JP2001273979A - オーガニック発光構造 - Google Patents
オーガニック発光構造Info
- Publication number
- JP2001273979A JP2001273979A JP2001072847A JP2001072847A JP2001273979A JP 2001273979 A JP2001273979 A JP 2001273979A JP 2001072847 A JP2001072847 A JP 2001072847A JP 2001072847 A JP2001072847 A JP 2001072847A JP 2001273979 A JP2001273979 A JP 2001273979A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- light emitting
- organic light
- led
- transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 80
- 239000002184 metal Substances 0.000 claims abstract description 80
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000000576 coating method Methods 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 51
- 239000000758 substrate Substances 0.000 claims description 28
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 125000005842 heteroatom Chemical group 0.000 claims description 5
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 5
- 239000011368 organic material Substances 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 253
- 239000003086 colorant Substances 0.000 description 18
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 18
- -1 8-hydroxyquinoline) Chemical compound 0.000 description 16
- 125000003118 aryl group Chemical group 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 16
- 150000002894 organic compounds Chemical class 0.000 description 15
- 125000000217 alkyl group Chemical group 0.000 description 14
- YXLXNENXOJSQEI-UHFFFAOYSA-L Oxine-copper Chemical compound [Cu+2].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 YXLXNENXOJSQEI-UHFFFAOYSA-L 0.000 description 13
- 238000010586 diagram Methods 0.000 description 13
- 239000011521 glass Substances 0.000 description 13
- DMDOIBWPFWJPQJ-ONEGZZNKSA-N (e)-2,3-bis(sulfanyl)but-2-enedinitrile Chemical compound N#CC(/S)=C(\S)C#N DMDOIBWPFWJPQJ-ONEGZZNKSA-N 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 11
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical group OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 11
- 239000010931 gold Substances 0.000 description 10
- 238000003475 lamination Methods 0.000 description 10
- 229910021645 metal ion Inorganic materials 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 239000010409 thin film Substances 0.000 description 10
- 238000001312 dry etching Methods 0.000 description 9
- 125000004432 carbon atom Chemical group C* 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 239000003446 ligand Substances 0.000 description 8
- JUJWROOIHBZHMG-UHFFFAOYSA-N pyridine Substances C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 125000000623 heterocyclic group Chemical group 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 229910052697 platinum Inorganic materials 0.000 description 7
- 238000010894 electron beam technology Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 229910052738 indium Inorganic materials 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 5
- 239000002262 Schiff base Substances 0.000 description 5
- 150000004753 Schiff bases Chemical class 0.000 description 5
- 150000004696 coordination complex Chemical class 0.000 description 5
- 125000004093 cyano group Chemical group *C#N 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 125000005843 halogen group Chemical group 0.000 description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 5
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- 229940122361 Bisphosphonate Drugs 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 230000005525 hole transport Effects 0.000 description 4
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 4
- 150000002602 lanthanoids Chemical class 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-M phenolate Chemical compound [O-]C1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-M 0.000 description 4
- 238000005424 photoluminescence Methods 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 239000005725 8-Hydroxyquinoline Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229910004205 SiNX Inorganic materials 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000370 acceptor Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 150000004663 bisphosphonates Chemical class 0.000 description 3
- 239000006059 cover glass Substances 0.000 description 3
- 239000007850 fluorescent dye Substances 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 229910052747 lanthanoid Inorganic materials 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- 229960003540 oxyquinoline Drugs 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 125000004076 pyridyl group Chemical group 0.000 description 3
- 229910052761 rare earth metal Inorganic materials 0.000 description 3
- 150000002910 rare earth metals Chemical class 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- XGCDBGRZEKYHNV-UHFFFAOYSA-N 1,1-bis(diphenylphosphino)methane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CP(C=1C=CC=CC=1)C1=CC=CC=C1 XGCDBGRZEKYHNV-UHFFFAOYSA-N 0.000 description 2
- YVWBDMCJRQQEDM-UHFFFAOYSA-N 1,3-dipyridin-2-ylpropan-2-one Chemical class C=1C=CC=NC=1CC(=O)CC1=CC=CC=N1 YVWBDMCJRQQEDM-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- UHBIKXOBLZWFKM-UHFFFAOYSA-N 8-hydroxy-2-quinolinecarboxylic acid Chemical compound C1=CC=C(O)C2=NC(C(=O)O)=CC=C21 UHBIKXOBLZWFKM-UHFFFAOYSA-N 0.000 description 2
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 2
- UEXCJVNBTNXOEH-UHFFFAOYSA-N Ethynylbenzene Chemical group C#CC1=CC=CC=C1 UEXCJVNBTNXOEH-UHFFFAOYSA-N 0.000 description 2
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 2
- 229960004889 salicylic acid Drugs 0.000 description 2
- 229910052706 scandium Inorganic materials 0.000 description 2
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229930192474 thiophene Natural products 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- SCGHAKASTHQQJI-UHFFFAOYSA-N 1,5-bis(4-methoxypyridin-2-yl)pentan-3-one Chemical compound COC1=CC=NC(CCC(=O)CCC=2N=CC=C(OC)C=2)=C1 SCGHAKASTHQQJI-UHFFFAOYSA-N 0.000 description 1
- VYXHVRARDIDEHS-UHFFFAOYSA-N 1,5-cyclooctadiene Chemical compound C1CC=CCCC=C1 VYXHVRARDIDEHS-UHFFFAOYSA-N 0.000 description 1
- 239000004912 1,5-cyclooctadiene Substances 0.000 description 1
- QIAKNRAYXFJDLG-UHFFFAOYSA-N 1-(4-methoxypyridin-2-yl)propan-2-one Chemical compound COC1=CC=NC(CC(C)=O)=C1 QIAKNRAYXFJDLG-UHFFFAOYSA-N 0.000 description 1
- ZWXPIUUSCCETDP-UHFFFAOYSA-L 3H-dithiole-3-carboxylate platinum(2+) Chemical compound [Pt+2].[O-]C(=O)C1SSC=C1.[O-]C(=O)C1SSC=C1 ZWXPIUUSCCETDP-UHFFFAOYSA-L 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- GFJCLYIKZRBYSA-UHFFFAOYSA-N P1(OC2=C(C=CC=C2)OP(OC=CO1)=O)=O Chemical compound P1(OC2=C(C=CC=C2)OP(OC=CO1)=O)=O GFJCLYIKZRBYSA-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical group OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 229910007261 Si2N3 Inorganic materials 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 125000006615 aromatic heterocyclic group Chemical group 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- HNYOPLTXPVRDBG-UHFFFAOYSA-N barbituric acid Chemical compound O=C1CC(=O)NC(=O)N1 HNYOPLTXPVRDBG-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 229920001688 coating polymer Polymers 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- KGMYEKIGSSWMTJ-UHFFFAOYSA-N cycloocta-1,5-diene Chemical compound C1=CCCC=CCC1.C1=CCCC=CCC1 KGMYEKIGSSWMTJ-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 125000005266 diarylamine group Chemical group 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000005678 ethenylene group Chemical group [H]C([*:1])=C([H])[*:2] 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- UJNZOIKQAUQOCN-UHFFFAOYSA-N methyl(diphenyl)phosphane Chemical compound C=1C=CC=CC=1P(C)C1=CC=CC=C1 UJNZOIKQAUQOCN-UHFFFAOYSA-N 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- SYRHIZPPCHMRIT-UHFFFAOYSA-N tin(4+) Chemical class [Sn+4] SYRHIZPPCHMRIT-UHFFFAOYSA-N 0.000 description 1
- 229910001428 transition metal ion Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 125000005259 triarylamine group Chemical group 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
- ZTWTYVWXUKTLCP-UHFFFAOYSA-N vinylphosphonic acid Chemical class OP(O)(=O)C=C ZTWTYVWXUKTLCP-UHFFFAOYSA-N 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/06—Luminescent, e.g. electroluminescent, chemiluminescent materials containing organic luminescent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
- H10K50/125—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
-
- H—ELECTRICITY
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Abstract
ガニック材料で実現でき、RGB表示装置に利用する際
に、信頼性が高く小型で効率がよく、駆動電圧が低くて
済むオーガニックLEDを提供する。 【解決手段】基板37と、基板上に支持された導電被膜
35と、導電被膜上に支持された電荷運搬材料の各層か
らなる透明オーガニック発光素子20と、透明オーガニ
ック発光素子上に支持された透明導電層26と、を備え
る。透明導電層は、透明オーガニック発光素子に接する
面に厚さ100Å未満で仕事関数4eV未満の金属層2
6Mを有するとともに、当該金属層以外の部分がITO
層26Iとされ、透明導電層と導電被膜との間にバイア
ス電圧32をかけることにより透明オーガニック発光素
子が駆動されて光を発する。
Description
(organic)発光素子に関し、特に、平面電子表示装置
で利用される多色オーガニック発光素子に関する。
報伝達に欠くことのできないものであり、テレビ、コン
ピュータ表示装置及び他のアプリケーションのホスト等
に利用されている。そして、速度、多様性、インタラク
ティブ特性の点で、これに優る媒体はない。今までに知
られている表示装置としては、プラズマ表示装置、発光
ダイオード(LED)、薄膜エレクトロルミネセント表
示装置等がある。
S)や液晶表示装置(LCD)として知られるある種の
オーガニック分子の電子光学特性が利用されている。こ
のLCDの動作には一応の信頼性があるが、コントラス
トや解像度が比較的低く、また高出力のバックライト照
射が必要である。また、アクティブマトリクス式の表示
装置では、それぞれが1つのLC画素を駆動できるよう
なトランジスター配列が使われている。このような平面
型表示装置に関する技術には大きな関心が寄せられてい
るということは疑いもない事実であり、その開発は継続
して行われている。例えば、S.W.デップとW.E.
