WO2013067840A9 - 一种大功率led的散热结构的制作方法 - Google Patents

一种大功率led的散热结构的制作方法 Download PDF

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WO2013067840A9
WO2013067840A9 PCT/CN2012/080761 CN2012080761W WO2013067840A9 WO 2013067840 A9 WO2013067840 A9 WO 2013067840A9 CN 2012080761 W CN2012080761 W CN 2012080761W WO 2013067840 A9 WO2013067840 A9 WO 2013067840A9
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Prior art keywords
heat
heat conducting
plate member
heat dissipation
power led
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PCT/CN2012/080761
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English (en)
French (fr)
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WO2013067840A1 (zh
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毕晓峰
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东莞勤上光电股份有限公司
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Priority to JP2013552828A priority Critical patent/JP5725522B2/ja
Priority to BR112013015297A priority patent/BR112013015297A2/pt
Priority to EP12844655.6A priority patent/EP2626919A4/en
Priority to AU2012333908A priority patent/AU2012333908C1/en
Priority to CA2818085A priority patent/CA2818085C/en
Priority to KR1020137013862A priority patent/KR101524388B1/ko
Priority to MX2013007638A priority patent/MX2013007638A/es
Priority to US13/990,421 priority patent/US9153760B2/en
Publication of WO2013067840A1 publication Critical patent/WO2013067840A1/zh
Publication of WO2013067840A9 publication Critical patent/WO2013067840A9/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Definitions

