TWI573245B - 發光二極體燈條 - Google Patents

發光二極體燈條 Download PDF

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TWI573245B
TWI573245B TW101149429A TW101149429A TWI573245B TW I573245 B TWI573245 B TW I573245B TW 101149429 A TW101149429 A TW 101149429A TW 101149429 A TW101149429 A TW 101149429A TW I573245 B TWI573245 B TW I573245B
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light
emitting diode
circuit board
package
bar
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TW101149429A
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TW201426966A (zh
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許義忠
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鴻海精密工業股份有限公司
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Priority to TW101149429A priority Critical patent/TWI573245B/zh
Priority to US13/873,144 priority patent/US20140177206A1/en
Publication of TW201426966A publication Critical patent/TW201426966A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Description

發光二極體燈條
本發明涉及一種發光二極體燈條，尤其涉及一種成本較低的發光二極體燈條。
相比於習知的發光源，發光二極體(Light Emitting Diode，LED)具有重量輕、體積小、污染低、壽命長等優點，其作為一種新型的發光源，已經被越來越多地應用到各領域當中。然而，對於液晶電視的背光模組來說，通常需要將發光二極體進行封裝，再配合二次光學透鏡以後再將其裝設到燈條上，如此使得該發光二極體燈條的成本上升，價格較為昂貴。
有鑒於此，本發明旨在提供一種成本較低的發光二極體燈條。
一種發光二極體燈條，包括其內部設有金屬線路的電路板，該發光二極體燈條還包括設置在該電路板上且與該電路板電連接的複數個發光二極體晶片和密封該複數個發光二極體晶片的封裝體，該電路板具有上表面和與該上表面相對的下表面，且該上表面的中部向內凹陷形成一凹槽，該複數個發光二極體晶片設置在該凹槽內。
本發明藉由在該發光二極體燈條上直接使用未經封裝的發光二極體晶片，如此，減小了發光二極體晶片的封裝成本，使得發光二 極體燈條成本較低。
1‧‧‧發光二極體燈條
10‧‧‧電路板
11‧‧‧上表面
12‧‧‧下表面
13‧‧‧凹槽
14‧‧‧底面
15‧‧‧側面
16‧‧‧反光層
20‧‧‧發光二極體晶片
30‧‧‧導線
40‧‧‧封裝體
41‧‧‧頂面
圖1為本發明一較佳實施例提供的發光二極體燈條的立體示意圖。
圖2為圖1中發光二極體燈條移除封裝體的立體示意圖。
圖3為圖1中發光二極體燈條沿III-III線的剖面示意圖。
如圖1和圖2所示，本發明第一實施例提供的發光二極體燈條1，其包括一長條狀的電路板10、設置在電路板10內的複數個發光二極體晶片20和密封該複數個發光二極體晶片20的一封裝體40。
電路板10具有一上表面11和與上表面11相對的一下表面12。電路板10的上表面11的中部向內凹陷形成一長條狀的凹槽13，且凹槽13由一底面14和沿底面14的邊緣向上垂直延伸的側面15所包圍。請同時參閱圖3，底面14和側面15上均設有一反光層16，反光層16使入射至其上的光線被反射向凹槽13的開口。電路板10的內部設有金屬線路。
該複數個發光二極體晶片20設置在電路板10的凹槽13內且位於底面14上，且發光二極體晶片20藉由兩導線30與電路板10內部的金屬線路形成電連接，從而該電路板10為發光二極體晶片20提供電能。於本實施例中，該兩導線30自發光二極體晶片20的相對兩側引出，並自底面14延伸至側面15，並最終從側面15與電路板10內部的金屬線路電連接。
封裝體40罩設且密封該複數個發光二極體晶片20，且封裝體40填 充整個凹槽13，從而可對該複數個發光二極體晶片20進行保護。可以理解地，封裝體40的遠離電路板下表面12的頂面41形狀可為平面狀也可為圓弧狀。本實施例中，封裝體40凸出其電路板10的外部，其頂面41形狀為平面狀，其橫截面大致呈T形。封裝體40是採用點膠工藝完成，先在凹槽13內利用點膠機點上封裝膠，使封裝膠覆蓋複數個個發光二極體晶片20並填滿凹槽13所包圍的整個區域，然後用模具擠壓使封裝體40的上端形成所需要的形狀的頂面41。於本實施例中，可在準備封裝膠時直接在封裝膠內部混合螢光粉，或者在封裝完成後，於封裝體40的頂面41塗覆一層螢光層，以獲得想要的出光顏色。
當發光二極體燈條1發光時，其發出的光線入射至封裝體40的內部之後，一部分光線射向發光二極體晶片20的正上方，另一部分光線射向發光二極體晶片20的側向。射向發光二極體晶片20正上方的光線射出封裝體40時被折射至周圍的空氣中；射向發光二極體晶片20側向的光線穿過封裝體40後入射到側面15及底面14上的反光層16上，在反光層16的反射作用下，該部分光線被反射向發光二極體燈條1上方的封裝體40區域，繼而從發光二極體燈條1上方的封裝體40區域出射，從而避免了發光二極體晶片20發出的部分光線被電路板10的側面15、底面14吸收，在不需額外設置透鏡等二次光學元件的條件下增加了發光二極體燈條1的正上方的發光強度。
本發明藉由在該發光二極體燈條1上直接使用未經封裝的發光二極體晶片20，如此，無需採用二次光學透鏡而減小了發光二極體晶片20的封裝成本，使得發光二極體燈條1的成本較低；另外， 藉由將發光二極體晶片20設置在電路板10的凹槽13內，再用封裝體40對該發光二極體晶片20進行密封，從而使得發光二極體燈條1更為輕薄。
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。
1‧‧‧發光二極體燈條
10‧‧‧電路板
11‧‧‧上表面
12‧‧‧下表面
14‧‧‧底面
15‧‧‧側面
16‧‧‧反光層
20‧‧‧發光二極體晶片
30‧‧‧導線
40‧‧‧封裝體
41‧‧‧頂面

