TWI578573B - A plurality of blue light emitting diodes in white light - Google Patents

A plurality of blue light emitting diodes in white light Download PDF

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TWI578573B
TWI578573B TW102103155A TW102103155A TWI578573B TW I578573 B TWI578573 B TW I578573B TW 102103155 A TW102103155 A TW 102103155A TW 102103155 A TW102103155 A TW 102103155A TW I578573 B TWI578573 B TW I578573B
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light
light emitting
blue light
transparent plate
layer
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TW102103155A
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TW201431126A (zh
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Tsungkan Cheng
Chiachin Chen
Chiapin Chang
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Harvatek Corp
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Priority to TW102103155A priority Critical patent/TWI578573B/zh
Priority to JP2013215921A priority patent/JP2014146784A/ja
Priority to US14/077,197 priority patent/US9224718B2/en
Priority to EP13195262.4A priority patent/EP2760057B1/en
Publication of TW201431126A publication Critical patent/TW201431126A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2109/00—Light sources with light-generating elements disposed on transparent or translucent supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Description

複數個藍光發光二極體的白光封裝
本發明關於一種發光二極體的封裝，尤其是關於一種可正面及背面兩面出光之複數個藍光發光二極體的白光封裝。
發光二極體的封裝，係將發光二極體晶片予以固晶、打線、封膠、以及接腳出來，使其能焊接於印刷電路板。發光二極體的白光封裝，係於藍光發光二極體晶片上覆蓋黃色螢光膠之封裝，而成白光出光者，其應用於各種產品例如燈具、電視機的背光模組等。發光二極體的封裝有單個晶片封裝，或複數個晶片以串連電路或並連電路封裝。
燈具等產品，其利用複數個藍光發光二極體的白光封裝與利用複數個單個晶片的白光封裝的不相同點，在於前者構造較簡單，使用時不須複數個的封裝一再焊接。
前述這些封裝，為了使其出光的效率提高，通常是於封裝的固著晶片的面上做成一光反射面，以將發光二極體晶片的側向光和底向光儘量的反射出去，以增加出光的亮度。
第1圖是繪示習知一種單個發光二極體的白光封裝100，其具有一光反射杯110，光反射杯的內表面111 為白色，發光二極體晶片120固著於一負電極板131，並電性連接該負電極板及一正電極板132，負電極板131和正電極板132的表面設有鍍銀層(未圖示)。該些鍍銀層及光反射杯的白色內表面的設計，係為了使發光二極體晶片120的側向光和底向光能儘量的反射出去，以增加出光的亮度。
