JP5174649B2 - 圧電素子の電気的接続構造、圧電アクチュエータ及びヘッドサスペンション - Google Patents
圧電素子の電気的接続構造、圧電アクチュエータ及びヘッドサスペンション Download PDFInfo
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- JP5174649B2 JP5174649B2 JP2008331409A JP2008331409A JP5174649B2 JP 5174649 B2 JP5174649 B2 JP 5174649B2 JP 2008331409 A JP2008331409 A JP 2008331409A JP 2008331409 A JP2008331409 A JP 2008331409A JP 5174649 B2 JP5174649 B2 JP 5174649B2
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- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4873—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives the arm comprising piezoelectric or other actuators for adjustment of the arm
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10666—Plated through-hole for surface mounting on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Moving Of The Head To Find And Align With The Track (AREA)
Description
図1は、本発明実施例に係るヘッドサスペンションの外観斜視図である。
図2は、本発明実施例に係る圧電アクチュエータの外観斜視図、図3は、本圧電アクチュエータのA−A線に沿う矢視断面図である。
図5(a)は、配線部材をヘッドサスペンションの裏面側から視た外観図、図5(b)は、配線部材を圧電素子側から視た外観図である。
本発明実施例による圧電素子にあけた貫通孔93中に端子部材57が配置される共有電極板19とは反対側から導電性接着剤71を注入して、前記共有電極板19と端子部材57との電気的接続をとる電気的接続構造により、導電性接着剤71の偏りや、接着の際の圧電素子13と端子部材57との平行位置からのずれに起因して端子部材が圧電素子13に対して傾いて接着されるために発生する接着不良や、対向する回転磁気ディスクとの間のクリアランス高さの不均一の問題が発生することが無くなる。
本発明は、上述した実施例に限られるものではなく、請求の範囲及び明細書全体から読み取れる発明の要旨、あるいは技術思想に反しない範囲で適宜変更可能であり、そのような変更を伴う圧電素子の電気的接続構造、圧電アクチュエータ、ヘッドサスペンション、及び導電性部材の電気的接続構造もまた、本発明における技術的範囲の射程に包含されるものである。
13 圧電素子(圧電アクチュエータの一部を構成する。)
15 第1電極板
17 第2電極板
19 共有電極板(圧電素子の電極)
21 圧電材料部
21a,21b 第1,第2圧電材料部
31 ヘッドサスペンション
33 ベースプレート
34 アクチュエータプレート
35 ロードビーム
37 連結プレート(ヒンジ部材)
39 フレキシャ
41a,41b 一対の可撓部
43 開口部
49a,49b ヒンジ部
53a,53b 一対の導電性接着剤
55 配線部材
57 端子部材
59 導電性基材
61 電気絶縁層
63 配線部
65 エッチング抜き部分
67 端子部材中心貫通孔
68 電気絶縁層貫通孔
69 液止め部材
71 導電性接着剤
81a,81b 一対の圧電素子(圧電アクチュエータの一部を構成する。)
83 圧電アクチュエータ
91 蓋部材
93、93a、93b、93c、93d 貫通孔
95 電極間のスリット
97 絶縁充填材
Claims (5)
- 基部と磁気ヘッドとの間に介在させて設けられ、電圧の印加状態に応じて変形する圧電素子を有し、前記圧電素子の変形に従って前記磁気ヘッド側をスウェイ方向に微少移動させる圧電アクチュエータにおいて、
前記圧電素子は両端面の少なくとも一端を覆う電極と、前記両端面間を貫通する貫通孔とを有し、
前記電極に給電するための端子部材を前記圧電素子の貫通孔の前記電極が配された側の一端を覆う形で配し、前記貫通孔の他端側より液状の導電性接着剤を注入することによって、前記圧電素子の電極と前記端子部材との間が電気的に接続されている、
ことを特徴とする圧電素子の電気的接続構造。 - 請求項1記載の圧電素子の電気的接続構造であって、
前記貫通孔の形状は、円柱形状、又は円錐台形状、又はこれらの同じ直径、又は異なる直径の形状の組合せからなる、
ことを特徴とする圧電素子の電気的接続構造。 - 請求項1又は2記載の圧電素子の電気的接続構造であって、
前記端子部材は、導電性基材上に、電気絶縁層を介して配線部材を積層させて構成される
ことを特徴とする圧電素子の電気的接続構造。 - 請求項1から3のいずれか一項に記載の圧電素子の電気的接続構造が採用されていることを特徴とする圧電アクチュエータ。
- 請求項4記載の圧電アクチュエータが、ベースプレートと、フレキシャが設けられるロードビームと、の間に取り付けられており、前記圧電素子の変形に従って前記ロードビームの先端側をスウェイ方向に微少移動させることを特徴とするヘッドサスペンション。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008331409A JP5174649B2 (ja) | 2008-12-25 | 2008-12-25 | 圧電素子の電気的接続構造、圧電アクチュエータ及びヘッドサスペンション |
US12/644,277 US8248731B2 (en) | 2008-12-25 | 2009-12-22 | Electrical connection between piezoelectric actuator and head suspension |
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JP2008331409A JP5174649B2 (ja) | 2008-12-25 | 2008-12-25 | 圧電素子の電気的接続構造、圧電アクチュエータ及びヘッドサスペンション |
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JP2010154691A JP2010154691A (ja) | 2010-07-08 |
JP5174649B2 true JP5174649B2 (ja) | 2013-04-03 |
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JP (1) | JP5174649B2 (ja) |