ハワードによる「平面型表示装置」、サイエンティック
アメリカン誌、1993年3月号、90〜97ページ、
における記述では、1995年までに、平面型表示装置
の市場規模は40〜50億米ドルになると予想してい
る。いずれの表示装置技術からでも、高解像度での多色
表示が可能であり、光レベルが良好で且つ競争力がある
価格の表示装置を提供できる。
青(B)の3原色に基づいて発色される。オーガニック
薄膜材を使った赤色、緑色、青色発光素子(LED)の
分野において、これまでに、目覚しい進歩があった。こ
れら薄膜材は高真空状態下で蒸着されるものであり、そ
の技法については世界中の様々な場所で開発されるとと
もに、多くの研究機関で研究が続けられている。
ク発光素子構造は、従来例として図1Aに図示されてい
る2重ヘテロ構造(double heterostructure)LED
と考えられている。このLED構造は、GaAsやIn
p等からなる従来からのインオーガニック(inorgani
c)LEDと同じである。
上に酸化錫インジウム(ITO)の薄膜11が被膜され
ており、該支持層10及び皮膜11により基板8を形成
している。次に、前記ITO層11上には、薄い(厚さ
100〜500Å)オーガニック性の正孔搬送層(HT
L)12が蒸着により設けられている。そしてHTL層
12の表面には、薄い(一般的には厚さ50〜100
Å)発光層(EL)13が形成されている。上記層が薄
すぎる場合、フィルムの連続性を欠くこととなるため、
この層を厚くした方が高出力動作に必要な内部抵抗を高
くできる。発光層(EL)13は、前記厚さ100〜5
00Åの電子搬送層(ETL)14から供給される電子
と、HTL層12から供給される正孔とが結合する場所
である。また、ETL層の材質は、正孔よりも電子の移
動度が大きいものとされている。従来技術におけるこれ
らETL、EL、HTL層の素材が、1994年3月1
5日受理の、タンらによる米国特許第5、294、87
0号、「オーガニックエレクトロルミネセント多色画像
表示装置」に記載されている。
子発光効率を増加させることとを目的として高蛍光染料
がドープされている場合が多い。そして図1Aの素子
は、金属接触層15、16及び上部電極層17を形成し
て完成する。一般的に、接触層15、16は、インジウ
ム或いはTi/Pt/Auから形成される。また、電極
層17は、オーガニックETL層14に接触するMg/
Ag等の合金層17’と、Mg/Ag合金を金(Au)
又は銀(Ag)で被膜した薄くて高仕事関数性の厚膜金
属層17”とからなる2層構成を有する。厚膜金属層1
7”は、透明である。所定のバイアス電圧が上部電極層
17と接触層15、16間に印加されると、ガラス基板
10を通して発光が生じる。図1AのLED素子は、発
光色やその構成に基づいて、0.05%〜4%の発光効
率をもつ。
e)をもつ別の従来のオーガニック発光素子構造が、従
来例として図1Bに図示されている。その構造が図1A
で示されたものと違うところは、EL層13がETL層
の役目をするため、図1AのETL層14を削除できる
ことである。しかしながら、作用を効率的なものとする
ためには、図1Bで示す素子のEL層13は、電子搬送
能力が高くなくてはならない。そうでなければ、図1A
で示した素子と同様のETL層14を別に設ける必要が
ある。
がよいとされている。そして、その駆動電圧は3〜10
Vでよい。これら初期の、見込みのある素子には、アモ
ルファス或いは高多結晶のオーガニック層が使われてい
る。この場合、フィルムを横切る電荷担体の移動性は制
限されるが、これにより電流が制限され駆動電圧が増加
する。しかし、多結晶状態から発生する微結晶のマイグ
レーションや成長が、この素子の主な欠点となる。電極
接触劣化も、同様にこの素子の欠点要因となる。
マー)LEDの一般的な断面図である図1Cに示されて
いる。図で示したように、ガラス支持層1が薄いITO
層3で被膜されており、素子の基板を構成している。I
TO層3上には、例えば、スピン被膜ポリマーのオーガ
ニック薄膜層5が形成されており、前述の素子のHTL
層、ETL層、EL層の全機能を備えている。また、こ
のオーガニック層5上には、金属性電極層6が形成され
ている。前記金属は、Mg、Ca、その他周知の利用可
能な金属が用いられる。
た多色エレクトロルミネセント画像表示装置が、前述の
タンらによる米国特許第5、294、870号に記載さ
れている。それに記載された発明は、青色発光サブ画素
区域において青色発光するオーガニック媒体を含む複数
の発光画素を開示する。この青色発光サブ画素区域の横
にいくらか離して蛍光媒体が配置されている。この場
合、蛍光媒体により、オーガニック媒体から生じた光が
吸収され、異なるサブ画素区域から赤色及び緑色の光が
発光される。このようにして青色サブ画素区域からの青
色光を吸収すると同時に、緑色又は赤色の光を発光する
蛍光染料でドープされた材料を利用するのは、緑色や赤
色のLED素子で直接発光画素を形成するよりも効率が
落ちる。というのは、効率値は、EL層の量子効率と蛍
光部の量子効率と(1−透過率)の積だからである。従
って、各発光色に対応して横方向に一定の間隔を置いて
異なるサブ画素区域を設ける必要があるのが、この表示
装置の欠点となる。
クトロルミネセントダイオードで使われるのと同じオー
ガニック材料を成長させることにより実現でき、RGB
表示装置に利用する際に、信頼性が高く、小型で、効率
がよく、そして駆動電圧が低くて済むオーガニックLE
Dの素子を提供することにある。
が異なる色を発光する数種のオーガニック電子発光媒体
を備える多色オーガニック発光素子の提供、また、表示
装置の共通の区域から各色を発光できるように、オーガ
ニック媒体を積み重ねて配列した高解像度多色表示装置
における素子の提供、そして、信頼性が高くて製造コス
トが低い3色オーガニック発光素子の提供が可能とな
る。
と、この基板上に支持された導電被膜と、この導電被膜
上に支持された電荷運搬材料の各層からなる透明オーガ
ニック発光素子と、この透明オーガニック発光素子上に
支持された透明導電層と、を備え、その透明導電層は、
透明オーガニック発光素子に接する面に仕事関数4eV
未満の金属層を有するとともに、当該金属層以外の部分
がITO(indium tin oxide)層とされ、この透明導電
層と基板上の導電被膜との間にバイアス電圧をかけるこ
とにより透明オーガニック発光素子が駆動されて光を発
することを特徴としたオーガニック発光構造が提案され
る。
ば、透明導電層で互いに分離しながら複数のLEDを積
み重ねて積層体を形成するようにし、少なくとも2つ
の、好ましくは3つのオーガニックLEDからなる多色
発光素子(LED)を構成することができる。このデバ
イスでは、各積層体から異なる色の光を発光させるた
め、それぞれの層に個別のバイアス電圧を入力できるよ
うになっている。
構造を用いた従来のオーガニック発光素子が図示されて
いる。図1Aの素子の基本構造は、以下で述べる本発明
でも使われている。
成長又は真空蒸着により形成されたオーガニック層から
なる非常に小型の集積RGB画素構造を簡略に示した断
面図である。(金属やITOを含む)様々な材質上でも
成長できるというオーガニック材料の能力に基づいて、
図20、21、22で示すような本発明の実施形態であ
るLEDの2重ヘテロ構造(DH)積層を構成する。説
明を簡単にするため、図2Aのように、LED20を積
層の底部に、LED21を中間部に、LED22を上部
に配置することとする。図2AではLEDを垂直方向に
積層しているが、他の方向にLEDを配向することも可
能である。他に、単ヘテロ構造(SH)のLED(図1
B)やポリマー層LED(図1C)等もDH構造LED
の代わりになって、発光素子でのDH素子としてSH素
子が利用できる。また、真空蒸着材とポリマー発光材の
組合せからなるSH素子及びDH素子ともに、本発明の
精神や範囲に含まれるものである。
に真空蒸着、気相成長、又は積層させたHTL層20H
が含まれる。上部のETL層20Tは、例えば、図2A
で図示した素子構造の場合のように、下部のHTL層2
0Hとの間でEL層20Eを挟んでいる。前記ETL層
