JP6442199B2 - 発光素子パッケージ - Google Patents
発光素子パッケージ Download PDFInfo
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- JP6442199B2 JP6442199B2 JP2014180001A JP2014180001A JP6442199B2 JP 6442199 B2 JP6442199 B2 JP 6442199B2 JP 2014180001 A JP2014180001 A JP 2014180001A JP 2014180001 A JP2014180001 A JP 2014180001A JP 6442199 B2 JP6442199 B2 JP 6442199B2
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- light emitting
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- 230000005540 biological transmission Effects 0.000 claims description 23
- 230000007423 decrease Effects 0.000 claims description 20
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- 230000008859 change Effects 0.000 claims description 2
- 230000004907 flux Effects 0.000 description 47
- 239000000463 material Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 239000010410 layer Substances 0.000 description 8
- 238000004088 simulation Methods 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 7
- -1 for example Substances 0.000 description 6
- 239000004417 polycarbonate Substances 0.000 description 6
- 229920000515 polycarbonate Polymers 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Planar Illumination Modules (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
Description
12 第2リードフレーム
20 発光素子
30 反射部
35 隔離部
50 光透過部
62,64 ワイヤ
Claims (5)
- 互いに離隔して配置される第1リードフレーム及び第2リードフレームと、
前記第1リードフレーム上に配置される発光素子と、
前記第1リードフレーム及び前記第2リードフレーム上に配置され、上面及び反射側壁を含む反射部と、
前記反射部の上面、前記第1リードフレーム、及び前記第2リードフレーム上に配置される下段部と、前記下段部の外周よりも小さい外周を有し、前記下段部上に配置される上段部とを含む、上面に平坦部を有する光透過部と、を含み、
前記上段部の側面は、前記反射部の側壁の上端と下端との間で、垂直方向に重なり、
前記上段部の側面と前記下段部の上面とが交わる角部は、前記反射部の前記反射側壁の一部と、垂直方向に重なり、
前記下段部の上面は、前記反射部の上面よりも高く位置し、
前記上段部の側面は、水平方向に前記下段部の側面と段差を有し、
前記段差は0.2mm〜0.5mmであり、前記下段部の上面を基準として前記上段部の側面が傾いた角度は15°〜50°であり、
前記反射部の上面から前記上段部の上面までの高さは0.3mm〜1.5mmであり、
前記垂直方向は、前記第1リードフレームから前記光透過部に向かう方向であり、前記水平方向は、前記垂直方向と垂直な方向であり、
前記上段部は、
前記垂直方向に積層される複数の部分を含み、
前記複数の部分は、前記垂直方向に上方に行くほど外周が減少し、
前記複数の部分のうち最も下に位置する部分の側面は、前記反射部の側壁の上端と下端との間に前記垂直方向に重なり、
前記複数の部分のうち隣接する2つの部分の間には、前記水平方向に延びる段差が存在し、
前記複数の部分のうち隣接する2つの部分の間の段差は0.2mm〜0.5mmであり、前記下段部の上面を基準として前記複数の部分のそれぞれの側面が傾いた角度は15°〜50°である、発光素子パッケージ。 - 前記複数の部分のそれぞれの中心は、前記下段部の中心に重なり、
前記複数の部分のそれぞれの側面と上面とが交わる角部は曲面である、請求項1に記載の発光素子パッケージ。 - 前記上段部の形状は、円筒状または六面体であり、
前記上段部の外周は、下から上に行くほど減少し、
前記上段部の側面は、前記下段部の上面の縁から離隔して位置する、請求項1または2に記載の発光素子パッケージ。 - 前記下段部は、
前記反射部の上面と側面、及び前記第1及び第2リードフレームのそれぞれの上面と接する、請求項1ないし3のいずれかに記載の発光素子パッケージ。 - 前記光透過部は、
前記発光素子から放出された光の波長を変化させる蛍光体を含む、請求項1ないし4のいずれかに記載の発光素子パッケージ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2013-0105865 | 2013-09-04 | ||
KR1020130105865A KR102076243B1 (ko) | 2013-09-04 | 2013-09-04 | 발광 소자 패키지 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015050468A JP2015050468A (ja) | 2015-03-16 |
JP2015050468A5 JP2015050468A5 (ja) | 2017-09-28 |
JP6442199B2 true JP6442199B2 (ja) | 2018-12-19 |
Family
ID=51429137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014180001A Active JP6442199B2 (ja) | 2013-09-04 | 2014-09-04 | 発光素子パッケージ |
Country Status (5)
Country | Link |
---|---|
US (1) | US9929329B2 (ja) |
EP (1) | EP2846368B1 (ja) |
JP (1) | JP6442199B2 (ja) |
KR (1) | KR102076243B1 (ja) |
CN (1) | CN104425690B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9437793B2 (en) * | 2014-02-21 | 2016-09-06 | Xiamen Sanan Optoelectronics Technology Co., Ltd. | Package support, fabrication method and LED package |
USD778848S1 (en) * | 2015-04-07 | 2017-02-14 | Cree, Inc. | Solid state light emitter component |
JP6118437B1 (ja) * | 2015-12-21 | 2017-04-19 | ルーメンス カンパニー リミテッド | Ledモジュール |
JP1566953S (ja) * | 2016-04-28 | 2017-01-16 | ||
CN108533981A (zh) * | 2017-03-02 | 2018-09-14 | 展晶科技(深圳)有限公司 | 发光元件 |
US10020426B1 (en) | 2017-04-10 | 2018-07-10 | Advanced Optoelectronic Technology, Inc | Light emitting device |
JP7257247B2 (ja) | 2019-05-16 | 2023-04-13 | スタンレー電気株式会社 | 発光装置 |
JP7300089B2 (ja) * | 2019-10-08 | 2023-06-29 | 日本電気硝子株式会社 | 保護キャップ、発光装置および保護キャップの製造方法 |
US11119862B2 (en) | 2019-10-11 | 2021-09-14 | Seagate Technology Llc | Delta information volumes to enable chained replication of data by uploading snapshots of data to cloud |
CN113302757B (zh) | 2021-03-03 | 2023-12-05 | 泉州三安半导体科技有限公司 | Led封装器件及其制备方法 |
Family Cites Families (20)
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DE2632462A1 (de) * | 1976-07-19 | 1978-01-26 | Siemens Ag | Leuchtdiode |
JP3789747B2 (ja) * | 2000-11-15 | 2006-06-28 | 三洋電機株式会社 | 発光装置の製造方法 |
JP4100155B2 (ja) * | 2002-12-05 | 2008-06-11 | オムロン株式会社 | 発光光源、発光光源アレイ及び当該発光光源を用いた機器 |
JP2005277139A (ja) * | 2004-03-25 | 2005-10-06 | Matsushita Electric Ind Co Ltd | 半導体発光装置 |
JP2006012918A (ja) * | 2004-06-22 | 2006-01-12 | Harison Toshiba Lighting Corp | 発光装置 |
TWI277223B (en) * | 2004-11-03 | 2007-03-21 | Chen-Lun Hsingchen | A low thermal resistance LED package |
JP2007042749A (ja) * | 2005-08-01 | 2007-02-15 | Matsushita Electric Ind Co Ltd | 発光装置とこれを用いた表示装置及び照明装置、並びに発光装置の製造方法 |
KR20070033801A (ko) | 2005-09-22 | 2007-03-27 | 삼성전기주식회사 | 발광 다이오드 패키지 및 그 제조 방법 |
JP4965858B2 (ja) * | 2005-12-26 | 2012-07-04 | 株式会社東芝 | レンズ付発光ダイオード装置 |
KR100819883B1 (ko) | 2006-02-17 | 2008-04-07 | 삼성전자주식회사 | 발광소자 패키지 및 그 제조방법 |
KR100820529B1 (ko) * | 2006-05-11 | 2008-04-08 | 엘지이노텍 주식회사 | 발광 장치 및 그 제조방법, 면 발광 장치 |
JP2010510659A (ja) * | 2006-11-15 | 2010-04-02 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | テクスチャ化された蛍光体変換層を有する発光ダイオード |
DE102009018088A1 (de) * | 2008-04-30 | 2009-12-24 | Ledon Lighting Jennersdorf Gmbh | Modul zur Homogenisierung von Licht, das von einer Festkörper-Lichtquelle (z.B. einer LED) emittiert wird |
JP2010171379A (ja) * | 2008-12-25 | 2010-08-05 | Seiko Instruments Inc | 発光デバイス |
JP2010182809A (ja) * | 2009-02-04 | 2010-08-19 | Stanley Electric Co Ltd | 半導体発光装置 |
JP2011009143A (ja) | 2009-06-29 | 2011-01-13 | Sony Corp | 照明装置およびバックライト |
EP2450613B1 (en) * | 2010-11-08 | 2015-01-28 | LG Innotek Co., Ltd. | Lighting device |
KR20120084526A (ko) | 2011-01-20 | 2012-07-30 | 삼성엘이디 주식회사 | 발광소자 패키지 |
WO2012099145A1 (ja) * | 2011-01-20 | 2012-07-26 | シャープ株式会社 | 発光装置、照明装置、表示装置及び発光装置の製造方法 |
US8513693B2 (en) * | 2011-08-08 | 2013-08-20 | Intellectual Discovery Co., Ltd. | Miniature leadless surface mount lamp with dome and reflector cup |
-
2013
- 2013-09-04 KR KR1020130105865A patent/KR102076243B1/ko active IP Right Grant
-
2014
- 2014-09-01 EP EP14183043.0A patent/EP2846368B1/en active Active
- 2014-09-03 US US14/476,404 patent/US9929329B2/en active Active
- 2014-09-04 CN CN201410448543.XA patent/CN104425690B/zh active Active
- 2014-09-04 JP JP2014180001A patent/JP6442199B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
KR20150027480A (ko) | 2015-03-12 |
CN104425690B (zh) | 2019-03-15 |
JP2015050468A (ja) | 2015-03-16 |
KR102076243B1 (ko) | 2020-02-12 |
EP2846368A1 (en) | 2015-03-11 |
US9929329B2 (en) | 2018-03-27 |
US20150060897A1 (en) | 2015-03-05 |
CN104425690A (zh) | 2015-03-18 |
EP2846368B1 (en) | 2019-04-24 |
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