第2圖是繪示習知一種複數個發光二極體的白光封裝200，其具有一電路板210，電路板設一接地兼作光反射區211，複數個發光二極體晶片220固著於光反射區211，並覆蓋螢光膠212。這個設計係為了使發光二極體晶片220的側向光和底向光能儘量地反射出去，以增加出光的亮度。
前述習知之發光二極體的封裝，其構造皆是設有一光反射面，所以其僅能達成正面的單面出光而已，無法正面及背面兩面同時出光。
本發明提供一種複數個藍光發光二極體的白光封裝，可以正面及背面兩面同時出光。
根據本發明之一態樣，提供一種複數個藍光發光二極體的白光封裝，包括：一透明板，具有位於相對向的一正面與一背面；複數個藍光發光二極體晶片，固著於透明板的正面；正面螢光膠層，覆蓋於複數個藍光發光二極體晶片；以及背面透明膠層，覆蓋於透明板的背面，並位於與正面螢光膠層上下互相對到的位置，且背面透明膠層的邊緣具有傾斜側面或帶有弧形的傾斜側面。依此，使 得發光二極體具有正、背兩面出光的功效，而且因設有背面透明膠層，更增加了透明板背面出光的效率。
根據本發明之一另一態樣，提供一種複數個藍光發光二極體的白光封裝，包括：一透明板，具有位於相對向的一正面與一背面；複數個藍光發光二極體晶片，固著於透明板的正面；正面螢光膠層，覆蓋於複數個藍光發光二極體晶片；以及背面螢光膠層，覆蓋於透明板的背面，並位於與正面螢光膠層上下互相對到的位置，且背面螢光膠層的邊緣具有傾斜側面或帶有弧形的傾斜側面。依此，使得發光二極體具有正、背兩面出光的功效，而且因設有背面螢光膠層，更增加了透明板背面出光的效率，以及減小正、背兩面之出光的色溫差異。
100‧‧‧習知單個發光二極體的白光封裝
110‧‧‧光反射杯
111‧‧‧內表面
120‧‧‧發光二極體晶片
131‧‧‧負電極板
132‧‧‧正電極板
200‧‧‧習知複數個發光二極體的白光封裝
210‧‧‧電路板
211‧‧‧光反射區
212‧‧‧螢光膠
220‧‧‧發光二極體晶片
300‧‧‧本發明複數個藍光發光二極體的白光封裝
310‧‧‧透明板
311‧‧‧正面
312‧‧‧背面
313‧‧‧端板
320‧‧‧藍光發光二極體晶片
321‧‧‧跳接線材
322‧‧‧晶片底部
330‧‧‧正面螢光膠層
331‧‧‧螢光粉
340‧‧‧背面透明膠層
341‧‧‧傾斜側面
350‧‧‧背面螢光膠層
351‧‧‧傾斜側面
352‧‧‧螢光粉
第1圖是繪示習知一種單個發光二極體的白光封裝的外觀示意圖。
第2圖是繪示習知一種複數個發光二極體的白色封裝的外觀示意圖。
第3圖是繪示依照本發明一第一實施方式一第一實施例之複數個藍光發光二極體的白色封裝的外觀示意圖。
第4圖是繪示依照本發明第一實施方式一第二實施例之複數個藍光發光二極體的白色封裝的外觀示意圖。
第5圖是繪示依照本發明第一實施方式一第三實施例之複數個藍光發光二極體的白色封裝的外觀示意圖。
第6圖是繪示第3圖、第4圖及第5圖所示複數個藍光發光二極體的白色封裝的橫向剖面示意圖。
第7圖是繪示第6圖中之發光二極體的白色封裝未備具背面透明膠層時的剖面示意圖。
第8圖是繪示第6圖所示複數個藍光發光二極體的白色封裝其中藍光發光二極體的外觀示意圖。
第9圖是繪示依照本發明一第二實施方式之複數個藍光發光二極體的白色封裝的橫向剖面示意圖。
有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之實施例詳細說明當中，將可清楚的呈現。
請參閱第3圖至第6圖所示，依照本發明一第一實施方式之複數個藍光發光二極體的白光封裝300包括有一透明板310、複數個藍光發光二極體晶片320、正面螢光膠層330與背面透明膠層340。
透明板310為可以透過光線呈現清澈或略帶霧矇的板材，其材質為例如玻璃、塑膠、樹脂或氧化鋁。透明板310界定有位於相對向的一正面311與一背面312。
複數個藍光發光二極體晶片320固著於透明板310的正面311。該些複數個藍光發光二極體晶片320之電源導通，可用金線或鋁線等跳接線材321跳接各藍光發光二極體晶片320的正、負電極，使其連接成為串連電路、或並連電路、或先串連後再將各串連並連起來的電路、或 先並連後再將各並連串連起來的電路，之後將該電路之最前端與最後端的藍光發光二極體晶片的一正電極和一負電極分別與固著於透明板310上的兩個端板313跳接，端板313即可以連接至電源(未圖示)，以提供該些藍光發光二極體晶片320點亮所需的電源。
正面螢光膠層330覆蓋於複數個藍光發光二極體晶片320。正面螢光膠層330的材質係為掺有黃色螢光粉331的矽膠等。
