CN101539250A - 一种大功率led灯 - Google Patents
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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Abstract
本发明涉及一种大功率LED灯,包括一个导热绝缘的基板和一个与基板厚度相同并嵌入基板中的导热基柱,所述的基柱的下表面连接散热板,上表面固定芯片;所述的基板上表面固定透明罩,并设置电路和电极,边缘设置电路通过的通孔,通孔的底部连接导电的电极片,并在基板的透明罩上封装透镜。本发明独特的结构,突破了传统LED灯的设计,可以提高产品可靠性、一致性,同时利用机器设备生产,可以大大提高生产效率,降低产品的成本。
Description
技术领域
本发明涉及半导体照明领域,更具体地说,涉及一种大功率LED灯。
背景技术
LED(Light Emitting Diode),也称发光二极管,作为一种新型光源,其具有体积小、耗能少、适用性强、稳定性高、响应时间短、对环境无污染、多色发光等的优点,广泛应用于照明装饰领域。以大功率的LED作为光源的灯,其具有发光效率高、节能、环保等优点。
但现有的中大功率LED大多采用直插式,贴片式、塑胶TOP的支架式结构,产品散热不好,密封性差,衰减快、光效低。不适应LED向照明应用领域的发展。
发明内容
本发明要解决的技术问题在于,针对现有技术的上述缺陷,提供一种大功率LED灯。
本发明解决其技术问题所采用的技术方案是:设计一种大功率LED灯,包括一个导热绝缘的基板和一个与基板厚度相同并嵌入基板中的导热基柱,所述的基柱的下表面连接散热板,上表面固定芯片;所述的基板上表面固定透明罩,并设置电路和电极,边缘设置电路通过的通孔,通孔的底部连接导电的电极片,并在基板的透明罩上封装透镜。所述的基柱可为铜、银、合金等高导热的材料。所述的基板可采用氮化铝、陶瓷、硅基板等导热绝缘的材料。
作为上述技术的进一步改进,以上所述的一种大功率LED灯,所述的基柱的底面为在同一平面内,由若干条线段或曲线首尾顺次连结且不相交所组成的图形,基柱底面与基板底面在同一个平面上。所述的基柱可为长方体、圆柱体、圆台等形状。
作为上述技术的进一步改进,以上所述的一种大功率LED灯,所述的透明罩采用透明材料,形状为上大下小的倒置圆锥状,透明罩的侧壁上部设有台阶,透明罩中充满荧光粉。台阶结构的设置可有效防止爬胶。
作为上述技术的进一步改进,以上所述的一种大功率LED灯,所述基板的上表面镀反光材料。
作为上述技术的进一步改进,以上所述的一种大功率LED灯,所述的透镜采用硅胶材料。硅胶材料具有优良的导热性。
作为上述技术的进一步改进,以上所述的一种大功率LED灯,所述的基柱为长方体。
实施本发明的一种大功率LED灯,具有以下有益效果:
1、所述基柱采用高导热的材料,下表面连接散热板,嵌入基板中,有利于将芯片发光时产生的热量迅速导出,保证芯片质量的稳定。
2、基板采用氮化铝、陶瓷、硅基板等导热绝缘的材料,不仅导热速度快,而且整体绝缘,可直接在板材上制作电路和电极,节约成本。平板的设计使芯片的发光角度大,出光效率高。
3、基板上设计与电极片单独连接的通孔,可将电路引到背面,并做到导热与导电的部分分离,增加产品的稳定性。
4、在基板的上镀氧化铝等反光材料,可将LED芯片的底部光向正面反射,提高光的利用效率和出光率。
5、基板的上表面固定透明罩,为上大下小的倒置圆锥形,有一定的角度,方便点荧光粉,同时透明材料可使芯片侧面的光透射出来,增加了出光效率。圆锥形透明罩的内壁上部采用特殊工艺处理,使内壁上部成台阶状,可防止爬胶,使光斑均匀,批量一致,视觉效果良好。
6、所述的透镜采用稳定性与散热性良好的硅胶材料,一次成型在基板上,具有两方面的优点:一是作为透镜使用,封装成不同的弧度,可得到不同的LED发光效果;二是起到密封和保护芯片的作用,使LED芯片或荧光粉不会被氧化或损坏。
7、本发明独特的结构,突破了传统LED灯的设计,可以提高产品可靠性、一致性,同时利用机器设备生产,可以大大提高生产效率,降低产品的成本。
附图说明
下面将结合附图及实施例对本发明作进一步说明,附图中:
图1是本发明一种大功率LED灯的结构分解示意图;
图2是本发明一种大功率LED灯实施例的结构示意图;
图3是本发明一种大功率LED灯实施例的剖面图;
图4是本发明一种大功率LED灯实施例的仰视图。
具体实施方式
如附图所示,在本发明一种大功率LED灯的实施例中,包括一个导热绝缘的基板10和一个与基板10厚度相同并嵌入基板10中的导热基柱20,所述的基柱20为长方体,其下表面连接散热板21,上表面固定芯片22;所述的基板10上表面固定透明罩23,并设置电路和电极,边缘设置电路通过的通孔11,通孔11的底部连接导电的电极片12,与基柱20的散热板21分隔开来,使导热与导电的部分分开,并在基板10的透明罩23上封装透镜13。
