DE60137972D1 - Lichtquellenbauelement mit led und verfahren zu seiner herstellung - Google Patents

Lichtquellenbauelement mit led und verfahren zu seiner herstellung

Info

Publication number
DE60137972D1
DE60137972D1 DE60137972T DE60137972T DE60137972D1 DE 60137972 D1 DE60137972 D1 DE 60137972D1 DE 60137972 T DE60137972 T DE 60137972T DE 60137972 T DE60137972 T DE 60137972T DE 60137972 D1 DE60137972 D1 DE 60137972D1
Authority
DE
Germany
Prior art keywords
radiator plate
hole
insulating member
light source
led chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60137972T
Other languages
English (en)
Inventor
Masaru Sugimoto
Eiji Shiohama
Hideyoshi Kimura
Takuma Hashimoto
Toshiyuki Suzuki
Kazuya Nakagawa
Mitsuru Kobayashi
Jiro Hashizume
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001114502A external-priority patent/JP4432275B2/ja
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Application granted granted Critical
Publication of DE60137972D1 publication Critical patent/DE60137972D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
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    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2924/181—Encapsulation
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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
DE60137972T 2001-04-12 2001-12-03 Lichtquellenbauelement mit led und verfahren zu seiner herstellung Expired - Lifetime DE60137972D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001114502A JP4432275B2 (ja) 2000-07-13 2001-04-12 光源装置
PCT/JP2001/010561 WO2002084750A1 (en) 2001-04-12 2001-12-03 Light source device using led, and method of producing same

Publications (1)

Publication Number Publication Date
DE60137972D1 true DE60137972D1 (de) 2009-04-23

Family

ID=18965561

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60137972T Expired - Lifetime DE60137972D1 (de) 2001-04-12 2001-12-03 Lichtquellenbauelement mit led und verfahren zu seiner herstellung

Country Status (7)

Country Link
US (1) US6874910B2 (de)
EP (1) EP1387412B1 (de)
CN (1) CN1212676C (de)
AT (1) ATE425556T1 (de)
DE (1) DE60137972D1 (de)
TW (1) TW517402B (de)
WO (1) WO2002084750A1 (de)

Families Citing this family (374)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW591990B (en) * 2001-07-25 2004-06-11 Sanyo Electric Co Method for making an illumination device
JP4045781B2 (ja) 2001-08-28 2008-02-13 松下電工株式会社 発光装置
CN1663044A (zh) * 2002-06-14 2005-08-31 莱尼股份有限公司 灯和制灯方法
TW554553B (en) * 2002-08-09 2003-09-21 United Epitaxy Co Ltd Sub-mount for high power light emitting diode
US7775685B2 (en) 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US7244965B2 (en) 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
KR20050072152A (ko) * 2002-12-02 2005-07-08 쓰리엠 이노베이티브 프로퍼티즈 컴파니 복수의 광원을 사용한 조사 시스템
DE112004000155B4 (de) 2003-01-16 2019-06-19 Panasonic Intellectual Property Management Co., Ltd. Anschlussrahmen für ein Halbleiterbauelement
TW570301U (en) * 2003-02-13 2004-01-01 Shang-Hua You Adhesive type LED lead frame
JP3948417B2 (ja) * 2003-02-28 2007-07-25 ノーリツ鋼機株式会社 光源ユニット
US6885033B2 (en) * 2003-03-10 2005-04-26 Cree, Inc. Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same
WO2004082034A1 (ja) * 2003-03-14 2004-09-23 Sumitomo Electric Industries Ltd. 半導体装置
TW594950B (en) * 2003-03-18 2004-06-21 United Epitaxy Co Ltd Light emitting diode and package scheme and method thereof
US20040229391A1 (en) * 2003-04-25 2004-11-18 Kazuyuki Ohya LED lamp manufacturing process
US7528421B2 (en) * 2003-05-05 2009-05-05 Lamina Lighting, Inc. Surface mountable light emitting diode assemblies packaged for high temperature operation
WO2004100213A2 (en) * 2003-05-05 2004-11-18 Gelcore Llc Led-based light bulb
US7633093B2 (en) * 2003-05-05 2009-12-15 Lighting Science Group Corporation Method of making optical light engines with elevated LEDs and resulting product
US7777235B2 (en) * 2003-05-05 2010-08-17 Lighting Science Group Corporation Light emitting diodes with improved light collimation
US20070013057A1 (en) * 2003-05-05 2007-01-18 Joseph Mazzochette Multicolor LED assembly with improved color mixing
TWI253765B (en) * 2003-05-26 2006-04-21 Matsushita Electric Works Ltd Light-emitting device
EP1634332A1 (de) * 2003-06-03 2006-03-15 Asetronics AG Isoliertes metallsubstrat mit wenigstens einer leuchtdiode, leuchtdiodenmatrix und herstellungsverfahren
US7391153B2 (en) * 2003-07-17 2008-06-24 Toyoda Gosei Co., Ltd. Light emitting device provided with a submount assembly for improved thermal dissipation
TWI220577B (en) * 2003-07-25 2004-08-21 Epistar Corp Light emitting device having composite substrate
JP2005064047A (ja) * 2003-08-13 2005-03-10 Citizen Electronics Co Ltd 発光ダイオード
US20050046003A1 (en) * 2003-08-26 2005-03-03 Chung-Che Tsai Stacked-chip semiconductor package and fabrication method thereof
DE602004020906D1 (de) * 2003-09-19 2009-06-10 Panasonic Corp Beleuchtungseinrichtung
CN1601768A (zh) * 2003-09-22 2005-03-30 福建省苍乐电子企业有限公司 一种发光二极管结构
US7329024B2 (en) * 2003-09-22 2008-02-12 Permlight Products, Inc. Lighting apparatus
KR100732267B1 (ko) * 2003-09-29 2007-06-25 마츠시타 덴끼 산교 가부시키가이샤 선형 광원장치 및 그 제조방법, 그리고 면 발광장치
US6995402B2 (en) * 2003-10-03 2006-02-07 Lumileds Lighting, U.S., Llc Integrated reflector cup for a light emitting device mount