20T及び以下で説明するその他のETL層は、M(8
−ヒドロキシキノレート)n(ただしMは金属イオンで
nは2〜4)で表せるオーガニック材料で形成されてい
る。尚、その他の適当なオーガニックETL層材の例
が、タンらの米国特許第5、294、870号に記載さ
れている。ETL層20Tの表面には、厚さ50Å以下
の薄く、半透明で且つ仕事関数の低い(好ましくは<4
eV)の金属層26Mが形成されている。この候補とし
て、Mg、Mg/Ag、As等が挙げられる。更に、金
属層26Mの表面には、他の透明な薄膜導電ITO層2
6Iが形成されている(説明を簡略にするため、これら
両金属層26Mと26Iの2層構成を、以下ITO/金
属層26と呼ぶ。)。前記2重ヘテロ構造素子20、2
1、22のそれぞれの下側では、透明導電ITO層26
I、35上に底部HTL層が形成されている。そして、
その上にはEL層が積層されており、更にその上には他
のETL層が積層されている。HTL層、ETL層、I
TO層、金属層、オーガニックEL層は、それらの組成
や厚さを適宜選択することにより、透明とされている。
尚、各HTL層の厚さは50〜1000Å、各EL層の
厚さは50〜200Å、各ETL層の厚さは50〜10
00Å、各金属層26Mの厚さは50〜100Å、各I
TO層26I、35の厚さは1000〜4000Å程度
である。尚、性能を最もよく発揮するためには、各層と
もに、上記条件を満たす範囲でなるべく薄いものとする
のが望ましい。従って、各LED20、21、22(I
TO/金属層を含む)の厚さは200Å程度とするのが
よい。
ED素子で前記素子20、21、22を形成した場合、
ETL層及びEL層は、図1BのSH構造で述べた層1
3と同様に単一の層で構成することになる。この層13
は、一般的には、Al−キノレートで形成される。この
ような素子の例が図2Bに図示されており、この場合、
EL層20E、21E、22Eのそれぞれが、EL層及
びETL層の機能を備えている。しかしながら、図2A
のDH構造LED積層は、図2BのSH構造のLED積
層と比較した場合、全体構成をより高効率にできると共
により薄くできるという長所を有する。
中心が互いにずれているが、各素子からの総出力光線は
LED20、21、22のいずれにおいても基本的に一
致している。出力光線が同心状に一致している場合、ガ
ラス基板に近接して設けられた発光及び非発光素子はガ
ラス基板から離れて設けられた1又は2以上の発光素子
に対して透明である。しかしながら、ダイオード20、
21、22は互いにオフセットされている必要はなく、
同心状に積層されていても構わない。この場合、各素子
からの光線は、他の光線と完全に一致することになる。
図12Eに、上記同心状に積層されたLED素子の構成
が図示されており、以下にその素子の製造方法に関する
説明がある。尚、各LEDがオフセットされた場合の構
成の場合でも同心状に配置された構成の場合でも、機能
的に差がないことに注意してほしい。各素子からガラス
基板37を透過する出力光線は、基本的に指向性がな
い。3個のLED素子積層体8へ印加する電圧を制御す
れば、各々の画素毎に、所望の色彩及び明度での発光を
いつでも可能とすることができる。従って、各LED素
子20、21、22のそれぞれは、図2A、図2Bで示
すように同時にR、G、B光線を発生させることがで
き、そして、この光線は、例えば、透明層を透過して出
力され、視認できる。各DH構造素子20、21、22
は、異なる色光線を発生させるため、適当なバイアス電
圧を印加することにより駆動される。2重ヘテロ構造L
ED20は、青色光線を出力する。また、2重ヘテロ構
造LED21は緑色光線、2重ヘテロ構造LED22は
赤色光線を出力する。LED20、21、22のそれぞ
れに付与する各電流値に対応させて、LED素子20、
21、22を個別に又は異なる組合せで駆動させれば、
各画素毎に所望の色による光出力を得ることができる。
0、21、22は、バッテリー32、31、30により
印加されるバイアス電圧によってそれぞれ駆動される。
電流は、各バッテリー32、31、30の正極端子か
ら、それぞれ対応するLED素子20、21、22のア
ノード端子40、41、42、及びカソード端子として
作用する端子21、21、42を経て、バッテリー3
2、31、30の負極へと流れる。その結果、LED素
子20、21、22のそれぞれから光が出力される。こ
の場合、対応するバッテリー32、31、30をLED
素子に選択的に切替接続するための内蔵手段(図示せ
ず)により、LED素子20、21、22への電流が選
択的に供給される。
2Bで図示したLED素子22が備える上部ITO接触
層26Iは、透明であり、ヘッドアップ表示装置として
利用可能な3色素子を構成している。
触層26Iを、上方向に進んでくる光を基板13に向け
て反射できるように、Mg/Ag、In、Ag、Au等
の金属薄膜層で形成してあるため、素子の発光効率を上
げることができる。また、ガラス基板37とITO層3
5間に多層誘電薄膜層を挿入して非反射面を形成するこ
とにより、素子全体の発光効率を増加させることもでき
る。非反射層は3層設けることが必要であり、それぞれ
の非反射層は、他の層から出射される光の波長に対する
非反射被膜を構成している。
つまり逆向きに素子を構成して、積層の底部からではな
く積層の上部から光を出力させることもできる。このよ
うな反転構造の例としては図2Cで示すようなものがあ
り、この場合ITO層35は薄い反射性金属層38とさ
れる。この実施形態において、例えば青色LED20に
着目してみると解るように、間にEL層20Eを挟んで
いるHTL層20HとETL層20Tとの位置が、先に
説明した素子の場合と反対に構成されている。そして、
金属接触層26Mは、ITO層26Iの上面に積層され
ている。この実施形態の積層内にある緑色LED21及
び赤色LED22についても、青色LED20の場合に
ついて既に説明したように、反転積層(HTL層とEL
層が逆転して、金属層とITO層が反対になっている)
で構成されている。ただし、この反転構造においては、
青色LED20が上部で、赤色LED22が底部に位置
せねばならない。その結果、素子20、21、22に供
給される電流は、バイアス電圧が印加された場合、図2
Aの実施形態と逆向きの方向に流れることになる。
明らかなように、段々の階段形状で構成されている。透
明接触層(ITO)26I部分は、積層内における各画
素素子に対してそれぞれ別個の独立したバイアス電圧を
付与できるようにされており、また、処理工程中におい
はエッチング停止部位として利用できるようになってい
る。各DH構造のLED素子20、21、22に別個の
バイアス電圧を付与することにより、画素からの出力波
長を調整して国際照明委員会(CIE)の色度基準で決
められた可視スペクトルのいずれかの色を変換出力する
ことができる。この実施形態において青色LED20
は、積層の底側に位置し且つ3個の素子の中で最も面積
の大きなものである。青色は、赤色や緑色の光に対して
透過性を有するため、出力側に近い素子底部に配置され
ているのである。尚、透明なITO/金属層26を用い
て異なる材質層を分離することにより、この素子製造工
程を簡略化できる。この製造工程について、以下に説明
する。図2A、2B、2Cで示した画素LED素子を実
現するために用いるオーガニック化合物に関する真空成
長工程や製造方法も、非常に特徴的である。図2A、2
B、2Cに示した縦方向積層では、3個の画素を非常に
小さい範囲で作成することが可能であり、これによって
高密度の表示装置を実現可能としている。
図2A、2B、2Cで図示するように、同時又は別個
に、矢印B、G、Rで示す光線が出力される。ここで、
出力光は、LED素子20、21、22の表面の全域か
ら照出されるものであって、図中に示されたR、G、B
の各矢印の幅が実際の出力光の幅を示すものでないこと
に注意してほしい。このようにして出力されるR、G、
Bの各光の色を加減算することにより、異なる明度、色
相の色彩として目に知覚されることになる。尚、このこ
とは、色の可視表示色彩技法の分野では周知である。そ
