１２と反対の誘電体層１４の側上にある。導体層１６は、湿気や他の物質に暴露された場合に比較的腐食性がある金属である、銅又は銅合金を実施形態では含む。実施形態ではクロムを含むシード層１８が、誘電体層１４と導体層１６との間に配置される。図示された実施形態では誘電体層１４の少なくとも一部及びベース層１２の一部が、エッジ部２０を形成する。シード層１８のセクション又はストリップ２２は、誘電体層１４のエッジ部２０を越えて延びる。非腐食層２４はシード層１８に面する導体層１６の表面上に配置される。また非腐食層２４は、シード層のストリップ２２にオーバーレイし、且つ誘電体層１４と接触して、エッジ部２０において誘電体層との接合部又はインターフェイスを形成する部分２６を含む。非腐食層２４は、湿気や他の物質に暴露された場合に導体層１６に対して比較的非腐食性の金属である、金及び／又はニッケルを実施形態では含む。
部分１０は、フレクシャ８におけるいくつかの異なる構造のいずれかであり得る。実施形態において、例えば、非腐食層２４、及び導体層１６の隣接部分は、一体型リードの裏側アクセス端子パッド（例えば、フレクシャ上の第２ステージアクチュエータモータ（図示せず）への接続用、又はフレクシャのテールにおいて、ディスクドライブ電子装置への他のコネクタ（図示せず）への接続用）であってもよい。これらの実施形態及び他の実施形態では、非腐食層２４及び導体層１６の隣接部分はまた、フレクシャ８上のベース層不支持リード又はフライングリードであってもよい。フレクシャ８のこれらの実施形態及び他の実施形態は、本発明の実施形態による非腐食性材料誘電体インターフェイスを有する１０などの部分を備えた他の構造を含んでもよい。
シード層１８のセクション又はストリップ２２は、非腐食層２４が接着する面を提供し、それによって非腐食性材料誘電体インターフェイスの強度及び統合性を高める。したがって、非腐食性材料誘電体インターフェイスは、分離しにくく、インターフェイスにおける導体層１６の腐食の可能性を低減する。実施形態では、ストリップ２２は、約３００ｎｍの深さ（例えば、ストリップのエッジ部と誘電体層１４との間の距離）にすることができる。ストリップ２２の深さは、他の実施形態では、より長い又は短い距離であってもよい。ストリップ２２の深さ及び他の寸法は、例えば、誘電体層１４、導体層１６、シード層１８及び/若しくは非腐食層２４の特性及び/若しくは寸法、並びに／又は部分１０の特性などの多くの要因のいずれかに基づいて決定されることができる（例えば、部分１０にインターフェイスの統合性を損なう可能性のある応力がかかる程度）。
部分１０を有するフレクシャ８を形成するための一連のステップを含む方法の実施形態は、図２ａ〜２ｅに関して記載される。図２ａは、オーバーレイベース層１２、誘電体層１４、シード層１８及び導体層１６を有する構造を含む、製造の中間段階におけるフレクシャ８’及び部分１０’の図である。フォトリソグラフィ（例えば、パターン状及び／又は非パターン状フォトレジストマスクの使用）に関連したウェットエッチング（例えば、化学的）及びドライエッチング（例えば、プラズマ）エッチング、電解めっき及び無電解めっき、並びにスパッタリングプロセスなどの従来のアディティブ堆積及び／又はサブトラクティブプロセスが、フレクシャ８及びフレクシャ８’の中間構造を製造するために用いられることができる。これらのタイプのアディティブプロセス及びサブトラクティブプロセスは、例えば、「デュアルステージアクチュエーションディスクドライブサスペンション用低抵抗グランドジョイント(Low Resistance Ground Joints for Dual Stage Actuation Disk DriveSuspensions)」）という発明の名称のＢｅｎｎｉｎ等の米国特許第８，８８５，２９９号明細書、「複数トレース構造を備えた一体型リードサスペンション（Integrated Lead Suspension with Multiple Trace Configurations）」という発明の名称のＲｉｃｅ等の米国特許第８，１６９，７４６号明細書、「一体型リードサスペンションの多層グランドプレーン構造（Multi-Layer Ground Plane Structures for Integrated Lead Suspensions）」という発明の名称のＨｅｎｔｇｅｓ等の米国特許第８，１４４，４３０号明細書、「一体型リードサスペンションの多層グランドプレーン構造（Multi-Layer Ground Plane Structures for Integrated Lead Suspensions)という発明の名称のＨｅｎｔｇｅｓ等の米国特許第７，９２９，２５２号明細書、「サスペンション組立体用貴金属導電リード製造方法（Method for Making Noble Metal Conductive Leads for SuspensionAssemblies）」）という発明の名称のＳｗａｎｓｏｎ等の米国特許第７，３８８，７３３号明細書、「一体型リードサスペンションのめっきグランド形体（Plated Ground Features for Integrated Lead Suspensions）」という発明の名称のＰｅｌｔｏｍａ等の米国特許第７，３８４，５３１号明細書である米国特許文献において概して公開されており、これらのすべてがあらゆる目的のために言及によって本明細書に組み込まれる。
図２ｂに示されるように、ベース層１２の一部は、（例えば、パターン状のフォトレジストマスク及び化学エッチングを使用して）部分１０’においてフレクシャ８’の構造から除去されることができる。ベース層１２の一部が除去された後、図２ｃに示すように、部分１０’における誘電体層１４の一部を（例えば、パターンマスクを介したレーザエッチングによって）除去することができる。シード１８の望ましくない部分は、図２ｄに示されるように、（例えば、化学エッチングによって）除去されることができる。その後、ストリップ２２は、図２ｅに示されるように、シード層１８上部の誘電体層１４の露出したエッジ部の一部を（例えば、大気プラズマエッチングによって）除去することによって形成されることができる。ストリップ２２を有する部分１０’の形成に続いて、非腐食性層２４を塗布して（すなわち、めっきして）図１に示される構造を作製することができる。
これらのタイプの製造方法には重大な有利性がある。これらのタイプの製造方法は部分１０の効率的な製造を可能にする。
本発明は、好ましい実施形態に関して記載されているが、当業者は、本発明の意図及び範囲から逸脱することなく形態や詳細の変更を行うことができることを認識する。例えば、フレクシャ８の部分１０を製造するために他の方法を使用することができる。
Claims (10)
- エッジ部を備えた誘電体層と、
導体層と、
前記誘電体層の前記エッジ部を越えて延びるストリップを有する、前記誘電体層と前記導体層との間のシード層と、
前記シード層の前記ストリップ上に延び、前記誘電体層の前記エッジ部と接触する、前記導体層の前記シード層側上の非腐食層と、を含む部分を備えた装置。 - 前記部分は、前記シード層と反対の前記誘電体層の側上にベース層をさらに含む、請求項１に記載の装置。
- 前記部分を含む端子パッドを有する、請求項２に記載の装置。
- 前記部分を含む端子パッドを有する、請求項１に記載の装置。
- 前記部分を含むフライングリードを有する、請求項２に記載の装置。
- 前記部分を含むフライングリードを有する、請求項１に記載の装置。
- 装置の製造方法であって、
シード層によって分離された導体層と誘電体層とを含み、前記誘電体層がエッジ部を備えた構造を準備するステップと、
前記エッジ部に隣接する前記誘電体層の一部を除去して、前記誘電体層の前記エッジ部から延びる前記シード層のストリップを露出させるステップと、
前記導体層の前記シード層側に、及び前記シード層の前記ストリップ上に、前記誘電体層の前記エッジ部と接触する非腐食層を塗布するステップと、を含む方法。 - 前記誘電体層の一部を除去することは、前記誘電体層をエッチングすることを含む、請求項７に記載の方法。
- 非腐食層を塗布することは、前記非腐食層をめっきすることを含む、請求項８に記載の方法。
- 非腐食層を塗布することは、前記非腐食層をめっきすることを含む、請求項７に記載の方法。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562186721P | 2015-06-30 | 2015-06-30 | |
| US62/186,721 | 2015-06-30 | ||
| PCT/US2016/038677 WO2017003782A1 (en) | 2015-06-30 | 2016-06-22 | Disk drive head suspension structures having improved gold-dielectric joint reliability |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018519615A JP2018519615A (ja) | 2018-07-19 |
| JP2018519615A5 JP2018519615A5 (ja) | 2019-07-25 |
| JP6689294B2 true JP6689294B2 (ja) | 2020-04-28 |
Family
ID=57609428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017565147A Active JP6689294B2 (ja) | 2015-06-30 | 2016-06-22 | 金誘電体接合部の信頼性を向上させたディスクドライブヘッドサスペンション構造 |
Country Status (4)
| Country | Link |
|---|---|
| US (4) | US9734852B2 (ja) |
| JP (1) | JP6689294B2 (ja) |
| CN (1) | CN107735834B (ja) |
| WO (1) | WO2017003782A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107735834B (zh) * | 2015-06-30 | 2019-11-19 | 哈钦森技术股份有限公司 | 具有改进的可靠性的盘驱动器头部悬架结构 |
Family Cites Families (579)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3320556A (en) | 1963-05-23 | 1967-05-16 | Bell Telephone Labor Inc | Impedance transformer |
| US3582575A (en) | 1969-07-02 | 1971-06-01 | Insul 8 Corp | Composite conductor bar and method of manufacture |
| US3877120A (en) | 1970-02-20 | 1975-04-15 | Toray Industries | Needle board |
| US3910339A (en) | 1971-12-13 | 1975-10-07 | Hyman Kramer | Webbing strip-to-tubular frame member fastenings |
| US3862522A (en) | 1973-08-10 | 1975-01-28 | Fiber Bond Corp | Needled scouring pad |
| US4014257A (en) | 1975-07-28 | 1977-03-29 | Minnesota Mining And Manufacturing Company | Apparatus for die cutting indicia on a multilayer tape |
| US4168214A (en) | 1978-06-14 | 1979-09-18 | American Chemical And Refining Company, Inc. | Gold electroplating bath and method of making the same |
| US4181554A (en) | 1978-10-06 | 1980-01-01 | National Semiconductor Corporation | Method of applying polarized film to liquid crystal display cells |
| US4299130A (en) | 1979-10-22 | 1981-11-10 | Gould Inc. | Thin film strain gage apparatus with unstrained temperature compensation resistances |
| DE3020371C2 (de) | 1980-05-29 | 1985-12-19 | Degussa Ag, 6000 Frankfurt | Verfahren zur Vorbehandlung von Edelstahl für eine direkte galvanische Vergoldung |
| US4418239A (en) | 1981-08-24 | 1983-11-29 | Oak Industries Inc. | Flexible connector with interconnection between conductive traces |
| US4422906A (en) | 1981-09-17 | 1983-12-27 | Masami Kobayashi | Process for direct gold plating of stainless steel |
| US4670804A (en) | 1985-10-15 | 1987-06-02 | International Business Machines Corporation | Expandable suspension for a read/write head in a disk file |
| EP0335608B1 (en) | 1988-03-28 | 1995-06-14 | Texas Instruments Incorporated | Lead frame with reduced corrosion |
| US4916798A (en) | 1988-08-26 | 1990-04-17 | Jack Toering | Method of applying applique or like object to a baseplate |
| US6600631B1 (en) | 1989-11-27 | 2003-07-29 | Censtor Corp. | Transducer/flexure/conductor structure for electromagnetic read/write system |
| USD332181S (en) | 1990-02-02 | 1993-01-05 | Mercedes-Benz Ag | Vehicle seat |
| US5333085A (en) | 1990-11-06 | 1994-07-26 | Seagate Technology, Inc. | Read/write gimbal with limited range of motion |
| US5267572A (en) | 1990-11-20 | 1993-12-07 | Bucalo Brian D | Biopsy instrument with tissue specimen retaining and retrieval device |
| US5140288A (en) | 1991-04-08 | 1992-08-18 | Motorola, Inc. | Wide band transmission line impedance matching transformer |
| US5144777A (en) | 1991-04-09 | 1992-09-08 | Allsteel Inc. | Grommet assembly for wall panels |
| US5427848A (en) | 1991-05-06 | 1995-06-27 | International Business Machines Corporation | Stress balanced composite laminate material |
| US5764444A (en) | 1991-07-23 | 1998-06-09 | Fujitsu Limited | Mechanism for minute movement of a head |
| US5275076A (en) | 1991-12-16 | 1994-01-04 | Atlas Die Inc. | Steel rule die having improved rule holders |
| EP0576680B1 (en) | 1992-01-20 | 2004-03-31 | Fujitsu Limited | Magnetic head assembly, its manufacture, and magnetic disc device |
| US5212847A (en) | 1992-01-21 | 1993-05-25 | Nagl Manufacturing Company | Swab and method of manufacturing and using it |
| US5282103A (en) | 1992-10-07 | 1994-01-25 | Read-Rite Corporation | Magnetic head suspension assembly fabricated with integral load beam and flexure |
| US5334804A (en) | 1992-11-17 | 1994-08-02 | Fujitsu Limited | Wire interconnect structures for connecting an integrated circuit to a substrate |
| USD356694S (en) | 1993-01-15 | 1995-03-28 | Keiper Recardo GmbH & Co. | Vehicle seat |
| US5320272A (en) | 1993-04-02 | 1994-06-14 | Motorola, Inc. | Tin-bismuth solder connection having improved high temperature properties, and process for forming same |
| US5321568A (en) | 1993-04-22 | 1994-06-14 | Maxtor Corporation | Head suspension assembly with improved pitch and roll characteristics |
| US5485053A (en) | 1993-10-15 | 1996-01-16 | Univ America Catholic | Method and device for active constrained layer damping for vibration and sound control |
| US5600691A (en) | 1993-10-29 | 1997-02-04 | General Electric Company | Noble metal doping or coating of crack interior for stress corrosion cracking protection of metals |
| US5459921A (en) | 1993-11-12 | 1995-10-24 | Seagate Technology, Inc. | Method of making a disc drive actuator arm with arm compliance compensation |
| US6014289A (en) | 1994-03-22 | 2000-01-11 | Hutchinson Technology Incorporated | Integrated circuit on a monocoque suspension |
| US5651723A (en) | 1994-04-13 | 1997-07-29 | Viratec Thin Films, Inc. | Method and apparatus for cleaning substrates in preparation for deposition of thin film coatings |
| US5598307A (en) | 1994-04-15 | 1997-01-28 | Hutchinson Technology Inc. | Integrated gimbal suspension assembly |
| US5491597A (en) | 1994-04-15 | 1996-02-13 | Hutchinson Technology Incorporated | Gimbal flexure and electrical interconnect assembly |
| US5631786A (en) | 1994-05-19 | 1997-05-20 | International Business Machines Corporation | Termination pad manipulator for a laminated suspension in a data storage system |
| US5608590A (en) | 1994-06-20 | 1997-03-04 | Hutchinson Technology Incorporated | Gimballing flexure with static compensation and load print intregal etched features |
| US6539609B2 (en) | 1994-07-05 | 2003-04-01 | International Business Machines Corporation | Method of forming a head gimbal assembly |
| JP3354302B2 (ja) | 1994-07-27 | 2002-12-09 | 日本メクトロン株式会社 | 磁気ヘッド用サスペンションの製造法 |
