CN203631595U - 一种绝缘散热式发光二极管 - Google Patents

一种绝缘散热式发光二极管 Download PDF

Info

Publication number
CN203631595U
CN203631595U CN201320755993.4U CN201320755993U CN203631595U CN 203631595 U CN203631595 U CN 203631595U CN 201320755993 U CN201320755993 U CN 201320755993U CN 203631595 U CN203631595 U CN 203631595U
Authority
CN
China
Prior art keywords
substrate
insulating
chip
emitting diode
negative
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320755993.4U
Other languages
English (en)
Inventor
王骞
余清泉
王清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGGUAN GUANGYU INDUSTRIAL CO LTD
Original Assignee
DONGGUAN GUANGYU INDUSTRIAL CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DONGGUAN GUANGYU INDUSTRIAL CO LTD filed Critical DONGGUAN GUANGYU INDUSTRIAL CO LTD
Priority to CN201320755993.4U priority Critical patent/CN203631595U/zh
Application granted granted Critical
Publication of CN203631595U publication Critical patent/CN203631595U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Led Device Packages (AREA)

Abstract

本实用新型公开了一种绝缘散热式发光二极管，包括位于壳体内的基板，基板上表面设有芯片，芯片的正极通过金线与基板上的正引线端连接，芯片的负极通过金线与基板上的负引线端连接，芯片上覆盖有荧光粉和外封胶，外封胶外侧罩有光学透镜，壳体内设有驱动器，驱动器与正、负引线端分别线路连接，驱动器下部连接有正、负引脚，壳体外底面设有绝缘座，正、负引脚从壳体和绝缘座穿出。本实用新型通过基板和壳体的材质使用和形状设计，实现了良好的绝缘散热性能，且体积小，使用方便，节能效果好，是一种可广泛应用的照明光源。

Description

一种绝缘散热式发光二极管
技术领域
本实用新型涉及发光二极管技术领域，尤其是一种绝缘散热式发光二极管。
背景技术
由于LED光源在使用寿命、启动时间、节能环保等方面比传统光源具有明显的优势，LED作为照明光源已获得了普遍认可，但由于散热问题，容易导致光衰，极大的影响了使用寿命，目前，解决散热问题常常采用例如铝型材、用铜材等作为封装的基材以加快散热。但是这些材料要使成品灯具散热件温度不得超过60℃，超过60℃有光衰问题产生，其散热体积要求较大，影响外观和安装使用。
发明内容
针对现有技术的不足，本实用新型提供一种设计合理、使用方便和节能效果好的绝缘散热式发光二极管。
本实用新型的技术方案为：一种绝缘散热式发光二极管，包括位于壳体内的基板，基板上表面设有芯片，芯片的正极通过金线与基板上的正引线端连接，芯片的负极通过金线与基板上的负引线端连接，芯片上覆盖有荧光粉和外封胶，外封胶外侧罩有光学透镜，壳体内设有驱动器，驱动器与正、负引线端分别线路连接，驱动器下部连接有正、负引脚，壳体外底面设有绝缘座，正、负引脚从壳体和绝缘座穿出。
所述基板为陶瓷基板。
所述基板底面设有多个凹坑，凹孔可以为球面、柱状和锥状。
所述壳体为由散热合金制成的壳体。
所述外封胶为环氧树脂或透明硅胶。
本实用新型的有益效果为：1、通过设置绝缘座，提升产品的绝缘性能。2、通过基板采用陶瓷制作且底面设有多个凹坑，以及壳体采用散热合金材质，提升了散热性能，显著降低了光衰。3、通过驱动器能传送高的光通量，节能效果好。
附图说明
图1为本实用新型所述的绝缘散热式发光二极管的结构示意图。
图中，1-壳体，2-绝缘座，3-基板，4-芯片，5-荧光粉，6-外封胶，7-透镜，8-引线，9-驱动器，10-引脚。 
具体实施方式
下面结合附图对本实用新型的具体实施方式作进一步说明：
如图1所示，一种绝缘散热式发光二极管，包括位于壳体（1）内的基板（3），壳体（1）由散热合金制成，基板（3）由陶瓷制成，基板（3）上表面设有芯片（4），基板（3）底面设有多个凹坑，凹孔可以为球面、柱状和锥状，芯片（4）的正极通过金线与基板（3）上的正引线（8）端连接，芯片（4）的负极通过金线与基板（3）上的负引线（8）端连接，芯片（4）上覆盖有荧光粉（5）和外封胶（6），外封胶（6）采用透明硅胶，外封胶（6）外侧罩有光学透镜（7），壳体（1）内设有驱动器（9），驱动器（9）与正、负引线（8）端分别线路连接，驱动器（9）下部连接有正、负引脚（10），壳体（1）外底面设有绝缘座（2），正、负引脚（10）从壳体（1）和绝缘座（2）穿出。本实用新型通过基板（3）和壳体（1）的材质使用和形状设计，实现了良好的绝缘散热性能，且体积小，使用方便，节能效果好，是一种可广泛应用的照明光源。
上述实施例和说明书中描述的只是说明本实用新型的原理和最佳实施例，在不脱离本实用新型精神和范围的前提下，本实用新型还会有各种变化和改进，这些变化和改进都落入要求保护的本实用新型范围内。

