CN203312357U - 一种全周角发光的贴片式led光源 - Google Patents

一种全周角发光的贴片式led光源 Download PDF

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Publication number
CN203312357U
CN203312357U CN2013202231656U CN201320223165U CN203312357U CN 203312357 U CN203312357 U CN 203312357U CN 2013202231656 U CN2013202231656 U CN 2013202231656U CN 201320223165 U CN201320223165 U CN 201320223165U CN 203312357 U CN203312357 U CN 203312357U
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led light
light source
emitting component
metal base
luminous
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严钱军
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Hangzhou Hangke Optoelectronics Group Co ltd
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HANGZHOU HANGKE PHOTOELECTRIC CO Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Abstract

本实用新型公开的全周角发光的贴片式LED光源,包括由两块相隔的金属底板和固定在金属底板上的透明框架构成的支架和LED发光元件,LED发光元件粘结在支架内,LED发光元件的两个电极分别通过金属线与两块金属底板相连,两块金属底板分别连接引脚,在支架内填充封装树脂。该全周角发光的贴片式LED光源具有结构简单、造价便宜、全角度发光、光效高、可靠性佳等特点。

Description

一种全周角发光的贴片式LED光源
技术领域
本实用新型涉及LED光源,具体来说是一种全周角发光的贴片式LED光源。
背景技术
LED具有节能、环保、寿命长、体积小等优点,是继白炽灯、荧光灯和高强度气体放电灯之后的新一代光源,在照明、亮化、显示、装饰等领域得到广泛应用,成为21世纪最具发展前景的高技术领域之一。随着外延技术和芯片技术的发展,LED芯片的性能得到不断提升,光效高达200lm/w以上的单颗芯片已能量产,开拓了LED在照明领域的应用市场。
现有贴片式LED光源,通常采用PPA、EMC等白色塑料与金属结合而成的支架引框。封装后的LED光源,在通电点亮时,固定于支架内的LED芯片发出的光线在金属层与白色塑料上反射进入封装胶水,由封装胶水层透射进入空气发光。一方面,由于光线通过支架与胶水界面发生反射出光,反射会有能量损失,会影响发光光效。另一方面,该光源其发光角度最多仅能达到120度,应用于灯具时,仅能实现单面发光,限制了其应用范围。另外,PPA、EMC等白色塑料在使用过程中易黄化,最终影响LED光源的出光和可靠性。
发明内容
 本实用新型的目的在于克服以上现有技术存在的不足,提供一种结构简单、光效高、全周角发光的贴片式LED光源。
 为了达到上述目的,采用以下技术方案:
本实用新型的全周角发光的贴片式LED光源包括支架和LED 发光元件,支架由两块相隔的金属底板和固定在金属底板上的透明框架构成,LED 发光元件粘结在支架内,LED 发光元件的两个电极分别通过金属线与两块金属底板相连,两块金属底板分别连接引脚,在支架内填充封装树脂。
本实用新型中,可将LED 发光元件粘结在其中一块金属底板的固晶区域。为了进一步提高出光光效,也可将其中一块金属底板的部分设计为金属网格,LED 发光元件粘结在金属网格的固晶区域;或者粘结在支架的透明框架上。
本实用新型中,所述的透明框架可以是透明塑料、透明陶瓷或玻璃;优选在透明塑料中充有AlN或者Al2O3陶瓷导热颗粒,以增加散热效果。
为了进一步提高出光均匀性,上述的封装树脂可以采用混有荧光粉的环氧树脂、硅树脂或硅橡胶。也可在所述的透明框架内混入荧光粉。所述的荧光粉是铝酸盐、硅酸盐、氮化物、氮氧化物氟锗酸盐中的一种或几种。
上述的LED发光元件可通过硅胶或者树脂粘结在支架内,优选混有荧光粉的硅胶或者树脂。
本实用新型相对于现有技术,具有如下的优点及效果:
 采用透明塑料、玻璃、陶瓷等透明材料与金属底板结合制成的支架,LED发光元件可透过侧面的透明材料发光,甚至底面的金属网格发光,加大了LED发光元件的发光角度,更加适用于LED发光元件的应用。同时,LED发光元件透过侧面和/或底面的透明材料发光,避免了LED发光元件在传统白色塑料界面上的反射,大大提高了光源的发光效率,光效至少提高10%以上。本实用新型的透明贴片式LED光源结构简单,成本低,适于批量生产。
附图说明
图1是全周角发光的贴片式LED光源的构成图;
 图2是图1全周角发光的贴片式LED光源的俯视图;
 图3是另一种全周角发光的贴片式LED光源的俯视图。
具体实施方式
 以下结合附图对本实用新型进行描述。
参照图1,本实用新型的全周角发光的贴片式LED光源包括支架1和LED 发光元件5,支架1由两块相隔的金属底板3和固定在金属底板3上的透明框架2构成, LED 发光元件5粘结在其中一块金属底板3的固晶区域,LED 发光元件5的两个电极分别通过金线、铝线或者铜线等金属线4与两块金属底板3相连,两块金属底板3分别连接引脚7,在支架1内填充封装树脂6。
金属底板可以是银,金,铜等材料,表面镀银层。
图2具体实例,具有两块相隔的金属底板,LED 发光元件5通过硅胶粘结在其中一块金属底板3的固晶区域,在支架1内填充混有荧光粉的封装树脂。该例产品在120mA测试电流下,其性能指标如下:光效160 lm/W,显值Ra>75,色温6500K。
图3所示实例,其中一块金属底板的部分设计为金属网格,LED 发光元件通过混有荧光粉的树脂粘结在金属网格的固晶区域,以提高产品出光效率。该例产品在20mA测试电流下,其性能指标如下:光效170 lm/W,显值Ra>75,色温6500K。
以上列举的仅是本实用新型的具体实施例子。显然,本实用新型不限于以上实施例子,在本实用新型的精神和权利要求的保护范围内,对本实用新型作出的任何修改和改变,均应认为是本实用新型的保护范围。