| US5526208A (en) | 1994-08-17 | 1996-06-11 | Quantum Corporation | Flex circuit vibration sensor |
| US5521778A (en) | 1994-08-30 | 1996-05-28 | International Business Machines Corporation | Disk drive with primary and secondary actuator drives |
| JPH08111015A (ja) | 1994-09-01 | 1996-04-30 | Tdk Corp | 磁気ヘッドスライダの支持装置及び磁気ヘッド装置 |
| US5929390A (en) | 1994-09-14 | 1999-07-27 | Ishida Co., Ltd. | Load cell weighing apparatus using the same |
| US5965936A (en) | 1997-12-31 | 1999-10-12 | Micron Technology, Inc. | Multi-layer lead frame for a semiconductor device |
| JP3324628B2 (ja) | 1994-11-18 | 2002-09-17 | 日本精工株式会社 | 低発塵性グリース組成物 |
| US5771568A (en) | 1995-03-02 | 1998-06-30 | Hutchinson Technology Incorporated | Method for manufacturing a head suspension having electrical trace interconnects with reduced capacitance |
| US5657188A (en) | 1995-06-01 | 1997-08-12 | Hutchinson Technology Incorporated | Head suspension with tracking microactuator |
| US5608591A (en) | 1995-06-09 | 1997-03-04 | International Business Machines Corporation | Integrated head-electronics interconnection suspension for a data recording disk drive |
| JPH0922570A (ja) | 1995-07-03 | 1997-01-21 | Fujitsu Ltd | ヘッドアセンブリ及び該ヘッドアセンブリを具備した磁気ディスク装置 |
| US5666241A (en) | 1995-07-10 | 1997-09-09 | Magnecomp Corp. | Double dimple disk drive suspension |
| US5674970A (en) | 1995-07-12 | 1997-10-07 | Georgia-Pacific Resins, Inc. | Phenolic polymers made by aralkylation reactions |
| US5636089A (en) | 1995-08-01 | 1997-06-03 | Hutchinson Technology Incorporated | Head suspension with spaced static attitude compensation protuberance and load dimple |
| US5737152A (en) | 1995-10-27 | 1998-04-07 | Quantum Corporation | Suspension with multi-layered integrated conductor trace array for optimized electrical parameters |
| SG43433A1 (en) | 1995-10-27 | 1997-10-17 | Tdk Corp | Suspension slider-suspension assmebly assembly carriage device and manufacturing method of the suspension |
| US6284563B1 (en) | 1995-10-31 | 2001-09-04 | Tessera, Inc. | Method of making compliant microelectronic assemblies |
| US5795435A (en) | 1995-11-08 | 1998-08-18 | Waters, Jr.; Jesse Walter | Transfer tape applicator system |
| US6215622B1 (en) | 1996-01-02 | 2001-04-10 | International Business Machines Corporation | Laminated hard disk head suspension and etching process |
| JP3206428B2 (ja) | 1996-04-09 | 2001-09-10 | ティーディーケイ株式会社 | ヘッドジンバルアセンブリを具備するハードディスク装置 |
| US6063228A (en) | 1996-04-23 | 2000-05-16 | Hitachi Cable, Ltd. | Method and apparatus for sticking a film to a lead frame |
| US5892637A (en) | 1996-05-10 | 1999-04-06 | International Business Machines Corporation | Multi-piece integrated suspension assembly for a magnetic storage system |
| US5862015A (en) | 1996-05-23 | 1999-01-19 | Hutchinson Technology Incorporated | Head suspension with resonance feedback transducer |
| US5916696A (en) | 1996-06-06 | 1999-06-29 | Lucent Technologies Inc. | Conformable nickel coating and process for coating an article with a conformable nickel coating |
| JPH103632A (ja) | 1996-06-12 | 1998-01-06 | Dainippon Printing Co Ltd | 磁気ヘッドサスペンション |
| US5914834A (en) | 1996-06-17 | 1999-06-22 | Hutchinson Technology, Inc. | Head suspension assembly with electrical interconnect by slider bond pads and gimbal bonding zones |
| US5805382A (en) | 1996-06-21 | 1998-09-08 | International Business Machines Corporation | Integrated conductor magnetic recording head and suspension having cross-over integrated circuits for noise reduction |
| US6078470A (en) | 1996-06-28 | 2000-06-20 | Hutchinson Technology, Inc. | Head suspension having a modified dimple design |
| US5921131A (en) | 1996-06-28 | 1999-07-13 | Hutchinson Technology Incorporated | Method for frictionally guiding and forming ferrous metal |
| US5818662A (en) | 1996-07-15 | 1998-10-06 | International Business Machines Corporation | Static attitude and stiffness control for an integrated suspension |
| US7169158B2 (en) | 1996-07-23 | 2007-01-30 | Tyco Healthcare Group Lp | Anastomosis instrument and method for performing same |
| EP0823719B1 (en) | 1996-07-26 | 2002-06-05 | Nec Corporation | Solid electrolytic capacitor having pre-plated lead terminals and manufacturing process thereof |
| US5973882A (en) | 1996-08-07 | 1999-10-26 | Hutchinson Technology, Inc. | Moment-flex head suspension |
| US6307715B1 (en) | 1996-08-30 | 2001-10-23 | Read-Rite Corporation | Head suspension having reduced torsional vibration |
| CA2214130C (en) | 1996-09-19 | 2003-12-02 | Northern Telecom Limited | Assemblies of substrates and electronic components |
| CN1117373C (zh) | 1996-09-26 | 2003-08-06 | 国际商业机器公司 | 悬挂组件，头悬挂组件，头组组件以及存储盘装置 |
| JPH10261212A (ja) | 1996-09-27 | 1998-09-29 | Nippon Mektron Ltd | 回路配線付き磁気ヘッド用サスペンションの製造法 |
| US5717547A (en) | 1996-10-03 | 1998-02-10 | Quantum Corporation | Multi-trace transmission lines for R/W head interconnect in hard disk drive |
| US5995328A (en) | 1996-10-03 | 1999-11-30 | Quantum Corporation | Multi-layered integrated conductor trace array interconnect structure having optimized electrical parameters |
| US5796552A (en) | 1996-10-03 | 1998-08-18 | Quantum Corporation | Suspension with biaxially shielded conductor trace array |
| WO1998019304A1 (fr) | 1996-10-31 | 1998-05-07 | Tdk Corporation | Tete d'enregistrement/reproduction, mecanisme de positionnement de tete d'enregistrement/reproduction et dispositif d'enregistrement/reproduction |
| WO1998020485A1 (en) | 1996-11-06 | 1998-05-14 | Quantum Corporation | Head suspension with self-shielding 'twisted' integrated conductor trace array |
| JP2853683B2 (ja) | 1996-12-03 | 1999-02-03 | 日本電気株式会社 | 磁気ヘッドスライダ支持機構及び磁気ディスク装置 |
| US5898541A (en) | 1996-12-04 | 1999-04-27 | Seagate Technology, Inc. | Leading surface slider microactuator |
| JP3584153B2 (ja) | 1996-12-05 | 2004-11-04 | キヤノン株式会社 | 軟質部品の切断方法及び実装方法、軟質部品の切断装置及び実装装置 |
| JP2001503552A (ja) | 1996-12-16 | 2001-03-13 | シーゲイト テクノロジー エルエルシー | バイモルフ圧電マイクロアクチュエータのヘッドとフレクシャとの組立体 |
| US5790347A (en) | 1996-12-23 | 1998-08-04 | Hutchinson Technology Incorporated | Head suspension load beam and flexure construction for reducing structural height |
| US5734526A (en) | 1996-12-31 | 1998-03-31 | Hutchinson Technology Incorporated | Monocoque head suspension and its method of construction |
| US5722142A (en) | 1997-01-06 | 1998-03-03 | Myers; Michael R. | Installation tool for irrigation emitter barbs |
| US6038102A (en) | 1997-01-21 | 2000-03-14 | Quantum Corporation | Conductor trace array having interleaved passive conductors |
| US6275358B1 (en) | 1997-01-21 | 2001-08-14 | Maxtor Corporation | Conductor trace array having passive stub conductors |
| US6349017B1 (en) | 1997-02-21 | 2002-02-19 | Read-Rite Corporation | Magnetic head suspension assembly using bonding pads of a slider to an attachment surface of a flexure |
| US6521358B1 (en) | 1997-03-04 | 2003-02-18 | Matsushita Electric Industrial Co., Ltd. | Lead frame for semiconductor device and method of producing same |
| US5945732A (en) | 1997-03-12 | 1999-08-31 | Staktek Corporation | Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package |
| US6011671A (en) | 1997-04-10 | 2000-01-04 | Seagate Technology, Inc. | Head gimbal assembly for limiting dimple separation for a data storage device |
| US5812344A (en) | 1997-05-12 | 1998-09-22 | Quantum Corporation | Suspension with integrated conductor trace array having optimized cross-sectional high frequency current density |
| JP3495224B2 (ja) | 1997-06-06 | 2004-02-09 | アルプス電気株式会社 | 磁気ヘッド装置及びその製造方法 |
| US5898544A (en) | 1997-06-13 | 1999-04-27 | Hutchinson Technology Incorporated | Base plate-mounted microactuator for a suspension |
| US5879965A (en) | 1997-06-19 | 1999-03-09 | Micron Technology, Inc. | Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
| US6396667B1 (en) | 1997-06-24 | 2002-05-28 | Seagate Technology Llc | Electromagnetic disc drive microactuator and suspension |
| US6728077B1 (en) | 1997-07-03 | 2004-04-27 | Seagate Technology Llc | Suspension-level piezoelectric microactuator |
| JPH1125628A (ja) | 1997-07-04 | 1999-01-29 | Fujitsu Ltd | 接触検出機能付ヘッドスライダ及びディスク装置 |
| US5862010A (en) | 1997-07-08 | 1999-01-19 | International Business Machines Corporation | Transducer suspension system |
| JP3605497B2 (ja) | 1997-07-11 | 2004-12-22 | 日本発条株式会社 | ディスク装置用サスペンション |
| US6085456A (en) | 1997-07-14 | 2000-07-11 | Battaglia; Vincent P | Sheet metal fish hook |
| US5973884A (en) | 1997-07-21 | 1999-10-26 | K. R. Precision Public Company Limited | Gimbal assembly with offset slider pad and cross beam for pitch and roll stiffness and high vertical and horizontal stiffness |
| US6218727B1 (en) | 1997-08-07 | 2001-04-17 | Infineon Technologie Ag | Wafer frame |
| USD411377S (en) | 1997-08-13 | 1999-06-22 | Daimler-Benz Aktiengesellschaft | Seat for motor vehicle |
| US6362542B1 (en) | 1997-08-15 | 2002-03-26 | Seagate Technology Llc | Piezoelectric microactuator for precise head positioning |
| US6180999B1 (en) | 1997-08-29 | 2001-01-30 | Texas Instruments Incorporated | Lead-free and cyanide-free plating finish for semiconductor lead frames |
| US6246546B1 (en) | 1997-10-02 | 2001-06-12 | Hutchinson Technology Incorporated | Coined partial etched dimple in a head suspension and method of manufacture |
| US6255723B1 (en) | 1997-10-27 | 2001-07-03 | Tessera, Inc. | Layered lead structures |
| US5922000A (en) | 1997-11-19 | 1999-07-13 | Redfield Corp. | Linear punch |
| US6029334A (en) | 1997-12-02 | 2000-02-29 | Unova Ip Corp. | Hemming method and apparatus |
| JPH11189835A (ja) | 1997-12-25 | 1999-07-13 | Jst Mfg Co Ltd | すず−ニッケル合金およびこの合金により表面処理を施した部品 |
| US5956212A (en) | 1997-12-29 | 1999-09-21 | Headway Technologies, Inc. | Static attitude adjustment of a trace-suspension assembly |
| US6195227B1 (en) | 1997-12-30 | 2001-02-27 | International Business Machines, Inc. | Integrated 3D limiters for microactuators |
| US6262868B1 (en) | 1997-12-30 | 2001-07-17 | International Business Machines Corporation | Method and structures used for connecting recording head signal wires in a microactuator |
| US5924187A (en) | 1998-01-06 | 1999-07-20 | Hutchinson Technology Incorporated | Integrated lead head suspension assembly having an etched laminated load beam and flexure with deposited conductors |
