DE602004025877D1 - Nichtflüchtiges Speicherbauelement mit einem Schaltelement und einem Widerstandsmaterial sowie Verfahren zur Herstellung des Speicherbauelements - Google Patents
Nichtflüchtiges Speicherbauelement mit einem Schaltelement und einem Widerstandsmaterial sowie Verfahren zur Herstellung des SpeicherbauelementsInfo
- Publication number
- DE602004025877D1 DE602004025877D1 DE602004025877T DE602004025877T DE602004025877D1 DE 602004025877 D1 DE602004025877 D1 DE 602004025877D1 DE 602004025877 T DE602004025877 T DE 602004025877T DE 602004025877 T DE602004025877 T DE 602004025877T DE 602004025877 D1 DE602004025877 D1 DE 602004025877D1
- Authority
- DE
- Germany
- Prior art keywords
- memory device
- producing
- switching element
- resistance material
- volatile memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
- G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0007—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising metal oxide memory material, e.g. perovskites
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/883—Oxides or nitrides
- H10N70/8833—Binary metal oxides, e.g. TaOx
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/30—Resistive cell, memory material aspects
- G11C2213/32—Material having simple binary metal oxide structure
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/79—Array wherein the access device being a transistor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030035562A KR100773537B1 (ko) | 2003-06-03 | 2003-06-03 | 한 개의 스위칭 소자와 한 개의 저항체를 포함하는비휘발성 메모리 장치 및 그 제조 방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602004025877D1 true DE602004025877D1 (de) | 2010-04-22 |
Family
ID=33157373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004025877T Expired - Lifetime DE602004025877D1 (de) | 2003-06-03 | 2004-05-27 | Nichtflüchtiges Speicherbauelement mit einem Schaltelement und einem Widerstandsmaterial sowie Verfahren zur Herstellung des Speicherbauelements |
Country Status (6)
Country | Link |
---|---|
US (2) | US8164130B2 (de) |
EP (3) | EP2164104A3 (de) |
JP (1) | JP4511249B2 (de) |
KR (1) | KR100773537B1 (de) |
CN (2) | CN101794807A (de) |
DE (1) | DE602004025877D1 (de) |
Families Citing this family (177)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101179079B (zh) * | 2000-08-14 | 2010-11-03 | 矩阵半导体公司 | 密集阵列和电荷存储器件及其制造方法 |
DE10255117A1 (de) * | 2002-11-26 | 2004-06-17 | Infineon Technologies Ag | Halbleiterspeichereinrichtung sowie Verfahren zu deren Herstellung |
KR100773537B1 (ko) | 2003-06-03 | 2007-11-07 | 삼성전자주식회사 | 한 개의 스위칭 소자와 한 개의 저항체를 포함하는비휘발성 메모리 장치 및 그 제조 방법 |
KR101051704B1 (ko) * | 2004-04-28 | 2011-07-25 | 삼성전자주식회사 | 저항 구배를 지닌 다층막을 이용한 메모리 소자 |
FR2887149B1 (fr) * | 2005-06-17 | 2007-08-03 | Galderma Sa | Procede de solubilisation du metronidazole |
KR100593448B1 (ko) * | 2004-09-10 | 2006-06-28 | 삼성전자주식회사 | 전이금속 산화막을 데이터 저장 물질막으로 채택하는비휘발성 기억 셀들 및 그 제조방법들 |
US7405465B2 (en) | 2004-09-29 | 2008-07-29 | Sandisk 3D Llc | Deposited semiconductor structure to minimize n-type dopant diffusion and method of making |
KR100738070B1 (ko) * | 2004-11-06 | 2007-07-12 | 삼성전자주식회사 | 한 개의 저항체와 한 개의 트랜지스터를 지닌 비휘발성메모리 소자 |
KR100657911B1 (ko) * | 2004-11-10 | 2006-12-14 | 삼성전자주식회사 | 한 개의 저항체와 한 개의 다이오드를 지닌 비휘발성메모리 소자 |
KR100593750B1 (ko) * | 2004-11-10 | 2006-06-28 | 삼성전자주식회사 | 이성분계 금속 산화막을 데이터 저장 물질막으로 채택하는교차점 비휘발성 기억소자 및 그 제조방법 |
KR100576369B1 (ko) * | 2004-11-23 | 2006-05-03 | 삼성전자주식회사 | 전이 금속 산화막을 데이타 저장 물질막으로 채택하는비휘발성 기억소자의 프로그램 방법 |
KR100682908B1 (ko) * | 2004-12-21 | 2007-02-15 | 삼성전자주식회사 | 두개의 저항체를 지닌 비휘발성 메모리 소자 |
KR100693409B1 (ko) * | 2005-01-14 | 2007-03-12 | 광주과학기술원 | 산화막의 저항변화를 이용한 비휘발성 기억소자 및 그제조방법 |
KR100682926B1 (ko) * | 2005-01-31 | 2007-02-15 | 삼성전자주식회사 | 저항체를 이용한 비휘발성 메모리 소자 및 그 제조방법 |
KR100657956B1 (ko) | 2005-04-06 | 2006-12-14 | 삼성전자주식회사 | 다치 저항체 메모리 소자와 그 제조 및 동작 방법 |
US7812404B2 (en) * | 2005-05-09 | 2010-10-12 | Sandisk 3D Llc | Nonvolatile memory cell comprising a diode and a resistance-switching material |
KR100695150B1 (ko) * | 2005-05-12 | 2007-03-14 | 삼성전자주식회사 | 금속-절연체 변환 물질을 이용한 트랜지스터 및 그 제조방법 |