背面透明膠層340覆蓋於透明板的背面，並位於與正面螢光膠層330上下互相對到的位置。背面透明膠層340的邊緣具有傾斜側面341(見第6圖的剖面示意圖)，其具體為帶有弧形之傾斜側面。背面透明膠層340的材質為矽膠等。背面透明膠層340及其傾斜側面341或帶有弧形之傾斜側面的做成，可以利用矽膠於液態時點著於透明板310的背面，依該矽膠於液態時的附著力加上表面張力，能在該矽膠的邊緣自然形成傾斜側面341或帶有弧形之傾斜側面，其如同用少量的水，滴在玻璃面上所形成的邊緣之帶有弧形之傾斜側面的樣子，然後將該矽膠加溫熟化凝固而成。
正面螢光膠層330和背面透明膠層340皆是以該些膠於液態時分別點著於透明板310的正面311和複數個藍光發光二極體晶片320，以及透明板310的背面312，並予熟化凝固而成。膠的點法不限，其可以如第3圖的第一實施例所示，正面螢光膠層330和背面透明膠層340以 一點一點的點法分別點著於透明板310的正面311和各藍光發光二極體晶片320，以及透明板310的背面312，經熟化凝固後即形成點狀的正面螢光膠層330和點狀的背面透明膠層340；亦可以如第4圖的第二實施例所示，正面螢光膠層330和背面透明膠層340以條狀的點法分別點著於透明板310的正面311和複數個藍光發光二極體晶片320，以及透明板310的背面312，經熟化凝固後即形成條狀的正面螢光膠層330和條狀的背面透明膠層340；亦可以如第5圖的第三實施例所示，正面螢光膠層330和背面透明膠層340以面狀的點法分別點著於透明板310的正面311和複數個藍光發光二極體晶片320，以及透明板310的背面312，經熟化凝固後即形成面狀的正面螢光膠層330和面狀的背面透明膠層340。以上不論何種點法，其背面透明膠層340的邊緣皆會自然具有傾斜側面341或帶有弧形之傾斜側面。
依據本發明第一實施方式之複數個藍光發光二極體的白光封裝，除了依其正面螢光膠層330，使得藍光發光二極體晶片320的正面具有白光出光之外，而且依透明板310及背面透明膠層340以及其傾斜側面341，使得藍光發光二極體晶片320可以背面出光，並且可以增加該背面出光的效率。
因此，依據本發明第一實施方式之複數個藍光發光二極體的白光封裝，其主要技術特點在於「於透明板的背面，在位於與正面螢光膠層上下互相對到的位置，覆蓋有背面透明膠層，且該背面透明膠層的邊緣具有傾斜側 面或帶有弧形的傾斜側面」。
之所以這樣做，是因為若只利用一個透明板310做成兩面出光的話(如第7圖剖面示意圖所示)，其固著於透明板310正面311的藍光發光二極體晶片320所射出的側向光和底向光，在與法線的夾角大於約40度角以上的光束都射不出透明板310的背面312(設使用普通玻璃N=1.51的臨界值計算)，光線只在透明板310的正、背兩面來回反射。再詳言之，如第7圖所示，A、B、A’、B’是藍光發光二極體晶片320的側向光，其對透明板310之出光面的法線夾角大於40度角，光線只在透明板310裡面來回反射，而射不出透明板310的背面312；C、D、C’、D’是藍光發光二極體晶片320的底向光與法線夾角大於40度角的部份，其光線亦只在透明板310裡面來回反射，而射不出透明板310的背面312。所以，若只以透明板310固著藍光發光二極體晶片320，其雖可以達成正、背兩面的出光，但透明板310背面312的出光比率卻是很低，如第7圖所示，其只有底向光對透明板310的出光面之與法線夾角小於40度角的E、F、G、E’、F’、G’和H的部份的光束會由透明板310的背面312射出，而A、B、A’、B’、C、D、C’、D’的光束並不會由透明板310的背面312射出。
請參閱第6圖，而在本發明第一實施方式之複數個藍光發光二極體的白光封裝，由於其「透明板310的背面312，在位於與正面螢光膠層330上下互相對到的位置，覆蓋有背面透明膠層340，且該背面透明膠層的邊緣具 有傾斜側面341或帶有弧形的傾斜側面」，即能引出藍光發光二極體晶片320前述之A、B、A’、B’的側向光以及C、D、C’、D’的底向光，使其由透明板310的背面射出。亦即不會發生藍光發光二極體晶片320發出的光束其與法線的夾角大於40度角的部份射不出透明板310背面312的問題，因此，依據本發明第一實施方式之複數個藍光發光二極體的白光封裝，除了具有正、背兩面出光的功效之外，同時可以增加透明板背面出光的效率。
前述由背面透明膠層340射出的光線，並非只會是藍光發光二極體晶片320的側向光和底向光射出的光束，其在透明板310正面311之正面螢光膠層330被藍光發光二極體晶片320正向光束所激發的黃色螢光，亦同時會透過透明板310由其背面312射出，而與前述之側向光和底向光的藍光混光，仍是得到白光的出光。