| US6118637A (en) | 1998-01-08 | 2000-09-12 | Seagate Technology, Inc. | Piezoelectric assembly for micropositioning a disc drive head |
| DE19808193B4 (de) | 1998-02-27 | 2007-11-08 | Robert Bosch Gmbh | Leadframevorrichtung und entsprechendes Herstellungsverfahren |
| JP3257500B2 (ja) | 1998-02-27 | 2002-02-18 | ティーディーケイ株式会社 | 磁気ヘッド装置 |
| EP0946086A1 (en) | 1998-03-23 | 1999-09-29 | STMicroelectronics S.r.l. | Plated leadframes with cantilever leads |
| US6465744B2 (en) | 1998-03-27 | 2002-10-15 | Tessera, Inc. | Graded metallic leads for connection to microelectronic elements |
| JPH11284294A (ja) * | 1998-03-31 | 1999-10-15 | Dainippon Printing Co Ltd | 回路基板、磁気ヘッドサスペンションおよび回路基板の製造方法 |
| US6295185B1 (en) | 1998-04-07 | 2001-09-25 | Seagate Technology Llc | Disc drive suspension having a moving coil or moving magnet microactuator |
| US6157522A (en) | 1998-04-07 | 2000-12-05 | Seagate Technology Llc | Suspension-level microactuator |
| US6215629B1 (en) | 1998-04-16 | 2001-04-10 | Seagate Technology Llc | Unitary synchronous flexure microactuator |
| JP3923174B2 (ja) | 1998-04-28 | 2007-05-30 | 富士通株式会社 | ヘッドアセンブリ及びサスペンション |
| US6735055B1 (en) | 1998-05-07 | 2004-05-11 | Seagate Technology Llc | Microactuator structure with vibration attenuation properties |
| US20050101983A1 (en) | 1998-05-29 | 2005-05-12 | By-Pass,Inc. | Method and apparatus for forming apertures in blood vessels |
| US6055132A (en) | 1998-06-04 | 2000-04-25 | Internatinal Business Machines Corporation | Integrated lead suspension flexure for attaching a micro-actuator with a transducer slider |
| US6282063B1 (en) | 1998-06-09 | 2001-08-28 | Magnecomp Corp. | Flexure-slider bonding system |
| JP2000003988A (ja) | 1998-06-15 | 2000-01-07 | Sony Corp | リードフレームおよび半導体装置 |
| US6400532B1 (en) | 1998-06-17 | 2002-06-04 | Magnecomp Corp. | Recording head suspension with coupled dimple and channel |
| US6194777B1 (en) | 1998-06-27 | 2001-02-27 | Texas Instruments Incorporated | Leadframes with selective palladium plating |
| US6215175B1 (en) | 1998-07-06 | 2001-04-10 | Micron Technology, Inc. | Semiconductor package having metal foil die mounting plate |
| US20010001937A1 (en) | 1998-07-29 | 2001-05-31 | David Benes | Die retention pallet for material cutting devices |
| US6320730B1 (en) | 1998-09-26 | 2001-11-20 | Seagate Technology Llc | Low-stress disc drive microactuator cradle |
| US6707680B2 (en) | 1998-10-22 | 2004-03-16 | Board Of Trustees Of The University Of Arkansas | Surface applied passives |
| US6297936B1 (en) | 1998-11-09 | 2001-10-02 | Seagate Technology Llc | Integral load beam push-pull microactuator |
| WO2000030080A1 (fr) | 1998-11-13 | 2000-05-25 | Tdk Corporation | Mecanisme support pour tete d'enregistrement/de reproduction, et dispositif d'enregistrement/de reproduction |
| US6233124B1 (en) | 1998-11-18 | 2001-05-15 | Seagate Technology Llc | Piezoelectric microactuator suspension assembly with improved stroke length |
| US6714384B2 (en) | 1998-12-07 | 2004-03-30 | Seagate Technology Llc | Reduced stiffness printed circuit head interconnect |
| JP3569144B2 (ja) | 1998-12-25 | 2004-09-22 | ヒタチグローバルストレージテクノロジーズネザーランドビーブイ | ヘッド支持アーム及びこれの製造方法 |
| US6387111B1 (en) | 1998-12-31 | 2002-05-14 | Arthrex, Inc. | Method of using a meniscal vascular punch |
| US6146813A (en) | 1999-01-13 | 2000-11-14 | Applied Kinetics Inc. | Method and shunting and deshunting an electrical component and a shuntable/shunted electrical component |
| JP3876088B2 (ja) | 1999-01-29 | 2007-01-31 | ローム株式会社 | 半導体チップおよびマルチチップ型半導体装置 |
| US6249404B1 (en) | 1999-02-04 | 2001-06-19 | Read-Rite Corporation | Head gimbal assembly with a flexible printed circuit having a serpentine substrate |
| US6596184B1 (en) | 1999-02-15 | 2003-07-22 | International Business Machines Corporation | Non-homogeneous laminate materials for suspensions with conductor support blocks |
| JP3532439B2 (ja) | 1999-03-02 | 2004-05-31 | アルプス電気株式会社 | 磁気ヘッド |
| JP3581268B2 (ja) | 1999-03-05 | 2004-10-27 | 株式会社東芝 | ヒートシンク付半導体装置およびその製造方法 |
| US6407481B1 (en) | 1999-03-05 | 2002-06-18 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive device having convexly curved diaphragm |
| US6380483B1 (en) | 1999-03-08 | 2002-04-30 | Ibc Corporation | Connector for flexible electrical conduit |
| JP3725991B2 (ja) | 1999-03-12 | 2005-12-14 | 株式会社日立グローバルストレージテクノロジーズ | 磁気ディスク装置 |
| US6300846B1 (en) | 1999-03-18 | 2001-10-09 | Molex Incorporated | Flat flexible cable with ground conductors |
| US20030011048A1 (en) | 1999-03-19 | 2003-01-16 | Abbott Donald C. | Semiconductor circuit assembly having a plated leadframe including gold selectively covering areas to be soldered |
| US6320729B1 (en) | 1999-04-27 | 2001-11-20 | Magnecomp Corp. | Snap-in assembly of suspension limiter having both high shock and load/unload cycle capability |
| US6695859B1 (en) | 1999-04-05 | 2004-02-24 | Coalescent Surgical, Inc. | Apparatus and methods for anastomosis |
| US6593643B1 (en) | 1999-04-08 | 2003-07-15 | Shinko Electric Industries Co., Ltd. | Semiconductor device lead frame |
| US6278587B1 (en) | 1999-04-21 | 2001-08-21 | Magnecomp Corp. | Positive coupling of piezoelectric devices in disk drive suspensions |
| JP3314754B2 (ja) | 1999-04-22 | 2002-08-12 | 松下電器産業株式会社 | 鉛を含まない錫ベース半田皮膜を有する半導体装置およびその製造方法 |
| US6469870B1 (en) | 1999-04-28 | 2002-10-22 | Magnecomp Corporation | Slider location in head gimbal assemblies using indicia instead of dimple |
| US6172853B1 (en) | 1999-05-20 | 2001-01-09 | Hutchinson Technology Incorporated | Head suspension having a near dimple motion limiter |
| US6080173A (en) | 1999-05-26 | 2000-06-27 | Idx Medical Ltd. | Tissue punching instrument |
| JP2000348321A (ja) | 1999-06-03 | 2000-12-15 | Nec Corp | 磁気ディスク装置，磁気ヘッド，磁気ヘッドの製造方法および磁気ディスク装置の製造方法 |
| US6376901B1 (en) | 1999-06-08 | 2002-04-23 | Texas Instruments Incorporated | Palladium-spot leadframes for solder plated semiconductor devices and method of fabrication |
| US6501625B1 (en) | 1999-06-29 | 2002-12-31 | Hutchinson Technology Incorporated | Disk drive suspension with multi-layered piezoelectric actuator controlled gram load |
| WO2001006146A1 (en) | 1999-07-14 | 2001-01-25 | Material Sciences Corporation | Vibration isolating construction |
| JP2001043647A (ja) | 1999-07-15 | 2001-02-16 | Internatl Business Mach Corp <Ibm> | ハードディスク装置、スライダ保持構造、ヘッド・ジンバル・アッセンブリ及びその製造方法 |
| JP3759344B2 (ja) | 1999-08-02 | 2006-03-22 | アルプス電気株式会社 | 磁気ヘッド及び磁気ヘッドの製造方法 |
| JP2001057039A (ja) | 1999-08-13 | 2001-02-27 | Sony Corp | ヘッドサスペンション、ヘッド・ジンバル組立体およびアクチュエータ |
| US6859345B2 (en) | 1999-08-17 | 2005-02-22 | Seagate Technology Llc | Bending microactuator having a two-piece suspension design |
| JP3804747B2 (ja) | 1999-08-24 | 2006-08-02 | ローム株式会社 | 半導体装置の製造方法 |
| US6335107B1 (en) | 1999-09-23 | 2002-01-01 | Lucent Technologies Inc. | Metal article coated with multilayer surface finish for porosity reduction |
| US6156982A (en) | 1999-09-24 | 2000-12-05 | Honeywell Inc. | Low current high temperature switch contacts |
| US6464428B1 (en) | 1999-09-24 | 2002-10-15 | Mike Mikell | Synthetic hay bale and method of using same |
| US6710373B2 (en) | 1999-09-27 | 2004-03-23 | Shih-Yi Wang | Means for mounting photoelectric sensing elements, light emitting diodes, or the like |
| US6563676B1 (en) | 1999-09-28 | 2003-05-13 | Maxtor Corporation | Disk drive actuator arm |
| US6469386B1 (en) | 1999-10-01 | 2002-10-22 | Samsung Aerospace Industries, Ltd. | Lead frame and method for plating the same |
| US6239953B1 (en) | 1999-10-15 | 2001-05-29 | Magnecomp Corp. | Microactuated disk drive suspension with heightened stroke sensitivity |
| JP4356215B2 (ja) | 1999-11-10 | 2009-11-04 | 凸版印刷株式会社 | フレクシャ及びその製造方法ならびにそれに用いるフレクシャ用基板 |
| JP2001209918A (ja) | 1999-11-19 | 2001-08-03 | Nitto Denko Corp | 回路付サスペンション基板 |
| US6381821B1 (en) | 1999-11-24 | 2002-05-07 | L.A.P. Innovations, Inc. | Emitter barb installation tool and emitter barb cluster |
| US6639761B1 (en) | 1999-12-02 | 2003-10-28 | Seagate Technology Llc | Micro-actuator damping and humidity protection |
| US6953986B2 (en) | 1999-12-10 | 2005-10-11 | Texas Instruments Incorporated | Leadframes for high adhesion semiconductor devices and method of fabrication |
| JP4232301B2 (ja) | 1999-12-14 | 2009-03-04 | ソニー株式会社 | リードフレームの製造方法、及び、半導体装置の製造方法 |
| US6661617B1 (en) | 1999-12-14 | 2003-12-09 | Seagate Technology Llc | Structure and fabrication process for integrated moving-coil magnetic micro-actuator |
| US6549736B2 (en) | 2000-01-19 | 2003-04-15 | Canon Kabushiki Kaisha | Process cartridge, engaging member therefor and method for mounting developing roller and magnet |
| JP3716164B2 (ja) | 2000-02-14 | 2005-11-16 | 株式会社日立グローバルストレージテクノロジーズ | ヘッド支持機構 |
| GB2359069B (en) | 2000-02-14 | 2003-04-23 | Kenneth Edward Marshall | Crimping and decapping tool |
| US6614627B1 (en) | 2000-02-14 | 2003-09-02 | Hitachi, Ltd. | Magnetic disk apparatus |
| JP3611198B2 (ja) | 2000-02-16 | 2005-01-19 | 松下電器産業株式会社 | アクチュエータとこれを用いた情報記録再生装置 |
| JP2001230360A (ja) | 2000-02-18 | 2001-08-24 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
| US6498704B1 (en) | 2000-02-23 | 2002-12-24 | Maxtor Corporation | Disk drive with viscoelastic damper disposed between adjacent load beams |
| US6900967B1 (en) | 2000-02-24 | 2005-05-31 | Magnecomp Corporation | Trace flexure suspension with differential insulator and trace structures for locally tailoring impedance |
| US6414820B1 (en) | 2000-02-24 | 2002-07-02 | Magnecomp Corporation | Trace flexure suspension with differential impedance in read and write conductor circuits |
| US6225684B1 (en) | 2000-02-29 | 2001-05-01 | Texas Instruments Tucson Corporation | Low temperature coefficient leadframe |
| US6570245B1 (en) | 2000-03-09 | 2003-05-27 | Intel Corporation | Stress shield for microelectronic dice |
| US7382582B1 (en) | 2000-03-21 | 2008-06-03 | Magnecomp Corporation | Reduced cross talk in wireless suspensions |
| US6942817B2 (en) | 2000-03-24 | 2005-09-13 | Dainippon Printing Co., Ltd. | Method of manufacturing wireless suspension blank |