JP5190182B2 (ja) * | 2005-05-31 | 2013-04-24 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US20060273298A1 (en) * | 2005-06-02 | 2006-12-07 | Matrix Semiconductor, Inc. | Rewriteable memory cell comprising a transistor and resistance-switching material in series |
JP4843259B2 (ja) * | 2005-06-10 | 2011-12-21 | シャープ株式会社 | 可変抵抗素子の製造方法 |
JP4783070B2 (ja) * | 2005-06-24 | 2011-09-28 | シャープ株式会社 | 半導体記憶装置及びその製造方法 |
KR100723872B1 (ko) * | 2005-06-30 | 2007-05-31 | 한국전자통신연구원 | 급격한 금속-절연체 전이를 이용한 메모리소자 및 그동작방법 |
KR100622268B1 (ko) * | 2005-07-04 | 2006-09-11 | 한양대학교 산학협력단 | ReRAM 소자용 다층 이원산화박막의 형성방법 |
US7955515B2 (en) * | 2005-07-11 | 2011-06-07 | Sandisk 3D Llc | Method of plasma etching transition metal oxides |
JP3889023B2 (ja) * | 2005-08-05 | 2007-03-07 | シャープ株式会社 | 可変抵抗素子とその製造方法並びにそれを備えた記憶装置 |
JP5019821B2 (ja) * | 2005-08-12 | 2012-09-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
KR101369864B1 (ko) * | 2005-08-12 | 2014-03-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 및 그 제조방법 |
JP4854233B2 (ja) * | 2005-08-15 | 2012-01-18 | 独立行政法人産業技術総合研究所 | スイッチング素子 |
US7521705B2 (en) * | 2005-08-15 | 2009-04-21 | Micron Technology, Inc. | Reproducible resistance variable insulating memory devices having a shaped bottom electrode |
KR101100427B1 (ko) * | 2005-08-24 | 2011-12-30 | 삼성전자주식회사 | 이온 전도층을 포함하는 불휘발성 반도체 메모리 장치와 그제조 및 동작 방법 |
US7601995B2 (en) * | 2005-10-27 | 2009-10-13 | Infineon Technologies Ag | Integrated circuit having resistive memory cells |
US8222917B2 (en) * | 2005-11-03 | 2012-07-17 | Agate Logic, Inc. | Impedance matching and trimming apparatuses and methods using programmable resistance devices |
KR100668348B1 (ko) * | 2005-11-11 | 2007-01-12 | 삼성전자주식회사 | 비휘발성 메모리 소자 및 그 제조방법 |
US7816659B2 (en) * | 2005-11-23 | 2010-10-19 | Sandisk 3D Llc | Devices having reversible resistivity-switching metal oxide or nitride layer with added metal |
US7834338B2 (en) * | 2005-11-23 | 2010-11-16 | Sandisk 3D Llc | Memory cell comprising nickel-cobalt oxide switching element |
JP4017650B2 (ja) * | 2005-12-02 | 2007-12-05 | シャープ株式会社 | 可変抵抗素子及びその製造方法 |
JP4939324B2 (ja) * | 2005-12-02 | 2012-05-23 | シャープ株式会社 | 可変抵抗素子及びその製造方法 |
JP4061328B2 (ja) * | 2005-12-02 | 2008-03-19 | シャープ株式会社 | 可変抵抗素子及びその製造方法 |
JP3989506B2 (ja) * | 2005-12-27 | 2007-10-10 | シャープ株式会社 | 可変抵抗素子とその製造方法ならびにそれを備えた半導体記憶装置 |
KR100684908B1 (ko) | 2006-01-09 | 2007-02-22 | 삼성전자주식회사 | 다수 저항 상태를 갖는 저항 메모리 요소, 저항 메모리 셀및 그 동작 방법 그리고 상기 저항 메모리 요소를 적용한데이터 처리 시스템 |
US7714315B2 (en) | 2006-02-07 | 2010-05-11 | Qimonda North America Corp. | Thermal isolation of phase change memory cells |
KR100718155B1 (ko) * | 2006-02-27 | 2007-05-14 | 삼성전자주식회사 | 두 개의 산화층을 이용한 비휘발성 메모리 소자 |
JP4228033B2 (ja) | 2006-03-08 | 2009-02-25 | パナソニック株式会社 | 不揮発性記憶素子、不揮発記憶装置、及びそれらの製造方法 |
KR101176543B1 (ko) * | 2006-03-10 | 2012-08-28 | 삼성전자주식회사 | 저항성 메모리소자 |
US7808810B2 (en) | 2006-03-31 | 2010-10-05 | Sandisk 3D Llc | Multilevel nonvolatile memory cell comprising a resistivity-switching oxide or nitride and an antifuse |
US7829875B2 (en) | 2006-03-31 | 2010-11-09 | Sandisk 3D Llc | Nonvolatile rewritable memory cell comprising a resistivity-switching oxide or nitride and an antifuse |
US7875871B2 (en) | 2006-03-31 | 2011-01-25 | Sandisk 3D Llc | Heterojunction device comprising a semiconductor and a resistivity-switching oxide or nitride |
TWI462099B (zh) * | 2006-03-31 | 2014-11-21 | Sandisk 3D Llc | 非揮發性記憶體單元、整體三維記憶體陣列及用於程式化所述記憶體陣列之方法 |
JP4699932B2 (ja) * | 2006-04-13 | 2011-06-15 | パナソニック株式会社 | 抵抗変化素子とそれを用いた抵抗変化型メモリならびにその製造方法 |
JP4857014B2 (ja) * | 2006-04-19 | 2012-01-18 | パナソニック株式会社 | 抵抗変化素子とそれを用いた抵抗変化型メモリ |
KR101213702B1 (ko) * | 2006-04-21 | 2012-12-18 | 삼성전자주식회사 | 비휘발성 메모리 소자, 그 동작 방법, 및 그 제조 방법 |
KR101239962B1 (ko) | 2006-05-04 | 2013-03-06 | 삼성전자주식회사 | 하부 전극 상에 형성된 버퍼층을 포함하는 가변 저항메모리 소자 |
KR101206034B1 (ko) * | 2006-05-19 | 2012-11-28 | 삼성전자주식회사 | 산소결핍 금속산화물을 이용한 비휘발성 메모리 소자 및 그제조방법 |
US20070267621A1 (en) * | 2006-05-19 | 2007-11-22 | Infineon Technologies Ag | Resistive memory device |