Claims (5)

1.一种全周角发光的贴片式LED光源,其特征在于包括支架(1)和LED 发光元件(5),支架(1)由两块相隔的金属底板(3)和固定在金属底板(3)上的透明框架(2)构成, LED 发光元件(5)粘结在支架(1)内,LED 发光元件(5)的两个电极分别通过金属线(4)与两块金属底板(3)相连,两块金属底板(3)分别连接引脚(7),在支架(1)内填充封装树脂(6)。
2.根据权利要求1所述的全周角发光的贴片式LED光源,其特征在于LED 发光元件(5)粘结在其中一块金属底板(3)的固晶区域。
3.根据权利要求1所述的全周角发光的贴片式LED光源,其特征在于其中一块金属底板(3)的部分为金属网格,LED 发光元件(5)粘结在金属网格的固晶区域。
4.根据权利要求1所述的全周角发光的贴片式LED光源,其特征在于LED发光元件(5)粘结在透明框架(2)上。
5.根据权利要求1所述的全周角发光的贴片式LED光源,其特征在于所述的透明框架(2)是透明塑料、透明陶瓷或玻璃。
CN2013202231656U 2013-04-27 2013-04-27 一种全周角发光的贴片式led光源 Expired - Lifetime CN203312357U (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103258937A (zh) * 2013-04-27 2013-08-21 杭州杭科光电股份有限公司 一种透明贴片式led光源
CN107086263A (zh) * 2017-04-07 2017-08-22 深圳市华星光电技术有限公司 显示装置及其四面发光led

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103258937A (zh) * 2013-04-27 2013-08-21 杭州杭科光电股份有限公司 一种透明贴片式led光源
CN107086263A (zh) * 2017-04-07 2017-08-22 深圳市华星光电技术有限公司 显示装置及其四面发光led
WO2018184281A1 (zh) * 2017-04-07 2018-10-11 深圳市华星光电技术有限公司 显示装置及其四面发光led
US10319885B2 (en) 2017-04-07 2019-06-11 Shenzhen China Star Optoelectronics Technology Co., Ltd Display device and LED emitting light on four sides thereof

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Address after: Hangzhou City, Zhejiang province 310011 Gongshu District Dengyun Road No. 425 Lilda Building 5 floor

Patentee after: HANGZHOU HANGKE OPTOELECTRONICS GROUP Co.,Ltd.

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