如第8圖所示，前述藍光發光二極體晶片320，可以使用晶片底部322無反射鏡面者、或晶片底部322有半反射鏡面者、或晶片底部322有全反射鏡面者。雖然藍光發光二極體晶片320的底部322有反射鏡面者會遮蔽底向光的出射，但如第6圖所示，其側向光的光束A、B、A’、B’仍能在透明膠層340邊緣的傾斜側面341出射，還是產生了增加透明板310背面出光效率的功效。而且，使用晶片底部322有半反射鏡面或全反射鏡面者，還可以減輕背面出光之混色不均的現象。
此外，如用普通玻璃例如鈉鈣玻璃作為透明板 310，其折射率常為1.5~1.7，此時，如背面透明膠層340使用折射率較玻璃為低的材質例如矽膠，其折射率有1.4的。依光學原理，散射光通過多層且逐層降低折射率的介質時，可以減少光的反射量，而增加其出射量。藍光發光二極體晶片320的光為散射，該散射光先通過玻璃製之透明板310其折射率為1.51、再經過矽膠做成之背面透明膠層340其折射率為1.4、再到達空氣其折射率為1，會比該散射光通過玻璃製之透明板310其折射率為1.51再通過某一折射率為大於或等於1.51之背面透明膠之光線的出射量較多，亦可以另外增加出光效率。亦即，選用折射率較透明板310為低的透明膠層340，可以增加藍光發光二極體晶片320背面的出光效率。
第9圖是繪示依照本發明一第二實施方式之複數個藍光發光二極體的白光封裝的剖面示意圖。在前述第一實施方式當中，其由背面透明膠層340射出的藍光發光二極體晶片320的藍光，會與正面螢光膠層330透過透明板310和背面透明膠層340射出的黃色螢光混光成為白色，但因混光的黃光稍微不足，而會使該白光偏藍，亦即色溫較高。而在第二實施方式當中，可以使得正、背兩面出光的色溫更為接近。
依照本發明第二實施方式之複數個藍光發光二極體的白光封裝，包括有一透明板310、複數個藍光發光二極體晶片320、正面螢光膠層330與背面螢光膠層350。其中，透明板310、複數個藍光發光二極體晶片320以及正 面螢光膠層330與前述第一實施方式所述者相同。亦即，透明板310具有位於相對向的一正面311與一背面312；複數個藍光發光二極體晶片320固著於透明板310的正面311；正面螢光膠層330覆蓋於複數個藍光發光二極體晶片320。所不同者係，在第二實施方式當中，係將第一實施方式中之矽膠材質的背面透明膠層進一步加有螢光粉352而成為背面螢光膠層350。該背面螢光膠層350同樣是覆蓋於透明板310的背面312，並位於與正面螢光膠層330上下互相對到的位置，且該背面螢光膠層350的邊緣同樣具有傾斜側面351或帶有弧形的傾斜側面。
依據本發明第二實施方式之複數個藍光發光二極體的白光封裝，除了可以使得藍光發光二極體晶片320具有正面及背面兩面出光的功效之外，而且依據背面螢光膠層350，可以產生更多的黃色螢光而減少藍光，因此能減小發光二極體正面及背面兩面之出光的色溫差異，使得兩面出光的色溫更接近。
300‧‧‧本發明複數個藍光發光二極體的白光封裝
310‧‧‧透明板
311‧‧‧正面
312‧‧‧背面
320‧‧‧藍光發光二極體晶片
330‧‧‧正面螢光膠層
331‧‧‧螢光粉
340‧‧‧背面透明膠層
341‧‧‧傾斜側面

Claims (2)

  1. 一種複數個藍光發光二極體的白光封裝，包括：一透明板，具有位於相對向的一正面與一背面；複數個藍光發光二極體晶片，固著於該透明板的正面；正面螢光膠層，覆蓋於該複數個藍光發光二極體晶片；以及背面透明膠層，覆蓋於該透明板的背面，並位於與正面螢光膠層上下互相對到的位置，其中該正面螢光膠層與該背面透明膠層由該透明板分隔開來，且該正面螢光膠層與該背面透明膠層由點著方式形成而使該正面螢光膠層與該背面透明膠層之邊緣為與該透明板的夾角為銳角的弧形，且該邊緣之高度由中間往兩側逐漸降低。
  2. 一種複數個藍光發光二極體的白光封裝，包括：一透明板，具有位於相對向的一正面與一背面；複數個藍光發光二極體晶片，固著於該透明板的正面；正面螢光膠層，覆蓋於該複數個藍光發光二極體晶片；以及背面螢光膠層，覆蓋於該透明板的背面，並位於與正面螢光膠層上下互相對到的位置，其中該正面螢光膠層與該背面螢光膠層由該透明板分隔開來，且該正面螢光膠層與該背面螢光膠層由點著方式形成而使該正面螢光膠層與該背面螢光膠層之邊緣為與該透明板的夾角為銳角的弧形，且該邊緣之高度由中間往兩側逐漸降低。
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