KR100818271B1 (ko) * | 2006-06-27 | 2008-03-31 | 삼성전자주식회사 | 펄스전압을 인가하는 비휘발성 메모리 소자의 문턱 스위칭동작 방법 |
KR100738116B1 (ko) * | 2006-07-06 | 2007-07-12 | 삼성전자주식회사 | 가변 저항 물질을 포함하는 비휘발성 메모리 소자 |
JP5263856B2 (ja) * | 2006-07-26 | 2013-08-14 | 独立行政法人産業技術総合研究所 | スイッチング素子及びその製造方法 |
WO2008023637A1 (fr) | 2006-08-25 | 2008-02-28 | Panasonic Corporation | Élément de stockage, dispositif mémoire et circuit intégré à semi-conducteur |
US8232175B2 (en) | 2006-09-14 | 2012-07-31 | Spansion Llc | Damascene metal-insulator-metal (MIM) device with improved scaleability |
JP4655019B2 (ja) * | 2006-10-04 | 2011-03-23 | セイコーエプソン株式会社 | 可変抵抗素子 |
CN101174672A (zh) | 2006-10-04 | 2008-05-07 | 旺宏电子股份有限公司 | 存储单元及其制程 |
US7524722B2 (en) | 2006-10-12 | 2009-04-28 | Macronix International Co., Ltd. | Resistance type memory device and fabricating method and operating method thereof |
JP5107252B2 (ja) | 2006-10-24 | 2012-12-26 | パナソニック株式会社 | 不揮発性半導体記憶装置およびその製造方法 |
KR101133832B1 (ko) * | 2006-11-08 | 2012-04-06 | 시메트릭스 주식회사 | 저항 스위칭 집적 회로 메모리, 저항 스위칭 메모리의 형성 방법 및 비휘발성 저항 스위칭 집적 회로 메모리의 제조 방법 |
KR100816759B1 (ko) * | 2006-11-09 | 2008-03-25 | 삼성전자주식회사 | 가변저항 스토리지를 갖는 비휘발성 기억 장치 및 동작방법 |
KR101206036B1 (ko) | 2006-11-16 | 2012-11-28 | 삼성전자주식회사 | 전이 금속 고용체를 포함하는 저항성 메모리 소자 및 그제조 방법 |
JP4527170B2 (ja) | 2006-11-17 | 2010-08-18 | パナソニック株式会社 | 不揮発性記憶素子、不揮発性記憶装置、不揮発性半導体装置、および不揮発性記憶素子の製造方法 |
KR101048199B1 (ko) | 2006-11-20 | 2011-07-08 | 파나소닉 주식회사 | 비휘발성 반도체 기억 장치 및 그 제조 방법 |
KR100846502B1 (ko) * | 2006-11-21 | 2008-07-17 | 삼성전자주식회사 | 비휘발성 메모리소자 및 그 제조방법 |
KR100982424B1 (ko) * | 2006-11-28 | 2010-09-15 | 삼성전자주식회사 | 저항 메모리 소자의 제조 방법 |
CN101536188B (zh) * | 2006-11-30 | 2010-09-29 | 富士通株式会社 | 电阻存储元件及其制造方法、非易失性半导体存储装置 |
KR101187374B1 (ko) | 2006-12-19 | 2012-10-02 | 후지쯔 가부시끼가이샤 | 저항 변화 소자 및 그 제조 방법 |
WO2008075412A1 (ja) * | 2006-12-19 | 2008-06-26 | Fujitsu Limited | 抵抗変化素子及びその製造方法 |
WO2008075414A1 (ja) * | 2006-12-19 | 2008-06-26 | Fujitsu Limited | 抵抗変化素子の製造方法 |
WO2008081742A1 (ja) | 2006-12-28 | 2008-07-10 | Panasonic Corporation | 抵抗変化型素子、抵抗変化型記憶装置、および抵抗変化型装置 |
JP4202411B2 (ja) | 2006-12-28 | 2008-12-24 | パナソニック株式会社 | 抵抗変化型素子および抵抗変化型記憶装置 |
KR20080064353A (ko) * | 2007-01-04 | 2008-07-09 | 삼성전자주식회사 | 저항 메모리 소자 및 그 제조 방법 |
JP2008182156A (ja) * | 2007-01-26 | 2008-08-07 | Nippon Telegr & Teleph Corp <Ntt> | 金属酸化物素子及びその製造方法 |
JP2008182154A (ja) * | 2007-01-26 | 2008-08-07 | Nippon Telegr & Teleph Corp <Ntt> | メモリ装置 |
US7972897B2 (en) | 2007-02-05 | 2011-07-05 | Intermolecular, Inc. | Methods for forming resistive switching memory elements |
US7704789B2 (en) | 2007-02-05 | 2010-04-27 | Intermolecular, Inc. | Methods for forming resistive switching memory elements |
US7678607B2 (en) | 2007-02-05 | 2010-03-16 | Intermolecular, Inc. | Methods for forming resistive switching memory elements |
WO2008097742A1 (en) * | 2007-02-05 | 2008-08-14 | Interolecular, Inc. | Methods for forming resistive switching memory elements |
KR101054321B1 (ko) * | 2007-03-01 | 2011-08-05 | 후지쯔 가부시끼가이샤 | 반도체 장치 및 그 제조 방법 |
US8097878B2 (en) | 2007-03-05 | 2012-01-17 | Intermolecular, Inc. | Nonvolatile memory elements with metal-deficient resistive-switching metal oxides |
US7629198B2 (en) | 2007-03-05 | 2009-12-08 | Intermolecular, Inc. | Methods for forming nonvolatile memory elements with resistive-switching metal oxides |
JP5345052B2 (ja) * | 2007-03-23 | 2013-11-20 | 富士通株式会社 | 抵抗記憶素子及び不揮発性半導体記憶装置 |
US8058636B2 (en) | 2007-03-29 | 2011-11-15 | Panasonic Corporation | Variable resistance nonvolatile memory apparatus |
US7960224B2 (en) | 2007-04-03 | 2011-06-14 | Macronix International Co., Ltd. | Operation method for multi-level switching of metal-oxide based RRAM |
CN101542729B (zh) | 2007-04-09 | 2012-05-02 | 松下电器产业株式会社 | 电阻变化型元件、不挥发性切换元件和电阻变化型存储装置 |
JP5526776B2 (ja) * | 2007-04-17 | 2014-06-18 | 日本電気株式会社 | 抵抗変化素子及び該抵抗変化素子を含む半導体装置 |
WO2008140979A1 (en) | 2007-05-09 | 2008-11-20 | Intermolecular, Inc. | Resistive-switching nonvolatile memory elements |
JP4967176B2 (ja) * | 2007-05-10 | 2012-07-04 | シャープ株式会社 | 可変抵抗素子とその製造方法及び不揮発性半導体記憶装置 |