Claims (5)

1.一种绝缘散热式发光二极管，包括位于壳体内的基板，其特征在于：基板上表面设有芯片，芯片的正极通过金线与基板上的正引线端连接，芯片的负极通过金线与基板上的负引线端连接，芯片上覆盖有荧光粉和外封胶，外封胶外侧罩有光学透镜，壳体内设有驱动器，驱动器与正、负引线端分别线路连接，驱动器下部连接有正、负引脚，壳体外底面设有绝缘座，正、负引脚从壳体和绝缘座穿出。
2.根据权利要求1所述的绝缘散热式发光二极管，其特征在于：所述基板为陶瓷基板。
3.根据权利要求1或2所述的绝缘散热式发光二极管，其特征在于：所述基板底面设有多个凹坑。
4.根据权利要求1所述的绝缘散热式发光二极管，其特征在于：所述壳体为由散热合金制成的壳体。
5.根据权利要求1所述的绝缘散热式发光二极管，其特征在于：所述外封胶为环氧树脂或透明硅胶。
CN201320755993.4U 2013-11-27 2013-11-27 一种绝缘散热式发光二极管 Expired - Fee Related CN203631595U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320755993.4U CN203631595U (zh) 2013-11-27 2013-11-27 一种绝缘散热式发光二极管

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320755993.4U CN203631595U (zh) 2013-11-27 2013-11-27 一种绝缘散热式发光二极管

Publications (1)

Publication Number Publication Date
CN203631595U true CN203631595U (zh) 2014-06-04

Family

ID=50818044

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320755993.4U Expired - Fee Related CN203631595U (zh) 2013-11-27 2013-11-27 一种绝缘散热式发光二极管

Country Status (1)

Country Link
CN (1) CN203631595U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109727962A (zh) * 2018-12-29 2019-05-07 莆田市城厢区福瑞科技电子有限公司 一种led鞋灯的封装结构及封装方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109727962A (zh) * 2018-12-29 2019-05-07 莆田市城厢区福瑞科技电子有限公司 一种led鞋灯的封装结构及封装方法

Similar Documents

Publication Publication Date Title
CN201866575U (zh) 一种led日光灯
CA2830284C (en) Liquid-cooled led illuminating lamp
CN101853914A (zh) 高功率的led白光光源结构
CN102364710A (zh) Led白光光源装置
CN202361116U (zh) 具有新型散热结构的led灯
CN201590435U (zh) 一种led的封装结构
CN205752232U (zh) 一种cob光模组
CN203571486U (zh) 可变形led全角度发光元件灯泡
CN201282151Y (zh) 一种大功率发光二极管器件
CN103742813B (zh) 一种新型led照明灯
CN203631595U (zh) 一种绝缘散热式发光二极管
CN206349386U (zh) 一种具有稳定性和折射率的led灯珠结构
CN204227147U (zh) 一种大角度照射的led灯
CN202228944U (zh) 一种led球灯泡
CN204611421U (zh) 一种基于ac-smt封装的led灯管
CN203190164U (zh) 一种带导光柱的led灯
CN203312357U (zh) 一种全周角发光的贴片式led光源
CN203225277U (zh) 大功率led封装结构
CN102176505A (zh) 一种集成led光源系统
CN204885214U (zh) Led灯珠结构
CN204577460U (zh) 采用多层氮化铝基板的led封装结构
CN205299134U (zh) Led球泡灯
CN205016556U (zh) 一种具有保护层的全周光led光源
CN201964190U (zh) 一种集成led光源系统
CN203631594U (zh) 一种直插式节能发光二极管

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140604

Termination date: 20181127

CF01 Termination of patent right due to non-payment of annual fee