して、図で示すようなオフセット構成の場合は、赤色、
緑色、青色の各光線がほぼ一致して出力される。素子を
50ミクロンかそれ以下の更に小さいサイズにしても、
どのような色でも上記積層から出力できる。しかしなが
ら、この光の出力は、単独の画素から出力される光の色
としか捉えることができない。
層の表面に成長形成されるものであり、上方に行くに連
れてそれからの出力光の波長が長くなるようにして縦方
向に積層される。即ち、その素子の上部には、赤色の光
を出力する最大波長素子22が、そしてその底部には青
色の光を出力する最短波長素子20が形成される。この
ような方法で画素を構成して、画素即ち素子内における
光吸収が最小限となるようにする。各DH構造のLED
素子は、ITO/金属層26(詳しくは、半透明金属層
26Mと酸化錫インジウム層26I)により互いに分離
されている。ITO層26Iは、更に金属被膜処理され
ており、接触部40、41、42、43を備える接触域
がITO層の表面に形成されている。それら接触部4
0、41、42、43は、例えば、インジウム、プラチ
ナ、金、銀等の金属や、Ti/Pt/Au、Cr/A
u、Mg/Ag等の合金で形成される。周知の金属被膜
法や蒸着法を用いて、この接触部を形成することができ
る。このように設けた接触部40、41、42、43に
より、積層内の各LED素子に個別のバイアス電圧を印
加できるようになる。また、製造工程において、オーガ
ニックLED材と透明電極層26Iの化学特性差のた
め、電極層はエッチング停止層として作用する。従っ
て、素子製造工程における各画素の選択的エッチング処
理や露光処理が行えるのである。
1、22には、それぞれバッテリー32、31、30か
らなるバイアス電圧付与用の電源部が備わっており、こ
れらが各LED素子を駆動することにより発光を生じさ
せる。バッテリー32、31、30に代えて、適当な信
号を利用することも勿論可能である。LED素子(DH
構造における)は、発光のために要求される最少しきい
値電圧を必要とするが、その駆動電圧はバッテリー記号
で示されている。
3原色及びその中間色全部を出力できる能力をもつオー
ガニック化合物を選択して形成する。このオーガニック
化合物は、以下のような3価金属キノレート(quinolat
e)錯体、3価金属ブリッジ構成キノレート錯体、シッ
フ(Schiff)塩基2価金属錯体、錫(IV)錯体、金属ア
セチルセトネート錯体、2座配位金属錯体、ビスホスホ
ネート、2価金属マレオニトリルジチオレート(maleon
itriledithiolate)金属錯体、分子電荷転送錯体、芳香
族複素環ポリマー、希土類混合キレート等から選択でき
る。
した構造式で表され、Mはランタノイド或いは周期表3
〜13族に含まれる3価金属である。この実施形態に適
した3価イオンとして、Al+3、Ga+3、IN+3
が挙げられる。図3中のRは、水素、置換又は非置換ア
ルキル基、アリール基、複素環基を含む。アルキル基
は、直鎖型又は有枝鎖型で、1〜8個の炭素原子を持つ
ものがよい。好ましいアルキル基の例として、メチル基
やエチル基がある。好ましいアリール基の例としてはフ
ェニル基があり、複素環基の例としては、ピリジル、イ
ミダゾール、フラン、チオフェンがある。
は、好ましくは1〜8個の炭素原子をもち且つアリー
ル、ハロゲン、シアノ、アルコキシの中から選択される
少なくとも1つの置換基で置換できるものである。この
場合の好適なハロゲン基として、クロロ基がある。
lylmethylketon)、置換又は非置換サリチルアルデヒド
バルビツル酸(salicylaldehyde substituted with bar
bituric acid)で置換されたサリチルアルデヒド等、R
が上記の基でありR(O)CO−で示される基、ハロゲ
ン、Rが上記基でありRO−で示される基、キノレート
(8−ヒドロキシキノリン等)、及びそれらの誘導体
(キノレートで置換されたバルビツル酸等)その他の配
位子である。図3の構造式に含まれる最適な錯体とし
て、MとしてのGa+3、Lとしてのシクロ基が挙げら
れる。このような化合物によれば、青色の発光ができ
る。MがGa+3で且つLがカルボキシル酸メチルの場
合は、青色から青/緑の範囲の発光が可能な錯体とな
る。黄色又は赤色の発光は、L基をバルビツル酸で置換
したサリチルアルデヒド又はバルビツル酸で置換した8
−ヒドロキシキノリン(8-hydroxyquinoline)を用いる
ことができる。緑色の出力光は、L基にキノレートを使
うことにより生成できる。
レート錯体が、図4A及び図4Bに図示されている。こ
れらの錯体からは、緑色の発光が可能であり、従来例で
使われているトリスキノレート(Lがキノレート基であ
る図3の錯体)と比較して、環境変化に対する安定性が
向上する。これらの錯体で使われる3価金属イオンM
は、前述のように、Al+3、Ga+3、In+3等が
好ましい。図4AのZ基は、Rが上記のようなSiRを
有する。Z基は、燐酸塩を作るP=Oの基でも構わな
い。
及び5Bに図示されたものを含むが、M1は周期表2〜
12族から選択できる2価金属であり、好ましくはZn
である(ハナダらの「アクソメシン/鉛錯体の薄膜にお
ける青色電子発光」、日本応用科学学会誌、32巻(1
993年)、L511〜L513ページを参照)。この
R1は、図5Aと5Bの構造式から選択されるものであ
る。R1基は、ピリジル基の窒素又はアミンが配位した
金属錯体とするのが好ましい。更にXは、水素、1〜8
個の炭素原子をもつアルキル又はアルコキシル基、アリ
ール基、複素環基、ホスフィノ基、ハライド基、アミノ
基その他の基から選択できる。この場合の好ましいアリ
ール基はフェニル基であり、好ましい複素環基はピリジ
ル、イミダゾール、フラン、チオフェンから選択でき
る。X基は、シッフ塩基2価金属錯体のオーガニック溶
剤への溶解度に影響を与える。特に、図5Bのシッフ塩
基2価金属錯体は、波長520nmの光を生成する。
体は、緑色の光を発光する。これらの錯体には、L1が
サリチルアルデヒド、サリチル酸、キノレート(8−ヒ
ドロキシキノリン等)から選択され且つ化学式SnL1 2
L2 2で表せる錯体が含まれる。また、L2には、水素基
を除く前述のR基全部が含まれる。例えば、L1がキノ
レート基で且つL2がフェニル基である錫(IV)金属錯
体からは、液状(solid state)のフォトルミネセンス
測定によれば、波長(λ)が504nmの光が出力され
る。
はNR2で且つR2が水素基及び置換又は非置換アルキ
ル基やアリール基から選択可能な図6の構造式で表せる
錯体も含まれる。アルキル基は、直鎖型又は有枝鎖型で
且つ1〜8個の炭素原子をもつのが好ましい。アルキル
基又はアリール基の置換基としては、1〜8個の炭素原
子をもつアルコキシ基、シアノ基、ハロゲン基等があ
る。L3は、アルキル基、アリール基、ハライド基、キ
ノレート(8−ヒドロキシキノレート等)サリチルアル
デヒド基、サルチル酸基、マレオニトリルジチオレート
(MNT)基等から選択できる。AがS、YがCN、且
つL3がMNTのとき、赤とオレンジの中間色が発光で
きる。
ト)3錯体からは、青色の光が出力される。金属イオン
Mは、ランタノイド或いは周期表3〜13族の3価金属
から選択される。本実施形態に適した金属イオンは、A
l+3、Ga+3、In+3等である。図7のR基は、
図3のR基と同じである。例えば、Rがメチル基で、M
がAl+3、Ga+3、In+3の1つである場合、液
状素子のフォトルミナンス測定による結果では、この素
子から出力される光の波長はそれぞれ415nm、44
5nm、457nmとなる(キドらの「ランタノイド錯
体を使ったオーガニック電子発光素子」、合金化合物学
会誌、92巻(1993年)、30〜33ページを参
照)。
通青色光を発光する。このような錯体の化学式はMDL
4 2 であり、Mはランタノイドや周期表3〜13族の3
価金属である。この場合の適した金属イオンとしては、
Al+3、Ga+3、In+ 3、Sc+3等が挙げられ
る。またDは、図8Aに図示されているような2座配位
子である。より詳しくいうと、上記2座配位錯体Dに
