JP5725522B2 - ハイパワーledの放熱構造の製造方法 - Google Patents
ハイパワーledの放熱構造の製造方法 Download PDFInfo
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- JP5725522B2 JP5725522B2 JP2013552828A JP2013552828A JP5725522B2 JP 5725522 B2 JP5725522 B2 JP 5725522B2 JP 2013552828 A JP2013552828 A JP 2013552828A JP 2013552828 A JP2013552828 A JP 2013552828A JP 5725522 B2 JP5725522 B2 JP 5725522B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 28
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
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- 238000000034 method Methods 0.000 description 2
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- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
本発明に係るハイパワーLEDの放熱構造の製造方法は、
PCBプレートと、一方の側に熱伝導柱が設けられた熱伝導プレートと、放熱プレートとを用意するステップ(1)と、
前記PCBプレートに両側を貫通する位置決め孔を設け、PCBプレートの一方の側面に銅プレート層を溶接し、PCBプレートの他方の側面に電極隅肉を溶接し、銅プレート層の表面にはんだペーストを塗布するステップ(2)と、
熱伝導柱をPCBプレートの銅プレート層が設けられた側から位置決め孔の内に設置し、且つリフローはんだ付けによって、銅プレート層と熱伝導プレートを溶接し、熱伝導プレートとPCBプレートを一体部材として固定接合し、前記熱伝導柱の高さを銅プレート層とPCBプレートと電極隅肉という三者の厚さの和よりも大きくするステップ(3)と、
ステップ(3)で得られた熱伝導プレートとPCBプレートの一体部材をスタンピング設備に置き、スタンピング設備が熱伝導柱の上端面に対してスタンピングを行うことで、熱伝導柱の上端面と電極隅肉の上表面を同一の平面内に位置させるように熱伝導柱の高さを調整するステップ(4)と、
放熱プレートの内側面を熱伝導プレートの他方の側面に固定密着するステップ(5)と、を含む。
Claims (8)
- ハイパワーLEDの放熱構造の製造方法であって、
PCBプレート(4)と、一方の側に熱伝導柱(8)が設けられた熱伝導プレート(6)と、放熱プレート(9)とを用意するステップ(1)と、
前記PCBプレート(4)に両側を貫通する位置決め孔(7)を設け、PCBプレート(4)の一方の側面に銅プレート層(5)を溶接し、PCBプレート(4)の他方の側面に電極隅肉(3)を溶接し、銅プレート層(5)の表面にはんだペーストを塗布するステップ(2)と、
熱伝導柱(8)をPCBプレート(4)の銅プレート層(5)が設けられた側から位置決め孔(7)の内に設置し、且つリフローはんだ付けによって、銅プレート層(5)と熱伝導プレート(6)を溶接し、熱伝導プレート(6)とPCBプレート(4)を一体部材として固定接合し、前記熱伝導柱(8)の高さを銅プレート層(5)とPCBプレート(4)と電極隅肉(3)という三者の厚さの和よりも大きくするステップ(3)と、
ステップ(3)で得られた熱伝導プレート(6)とPCBプレート(4)の一体部材をスタンピング設備に置き、スタンピング設備が熱伝導柱(8)の上端面に対してスタンピングを行うことで、熱伝導柱(8)の上端面と電極隅肉(3)の上表面を同一の平面内に位置させるように熱伝導柱(8)の高さを調整するステップ(4)と、
放熱プレート(9)の内側面を熱伝導プレート(6)の他方の側面に固定密着するステップ(5)と
を含むことを特徴とするハイパワーLEDの放熱構造の製造方法。 - ステップ(5)において、前記放熱プレート(9)の外側面に複数のフイン(10)が設けられていることを特徴とする請求項1に記載のハイパワーLEDの放熱構造の製造方法。
- ステップ(1)において、前記熱伝導柱(8)と熱伝導プレート(6)が一体成形で設置されていることを特徴とする請求項1に記載のハイパワーLEDの放熱構造の製造方法。
- ステップ(1)において、前記熱伝導柱(8)と熱伝導プレート(6)が溶接して固定設置されていることを特徴とする請求項1に記載のハイパワーLEDの放熱構造の製造方法。
- ステップ(1)において、前記熱伝導柱(8)と位置決め孔(7)がネジ接続されていることを特徴とする請求項1に記載のハイパワーLEDの放熱構造の製造方法。
- ステップ(1)において、前記熱伝導プレート(6)が純銅材料で製造されることを特徴とする請求項1に記載のハイパワーLEDの放熱構造の製造方法。
- ステップ(1)において、前記放熱プレート(9)がアルミニウム又は銅材料で製造されることを特徴とする請求項1に記載のハイパワーLEDの放熱構造の製造方法。
- ステップ(1)において、前記熱伝導柱(8)が純銅材料で製造されることを特徴とする請求項1に記載のハイパワーLEDの放熱構造の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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CN201110351439.5 | 2011-11-09 | ||
CN2011103514395A CN102403418A (zh) | 2011-11-09 | 2011-11-09 | 一种大功率led的散热结构的制作方法 |
PCT/CN2012/080761 WO2013067840A1 (zh) | 2011-11-09 | 2012-08-30 | 一种大功率led的散热结构的制作方法 |
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JP2014505373A JP2014505373A (ja) | 2014-02-27 |
JP5725522B2 true JP5725522B2 (ja) | 2015-05-27 |
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US (1) | US9153760B2 (ja) |
EP (1) | EP2626919A4 (ja) |
JP (1) | JP5725522B2 (ja) |
KR (1) | KR101524388B1 (ja) |
CN (1) | CN102403418A (ja) |
AU (1) | AU2012333908C1 (ja) |
BR (1) | BR112013015297A2 (ja) |
CA (1) | CA2818085C (ja) |
CL (1) | CL2013002183A1 (ja) |
MY (1) | MY170785A (ja) |
WO (1) | WO2013067840A1 (ja) |
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2011
- 2011-11-09 CN CN2011103514395A patent/CN102403418A/zh active Pending
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- 2012-08-30 AU AU2012333908A patent/AU2012333908C1/en not_active Ceased
- 2012-08-30 EP EP12844655.6A patent/EP2626919A4/en not_active Withdrawn
- 2012-08-30 JP JP2013552828A patent/JP5725522B2/ja not_active Expired - Fee Related
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- 2012-08-30 CA CA2818085A patent/CA2818085C/en not_active Expired - Fee Related
- 2012-08-30 KR KR1020137013862A patent/KR101524388B1/ko not_active IP Right Cessation
- 2012-08-30 WO PCT/CN2012/080761 patent/WO2013067840A1/zh active Application Filing
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Publication number | Publication date |
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AU2012333908C1 (en) | 2015-08-27 |
AU2012333908A1 (en) | 2013-05-16 |
BR112013015297A2 (pt) | 2016-09-20 |
US20130298396A1 (en) | 2013-11-14 |
CA2818085A1 (en) | 2013-05-16 |
KR20130079618A (ko) | 2013-07-10 |
AU2012333908B2 (en) | 2015-04-02 |
US9153760B2 (en) | 2015-10-06 |
CA2818085C (en) | 2016-03-22 |
WO2013067840A1 (zh) | 2013-05-16 |
CL2013002183A1 (es) | 2014-06-27 |
WO2013067840A9 (zh) | 2013-07-04 |
EP2626919A1 (en) | 2013-08-14 |
KR101524388B1 (ko) | 2015-05-29 |
MY170785A (en) | 2019-08-28 |
CN102403418A (zh) | 2012-04-04 |
JP2014505373A (ja) | 2014-02-27 |
EP2626919A4 (en) | 2016-03-16 |
AU2012333908A8 (en) | 2013-08-01 |
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