KR101350979B1 (ko) | 2007-05-11 | 2014-01-14 | 삼성전자주식회사 | 저항성 메모리 소자 및 그 제조 방법 |
US8148711B2 (en) | 2007-05-18 | 2012-04-03 | Panasonic Corporation | Nonvolatile memory element, manufacturing method thereof, and nonvolatile semiconductor apparatus using nonvolatile memory element |
US8173989B2 (en) * | 2007-05-30 | 2012-05-08 | Samsung Electronics Co., Ltd. | Resistive random access memory device and methods of manufacturing and operating the same |
DE602008006652D1 (de) | 2007-06-05 | 2011-06-16 | Panasonic Corp | Nicht flüchtiges speicherelement, verfahren zu seiner herstellung sowie nicht flüchtige halbleitervorrichtung mit dem nicht flüchtigen speicherelement |
US7902537B2 (en) | 2007-06-29 | 2011-03-08 | Sandisk 3D Llc | Memory cell that employs a selectively grown reversible resistance-switching element and methods of forming the same |
US8233308B2 (en) | 2007-06-29 | 2012-07-31 | Sandisk 3D Llc | Memory cell that employs a selectively deposited reversible resistance-switching element and methods of forming the same |
US7846785B2 (en) | 2007-06-29 | 2010-12-07 | Sandisk 3D Llc | Memory cell that employs a selectively deposited reversible resistance-switching element and methods of forming the same |
CN101720506B (zh) * | 2007-06-29 | 2012-05-16 | 桑迪士克3D公司 | 存储器单元,存储器阵列以及形成它们的方法 |
US7824956B2 (en) | 2007-06-29 | 2010-11-02 | Sandisk 3D Llc | Memory cell that employs a selectively grown reversible resistance-switching element and methods of forming the same |
TWI402980B (zh) | 2007-07-20 | 2013-07-21 | Macronix Int Co Ltd | 具有緩衝層之電阻式記憶結構 |
WO2009015298A2 (en) | 2007-07-25 | 2009-01-29 | Intermolecular, Inc. | Nonvolatile memory elements |
WO2009015297A1 (en) | 2007-07-25 | 2009-01-29 | Intermolecular, Inc. | Multistate nonvolatile memory elements |
JP5012312B2 (ja) * | 2007-08-15 | 2012-08-29 | ソニー株式会社 | 記憶装置の駆動方法 |
US8338816B2 (en) * | 2007-10-15 | 2012-12-25 | Panasonic Corporation | Nonvolatile memory element, and nonvolatile semiconductor device using the nonvolatile memory element |
CN101842897B (zh) * | 2007-10-30 | 2011-11-02 | 松下电器产业株式会社 | 非易失性半导体存储装置和其制造方法 |
US8345462B2 (en) | 2007-12-05 | 2013-01-01 | Macronix International Co., Ltd. | Resistive memory and method for manufacturing the same |
JP2009141225A (ja) * | 2007-12-07 | 2009-06-25 | Sharp Corp | 可変抵抗素子、可変抵抗素子の製造方法、不揮発性半導体記憶装置 |
US7759201B2 (en) * | 2007-12-17 | 2010-07-20 | Sandisk 3D Llc | Method for fabricating pitch-doubling pillar structures |
US7706169B2 (en) * | 2007-12-27 | 2010-04-27 | Sandisk 3D Llc | Large capacity one-time programmable memory cell using metal oxides |
US7764534B2 (en) * | 2007-12-28 | 2010-07-27 | Sandisk 3D Llc | Two terminal nonvolatile memory using gate controlled diode elements |
US8125818B2 (en) * | 2008-02-25 | 2012-02-28 | Panasonic Corporation | Method of programming variable resistance element and variable resistance memory device using the same |
JP4549401B2 (ja) * | 2008-03-11 | 2010-09-22 | 富士通株式会社 | 抵抗記憶素子の製造方法 |
US8373149B2 (en) * | 2008-04-07 | 2013-02-12 | Nec Corporation | Resistance change element and manufacturing method thereof |
US7981592B2 (en) * | 2008-04-11 | 2011-07-19 | Sandisk 3D Llc | Double patterning method |
US7786015B2 (en) * | 2008-04-28 | 2010-08-31 | Sandisk 3D Llc | Method for fabricating self-aligned complementary pillar structures and wiring |
WO2009142165A1 (ja) * | 2008-05-20 | 2009-11-26 | 日本電気株式会社 | 半導体装置およびその製造方法 |
US7732235B2 (en) | 2008-06-30 | 2010-06-08 | Sandisk 3D Llc | Method for fabricating high density pillar structures by double patterning using positive photoresist |
US7781269B2 (en) * | 2008-06-30 | 2010-08-24 | Sandisk 3D Llc | Triangle two dimensional complementary patterning of pillars |
US7981742B2 (en) * | 2008-07-02 | 2011-07-19 | Macronic International Co., Ltd. | Semiconductor device, data element thereof and method of fabricating the same |
US8264865B2 (en) | 2008-07-11 | 2012-09-11 | Panasonic Corporation | Nonvolatile memory element, manufacturing method thereof, and nonvolatile semiconductor device incorporating nonvolatile memory element |