Claims (8)

  1. 一種發光二極體燈條，包括內部設有金屬線路的電路板，其改良在於：該發光二極體燈條還包括設置在該電路板上且與該電路板電連接的複數個發光二極體晶片和密封該複數個發光二極體晶片的封裝體，該電路板具有上表面和與該上表面相對的下表面，且該上表面的中部向內凹陷形成一凹槽，該複數個發光二極體晶片設置在該凹槽內，該凹槽由一底面和沿該底面的邊緣向上延伸的側面圍繞形成，該底面和該側面上均設有一反光層，每一發光二極體晶片與該電路板藉由兩導線電連接，該兩導線貼設所述反光層，且該兩導線自該發光二極體晶片的相對兩側引出，並自該凹槽底面延伸至該側面，最終沿著與該側面垂直的方向貼設並貫穿所述反光層而與所述電路板內部的金屬線路電連接。
  2. 如申請專利範圍第1項所述的發光二極體燈條，其中該複數個發光二極體晶片設置在該底面上。
  3. 如申請專利範圍第1項所述的發光二極體燈條，其中，每一發光二極體晶片藉由兩導線與該電路板內部的金屬線路形成電連接。
  4. 如申請專利範圍第1項所述的發光二極體燈條，其中，該封裝體填充滿整個凹槽。
  5. 如申請專利範圍第4項所述的發光二極體燈條，其中，該封裝體的頂面形狀為平面狀或圓弧狀。
  6. 如申請專利範圍第5項所述的發光二極體燈條，其中，該封裝體的頂面形狀為平面狀，且橫截面呈T形。
  7. 如申請專利範圍第1項所述的發光二極體燈條，其中，該封裝體內設有螢光粉。
  8. 如申請專利範圍第1項所述的發光二極體燈條，其中，該複數個發光二極體晶片藉由一個封裝體密封。
TW101149429A 2012-12-24 2012-12-24 發光二極體燈條 TWI573245B (zh)

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TW101149429A TWI573245B (zh) 2012-12-24 2012-12-24 發光二極體燈條
US13/873,144 US20140177206A1 (en) 2012-12-24 2013-04-29 Light emitting diode light bar for use in a backlight module

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TW201631808A (zh) * 2015-02-25 2016-09-01 隆達電子股份有限公司 發光二極體晶片封裝體
CN105120593A (zh) * 2015-09-07 2015-12-02 杨福德 Led直排电路板
EP3543776A1 (en) * 2018-03-23 2019-09-25 Maven Optronics Co., Ltd. Chip-scale linear light-emitting device
CN109351550B (zh) * 2018-10-16 2021-06-11 Tcl王牌电器(惠州)有限公司 灯条安装设备

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US20090134421A1 (en) * 2004-10-25 2009-05-28 Cree, Inc. Solid metal block semiconductor light emitting device mounting substrates and packages
US20070236934A1 (en) * 2006-03-31 2007-10-11 Hong Kong Applied Science and Technology Research Institute Company Limited Illumination system and display device

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