US7102172B2 (en) * 2003-10-09 2006-09-05 Permlight Products, Inc. LED luminaire
US20050077616A1 (en) * 2003-10-09 2005-04-14 Ng Kee Yean High power light emitting diode device
JP4259979B2 (ja) * 2003-10-22 2009-04-30 新光電気工業株式会社 光透過性カバー及びこれを備えたデバイス並びにそれらの製造方法
US7607801B2 (en) * 2003-10-31 2009-10-27 Toyoda Gosei Co., Ltd. Light emitting apparatus
DE10351934B4 (de) * 2003-11-07 2017-07-13 Tridonic Jennersdorf Gmbh Leuchtdioden-Anordnung mit wärmeabführender Platine
FR2862424B1 (fr) * 2003-11-18 2006-10-20 Valeo Electronique Sys Liaison Dispositif de refroidissement d'un composant electrique et procede de fabrication de ce dispositif
DE602004028648D1 (de) * 2003-11-25 2010-09-23 Panasonic Elec Works Co Ltd Lichtemittierendes bauelement mit einem leuchtdiodenchip
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
US7250611B2 (en) * 2003-12-02 2007-07-31 3M Innovative Properties Company LED curing apparatus and method
US7329887B2 (en) * 2003-12-02 2008-02-12 3M Innovative Properties Company Solid state light device
US7403680B2 (en) 2003-12-02 2008-07-22 3M Innovative Properties Company Reflective light coupler
US20050116635A1 (en) * 2003-12-02 2005-06-02 Walson James E. Multiple LED source and method for assembling same
US7456805B2 (en) 2003-12-18 2008-11-25 3M Innovative Properties Company Display including a solid state light device and method using same
US7198387B1 (en) * 2003-12-18 2007-04-03 B/E Aerospace, Inc. Light fixture for an LED-based aircraft lighting system
JP2005197369A (ja) * 2004-01-05 2005-07-21 Toshiba Corp 光半導体装置
JP4343720B2 (ja) * 2004-01-23 2009-10-14 株式会社小糸製作所 灯具
US20060017658A1 (en) * 2004-03-15 2006-01-26 Onscreen Technologies, Inc. Rapid dispatch emergency signs
KR100621550B1 (ko) * 2004-03-17 2006-09-14 삼성전자주식회사 테이프 배선 기판의 제조방법
DE102004013680A1 (de) * 2004-03-18 2005-10-20 Siemens Ag Lichtquelle für Bilderzeugungseinheit
DE102004014207A1 (de) * 2004-03-23 2005-10-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil mit mehrteiligem Gehäusekörper
US7355284B2 (en) * 2004-03-29 2008-04-08 Cree, Inc. Semiconductor light emitting devices including flexible film having therein an optical element
EP1735845A2 (de) * 2004-04-16 2006-12-27 Lucea AG Gehäuse für led-chip und lichtquelle
US20080043444A1 (en) * 2004-04-27 2008-02-21 Kyocera Corporation Wiring Board for Light-Emitting Element
US8188503B2 (en) * 2004-05-10 2012-05-29 Permlight Products, Inc. Cuttable illuminated panel
TWI244226B (en) * 2004-11-05 2005-11-21 Chen Jen Shian Manufacturing method of flip-chip light-emitting device
US7138659B2 (en) * 2004-05-18 2006-11-21 Onscreen Technologies, Inc. LED assembly with vented circuit board
JP2005339881A (ja) * 2004-05-25 2005-12-08 Hitachi Displays Ltd 照明装置、照明モジュール及び液晶表示装置
KR100623024B1 (ko) * 2004-06-10 2006-09-19 엘지전자 주식회사 고출력 ｌｅｄ 패키지
US7111972B2 (en) * 2004-06-23 2006-09-26 Osram Sylvania Inc. LED lamp with central optical light guide
US20060013003A1 (en) * 2004-06-30 2006-01-19 Taiwan Oasis Technology Co., Ltd. High illumination light emitting diode
TWI302038B (en) * 2004-07-07 2008-10-11 Epistar Corp Light emitting diode having an adhesive layer and heat paths
US20060012992A1 (en) * 2004-07-14 2006-01-19 Taiwan Oasis Technology Co., Ltd. LED luminance enhancing construction
CN1317592C (zh) * 2004-07-19 2007-05-23 友达光电股份有限公司 散热固定装置及其散热方法
US20060017058A1 (en) * 2004-07-22 2006-01-26 Taiwan Oasis Technology Co., Ltd. Construction of LED circuit board
US7236366B2 (en) * 2004-07-23 2007-06-26 Excel Cell Electronic Co., Ltd. High brightness LED apparatus with an integrated heat sink
US20080290354A1 (en) * 2004-07-27 2008-11-27 Koninklijke Philips Electronics, N.V. Light Emitting Diode Assembly
US20060046327A1 (en) * 2004-08-30 2006-03-02 Nan Ya Plastics Corporation High heat dissipation LED device and its manufacturing method
JP2006100787A (ja) 2004-08-31 2006-04-13 Toyoda Gosei Co Ltd 発光装置および発光素子
DE102004042186B4 (de) * 2004-08-31 2010-07-01 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
JP3956965B2 (ja) 2004-09-07 2007-08-08 日立エーアイシー株式会社 チップ部品型発光装置及びそのための配線基板
TW200629596A (en) * 2004-09-16 2006-08-16 Hitachi Aic Inc Reflector for led and led device
WO2006033057A1 (en) * 2004-09-23 2006-03-30 Koninklijke Philips Electronics N.V. Light-emitting device
CN100550442C (zh) * 2004-10-22 2009-10-14 皇家飞利浦电子股份有限公司 发光装置和制造这种装置的方法
US20060097385A1 (en) * 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
JP4757477B2 (ja) * 2004-11-04 2011-08-24 株式会社 日立ディスプレイズ 光源ユニット、それを用いた照明装置及びそれを用いた表示装置
US7303315B2 (en) * 2004-11-05 2007-12-04 3M Innovative Properties Company Illumination assembly using circuitized strips
TWI255377B (en) * 2004-11-05 2006-05-21 Au Optronics Corp Backlight module
JP2006186297A (ja) * 2004-12-03 2006-07-13 Toshiba Corp 半導体発光装置及びその製造方法
US7683393B2 (en) * 2004-12-07 2010-03-23 Ngk Spark Plug Co., Ltd. Wiring substrate for mounting light emitting element
US7285802B2 (en) * 2004-12-21 2007-10-23 3M Innovative Properties Company Illumination assembly and method of making same
US20060131601A1 (en) * 2004-12-21 2006-06-22 Ouderkirk Andrew J Illumination assembly and method of making same
ITRM20040633A1 (it) * 2004-12-23 2005-03-23 St Microelectronics Srl Trasmettitore ottico multi-sorgente e dispositivo di visualizzazione fotonico.