  • the invention relates to the technical field of heat dissipating devices, and in particular to a method for manufacturing a heat dissipating structure of a high power LED.
  • LEDs are widely used in various fields such as indication, indoor and outdoor lighting, etc. due to their long theoretical life, low energy consumption and environmental protection.
  • the most critical factor affecting the service life of LEDs is the heat dissipation problem of LEDs, especially for high-power LEDs.
  • the heat dissipation structure of the existing high-power LED is mainly composed of a heat sink, an aluminum substrate, a thermal grease, a heat dissipation plate member and the like, and the LED is connected to the aluminum substrate via a heat sink.
  • the manufacturing method is simple, However, the heat dissipation structure produced by the heat dissipation structure has defects and shortcomings such as poor heat conduction and heat dissipation performance, which greatly affects the application field and application range of the LED.
  • the main reason for the poor heat conduction and heat dissipation performance is the structural arrangement of the aluminum substrate.
  • the aluminum substrate is generally formed by superimposing a protective oil layer, a copper foil layer, an insulating layer and an aluminum plate layer.
  • the insulating layer plays a good and effective positive role in insulation, it also produces a negative effect of heat insulation.
  • the heat generated cannot be quickly and quickly exported, which greatly affects the service life of the LED. Therefore, it is necessary to innovate the existing manufacturing methods, realize the difference in the heat dissipation structure, and effectively solve the heat dissipation problem of the LED.
  • the object of the present invention is to provide a method for manufacturing a heat dissipation structure of a high-power LED with simple process and high production efficiency in view of the defects and deficiencies of the prior art, and the obtained heat dissipation structure has the advantages of simple and compact structure, good heat dissipation effect and the like.
  • the present invention adopts the following technical solutions:
  • the method for manufacturing a heat dissipation structure of a high-power LED according to the present invention comprises the following steps:
  • the heat conducting column is disposed from the side of the PCB board with the copper plate layer into the positioning hole, and the copper plate layer and the heat conducting plate member are reflowed by reflow soldering, and the heat conducting plate member and the PCB board are fixedly connected as a unitary piece;
  • the height is greater than the sum of the thickness of the copper plate layer, the PCB board and the electrode pads;
  • a plurality of fins are disposed on the outer side surface of the heat dissipation plate member.
  • the heat conducting column and the heat conducting plate member in the step (1) are integrally formed.
  • the heat conducting column and the heat conducting plate member in the step (1) may also be fixedly arranged for the split welding.
  • the heat conducting column in the step (1) is screwed to the positioning hole.
  • the heat conducting plate member in the step (1) is made of a copper material.
  • the heat dissipation plate member in the step (1) is made of aluminum or copper material.
  • the heat conducting column in the step (1) is made of a copper material.
  • the beneficial effects of the present invention are as follows: the upper surface of the electrode pad and the upper end surface of the heat conducting column are adjusted to be in the same plane, and the bottom surface of the LED base is attached to the electrode pad and the heat conducting column.
  • the bottom surface of the LED base and the upper end surface of the heat conducting column can be fully contacted and soldered, thereby effectively increasing the heat conduction portion of the bottom surface of the LED base and the heat conducting column.
  • the contact area of the end face is arranged such that the heat dissipation structure obtained by the manufacturing method of the invention can quickly derive the heat generated by the LED through the heat conducting column and the heat conducting plate member, and the heat conducting and heat dissipating function is greatly enhanced.
  • FIG. 1 is a schematic cross-sectional structural view of a heat dissipation structure prepared by the present invention
  • FIG. 2 is a schematic exploded view of a heat dissipation structure prepared by the present invention.
  • FIG. 1 and FIG. 2 are schematic diagrams showing the overall structure and the exploded structure of the heat dissipation structure prepared by the present invention. The specific steps of the present invention will be further described and described below with reference to the accompanying drawings.
  • the method for manufacturing a heat dissipation structure of a high-power LED according to the present invention comprises the following steps:
  • the heat conducting plate member 6 of the heat conducting column 8 and a heat dissipating plate member 9 and the like Preparing the PCB board 4, one side is provided with a heat conducting plate member 6 of the heat conducting column 8 and a heat dissipating plate member 9 and the like; wherein the heat conducting plate member 6 is made of a material such as copper and aluminum, and the heat conducting column 8 is made of copper The material is fabricated, and the heat dissipation plate member 9 is made of aluminum or copper material.
  • the materials such as copper and aluminum have a specific heat conduction and heat dissipation function.
  • the heat conductive plate member 6 and the heat dissipation plate member 9 of the present invention are made of copper and aluminum materials, which are advantageous for achieving the object of the present invention.
  • the above structural body can also be made of other metal materials having good heat conduction and heat dissipation properties.
  • the heat conducting column 8 and the heat conducting plate member 6 may be integrally formed or may be fixedly arranged by split welding.
  • a positioning hole 7 is formed on the PCB board 4, and a copper plate layer 5 is welded on one side of the PCB board 4, and a solder paste is applied on the surface of the copper board layer 5 for soldering and fixing the heat conducting board member 6; 4 The other side is soldered with electrode pads 3 for connecting the electrode portions on the bottom surface of the base 2 of the LED 1.
  • the heat conducting column 8 is disposed in the positioning hole 7 from the side of the PCB board 4 on which the copper plate layer 5 is disposed, and the copper plate layer 5 and the heat conducting plate member 6 are reflowed by reflow soldering, and the heat conducting plate member 6 and the PCB board 4 are fixedly connected into one.
  • the shape of the heat conducting column 8 is matched with the shape and size of the positioning hole 7.
  • the cross section of the heat conducting column 8 may be circular, elliptical, triangular or regular hexagonal when the cross section of the heat conducting column 8 is When the circular hole is disposed, the inner wall of the positioning hole 7 is provided with an internal thread, and the side wall of the heat conducting column 8 is provided with an external thread, and the heat conducting column 8 is screwed with the positioning hole 7.
  • the threaded connection of the heat conducting column 8 and the positioning hole 7 can make the structure tightness of the present invention indirectly improve the heat conduction and heat dissipation function.
  • the height of the heat conducting column 8 is greater than the sum of the thicknesses of the copper plate layer 5, the PCB board 4, and the electrode pads 3.
  • the heat conducting plate member 6 and the integral piece of the PCB board 4 obtained in the step (3) are placed on a stamping device, and the punching device presses the upper end surface of the heat conducting column 8 to adjust the height of the heat conducting column 8 so that the upper end surface of the heat conducting column 8 It is in the same plane as the upper surface of the electrode pad 3.
  • This step is a key step of the manufacturing method of the present invention. As described above, the height of the heat conducting column 8 is greater than the sum of the thicknesses of the copper plate layer 5, the PCB board 4 and the electrode pads 3, and the heat conducting column 8 is punched by the punching device.
  • the height of the heat conducting column 8 and the upper end surface are stamped and adjusted until the height of the heat conducting column 8 is equal to the sum of the thicknesses of the copper plate layer 5, the PCB board 4, and the electrode pads 3.
  • the cross section of the heat conducting column 8 becomes larger, forming an interference fit with the positioning hole 7, so that the contact surface with the heat conducting portion of the bottom surface of the base 2 is increased to facilitate heat conduction; meanwhile, the upper end surface of the heat conducting column 8 and the electrode soldering leg 3
  • the upper surface of the base 2 is in the same plane, so that the bottom surface of the base 2 can be fully engaged with the upper end surface of the heat conducting post 8 and the upper surface of the electrode soldering leg 3, and the electrode portion of the bottom surface of the base 2 and the electrode soldering leg 3 are fully performed.
  • Contact welding can realize sufficient contact welding between the heat conducting portion of the bottom surface of the base 2 and the upper end surface of the heat conducting column 8, and increase the contact area between the heat conducting portion of the bottom surface of the base 2 and the upper end surface of the heat conducting column 8 as much as possible to ensure the LED1 is generated.
  • the heat can be transferred to the heat dissipating plate member 9 through the heat conducting column 8 and the heat conducting plate member 6 in a timely manner, and is dissipated through the heat dissipating plate member 9.
  • the inner side of the heat dissipating plate member 9 is fixedly attached to the other side of the heat conducting plate member 6, and the heat dissipating plate member 9 is arranged to dissipate the heat of the heat conducting plate member 6 in time.
  • a plurality of fins 10 are disposed on the outer surface of the heat dissipating plate member 9 to increase the heat dissipating area of the heat dissipating plate member 9, thereby further enhancing the heat dissipating effect of the heat dissipating plate member 9.
  • the heat dissipation structure obtained by the manufacturing method of the invention can quickly derive the heat generated by the LED, and the heat dissipation and heat dissipation effect thereof is greatly enhanced compared with the prior art.
  • Table 1 temperature data test table of the existing heat dissipation structure (old) and the heat dissipation structure (new) produced by the present invention