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JP5481151B2 (ja) * | 2009-10-09 | 2014-04-23 | 日本発條株式会社 | ディスク装置用サスペンションと、その製造方法 |
JP5335658B2 (ja) * | 2009-12-15 | 2013-11-06 | 日本発條株式会社 | ヘッドサスペンション、及びヘッドサスペンションの製造方法 |
JP5383557B2 (ja) * | 2010-03-03 | 2014-01-08 | 日本発條株式会社 | ヘッドサスペンション及びヘッドサスペンションの製造方法 |
US8542465B2 (en) | 2010-03-17 | 2013-09-24 | Western Digital Technologies, Inc. | Suspension assembly having a microactuator electrically connected to a gold coating on a stainless steel surface |
JP5478331B2 (ja) * | 2010-03-31 | 2014-04-23 | 日本発條株式会社 | 電子機器と、ディスク装置用サスペンション |
US8885299B1 (en) | 2010-05-24 | 2014-11-11 | Hutchinson Technology Incorporated | Low resistance ground joints for dual stage actuation disk drive suspensions |
US8665567B2 (en) | 2010-06-30 | 2014-03-04 | Western Digital Technologies, Inc. | Suspension assembly having a microactuator grounded to a flexure |
JP4977906B2 (ja) * | 2010-07-15 | 2012-07-18 | 大日本印刷株式会社 | サスペンション用基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブ、サスペンション用基板の製造方法、およびサスペンションの導通検査方法 |
JP5626653B2 (ja) * | 2010-07-15 | 2014-11-19 | 大日本印刷株式会社 | サスペンション用基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブ、サスペンション用基板の製造方法、およびサスペンションの製造方法 |
JP6054593B2 (ja) * | 2011-03-03 | 2016-12-27 | 日本発條株式会社 | 圧電素子の電気的接続構造 |
JP5989370B2 (ja) * | 2012-03-23 | 2016-09-07 | 日東電工株式会社 | 配線回路基板 |
US8456780B1 (en) * | 2012-02-10 | 2013-06-04 | HGST Netherlands B.V. | Uncoupled piezoelectric milli-actuator assembly |
WO2013138619A1 (en) | 2012-03-16 | 2013-09-19 | Hutchinson Technology Incorporated | Mid-loadbeam dual stage actuated (dsa) disk drive head suspension |
CN104205216A (zh) | 2012-03-22 | 2014-12-10 | 哈特奇桑科技公司 | 用于磁盘驱动器磁头悬架挠性件的接地特征 |
WO2014043498A2 (en) | 2012-09-14 | 2014-03-20 | Hutchinson Technology Incorporated | Co-located gimbal-based dual stage actuation disk drive suspensions |
US8896968B2 (en) | 2012-10-10 | 2014-11-25 | Hutchinson Technology Incorporated | Co-located gimbal-based dual stage actuation disk drive suspensions with dampers |
US8941951B2 (en) | 2012-11-28 | 2015-01-27 | Hutchinson Technology Incorporated | Head suspension flexure with integrated strain sensor and sputtered traces |
US8891206B2 (en) | 2012-12-17 | 2014-11-18 | Hutchinson Technology Incorporated | Co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffener |
JP5920274B2 (ja) * | 2013-04-01 | 2016-05-18 | Tdk株式会社 | 圧電駆動装置及びレンズ駆動装置 |
US8896969B1 (en) | 2013-05-23 | 2014-11-25 | Hutchinson Technology Incorporated | Two-motor co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffeners |
US8717712B1 (en) | 2013-07-15 | 2014-05-06 | Hutchinson Technology Incorporated | Disk drive suspension assembly having a partially flangeless load point dimple |
US8792214B1 (en) * | 2013-07-23 | 2014-07-29 | Hutchinson Technology Incorporated | Electrical contacts to motors in dual stage actuated suspensions |
JP6106068B2 (ja) * | 2013-11-15 | 2017-03-29 | 日本発條株式会社 | ディスク装置用フレキシャ |
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US8248731B2 (en) | 2012-08-21 |
JP2010154691A (ja) | 2010-07-08 |
US20100165516A1 (en) | 2010-07-01 |
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