| US6647621B1 (en) | 2000-03-24 | 2003-11-18 | Hutchinson Technology Incorporated | Electrical resistance reduction method for thermosetting conductive epoxy contacts in integrated lead suspensions |
| US6549376B1 (en) | 2000-03-31 | 2003-04-15 | John E. Scura | Gimbal suspension with vibration damper |
| JP4104807B2 (ja) | 2000-04-13 | 2008-06-18 | 日本発条株式会社 | ディスク装置用サスペンション |
| US6704157B2 (en) | 2000-04-14 | 2004-03-09 | Seagate Technology Llc | Passive damping method and circuit for data storage device actuator |
| US6480359B1 (en) | 2000-05-09 | 2002-11-12 | 3M Innovative Properties Company | Hard disk drive suspension with integral flexible circuit |
| US6728057B2 (en) | 2000-05-10 | 2004-04-27 | Seagate Technology Llc | Frequency extension method and apparatus for fast rise time writers |
| JP4156203B2 (ja) | 2000-05-22 | 2008-09-24 | 株式会社日立グローバルストレージテクノロジーズ | ディスク装置用サスペンション |
| FR2809747B1 (fr) | 2000-05-30 | 2002-12-20 | Imphy Ugine Precision | Alliage fe-ni durci pour la fabrication de grilles support de circuits integres et procede de fabrication |
| CN1162859C (zh) | 2000-06-08 | 2004-08-18 | 新科实业有限公司 | 采用环形旋转压电执行机构的高密度硬盘驱动器的双级执行机构系统 |
| JP3935309B2 (ja) * | 2000-06-08 | 2007-06-20 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
| US6621653B1 (en) | 2000-06-09 | 2003-09-16 | Hitachi Global Storage Technologies Netherlands B.V. | Secondary actuator system for mode compensation |
| US6493192B2 (en) | 2000-06-22 | 2002-12-10 | Seagate Technology Llc | Disc drive with improved head pitch adjustment |
| WO2002000805A2 (en) | 2000-06-27 | 2002-01-03 | Exxonmobil Chemical Patents Inc. | Adhesives with improved die-cutting performance |
| KR100767275B1 (ko) | 2000-06-27 | 2007-10-17 | 엑손모빌 케미칼 패턴츠 인코포레이티드 | 개선된 다이-절단 성능을 갖는 접착제 |
| US6618220B2 (en) | 2000-07-04 | 2003-09-09 | Matsushita Electric Industrial Co., Ltd. | Head actuator and hard disc drive including the same |
| USD440062S1 (en) | 2000-07-05 | 2001-04-10 | Honda Giken Kogyo Kabushiki Kaisha | Vehicle seat |
| US6308483B1 (en) | 2000-07-07 | 2001-10-30 | Robert L. Romine | Roofing fastener assembly |
| JP2002076229A (ja) | 2000-07-13 | 2002-03-15 | Texas Instruments Inc | 銀めっきを含む半導体のリードフレームおよびその製造方法 |
| DE10038998A1 (de) | 2000-08-10 | 2002-02-21 | Bosch Gmbh Robert | Halbleiterbauelement und Verfahren zur Identifizierung eines Halbleiterbauelementes |
| US6493190B1 (en) | 2000-08-16 | 2002-12-10 | Magnecomp Corporation | Trace flexure with controlled impedance |
| KR100379128B1 (ko) | 2000-08-23 | 2003-04-08 | 주식회사 아큐텍반도체기술 | 삼원합금을 이용한 환경친화적 반도체 장치 제조용 기질 |
| US7256968B1 (en) | 2000-09-11 | 2007-08-14 | Hutchinson Technology Incorporated | Microactuated dimple for head suspensions |
| JP2002093093A (ja) | 2000-09-19 | 2002-03-29 | Tdk Corp | ヘッドジンバルアセンブリ |
| JP3417395B2 (ja) | 2000-09-21 | 2003-06-16 | 松下電器産業株式会社 | 半導体装置用リードフレーム及びその製造方法及びそれを用いた半導体装置 |
| US6452258B1 (en) | 2000-11-06 | 2002-09-17 | Lucent Technologies Inc. | Ultra-thin composite surface finish for electronic packaging |
| KR100756508B1 (ko) | 2000-11-10 | 2007-09-10 | 주식회사 엘지이아이 | 전자레인지의 대류장치 |
| CN1937037A (zh) | 2000-11-28 | 2007-03-28 | 新科实业有限公司 | 带有压电微驱动机构的磁头弹簧片组件 |
| JP2002170607A (ja) | 2000-12-01 | 2002-06-14 | Fujikura Ltd | フレキシブルプリント回路のジャンパー部品、ジャンパー構造及び短絡方法 |
| US7177119B1 (en) | 2000-12-05 | 2007-02-13 | Hutchinson Technology Incorporated | Microactuated head suspension with ring springs |
| KR100371567B1 (ko) | 2000-12-08 | 2003-02-07 | 삼성테크윈 주식회사 | Ａｇ 선도금을 이용한 반도체 패키지용 리드프레임 |
| JP4298911B2 (ja) | 2000-12-15 | 2009-07-22 | 日本発條株式会社 | ディスク装置用サスペンション |
| JP4237394B2 (ja) | 2000-12-27 | 2009-03-11 | 日本発條株式会社 | ディスク装置用サスペンション |
| US7068473B2 (en) | 2001-01-22 | 2006-06-27 | Kinetic Ceramics, Inc. | Piezoelectric microactuator for improved tracking control of disk drive read/write heads |
| DE60227235D1 (de) | 2001-01-24 | 2008-08-07 | Tyco Healthcare | Instrument und verfahren zur durchführung einer anastomose |
| JP2002222578A (ja) | 2001-01-26 | 2002-08-09 | Nitto Denko Corp | 中継フレキシブル配線回路基板 |
| US6798597B1 (en) | 2001-02-02 | 2004-09-28 | Marvell International Ltd. | Write channel having preamplifier and non-uniform transmission line |
| US6490228B2 (en) | 2001-02-16 | 2002-12-03 | Koninklijke Philips Electronics N.V. | Apparatus and method of forming electrical connections to an acoustic transducer |
| US6760182B2 (en) | 2001-02-19 | 2004-07-06 | Seagate Technology Llc | Temperature compensated fly height control |
| JP3792521B2 (ja) | 2001-02-23 | 2006-07-05 | アルプス電気株式会社 | 磁気ヘッド装置 |
| JP4277455B2 (ja) | 2001-02-27 | 2009-06-10 | Ｔｄｋ株式会社 | ヘッドジンバルアセンブリ |
| US20020117740A1 (en) | 2001-02-28 | 2002-08-29 | Advanced Semiconductor Engineering Inc. | Lead frame for plastic molded type semiconductor package |
| JP2002269713A (ja) | 2001-03-12 | 2002-09-20 | Tdk Corp | ヘッド支持体の加工方法 |
| JP2002299538A (ja) | 2001-03-30 | 2002-10-11 | Dainippon Printing Co Ltd | リードフレーム及びそれを用いた半導体パッケージ |
| US6714385B1 (en) | 2001-04-16 | 2004-03-30 | Hutchinson Technology Inc. | Apparatus and method for controlling common mode impedance in disk drive head suspensions |
| US6977790B1 (en) | 2001-05-04 | 2005-12-20 | Maxtor Corporation | Design scheme to increase the gain of strain based sensors in hard disk drive actuators |
| TW486170U (en) | 2001-05-08 | 2002-05-01 | Hon Hai Prec Ind Co Ltd | Electrical connector positioning device |
| US20020185716A1 (en) | 2001-05-11 | 2002-12-12 | Abys Joseph Anthony | Metal article coated with multilayer finish inhibiting whisker growth |
| US6760196B1 (en) | 2001-12-12 | 2004-07-06 | Western Digital, Inc. | Microactuator with offsetting hinges and method for high-resolution positioning of magnetic read/write head |
| US6376964B1 (en) | 2001-05-16 | 2002-04-23 | Read-Rite Corporation | Collocated rotating flexure microactuator for dual-stage servo in disk drives |
| US6704158B2 (en) | 2001-06-05 | 2004-03-09 | Western Digital (Fremont), Inc. | Shear mode multilayered collocated micro-actuator for dual-stage servo controllers in disk drives |
| US6898042B2 (en) | 2001-05-23 | 2005-05-24 | Seagate Technology Llc | Slider level microactuator with integrated fly control |
| CN1288629C (zh) | 2001-05-23 | 2006-12-06 | 西加特技术有限责任公司 | 具有一复合材料层的存储装置用的加强悬架 |
| US6711930B2 (en) | 2001-06-01 | 2004-03-30 | Telect, Inc. | Fiber optic cable trough component notching system |
| JP2004530249A (ja) | 2001-06-08 | 2004-09-30 | シーゲイト テクノロジー エルエルシー | Ｚ軸導電性接着フィルムを使用したヘッド・ジンバル・アセンブリのプリント回路板への取付け |
| CA103845S (en) | 2001-06-12 | 2004-06-30 | Porsche Ag | Actuator device for a vehicle seat |
| US20030025182A1 (en) | 2001-06-22 | 2003-02-06 | Abys Joseph A. | Metal article coated with tin or tin alloy under tensile stress to inhibit whisker growth |
| US6856075B1 (en) | 2001-06-22 | 2005-02-15 | Hutchinson Technology Incorporated | Enhancements for adhesive attachment of piezoelectric motor elements to a disk drive suspension |
| US7006333B1 (en) | 2001-06-28 | 2006-02-28 | Magnecomp Corporation | Suspension with flexure mounted microactuator |
| JP4144196B2 (ja) | 2001-07-04 | 2008-09-03 | 新科實業有限公司 | 振動抑制機構及び振動抑制機構を備えたヘッドジンバルアセンブリ |
| JP4144198B2 (ja) | 2001-07-04 | 2008-09-03 | 新科實業有限公司 | 振動抑制機構及び振動抑制機構を備えたヘッドジンバルアセンブリ |
| JP4144197B2 (ja) | 2001-07-04 | 2008-09-03 | 新科實業有限公司 | 振動抑制機構及び振動抑制機構を備えたヘッドジンバルアセンブリ |
| US6967821B2 (en) | 2001-07-10 | 2005-11-22 | Seagate Technology Llc | Head gimbal assembly including dampening for air bearing vibration |
| JP2003031684A (ja) | 2001-07-11 | 2003-01-31 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
| JP4144199B2 (ja) | 2001-07-13 | 2008-09-03 | 新科實業有限公司 | 振動抑制機構及び振動抑制機構を備えたヘッドジンバルアセンブリ |
| JP3692314B2 (ja) | 2001-07-17 | 2005-09-07 | 日東電工株式会社 | 配線回路基板 |
| US7016159B1 (en) | 2001-07-24 | 2006-03-21 | Hutchinson Technology Incorporated | Disk drive head suspension with spring rails for base plate microactuation |
| US6894876B1 (en) | 2001-08-01 | 2005-05-17 | Magnecomp Corporation | Microactuated suspension with shear transmission of force |
| IL160268A0 (en) | 2001-08-06 | 2004-07-25 | Method and means for connecting barbed tubular connectors | |
| US6741424B1 (en) | 2001-08-31 | 2004-05-25 | Hutchinson Technology, Inc. | Head suspension with rail and stiffener combination |
| US6757137B1 (en) | 2001-09-30 | 2004-06-29 | Magnecomp Corporation | Stiffness controlled disk drive suspension with limiter feature |
| US7241302B2 (en) | 2001-10-18 | 2007-07-10 | Tyco Healthcare Group Lp | Anastomosis instrument and method for performing same |
| US20030128474A1 (en) | 2001-11-09 | 2003-07-10 | Schulz Kevin J. | Low electrical impedance slider grounding |
| JP3631992B2 (ja) | 2001-11-13 | 2005-03-23 | 日東電工株式会社 | 配線回路基板 |
| US7336436B2 (en) | 2004-07-29 | 2008-02-26 | Samsung Electronics Co., Ltd. | Head gimbal assemblies for very low flying height heads with optional micro-actuators in a hard disk drive |
| US7612967B2 (en) | 2001-12-05 | 2009-11-03 | Samsung Electronics Co., Ltd. | Method and apparatus coupling at least one piezoelectric device to a slider in a hard disk drive for microactuation |
| US6961221B1 (en) | 2001-12-18 | 2005-11-01 | Western Digital (Fremont), Inc. | Piezoelectric microactuators with substantially fixed axis of rotation and magnified stroke |
| JP4397556B2 (ja) | 2001-12-18 | 2010-01-13 | Ｔｄｋ株式会社 | 磁気ヘッド用サスペンションの製造方法 |
| US6796018B1 (en) | 2001-12-21 | 2004-09-28 | Western Digital (Fremont), Inc. | Method of forming a slider/suspension assembly |
| WO2003060886A1 (en) | 2002-01-19 | 2003-07-24 | Sae Magnetics (H.K.) Ltd. | Method and apparatus for the physical and electrical coupling of a hard disk micro-actuator and magnetic head to a drive arm suspension |
| JP2003223771A (ja) | 2002-01-25 | 2003-08-08 | Hitachi Ltd | ヘッドスライダ支持機構及びヘッド組み立て体並びに記録再生装置 |
| US6713852B2 (en) | 2002-02-01 | 2004-03-30 | Texas Instruments Incorporated | Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin |
| JP3929319B2 (ja) | 2002-02-01 | 2007-06-13 | 富士通株式会社 | サスペンション及び磁気記録読出装置 |
| WO2003067576A1 (en) | 2002-02-02 | 2003-08-14 | Sae Magnetics (H.K.) Ltd. | Head gimbal assembly with precise positioning actuator for head element, disk drive apparatus with the head gimbal assembly, and manufacturing method of the head gimbal assembly |
| JP2003234549A (ja) | 2002-02-07 | 2003-08-22 | Nitto Denko Corp | フレキシブル配線板 |