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

一种大功率LED的散热结构的制作方法，包括如下步骤：（1）准备PCB板（4），一侧设有导热柱（8）的导热板件（6），散热板件（9）；（2）在PCB板（4）上设贯通两侧的定位孔（7），在PCB板（4）一侧面上设铜板层（5），在PCB板（4）另一侧面设电极焊脚（3），在铜板层（5）表面涂焊锡膏；（3）将导热柱（8）从PCB板（4）设有铜板层（5）的一侧设入定位孔（7）内，并通过回流焊焊接铜板层（5）与导热板件（6）；（4）将步骤（3）所得的导热板件（6）和PCB板（4）的整体件置于冲压设备上，调整导热柱（8）的高度；（5）将散热板件（9）内侧面固定贴设于导热板件（6）的另一侧面上。

Description

一种大功率LED的散热结构的制作方法 技术领域
本发明涉及散热装置技术领域，特别涉及一种大功率LED的散热结构的制作方法。
背景技术
LED以其理论寿命长、能耗低以及绿色环保等特点而被广泛应用于指示、室内外照明等各个领域。众所周知，影响LED使用寿命的最关键的因素就是LED的散热问题，大功率LED尤其如此。现有大功率LED的散热结构的制作方法是主要将热沉，铝基板、导热硅脂、散热板件等部分依次连接构成，LED经热沉与铝基板连接，这种制作方法虽然工艺简单，但其所制得的散热结构却存在导热散热性能差等缺陷和不足，从而极大的影响了LED的应用领域和应用范围，其导热散热性能差的主要原因在于铝基板的结构设置。铝基板一般由保护油层、铜箔层，绝缘层以及铝板层依次叠加而成，其中，绝缘层虽然在绝缘方面起到良好且有效的积极作用，却同时也生产了隔热的负面效果，LED所产生的热量无法及时迅速导出，从而极大地影响了LED的使用寿命。故有必要对现有制作方法进行革新，实现散热结构差异化，有效地解决LED的散热问题。
 技术问题
本发明的目的在于针对现有技术的缺陷和不足，提供一种工艺简单，生产效率高的大功率LED的散热结构的制作方法，其所得的散热结构具有结构简单紧凑、散热效果好等优点。
 技术解决方案
为实现上述目的，本发明采用以下技术方案：
本发明所述的一种大功率LED的散热结构的制作方法，其包括如下步骤：
(1) 准备PCB板，一侧设有导热柱的导热板件以及散热板件；
(2) 在所述PCB板上设贯通两侧的定位孔，在PCB板一侧面上焊设铜板层，在PCB板另一侧面焊设电极焊脚，然后在铜板层表面涂焊锡膏；
(3) 将导热柱从PCB板设有铜板层的一侧设入定位孔内，并通过回流焊焊接铜板层与导热板件，将导热板件和PCB板固定连接为一整体件；所述导热柱的高度大于铜板层，PCB板以及电极焊脚三者的厚度之和；
(4) 将步骤(3)所得的导热板件和PCB板的整体件置于冲压设备上，冲压设备对导热柱上端面进行冲压，以调整导热柱的高度，使导热柱的上端面与电极焊脚的上表面处于同一平面内；
(5) 将散热板件内侧面固定贴设于导热板件的另一侧面上。
其中，步骤(5)中所述散热板件外侧面上设有若干散热片。
其中，步骤(1)中所述导热柱与导热板件为一体成型设置。当然，步骤(1)中所述导热柱与导热板件也可以为分体焊接固定设置。
其中，步骤(1)中所述导热柱与定位孔螺纹连接。
其中，步骤(1)中所述导热板件由紫铜材料制作。
其中，步骤(1)中所述散热板件由铝或铜材料制作。
其中，步骤(1)中所述导热柱由紫铜材料制作。
 有益效果
采用上述制作方法后，本发明有益效果为：因本发明制作方法将电极焊脚的上表面和导热柱的上端面调整为同一平面内，将LED基座底面贴设于电极焊脚和导热柱上时，在不影响LED基座底面与电极焊脚电连接的情况下，LED基座底面与导热柱的上端面可以实现充分接触焊接连接，有效增加LED基座底面导热部分与导热柱的上端面的接触面积，这样设置，本发明制作方法所得的散热结构可以将LED所产生热量经导热柱和导热板件迅速导出，其导热散热功能大大增强。
附图说明
图1是本发明制得的散热结构整体剖视结构示意图；
图2是本发明制得的散热结构分解结构示意图。
图中： 1、LED； 2、基座；3、电极焊脚；4、PCB板；5、铜板层；6、导热板件；7、定位孔； 8、导热柱；9、散热板件；10、散热片。
 本发明的最佳实施方式
如图1，图2所示为本发明所制得的散热结构的整体以及分解结构示意图，下面结合附图对本发明具体步骤作进一步的说明和描述。
本发明所述的一种大功率LED的散热结构的制作方法，其包括如下步骤：
(1) 准备PCB板4，一侧设有导热柱8的导热板件6以及散热板件9等部件或材料；其中，所述导热板件6由紫铜以及铝等材料制作，所述导热柱8由紫铜材料制作，所述散热板件9由铝或铜材料制作。紫铜以及铝等材料均具体良好的导热散热功能，本发明所述导热板件6以及散热板件9采用紫铜以及铝材料制作，有利于实现本发明之目的。当然，上述结构主体亦可采用其它具有良好导热散热性能的金属材料制作。所述导热柱8与导热板件6可以为一体成型设置，也可以为分体焊接固定设置。
(2) 在所述PCB板4上设贯通两侧的定位孔7，在PCB板4一侧面上焊设铜板层5，在铜板层5表面涂焊锡膏，用于焊接固定导热板件6；在PCB板4另一侧面焊设电极焊脚3，用于连接LED1的基座2面底上的电极部分。
(3) 将导热柱8从PCB板4设有铜板层5的一侧设入定位孔7内，并通过回流焊焊接铜板层5与导热板件6，将导热板件6和PCB板4固定连接为一整体件。所述导热柱8的形状大小与定位孔7的形状大小相匹配，具体而言，导热柱8的横截面可以呈圆形、椭圆形、三角形或正六边形设置，当导热柱8的横截面呈圆形设置时，所述定位孔7内壁上设有内螺纹，所述导热柱8的侧壁上设有外螺纹，所述导热柱8与定位孔7螺纹连接。导热柱8与定位孔7的螺纹连接，可以使本发明的结构紧密度，间接提高导热散热功能。另外，所述导热柱8的高度大于铜板层5，PCB板4以及电极焊脚3三者的厚度之和。
(4) 将步骤(3)所得的导热板件6和PCB板4的整体件置于冲压设备上，冲压设备对导热柱8上端面进行冲压，以调整导热柱8的高度，使导热柱8的上端面与电极焊脚3的上表面处于同一平面内。本步骤为本发明制作方法的关键步骤，如上所述，所述导热柱8的高度大于铜板层5，PCB板4以及电极焊脚3三者的厚度之和，通过冲压设备冲压导热柱8，对导热柱8的高度以及上端面进行冲压调整，直至所述导热柱8的高度等于铜板层5，PCB板4以及电极焊脚3三者的厚度之和。经过冲压后，导热柱8横截面变大，与定位孔7形成过盈配合，从而与基座2底面导热部分接触面增大，便于导热；同时，导热柱8的上端面与电极焊脚3的上表面处于同一平面，这样，基座2底面可同时与导热柱8的上端面以及电极焊脚3的上表面进行充分帖合，既基座2底面的电极部分与电极焊脚3进行充分接触焊接，又能实现基座2底面导热部分与导热柱8的上端面的充分接触焊接，尽可能增大基座2底面导热部分与导热柱8的上端面的接触面积，以确保LED1所产生热量可以及时迅速的经由导热柱8，导热板件6传导至散热板件9，并经散热板件9散出。
(5) 将散热板件9内侧面固定贴设于导热板件6的另一侧面上，散热板件9以便于将导热板件6的热量及时散出。所述散热板件9外侧面上设有若干散热片10，以增加散热板件9的散热面积，进一步增强散热板件9的散热效果。
本发明制作方法所得的散热结构可以将LED所产生热量迅速导出，其导热散热效果较现有技术而言大大增强。
表一，现有散热结构(旧)与本发明所制得散热结构(新)的温度数据测试表
输入电流 环境温度 热沉温度（旧）导热柱温度（新） 铝基板（旧）导热板件（新） 散热板件
散热结构（旧） 700mA 24.3℃ 57.3℃ 44.7℃ 45.2℃
散热结构（新） 700mA 28℃ 48.1/51℃ 47.3/50.3℃ 45.6/50.3℃
从上表可看出，对分别采用新散热结构和旧散热结构的大功率LED，均通以相同电流，且新散热结构环境温度较高的情况下，新散热结构导热柱温度明显低于旧散热结构热沉温度，而新散热结构的导热板件以及散热板件的温度却明显高于旧散热结构的铝基板和散热板件的温度，这充分说明了本发明制作方法所得新散热结构的散热效果比旧散热结构的散热结构的效果更好。
以上所述仅是本发明的较佳实施方式，故凡依本发明专利申请范围所述的构造、特征及原理所做的等效变化或修饰，均包括于本发明专利申请范围内。
 本发明的实施方式
工业实用性
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Claims (8)

  1. 一种大功率LED的散热结构的制作方法，其特征在于，其包括如下步骤：
    (1) 准备PCB板(4)，一侧设有导热柱(8)的导热板件(6)以及散热板件(9)；
    (2) 在所述PCB板(4)上设贯通两侧的定位孔(7)，在PCB板(4)一侧面上焊设铜板层(5)，在PCB 板(4)另一侧面焊设电极焊脚(3)，然后在铜板层(5)表面涂焊锡膏；
    (3) 将导热柱(8)从PCB板(4)设有铜板层(5)的一侧设入定位孔(7)内，并通过回流焊焊接铜板层(5)与导热板件(6)，将导热板件(6)和PCB板(4)固定连接为一整体件；所述导热柱(8)的高度大于铜板层(5)，PCB板(4)以及电极焊脚(3)三者的厚度之和；
    (4) 将步骤(3)所得的导热板件(6)和PCB板(4)的整体件置于冲压设备上，冲压设备对导热柱(8)上端面进行冲压，以调整导热柱(8)的高度，使导热柱(8)的上端面与电极焊脚(3)的上表面处于同一平面内；
    (5) 将散热板件(9)内侧面固定贴设于导热板件(6)的另一侧面上。
  2. 根据权利要求1所述的大功率LED的散热结构的制作方法，其特征在于：步骤(5)中所述散热板件(9)外侧面上设有若干散热片(10)。
  3. 根据权利要求1所述的大功率LED的散热结构的制作方法，其特征在于：步骤(1)中所述导热柱(8)与导热板件(6)为一体成型设置。
  4. 根据权利要求1所述的大功率LED的散热结构的制作方法，其特征在于：步骤(1)中所述导热柱(8)与导热板件(6)为分体焊接固定设置。
  5. 根据权利要求1所述的大功率LED的散热结构的制作方法，其特征在于：步骤(1)中所述导热柱(8)与定位孔(7)螺纹连接。
  6. 根据权利要求1所述的大功率LED的散热结构的制作方法，其特征在于：步骤(1)中所述导热板件(6)由紫铜材料制作。
  7. 根据权利要求1所述的大功率LED的散热结构的制作方法，其特征在于：步骤(1)中所述散热板件(9)由铝或铜材料制作。
  8. 根据权利要求1所述的大功率LED的散热结构的制作方法，其特征在于：步骤(1)中所述导热柱(8)由紫铜材料制作。
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CN102820384B (zh) * 2011-06-08 2015-10-07 展晶科技(深圳)有限公司 发光二极管封装结构的制造方法
CN102403418A (zh) * 2011-11-09 2012-04-04 东莞勤上光电股份有限公司 一种大功率led的散热结构的制作方法

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US20130298396A1 (en) 2013-11-14
AU2012333908C1 (en) 2015-08-27
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JP5725522B2 (ja) 2015-05-27
AU2012333908A1 (en) 2013-05-16
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