JP5681407B2 - 発光モジュール - Google Patents
発光モジュール Download PDFInfo
- Publication number
- JP5681407B2 JP5681407B2 JP2010167480A JP2010167480A JP5681407B2 JP 5681407 B2 JP5681407 B2 JP 5681407B2 JP 2010167480 A JP2010167480 A JP 2010167480A JP 2010167480 A JP2010167480 A JP 2010167480A JP 5681407 B2 JP5681407 B2 JP 5681407B2
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- light emitting
- semiconductor light
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- conductive layer
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- 239000000758 substrate Substances 0.000 claims description 102
- 239000004065 semiconductor Substances 0.000 claims description 94
- 238000007789 sealing Methods 0.000 claims description 15
- 239000010949 copper Substances 0.000 description 20
- 238000007747 plating Methods 0.000 description 20
- 239000000463 material Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 12
- 238000009826 distribution Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000002131 composite material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910001374 Invar Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Description
図1は、第1の実施形態に係る発光モジュール10の構成を示す図である。図1は、鉛直面による発光モジュール10の断面を側方から見たときを示している。発光モジュール10は、発光ユニット12、支持部材14、およびベースハウジング16を備える。
図3(a)は、第2の実施形態に係る発光ユニット50の上面図であり、図3(b)は、第2の実施形態に係る発光ユニット50の正面図である。第2の実施形態に係る発光モジュールの構成は、発光ユニット12に代えて発光ユニット50が設けられ、さらに半導体発光素子20の各々に個別に給電が可能となるよう設けられている以外は、第1の実施形態と同様である。以下、第1の実施形態と同様の個所は同一の符号を付して説明を省略する。
図4は、第3の実施形態に係る発光モジュール80の構成を示す図である。以下、上述の実施形態と同様の個所については同一の符号を付して説明を省略する。
図5は、第4の実施形態に係る発光モジュール100の構成を示す図である。以下、上述の実施形態と同様の個所については同一の符号を付して説明を省略する。
Claims (5)
- 半導体発光素子が実装される実装基板と、
前記実装基板に実装された半導体発光素子に導通するよう前記実装基板の表面上に設けられた導電層と、
前記導電層と離間して配置される導電性部材と、
前記導電層と前記導電性部材とを互いに導通させるよう前記導電層と前記導電性部材との双方に接続される導電性ワイヤと、
を備え、
前記導電層は、前記実装基板の表面のうち半導体発光素子が実装される第1面よりも下方の第2面において前記半導体発光素子への給電を可能とするよう、第1面から第2面に延在する給電部を含み、
前記導電性ワイヤは、前記実装基板の第2面上の給電部と前記導電性部材とを接続し、
前記第2面は、前記導電性部材と略同一の高さである、
ことを特徴とする発光モジュール。 - 前記実装基板は、第1面に複数の半導体発光素子が実装可能に設けられ、
前記導電層は、第1面に実装された複数の半導体発光素子を互いに直列に接続させるよう第1面上に設けられた素子接続部をさらに含むことを特徴とする請求項1に記載の発光モジュール。 - 前記実装基板は、第1面に複数の半導体発光素子が実装可能に設けられ、
前記導電層は、前記実装基板に実装された複数の半導体発光素子の各々への個別の給電を第2面において可能とするよう、第1面から第2面にそれぞれ延在する複数の給電部を含むことを特徴とする請求項1に記載の発光モジュール。 - 前記導電性ワイヤの少なくとも一部を外気から封止する封止部材をさらに備え、
前記封止部材は、前記半導体発光素子の発光面よりも下方に位置するよう配置されることを特徴とする請求項1から3のいずれかに記載の発光モジュール。 - 前記実装基板の第1面の背向面に当接する当接面を有する放熱部材をさらに備え、
前記放熱部材は、前記当接面の背向面が前記当接面よりも面積が大きくなるよう形成されていることを特徴とする請求項1から4のいずれかに記載の発光モジュール。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010167480A JP5681407B2 (ja) | 2010-07-26 | 2010-07-26 | 発光モジュール |
PCT/JP2011/003543 WO2012014372A1 (ja) | 2010-07-26 | 2011-06-21 | 発光モジュール |
US13/715,498 US8803168B2 (en) | 2010-07-26 | 2012-12-14 | Light emitting module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010167480A JP5681407B2 (ja) | 2010-07-26 | 2010-07-26 | 発光モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012028648A JP2012028648A (ja) | 2012-02-09 |
JP5681407B2 true JP5681407B2 (ja) | 2015-03-11 |
Family
ID=45529611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010167480A Active JP5681407B2 (ja) | 2010-07-26 | 2010-07-26 | 発光モジュール |
Country Status (3)
Country | Link |
---|---|
US (1) | US8803168B2 (ja) |
JP (1) | JP5681407B2 (ja) |
WO (1) | WO2012014372A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7092496B2 (ja) * | 2017-12-22 | 2022-06-28 | 晶呈科技股▲分▼有限公司 | 垂直型発光ダイオードダイの構造およびその製造方法 |
CN110546751A (zh) * | 2018-06-11 | 2019-12-06 | 厦门三安光电有限公司 | 发光组件 |
EP3745090B1 (de) | 2019-05-27 | 2021-07-14 | Dr. Johannes Heidenhain GmbH | Lichtquelle sowie verfahren zu deren herstellung und positionsmesseinrichtung mit einer lichtquelle |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4432275B2 (ja) * | 2000-07-13 | 2010-03-17 | パナソニック電工株式会社 | 光源装置 |
CN1212676C (zh) | 2001-04-12 | 2005-07-27 | 松下电工株式会社 | 使用led的光源装置及其制造方法 |
JP2003008072A (ja) * | 2001-06-25 | 2003-01-10 | Citizen Electronics Co Ltd | 発光ダイオード |
JP4123105B2 (ja) * | 2003-05-26 | 2008-07-23 | 松下電工株式会社 | 発光装置 |
JP4288481B2 (ja) * | 2003-10-02 | 2009-07-01 | シチズン電子株式会社 | 発光ダイオード |
EP2280430B1 (en) * | 2005-03-11 | 2020-01-01 | Seoul Semiconductor Co., Ltd. | LED package having an array of light emitting cells coupled in series |
JP4733434B2 (ja) * | 2005-06-03 | 2011-07-27 | シチズン電子株式会社 | チップ型led |
JP4836230B2 (ja) * | 2005-06-17 | 2011-12-14 | 株式会社小糸製作所 | 発光デバイス及びこれを用いた光源装置 |
JP2007087668A (ja) | 2005-09-20 | 2007-04-05 | Matsushita Electric Works Ltd | 照明器具 |
KR101495071B1 (ko) * | 2008-06-24 | 2015-02-25 | 삼성전자 주식회사 | 서브 마운트 및 이를 이용한 발광 장치, 상기 서브마운트의 제조 방법 및 이를 이용한 발광 장치의 제조 방법 |
JP5126127B2 (ja) * | 2009-03-17 | 2013-01-23 | 豊田合成株式会社 | 発光装置の製造方法 |
-
2010
- 2010-07-26 JP JP2010167480A patent/JP5681407B2/ja active Active
-
2011
- 2011-06-21 WO PCT/JP2011/003543 patent/WO2012014372A1/ja active Application Filing
-
2012
- 2012-12-14 US US13/715,498 patent/US8803168B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8803168B2 (en) | 2014-08-12 |
JP2012028648A (ja) | 2012-02-09 |
US20130099261A1 (en) | 2013-04-25 |
WO2012014372A1 (ja) | 2012-02-02 |
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