は、図8AのR基が前述のものと同じである、2−ピコ
リルケトン(2-picolylketones)、2−キナルジルケト
ン(2-quinaldylketones) 、2−(0−フェノキシ)ピ
リジンケトン(2-(O-phenoxy)pyridine ketones)が含
まれる。
(acetylacetonate)、R3がSiとCのいずれかであ
り、Rが前記の場合と同様の基から選択される化学式O
R3Rの化合物、3、5−ジ(t−bu)フェノール
(3、5di(t‐bu)phenol)、2、6−ジ(t−bu)フ
ェノール(2、6di(t‐bu)phenol)、2、6−ジ(t−
bu)クレゾール(3、5di(t‐bu)cresol)、H2Bpz
2 等が含まれる。尚、これらの化合物は、図8B〜8E
に図示されている。
トン)ビス[2、6−ジ(t−bu)フェノキシド]
(alminum(picolymethylketone)bis[2,6‐di(t‐bu)phe
noxide])は、液状素子のフォトルミネセンス測定によ
れば、波長(λ)420nmの光を出力する。前記化合
物のクレゾール誘導体でも、波長420nmの光を出力
した。また、アルミニウム(ピコリメチルケトン)ビス
(OSiPh3)(alminum(picolylmethylketone)bis(O
siph))やスカンジウム(4−メトキシ−ピコリルメチ
ルケトン)ビス(アセチルアセトネート)(scandium(4
‐methoxy‐picolylmethylketone)bis(acetylacetonat
e))では433nm、アルミニウム[2−(0−フェノ
キシ)ピリジン]ビス[2、6−ジ(t−bu)フェノ
キシド](alminum[2‐(O‐phenoxide)pyridine]bis[2,
6‐di(t‐bu)phenoxide])では450nmである。 前
記のビスホスホネートは、本発明に従ってEL層で利用
できる他の種類の化合物である。ビスホスホネート(bi
shosphonate)は、下記の化学式で示せる。即ち、M2
x(O3P−オーガニック−PO3 )yである。
が共に1の場合、これは4価金属イオンとなる(Zr
+4、Ti+4、Hf+4等)。xが3でyが2だと、
金属イオンM2は2価となって、Zn+2、Cu+2、
Cd+2等が適用できる。化学式の「オーガニック」の
部分は、ホスホネート基と2官能価化できる芳香族又は
複素環の蛍光化合物がよい。
は、例えば、図9Aと9Bに示すようなフェニレンビニ
レンビスホスホネート(phenylene vinylene bisphon
etes)等が好ましい。特に、図9Aはβ−スチレニルス
チルベンビスホスホネート(β‐styrenyl stilbene
bisphosphonates)であって、図9Bは4、4’−ビフ
ェニルジ(ビニルホスホネート)(4,4'‐biphenyl d
i(vinylphosphonates))であり、Rは前述の場合と同じ
で、R4は好ましくは1〜8個の炭素原子をもつ置換又
は非置換アルキル基やアリール基から選択できる。好適
なアルキル基は、メチル基及びエチル基である。好適な
アリール基には、フェニル基がある。アルキル基やアリ
ール基の好適な置換基には、好ましくは1〜8個の炭素
原子を持ち且つアリール基、ハロゲン基、シアノ基、ア
ルコキシ基から選択された、少なくとも1種の基が含ま
れる。
ト(MNT)錯体は、図10に図示した化学式構造を有
している。2価金属イオンM3には、+2電荷をもつあ
らゆる金属イオンを適用できるが、Pt+2、Z
n+2、Pd+2等の遷移金属イオンが望ましい。Y1
は、シアノ基や、置換又は非置換フェニル基から選択で
きる。好適なフェニルの置換基として、アルキル基、シ
アノ基、クロロ1、2、2−トリシアノビニルが挙げら
れる。
適なL5基として、前述のようなR基を有するP(O
R)3やP(R)3があるが、2、2’−ジフィリジル
(2、2'‐dipyridyl)、フェナンチロリン(phenanthto
line)、1、5−シクロオクタジエン(1,5‐cycloocta
diene))、ビス(ジフェニルホスフィノ)メタン(bis
(diphenylphosphino)methane)等のキレート配位子も適
用できる。
ト性イリジウム(I)、ラジウム(I)、プラチナム
(II)ジチオレート錯体」、米国化学学会誌、105
巻(1983年)、1795ページの記載内容に基づ
き、前記化合物の多様な組合せからの発光波長の例を表
1に示している。
分子電荷転送錯体には、電子ドナー構造をもつ電子アク
セプタ等が含まれる。図11A〜11Eに、適用可能な
多様な電子アクセプタが図示されており、図11F〜1
1Jに示された電子ドナー構造の内の1つを使って電荷
転送錯体を構成している。図11A〜11HのR基は、
前述のものと同様である。
転送錯体を直接蒸着することにより作成できる。このよ
うにした場合、アクセプタとドナーとの結合度合により
赤色から青色までの範囲でその発光波長を変化させて出
力できる。
もつ芳香族や複素環式化合物のポリマーを、本発明にお
けるEL層として利用することも可能である。このよう
なポリマーも、異なる色を発光させるために利用でき
る。下記の表2に、ポリマーの好適な例及びその発光色
が記載されている。
は、2座配位芳香族か又は複素環式の配位子かと結合し
たランタノイド原子(La、Pr、Nd、Sm、Eu、
Tb等)が含まれる。2座配位子は転送担体(電子等
の)として作用するが、発光エネルギーを吸収すること
はない。それゆえ、2座配位子により、金属へエネルギ
ーを転送できる。希土類混合キレートの配位子の例とし
て、サリチルアルデヒドやその誘導体、サリチル酸、キ
ノレート、シッフ塩基配位子、アセチルアセトネート、
フェナンチロリン、バイピリジン、キノレート、ピリジ
ン等がある。
は、ポリフォリニック化合物で形成できる。更に、正孔
搬送層20H、21H、22Hは、少なくともそのうち
の1つが芳香族環の員であり且つ炭素原子とのみ結合さ
れた少なくとも1個の3価窒素原子を含む化合物であ
る、少なくとも1つの正孔を搬送できる芳香族第3アミ
ンであっても構わない。例えば、芳香族第3アミンに
は、モノアリールアミン、ジアリールアミン、トリアリ
ールアミン、ポリアリールアミン等のアリールアミンが
適用できる。その他、適切な芳香族第3アミンが、ポリ
フォリニック化合物の例と共に、タンらの米国特許第
5、294、870号に記載されており、その内容が本
発明の主旨と一致しているという範囲で、そのすべての
内容を本発明の引用例として採用する。
3色画素の製造方法は、シャドーマスク法及びドライエ
ッチング法のいずれかにより実行できる。ここで説明を
簡略化するため、いずれの方法の説明においても、底部
ガラス基板から発光する各発光層は、オーガニック化合
物層からなる2重ヘテロ構造LED体であると仮定す
る。当然ながら、各活性発光層が多層オーガニック化合
物層であるような多層ヘテロ結合オーガニックLED構
成、及び/又は、反転構成(積層の上部面から発光する
場合)の場合も、本方法をわずかに変更することによっ
て製造できることは当業者には理解できできるであろ
う。
2(A〜E)に図示されている。この方法においては、
まず最初に、ITO層52で被膜されたガラス基板50
を、沸騰したトリクロロエチレン又は同様の塩素化炭化
水素に約5分間浸積する。この後、アセトンで5分程度
洗った後、更に約5分間だけメチルアルコール洗浄を行
う。次に基板50を、超純度(UHP)窒素の噴流を用
いて乾燥させる。ここで使う洗浄溶剤は、「電子グレー
ド」であるのが望ましい。洗浄後に、周知のスパッター
法や電子ビーム法を用いて、ITO層52を真空中で基
板50上に形成する。
して、青色発光LED55を形成する(図12B)。ま
ず、ITO層52の所定の外側部にシャドーマスク73
を載置する。このシャドーマスク工程で使うシャドーマ
スク73やその他のマスクは、素子の動作寿命を縮める
ような湿気、酸素、その他の汚染物を素子に触れさせる
ことがないようにしながら、処理工程中で導入し且つ除
去しなければならない。この作業は、窒素ガス又は不活
性ガスが充満した雰囲気中でマスク交換を行ったり、或
いは、遠隔操作を使って真空環境で素子面にマスクを遠
隔載置することにより実践できる。そして、マスク53
の開孔を通じて、50〜100Å厚の正孔搬送層(HT
L)54及び50〜200Å厚の青色発光層(EL)5
6を空気に触れない状態を保ちつつ真空中等で順番に積
層する(図12B参照)。そして、このEL層56上
に、好ましくは50〜1000Åの厚さの電子搬送層
(ETL)58を形成する。更にこのETL層58上
に、例えば、好ましくは10%Agと90%Mg層、又
は低仕事関数金属若しくは金属合金層からなるような半
透明金属層60Mを作成する。金属層60Mの厚さは、
100Å以下の薄いものである。これら積層54、5
6、58、60Mは、気相蒸着、イオンビーム積層、電
子ビーム積層、スパッタリング、レーザー融蝕法等のい
ずれかの周知方向性積層技術により作成することが可能
である。
ング又は電子ビーム法を用いて、1000〜4000Å
厚のITO接触層60Iを積層する。ここでも説明を簡
略化するために、図2の層26と同様に、前記の両層6
0M及び60Iを単層60として説明する。各層60の
低仕事関数金属部分60Mは、その下側のETL層58
と直接接触するが、ITO層60Iはそのすぐ上側のH
TL層に接触する。ここで、どの素子製造工程でも、そ
の工程間において真空環境を阻害しないよう真空を維持
しつつ行われる必要があることに注意してほしい。
を製造したのと同じシャドーマスク及び積層技術によっ
て、前記上端層60上面に作成された緑色発光LED6
5が図示されている。このLED65は、HTL層6
2、緑色発光層64、ETL層66とからなる(その厚
さは、100Åであり且つ半透明であるが、電気連続性
を損なうほど薄くはない)。そして、第2の薄膜金像層
60MがETL層66上に積層され、続いて1000〜
4000Å厚の他のITO層60Iを第2の挟積層60
として形成する。
積層技術を用いて、前記層60の上面に赤色発光LED
75を積層している。赤色発光LED75も、HTL層
70、赤色発光EL層72及びETL層74とからな
る。最後にLED75の上面に、緑色上記発光層の場合
と同様に、60I及び60Mの両層からなる挟積層60
を形成する。図2の実施形態と同様に他の構成として、
上部透明ITO層60Iを、素子上部における光損失を
削減するために、上方向への光を基板50へ向かって反
射するミラーとして働く所定の金属電極層に代えること
もできる。尚、各ETL層74、66、58の厚さは5
0〜200Å、各HTL層54、62、70の厚さは1
00〜500Å、各EL層56、64、72の厚さは5
0〜1000Å程度である。明度や効率を最もよくする
ためには、ITO/金属層を含む全層を、上記厚さ範囲
内で、できるかぎり小さくする必要がある。
51、59を、ITO/金属層60のITO部分60I
の上面に電気接触端子88、89、92、94、96を
それぞれ形成する。電気端子は、インジウム、プラチナ
ム、金、銀等の金属か、Ti/Pt/Au、Cr/A
u、Mg/Ag等の合金で形成するのが望ましい。この
製造方法においても、素子の不要部分をマスクした後で
適当な金属積層法或いは蒸着法を使って行うことができ
る。
2Eに示されているように、マスクされた全金属接触端
子51、59、88、89、92、94、96を除いた
素子全域を、絶縁層97で被膜する。絶縁層97は、湿
気、酸素、その他の汚染物に対して不浸透性であるた
め、LEDの汚染を防止できる。絶縁層97は、電子ビ
ーム法、スパッタリング、又は高温プラズマで補完した
CVD法により、SiO2、Si2N3 等の窒化シリコン
又はその他の絶縁材により形成できる。尚、この積層工
程においては、LED特性を損ねるような120℃以上
の温度にならないよう注意する必要がある。
ドライエッチング法を、図13(A〜F)に図示してい
る。図13Aでは、最初に、前記シャドーマスク工程と
同様の方法で、ガラス基板102を洗浄する。そしてガ
ラス基板102の上に、周知のスパッタリングや電子ビ
ーム法を使って真空中でITO層101を形成する。更
に、ITO層101の表面全体に、従来の真空蒸着法
や、ポリマーを用いる場合にはスピン法やスプレー被膜
法を利用して、それぞれシャドーマスク工程の積層と同
じ厚さのHTL層104、青色EL層105、ETL層
106、金属層107MとITO層107Iを含む挟積
層107を積層形成する。尚、ITO/金属挟積層10
7は、厚さが100Å以下であり、その低仕事関数金属
層107Mは、ETL層106のすぐ上面に形成され、
1000〜4000Å厚のITO厚膜層107Iは、こ
の金属層107M上に形成される。ITO層107I上
の全面には、低温プラズマCVD法にて1000〜20
00Å厚の窒化シリコン又は2酸化シリコンのマスク材
108を被膜形成し、次に、窒化シリコンその他の層1
08上に、HPR1400J等の正極フォトレジスト層
109を積層する。そして、図13Bに示されているよ
うに、フォトレジスト層109の外側域110を、一般
的な写真リソグラフ技法を用いて、露光させ除去する
(図13A参照)。露光される外側域110は、底部I
TO層101が露出され電気接触可能な区域とされてい
る。図13Cでは、(図13Bで特定されている)フォ
トレジストが除去された区域で、ある窒化シリコン層1
08の外側部分111がCF4:O2のプラズマを用いて
除去される。その後、イオン加工法その他のプラズマエ
ッチング法によって、ITO/金属層107Iと107
Mの露出された外側域が除去される。同様に、対応する
ETL層106、EL層105,HTL層104の外側
域は、O2のプラズマ法により順番に除去され、続い
て、残りのフォトレジスト層109を除去する。最後
に、再度CF4:O2のプラズマを使って窒化シリコンマ
スク層108を除去すれば、図13Dに図示されるよう
な青色発光LEDが完成する。
て、図13Eに示したように、ITO層101の外側部
をマスクするフォトレジストマスク113を積層し、そ
れ以外の部分では前記方法と同様のドライエッチング工
程を行って青色LEDの上部に緑色LED115を形成
する。つまり、HTL層114、緑色発光EL層116
等が積層される(図13F参照)。青色LED製造工程
と同様の写真リソグラフ法又はドラエッチング法を用い
れば、緑色LED115が完成する。更に同じドライエ
ッチング技法により、緑色発光LED115上に、赤色
LED117を形成する。その後、図12Eの層97と
同じような不導体層119を、シャドーマスク工程で説
明した電気接触端子の露出パターン作業を用いて、LE
D積層体上に形成する。更に、不導体層119にドライ
エッチング法によって開孔を作成するため、フォトレジ
ストマスクを被膜形成する。そして最後に、リフトオフ
技法を使って、フォトレジスト層や余分な金属を除去す
るのである。
他の技法を用いてLED積層を製造した後、素子の性能
や信頼性が許容範囲内になるような積層パッケージを製
造する。図14(A〜C)は、本発明の多色LED素子
を4つ以下の範囲で容易にパッケージ化し、且つ該パッ
ケージを密閉化するような実施形態が示されている。
尚、図14(AとB)中で使用される符号の内、図12
Eで使用されるのと同じ符号は、図12Eと同じ部分を
示すものである。このパッケージ構造は、図13Fとほ
ぼ同様である。図14Aのように、素子全体をSiNx
等の絶縁層97で被膜した後、アクセス開孔120、1
22、124を周知のエッチング/フォトマスク技法で
作成し、本発明の場合では、青色LED、緑色LED、
赤色LED(オーガニック発光ダイオード)それぞれの
最上面にある金属層60M’、60M”、60M”’を
露出させる。続いて、それら露出した金属層60M’、
60M”、60M”’の端部に位置するインジウム溶接
突起132、133、134にまで伸長するような(通
常は金を使った)金属導電通路126、128、130
を、周知の方法で形成する。同様に、周知の方法で、内
側端がITO層52に接触しており、外側端が端部に位
置するインジウム溶接突起136と接続されている(金
等で形成された)金属導電通路135を経由したアノー
ド電極端子を形成する。更に、素子全体をSiNx等の
他の絶縁層で被膜して、溶接突起132、133、13
4、136だけを端面に沿って露出させる。このような
方法を使えば、従来技術を用いてオーガニックLED素
子を簡単にパッケージ化できる。尚、以下に示すような
他の実施形態によっても、パッケージを製造することが
可能である。
50上に4個の多色LED素子をパッケージ構成で作成
する方法を、図14A、14B、14Cを参照して説明
する。この場合まず、ガラス基板50を酸化錫インジウ
ム(ITO)層152で被膜する。その後、下記の工程
により、多色オーガニックLED積層パッケージを作成
する。
配するというパターンで積層されるSiO2層138を
ITO層52上面に設けるため、従来方法を用いてIT
O層52をマスクする。
ずれかの構造を作成するための前述の方法を使って、S
iO2層138上の区域140内の共通層を分かち合う
4個の3色LED積層を形成する。
0’〜180’を設けるため、SiO 2層138上の各
端子外側端に積層を行うって金属接触端子170〜18
1を製造する。
端子中で見た場合、各端子の組の中で連続する3つにつ
いては、図14Aで示した端子126、128、130
と同じである。3個の接触端子170から172、17
3から175、176から178、179から181の
内側端即ち外側端の反対端は、それぞれ金属層60
M’、60M”、60M”’と電気的に接続されてお
り、4つのオーガニックLED素子内の各素子について
見た場合でも同様である。4個のLED素子に共通なI
TO層52の端部上に、シャドーマスク法にて、本例で
は共通アノード接続する他の金属接触端子182を形成
する。ここで、適切なマスキング法及びエッチング法を
用いて完全に独立した層からなる4個の素子を作成して
も、マルチプレクス動作可能な後者のアレーでは4つの
アノード接触端子を形成する必要があることに注意して
ほしい。本例における多色LEDアレーは、非マルチプ
レクス動作アレーである。
連続するバンド又はリング状にスパッタリング、プラズ
マ増強CVD、又は電子ビーム積層方法を用いて形成
し、露出している結合パッド170’〜181’だけを
残すようにする。
に、Pb−Sn又は低温溶解ソルダの連続バンド又はリ
ング186を積層する。
ダ密閉リング186と整合する金属リング190を形成
する。
がソルダーリング186と対向するよう、カバーガラス
188を集合体に組み込む。
合体を置いてから、加熱してソルダリング186を溶解
させ、不活性ガズをその内部192に閉じ込めて空気密
閉処理する。
示装置である表示装置194が図示されている。ドット
195は、楕円形状である。表示装置194は、196
等の符号で示す複数の画素からなる。ITOで被膜され
たガラス板全面をカバーするようにして、画素はX−Y
マトリクス状に配置されている。そして、この各画素は
図2のような積層LED構造を備えている。図2のバッ
テリー30、31、32等の固定バイアス手段の代わり
に、図2で青(B)、緑(G)、赤(R)で示されてい
る端子線を延長して、TV受像器等の表示モニター19
9の制御下で、それぞれ適切な水平及び垂直走査プロセ
ッサー197と198と接続されている。従って、LE
D素子の各マトリクスには少なくとも2本の軸(x、
y)があって、各LEDは少なくともこの2軸の交差点
に位置する。この場合x軸を水平軸に、y軸を垂直軸に
することができる。尚、NTSC等のテレビ信号を、色
表示のための色成分R、G、Bに変換することは周知で
ある。3原色として赤、緑、青を使うコンピュータ用の
モニター装置も、よく知られている。水平や垂直走査に
よりそのような表示装置を駆動且つ制御することも、同
じく周知である。表示装置の画面上に形成された画素ア
レーの走査は、xyアドレスを利用するxy走査法で実
行できる。これら技術は、アクティブマトリクス式表示
装置で、利用されている。
り、DH構造LED画素へ各画素の赤、緑、青の出力を
決める信号の入力を決定できる。このようにして、表示
装置における各走査線上にある各LEDのそれぞれに選
択的にアクセスし、パルス幅変調信号や階段状電圧等の
手段によってバイアス駆動することにより、単色又は多
色の光を装置から出力することができ、以上のように装
置から出力された光によって所定の形状や色の画像を形
成できる。また、xy軸の各自を順番に走査して、マト
リクス状のLEDの選択部分を順番に駆動し、連続して
垂直方向にカラー画層を作成できるよう発光させること
もできる。LEDの選択部分は同時に駆動することも可
能である。
れば、非常に狭い区域内で3色DH構造LED画素を有
するような画素を製造できる。従って、1インチあたり
300から600本以上の走査線を持つような解像度を
備えた表示装置である高精細表示装置を実現できること
となる。このような高解像度は、異なる色を出力するオ
ーガニック発光層や蛍光媒体が互いに横方向に一定の間
隔をおいて配置されるような従来技術では到底達成でき
ない。
う狭い有効域内で、数百個の画素ダイオードを垂直及び
水平方向に積層するような、つまり図2に図示するよう
なLED素子を作成することは可能である。従って、製
造技術の面においても、高光出力且つ高解像度の表示装
置を実現できるのである。
多色LED素子が、本発明の更なる実施形態として図1
6に図示されている。将来における技術水準の高低よっ
て、Nの値は現実的に限定されるであろう。このLED
のNレベル積層体は、例えば、図12(A〜E)で説明
したシャドーマスク工程、又は、図13Aから13Fで
説明したドライエッチング工程のいずれかにより作成で
きる。図16の積層アレーの基部即ち底部は、図13F
のようなガラス基板102であり、その上面にITO層
101が被膜されている。第1のLEDのすぐ上部にL
EDが積層形成され、各LEDは、前記ITO層101
の上に順番に形成されたHTL層154、EL層15
6、ETL層158、金属層160、ITO層162か
らなる。N番目のLED164には、その最上面のIT
O層162の更に上面に最上部金属層が形成されている
(図13Fの層152を参照)。そして図13Fの色発
光積層体と同様に、積層体には不導体層119が被膜形
成される。各LED素子中にあるEL層156の素材
は、そのLEDから所望の色が発光できるようなものが
選択される。3色素子では、赤色発光層による光学吸収
を避けるため、短い波長光(青)の素子を長い波長光
(赤)の素子よりも下側に位置させる。各LEDの色選
択や積層するLEDの数は、所望する色や陰影の適用能
力や用途によって異なる。このような多色素子は、積層
体の所定の素子から出力される別々の波長を使って違う
光学チャンネルで送信できるような光学通信ネットワー
クでも利用できる。この装置による発光が本来的に備え
る同心特性は、単線光通信ファイバーにおいて、複数波
長の結合を可能にする。実際、そのような積層アレーに
おいては、アクセス開孔が各素子のITO層162に設
けられ、その後に図14A、14B、14Cの各積層多
色LED素子で説明したのと同様の方法で、積層体のL
EDの電気接続やパッケージ化を容易にするための所定
の金属積層が行われる。
且つ高明度なあらゆるサイズのオールカラー平面パネル
表示装置が作成できる。従って、下は数mmから、上は
ビルの大きさまで、いかなる大きさの表示装置にでも、
本発明を適用できる。この表示装置は、個々のLEDの
サイズに従った解像度で、フルカラーの文字画像及び絵
画像のいずれも表示できる。
いて様々な変更を加えうることは、当業者から見て当然
に理解できよう。そのような変更例も、付随の請求項の
精神や範囲にカバーされるものである。例えば、図2で
示した3色素子等の多色積層LED素子を変更した例と
して、真空中で3層全部を形成する代わりに、ポリマー
素子或いは蒸着金属ホスホネートフィルムから図1Cの
LED20を作成し、残りの2個の積層LEDを蒸着で
形成することも可能である。
発光素子(LED)の断面図である。図1Bは、従来の
オーガニック単ヘテロ構造発光素子(LED)の断面図
である。図1Cは、従来のオーガニック単層ポリマーL