| US6980400B2 (en) | 2002-02-26 | 2005-12-27 | Applied Kinetics, Inc. | Limiter for integral flexible circuit suspension assembly |
| US6847505B2 (en) | 2002-03-14 | 2005-01-25 | Hitachi Global Storage Technologies, The Netherlands B.V. | Electrostatic discharge protection for disk drive integrated lead suspension |
| JP3877631B2 (ja) | 2002-04-10 | 2007-02-07 | 日本発条株式会社 | ディスクドライブ用サスペンションの配線部材 |
| US6833978B2 (en) | 2002-04-24 | 2004-12-21 | Hitachi Global Storage Technologies | Micro-actuator integrated lead suspension head terminations |
| US6765761B2 (en) | 2002-04-24 | 2004-07-20 | International Business Machines Corp. | Swageless mount plate or unimount arm based milliactuated suspension |
| JP2003317413A (ja) | 2002-04-26 | 2003-11-07 | Hitachi Ltd | ディスク装置 |
| US7079357B1 (en) | 2002-04-30 | 2006-07-18 | Magnecomp Corporation | Additive-process suspension interconnect with controlled noise |
| US6975488B1 (en) | 2002-04-30 | 2005-12-13 | Magnecomp Corporation | Suspension interconnect with controlled noise |
| US7158348B2 (en) | 2002-05-01 | 2007-01-02 | Hitachi Global Storage Technologies Netherlands B.V. | Integrated lead suspension for use in a disk drive using a tri-metal laminate and method for fabrication |
| US7072144B2 (en) | 2002-05-07 | 2006-07-04 | Hitachi Global Storage Technologies Netherlands B.V. | Damping of vertical and offtrack dynamic modes gain at the slider in a disc drive |
| US20030218236A1 (en) | 2002-05-24 | 2003-11-27 | Wright Lance Cole | Chip carrier tape |
| US6866958B2 (en) | 2002-06-05 | 2005-03-15 | General Motors Corporation | Ultra-low loadings of Au for stainless steel bipolar plates |
| US7318590B2 (en) | 2002-06-19 | 2008-01-15 | Ali Razavi | Pattern adhesive seal products and method of production |
| JP2004039056A (ja) | 2002-07-01 | 2004-02-05 | Fujikura Ltd | 回路一体型サスペンション及びフレキシブル回路基板並びにそれらの製造方法 |
| US7161767B2 (en) | 2002-07-16 | 2007-01-09 | Sae Magnetics (H.K.) Ltd. | Wireless suspension design with ground plane structure |
| US6737931B2 (en) | 2002-07-19 | 2004-05-18 | Agilent Technologies, Inc. | Device interconnects and methods of making the same |
| US7006336B2 (en) | 2002-08-06 | 2006-02-28 | International Business Machines Corporation | Magnetic head having a heater circuit for thermally-assisted writing |
| WO2004019321A1 (en) | 2002-08-26 | 2004-03-04 | Sae Magnetics (H.K.) Ltd. | A suspension design for the co-located pzt micro-actuator |
| US7218481B1 (en) | 2002-10-07 | 2007-05-15 | Hutchinson Technology Incorporated | Apparatus for insulating and electrically connecting piezoelectric motor in dual stage actuator suspension |
| US7023667B2 (en) | 2002-10-07 | 2006-04-04 | Hitachi Global Storage Technologies Netherlands B.V. | Dual stage suspension with PZT actuators arranged to improve actuation in suspensions of short length |
| JP3891912B2 (ja) | 2002-10-09 | 2007-03-14 | 日本発条株式会社 | ディスクドライブ用サスペンション |
| CN1685400B (zh) | 2002-10-09 | 2010-12-08 | 新科实业有限公司 | 硬盘驱动器的双级微致动器和悬架设计的集成方法和设备 |
| US7064928B2 (en) | 2002-10-11 | 2006-06-20 | Sae Magnetics (H.K.) Ltd. | Method and apparatus for providing an additional ground pad and electrical connection for grounding a magnetic recording head |
| US6789593B1 (en) | 2002-10-29 | 2004-09-14 | John Hui | Hole puncher and reinforcer |
| US6581262B1 (en) | 2002-10-29 | 2003-06-24 | Michael Myers | Installation tool for irrigation emitter barbs |
| US6801402B1 (en) | 2002-10-31 | 2004-10-05 | Western Digital Technologies, Inc. | ESD-protected head gimbal assembly for use in a disk drive |
| US6870091B2 (en) | 2002-11-01 | 2005-03-22 | Interplex Nas, Inc. | Two-piece electrical RF shield and method of manufacturing the same |
| WO2004042706A1 (en) | 2002-11-04 | 2004-05-21 | Sae Magnetics (H.K.) Ltd. | Precise positioning actuator for head element, head gimbal assembly with the actuator and disk drive apparatus with the head gimbal assembly |
| US6922305B2 (en) | 2002-11-18 | 2005-07-26 | Hitachi Global Storage Technologies Netherlands B.V. | Apparatus and method for reducing vibrational excitation in storage devices with dual stage actuators |
| US6802496B1 (en) | 2002-12-09 | 2004-10-12 | John Preta | Fence bracket system and fence system using the fence bracket system |
| JP4076434B2 (ja) | 2002-12-12 | 2008-04-16 | 株式会社日立グローバルストレージテクノロジーズ | 磁気ヘッド及びヘッド・ジンバル・アセンブリ |
| DE10260009B4 (de) | 2002-12-18 | 2007-12-27 | Gatzen, Hans-Heinrich, Prof. Dr.-Ing. | Schreib-/Lesekopf mit integriertem Mikroaktor |
| US7057857B1 (en) | 2002-12-20 | 2006-06-06 | Western Digital (Fremont), Inc. | Dimple pivot post for a rotary co-located microactuator |
| US20040125508A1 (en) | 2002-12-27 | 2004-07-01 | Kr Precision Public Company Limited | Method and apparatus for forming a plurality of actuation devices on suspension structures for hard disk drive suspension |
| US7375930B2 (en) | 2002-12-27 | 2008-05-20 | Magnecomp Corporation | Apparatus for PZT actuation device for hard disk drives |
| WO2004084219A1 (en) | 2003-03-17 | 2004-09-30 | Sae Magnetics (H.K) Ltd. | System and method for manufacturing a hard disk drive suspension flexure and for preventing damage due to electrical arcing |
| KR100528333B1 (ko) | 2003-03-27 | 2005-11-16 | 삼성전자주식회사 | 하드디스크 드라이브의 헤드-김발 조립체 |
| JP2004300489A (ja) | 2003-03-31 | 2004-10-28 | Nisshin Steel Co Ltd | ステンレス鋼製電気接点 |
| CN100352876C (zh) | 2003-04-10 | 2007-12-05 | 优泊公司 | 粘着加工薄片 |
| JP3964822B2 (ja) | 2003-05-07 | 2007-08-22 | 日東電工株式会社 | 回路付サスペンション基板の製造方法 |
| US7322999B2 (en) | 2003-05-09 | 2008-01-29 | Atrion Medical Products, Inc. | Tissue punch and method for creating an anastomosis for locating a bypass graft |
| JP4178077B2 (ja) | 2003-06-04 | 2008-11-12 | 日東電工株式会社 | 配線回路基板 |
| US20040264056A1 (en) | 2003-06-26 | 2004-12-30 | Eunkyu Jang | Symmetric interconnect design for a flexure arm of a hard disk drive |
| US20050010241A1 (en) | 2003-07-09 | 2005-01-13 | Keith Milliman | Anastomosis instrument and method for performing same |
| WO2005008726A2 (en) | 2003-07-09 | 2005-01-27 | Newport Corporation | Flip chip device assembly machine |
| US6969932B2 (en) | 2003-07-18 | 2005-11-29 | General Electric Co. | Application of corrosion protective coating for extending the lifetime of water cooled stator bar clips |
| US7538983B1 (en) | 2003-07-29 | 2009-05-26 | Meyer Dallas W | Micropositioner recording head for a magnetic storage device |
| US6831539B1 (en) | 2003-08-28 | 2004-12-14 | Seagate Technology Llc | Magnetic microactuator for disc with integrated head connections and limiters drives |
| JP4019034B2 (ja) | 2003-09-22 | 2007-12-05 | 日東電工株式会社 | 回路付サスペンション基板の製造方法 |
| US7099117B1 (en) | 2003-09-30 | 2006-08-29 | Western Digital Technologies, Inc. | Head stack assembly including a trace suspension assembly backing layer and a ground trace for grounding a slider |
| US8064172B2 (en) | 2003-11-13 | 2011-11-22 | Samsung Electronics Co., Ltd. | Method and apparatus coupling to a slider in a hard disk drive for microactuation |
| US7489493B2 (en) | 2003-12-01 | 2009-02-10 | Magnecomp Corporation | Method to form electrostatic discharge protection on flexible circuits using a diamond-like carbon material |
| US7420778B2 (en) | 2003-12-22 | 2008-09-02 | Seagate Technology Llc | Suspension component with sealed damping layer |
| KR100532496B1 (ko) | 2004-01-19 | 2005-11-30 | 삼성전자주식회사 | 플렉셔 리미터를 가진 서스펜션 조립체와 이를 채용한디스크 드라이브용 액츄에이터 |
| EP1557449A1 (en) | 2004-01-22 | 2005-07-27 | 3M Innovative Properties Company | Adhesive tape for structural bonding |
| US20080019120A1 (en) | 2004-01-27 | 2008-01-24 | Carmen Rapisarda | Lighting systems for attachment to wearing apparel |
| US8902603B2 (en) | 2004-02-06 | 2014-12-02 | Carmen Rapisarda | Solder and lead free electronic circuit and method of manufacturing same |
| US20050180053A1 (en) | 2004-02-18 | 2005-08-18 | Headway Technologies, Inc. | Cross talk and EME minimizing suspension design |
| US7384531B1 (en) | 2004-02-19 | 2008-06-10 | Hutchinson Technology Incorporated | Plated ground features for integrated lead suspensions |
| US8753354B2 (en) | 2004-03-09 | 2014-06-17 | John P. Cole | Enhanced follicular extraction punch and method |
| US7268981B2 (en) * | 2004-04-30 | 2007-09-11 | Hitachi Global Storage Technologies Netherlands B.V. | Spin valve sensor having antiferromagnetic (AFM) pinning layer structures formed in the end regions |
| WO2005114658A2 (en) | 2004-05-14 | 2005-12-01 | Hutchinson Technology Incorporated | Method for making noble metal conductive leads for suspension assemblies |
| JP4032043B2 (ja) | 2004-06-02 | 2008-01-16 | アルプス電気株式会社 | 磁気ヘッド装置の製造方法 |
| US7283331B2 (en) | 2004-06-04 | 2007-10-16 | Samsung Electronics, Co., Ltd. | Method and apparatus reducing off track head motion due to disk vibration in a hard disk drive |
| US7342750B2 (en) | 2004-06-16 | 2008-03-11 | Sae Magnetics (H.K.) Ltd. | Method for providing electrical crossover in a laminated structure |
| JP4343049B2 (ja) | 2004-07-13 | 2009-10-14 | 富士通株式会社 | ハードディスクドライブのキャリッジアセンブリ |
| US7403357B1 (en) | 2004-08-05 | 2008-07-22 | Maxtor Corporation | Disk drive flexure assembly with a plurality of support bond pad apertures with a bond pad disposed over a bond pad support and part of each support bond pad aperture |
| JP2006049751A (ja) | 2004-08-09 | 2006-02-16 | Hitachi Global Storage Technologies Netherlands Bv | 磁気ディスク装置と、その配線接続構造及び端子構造 |
| US7345851B2 (en) | 2004-08-26 | 2008-03-18 | Hitachi Global Storage Technologies Netherlands B.V. | Disk drive with rotary piezoelectric microactuator |
| CN102544027B (zh) * | 2004-09-15 | 2016-02-17 | 株式会社半导体能源研究所 | 半导体器件 |
| US7724476B1 (en) | 2004-09-16 | 2010-05-25 | Hutchinson Technology Incorporated | Coined headlift with formed rail offset for a disk drive head suspension component |
| US7466520B2 (en) | 2004-10-07 | 2008-12-16 | Seagate Technology Llc | Co-located microactuator lever assembly |
| JP2006201041A (ja) | 2005-01-20 | 2006-08-03 | Oki Electric Ind Co Ltd | 加速度センサ |
| KR100897671B1 (ko) | 2005-02-04 | 2009-05-14 | 삼성전기주식회사 | 회절형 광변조기 |
| JP2006221726A (ja) | 2005-02-09 | 2006-08-24 | Fujitsu Ltd | 磁気ヘッドアセンブリ |
| US7185409B1 (en) | 2005-02-17 | 2007-03-06 | Michael Myers | Installation tool for irrigation emitter barbs with cutter |