CN101878507B (zh) * | 2008-09-30 | 2013-10-23 | 松下电器产业株式会社 | 电阻变化元件的驱动方法、初始处理方法及非易失性存储装置 |
CN101878530B (zh) * | 2008-10-01 | 2012-03-07 | 松下电器产业株式会社 | 非易失性存储元件和使用该元件的非易失性存储装置 |
US8076056B2 (en) * | 2008-10-06 | 2011-12-13 | Sandisk 3D Llc | Method of making sub-resolution pillar structures using undercutting technique |
KR20100041155A (ko) | 2008-10-13 | 2010-04-22 | 삼성전자주식회사 | 저항성 메모리 소자 |
US8080443B2 (en) * | 2008-10-27 | 2011-12-20 | Sandisk 3D Llc | Method of making pillars using photoresist spacer mask |
WO2010064446A1 (ja) | 2008-12-04 | 2010-06-10 | パナソニック株式会社 | 不揮発性記憶素子及び不揮発性記憶装置 |
US7846756B2 (en) * | 2008-12-31 | 2010-12-07 | Sandisk 3D Llc | Nanoimprint enhanced resist spacer patterning method |
US8084347B2 (en) * | 2008-12-31 | 2011-12-27 | Sandisk 3D Llc | Resist feature and removable spacer pitch doubling patterning method for pillar structures |
US8114765B2 (en) * | 2008-12-31 | 2012-02-14 | Sandisk 3D Llc | Methods for increased array feature density |
CN101981695B (zh) * | 2009-01-29 | 2012-06-13 | 松下电器产业株式会社 | 电阻变化元件及其制造方法 |
WO2010087211A1 (ja) | 2009-02-02 | 2010-08-05 | パナソニック株式会社 | 不揮発性記憶素子、不揮発性記憶装置、不揮発性半導体装置、および不揮発性記憶素子の製造方法 |
JP2010177624A (ja) * | 2009-02-02 | 2010-08-12 | Toshiba Corp | 半導体記憶装置 |
JP4592828B2 (ja) * | 2009-02-04 | 2010-12-08 | パナソニック株式会社 | 不揮発性記憶素子 |
JP5477371B2 (ja) | 2009-03-12 | 2014-04-23 | 富士通株式会社 | 半導体記憶装置及びその製造方法 |
CN102047422B (zh) * | 2009-03-25 | 2013-04-24 | 松下电器产业株式会社 | 电阻变化元件的驱动方法以及非易失性存储装置 |
JP2010251529A (ja) * | 2009-04-16 | 2010-11-04 | Sony Corp | 半導体記憶装置およびその製造方法 |
US8488362B2 (en) | 2009-04-29 | 2013-07-16 | Macronix International Co., Ltd. | Graded metal oxide resistance based semiconductor memory device |
JP5287544B2 (ja) | 2009-06-25 | 2013-09-11 | ソニー株式会社 | 不揮発性メモリの記録方法及び不揮発性メモリ |
JP5016699B2 (ja) | 2009-12-16 | 2012-09-05 | シャープ株式会社 | 不揮発性半導体記憶装置及びその製造方法 |
KR20110072921A (ko) | 2009-12-23 | 2011-06-29 | 삼성전자주식회사 | 메모리소자 및 그 동작방법 |
KR20110074354A (ko) | 2009-12-24 | 2011-06-30 | 삼성전자주식회사 | 메모리소자 및 그 동작방법 |
JP5120967B2 (ja) * | 2009-12-25 | 2013-01-16 | シャープ株式会社 | 可変抵抗素子 |
JP5039857B2 (ja) * | 2009-12-28 | 2012-10-03 | パナソニック株式会社 | 記憶装置およびその製造方法 |
US7923305B1 (en) | 2010-01-12 | 2011-04-12 | Sandisk 3D Llc | Patterning method for high density pillar structures |
US8026178B2 (en) | 2010-01-12 | 2011-09-27 | Sandisk 3D Llc | Patterning method for high density pillar structures |
WO2011096194A1 (ja) | 2010-02-02 | 2011-08-11 | パナソニック株式会社 | 抵抗変化素子の駆動方法、初期処理方法、及び不揮発性記憶装置 |
KR20110101983A (ko) | 2010-03-10 | 2011-09-16 | 삼성전자주식회사 | 바이폴라 메모리셀 및 이를 포함하는 메모리소자 |
US8551853B2 (en) | 2010-07-08 | 2013-10-08 | Panasonic Corporation | Non-volatile semiconductor memory device and manufacturing method thereof |
US8264868B2 (en) | 2010-10-25 | 2012-09-11 | Hewlett-Packard Development Company, L.P. | Memory array with metal-insulator transition switching devices |
CN102064276B (zh) * | 2010-11-01 | 2014-06-04 | 华中科技大学 | 一种非对称相变存储器单元及器件 |
US8699258B2 (en) | 2011-01-21 | 2014-04-15 | Macronix International Co., Ltd. | Verification algorithm for metal-oxide resistive memory |
JP5490961B2 (ja) | 2011-03-14 | 2014-05-14 | パナソニック株式会社 | 不揮発性記憶素子の駆動方法及び不揮発性記憶装置 |
US8951829B2 (en) | 2011-04-01 | 2015-02-10 | Micron Technology, Inc. | Resistive switching in memory cells |
WO2012172773A1 (ja) | 2011-06-13 | 2012-12-20 | パナソニック株式会社 | 抵抗変化素子の駆動方法、及び不揮発性記憶装置 |
JP5548319B2 (ja) | 2012-04-20 | 2014-07-16 | パナソニック株式会社 | 不揮発性記憶素子の駆動方法 |
JP2014032724A (ja) * | 2012-08-03 | 2014-02-20 | Sharp Corp | 半導体記憶装置 |
US9231204B2 (en) * | 2012-09-28 | 2016-01-05 | Intel Corporation | Low voltage embedded memory having conductive oxide and electrode stacks |
TWI513074B (zh) * | 2013-01-08 | 2015-12-11 | Nat Univ Tsing Hua | 電阻式記憶體 |
JP5830655B2 (ja) | 2013-04-30 | 2015-12-09 | パナソニックIpマネジメント株式会社 | 不揮発性記憶素子の駆動方法 |
CN103367639B (zh) * | 2013-07-25 | 2015-09-09 | 福州大学 | 一种氧化锌纳米线低功耗阻变存储器及其制备方法 |
CN103682100B (zh) * | 2013-12-06 | 2016-04-06 | 南昌大学 | 氧化锌/聚甲基丙烯酸甲酯/硫氰酸亚铜结构的数据存储器及制备方法 |
