JP5896846B2 - 回路付サスペンション基板 - Google Patents
回路付サスペンション基板 Download PDFInfo
- Publication number
- JP5896846B2 JP5896846B2 JP2012151724A JP2012151724A JP5896846B2 JP 5896846 B2 JP5896846 B2 JP 5896846B2 JP 2012151724 A JP2012151724 A JP 2012151724A JP 2012151724 A JP2012151724 A JP 2012151724A JP 5896846 B2 JP5896846 B2 JP 5896846B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- terminal
- base
- metal support
- support substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4833—Structure of the arm assembly, e.g. load beams, flexures, parts of the arm adapted for controlling vertical force on the head
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4846—Constructional details of the electrical connection between arm and support
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4853—Constructional details of the electrical connection between head and arm
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Description
(変形例)
図12および図13は、本発明の回路付サスペンション基板の変形例を説明する説明図である。なお、図12および図13において、上記した実施形態と同様の部材については、同一の参照符号を付し、その詳細な説明を省略する。
2 磁気ヘッド
3 スライダ
14 連通空間
20 金属支持基板
21 第1ベース絶縁層
22 第1導体パターン
26 ピエゾ素子
30 ヘッド側端子
33 先端縁(第1ベース絶縁層)
35 後端縁(第1ベース絶縁層)
39 先端縁(第2ベース絶縁層)
40 後端縁(第2ベース絶縁層)
41 第2ベース絶縁層
42 第2導体パターン
45 素子側端子
54 先端縁(金属支持基板)
55 後端縁(金属支持基板)
Claims (3)
- 磁気ヘッドを搭載する外部のスライダと、前記磁気ヘッドの近傍に設けられる外部の電子素子とを搭載できるように構成される回路付サスペンション基板であって、
金属支持基板と、
前記金属支持基板の表面に積層される第1絶縁層と、
前記第1絶縁層の前記表面側に積層される第1端子を備える第1導体パターンと、
前記金属支持基板の裏面に積層される第2絶縁層と、
前記第2絶縁層の前記裏面側に積層される第2端子を備える第2導体パターンと
を備え、
前記回路付サスペンション基板には、表裏方向に連通する連通空間が形成され、
前記第1端子は、前記スライダの前記磁気ヘッドが電気的に接続されるように構成され、
前記第2端子は、前記電子素子が電気的に接続されるように構成され、前記電子素子が架設されるように前記連通空間を隔てて少なくとも1対設けられ、
前記表裏方向に投影したときに、前記第1絶縁層および前記第2絶縁層の端縁は、前記金属支持基板の端縁よりも前記連通空間内に突出している
ことを特徴とする、回路付サスペンション基板。 - 前記表裏方向に投影したときに前記電子素子と重複するように、前記スライダを搭載できることを特徴とする、請求項1に記載の回路付サスペンション基板。
- 前記電子素子が、ピエゾ素子であることを特徴とする、請求項1または2に記載の回路付サスペンション基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012151724A JP5896846B2 (ja) | 2011-08-22 | 2012-07-05 | 回路付サスペンション基板 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011180972 | 2011-08-22 | ||
JP2011180972 | 2011-08-22 | ||
JP2012151724A JP5896846B2 (ja) | 2011-08-22 | 2012-07-05 | 回路付サスペンション基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013062013A JP2013062013A (ja) | 2013-04-04 |
JP5896846B2 true JP5896846B2 (ja) | 2016-03-30 |
Family
ID=47534425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012151724A Expired - Fee Related JP5896846B2 (ja) | 2011-08-22 | 2012-07-05 | 回路付サスペンション基板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8508888B2 (ja) |
JP (1) | JP5896846B2 (ja) |
CN (1) | CN102890940B (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5603657B2 (ja) | 2010-05-20 | 2014-10-08 | 日東電工株式会社 | 回路付サスペンション基板およびその製造方法 |
US8885299B1 (en) | 2010-05-24 | 2014-11-11 | Hutchinson Technology Incorporated | Low resistance ground joints for dual stage actuation disk drive suspensions |
US8861142B2 (en) * | 2010-10-13 | 2014-10-14 | Nitto Denko Corporation | Suspension board with circuit and producing method thereof |
JP5781773B2 (ja) * | 2011-01-12 | 2015-09-24 | 日東電工株式会社 | 回路付サスペンション基板 |
JP6024078B2 (ja) * | 2011-08-17 | 2016-11-09 | 大日本印刷株式会社 | サスペンション用基板 |
JP5974824B2 (ja) * | 2012-10-25 | 2016-08-23 | 大日本印刷株式会社 | サスペンション用基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよびサスペンション用基板の製造方法 |
JP6043613B2 (ja) * | 2012-12-11 | 2016-12-14 | 日東電工株式会社 | 回路付サスペンション基板 |
US8982513B1 (en) * | 2013-05-21 | 2015-03-17 | Western Digital Technologies, Inc. | Disk drive head suspension with dual piezoelectric elements adhered to rotary-actuated and non-actuated portions of a structural layer of a tongue of a laminated flexure |
US8896969B1 (en) | 2013-05-23 | 2014-11-25 | Hutchinson Technology Incorporated | Two-motor co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffeners |
JP6169960B2 (ja) * | 2013-12-04 | 2017-07-26 | 日東電工株式会社 | 回路付サスペンション基板の製造方法 |
JP6370619B2 (ja) * | 2014-06-26 | 2018-08-08 | 日東電工株式会社 | 回路付サスペンション基板およびその製造方法 |
JP6522317B2 (ja) * | 2014-11-10 | 2019-05-29 | 日東電工株式会社 | 配線回路基板およびその製造方法、ならびに、配線回路基板アセンブリおよびその製造方法 |
US9070392B1 (en) | 2014-12-16 | 2015-06-30 | Hutchinson Technology Incorporated | Piezoelectric disk drive suspension motors having plated stiffeners |
US9318136B1 (en) * | 2014-12-22 | 2016-04-19 | Hutchinson Technology Incorporated | Multilayer disk drive motors having out-of-plane bending |
US9296188B1 (en) | 2015-02-17 | 2016-03-29 | Hutchinson Technology Incorporated | Partial curing of a microactuator mounting adhesive in a disk drive suspension |
CN107735834B (zh) | 2015-06-30 | 2019-11-19 | 哈钦森技术股份有限公司 | 具有改进的可靠性的盘驱动器头部悬架结构 |
US9646638B1 (en) | 2016-05-12 | 2017-05-09 | Hutchinson Technology Incorporated | Co-located gimbal-based DSA disk drive suspension with traces routed around slider pad |
JP6788442B2 (ja) * | 2016-09-07 | 2020-11-25 | 日東電工株式会社 | 回路付サスペンション基板および回路付サスペンション基板の製造方法 |
JP6687490B2 (ja) * | 2016-09-07 | 2020-04-22 | 日東電工株式会社 | 回路付サスペンション基板および回路付サスペンション基板の製造方法 |
JP6979287B2 (ja) * | 2017-06-09 | 2021-12-08 | 日東電工株式会社 | 回路付サスペンション基板 |
JP6865643B2 (ja) * | 2017-06-09 | 2021-04-28 | 日東電工株式会社 | 回路付サスペンション基板 |
US10783909B1 (en) * | 2018-05-14 | 2020-09-22 | Seagate Technology | In-plane gimbal tongue microactuator system |
JP7413237B2 (ja) * | 2020-11-16 | 2024-01-15 | 株式会社東芝 | サスペンションアッセンブリおよびディスク装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5896247A (en) * | 1997-05-23 | 1999-04-20 | International Business Machines Corporation | Disk file suspension formed flexure |
US6195227B1 (en) * | 1997-12-30 | 2001-02-27 | International Business Machines, Inc. | Integrated 3D limiters for microactuators |
US6262868B1 (en) * | 1997-12-30 | 2001-07-17 | International Business Machines Corporation | Method and structures used for connecting recording head signal wires in a microactuator |
US7612967B2 (en) * | 2001-12-05 | 2009-11-03 | Samsung Electronics Co., Ltd. | Method and apparatus coupling at least one piezoelectric device to a slider in a hard disk drive for microactuation |
JP2005251262A (ja) * | 2004-03-02 | 2005-09-15 | Hitachi Global Storage Technologies Netherlands Bv | ヘッド/スライダ支持構造及び回転円板形記憶装置 |
JP4238195B2 (ja) * | 2004-10-25 | 2009-03-11 | 日東電工株式会社 | 回路付サスペンション基板 |
US7518830B1 (en) * | 2006-04-19 | 2009-04-14 | Hutchinson Technology Incorporated | Dual sided electrical traces for disk drive suspension flexures |
JP5032949B2 (ja) * | 2007-11-14 | 2012-09-26 | エイチジーエスティーネザーランドビーブイ | マイクロアクチュエータ、ヘッド・ジンバル・アセンブリ及びディスク・ドライブ装置 |
JP5147591B2 (ja) * | 2008-08-06 | 2013-02-20 | 日東電工株式会社 | 回路付サスペンション基板、その製造方法および回路付サスペンション基板の位置決め方法 |
JP5138549B2 (ja) | 2008-10-31 | 2013-02-06 | 日東電工株式会社 | 回路付サスペンション基板 |
JP5027778B2 (ja) * | 2008-10-31 | 2012-09-19 | 日東電工株式会社 | 回路付サスペンション基板 |
JP5002574B2 (ja) * | 2008-11-11 | 2012-08-15 | 日東電工株式会社 | 回路付サスペンション基板およびその製造方法 |
JP2010123195A (ja) * | 2008-11-19 | 2010-06-03 | Hitachi Global Storage Technologies Netherlands Bv | ヘッド・ジンバル・アセンブリ、マイクロアクチュエータ及びマイクロアクチュエータの製造方法 |
JP5570111B2 (ja) * | 2008-12-18 | 2014-08-13 | エイチジーエスティーネザーランドビーブイ | ヘッド・ジンバル・アセンブリ及びディスク・ドライブ |
US8854826B2 (en) * | 2010-10-07 | 2014-10-07 | Nitto Denko Corporation | Suspension board with circuit |
-
2012
- 2012-07-05 JP JP2012151724A patent/JP5896846B2/ja not_active Expired - Fee Related
- 2012-07-19 US US13/553,107 patent/US8508888B2/en not_active Expired - Fee Related
- 2012-07-20 CN CN201210254776.7A patent/CN102890940B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN102890940B (zh) | 2016-12-07 |
US20130021699A1 (en) | 2013-01-24 |
CN102890940A (zh) | 2013-01-23 |
US8508888B2 (en) | 2013-08-13 |
JP2013062013A (ja) | 2013-04-04 |
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