所述的透明罩23为上大下小的倒置圆锥状,在杯中点荧光粉,在透明罩23的上部内壁进行特殊工艺处理,使内壁上部成台阶状231,防止爬胶。因为爬胶会影响光斑的均匀性,批量的一致性,容易造成外观不良。
基板10的上表面镀氧化铝等反光材料14,将LED芯片的底部光向正面反射,可提高光的利用效率和出光率。
所述的透镜13采用导热优良的硅胶材料。一次成型在基板10上,可起到两方面的作用:一是作为透镜使用,封装成不同的椭圆形,可得到LED的不同发光效果;二是起到密封和保护芯片的作用,使LED芯片或荧光粉不会被氧化或损坏。
综上所述,如本技术领域中普通技术人员可以了解的,本说明书中所述的只是本发明的一个较佳实施例,凡依本发明的构思所做的改变或修饰,皆应在本发明的权利要求保护范围内。
Claims (6)
1、一种大功率LED灯,其特征在于,包括一个导热绝缘的基板和一个与基板厚度相同并嵌入基板中的导热基柱,所述的基柱的下表面连接散热板,上表面固定芯片;所述的基板上表面固定透明罩,并设置电路和电极,边缘设置电路通过的通孔,通孔的底部连接导电的电极片,并在基板的透明罩上封装透镜。
2、根据权利要求1所述的一种大功率LED灯,其特征在于,所述的基柱的底面为在同一平面内,由若干条线段或曲线首尾顺次连结且不相交所组成的图形,基柱的底面与基板底面在同一个平面上。
3、根据权利要求1所述的一种大功率LED灯,其特征在于,所述的透明罩采用透明材料,形状为上大下小的倒置圆锥状,透明罩的侧壁上部设有台阶,透明罩中充满荧光粉。
4、根据权利要求1所述的一种大功率LED灯,其特征在于,所述基板的上表面镀反光材料。
5、根据权利要求1所述的一种大功率LED灯,其特征在于,所述的透镜采用硅胶材料。
6、根据权利要求2所述的一种大功率LED灯,其特征在于,所述的基柱为长方体。
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CN200910106764A CN101539250A (zh) | 2009-04-21 | 2009-04-21 | 一种大功率led灯 |
EP09164091A EP2244313A1 (en) | 2009-04-21 | 2009-06-30 | Light emitting diode with high power |
JP2009155040A JP2010258397A (ja) | 2009-04-21 | 2009-06-30 | 大効率のled灯 |
US12/502,914 US20100264451A1 (en) | 2009-04-21 | 2009-07-14 | Light Emitting Diode with High Power |
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CN200910106764A CN101539250A (zh) | 2009-04-21 | 2009-04-21 | 一种大功率led灯 |
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WO2013060001A1 (zh) * | 2011-10-25 | 2013-05-02 | 宁波市佰仕电器有限公司 | 一种led灯 |
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WO2009107535A1 (ja) * | 2008-02-25 | 2009-09-03 | 株式会社東芝 | 白色ledランプ、バックライト、発光装置、表示装置および照明装置 |
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2009
- 2009-04-21 CN CN200910106764A patent/CN101539250A/zh active Pending
- 2009-06-30 JP JP2009155040A patent/JP2010258397A/ja active Pending
- 2009-06-30 EP EP09164091A patent/EP2244313A1/en not_active Withdrawn
- 2009-07-14 US US12/502,914 patent/US20100264451A1/en not_active Abandoned
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Also Published As
Publication number | Publication date |
---|---|
JP2010258397A (ja) | 2010-11-11 |
EP2244313A1 (en) | 2010-10-27 |
US20100264451A1 (en) | 2010-10-21 |
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