CN103985816B (zh) * | 2014-05-28 | 2016-09-14 | 淮阴师范学院 | 一种铝/铁掺杂非晶碳膜/铝纳米薄膜记忆电阻存储器件及其制备方法 |
TWI548127B (zh) * | 2014-09-19 | 2016-09-01 | 華邦電子股份有限公司 | 電阻式隨機存取記憶體 |
CN105448948B (zh) * | 2014-09-30 | 2019-01-11 | 华邦电子股份有限公司 | 电阻式随机存取存储器 |
CN107155371B (zh) | 2014-12-18 | 2021-06-25 | 英特尔公司 | 包括局部丝状沟道的电阻性存储器单元、包括其的器件、以及制造其的方法 |
US20170117464A1 (en) * | 2015-10-22 | 2017-04-27 | Winbond Electronics Corp. | Resistive random access memory device |
WO2019054001A1 (ja) | 2017-09-12 | 2019-03-21 | パナソニック株式会社 | 不揮発性記憶装置、及び駆動方法 |
CN109698213A (zh) * | 2017-10-20 | 2019-04-30 | 联华电子股份有限公司 | 半导体结构及其制作方法 |
JP7308026B2 (ja) | 2018-12-26 | 2023-07-13 | ヌヴォトンテクノロジージャパン株式会社 | 抵抗変化型不揮発性記憶素子及びそれを用いた抵抗変化型不揮発性記憶装置 |
US11424407B2 (en) * | 2020-09-02 | 2022-08-23 | Winbond Electronics Corp. | Resistive random access memory and method of manufacturing the same |
US11469373B2 (en) * | 2020-09-10 | 2022-10-11 | Rockwell Collins, Inc. | System and device including memristor material |
US11631808B2 (en) | 2020-12-07 | 2023-04-18 | Rockwell Collins, Inc. | System and device including memristor material |
US11462267B2 (en) | 2020-12-07 | 2022-10-04 | Rockwell Collins, Inc. | System and device including memristor material |
US11456418B2 (en) | 2020-09-10 | 2022-09-27 | Rockwell Collins, Inc. | System and device including memristor materials in parallel |
Family Cites Families (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3761896A (en) * | 1972-04-18 | 1973-09-25 | Ibm | Memory array of cells containing bistable switchable resistors |
US4472296A (en) * | 1982-06-21 | 1984-09-18 | Iowa State University Research Foundation, Inc. | Bulk, polycrystalline switching materials for threshold and/or memory switching |
JPS6242582A (ja) | 1985-08-20 | 1987-02-24 | Matsushita Electric Ind Co Ltd | 非線形抵抗素子及びその製造方法 |
JPS63226981A (ja) | 1987-03-16 | 1988-09-21 | Fujitsu Ltd | 超伝導集積回路装置およびその製造方法 |
JPH0258264A (ja) | 1988-08-23 | 1990-02-27 | Matsushita Electric Ind Co Ltd | メモリー素子 |
FR2636481B1 (fr) | 1988-09-14 | 1990-11-30 | Sgs Thomson Microelectronics | Diode active integrable |
US5406509A (en) | 1991-01-18 | 1995-04-11 | Energy Conversion Devices, Inc. | Electrically erasable, directly overwritable, multibit single cell memory elements and arrays fabricated therefrom |
JP3454821B2 (ja) | 1991-08-19 | 2003-10-06 | エナージー・コンバーション・デバイセス・インコーポレーテッド | 電気的に消去可能な、直接重ね書き可能なマルチビット単セルメモリ素子およびそれらから作製したアレイ |
KR970009616B1 (en) * | 1993-12-31 | 1997-06-14 | Hyundai Electronics Ind | Fabricating method of semiconductor device |
US5751012A (en) | 1995-06-07 | 1998-05-12 | Micron Technology, Inc. | Polysilicon pillar diode for use in a non-volatile memory cell |
US5640343A (en) | 1996-03-18 | 1997-06-17 | International Business Machines Corporation | Magnetic memory array using magnetic tunnel junction devices in the memory cells |
US6461982B2 (en) | 1997-02-27 | 2002-10-08 | Micron Technology, Inc. | Methods for forming a dielectric film |
JP3236262B2 (ja) * | 1998-06-16 | 2001-12-10 | 松下電器産業株式会社 | 強誘電体メモリ装置 |
US6586790B2 (en) * | 1998-07-24 | 2003-07-01 | Kabushiki Kaisha Toshiba | Semiconductor device and method for manufacturing the same |
GB9902993D0 (en) | 1999-02-11 | 1999-03-31 | Univ Strathclyde | Low pressure chemical vapour deposition of titanium dioxide |
CN1191635C (zh) | 1999-02-17 | 2005-03-02 | 国际商业机器公司 | 用于存储信息的微电子器件及其方法 |
US6151241A (en) * | 1999-05-19 | 2000-11-21 | Symetrix Corporation | Ferroelectric memory with disturb protection |
US6297539B1 (en) | 1999-07-19 | 2001-10-02 | Sharp Laboratories Of America, Inc. | Doped zirconia, or zirconia-like, dielectric film transistor structure and deposition method for same |
JP2001148465A (ja) * | 1999-11-18 | 2001-05-29 | Nec Corp | 半導体装置の製造方法 |
AU2001260374A1 (en) | 2000-05-15 | 2001-11-26 | Asm Microchemistry Oy | Process for producing integrated circuits |
US20020036313A1 (en) * | 2000-06-06 | 2002-03-28 | Sam Yang | Memory cell capacitor structure and method of formation |
US6605311B2 (en) * | 2000-06-22 | 2003-08-12 | The Procter & Gamble Company | Insoluble protein particles |
JP4050446B2 (ja) | 2000-06-30 | 2008-02-20 | 株式会社東芝 | 固体磁気メモリ |
US6487110B2 (en) * | 2000-09-27 | 2002-11-26 | Canon Kabushiki Kaisha | Nonvolatile solid-state memory device using magnetoresistive effect and recording and reproducing method of the same |
JP4223189B2 (ja) * | 2000-12-26 | 2009-02-12 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
US6358756B1 (en) | 2001-02-07 | 2002-03-19 | Micron Technology, Inc. | Self-aligned, magnetoresistive random-access memory (MRAM) structure utilizing a spacer containment scheme |
JP3892736B2 (ja) * | 2001-03-29 | 2007-03-14 | 株式会社東芝 | 半導体記憶装置 |
DE10128482A1 (de) | 2001-06-12 | 2003-01-02 | Infineon Technologies Ag | Halbleiterspeichereinrichtung sowie Verfahren zu deren Herstellung |
US7135734B2 (en) | 2001-08-30 | 2006-11-14 | Micron Technology, Inc. | Graded composition metal oxide tunnel barrier interpoly insulators |
US6773929B2 (en) * | 2001-09-14 | 2004-08-10 | Hynix Semiconductor Inc. | Ferroelectric memory device and method for manufacturing the same |
JP4575664B2 (ja) | 2001-09-25 | 2010-11-04 | 独立行政法人科学技術振興機構 | 固体電解質を用いた電気素子 |
KR20030034500A (ko) * | 2001-10-23 | 2003-05-09 | 주식회사 하이닉스반도체 | 마그네틱 램 |
DE60137788D1 (de) | 2001-12-27 | 2009-04-09 | St Microelectronics Srl | Architektur einer nichtflüchtigen Phasenwechsel -Speichermatrix |
US6667900B2 (en) | 2001-12-28 | 2003-12-23 | Ovonyx, Inc. | Method and apparatus to operate a memory cell |
US6847535B2 (en) * | 2002-02-20 | 2005-01-25 | Micron Technology, Inc. | Removable programmable conductor memory card and associated read/write device and method of operation |
US6891749B2 (en) * | 2002-02-20 | 2005-05-10 | Micron Technology, Inc. | Resistance variable ‘on ’ memory |
TWI224403B (en) | 2002-03-15 | 2004-11-21 | Axon Technologies Corp | Programmable structure, an array including the structure, and methods of forming the same |
US20030189851A1 (en) | 2002-04-09 | 2003-10-09 | Brandenberger Sarah M. | Non-volatile, multi-level memory device |
JP4103497B2 (ja) * | 2002-04-18 | 2008-06-18 | ソニー株式会社 | 記憶装置とその製造方法および使用方法、半導体装置とその製造方法 |
US6850432B2 (en) | 2002-08-20 | 2005-02-01 | Macronix International Co., Ltd. | Laser programmable electrically readable phase-change memory method and device |
US6583003B1 (en) * | 2002-09-26 | 2003-06-24 | Sharp Laboratories Of America, Inc. | Method of fabricating 1T1R resistive memory array |
US7589343B2 (en) | 2002-12-13 | 2009-09-15 | Intel Corporation | Memory and access device and method therefor |
US7205562B2 (en) | 2002-12-13 | 2007-04-17 | Intel Corporation | Phase change memory and method therefor |
US6795338B2 (en) * | 2002-12-13 | 2004-09-21 | Intel Corporation | Memory having access devices using phase change material such as chalcogenide |
US6887523B2 (en) | 2002-12-20 | 2005-05-03 | Sharp Laboratories Of America, Inc. | Method for metal oxide thin film deposition via MOCVD |
US7042052B2 (en) * | 2003-02-10 | 2006-05-09 | Micron Technology, Inc. | Transistor constructions and electronic devices |
KR100773537B1 (ko) | 2003-06-03 | 2007-11-07 | 삼성전자주식회사 | 한 개의 스위칭 소자와 한 개의 저항체를 포함하는비휘발성 메모리 장치 및 그 제조 방법 |
KR101051704B1 (ko) | 2004-04-28 | 2011-07-25 | 삼성전자주식회사 | 저항 구배를 지닌 다층막을 이용한 메모리 소자 |
KR100651656B1 (ko) * | 2004-11-29 | 2006-12-01 | 한국과학기술연구원 | 투명전도성 산화물 전극 접촉 재료를 갖는 상변화 메모리 셀 |
KR100585175B1 (ko) * | 2005-01-31 | 2006-05-30 | 삼성전자주식회사 | 화학 기상 증착법에 의한 GeSbTe 박막의 제조방법 |
US20070132049A1 (en) | 2005-12-12 | 2007-06-14 | Stipe Barry C | Unipolar resistance random access memory (RRAM) device and vertically stacked architecture |
KR100718155B1 (ko) | 2006-02-27 | 2007-05-14 | 삼성전자주식회사 | 두 개의 산화층을 이용한 비휘발성 메모리 소자 |
KR101054321B1 (ko) | 2007-03-01 | 2011-08-05 | 후지쯔 가부시끼가이샤 | 반도체 장치 및 그 제조 방법 |
KR100809724B1 (ko) * | 2007-03-02 | 2008-03-06 | 삼성전자주식회사 | 터널링층을 구비한 바이폴라 스위칭 타입의 비휘발성메모리소자 |
-
2003
- 2003-06-03 KR KR1020030035562A patent/KR100773537B1/ko active IP Right Grant
-
2004
- 2004-05-25 US US10/852,287 patent/US8164130B2/en not_active Expired - Fee Related