KR101115800B1 (ko) * 2004-12-27 2012-03-08 엘지디스플레이 주식회사 발광소자 패키지, 이의 제조 방법 및 백라이트 유닛
TWI352437B (en) * 2007-08-27 2011-11-11 Epistar Corp Optoelectronic semiconductor device
KR101197046B1 (ko) 2005-01-26 2012-11-06 삼성디스플레이 주식회사 발광다이오드를 사용하는 2차원 광원 및 이를 이용한 액정표시 장치
KR101138944B1 (ko) * 2005-01-26 2012-04-25 서울옵토디바이스주식회사 직렬 연결된 복수개의 발광셀들을 갖는 발광 소자 및그것을 제조하는 방법
JP4895075B2 (ja) * 2005-01-31 2012-03-14 ウシオ電機株式会社 放電ランプ
JP2006237190A (ja) * 2005-02-24 2006-09-07 Toshiba Discrete Technology Kk 半導体発光装置
US7262438B2 (en) * 2005-03-08 2007-08-28 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. LED mounting having increased heat dissipation
JP4241658B2 (ja) * 2005-04-14 2009-03-18 シチズン電子株式会社 発光ダイオード光源ユニット及びそれを用いて形成した発光ダイオード光源
US7329942B2 (en) * 2005-05-18 2008-02-12 Ching-Fu Tsou Array-type modularized light-emitting diode structure and a method for packaging the structure
KR100649641B1 (ko) * 2005-05-31 2006-11-27 삼성전기주식회사 Ｌｅｄ 패키지
CN100435361C (zh) * 2005-05-31 2008-11-19 新灯源科技有限公司 半导体发光元件封装结构
CN2814677Y (zh) * 2005-06-03 2006-09-06 明达光电(厦门)有限公司 带凹槽式基板的发光二极管
WO2006132148A1 (ja) 2005-06-07 2006-12-14 Fujikura Ltd. 発光素子実装用ホーロー基板、発光素子モジュール、照明装置、表示装置及び交通信号機
KR101017921B1 (ko) * 2005-06-13 2011-03-08 가부시키가이샤후지쿠라 발광 소자 실장용 기판, 발광 모듈 및 조명 장치
US7980743B2 (en) 2005-06-14 2011-07-19 Cree, Inc. LED backlighting for displays
KR100784057B1 (ko) * 2005-06-24 2007-12-10 엘지이노텍 주식회사 발광소자 패키지 및 발광소자 패키지 제조 방법
KR101232505B1 (ko) * 2005-06-30 2013-02-12 엘지디스플레이 주식회사 발광다이오드 패키지 제조방법, 백라이트 유닛 및액정표시장치
KR20080027355A (ko) * 2005-06-30 2008-03-26 마츠시다 덴코 가부시키가이샤 발광 장치
JP4617209B2 (ja) * 2005-07-07 2011-01-19 株式会社豊田自動織機 放熱装置
CN2821749Y (zh) * 2005-07-21 2006-09-27 新灯源科技有限公司 发光显示面板
KR100629521B1 (ko) * 2005-07-29 2006-09-28 삼성전자주식회사 Ｌｅｄ 패키지 및 그 제조방법과 이를 이용한 ｌｅｄ어레이 모듈
US20070041195A1 (en) * 2005-08-16 2007-02-22 Excel Cell Electronic Co., Ltd. Light emitting assembly
US7311420B2 (en) * 2005-08-22 2007-12-25 Avago Technologies Ecbuip Pte Ltd Opto-electronic package, and methods and systems for making and using same
CN100403503C (zh) * 2005-09-07 2008-07-16 孙卓 高反射率半导体照明集成光源模块的制造方法
US7812358B2 (en) * 2005-09-13 2010-10-12 Showa Denko K.K. Light-emitting device
CN100594623C (zh) * 2005-09-20 2010-03-17 松下电工株式会社 发光二极管照明器具
KR100985452B1 (ko) * 2005-09-20 2010-10-05 파나소닉 전공 주식회사 발광 장치
DE102006032415A1 (de) * 2005-09-30 2007-04-05 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines strahlungsemittierenden Bauelements und strahlungsemittierendes Bauelement
WO2007046516A1 (en) * 2005-10-20 2007-04-26 Showa Denko K.K. Luminous device mounting substrate, luminous device mounting package, and planar light source device
US7505275B2 (en) * 2005-11-04 2009-03-17 Graftech International Holdings Inc. LED with integral via
WO2007059657A1 (en) 2005-11-28 2007-05-31 Jen-Shyan Chen Package structure of light-emitting diode
JP2007165803A (ja) * 2005-12-16 2007-06-28 Sharp Corp 発光装置
KR100764380B1 (ko) * 2005-12-16 2007-10-08 삼성전기주식회사 슬림형 백라이트유닛
KR101144489B1 (ko) * 2005-12-23 2012-05-11 엘지이노텍 주식회사 Ｌｅｄ 패키지
KR100723144B1 (ko) * 2005-12-24 2007-05-30 삼성전기주식회사 발광다이오드 패키지
US20070164303A1 (en) * 2006-01-13 2007-07-19 Lightop Technology Co., Ltd. [led lamp]
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
US20070176182A1 (en) * 2006-01-27 2007-08-02 Way-Jze Wen Structure for integrating LED circuit onto heat-dissipation substrate
EP1830421A3 (de) 2006-03-03 2012-03-14 Semiconductor Energy Laboratory Co., Ltd. Lichtemittierende Vorrichtung, Verfahren zur Herstellung der lichtemittierenden Vorrichtung und blattförmiges Dichtungsmaterial
JP5165207B2 (ja) * 2006-03-29 2013-03-21 オンセミコンダクター・トレーディング・リミテッド 半導体装置の製造方法
KR100748722B1 (ko) * 2006-04-03 2007-08-13 삼성전자주식회사 미소소자 패키지 모듈 및 그 제조방법
JP2007288050A (ja) * 2006-04-19 2007-11-01 Shinko Electric Ind Co Ltd 半導体装置および半導体装置の製造方法
US7827679B1 (en) 2006-04-20 2010-11-09 Rati M. Patel Thermal management circuit board and methods of producing the same
JP4721437B2 (ja) * 2006-04-26 2011-07-13 キヤノン株式会社 光源装置及び映像表示装置
US8179679B2 (en) * 2006-04-27 2012-05-15 Netapp, Inc. Airflow guides using silicon walls/creating channels for heat control
US7829899B2 (en) 2006-05-03 2010-11-09 Cree, Inc. Multi-element LED lamp package
US20070259576A1 (en) * 2006-05-03 2007-11-08 Brandt Bruce B Metal carrier for LEDs in composite lamps
WO2007139781A2 (en) * 2006-05-23 2007-12-06 Cree Led Lighting Solutions, Inc. Lighting device
US20070278493A1 (en) * 2006-06-02 2007-12-06 Semiconductor Energy Laboratory Co., Ltd. Light-emitting element and display device
TWM309059U (en) * 2006-06-12 2007-04-01 Grand Halo Technology Co Ltd Heat sink module
US20070295969A1 (en) * 2006-06-26 2007-12-27 Tong-Fatt Chew LED device having a top surface heat dissipator
TWI350409B (en) * 2006-07-06 2011-10-11 Nat Univ Chung Hsing Flexible and could be rolling-up area lights module and the method of producing thereof
KR200429400Y1 (ko) * 2006-07-28 2006-10-23 지아 쭁 엔터프라이즈 컴퍼니 리미티드 액정디스플레이의 이극체 기판구조
EP3489572A1 (de) 2006-08-29 2019-05-29 Toshiba Lighting & Technology Corporation Beleuchtungsvorrichtung mit mehreren lichtemittierenden halbleiterbauelementen
US20080062698A1 (en) * 2006-09-13 2008-03-13 Yun Tai LED module
US20080266869A1 (en) * 2006-09-13 2008-10-30 Yun Tai LED module
JP4846498B2 (ja) * 2006-09-22 2011-12-28 株式会社東芝 光半導体装置及び光半導体装置の製造方法
US7566154B2 (en) * 2006-09-25 2009-07-28 B/E Aerospace, Inc. Aircraft LED dome light having rotatably releasable housing mounted within mounting flange
US8497560B2 (en) * 2006-10-06 2013-07-30 Industrial Technology Research Institute LED package and method of assembling the same
EP1928026A1 (de) * 2006-11-30 2008-06-04 Toshiba Lighting & Technology Corporation Beleuchtungsvorrichtung mit lichtemittierenden Halbleiterelementen
CN101192601B (zh) * 2006-11-30 2010-10-13 东芝照明技术株式会社 具有半导体发光元件的照明装置
TW201448263A (zh) 2006-12-11 2014-12-16 Univ California 透明發光二極體
KR20080057881A (ko) * 2006-12-21 2008-06-25 엘지전자 주식회사 인쇄회로기판, 이를 포함하는 발광 장치 및 그 제조 방법
EP1936683A1 (de) * 2006-12-22 2008-06-25 ABB Technology AG Bodenplatte für eine Wärmesenke und elektronische Vorrichtung mit einer Bodenplatte
WO2008078587A1 (ja) * 2006-12-25 2008-07-03 Showa Denko K.K. 発光装置、表示装置、および固体発光素子基板
US7687823B2 (en) * 2006-12-26 2010-03-30 Nichia Corporation Light-emitting apparatus and method of producing the same
TWI325186B (en) * 2007-01-19 2010-05-21 Harvatek Corp Led chip package structure using ceramic material as a substrate
TWM318188U (en) * 2007-02-02 2007-09-01 Lighthouse Technology Co Ltd Light-emitting diode
WO2008100298A1 (en) * 2007-02-14 2008-08-21 Lynk Labs, Inc. Led lighting device
US8172434B1 (en) 2007-02-23 2012-05-08 DeepSea Power and Light, Inc. Submersible multi-color LED illumination system
JP4893378B2 (ja) * 2007-03-07 2012-03-07 ソニー株式会社 発光装置、表示装置および表示装置の製造方法
JP2008227001A (ja) * 2007-03-09 2008-09-25 Rohm Co Ltd 赤外線リフレクター及び加熱装置
US20080290359A1 (en) * 2007-04-23 2008-11-27 Samsung Electro-Mechanics Co., Ltd. Light emitting device and manufacturing method of the same
TW200845877A (en) * 2007-05-07 2008-11-16 Tysun Inc Heat-dissipating substrates of composite structure
EP2149920A1 (de) * 2007-05-17 2010-02-03 Showa Denko K.K. Lichtemittierendes halbleiterbauelement
TWM328763U (en) * 2007-05-21 2008-03-11 Univ Nat Taiwan Structure of heat dissipation substrate
US20080302564A1 (en) * 2007-06-11 2008-12-11 Ppg Industries Ohio, Inc. Circuit assembly including a metal core substrate and process for preparing the same
TW200903834A (en) * 2007-07-05 2009-01-16 Bright Led Electronics Corp High heat-dissipation light emitting diode device
US20090016066A1 (en) * 2007-07-12 2009-01-15 Chen Pi Hsiang Package Structure for a High-Luminance Light Source
TW200905914A (en) * 2007-07-25 2009-02-01 Tera Automation Corp Ltd High-power LED package
DE102007037821A1 (de) * 2007-08-10 2009-02-12 Osram Gesellschaft mit beschränkter Haftung Leuchtmodul
US7652301B2 (en) * 2007-08-16 2010-01-26 Philips Lumileds Lighting Company, Llc Optical element coupled to low profile side emitting LED
JP2009054610A (ja) * 2007-08-23 2009-03-12 Tera Autotech Corp 高効率ｌｅｄのパッケージング
TWI312046B (en) * 2007-08-24 2009-07-11 Ama Precision Inc Led base with heat fins
EP2207998B1 (de) * 2007-10-09 2015-09-16 Philips Solid-State Lighting Solutions, Inc. Integrierte leuchte auf led-basis für allgemeine beleuchtung
US7854616B2 (en) * 2007-10-12 2010-12-21 The L.D. Kichler Co. Positionable lighting systems and methods
JP5277610B2 (ja) * 2007-10-29 2013-08-28 日亜化学工業株式会社 発光装置及び面発光装置並びに発光装置用パッケージ
GB2470802B (en) * 2007-11-16 2011-10-05 Uriel Meyer Wittenberg A silver-based thermally conductive composition for thermally coupling LED chips to heat sinks
DE102007055133A1 (de) * 2007-11-19 2009-05-20 Osram Gesellschaft mit beschränkter Haftung Beleuchtungsvorrichtung mit einem Kühlkörper
TW200924229A (en) * 2007-11-23 2009-06-01 Gigno Technology Co Ltd LED package module and manufacturing method thereof
US7651254B2 (en) * 2007-12-03 2010-01-26 Industrial Technology Research Institute Microchip matrix light source module
US8304660B2 (en) * 2008-02-07 2012-11-06 National Taiwan University Fully reflective and highly thermoconductive electronic module and method of manufacturing the same
US8148747B2 (en) * 2008-03-25 2012-04-03 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base/cap heat spreader
US8531024B2 (en) * 2008-03-25 2013-09-10 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
US8354688B2 (en) 2008-03-25 2013-01-15 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump
US8110446B2 (en) * 2008-03-25 2012-02-07 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace
US8314438B2 (en) * 2008-03-25 2012-11-20 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base heat spreader and cavity in bump
US8324723B2 (en) * 2008-03-25 2012-12-04 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump
US8310043B2 (en) 2008-03-25 2012-11-13 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader with ESD protection layer
US20110156090A1 (en) * 2008-03-25 2011-06-30 Lin Charles W C Semiconductor chip assembly with post/base/post heat spreader and asymmetric posts
US8203167B2 (en) 2008-03-25 2012-06-19 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal
US8232576B1 (en) 2008-03-25 2012-07-31 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and ceramic block in post
US20110163348A1 (en) * 2008-03-25 2011-07-07 Bridge Semiconductor Corporation Semiconductor chip assembly with bump/base heat spreader and inverted cavity in bump
US8288792B2 (en) * 2008-03-25 2012-10-16 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base/post heat spreader
US8193556B2 (en) * 2008-03-25 2012-06-05 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and cavity in post
US20100181594A1 (en) * 2008-03-25 2010-07-22 Lin Charles W C Semiconductor chip assembly with post/base heat spreader and cavity over post
US20090284932A1 (en) * 2008-03-25 2009-11-19 Bridge Semiconductor Corporation Thermally Enhanced Package with Embedded Metal Slug and Patterned Circuitry
US20100072511A1 (en) * 2008-03-25 2010-03-25 Lin Charles W C Semiconductor chip assembly with copper/aluminum post/base heat spreader
US8415703B2 (en) * 2008-03-25 2013-04-09 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange
US8207553B2 (en) * 2008-03-25 2012-06-26 Bridge Semiconductor Corporation Semiconductor chip assembly with base heat spreader and cavity in base
US8129742B2 (en) 2008-03-25 2012-03-06 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and plated through-hole
US8525214B2 (en) * 2008-03-25 2013-09-03 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader with thermal via
CN101546795B (zh) * 2008-03-25 2011-02-16 旭丽电子(广州)有限公司 半导体发光元件
US8378372B2 (en) * 2008-03-25 2013-02-19 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and horizontal signal routing
US20100052005A1 (en) * 2008-03-25 2010-03-04 Lin Charles W C Semiconductor chip assembly with post/base heat spreader and conductive trace
US8329510B2 (en) 2008-03-25 2012-12-11 Bridge Semiconductor Corporation Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer
US9018667B2 (en) * 2008-03-25 2015-04-28 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and dual adhesives
US7948076B2 (en) * 2008-03-25 2011-05-24 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and vertical signal routing
US20110278638A1 (en) 2008-03-25 2011-11-17 Lin Charles W C Semiconductor chip assembly with post/dielectric/post heat spreader
US8067784B2 (en) 2008-03-25 2011-11-29 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and substrate
US8212279B2 (en) 2008-03-25 2012-07-03 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader, signal post and cavity
US8269336B2 (en) * 2008-03-25 2012-09-18 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base heat spreader and signal post
WO2009119461A1 (ja) 2008-03-26 2009-10-01 島根県 半導体発光モジュールおよびその製造方法
TWI458119B (zh) * 2008-05-05 2014-10-21 Univ Nat Central 發光二極體之混光裝置
KR100982141B1 (ko) 2008-05-14 2010-09-14 주식회사 세코닉스 색 합성 및 고효율의 집광 특성을 갖는 ｌｅｄ 집광렌즈
TWM345341U (en) * 2008-05-30 2008-11-21 Unity Opto Technology Co Ltd Light-emitting structure
TWM353308U (en) * 2008-06-09 2009-03-21 qiu-shuang Ke LED illumination device
JP2010002745A (ja) * 2008-06-20 2010-01-07 Hitachi Displays Ltd 液晶表示装置
KR101438826B1 (ko) * 2008-06-23 2014-09-05 엘지이노텍 주식회사 발광장치
CN101615643A (zh) * 2008-06-25 2009-12-30 富准精密工业(深圳)有限公司 发光二极管结构
US20100001305A1 (en) * 2008-07-07 2010-01-07 Visera Technologies Company Limited Semiconductor devices and fabrication methods thereof
KR101012043B1 (ko) * 2008-08-13 2011-01-31 김욱동 Ｌｅｄ의 방열처리 구조체
TWI376783B (en) * 2008-08-25 2012-11-11 Young Green Energy Co Electronic assembly and backlight module
US20100067240A1 (en) * 2008-09-16 2010-03-18 John Selverian Optical Cup For Lighting Module
US8183585B2 (en) * 2008-09-16 2012-05-22 Osram Sylvania Inc. Lighting module
US8188486B2 (en) * 2008-09-16 2012-05-29 Osram Sylvania Inc. Optical disk for lighting module
TWI420695B (zh) * 2008-10-21 2013-12-21 Advanced Optoelectronic Tech 化合物半導體元件之封裝模組結構及其製造方法
US8136960B2 (en) * 2008-11-12 2012-03-20 American Opto Plus Led Corporation Light emitting diode display
KR101007131B1 (ko) 2008-11-25 2011-01-10 엘지이노텍 주식회사 발광 소자 패키지
JP2010171379A (ja) * 2008-12-25 2010-08-05 Seiko Instruments Inc 発光デバイス
TWI426206B (zh) * 2008-12-25 2014-02-11 Au Optronics Corp 發光二極體裝置
KR101301445B1 (ko) * 2008-12-30 2013-08-28 엘지디스플레이 주식회사 발광 다이오드 모듈 및 이를 구비한 백라이트 어셈블리
JP5406540B2 (ja) * 2009-01-23 2014-02-05 株式会社小糸製作所 光源モジュール、車輌用灯具及び光源モジュールの製造方法
KR100979971B1 (ko) 2009-02-09 2010-09-03 주식회사 두성에이텍 발광 다이오드 유닛의 제조 방법과, 이 방법에 의하여 제조된 발광 다이오드 유닛
KR20100094246A (ko) * 2009-02-18 2010-08-26 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
CN101539250A (zh) * 2009-04-21 2009-09-23 薛信培 一种大功率led灯
TW201041190A (en) * 2009-05-01 2010-11-16 Univ Nat Taiwan Science Tech Polarized white light emitting diode (LED)
US20100302789A1 (en) * 2009-05-28 2010-12-02 Qing Li LED Light Source Module and Method for Producing the Same
JP5499325B2 (ja) * 2009-06-01 2014-05-21 東芝ライテック株式会社 発光モジュールおよび照明装置
KR101056740B1 (ko) 2009-06-01 2011-08-12 주식회사 세미라인 발광 다이오드 패키지 모듈 및 그의 제조방법
JP5121783B2 (ja) * 2009-06-30 2013-01-16 株式会社日立ハイテクノロジーズ Ｌｅｄ光源およびその製造方法ならびにｌｅｄ光源を用いた露光装置及び露光方法
CN101944898B (zh) * 2009-07-06 2013-08-07 光宝电子(广州)有限公司 触控按键装置以及使用此触控按键装置的电子装置
TWM371307U (en) * 2009-07-24 2009-12-21 Wei-Ting Chen Heat dissipation module of light emitting diode
US8324653B1 (en) 2009-08-06 2012-12-04 Bridge Semiconductor Corporation Semiconductor chip assembly with ceramic/metal substrate
JP2011054736A (ja) * 2009-09-01 2011-03-17 Sharp Corp 発光装置、平面光源および液晶表示装置
US9385285B2 (en) * 2009-09-17 2016-07-05 Koninklijke Philips N.V. LED module with high index lens
KR101034054B1 (ko) * 2009-10-22 2011-05-12 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
US8659106B2 (en) * 2009-10-29 2014-02-25 Nichia Corporation Light emitting device and method of manufacturing the light emitting device
CN101728474B (zh) * 2009-11-16 2014-04-16 李亚平 高热传导大功率led基板制备工艺
KR101039881B1 (ko) * 2009-12-21 2011-06-09 엘지이노텍 주식회사 발광소자 및 그를 이용한 라이트 유닛
CN102104102B (zh) * 2009-12-21 2013-01-02 钰桥半导体股份有限公司 半导体芯片组体
CA2726179C (en) 2009-12-22 2019-02-19 Virginia Optoelectronics, Inc. Light emitting diode light source modules
TW201123410A (en) * 2009-12-25 2011-07-01 Bright Led Electronics Corp LED light-emitting module and its manufacturing method thereof.
KR20120125452A (ko) * 2010-02-01 2012-11-15 아사히 가라스 가부시키가이샤 발광 소자 탑재용 지지체 및 발광 장치
EP2365552A3 (de) 2010-03-09 2015-03-25 LG Innotek Co., Ltd. Lichtemittierendes Bauteil mit einem Anschlußträger der eine Einbuchtung aufweist.
TWI495113B (zh) * 2010-03-22 2015-08-01 Xintec Inc 具有改良防焊堰體結構之封裝用光學蓋板、影像感測件封裝體及其製作方法
US8319247B2 (en) * 2010-03-25 2012-11-27 Koninklijke Philips Electronics N.V. Carrier for a light emitting device
US20110272179A1 (en) * 2010-05-06 2011-11-10 Vasoya Kalu K Printed Circuit Board with Embossed Hollow Heatsink Pad
CN102313157A (zh) * 2010-06-30 2012-01-11 可成科技股份有限公司 高散热效率的发光二极管灯具模块及其制造方法
DE102010026344A1 (de) 2010-07-07 2012-01-12 Osram Opto Semiconductors Gmbh Leuchtdiode
TWI485823B (zh) * 2010-07-08 2015-05-21 Subtron Technology Co Ltd 半導體封裝結構及半導體封裝結構的製作方法
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
JP5681407B2 (ja) 2010-07-26 2015-03-11 株式会社小糸製作所 発光モジュール
TWI417478B (zh) * 2010-08-19 2013-12-01 Delta Electronics Inc 燈具模組
CN102376677B (zh) * 2010-08-20 2013-07-10 旭德科技股份有限公司 半导体封装结构及半导体封装结构的制作方法
TW201210078A (en) * 2010-08-25 2012-03-01 Foxsemicon Integrated Tech Inc Light emitting diode
DE102010044312B4 (de) * 2010-09-03 2012-07-12 Tyco Electronics Amp Gmbh Leuchte zur Verwendung in feuchten oder nassen Umgebungen mit Leuchtmittelträger
EP2618050A4 (de) * 2010-09-13 2014-08-27 Bk Technology Co Ltd Led-lichtquellenstruktur mit hoher leuchtkraft und verbesserten wärmeableitungseigenschaften
GB2484713A (en) 2010-10-21 2012-04-25 Optovate Ltd Illumination apparatus
KR20130143067A (ko) * 2010-11-03 2013-12-30 쓰리엠 이노베이티브 프로퍼티즈 컴파니 가요성 led 디바이스 및 제조 방법
US8415684B2 (en) * 2010-11-12 2013-04-09 Tsmc Solid State Lighting Ltd. LED device with improved thermal performance
CN102466206A (zh) * 2010-11-15 2012-05-23 黄家兴 Led灯具模块的制程
US10267506B2 (en) 2010-11-22 2019-04-23 Cree, Inc. Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same
CN102052594A (zh) * 2010-12-20 2011-05-11 惠州志能达光电科技有限公司 一种高散热led光源模组及其制作方法
CN102610730B (zh) * 2011-01-24 2014-05-07 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法
US20120188738A1 (en) * 2011-01-25 2012-07-26 Conexant Systems, Inc. Integrated led in system-in-package module
CN103348496A (zh) 2011-02-07 2013-10-09 克利公司 用于发光二极管（led）发光的部件和方法
TWI431218B (zh) * 2011-03-11 2014-03-21 Lingsen Precision Ind Ltd The manufacturing method and structure of LED light bar
CN102683544B (zh) * 2011-03-17 2015-07-08 展晶科技(深圳)有限公司 贴片式发光二极管
KR101128063B1 (ko) 2011-05-03 2012-04-23 테세라, 인코포레이티드 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리
US20120294040A1 (en) * 2011-05-16 2012-11-22 Shenzhen China Star Optoelectronics Technology Co. Ltd. Light-emitting diode heat-dissipation structure and backlight module
CN102820384B (zh) * 2011-06-08 2015-10-07 展晶科技(深圳)有限公司 发光二极管封装结构的制造方法
CN102856464B (zh) * 2011-06-29 2015-07-08 展晶科技(深圳)有限公司 发光二极管封装结构及封装方法
KR101253247B1 (ko) * 2011-07-14 2013-04-16 (주)포인트엔지니어링 광 디바이스용 기판
US8851736B2 (en) * 2011-08-30 2014-10-07 Lg Innotek Co., Ltd. Light emitting module with heatsink plate having coupling protrusions
KR101893046B1 (ko) * 2011-08-30 2018-08-29 엘지이노텍 주식회사 발광 모듈 및 이를 구비한 라이트 유닛
US9117941B2 (en) * 2011-09-02 2015-08-25 King Dragon International Inc. LED package and method of the same
US20150001570A1 (en) * 2011-09-02 2015-01-01 King Dragon International Inc. LED Package and Method of the Same
CN103035813B (zh) * 2011-10-09 2015-10-28 官淑燕 高温元件用电路基板及具该基板的led组件及其制法
US8404520B1 (en) 2011-10-17 2013-03-26 Invensas Corporation Package-on-package assembly with wire bond vias
TWI451556B (zh) * 2011-11-04 2014-09-01 恆日光電股份有限公司 發光二極體封裝模組
CN102403418A (zh) * 2011-11-09 2012-04-04 东莞勤上光电股份有限公司 一种大功率led的散热结构的制作方法
JP5671486B2 (ja) * 2012-01-27 2015-02-18 株式会社沖データ 発光パネル、及びそれを備えたヘッドアップディスプレイ
US9806246B2 (en) 2012-02-07 2017-10-31 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components, and methods
US9786825B2 (en) 2012-02-07 2017-10-10 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components, and methods
US8895998B2 (en) * 2012-03-30 2014-11-25 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components and methods
US8946757B2 (en) * 2012-02-17 2015-02-03 Invensas Corporation Heat spreading substrate with embedded interconnects
JP2013201256A (ja) * 2012-03-23 2013-10-03 Toshiba Lighting & Technology Corp 配線基板装置、発光モジュール、照明装置および配線基板装置の製造方法
DE102012102847A1 (de) * 2012-04-02 2013-10-02 Osram Opto Semiconductors Gmbh Licht emittierendes Halbleiterbauelement und Verfahren zur Herstellung eines Licht emittierenden Halbleiterbauelements
US20130272027A1 (en) * 2012-04-11 2013-10-17 Shenzhen China Star Optoelectronics Technology Co., Ltd. Method for Manufacturing LED Light Bar and LED Light Bar and Backlight Module
CN103375736A (zh) * 2012-04-28 2013-10-30 Ge医疗系统环球技术有限公司 Led灯及包括led灯的限束器和x射线设备
DE102012207166A1 (de) * 2012-04-30 2013-10-31 At & S Austria Technologie & Systemtechnik Aktiengesellschaft LED-Anordnung
JP6211795B2 (ja) * 2012-05-16 2017-10-11 ローム株式会社 Ｌｅｄ光源モジュール
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
JP2014013879A (ja) * 2012-06-06 2014-01-23 Nitto Denko Corp 光半導体用光反射部材およびそれを用いた光半導体実装用基板ならびに光半導体装置
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
DE102012108107A1 (de) * 2012-08-31 2014-03-27 Epcos Ag Leuchtdiodenvorrichtung
JP2014135473A (ja) * 2012-12-11 2014-07-24 Renesas Electronics Corp 光結合素子
CN104871327A (zh) * 2012-12-14 2015-08-26 克利公司 基于陶瓷的发光二极管(led)装置、元件以及方法
TWI573245B (zh) * 2012-12-24 2017-03-01 鴻海精密工業股份有限公司 發光二極體燈條
CN103032848B (zh) * 2013-01-09 2015-02-18 深圳市华星光电技术有限公司 液晶显示装置、背光模组、印刷电路板及其制造方法
US20140201991A1 (en) * 2013-01-24 2014-07-24 Cheih Oh Yang Method for connecting plates of a substrate device
DE102013104195A1 (de) * 2013-04-25 2014-10-30 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
US9167710B2 (en) 2013-08-07 2015-10-20 Invensas Corporation Embedded packaging with preformed vias
CN104425695B (zh) * 2013-09-04 2017-10-03 展晶科技(深圳)有限公司 发光二极管
US20150076714A1 (en) 2013-09-16 2015-03-19 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
CN103489995B (zh) * 2013-10-16 2017-02-22 福州圆点光电技术有限公司 柔性led光源灯丝
GB201318870D0 (en) * 2013-10-25 2013-12-11 Litecool Ltd LED package and LED module
CN104576883B (zh) * 2013-10-29 2018-11-16 普因特工程有限公司 芯片安装用阵列基板及其制造方法
US9263394B2 (en) 2013-11-22 2016-02-16 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9583456B2 (en) 2013-11-22 2017-02-28 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9379074B2 (en) 2013-11-22 2016-06-28 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
CN103687278A (zh) * 2013-11-26 2014-03-26 广州兴森快捷电路科技有限公司 凸台式金属基夹芯刚挠板及其制备方法
JP6171921B2 (ja) * 2013-12-24 2017-08-02 日亜化学工業株式会社 配線基板及び発光装置
KR101552422B1 (ko) * 2014-01-14 2015-09-10 성균관대학교산학협력단 발광 다이오드용 기판 및 그 제조방법과 상기 기판을 포함하는 광원 장치
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9883580B1 (en) 2014-04-11 2018-01-30 Adura Led Solutions, Llc Printed circuit board that provides a direct thermal path between components and a thermal layer and method for assembly
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
US9379298B2 (en) 2014-10-03 2016-06-28 Henkel IP & Holding GmbH Laminate sub-mounts for LED surface mount package
US9825202B2 (en) * 2014-10-31 2017-11-21 eLux, Inc. Display with surface mount emissive elements
US9826581B2 (en) 2014-12-05 2017-11-21 Cree, Inc. Voltage configurable solid state lighting apparatuses, systems, and related methods
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9502372B1 (en) 2015-04-30 2016-11-22 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
JP6604505B2 (ja) * 2015-09-10 2019-11-13 パナソニックＩｐマネジメント株式会社 発光装置
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
US9490222B1 (en) 2015-10-12 2016-11-08 Invensas Corporation Wire bond wires for interference shielding
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US9911718B2 (en) 2015-11-17 2018-03-06 Invensas Corporation ‘RDL-First’ packaged microelectronic device for a package-on-package device
US20170141278A1 (en) * 2015-11-17 2017-05-18 Toshiba Corporation Led assembly for led package with sidewall electrodes
US11686459B2 (en) 2015-12-15 2023-06-27 Wangs Alliance Corporation LED lighting methods and apparatus
US20170171932A1 (en) 2015-12-15 2017-06-15 Wangs Alliance Corporation Led lighting methods and apparatus
US10941924B2 (en) 2015-12-15 2021-03-09 Wangs Alliance Corporation LED lighting methods and apparatus
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
JP2017199803A (ja) * 2016-04-27 2017-11-02 日立マクセル株式会社 三次元成形回路部品
US20170356640A1 (en) 2016-06-10 2017-12-14 Innotec, Corp. Illumination assembly including thermal energy management
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US10718490B2 (en) * 2016-09-23 2020-07-21 Shenzhen Keweitian Eco-Lighting Co., Ltd. LED lamp bead structure having quasi-solar spectrum
JP6653235B2 (ja) * 2016-09-29 2020-02-26 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
US10378736B2 (en) * 2016-11-03 2019-08-13 Foshan Nationstar Optoelectronics Co., Ltd. LED bracket, LED bracket array, LED device and LED display screen
US10299368B2 (en) 2016-12-21 2019-05-21 Invensas Corporation Surface integrated waveguides and circuit structures therefor
GB201705364D0 (en) 2017-04-03 2017-05-17 Optovate Ltd Illumination apparatus
GB201705365D0 (en) 2017-04-03 2017-05-17 Optovate Ltd Illumination apparatus
TWI820026B (zh) 2017-06-21 2023-11-01 荷蘭商露明控股公司 具有改善的熱行為的照明組件
US11812525B2 (en) 2017-06-27 2023-11-07 Wangs Alliance Corporation Methods and apparatus for controlling the current supplied to light emitting diodes
GB201718307D0 (en) 2017-11-05 2017-12-20 Optovate Ltd Display apparatus
JP2019096722A (ja) * 2017-11-22 2019-06-20 富士通株式会社 光モジュール
TWI642335B (zh) * 2017-12-11 2018-11-21 欣興電子股份有限公司 電路板及其製造方法
GB201800574D0 (en) 2018-01-14 2018-02-28 Optovate Ltd Illumination apparatus
JP7072045B2 (ja) 2018-02-16 2022-05-19 京セラ株式会社 多数個取り素子収納用パッケージおよび多数個取り光半導体装置
GB201803767D0 (en) 2018-03-09 2018-04-25 Optovate Ltd Illumination apparatus
GB201807747D0 (en) 2018-05-13 2018-06-27 Optovate Ltd Colour micro-LED display apparatus
KR102669161B1 (ko) * 2018-11-21 2024-05-28 삼성디스플레이 주식회사 발광 장치 및 이를 구비하는 표시 장치
CN111584696A (zh) * 2019-02-19 2020-08-25 江苏罗化新材料有限公司 一种双面出光的led芯片csp封装结构及其封装方法
TW202102883A (zh) 2019-07-02 2021-01-16 美商瑞爾Ｄ斯帕克有限責任公司 定向顯示設備
US11294233B2 (en) 2019-08-23 2022-04-05 ReaID Spark, LLC Directional illumination apparatus and privacy display
WO2021050918A1 (en) 2019-09-11 2021-03-18 Reald Spark, Llc Switchable illumination apparatus and privacy display
CN114730044A (zh) 2019-09-11 2022-07-08 瑞尔D斯帕克有限责任公司 定向照明设备和隐私显示器
KR20220077914A (ko) 2019-10-03 2022-06-09 리얼디 스파크, 엘엘씨 수동형 광학 나노구조를 포함하는 조명 장치
CN114730851A (zh) 2019-10-03 2022-07-08 瑞尔D斯帕克有限责任公司 包括无源光学纳米结构的照明设备
US11089671B2 (en) * 2019-11-26 2021-08-10 Eridan Communications, Inc. Integrated circuit / printed circuit board assembly and method of manufacture
CN110985903B (zh) 2019-12-31 2020-08-14 江苏舒适照明有限公司 一种灯模组
US11598517B2 (en) 2019-12-31 2023-03-07 Lumien Enterprise, Inc. Electronic module group
CN113281853B (zh) * 2020-02-19 2023-01-20 青岛海信宽带多媒体技术有限公司 一种光模块
WO2021168090A1 (en) 2020-02-20 2021-08-26 Reald Spark, Llc Illumination and display apparatus
WO2021170194A1 (en) * 2020-02-26 2021-09-02 LED iBond International A/S Air transport unit
CN111503556B (zh) 2020-04-23 2020-11-27 江苏舒适照明有限公司 一种射灯结构
US11592166B2 (en) 2020-05-12 2023-02-28 Feit Electric Company, Inc. Light emitting device having improved illumination and manufacturing flexibility
US11876042B2 (en) 2020-08-03 2024-01-16 Feit Electric Company, Inc. Omnidirectional flexible light emitting device
US11802682B1 (en) 2022-08-29 2023-10-31 Wangs Alliance Corporation Modular articulating lighting

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59176166A (ja) 1983-03-25 1984-10-05 Nissan Motor Co Ltd バルジハツチとフ−ドとの結合構造
JPS59176166U (ja) * 1983-05-11 1984-11-24 株式会社東芝 光半導体装置
JPS61158606A (ja) 1984-12-28 1986-07-18 株式会社小糸製作所 照明装置
JPS62174980A (ja) * 1986-01-28 1987-07-31 Mitsubishi Cable Ind Ltd 光フアイバ通信用発光装置
JPH0680841B2 (ja) 1986-04-07 1994-10-12 株式会社小糸製作所 照明装置
JP2602063B2 (ja) 1988-06-10 1997-04-23 三菱電線工業株式会社 発光ダイオード照明具
US4935665A (en) * 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
JPH02229477A (ja) * 1988-11-08 1990-09-12 Aichi Electric Co Ltd 固体発光表示装置
JP2922977B2 (ja) * 1990-04-27 1999-07-26 豊田合成株式会社 発光ダイオード
JP2914097B2 (ja) * 1993-06-25 1999-06-28 松下電工株式会社 射出成形プリント基板
JPH07307492A (ja) * 1994-05-11 1995-11-21 Mitsubishi Cable Ind Ltd Ｌｅｄ集合体モジュールおよびその作製方法
US5458716A (en) * 1994-05-25 1995-10-17 Texas Instruments Incorporated Methods for manufacturing a thermally enhanced molded cavity package having a parallel lid
DE19535777A1 (de) 1995-09-26 1997-03-27 Siemens Ag Optoelektronisches Halbleiter-Bauelement und Verfahren zur Herstellung
US5813753A (en) * 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
JPH11298048A (ja) * 1998-04-15 1999-10-29 Matsushita Electric Works Ltd Ｌｅｄ実装基板
JP2000174350A (ja) 1998-12-10 2000-06-23 Toshiba Corp 光半導体モジュール
JP2000223749A (ja) * 1999-01-29 2000-08-11 Seiwa Electric Mfg Co Ltd 発光ダイオードランプとその製造方法、チップ型発光ダイオード素子及びドットマトリクス型発光ダイオードユニット
JP2000277813A (ja) * 1999-03-26 2000-10-06 Matsushita Electric Works Ltd 光源装置
JP4304760B2 (ja) * 1999-05-13 2009-07-29 パナソニック株式会社 半導体発光装置
JP2000082849A (ja) 1999-09-27 2000-03-21 Toshiba Corp 半導体発光素子、半導体発光装置およびその製造方法
US6517218B2 (en) * 2000-03-31 2003-02-11 Relume Corporation LED integrated heat sink
US6531328B1 (en) * 2001-10-11 2003-03-11 Solidlite Corporation Packaging of light-emitting diode

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US6874910B2 (en) 2005-04-05
WO2002084750A1 (en) 2002-10-24
CN1436374A (zh) 2003-08-13
TW517402B (en) 2003-01-11
EP1387412B1 (de) 2009-03-11
CN1212676C (zh) 2005-07-27
US20030189830A1 (en) 2003-10-09
EP1387412A4 (de) 2006-05-31
EP1387412A1 (de) 2004-02-04

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