EDの断面図である。
る積層した3色画素を利用する結晶オーガニック発光素
子(LED)の断面図である。
る様々なオーガニック化合物の図である。
る様々なオーガニック化合物の図である。
る様々なオーガニック化合物の図である。
る様々なオーガニック化合物の図である。
る様々なオーガニック化合物の図である。
る様々なオーガニック化合物の図である。
る様々なオーガニック化合物の図である。
きる様々なオーガニック化合物の図である。
きる様々なオーガニック化合物の図である。
造のために用いるシャドーマスク処理工程を示す図であ
る。
造のために用いるドライエッチング処理工程を示す図で
ある。
パッケージを簡単にした多色LEDを示す図である。図
14Bは、本発明による他の実施形態である密閉パッケ
ージを示す断面図である。 図14Cは、図14Bの1
4C−14C線に沿った断面図である。
子を使ったRGB表示装置のブロック図である。
た、本発明による他の実施形態のLED素子を示す図で
ある。
Claims (12)
- 【請求項1】 基板と、該基板上に支持された導電被膜
と、該導電被膜上に支持された電荷運搬材料の各層から
なる透明オーガニック発光素子と、該透明オーガニック
発光素子上に支持された透明導電層と、を備え、 前記透明導電層は、前記透明オーガニック発光素子に接
する面に仕事関数4eV未満の金属層を有するととも
に、該金属層以外の部分がITO(indium tin oxide)
層とされ、この透明導電層と前記導電被膜との間にバイ
アス電圧をかけることにより前記透明オーガニック発光
素子が駆動されて光を発することを特徴とするオーガニ
ック発光構造。 - 【請求項2】 透明導電層が厚さ100Å未満である請
求項1記載のオーガニック発光構造。 - 【請求項3】 基板が透明である請求項1又は請求項2
記載のオーガニック発光構造。 - 【請求項4】 透明導電層中の金属層がMgからなる請
求項1〜3のいずれか1項に請求項2記載のオーガニッ
ク発光構造。 - 【請求項5】 透明導電層中の金属層がMg及びAgか
らなる請求項1〜3のいずれか1項に記載のオーガニッ
ク発光構造。 - 【請求項6】 透明導電層のITO層は、金属層の上に
蒸着(デポジション)されたものである請求項1〜5の
いずれか1項に記載のオーガニック発光構造。 - 【請求項7】 透明導電層のITO層が1000〜40
00Åの厚さである請求項1〜6のいずれか1項に記載
のオーガニック発光構造。 - 【請求項8】 基板上の導電被膜が透明である請求項1
〜7のいずれか1項に記載のオーガニック発光構造。 - 【請求項9】 基板上の導電被膜がITO層である請求
項8記載のオーガニック発光構造。 - 【請求項10】 基板上の導電被膜が光を反射する金属
層である請求項1〜7のいずれか1項に記載のオーガニ
ック発光構造。 - 【請求項11】 透明オーガニック発光素子が単ヘテロ
構造をもつ請求項1〜10のいずれか1項に記載のオー
ガニック発光構造。 - 【請求項12】 透明オーガニック発光素子が二重ヘテ
ロ構造をもつ請求項1〜10のいずれか1項に記載のオ
ーガニック発光構造。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/354,674 US5707745A (en) | 1994-12-13 | 1994-12-13 | Multicolor organic light emitting devices |
US08/354,674 | 1994-12-13 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51983096A Division JP3496681B2 (ja) | 1994-12-13 | 1995-12-06 | 多色オーガニック発光素子 |
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Publication Number | Publication Date |
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JP2001273979A true JP2001273979A (ja) | 2001-10-05 |
JP4053734B2 JP4053734B2 (ja) | 2008-02-27 |
Family
ID=23394434
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51983096A Expired - Lifetime JP3496681B2 (ja) | 1994-12-13 | 1995-12-06 | 多色オーガニック発光素子 |
JP2001072847A Expired - Lifetime JP4053734B2 (ja) | 1994-12-13 | 2001-03-14 | オーガニック発光構造 |
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---|---|
US (5) | US5707745A (ja) |
EP (2) | EP0808244B1 (ja) |
JP (2) | JP3496681B2 (ja) |
KR (1) | KR100419020B1 (ja) |
CN (3) | CN1236410C (ja) |
AR (1) | AR001331A1 (ja) |
AT (1) | ATE220246T1 (ja) |
AU (1) | AU690413B2 (ja) |
BR (1) | BR9510076A (ja) |
CA (1) | CA2206769A1 (ja) |
DE (2) | DE69527308T2 (ja) |
ES (1) | ES2117590B1 (ja) |
FI (1) | FI972176A (ja) |
FR (3) | FR2728082B1 (ja) |
GB (1) | GB2313478B (ja) |
IT (1) | IT1277977B1 (ja) |
NO (1) | NO972706L (ja) |
PL (1) | PL179550B1 (ja) |
RU (1) | RU2160470C2 (ja) |
TW (1) | TW294842B (ja) |
WO (1) | WO1996019792A2 (ja) |
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- 1995-12-06 KR KR1019970703981A patent/KR100419020B1/ko not_active IP Right Cessation
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- 1995-12-06 CN CNB001095781A patent/CN1236410C/zh not_active Expired - Lifetime
- 1995-12-06 DE DE69527308T patent/DE69527308T2/de not_active Expired - Lifetime
- 1995-12-06 RU RU97112083/09A patent/RU2160470C2/ru active
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- 1995-12-06 DE DE19581862T patent/DE19581862T1/de not_active Withdrawn
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- 1995-12-06 EP EP01108236A patent/EP1119059A3/en not_active Withdrawn
- 1995-12-12 AR AR33458295A patent/AR001331A1/es unknown
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