- 2004-05-27 DE DE602004025877T patent/DE602004025877D1/de not_active Expired - Lifetime
- 2004-05-27 EP EP09179704A patent/EP2164104A3/de not_active Withdrawn
- 2004-05-27 EP EP08155548A patent/EP1947696B1/de not_active Expired - Lifetime
- 2004-05-27 EP EP04253135A patent/EP1484799B1/de not_active Expired - Lifetime
- 2004-06-02 JP JP2004164659A patent/JP4511249B2/ja not_active Expired - Lifetime
- 2004-06-02 CN CN201010114820A patent/CN101794807A/zh active Pending
- 2004-06-02 CN CN2004100465448A patent/CN1574363B/zh not_active Expired - Lifetime
-
2007
- 2007-01-18 US US11/654,626 patent/US8101983B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8164130B2 (en) | 2012-04-24 |
KR20040104967A (ko) | 2004-12-14 |
JP4511249B2 (ja) | 2010-07-28 |
EP1947696B1 (de) | 2011-07-06 |
JP2004363604A (ja) | 2004-12-24 |
CN1574363B (zh) | 2011-08-10 |
EP2164104A2 (de) | 2010-03-17 |
EP1947696A1 (de) | 2008-07-23 |
EP1484799A3 (de) | 2006-06-14 |
EP1484799A2 (de) | 2004-12-08 |
KR100773537B1 (ko) | 2007-11-07 |
US20070114587A1 (en) | 2007-05-24 |
CN1574363A (zh) | 2005-02-02 |
US20040245557A1 (en) | 2004-12-09 |
US8101983B2 (en) | 2012-01-24 |
EP2164104A3 (de) | 2010-04-21 |
EP1484799B1 (de) | 2010-03-10 |
CN101794807A (zh) | 2010-08-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE602004025877D1 (de) | Nichtflüchtiges Speicherbauelement mit einem Schaltelement und einem Widerstandsmaterial sowie Verfahren zur Herstellung des Speicherbauelements | |
DE602004015813D1 (de) | Speichervorrichtung und verfahren zur löschung derselben | |
DE502004011667D1 (de) | Steuergeräteeinheit und verfahren zur herstellung derselben | |
DE602005001924D1 (de) | Verfahren zur Herstellung eines nicht-flüchtigen Speicherbauelements aus elektrischem Widerstandsmaterial | |
DE502004009597D1 (de) | Gummimaterial und verfahren zur herstellung desselben | |
DE602004028481D1 (de) | Automatisches programmierverfahren und einrichtung | |
ATE430704T1 (de) | Verpackung aus schrumpffolie und verfahren zur herstellung derselben | |
DE502004006991D1 (de) | Füllelement sowie Füllmaschine mit derartigen Füllelementen | |
DE60324117D1 (de) | Multibit Speicheranordnung und Verfahren zur Programmierung und zum Auslesen derselben | |
ATE365624T1 (de) | Verfahren zur herstellung eines behälters aus polyesterharz und vorrichtung zur durchführung desselben | |
DE60220912D1 (de) | Speichervorrichtung mit einem sich selbst einbauenden polymer und verfahren zur herstellung derselben | |
DE602004004398D1 (de) | Formvorrichtung zur herstellung von behältern aus thermoplastischem material | |
DE602004020476D1 (de) | Verfahren zur herstellung von thermoplastischen vulkanisaten und thermoplastischen vulkanisaten | |
DE60319654D1 (de) | Nichtflüchtiger variabler Widerstand, Speicherelement, und Skalierungsverfahren für einen nichtflüchtigen variablen Widerstand | |
DE60109887D1 (de) | Einmalig programmierbare nichtflüchtige halbleiterspeicheranordnung und verfahren zu deren herstellung | |
DE60301698D1 (de) | Galsfaserverstärkte thermoplastische harzpellets und verfahren zu ihrer herstellung | |
DE602004021410D1 (de) | Heizelement, verfahren zur herstellung einerheizelement-oberflächenschicht, fixierglied, heizeinrichtung,fixierverfahren, fixiereinrichtung und bilderzeugungseinrichtung | |
DE602004014280D1 (de) | Flammgeschützte thermoplastische harzzusammensetzung | |
DE60135786D1 (de) | Flexibles harzpellet und verfahren zu seiner herstellung | |
DE602004019930D1 (de) | Flammgeschützte thermoplastische harzzusammensetzung | |
DE60333840D1 (de) | Geformte absorbierende auflagen und verfahren zur dessen herstellung | |
DE60235643D1 (de) | 2h-1-benzopyranverbindungen zur verwendung in einem photochromen material | |
AT8384U3 (de) | Kunststoffbehälter und verfahren zu seiner herstellung | |
EP1629133A4 (de) | Formgedächtnismaterial und herstellungsverfahren dafür | |
DE602004021601D1 (de) | Positivphotoresistzusammensetzung und verfahren zur ausbildung einer resiststruktur |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |