JP5878305B2 - 発光素子パッケージ及び照明システム - Google Patents
発光素子パッケージ及び照明システム Download PDFInfo
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- JP5878305B2 JP5878305B2 JP2011123125A JP2011123125A JP5878305B2 JP 5878305 B2 JP5878305 B2 JP 5878305B2 JP 2011123125 A JP2011123125 A JP 2011123125A JP 2011123125 A JP2011123125 A JP 2011123125A JP 5878305 B2 JP5878305 B2 JP 5878305B2
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
Claims (15)
- リセスと、
前記リセスの底面に配置された第1及び第2発光素子収容部を含む胴体と、
前記第1発光素子収容部に提供された第1発光素子と、
前記第2発光素子収容部に提供された第2発光素子と、
前記第1発光素子の上に配置された第1個別レンズと、
前記第2発光素子の上に配置された第2個別レンズと、
前記第1個別レンズ及び前記第2個別レンズを覆う共通レンズと、を含み、
前記第2個別レンズの屈折率は、前記第1個別レンズの屈折率より大きく、
前記第2個別レンズを介した光抽出効率が、前記第1個別レンズを介した光抽出効率より大きく、
前記第1発光素子の発光効率は、前記第2発光素子の発光効率より大きく、
前記第1発光素子の発光効率と前記第2発光素子の発光効率との間の差が、前記第1個別レンズを介した光抽出効率と前記第2個別レンズを介した光抽出効率との間の差によって補償され、前記第1個別レンズ及び前記第2個別レンズのそれぞれを介して抽出された光が、前記共通レンズの外部に均一に放出されることを特徴とする発光素子パッケージ。 - 前記第1及び第2個別レンズのうちの少なくとも1つは、上部領域に提供されて、前記リセスの底面に向けて凹んだ形態の凹部を含むことを特徴とする請求項1に記載の発光素子パッケージ。
- 前記凹部の内に提供された反射物質を含むことを特徴とする、請求項2に記載の発光素子パッケージ。
- 前記第1及び第2個別レンズは、前記リセスの側面と離隔することを特徴とする、請求項1乃至3のうち、いずれか1項に記載の発光素子パッケージ。
- 前記共通レンズは、前記リセスの上に位置することを特徴とする、請求項1乃至4のうち、いずれか1項に記載の発光素子パッケージ。
- 前記共通レンズの屈折率より前記第1及び第2個別レンズの屈折率がより大きいことを特徴とする、請求項1乃至5のうち、いずれか1項に記載の発光素子パッケージ。
- 前記リセスに前記共通レンズを固定する段差が形成されることを特徴とする、請求項1乃至6のうち、いずれか1項に記載の発光素子パッケージ。
- 前記リセスの深さより前記第1及び第2発光素子収容部の深さがより深いことを特徴とする、請求項1乃至7のうち、いずれか1項に記載の発光素子パッケージ。
- 前記第1個別レンズと前記第2個別レンズは形状が互いに異なることを特徴とする、請求項1乃至8のうち、いずれか1項に記載の発光素子パッケージ。
- 前記第2個別レンズの屈折率が1.5以上、1.6未満であり、前記第1個別レンズの屈折率が1.4以上、1.5未満であることを特徴とする、請求項1乃至9のうち、いずれか1項に記載の発光素子パッケージ。
- 前記第1収容部及び前記第2収容部のうち、少なくとも1つの内部に蛍光物質が位置することを特徴とする、請求項1乃至10のうち、いずれか1項に記載の発光素子パッケージ。
- 前記第1収容部の内に位置する蛍光物質と前記第2収容部の内に位置する蛍光物質とが互いに異なる種類であることを特徴とする、請求項11に記載の発光素子パッケージ。
- 前記第1及び第2個別レンズの上の前記リセスの内に第2蛍光物質が位置することを特徴とする、請求項11に記載の発光素子パッケージ。
- 前記第1及び第2個別レンズの間に前記第1及び第2個別レンズをガイドするガイド部材をさらに含むことを特徴とする、請求項1乃至13のうち、いずれか1項に記載の発光素子パッケージ。
- 基板と、
前記基板の上に配置される請求項1乃至請求項14のうちのいずれか1項による発光素子パッケージを含む発光モジュールと、を含むことを特徴とする、照明システム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100051998A KR101064036B1 (ko) | 2010-06-01 | 2010-06-01 | 발광 소자 패키지 및 조명 시스템 |
KR10-2010-0051998 | 2010-06-01 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011254079A JP2011254079A (ja) | 2011-12-15 |
JP2011254079A5 JP2011254079A5 (ja) | 2014-07-10 |
JP5878305B2 true JP5878305B2 (ja) | 2016-03-08 |
Family
ID=44118011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011123125A Active JP5878305B2 (ja) | 2010-06-01 | 2011-06-01 | 発光素子パッケージ及び照明システム |
Country Status (6)
Country | Link |
---|---|
US (1) | US8434910B2 (ja) |
EP (1) | EP2400568B1 (ja) |
JP (1) | JP5878305B2 (ja) |
KR (1) | KR101064036B1 (ja) |
CN (1) | CN102270629B (ja) |
TW (1) | TWI521738B (ja) |
Families Citing this family (76)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9793247B2 (en) | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
US9335006B2 (en) | 2006-04-18 | 2016-05-10 | Cree, Inc. | Saturated yellow phosphor converted LED and blue converted red LED |
US10295147B2 (en) | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
US9425172B2 (en) | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
US20130070168A1 (en) * | 2010-05-26 | 2013-03-21 | Sharp Kabushiki Kaisha | Led light source, led backlight, liquid crystal display device and tv reception device |
WO2012053571A1 (en) * | 2010-10-22 | 2012-04-26 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting element, light-emitting device, and lighting device |
TWI414714B (zh) | 2011-04-15 | 2013-11-11 | Lextar Electronics Corp | 發光二極體杯燈 |
CN102588762A (zh) * | 2011-01-06 | 2012-07-18 | 隆达电子股份有限公司 | 发光二极管杯灯 |
US9786811B2 (en) | 2011-02-04 | 2017-10-10 | Cree, Inc. | Tilted emission LED array |
JP5373859B2 (ja) * | 2011-07-05 | 2013-12-18 | デクセリアルズ株式会社 | 照明装置 |
US10842016B2 (en) * | 2011-07-06 | 2020-11-17 | Cree, Inc. | Compact optically efficient solid state light source with integrated thermal management |
JP5552573B2 (ja) * | 2011-07-12 | 2014-07-16 | パナソニック株式会社 | 光学素子及びそれを用いた半導体発光装置 |
KR101326518B1 (ko) | 2011-09-02 | 2013-11-07 | 엘지이노텍 주식회사 | 조명 장치 |
JP5742629B2 (ja) * | 2011-09-26 | 2015-07-01 | 東芝ライテック株式会社 | 発光装置及びこれを備えた照明器具 |
KR102017538B1 (ko) | 2012-01-31 | 2019-10-21 | 엘지이노텍 주식회사 | 조명 장치 |
CN102543987A (zh) * | 2012-02-07 | 2012-07-04 | 达亮电子(苏州)有限公司 | 固态发光组件 |
EP2645434A1 (en) * | 2012-03-30 | 2013-10-02 | Lumenmax Optoelectronics Co., Ltd. | Led-packaging arrangement with uniform light and wide angle |
CN102620215B (zh) * | 2012-04-11 | 2014-08-13 | 深圳市华星光电技术有限公司 | Led背光光源 |
US8680755B2 (en) | 2012-05-07 | 2014-03-25 | Lg Innotek Co., Ltd. | Lighting device having reflectors for indirect light emission |
KR20150022918A (ko) | 2012-06-01 | 2015-03-04 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 원격 인광체 led와 직접 방출 led의 조합을 사용한 하이브리드 전구 |
KR101961310B1 (ko) * | 2012-07-09 | 2019-07-17 | 엘지이노텍 주식회사 | 발광 장치 |
KR20140096722A (ko) * | 2013-01-29 | 2014-08-06 | 엘지이노텍 주식회사 | 램프 유닛 |
US8916896B2 (en) * | 2013-02-22 | 2014-12-23 | Cree, Inc. | Light emitter components and methods having improved performance |
TWI559053B (zh) * | 2013-05-28 | 2016-11-21 | 潘宇翔 | 適用於直下式背光模組之光源裝置及其顯示器 |
TWI523277B (zh) * | 2013-07-12 | 2016-02-21 | White light emitting diode module with ultraviolet light | |
TWI582344B (zh) * | 2013-08-05 | 2017-05-11 | 鴻海精密工業股份有限公司 | 透鏡及使用該透鏡的光源裝置 |
CN104344344A (zh) * | 2013-08-06 | 2015-02-11 | 鸿富锦精密工业(深圳)有限公司 | 透镜及使用该透镜的光源装置 |
KR20150025231A (ko) * | 2013-08-28 | 2015-03-10 | 서울반도체 주식회사 | 광원 모듈 및 그 제조 방법, 및 백라이트 유닛 |
KR102024297B1 (ko) * | 2013-10-07 | 2019-09-23 | 엘지이노텍 주식회사 | 렌즈모듈 및 이를 포함하는 발광소자패키지 |
KR102140028B1 (ko) * | 2013-10-22 | 2020-08-03 | 삼성디스플레이 주식회사 | 표시 장치의 광원용 렌즈 및 이를 포함하는 표시 장치의 광원 |
CN104566211A (zh) * | 2013-10-28 | 2015-04-29 | 鸿富锦精密工业(深圳)有限公司 | 复合透镜及使用该复合透镜的光源装置 |
US20150270900A1 (en) * | 2014-03-19 | 2015-09-24 | Apple Inc. | Optical data transfer utilizing lens isolation |
JP6515716B2 (ja) | 2014-07-18 | 2019-05-22 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
KR20160054666A (ko) * | 2014-11-06 | 2016-05-17 | 삼성전자주식회사 | 광원 모듈 및 조명 장치 |
WO2016123341A1 (en) * | 2015-01-29 | 2016-08-04 | Venntis Technologies, Llc | Omni-directional light emitting device |
CN110260182B (zh) * | 2015-07-23 | 2022-12-02 | 晶元光电股份有限公司 | 发光装置 |
KR20170058489A (ko) * | 2015-11-18 | 2017-05-29 | 주식회사 세미콘라이트 | 반도체 발광소자용 프레임 |
KR20170064664A (ko) * | 2015-12-02 | 2017-06-12 | 엘지이노텍 주식회사 | 조명장치 및 이를 포함하는 차량용 램프 |
WO2017099351A1 (ko) * | 2015-12-09 | 2017-06-15 | (주)파트론 | 광학 센서 패키지 |
KR101971669B1 (ko) * | 2015-12-09 | 2019-04-23 | (주)파트론 | 광학 센서 패키지 |
US10189401B2 (en) * | 2016-02-09 | 2019-01-29 | Ford Global Technologies, Llc | Vehicle light strip with optical element |
DE102016103136A1 (de) * | 2016-02-23 | 2017-08-24 | Vishay Semiconductor Gmbh | Optoelektronische Vorrichtung |
CN105702670A (zh) * | 2016-04-06 | 2016-06-22 | 深圳市九洲光电科技有限公司 | 一种透镜式smd封装器件 |
KR102531109B1 (ko) * | 2016-05-17 | 2023-05-10 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자 및 이를 구비한 조명 모듈 |
DE102017101267B4 (de) | 2017-01-24 | 2023-11-02 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
NL2018334B1 (nl) * | 2017-02-06 | 2018-09-03 | Jozef Horvath Gusztav | Uv-afdeklaaguithardinrichting |
JP6659612B2 (ja) * | 2017-03-31 | 2020-03-04 | Hoya Candeo Optronics株式会社 | 発光装置、光照射モジュール、及び光照射装置 |
DE102017109079B4 (de) * | 2017-04-27 | 2024-02-22 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und Bauteil mit solch einem Bauelement |
JP6947966B2 (ja) * | 2017-05-24 | 2021-10-13 | 日亜化学工業株式会社 | 発光装置 |
CN110800117A (zh) * | 2017-07-03 | 2020-02-14 | 夏普株式会社 | 光源装置及发光装置 |
EP3653923B1 (en) * | 2017-07-13 | 2022-03-30 | Sony Group Corporation | Light emitting device, display device, and illuminating device |
US11257990B2 (en) * | 2017-09-29 | 2022-02-22 | Nichia Corporation | Light emitting device |
CN108019675B (zh) * | 2017-11-28 | 2020-10-13 | 扬州点滴照明有限公司 | 医用手术灯 |
CN108019669B (zh) * | 2017-11-28 | 2020-10-30 | 西安科锐盛创新科技有限公司 | 智能led地面灯 |
CN107990254B (zh) * | 2017-11-28 | 2020-10-27 | 吉安品位环保科技有限公司 | 节能大功率led工矿灯 |
CN108006564B (zh) * | 2017-11-28 | 2020-05-19 | 扬州市中美新能源照明有限公司 | Led路灯 |
CN108006525B (zh) * | 2017-11-28 | 2020-06-02 | 广州柏曼光电科技有限公司 | 智能led吸顶灯 |
CN108036243B (zh) * | 2017-11-28 | 2020-10-02 | 扬州威核光电有限公司 | Led地面灯 |
CN108006565B (zh) * | 2017-11-28 | 2020-05-15 | 江苏赛鸥电气集团有限公司 | 智能led路灯 |
CN108006540B (zh) * | 2017-11-28 | 2020-04-28 | 江苏辰彩光电科技有限公司 | 智能led路灯 |
CN107830452B (zh) * | 2017-11-28 | 2020-08-07 | 广东华之创科技照明有限公司 | 一种大功率led洗墙灯 |
CN108006524B (zh) * | 2017-11-28 | 2020-08-07 | 江门市江海区格派光电有限公司 | 智能led吸顶灯 |
CN108006489B (zh) * | 2017-11-28 | 2020-06-23 | 中山市逸光照明科技有限公司 | 投光灯 |
CN107940273B (zh) * | 2017-11-28 | 2021-01-05 | 嘉兴明禾智能家居用品有限公司 | 手提灯 |
CN108006563B (zh) * | 2017-11-28 | 2020-05-15 | 深圳市金鼎胜照明有限公司 | Led草坪灯 |
CN108006491B (zh) * | 2017-11-28 | 2020-10-30 | 吉安建伟纸塑制品包装有限公司 | Led隧道灯 |
WO2019132386A1 (ko) * | 2017-12-26 | 2019-07-04 | 엘지이노텍 주식회사 | 발광소자 패키지 및 광원 장치 |
KR102487795B1 (ko) | 2018-04-24 | 2023-01-11 | 엘지디스플레이 주식회사 | 광원 패키지를 포함하는 백라이트 유닛 및 이를 이용한 표시 장치 |
JP2020021823A (ja) * | 2018-07-31 | 2020-02-06 | 日亜化学工業株式会社 | 発光装置 |
JP7178820B2 (ja) * | 2018-08-09 | 2022-11-28 | シチズン時計株式会社 | Led発光装置 |
CN111341765A (zh) * | 2018-12-18 | 2020-06-26 | 深圳Tcl新技术有限公司 | 一种背光模组 |
CN111081849A (zh) * | 2020-01-03 | 2020-04-28 | 广东省半导体产业技术研究院 | 一种led封装结构与封装方法 |
KR102338177B1 (ko) * | 2020-02-24 | 2021-12-10 | 주식회사 에스엘바이오닉스 | 반도체 발광소자 |
KR102457808B1 (ko) * | 2020-08-26 | 2022-10-24 | 주식회사 예지아테크코리아 | 광학 렌즈, 발광 모듈 및 이를 구비한 라이트 유닛 |
JP2022137900A (ja) * | 2021-03-09 | 2022-09-22 | パナソニックIpマネジメント株式会社 | 照明装置 |
Family Cites Families (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10021114B4 (de) * | 2000-05-02 | 2009-04-30 | Robert Bosch Gmbh | Beleuchtungsvorrichtung |
US6773139B2 (en) * | 2001-09-17 | 2004-08-10 | Gelcore Llp | Variable optics spot module |
US6679621B2 (en) * | 2002-06-24 | 2004-01-20 | Lumileds Lighting U.S., Llc | Side emitting LED and lens |
JP4002207B2 (ja) * | 2003-04-21 | 2007-10-31 | 株式会社小糸製作所 | 車両用前照灯 |
JP4360945B2 (ja) * | 2004-03-10 | 2009-11-11 | シチズン電子株式会社 | 照明装置 |
DE102004043516A1 (de) * | 2004-09-08 | 2006-03-23 | Osram Opto Semiconductors Gmbh | Seitlich emittierendes strahlungserzeugendes Bauelement und Linse für ein solches Bauelement |
KR100606795B1 (ko) | 2004-10-08 | 2006-08-02 | 엘지전자 주식회사 | 다중 싸이클론 집진장치 |
KR101214934B1 (ko) * | 2005-01-27 | 2012-12-24 | 삼성디스플레이 주식회사 | 광학 렌즈, 이를 갖는 광학 모듈, 이를 갖는 백라이트어셈블리 및 이를 갖는 표시장치 |
JP2006114854A (ja) * | 2004-10-18 | 2006-04-27 | Sharp Corp | 半導体発光装置、液晶表示装置用のバックライト装置 |
JP4823505B2 (ja) | 2004-10-20 | 2011-11-24 | シャープ株式会社 | 半導体装置及び電子機器 |
US8816369B2 (en) * | 2004-10-29 | 2014-08-26 | Led Engin, Inc. | LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices |
KR100644052B1 (ko) | 2004-11-08 | 2006-11-10 | 엘지전자 주식회사 | 고 광적출 효율 발광 다이오드 및 그의 제조 방법 |
CN101111793A (zh) * | 2004-12-03 | 2008-01-23 | 索尼株式会社 | 光拾取透镜,发光元件,面光源装置和彩色液晶显示单元 |
JP2007102139A (ja) * | 2004-12-03 | 2007-04-19 | Sony Corp | 光取出しレンズ、発光素子組立体、面状光源装置、及び、カラー液晶表示装置組立体 |
WO2006059728A1 (ja) * | 2004-12-03 | 2006-06-08 | Sony Corporation | 光取出しレンズ、発光素子組立体、面状光源装置、及び、カラー液晶表示装置組立体 |
KR100593933B1 (ko) * | 2005-03-18 | 2006-06-30 | 삼성전기주식회사 | 산란 영역을 갖는 측면 방출형 발광다이오드 패키지 및이를 포함하는 백라이트 장치 |
KR20060104432A (ko) | 2005-03-30 | 2006-10-09 | 알티전자 주식회사 | 고휘도 박형 플래시 장치 |
ATE498358T1 (de) | 2005-06-29 | 2011-03-15 | Compumedics Ltd | Sensoranordnung mit leitfähiger brücke |
WO2007056354A2 (en) * | 2005-11-04 | 2007-05-18 | The Regents Of The University Of California | High light extraction efficiency light emitting diode (led) |
US20070102718A1 (en) | 2005-11-07 | 2007-05-10 | Akira Takekuma | Lens in light emitting device |
JP2007214522A (ja) * | 2006-02-10 | 2007-08-23 | Intekkusu Kk | 光源装置及びこれを用いた照明装置 |
JP4739064B2 (ja) * | 2006-02-27 | 2011-08-03 | ミネベア株式会社 | スピーカ |
KR20090005194A (ko) | 2006-04-18 | 2009-01-12 | 라미나 라이팅, 인크. | 피제어 색 혼합용 광 디바이스 |
TW200801513A (en) | 2006-06-29 | 2008-01-01 | Fermiscan Australia Pty Ltd | Improved process |
CN101485004B (zh) | 2006-07-06 | 2012-05-02 | 皇家飞利浦电子股份有限公司 | 照明器件封装 |
JP5431636B2 (ja) * | 2006-07-14 | 2014-03-05 | 株式会社小糸製作所 | 車両用標識灯 |
TW200810145A (en) * | 2006-08-04 | 2008-02-16 | Chiang Cheng Ting | A lighting structure with light emitting diodes and the method thereof |
KR100877219B1 (ko) | 2006-09-08 | 2009-01-07 | (주) 아모엘이디 | 렌즈 형성방법 및 렌즈를 갖춘 전자부품 패키지 제조방법 |
US7897980B2 (en) * | 2006-11-09 | 2011-03-01 | Cree, Inc. | Expandable LED array interconnect |
US10295147B2 (en) * | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
US9061450B2 (en) * | 2007-02-12 | 2015-06-23 | Cree, Inc. | Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding |
EP2191517B1 (en) * | 2007-08-31 | 2017-11-29 | LG Innotek Co., Ltd. | Light emitting device package |
KR101393948B1 (ko) | 2007-09-10 | 2014-05-12 | 엘지이노텍 주식회사 | 발광 다이오드 패키지 및 그 제조방법 |
US20090086484A1 (en) * | 2007-09-28 | 2009-04-02 | Johnson Stephen G | Small form factor downlight system |
CN101532644A (zh) * | 2008-03-14 | 2009-09-16 | 鸿富锦精密工业(深圳)有限公司 | 灯具 |
KR100944085B1 (ko) | 2008-06-23 | 2010-02-24 | 서울반도체 주식회사 | 발광 장치 |
KR101485322B1 (ko) | 2008-06-27 | 2015-01-22 | 서울반도체 주식회사 | 발광소자 |
JP4883648B2 (ja) * | 2008-10-07 | 2012-02-22 | Idec株式会社 | Led照明装置およびその配光特性変更方法 |
US8075165B2 (en) * | 2008-10-14 | 2011-12-13 | Ledengin, Inc. | Total internal reflection lens and mechanical retention and locating device |
CN101769451B (zh) * | 2008-12-29 | 2012-03-14 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
TWI442100B (zh) * | 2009-09-18 | 2014-06-21 | 敦網光電股份有限公司 | 發光裝置及光擴散板 |
KR101039994B1 (ko) * | 2010-05-24 | 2011-06-09 | 엘지이노텍 주식회사 | 발광소자 및 이를 구비한 라이트 유닛 |
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