| JP4386863B2 (ja) | 2005-02-21 | 2009-12-16 | 日本発條株式会社 | ヘッド・サスペンション |
| JP4326484B2 (ja) | 2005-02-21 | 2009-09-09 | 日本発條株式会社 | ヘッドサスペンション |
| CN1828726B (zh) | 2005-02-28 | 2010-04-28 | 新科实业有限公司 | 可旋转压电微驱动器及其磁头折片组合和磁盘驱动单元 |
| CN1828727A (zh) | 2005-02-28 | 2006-09-06 | 新科实业有限公司 | 微驱动器及其磁头折片组合和磁盘驱动单元 |
| US7663841B2 (en) | 2005-02-28 | 2010-02-16 | Seagate Technology Llc | Resonance control features for a head gimbal assembly |
| JP3742422B1 (ja) | 2005-03-17 | 2006-02-01 | 日立マクセル株式会社 | 扁平形電池 |
| JP4727264B2 (ja) | 2005-03-17 | 2011-07-20 | 日本発條株式会社 | ヘッド・サスペンション |
| US7131694B1 (en) | 2005-04-29 | 2006-11-07 | Buffa John A | Adjustable lumbar support for vehicle seat |
| US7408745B2 (en) | 2005-05-10 | 2008-08-05 | Sae Magnetics (H.K.) Ltd. | Sway-type micro-actuator with slider holding arms for a disk drive head gimbal assembly |
| US7821742B1 (en) | 2005-05-12 | 2010-10-26 | Magnecomp Corporation | High stroke sensitivity suspension with laminate load beam for additive laminated and other interconnect support |
| US7902639B2 (en) | 2005-05-13 | 2011-03-08 | Siluria Technologies, Inc. | Printable electric circuits, electronic components and method of forming the same |
| US7701673B2 (en) | 2005-05-17 | 2010-04-20 | Sae Magnetics (Hk) Ltd. | Gimbal design with solder ball bond pads and trailing edge limiter tab for a recording head |
| JP4363658B2 (ja) | 2005-05-27 | 2009-11-11 | 日本発條株式会社 | ヘッド・サスペンション |
| US20060274453A1 (en) | 2005-06-02 | 2006-12-07 | Arya Satya P | Method for utilizing a stainless steel framework for changing the resonance frequency range of a flexure nose portion of a head gimbal assembly |
| US20060274452A1 (en) | 2005-06-02 | 2006-12-07 | Arya Satya P | Method for utilizing a suspension flexure polyimide material web to dampen a flexure nose portion of a head gimbal assembly |
| US20060279880A1 (en) | 2005-06-08 | 2006-12-14 | Seagate Technology Llc | Suspension with sway beam micropositioning |
| US20070005072A1 (en) | 2005-06-18 | 2007-01-04 | Ortho Impact Inc. | Pedicle punch |
| US7846164B2 (en) | 2005-06-18 | 2010-12-07 | Ortho Impact Corporation | Pedicle punch with cannula |
| US7417830B1 (en) | 2005-08-31 | 2008-08-26 | Magnecomp Corporation | Head gimbal assembly with dual-mode piezo microactuator |
| US7781679B1 (en) * | 2005-09-09 | 2010-08-24 | Magnecomp Corporation | Disk drive suspension via formation using a tie layer and product |
| US8553364B1 (en) | 2005-09-09 | 2013-10-08 | Magnecomp Corporation | Low impedance, high bandwidth disk drive suspension circuit |
| JP2007115864A (ja) | 2005-10-20 | 2007-05-10 | Nitto Denko Corp | 配線回路基板およびその製造方法 |
| BE1016816A5 (fr) | 2005-10-21 | 2007-07-03 | Son Paul | Dispositif de fermeture pour conteneur de boisson ou autre liquide et conteneur muni d'un tel dispositif. |
| US7983008B2 (en) | 2005-10-24 | 2011-07-19 | The Chinese University Of Hong Kong | Piezoelectric actuated suspension with passive damping in hard disk drives |
| US7595965B1 (en) | 2005-11-18 | 2009-09-29 | Magnecomp Corporation | Single PZT actuator for effecting rotation of head suspension loads |
| US7293994B2 (en) | 2005-12-08 | 2007-11-13 | International Business Machines Corporation | Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member |
| JP4330580B2 (ja) | 2005-12-09 | 2009-09-16 | 日本発條株式会社 | 多層グランド層のヘッド・サスペンション及びその製造方法、多層グランド層のフレキシャ及びその製造方法 |
| US7768746B2 (en) | 2005-12-29 | 2010-08-03 | Sae Magnetics (H.K.) Ltd. | Rotational micro-actuator with a rotatable plate, head gimbal assembly and disk drive device with the same |
| KR100745756B1 (ko) | 2006-01-04 | 2007-08-02 | 삼성전자주식회사 | 마이크로 액츄에이터 및 이를 채용한 정보저장장치 |
| US8395865B2 (en) | 2006-01-10 | 2013-03-12 | Seagate Technology Llc | Thermally insulated suspension load beam |
| US7813083B2 (en) | 2006-01-18 | 2010-10-12 | Maxtor Corporation | Disk drive load arm structure having a strain sensor and method of its fabrication |
| US7636222B1 (en) | 2006-02-10 | 2009-12-22 | Maxtor Corporation | Tuned mass actuator arms for decreasing track misregistration in a depopulated head suspension disk drive |
| US7719798B2 (en) | 2006-02-14 | 2010-05-18 | Sae Magnetics (H.K.) Ltd. | Rotational micro-actuator integrated with suspension of head gimbal assembly, and disk drive unit with the same |
| JP2007220785A (ja) | 2006-02-15 | 2007-08-30 | Nippon Steel Materials Co Ltd | 導電性金属層付きステンレス基体とその製造方法及びハードディスクサスペンション材料、ハードディスクサスペンション |
| US7459835B1 (en) | 2006-03-06 | 2008-12-02 | Magnecomp Corporation | Loading-protected bending microactuator in additive suspensions |
| US7551405B2 (en) | 2006-03-22 | 2009-06-23 | Sae Magnetics (H.K.) Ltd. | Rotational PZT micro-actuator with fine head position adjustment capacity, head gimbal assembly, and disk drive unit with same |
| US7518830B1 (en) | 2006-04-19 | 2009-04-14 | Hutchinson Technology Incorporated | Dual sided electrical traces for disk drive suspension flexures |
| US20070254796A1 (en) | 2006-04-26 | 2007-11-01 | Kurtz Anthony D | Method and apparatus for preventing catastrophic contact failure in ultra high temperature piezoresistive sensors and transducers |
| JP4749221B2 (ja) | 2006-05-01 | 2011-08-17 | 日東電工株式会社 | 配線回路基板 |
| US7649254B2 (en) | 2006-05-01 | 2010-01-19 | Flextronics Ap, Llc | Conductive stiffener for a flexible substrate |
| WO2007148728A1 (ja) | 2006-06-22 | 2007-12-27 | Dai Nippon Printing Co., Ltd. | サスペンション用基板およびその製造方法 |
| JP4916235B2 (ja) | 2006-06-29 | 2012-04-11 | 日東電工株式会社 | 配線回路基板 |
| US7460337B1 (en) | 2006-06-30 | 2008-12-02 | Magnecomp Corporation | Low density, high rigidity disk drive suspension for high resonance frequency applications |
| US7593191B2 (en) | 2006-07-26 | 2009-09-22 | Sae Magnetics (H.K.) Ltd. | HGA having separate dimple element, disk drive unit with the same, and manufacturing method thereof |
| US7660079B2 (en) | 2006-07-31 | 2010-02-09 | Sae Magnetics (H.K.) Ltd. | Method and system of using a step plate mechanically formed in a disk drive suspension flexure to mount a micro-actuator to the flexure |
| US7688552B2 (en) | 2006-08-09 | 2010-03-30 | Sae Magnetics (H.K.) Ltd. | Head gimbal assembly having dimple-shaft limiter and manufacturing method thereof and disk drive unit with the same |
| US7710687B1 (en) | 2006-09-13 | 2010-05-04 | Hutchinson Technology Incorporated | High conductivity ground planes for integrated lead suspensions |
| US7875804B1 (en) | 2006-09-27 | 2011-01-25 | Hutchinson Technology Incorporated | Plated ground features for integrated lead suspensions |
| US20080084638A1 (en) | 2006-10-09 | 2008-04-10 | Seagate Technology Llc | Material Selection for a Suspension Assembly |
| US7929252B1 (en) | 2006-10-10 | 2011-04-19 | Hutchinson Technology Incorporated | Multi-layer ground plane structures for integrated lead suspensions |
| US7832082B1 (en) | 2006-10-10 | 2010-11-16 | Hutchinson Technology Incorporated | Method for manufacturing an integrated lead suspension component |
| US7826177B1 (en) | 2006-10-18 | 2010-11-02 | Western Digital Technologies, Inc. | Flexure having arms with reduced centroid offset for supporting a head in a disk drive |
| US7835113B1 (en) | 2006-10-27 | 2010-11-16 | Hutchinson Technology Incorporated | Deep dimple structure for head suspension component |
| US7567410B1 (en) | 2006-10-31 | 2009-07-28 | Western Digital Technologies, Inc. | Flexure including a heat sink and a dielectric layer under trace termination pads |
| US7560303B2 (en) | 2006-11-07 | 2009-07-14 | Avery Dennison Corporation | Method and apparatus for linear die transfer |
| US20080144225A1 (en) | 2006-12-14 | 2008-06-19 | Sae Magnetics (H.K.) Ltd. | Techniques for reducing flexure distortion and gimbal separation for thin-film PZT micro-actuators of head gimbal assemblies |
| US7804663B2 (en) | 2006-12-20 | 2010-09-28 | Hitachi Global Storage Technologies Netherlands B.V. | High frequency interconnect signal transmission lines |
| US7697237B1 (en) | 2007-01-11 | 2010-04-13 | Hutchinson Technology Incorporated | Shielded copper-dielectric flexure for disk drive head suspensions |
| US7710688B1 (en) | 2007-02-06 | 2010-05-04 | Hutchinson Technology Incorporated | Split embedded signal transmission planes in integrated lead disk drive suspensions |
| US7835112B2 (en) * | 2007-02-12 | 2010-11-16 | Hutchinson Technology Incorporated | Integrated lead flexure with embedded traces |
| US20080198511A1 (en) | 2007-02-20 | 2008-08-21 | Toshiki Hirano | Suspension for a hard disk drive microactuator |
| US7813084B1 (en) | 2007-02-22 | 2010-10-12 | Hutchinson Technology Incorporated | Co-planar shielded write traces for disk drive head suspensions |
| JP2008234748A (ja) | 2007-03-19 | 2008-10-02 | Fujitsu Ltd | 振動センサを備えたヘッドサスペンション及びその製造方法。 |
| US8097811B2 (en) | 2007-04-04 | 2012-01-17 | Dai Nippon Printing Co., Ltd. | Substrate for suspension |
| US8157947B2 (en) | 2007-04-27 | 2012-04-17 | Applied Ft Composite Solutions Inc. | Method and apparatus for fabricating composite protective material |
| US7986494B2 (en) | 2007-05-04 | 2011-07-26 | Hutchinson Technology Incorporated | Integrated lead head suspension with tapered trace spacing |
| US8379349B1 (en) | 2007-05-04 | 2013-02-19 | Hutchinson Technology Incorporated | Trace jumpers for disc drive suspensions |
| US7782572B2 (en) | 2007-05-04 | 2010-08-24 | Hutchinson Technology Incorporated | Disk drive head suspension flexures having alternating width stacked leads |
| US8125741B2 (en) | 2007-07-20 | 2012-02-28 | Magnecomp Corporation | Rotational, shear mode, piezoelectric motor integrated into a collocated, rotational, shear mode, piezoelectric micro-actuated suspension, head or head/gimbal assembly for improved tracking in disk drives and disk drive equipment |
| US8169745B2 (en) | 2007-07-25 | 2012-05-01 | Sae Magnetics (H.K.) Ltd. | Head gimbal assembly having balanced weight, and disk drive unit with the same |
| USD626349S1 (en) | 2007-08-16 | 2010-11-02 | Johnson Controls Technology Company | Vehicle seat |
| US8085506B1 (en) | 2007-08-27 | 2011-12-27 | Magnecomp Corporation | Disk drive gimbal having a stable pitch static attitude and related method of manufacture |
| JP4839293B2 (ja) | 2007-10-04 | 2011-12-21 | 日本発條株式会社 | ヘッドサスペンション、ロードビーム、及びロードビームの製造方法 |
| WO2009044489A1 (ja) | 2007-10-05 | 2009-04-09 | Fujitsu Limited | マイクロアクチュエータ装置並びにヘッドサスペンションアセンブリおよび記憶媒体駆動装置 |
| JP4954013B2 (ja) | 2007-10-11 | 2012-06-13 | 日本発條株式会社 | ヘッドサスペンション、ロードビーム、及びロードビームの製造方法 |
| US7924530B1 (en) | 2007-11-14 | 2011-04-12 | Magnecomp Corporation | Head suspension having a punched gimbal dimple with coined inclined inner and outer surfaces oriented at different angles and method of fabricating same |
| JP5032949B2 (ja) | 2007-11-14 | 2012-09-26 | エイチジーエスティーネザーランドビーブイ | マイクロアクチュエータ、ヘッド・ジンバル・アセンブリ及びディスク・ドライブ装置 |
| US20090147407A1 (en) | 2007-12-10 | 2009-06-11 | Fu-Ying Huang | Integrated flexure tongue micro-actuator |
| US8179629B2 (en) | 2007-12-26 | 2012-05-15 | Nitto Denko Corporation | Flexure based shock and vibration sensor for head suspensions in hard disk drives |
| EP2229471B1 (en) | 2008-01-08 | 2015-03-11 | Treadstone Technologies, Inc. | Highly electrically conductive surfaces for electrochemical applications |
| JP4796084B2 (ja) | 2008-01-22 | 2011-10-19 | 日本発條株式会社 | ヘッドサスペンションの製造方法、製造装置、及び製造用治具、並びにヘッドサスペンション |
| US8085508B2 (en) | 2008-03-28 | 2011-12-27 | Hitachi Global Storage Technologies Netherlands B.V. | System, method and apparatus for flexure-integrated microactuator |
| US8004798B1 (en) | 2008-03-31 | 2011-08-23 | Magnecomp Corporation | High bandwidth flexure for hard disk drives |
| US8169746B1 (en) | 2008-04-08 | 2012-05-01 | Hutchinson Technology Incorporated | Integrated lead suspension with multiple trace configurations |
| US8259416B1 (en) | 2008-05-09 | 2012-09-04 | Hutchinson Technology Incorporated | Head suspension having viscoelastic load point |
| JP2009277306A (ja) | 2008-05-16 | 2009-11-26 | Fujitsu Ltd | ヘッドサスペンションアセンブリおよび記憶媒体駆動装置 |
| US8194359B2 (en) | 2008-05-21 | 2012-06-05 | Sae Magnetics (H.K.) Ltd. | Piezoelectric element having etched portion to form stepped recesses between layers and manufacturing method thereof, head gimbal assembly, and disk drive device with the same |
| US20110159767A1 (en) | 2008-06-12 | 2011-06-30 | Teijin Limited | Nonwoven fabric, felt and production processes therefor |
| USD592413S1 (en) | 2008-06-17 | 2009-05-19 | Honda Motor Co., Ltd. | Vehicle seat |
| US8154827B2 (en) | 2008-07-14 | 2012-04-10 | Hitachi Global Storage Technologies Netherlands B.V. | Integrated lead suspension with multiple crossover coplanar connection of the electrically conductive traces |
| JP5318703B2 (ja) | 2008-09-08 | 2013-10-16 | 日本発條株式会社 | 圧電素子の電気的接続構造、圧電アクチュエータ、ヘッドサスペンション、及び導電性部材の電気的接続構造 |
| JP5100589B2 (ja) | 2008-09-19 | 2012-12-19 | 日本発條株式会社 | ヘッドサスペンション |
| JP5053217B2 (ja) | 2008-09-24 | 2012-10-17 | 日本発條株式会社 | ヘッドサスペンション |
| CN101714359B (zh) | 2008-10-03 | 2012-05-02 | 日本发条株式会社 | 头悬架及制造头悬架的方法 |
| US8120878B1 (en) | 2008-10-17 | 2012-02-21 | Hutchinson Technology Incorporated | Tubular stiffening rails for head suspension components |
| US8254062B2 (en) | 2008-10-20 | 2012-08-28 | Seagate Technology Llc | Recessed base plate for data transducer suspension |
| US8144435B2 (en) | 2008-10-20 | 2012-03-27 | Seagate Technology Llc | Cost reduced microactuator suspension |
| US8149545B1 (en) | 2008-10-23 | 2012-04-03 | Magnecomp Corporation | Low profile load beam with etched cavity for PZT microactuator |
| JP4547035B2 (ja) | 2008-11-10 | 2010-09-22 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
| US8289656B1 (en) | 2008-11-19 | 2012-10-16 | Western Digital Technologies, Inc. | Disk drive comprising stacked and stepped traces for improved transmission line performance |
| JP2010123195A (ja) | 2008-11-19 | 2010-06-03 | Hitachi Global Storage Technologies Netherlands Bv | ヘッド・ジンバル・アセンブリ、マイクロアクチュエータ及びマイクロアクチュエータの製造方法 |
| JP2010135002A (ja) | 2008-12-04 | 2010-06-17 | Toshiba Storage Device Corp | 磁気ディスク装置、アクチュエータアームおよびサスペンション |
| JP5570111B2 (ja) | 2008-12-18 | 2014-08-13 | エイチジーエスティーネザーランドビーブイ | ヘッド・ジンバル・アセンブリ及びディスク・ドライブ |
| JP5174649B2 (ja) | 2008-12-25 | 2013-04-03 | 日本発條株式会社 | 圧電素子の電気的接続構造、圧電アクチュエータ及びヘッドサスペンション |
| JP5138571B2 (ja) | 2008-12-25 | 2013-02-06 | 日本発條株式会社 | 圧電素子の配線接続部構造、圧電アクチュエータ、及びヘッドサスペンション |
| JP4907675B2 (ja) | 2009-01-15 | 2012-04-04 | 日本発條株式会社 | 圧電素子の配線接続部構造、圧電アクチュエータ、及びヘッドサスペンション |
| JP4993625B2 (ja) | 2009-02-04 | 2012-08-08 | 日本発條株式会社 | 圧電素子の電極構造、圧電素子の電極形成方法、圧電アクチュエータ及びヘッドサスペンション |
| JP4948554B2 (ja) | 2009-02-16 | 2012-06-06 | 日本発條株式会社 | ヘッドサスペンション |
| US8228642B1 (en) | 2009-02-16 | 2012-07-24 | Magnecomp Corporation | Dual stage actuator suspension having a single microactuator and employing pseudo symmetry to achieve suspension balance |
| CN101807407B (zh) | 2009-02-17 | 2015-09-09 | 日本发条株式会社 | 负载杆、具备该负载杆的悬架以及悬架的制造方法 |
| US8179639B2 (en) | 2009-03-02 | 2012-05-15 | Seagate Technology Llc | Head gimbal assembly without bus traces for plating |
| USD605879S1 (en) | 2009-03-12 | 2009-12-15 | Bose Corporation | Vehicle seat base |
| US8390961B2 (en) | 2009-03-26 | 2013-03-05 | Suncall Corporation | Magnetic head suspension having a support plate connected to the lower surface of the supporting part |
| JP2010238300A (ja) | 2009-03-31 | 2010-10-21 | Toshiba Storage Device Corp | ヘッドサスペンションアセンブリおよび磁気ディスク装置 |
| US8189301B2 (en) | 2009-04-24 | 2012-05-29 | Magnecomp Corporation | Wireless microactuator motor assembly for use in a hard disk drive suspension, and mechanical and electrical connections thereto |
| JP5396138B2 (ja) | 2009-04-30 | 2014-01-22 | 日本発條株式会社 | ディスク装置用サスペンションおよびその製造方法 |
| JP5138635B2 (ja) | 2009-05-15 | 2013-02-06 | 日本発條株式会社 | ヘッドサスペンション |
| JP5291535B2 (ja) | 2009-05-25 | 2013-09-18 | 日本発條株式会社 | ヘッドサスペンション |
| US8300362B2 (en) | 2009-06-15 | 2012-10-30 | Seagate Technology Llc | Slider-gimbal scratch mitigation |
| JP5508774B2 (ja) | 2009-07-16 | 2014-06-04 | エイチジーエスティーネザーランドビーブイ | ディスク・ドライブ |
| US8089728B2 (en) | 2009-07-23 | 2012-01-03 | Sae Magnetics (H.K.) Ltd. | Head gimbal assembly, suspension for the head gimbal assembly, and disk drive unit with the same |
| JP4790053B2 (ja) | 2009-09-04 | 2011-10-12 | サンコール株式会社 | 磁気ヘッドサスペンション |
| JP5277119B2 (ja) | 2009-09-08 | 2013-08-28 | 日本発條株式会社 | ディスク装置用サスペンション |
| JP5377177B2 (ja) | 2009-09-08 | 2013-12-25 | 日本発條株式会社 | ディスク装置用サスペンション |
| JP5481151B2 (ja) | 2009-10-09 | 2014-04-23 | 日本発條株式会社 | ディスク装置用サスペンションと、その製造方法 |
| US8531799B2 (en) | 2009-10-22 | 2013-09-10 | Seagate Technology Llc | Head gimbal assembly with contact detection |
| JP5453052B2 (ja) | 2009-10-27 | 2014-03-26 | 日本発條株式会社 | ディスク装置用サスペンション |
| JP5227940B2 (ja) | 2009-11-26 | 2013-07-03 | 日東電工株式会社 | 回路付サスペンション基板 |
| US8233240B2 (en) | 2009-12-10 | 2012-07-31 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic recording disk drive with integrated lead suspension having multiple segments for optimal characteristic impedance |
| JP5335658B2 (ja) | 2009-12-15 | 2013-11-06 | 日本発條株式会社 | ヘッドサスペンション、及びヘッドサスペンションの製造方法 |
| US8189281B2 (en) | 2009-12-18 | 2012-05-29 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic recording disk drive with write driver to write head transmission line having non-uniform sections for optimal write current pulse overshoot |
| JP5869200B2 (ja) | 2009-12-21 | 2016-02-24 | エイチジーエスティーネザーランドビーブイ | ヘッド・ジンバル・アセンブリ及びディスク・ドライブ |
| US8264797B2 (en) | 2009-12-21 | 2012-09-11 | Western Digital (Fremont), Llc | Head gimbal assembly having a radial rotary piezoelectric microactuator between a read head and a flexure tongue |
| US8305712B2 (en) | 2009-12-23 | 2012-11-06 | Hitachi Global Storage Technologies, Netherlands B.V. | Tunable microstrip signal transmission path in a hard disk drive |
| JP5383557B2 (ja) | 2010-03-03 | 2014-01-08 | 日本発條株式会社 | ヘッドサスペンション及びヘッドサスペンションの製造方法 |
| US8542465B2 (en) | 2010-03-17 | 2013-09-24 | Western Digital Technologies, Inc. | Suspension assembly having a microactuator electrically connected to a gold coating on a stainless steel surface |
| JP5478331B2 (ja) | 2010-03-31 | 2014-04-23 | 日本発條株式会社 | 電子機器と、ディスク装置用サスペンション |
| JP5875216B2 (ja) | 2010-05-12 | 2016-03-02 | 日本発條株式会社 | 圧電素子の電気的接続構造の製造方法 |
| JP5042336B2 (ja) | 2010-05-13 | 2012-10-03 | サンコール株式会社 | 磁気ヘッドサスペンション |
| US8885299B1 (en) | 2010-05-24 | 2014-11-11 | Hutchinson Technology Incorporated | Low resistance ground joints for dual stage actuation disk drive suspensions |
| JP2011253603A (ja) | 2010-06-04 | 2011-12-15 | Hitachi Ltd | 磁気ディスク装置 |
| US8339748B2 (en) | 2010-06-29 | 2012-12-25 | Western Digital Technologies, Inc. | Suspension assembly having a microactuator bonded to a flexure |
| US8665567B2 (en) | 2010-06-30 | 2014-03-04 | Western Digital Technologies, Inc. | Suspension assembly having a microactuator grounded to a flexure |
| JP5484223B2 (ja) | 2010-07-02 | 2014-05-07 | キヤノン株式会社 | 繊維吸収体の製造方法 |
| JP4962879B2 (ja) | 2010-07-06 | 2012-06-27 | 大日本印刷株式会社 | サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ |
| JP5626653B2 (ja) * | 2010-07-15 | 2014-11-19 | 大日本印刷株式会社 | サスペンション用基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブ、サスペンション用基板の製造方法、およびサスペンションの製造方法 |
| JP4977906B2 (ja) | 2010-07-15 | 2012-07-18 | 大日本印刷株式会社 | サスペンション用基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブ、サスペンション用基板の製造方法、およびサスペンションの導通検査方法 |
| JP5436361B2 (ja) * | 2010-07-30 | 2014-03-05 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
| US7946010B1 (en) | 2010-08-12 | 2011-05-24 | EMC Industries LLC | Installation tool for irrigation emitter barbs and tubing punch |
| JP2012079378A (ja) | 2010-09-30 | 2012-04-19 | Toshiba Corp | 配線構造、データ記録装置、及び電子機器 |
| JP5583539B2 (ja) | 2010-10-01 | 2014-09-03 | 日本発條株式会社 | フレキシャの配線構造 |
| US8854826B2 (en) | 2010-10-07 | 2014-10-07 | Nitto Denko Corporation | Suspension board with circuit |
| JP5596487B2 (ja) | 2010-10-07 | 2014-09-24 | 日本発條株式会社 | 圧電アクチュエータ及びヘッド・サスペンション |
| US8289652B2 (en) | 2010-10-22 | 2012-10-16 | Seagate Technology Llc | Compact microactuator head assembly |
| US8467153B1 (en) | 2010-10-29 | 2013-06-18 | Western Digital Technologies, Inc. | Disk drive head gimbal assembly having a flexure tail with folded bond pads |
| JP5603744B2 (ja) | 2010-11-10 | 2014-10-08 | 日東電工株式会社 | 回路付サスペンション基板およびその製造方法 |
| US8526142B1 (en) | 2010-12-30 | 2013-09-03 | Magnecomp Corporation | Hard disk drive DSA suspension having PZT encapsulation dam |
| CN102592610B (zh) | 2011-01-05 | 2016-08-03 | 新科实业有限公司 | 具有支撑块的悬臂件、磁头折片组合及磁盘驱动单元 |
| JP5943590B2 (ja) | 2011-01-07 | 2016-07-05 | 日本発條株式会社 | 圧電素子の製造方法、圧電素子、圧電アクチュエータ、及びヘッド・サスペンション |
| US8498082B1 (en) | 2011-03-23 | 2013-07-30 | Magnecomp Corporation | DSA suspension with improved microactuator stroke length |
| US8898876B2 (en) | 2011-03-30 | 2014-12-02 | Rain Bird Corporation | Barbed fittings, fitting insertion tools and methods relating to same |
| US9011133B2 (en) | 2011-04-29 | 2015-04-21 | Covidien Lp | Apparatus and method of forming barbs on a suture |
| JP5762119B2 (ja) | 2011-05-06 | 2015-08-12 | 日東電工株式会社 | 回路付きサスペンション基板およびその製造方法 |
| US8783148B2 (en) | 2011-05-11 | 2014-07-22 | Bruce Weibelt | Rotary die cutter insert |
| US8310790B1 (en) | 2011-06-11 | 2012-11-13 | Nhk Spring Co., Ltd | Remote drive rotary head dual stage actuator |
| US8446694B1 (en) | 2011-06-14 | 2013-05-21 | Western Digital Technologies, Inc. | Disk drive head suspension assembly with embedded in-plane actuator at flexure tongue |
| US8295012B1 (en) | 2011-06-14 | 2012-10-23 | Western Digital Technologies, Inc. | Disk drive suspension assembly with rotary fine actuator at flexure tongue |
| US8593764B1 (en) | 2011-06-14 | 2013-11-26 | Western Digital Technologies, Inc. | Method for fine actuation of a head during operation of a disk drive |
| US20130021698A1 (en) | 2011-07-20 | 2013-01-24 | Seagate Technology Llc | Gimbal limiter for suspension with lift tab |
| JP5896846B2 (ja) | 2011-08-22 | 2016-03-30 | 日東電工株式会社 | 回路付サスペンション基板 |
| JP5896845B2 (ja) | 2011-08-22 | 2016-03-30 | 日東電工株式会社 | 配線回路基板 |
| JP5811691B2 (ja) * | 2011-08-24 | 2015-11-11 | 大日本印刷株式会社 | サスペンション用基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよびサスペンション用基板の製造方法 |
| JP5808980B2 (ja) | 2011-08-30 | 2015-11-10 | 日本発條株式会社 | ダンパーの打抜方法、打抜装置、及び貼付装置 |
| JP5813464B2 (ja) | 2011-11-02 | 2015-11-17 | 日本発條株式会社 | ヘッド・サスペンションの配線構造及び製造方法 |
| JP5887143B2 (ja) | 2012-01-05 | 2016-03-16 | 日本発條株式会社 | ディスク装置用フレキシャのインターリーブ配線部 |
| US8456780B1 (en) | 2012-02-10 | 2013-06-04 | HGST Netherlands B.V. | Uncoupled piezoelectric milli-actuator assembly |
| JP5943658B2 (ja) | 2012-03-15 | 2016-07-05 | 日本発條株式会社 | 端子部構造、フレキシャ、及びヘッド・サスペンション |
| US9001469B2 (en) | 2012-03-16 | 2015-04-07 | Hutchinson Technology Incorporated | Mid-loadbeam dual stage actuated (DSA) disk drive head suspension |
| JP2015518229A (ja) | 2012-03-22 | 2015-06-25 | ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ | ディスクドライブのヘッドサスペンションのフレクシャ用接地形体 |
| US9786307B2 (en) | 2012-04-04 | 2017-10-10 | Nhk Spring Co., Ltd | Gimbal assembly with a gold tongue/dimple interface and methods of making the same |
| CN103378286B (zh) | 2012-04-19 | 2017-12-01 | 新科实业有限公司 | 薄膜压电元件及其制造方法、磁头折片组合及磁盘驱动器 |
| JP5941332B2 (ja) | 2012-04-27 | 2016-06-29 | 日本発條株式会社 | ヘッド・サスペンション |
| US8730621B2 (en) | 2012-07-09 | 2014-05-20 | Seagate Technology Llc | Solder ball bridge, and methods of making |
| JP5931622B2 (ja) | 2012-07-19 | 2016-06-08 | 日本発條株式会社 | ディスク装置用サスペンション |
| JP5931625B2 (ja) | 2012-07-19 | 2016-06-08 | 日本発條株式会社 | ディスク装置用サスペンション |
| JP5931623B2 (ja) | 2012-07-19 | 2016-06-08 | 日本発條株式会社 | ディスク装置用サスペンション |
| JP5931624B2 (ja) | 2012-07-19 | 2016-06-08 | 日本発條株式会社 | ディスク装置用サスペンション |
| US9136820B2 (en) | 2012-07-31 | 2015-09-15 | Tdk Corporation | Piezoelectric device |
| US8861141B2 (en) | 2012-08-31 | 2014-10-14 | Hutchinson Technology Incorporated | Damped dual stage actuation disk drive suspensions |
| WO2014043498A2 (en) | 2012-09-14 | 2014-03-20 | Hutchinson Technology Incorporated | Co-located gimbal-based dual stage actuation disk drive suspensions |
| JP5933403B2 (ja) | 2012-09-27 | 2016-06-08 | 日本発條株式会社 | ディスク装置用サスペンション |
| JP5933402B2 (ja) | 2012-09-27 | 2016-06-08 | 日本発條株式会社 | ディスク装置用サスペンション |
| US8896968B2 (en) | 2012-10-10 | 2014-11-25 | Hutchinson Technology Incorporated | Co-located gimbal-based dual stage actuation disk drive suspensions with dampers |
| US8780503B2 (en) | 2012-10-16 | 2014-07-15 | Seagate Technology Llc | Multi-layer piezoelectric transducer with inactive layers |
| US8941951B2 (en) * | 2012-11-28 | 2015-01-27 | Hutchinson Technology Incorporated | Head suspension flexure with integrated strain sensor and sputtered traces |
| US8891206B2 (en) | 2012-12-17 | 2014-11-18 | Hutchinson Technology Incorporated | Co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffener |
| JP6307217B2 (ja) | 2013-02-07 | 2018-04-04 | 日本発條株式会社 | ダンパーの打抜方法、打抜装置、及び貼付装置 |
| US9117468B1 (en) | 2013-03-18 | 2015-08-25 | Magnecomp Corporation | Hard drive suspension microactuator with restraining layer for control of bending |
| USD695535S1 (en) | 2013-03-27 | 2013-12-17 | Honda Motor Co., Ltd | Front seat |
| US8896969B1 (en) | 2013-05-23 | 2014-11-25 | Hutchinson Technology Incorporated | Two-motor co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffeners |
| US9311938B1 (en) | 2013-05-30 | 2016-04-12 | Magnecomp Corporation | Dual stage actuated suspension having adhesive overflow control channels |
| USD707048S1 (en) | 2013-06-12 | 2014-06-17 | Komatsu Ltd. | Vehicle seat |
| USD711125S1 (en) | 2013-06-12 | 2014-08-19 | Komatsu Ltd. | Vehicle seat |
| US8717712B1 (en) | 2013-07-15 | 2014-05-06 | Hutchinson Technology Incorporated | Disk drive suspension assembly having a partially flangeless load point dimple |
| US8792214B1 (en) | 2013-07-23 | 2014-07-29 | Hutchinson Technology Incorporated | Electrical contacts to motors in dual stage actuated suspensions |
| USD723821S1 (en) | 2013-08-09 | 2015-03-10 | Fuji Jukogyo Kabushiki Kaisha | Seat for automobile |
| US8675314B1 (en) | 2013-08-21 | 2014-03-18 | Hutchinson Technology Incorporated | Co-located gimbal-based dual stage actuation disk drive suspensions with offset motors |
| US9224410B1 (en) | 2013-09-04 | 2015-12-29 | Magnecomp Corporation | Suspension having microactuator grounded to opposite side of metal support layer |
| US9330697B2 (en) | 2013-12-05 | 2016-05-03 | Hutchinson Technology Incorporated | Constrained dimple pad damper for disk drive head suspension |
| US9330695B1 (en) | 2013-12-10 | 2016-05-03 | Western Digital Technologies, Inc. | Disk drive head suspension tail with a noble metal layer disposed on a plurality of structural backing islands |
| US8896970B1 (en) | 2013-12-31 | 2014-11-25 | Hutchinson Technology Incorporated | Balanced co-located gimbal-based dual stage actuation disk drive suspensions |
| US8867173B1 (en) | 2014-01-03 | 2014-10-21 | Hutchinson Technology Incorporated | Balanced multi-trace transmission in a hard disk drive flexure |
| US8834660B1 (en) | 2014-01-07 | 2014-09-16 | Hutchinson Technology Incorporated | Visco pad placement in disk drives |
| US9070392B1 (en) | 2014-12-16 | 2015-06-30 | Hutchinson Technology Incorporated | Piezoelectric disk drive suspension motors having plated stiffeners |
| US9318136B1 (en) | 2014-12-22 | 2016-04-19 | Hutchinson Technology Incorporated | Multilayer disk drive motors having out-of-plane bending |
| US9296188B1 (en) | 2015-02-17 | 2016-03-29 | Hutchinson Technology Incorporated | Partial curing of a microactuator mounting adhesive in a disk drive suspension |
| CN107735834B (zh) * | 2015-06-30 | 2019-11-19 | 哈钦森技术股份有限公司 | 具有改进的可靠性的盘驱动器头部悬架结构 |
-
2016
- 2016-06-22 CN CN201680038786.3A patent/CN107735834B/zh active Active
- 2016-06-22 WO PCT/US2016/038677 patent/WO2017003782A1/en active Application Filing
- 2016-06-22 US US15/189,424 patent/US9734852B2/en active Active
- 2016-06-22 JP JP2017565147A patent/JP6689294B2/ja active Active
-
2017
- 2017-08-14 US US15/676,698 patent/US9984708B2/en active Active
-
2018
- 2018-05-15 US US15/980,649 patent/US10290313B2/en active Active
-
2019
- 2019-05-13 US US16/410,898 patent/US10748566B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20190267030A1 (en) | 2019-08-29 |
| US20180012621A1 (en) | 2018-01-11 |
| US10290313B2 (en) | 2019-05-14 |
| US20170004854A1 (en) | 2017-01-05 |
| WO2017003782A1 (en) | 2017-01-05 |
| US20180286438A1 (en) | 2018-10-04 |
| US9984708B2 (en) | 2018-05-29 |
| CN107735834B (zh) | 2019-11-19 |
| JP2018519615A (ja) | 2018-07-19 |
| US9734852B2 (en) | 2017-08-15 |
| CN107735834A (zh) | 2018-02-23 |
| US10748566B2 (en) | 2020-08-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4909844B2 (ja) | 埋め込まれたトレースを有する一体化されたリードのフレクシャ | |
| US7875804B1 (en) | Plated ground features for integrated lead suspensions | |
| US7929252B1 (en) | Multi-layer ground plane structures for integrated lead suspensions | |
| JP2007537562A5 (ja) | ||
| US7697237B1 (en) | Shielded copper-dielectric flexure for disk drive head suspensions | |
| JP4820790B2 (ja) | インライン型リード部を有するヘッドサスペンションフレクシャ | |
| US8144430B2 (en) | Multi-layer ground plane structures for integrated lead suspensions | |
| US7384531B1 (en) | Plated ground features for integrated lead suspensions | |
| JP2003097617A (ja) | 解放後に先端部に導電被膜を形成する微小バネ | |
| JP2005100488A (ja) | 回路付サスペンション基板およびその製造方法 | |
| JP2004363281A (ja) | 配線回路基板 | |
| JP2006503402A5 (ja) | ||
| JP2006245220A (ja) | 配線回路基板 | |
| JP4962392B2 (ja) | サスペンション用基板の製造方法 | |
| JP2008034639A (ja) | 配線回路基板 | |
| JP2012023296A (ja) | 回路基板、回路基板の製造方法、サスペンション用基板、サスペンション、素子付サスペンションおよびハードディスクドライブ | |
| JP6689294B2 (ja) | 金誘電体接合部の信頼性を向上させたディスクドライブヘッドサスペンション構造 | |
| CN101562170A (zh) | 带电路的悬挂基板及其制造方法 | |
| TWI439187B (zh) | 可撓性印刷配線板薄片及其製造方法 | |
| JP2005303172A (ja) | 配線回路基板 | |
| JP2006202358A (ja) | 磁気ヘッドサスペンション及びその製造方法 | |
| US10783908B1 (en) | Microstructure patterned surfaces for integrated lead disk drive head suspensions | |
| JP2013206488A (ja) | サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブ、およびサスペンション用基板の製造方法 | |
| CN103841772A (zh) | 布线电路基板及其制造方法 | |
| JP5351830B2 (ja) | 配線回路基板およびその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20180122 |
|
| RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7426 Effective date: 20180122 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190618 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190618 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200311 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200317 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200407 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6689294 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |