CN102403418A - 一种大功率led的散热结构的制作方法 - Google Patents

一种大功率led的散热结构的制作方法 Download PDF

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CN102403418A
CN102403418A CN2011103514395A CN201110351439A CN102403418A CN 102403418 A CN102403418 A CN 102403418A CN 2011103514395 A CN2011103514395 A CN 2011103514395A CN 201110351439 A CN201110351439 A CN 201110351439A CN 102403418 A CN102403418 A CN 102403418A
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heating column
pcb board
heat conduction
radiator structure
power led
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毕晓峰
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Dongguan Kingsun Optoelectronic Co Ltd
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Priority to CN2011103514395A priority Critical patent/CN102403418A/zh
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Priority to US13/990,421 priority patent/US9153760B2/en
Priority to MYPI2013001839A priority patent/MY170785A/en
Priority to BR112013015297A priority patent/BR112013015297A2/pt
Priority to EP12844655.6A priority patent/EP2626919A4/en
Priority to KR1020137013862A priority patent/KR101524388B1/ko
Priority to CA2818085A priority patent/CA2818085C/en
Priority to PCT/CN2012/080761 priority patent/WO2013067840A1/zh
Priority to AU2012333908A priority patent/AU2012333908C1/en
Priority to JP2013552828A priority patent/JP5725522B2/ja
Priority to CL2013002183A priority patent/CL2013002183A1/es
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Abstract

本发明涉及散热装置技术领域，特别涉及一种大功率LED的散热结构的制作方法，包括如下步骤，(1)准备PCB板，一侧设有导热柱的导热板件，散热板件；(2)在PCB板上设贯通两侧的定位孔，在PCB板一侧面上设铜板层，在PCB板另一侧面设电极焊脚，在铜板层表面涂焊锡膏；(3)将导热柱从PCB板设有铜板层的一侧设入定位孔内，并通过回流焊焊接铜板层与导热板件；(4)将步骤(3)所得的导热板件和PCB板的整体件置于冲压设备上，调整导热柱的高度；(5)将散热板件内侧面固定贴设于导热板件的另一侧面上。本发明制作方法工艺简单，所得散热结构具有结构简单，导热散热效果好等优点。

Description

一种大功率LED的散热结构的制作方法
技术领域
本发明涉及散热装置技术领域，特别涉及一种大功率LED的散热结构的制作方法。
背景技术
LED以其理论寿命长、能耗低以及绿色环保等特点而被广泛应用于指示、室内外照明等各个领域。众所周知，影响LED使用寿命的最关键的因素就是LED的散热问题，大功率LED尤其如此。现有大功率LED的散热结构的制作方法是主要将热沉，铝基板、导热硅脂、散热板件等部分依次连接构成，LED经热沉与铝基板连接，这种制作方法虽然工艺简单，但其所制得的散热结构却存在导热散热性能差等缺陷和不足，从而极大的影响了LED的应用领域和应用范围，其导热散热性能差的主要原因在于铝基板的结构设置。铝基板一般由保护油层、铜箔层，绝缘层以及铝板层依次叠加而成，其中，绝缘层虽然在绝缘方面起到良好且有效的积极作用，却同时也生产了隔热的负面效果，LED所产生的热量无法及时迅速导出，从而极大地影响了LED的使用寿命。故有必要对现有制作方法进行革新，实现散热结构差异化，有效地解决LED的散热问题。
发明内容
本发明的目的在于针对现有技术的缺陷和不足，提供一种工艺简单，生产效率高的大功率LED的散热结构的制作方法，其所得的散热结构具有结构简单紧凑、散热效果好等优点。
为实现上述目的，本发明采用以下技术方案：
本发明所述的一种大功率LED的散热结构的制作方法，其包括如下步骤：
(1)准备PCB板，一侧设有导热柱的导热板件以及散热板件；
(2)在所述PCB板上设贯通两侧的定位孔，在PCB板一侧面上焊设铜板层，在PCB板另一侧面焊设电极焊脚，然后在铜板层表面涂焊锡膏；
(3)将导热柱从PCB板设有铜板层的一侧设入定位孔内，并通过回流焊焊接铜板层与导热板件，将导热板件和PCB板固定连接为一整体件；所述导热柱的高度大于铜板层，PCB板以及电极焊脚三者的厚度之和；
(4)将步骤(3)所得的导热板件和PCB板的整体件置于冲压设备上，冲压设备对导热柱上端面进行冲压，以调整导热柱的高度，使导热柱的上端面与电极焊脚的上表面处于同一平面内；
(5)将散热板件内侧面固定贴设于导热板件的另一侧面上。
其中，步骤(5)中所述散热板件外侧面上设有若干散热片。
其中，步骤(1)中所述导热柱与导热板件为一体成型设置。当然，步骤(1)中所述导热柱与导热板件也可以为分体焊接固定设置。
其中，步骤(1)中所述导热柱与定位孔螺纹连接。
其中，步骤(1)中所述导热板件由紫铜材料制作。
其中，步骤(1)中所述散热板件由铝或铜材料制作。
其中，步骤(1)中所述导热柱由紫铜材料制作。
采用上述制作方法后，本发明有益效果为：因本发明制作方法将电极焊脚的上表面和导热柱的上端面调整为同一平面内，将LED基座底面贴设于电极焊脚和导热柱上时，在不影响LED基座底面与电极焊脚电连接的情况下，LED基座底面与导热柱的上端面可以实现充分接触焊接连接，有效增加LED基座底面导热部分与导热柱的上端面的接触面积，这样设置，本发明制作方法所得的散热结构可以将LED所产生热量经导热柱和导热板件迅速导出，其导热散热功能大大增强。
附图说明
图1是本发明制得的散热结构整体剖视结构示意图；
图2是本发明制得的散热结构分解结构示意图。
图中：
1、LED；     2、基座；    3、电极焊脚；4、PCB板；
5、铜板层；  6、导热板件；7、定位孔；  8、导热柱；
9、散热板件；10、散热片。
具体实施方式
如图1，图2所示为本发明所制得的散热结构的整体以及分解结构示意图，下面结合附图对本发明具体步骤作进一步的说明和描述。
本发明所述的一种大功率LED的散热结构的制作方法，其包括如下步骤：
(1)准备PCB板4，一侧设有导热柱8的导热板件6以及散热板件9等部件或材料；其中，所述导热板件6由紫铜以及铝等材料制作，所述导热柱8由紫铜材料制作，所述散热板件9由铝或铜材料制作。紫铜以及铝等材料均具体良好的导热散热功能，本发明所述导热板件6以及散热板件9采用紫铜以及铝材料制作，有利于实现本发明之目的。当然，上述结构主体亦可采用其它具有良好导热散热性能的金属材料制作。所述导热柱8与导热板件6可以为一体成型设置，也可以为分体焊接固定设置。
(2)在所述PCB板4上设贯通两侧的定位孔7，在PCB板4一侧面上焊设铜板层5，在铜板层5表面涂焊锡膏，用于焊接固定导热板件6；在PCB板4另一侧面焊设电极焊脚3，用于连接LED 1的基座2面底上的电极部分。
(3)将导热柱8从PCB板4设有铜板层5的一侧设入定位孔7内，并通过回流焊焊接铜板层5与导热板件6，将导热板件6和PCB板4固定连接为一整体件。所述导热柱8的形状大小与定位孔7的形状大小相匹配，具体而言，导热柱8的横截面可以呈圆形、椭圆形、三角形或正六边形设置，当导热柱8的横截面呈圆形设置时，所述定位孔7内壁上设有内螺纹，所述导热柱8的侧壁上设有外螺纹，所述导热柱8与定位孔7螺纹连接。导热柱8与定位孔7的螺纹连接，可以使本发明的结构紧密度，间接提高导热散热功能。另外，所述导热柱8的高度大于铜板层5，PCB板4以及电极焊脚3三者的厚度之和。
(4)将步骤(3)所得的导热板件6和PCB板4的整体件置于冲压设备上，冲压设备对导热柱8上端面进行冲压，以调整导热柱8的高度，使导热柱8的上端面与电极焊脚3的上表面处于同一平面内。本步骤为本发明制作方法的关键步骤，如上所述，所述导热柱8的高度大于铜板层5，PCB板4以及电极焊脚3三者的厚度之和，通过冲压设备冲压导热柱8，对导热柱8的高度以及上端面进行冲压调整，直至所述导热柱8的高度等于铜板层5，PCB板4以及电极焊脚3三者的厚度之和。经过冲压后，导热柱8横截面变大，与定位孔7形成过盈配合，从而与基座2底面导热部分接触面增大，便于导热；同时，导热柱8的上端面与电极焊脚3的上表面处于同一平面，这样，基座2底面可同时与导热柱8的上端面以及电极焊脚3的上表面进行充分帖合，既基座2底面的电极部分与电极焊脚3进行充分接触焊接，又能实现基座2底面导热部分与导热柱8的上端面的充分接触焊接，尽可能增大基座2底面导热部分与导热柱8的上端面的接触面积，以确保LED 1所产生热量可以及时迅速的经由导热柱8，导热板件6传导至散热板件9，并经散热板件9散出。
(5)将散热板件9内侧面固定贴设于导热板件6的另一侧面上，散热板件9以便于将导热板件6的热量及时散出。所述散热板件9外侧面上设有若干散热片10，以增加散热板件9的散热面积，进一步增强散热板件9的散热效果。
本发明制作方法所得的散热结构可以将LED所产生热量迅速导出，其导热散热效果较现有技术而言大大增强。
表一，现有散热结构(旧)与本发明所制得散热结构(新)的温度数据测试表
Figure BSA00000608648500051
从上表可看出，对分别采用新散热结构和旧散热结构的大功率LED，均通以相同电流，且新散热结构环境温度较高的情况下，新散热结构导热柱温度明显低于旧散热结构热沉温度，而新散热结构的导热板件以及散热板件的温度却明显高于旧散热结构的铝基板和散热板件的温度，这充分说明了本发明制作方法所得新散热结构的散热效果比旧散热结构的散热结构的效果更好。
以上所述仅是本发明的较佳实施方式，故凡依本发明专利申请范围所述的构造、特征及原理所做的等效变化或修饰，均包括于本发明专利申请范围内。

Claims (8)

1.一种大功率LED的散热结构的制作方法，其特征在于，其包括如下步骤：
(1)准备PCB板(4)，一侧设有导热柱(8)的导热板件(6)以及散热板件(9)；
(2)在所述PCB板(4)上设贯通两侧的定位孔(7)，在PCB板(4)一侧面上焊设铜板层(5)，在PCB板(4)另一侧面焊设电极焊脚(3)，然后在铜板层(5)表面涂焊锡膏；
(3)将导热柱(8)从PCB板(4)设有铜板层(5)的一侧设入定位孔(7)内，并通过回流焊焊接铜板层(5)与导热板件(6)，将导热板件(6)和PCB板(4)固定连接为一整体件；所述导热柱(8)的高度大于铜板层(5)，PCB板(4)以及电极焊脚(3)三者的厚度之和；
(4)将步骤(3)所得的导热板件(6)和PCB板(4)的整体件置于冲压设备上，冲压设备对导热柱(8)上端面进行冲压，以调整导热柱(8)的高度，使导热柱(8)的上端面与电极焊脚(3)的上表面处于同一平面内；
(5)将散热板件(9)内侧面固定贴设于导热板件(6)的另一侧面上。
2.根据权利要求1所述的大功率LED的散热结构的制作方法，其特征在于：步骤(5)中所述散热板件(9)外侧面上设有若干散热片(10)。
3.根据权利要求1所述的大功率LED的散热结构的制作方法，其特征在于：步骤(1)中所述导热柱(8)与导热板件(6)为一体成型设置。
4.根据权利要求1所述的大功率LED的散热结构的制作方法，其特征在于：步骤(1)中所述导热柱(8)与导热板件(6)为分体焊接固定设置。
5.根据权利要求1所述的大功率LED的散热结构的制作方法，其特征在于：步骤(1)中所述导热柱(8)与定位孔(7)螺纹连接。
6.根据权利要求1所述的大功率LED的散热结构的制作方法，其特征在于：步骤(1)中所述导热板件(6)由紫铜材料制作。
7.根据权利要求1所述的大功率LED的散热结构的制作方法，其特征在于：步骤(1)中所述散热板件(9)由铝或铜材料制作。
8.根据权利要求1所述的大功率LED的散热结构的制作方法，其特征在于：步骤(1)中所述导热柱(8)由紫铜材料制作。
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EP12844655.6A EP2626919A4 (en) 2011-11-09 2012-08-30 METHOD FOR PRODUCING A COOLING BODY STRUCTURE FOR HIGH-PERFORMANCE LED
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013067840A1 (zh) * 2011-11-09 2013-05-16 东莞勤上光电股份有限公司 一种大功率led的散热结构的制作方法
CN104866047A (zh) * 2015-05-29 2015-08-26 广东欧珀移动通信有限公司 一种cpu散热结构和终端
CN105319821A (zh) * 2014-07-16 2016-02-10 日立乐金光科技株式会社 光模块及投影型图像显示装置
CN111836461A (zh) * 2020-07-21 2020-10-27 方炜 一种散热型线路板及其制备方法
CN110888506B (zh) * 2019-11-29 2021-06-25 深圳市核芯智联科技开发有限公司 多媒体双核工控主板
CN113141755A (zh) * 2021-03-15 2021-07-20 电子科技大学 一种星载射频功率e类放大器散热装置的制备方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101412743B1 (ko) * 2013-09-10 2014-08-06 유트로닉스주식회사 칩led 모듈
KR101402177B1 (ko) * 2013-11-18 2014-06-27 김인호 평면 냉각핀식 엘이디 배열 기판
KR101462170B1 (ko) * 2014-01-13 2014-11-14 정지상 Led 모듈 및 이를 포함하는 조명장치
KR101462183B1 (ko) * 2014-01-13 2014-11-20 정지상 Ｌｅｄ 조명장치
KR101464176B1 (ko) * 2014-01-13 2014-11-20 정지상 Led 모듈 및 이를 포함하는 조명장치
US10299403B2 (en) * 2015-09-23 2019-05-21 Advanced Micro Devices, Inc. Modular thermal solution for high-performance processors
US10504813B2 (en) * 2016-09-30 2019-12-10 Astec International Limited Heat sink assemblies for surface mounted devices
DE102018101264A1 (de) * 2018-01-22 2019-07-25 HELLA GmbH & Co. KGaA Leiterplatten- Kühlkörper- Aufbau und Verfahren hierzu
US11089671B2 (en) * 2019-11-26 2021-08-10 Eridan Communications, Inc. Integrated circuit / printed circuit board assembly and method of manufacture
CN114126329A (zh) * 2020-08-31 2022-03-01 华为技术有限公司 一种散热组件及汽车
CN112752432B (zh) * 2020-11-20 2022-12-23 成都泰格微电子研究所有限责任公司 一种高效率高可靠性的印制电路板与垫片一体化装配工艺
CN113784590B (zh) * 2021-09-06 2022-08-02 无锡华测电子系统有限公司 瓦片式tr组件装置、外部散热结构
CN117320264B (zh) * 2023-11-29 2024-02-27 广州贵宇光电材料科技有限公司 一种金属基板热电分离结构及其制造工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060131602A1 (en) * 2004-12-21 2006-06-22 Ouderkirk Andrew J Illumination assembly and method of making same
CN201576701U (zh) * 2009-12-25 2010-09-08 上海必威电机电器有限公司 Led灯芯片金属散热装置
CN102064265A (zh) * 2009-11-11 2011-05-18 钰桥半导体股份有限公司 具有凸柱/基座的散热座及基板的半导体晶片组体
US20110248616A1 (en) * 2010-04-12 2011-10-13 Foxsemicon Integrated Technology, Inc. Light emitting diode and light source module incorporating the same

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5012386A (en) * 1989-10-27 1991-04-30 Motorola, Inc. High performance overmolded electronic package
US5172301A (en) * 1991-10-08 1992-12-15 Lsi Logic Corporation Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same
US5991156A (en) * 1993-12-20 1999-11-23 Stmicroelectronics, Inc. Ball grid array integrated circuit package with high thermal conductivity
JPH0917918A (ja) * 1995-06-27 1997-01-17 Murata Mfg Co Ltd 混成集積回路
JPH10172632A (ja) * 1996-12-04 1998-06-26 Kel Corp 電気コネクタ
EP0926729A3 (en) * 1997-12-10 1999-12-08 Mitsubishi Gas Chemical Company, Inc. Semiconductor plastic package and process for the production thereof
US6507049B1 (en) * 2000-09-01 2003-01-14 General Electric Company Encapsulants for solid state devices
US6987613B2 (en) * 2001-03-30 2006-01-17 Lumileds Lighting U.S., Llc Forming an optical element on the surface of a light emitting device for improved light extraction
US6874910B2 (en) * 2001-04-12 2005-04-05 Matsushita Electric Works, Ltd. Light source device using LED, and method of producing same
JP3563055B2 (ja) * 2001-10-11 2004-09-08 株式会社イデア・デザインテック セルフタッピンを用いた緩み止め締付け用のおねじ部品とめねじ部品の組合せ
US20030076034A1 (en) * 2001-10-22 2003-04-24 Marshall Thomas M. Led chip package with four led chips and intergrated optics for collimating and mixing the light
JP4211359B2 (ja) * 2002-03-06 2009-01-21 日亜化学工業株式会社 半導体装置の製造方法
US20030230977A1 (en) * 2002-06-12 2003-12-18 Epstein Howard C. Semiconductor light emitting device with fluoropolymer lens
JP2004232656A (ja) * 2003-01-28 2004-08-19 Hirosugi Keiki:Kk スペーサ
US7777235B2 (en) * 2003-05-05 2010-08-17 Lighting Science Group Corporation Light emitting diodes with improved light collimation
US7633093B2 (en) * 2003-05-05 2009-12-15 Lighting Science Group Corporation Method of making optical light engines with elevated LEDs and resulting product
US7495322B2 (en) * 2003-05-26 2009-02-24 Panasonic Electric Works Co., Ltd. Light-emitting device
US20040264195A1 (en) * 2003-06-25 2004-12-30 Chia-Fu Chang Led light source having a heat sink
JP2005051233A (ja) * 2003-07-15 2005-02-24 Matsushita Electric Ind Co Ltd 半導体発光装置およびその製造方法
JP2005136224A (ja) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd 発光ダイオード照明モジュール
TWI303110B (en) * 2003-11-25 2008-11-11 Matsushita Electric Works Ltd Light-emitting device using light-emitting diode chip
WO2006043234A1 (en) * 2004-10-22 2006-04-27 Koninklijke Philips Electronics N.V. Semiconductor light-emitting device with improved heatsinking
US20060097385A1 (en) * 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
ITRM20040633A1 (it) * 2004-12-23 2005-03-23 St Microelectronics Srl Trasmettitore ottico multi-sorgente e dispositivo di visualizzazione fotonico.
DE102005014605A1 (de) * 2005-03-31 2006-10-05 Conti Temic Microelectronic Gmbh Leiterplattenanordnung
JP4655735B2 (ja) * 2005-04-20 2011-03-23 パナソニック電工株式会社 Ｌｅｄユニット
WO2007002644A2 (en) * 2005-06-27 2007-01-04 Lamina Lighting, Inc. Light emitting diode package and method for making same
KR100592508B1 (ko) * 2005-07-15 2006-06-26 한국광기술원 비콘 모양의 기판을 구비한 고출력 발광 다이오드 패키지
US8044412B2 (en) * 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
KR20080007961A (ko) * 2006-07-19 2008-01-23 알티전자 주식회사 엘이디 모듈의 냉각 장치 및 그 제조 방법
CN100580525C (zh) * 2006-09-12 2010-01-13 启萌科技有限公司 发光单元及发光二极管模组
JP4846498B2 (ja) * 2006-09-22 2011-12-28 株式会社東芝 光半導体装置及び光半導体装置の製造方法
US7566154B2 (en) * 2006-09-25 2009-07-28 B/E Aerospace, Inc. Aircraft LED dome light having rotatably releasable housing mounted within mounting flange
TWI325186B (en) * 2007-01-19 2010-05-21 Harvatek Corp Led chip package structure using ceramic material as a substrate
JP4893378B2 (ja) * 2007-03-07 2012-03-07 ソニー株式会社 発光装置、表示装置および表示装置の製造方法
JP4903179B2 (ja) * 2007-04-23 2012-03-28 サムソン エルイーディー カンパニーリミテッド． 発光装置及びその製造方法
TW200845877A (en) * 2007-05-07 2008-11-16 Tysun Inc Heat-dissipating substrates of composite structure
TWM328763U (en) * 2007-05-21 2008-03-11 Univ Nat Taiwan Structure of heat dissipation substrate
JP4677549B2 (ja) * 2007-08-30 2011-04-27 順徳工業股▲ふん▼有限公司 リードフレーム・ストリップの製造方法
US7651254B2 (en) * 2007-12-03 2010-01-26 Industrial Technology Research Institute Microchip matrix light source module
KR20100094246A (ko) * 2009-02-18 2010-08-26 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
KR101060432B1 (ko) * 2009-04-13 2011-08-29 주식회사 인성전자 엘이디 패키지와 그 엘이디 방열 장치 및 이를 이용한 엘이디 소켓
CN201623176U (zh) * 2009-11-06 2010-11-03 湖北小天地科技有限公司 一种大功率led结构
TW201123410A (en) * 2009-12-25 2011-07-01 Bright Led Electronics Corp LED light-emitting module and its manufacturing method thereof.
WO2011092934A1 (ja) * 2010-02-01 2011-08-04 旭硝子株式会社 発光素子搭載用支持体及び発光装置
JP5546889B2 (ja) * 2010-02-09 2014-07-09 日本電産エレシス株式会社 電子部品ユニット及びその製造方法
WO2011137355A1 (en) * 2010-04-30 2011-11-03 Uniflux Led, Inc. A cooling structure for led lamps
CN201904999U (zh) * 2010-11-24 2011-07-20 董林洲 电路板散热改良结构
CN102683544B (zh) * 2011-03-17 2015-07-08 展晶科技(深圳)有限公司 贴片式发光二极管
CN102820384B (zh) * 2011-06-08 2015-10-07 展晶科技(深圳)有限公司 发光二极管封装结构的制造方法
CN102403418A (zh) * 2011-11-09 2012-04-04 东莞勤上光电股份有限公司 一种大功率led的散热结构的制作方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060131602A1 (en) * 2004-12-21 2006-06-22 Ouderkirk Andrew J Illumination assembly and method of making same
CN102064265A (zh) * 2009-11-11 2011-05-18 钰桥半导体股份有限公司 具有凸柱/基座的散热座及基板的半导体晶片组体
CN201576701U (zh) * 2009-12-25 2010-09-08 上海必威电机电器有限公司 Led灯芯片金属散热装置
US20110248616A1 (en) * 2010-04-12 2011-10-13 Foxsemicon Integrated Technology, Inc. Light emitting diode and light source module incorporating the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013067840A1 (zh) * 2011-11-09 2013-05-16 东莞勤上光电股份有限公司 一种大功率led的散热结构的制作方法
CN105319821A (zh) * 2014-07-16 2016-02-10 日立乐金光科技株式会社 光模块及投影型图像显示装置
CN105319821B (zh) * 2014-07-16 2017-05-24 日立乐金光科技株式会社 光模块及投影型图像显示装置
CN104866047A (zh) * 2015-05-29 2015-08-26 广东欧珀移动通信有限公司 一种cpu散热结构和终端
CN110888506B (zh) * 2019-11-29 2021-06-25 深圳市核芯智联科技开发有限公司 多媒体双核工控主板
CN111836461A (zh) * 2020-07-21 2020-10-27 方炜 一种散热型线路板及其制备方法
CN113141755A (zh) * 2021-03-15 2021-07-20 电子科技大学 一种星载射频功率e类放大器散热装置的制备方法

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