WO2013067841A1 - 一种大功率led 的散热结构 - Google Patents

一种大功率led 的散热结构 Download PDF

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Publication number
WO2013067841A1
WO2013067841A1 PCT/CN2012/080764 CN2012080764W WO2013067841A1 WO 2013067841 A1 WO2013067841 A1 WO 2013067841A1 CN 2012080764 W CN2012080764 W CN 2012080764W WO 2013067841 A1 WO2013067841 A1 WO 2013067841A1
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Prior art keywords
heat
heat conducting
heat dissipation
plate member
column
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PCT/CN2012/080764
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English (en)
French (fr)
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毕晓峰
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东莞勤上光电股份有限公司
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Publication of WO2013067841A1 publication Critical patent/WO2013067841A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • the present invention relates to the field of heat sink devices, and in particular, to a heat dissipation structure of a high power LED.
  • LEDs are widely used in various fields such as indication, indoor and outdoor lighting, etc. due to their long theoretical life, low energy consumption and environmental protection.
  • the most critical factor affecting the service life of LEDs is the heat dissipation problem of LEDs, especially for high-power LEDs.
  • the heat dissipation structure of the existing high-power LED is mainly composed of a heat sink, an aluminum substrate, a thermal grease, a heat dissipation plate member and the like, and the LED is connected to the aluminum substrate via a heat sink.
  • the heat dissipation structure has defects such as poor heat conduction and heat dissipation performance. Insufficient, which greatly affects the application field and application range of LED.
  • the main reason for its poor thermal conductivity is the structural setting of the aluminum substrate.
  • the aluminum substrate is generally formed by superimposing a protective oil layer, a copper foil layer, an insulating layer and an aluminum plate layer.
  • the insulating layer plays a good and effective positive role in insulation, it also produces a negative effect of heat insulation.
  • the heat generated cannot be quickly and quickly exported, which greatly affects the service life of the LED. Therefore, it is necessary to carry out technological innovation on the existing LED heat dissipation structure, and most effectively solve the heat dissipation problem of the LED.
  • the object of the present invention is to provide a heat dissipation structure of a high-power LED with a simple and compact structure and good heat dissipation effect in view of the defects and deficiencies of the prior art.
  • the present invention adopts the following technical solutions:
  • the heat dissipation structure of a high-power LED comprises a PCB board, a heat-conducting board member and a heat-dissipating board member.
  • the PCB board is provided with a positioning hole, and the positioning hole penetrates both sides of the PCB board, and one side of the PCB board a copper plate layer is disposed on the other side of the PCB board, and an electrode pad is disposed on the other side of the PCB board; a heat conducting column is disposed on one side of the heat conducting plate member, and the shape of the heat conducting column matches the shape and size of the positioning hole, and the heat conduction
  • the height of the column is equal to the sum of the thicknesses of the copper plate layer, the PCB board and the electrode soldering legs.
  • the heat conducting column is disposed in the positioning hole, and the side of the heat conducting plate member is provided with the heat conducting column and the copper plate layer is welded and connected; the heat conducting column The upper end surface is in the same plane as the upper surface of the electrode pad; the heat dissipation plate member is attached to the other side of the heat conducting plate member.
  • the heat dissipation plate member is provided with a plurality of heat dissipation fins.
  • the heat conducting column and the heat conducting plate member are integrally formed.
  • the heat conducting column and the heat conducting plate member may also be fixedly arranged for the split welding.
  • the heat conducting column has a circular cross section; the inner wall of the positioning hole is provided with an internal thread, and the side wall of the heat conducting column is provided with an external thread, and the heat conducting column is screwed with the positioning hole.
  • the cross section of the heat conducting column may also be set to an elliptical shape, a triangular shape or a regular hexagonal shape.
  • the heat conducting plate member is made of a copper material, and of course, the heat conducting plate member can also be made of an aluminum material.
  • the heat dissipation plate member is made of aluminum or copper material.
  • the heat conducting column is made of a copper material.
  • the beneficial effect of the invention is that the bottom surface of the LED base is attached to the electrode soldering foot and the heat conducting column of the present invention, because the upper surface of the electrode soldering foot and the upper end surface of the heat conducting column are in the same plane
  • the bottom surface of the LED base is not electrically connected to the electrode pads
  • the bottom surface of the LED base and the upper end surface of the heat-conducting column can be fully contacted and soldered, thereby effectively increasing the heat-conducting portion of the bottom surface of the LED base and the upper end surface of the heat-conducting column.
  • the contact area is arranged such that the heat dissipation structure of the present invention can quickly derive the heat generated by the LED through the heat conducting column and the heat conducting plate, and the heat conducting and heat dissipating function is greatly enhanced.
  • Figure 1 is a schematic cross-sectional view showing the entire structure of the present invention
  • Figure 2 is a schematic exploded view of the present invention.
  • the heat dissipation structure of a high-power LED includes a PCB board 4, a heat-conducting board member 6, and a heat-dissipating board member 9, that is, a PCB board 4, a heat-conducting board member 6, and a heat dissipation device.
  • the plate member 9 constitutes the main body member of the present invention.
  • the heat conducting plate member 6 is made of a material such as copper and aluminum
  • the heat radiating plate member 9 is made of aluminum or copper material
  • the heat conducting column 8 is made of a copper material. Both the copper and the aluminum materials have a specific heat conduction and heat dissipation function.
  • the heat conductive plate member 6 and the heat dissipation plate member 9 of the present invention are made of copper and aluminum materials, which are advantageous for achieving the object of the present invention.
  • the above structural body can also be made of other metal materials having good heat conduction and heat dissipation properties.
  • the PCB board 4 is provided with a positioning hole 7 through which the positioning hole 7 penetrates the two sides of the PCB board 4.
  • the copper board layer 5 is disposed on one side of the PCB board 4 for soldering and fixing the heat conducting board member 6; On the other side, there are electrode pads 3 for connecting LEDs The electrode portion on the bottom of the pedestal 2 of 1.
  • a heat conducting column 8 is disposed on one side of the heat conducting plate member 6.
  • the heat conducting column 8 and the heat conducting plate member 6 may be integrally formed or may be fixedly disposed by split welding.
  • a heat dissipating plate member 9 is attached to the other side of the heat conducting plate member 6 so as to dissipate the heat of the heat conducting plate member 6 in time.
  • the heat dissipating plate member 9 is provided with a plurality of fins 10 to increase the heat dissipating area of the heat dissipating plate member 9, and further enhance the heat dissipating effect of the heat dissipating plate member 9.
  • the shape of the heat conducting column 8 is matched with the shape and size of the positioning hole 7.
  • the heat conducting column 8 has a circular, elliptical, triangular or regular hexagonal cross section, and the cross section of the heat conducting column 8 is
  • the inner wall of the positioning hole 7 is provided with an internal thread
  • the side wall of the heat conducting column 8 is provided with an external thread
  • the heat conducting column 8 is screwed with the positioning hole 7.
  • the threaded connection of the heat conducting column 8 and the positioning hole 7 can make the structure tightness of the present invention indirectly improve the heat conduction and heat dissipation function.
  • the height of the heat conducting column 8 is equal to the sum of the thicknesses of the copper plate layer 5, the PCB board 4 and the electrode pads 3, and the heat conducting columns 8 are disposed in the positioning holes 7.
  • the upper end surface of the heat conducting column 8 is at the upper surface of the electrode pad 3.
  • the bottom surface of the base 2 can be fully engaged with the upper end surface of the heat conducting post 8 and the upper surface of the electrode soldering leg 3, that is, the electrode portion of the bottom surface of the base 2 is fully contacted with the electrode soldering leg 3
  • the contact between the heat conducting portion of the bottom surface of the base 2 and the upper end surface of the heat column 8 can be achieved, and the contact area between the heat conducting portion of the bottom surface of the base 2 and the upper end surface of the heat conducting column 8 can be increased as much as possible to ensure the LED1 is generated.
  • the heat can be transferred to the heat dissipating plate member 9 through the heat conducting column 8 and the heat conducting plate member 6 in a timely manner, and is dissipated through the heat dissipating plate member 9.
  • the heat dissipation structure of the invention can quickly derive the heat generated by the LED, and the heat dissipation and heat dissipation effect thereof is greatly enhanced compared with the prior art.
  • Table 1 temperature data test table of the existing heat dissipation structure (old) and the heat dissipation structure (new) of the present invention
  • the high-power LEDs with new heat dissipation structure and old heat dissipation structure are all connected with the same current, and the temperature of the heat-dissipating column of the new heat-dissipation structure is significantly lower when the temperature of the new heat-dissipating structure is high.
  • the temperature of the heat conduction plate member and the heat dissipation plate member of the new heat dissipation structure is significantly higher than the temperature of the aluminum substrate and the heat dissipation plate member of the old heat dissipation structure, which fully demonstrates the heat dissipation effect ratio of the new heat dissipation structure.
  • the heat dissipation structure of the old heat dissipation structure is better.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

本发明涉及散热装置技术领域，特别涉及一种大功率LED的散热结构，包括PCB板和导热板件以及散热板件，所述PCB板上设有定位孔，定位孔贯通PCB板两侧，所述PCB板一侧面上设有铜板层，PCB板另一侧面上设有电极焊脚；所述导热板件一侧面上设有导热柱，所述导热柱的形状大小与定位孔的形状大小相匹配，所述导热柱的高度等于PCB板的厚度和电极焊脚的厚度之和，所述导热柱配合设于定位孔内，导热板件设有导热柱的侧面与铜板层焊接连接；所述导热柱的上端面与电极焊脚的上表面处于同一平面内；所述散热板件贴设于导热板件的另一侧面上。本发明结构简单紧凑，导热散热效果好。

Description

一种大功率LED 的散热结构 技术领域
本发明涉及散热装置技术领域，特别涉及一种大功率LED的散热结构。
 背景技术
LED以其理论寿命长、能耗低以及绿色环保等特点而被广泛应用于指示、室内外照明等各个领域。众所周知，影响LED使用寿命的最关键的因素就是LED的散热问题，大功率LED尤其如此。现有大功率LED的散热结构主要由热沉，铝基板、导热硅脂、散热板件等部分依次连接构成，LED经热沉与铝基板连接，这种散热结构存在导热散热性能差等缺陷和不足，从而极大的影响了LED的应用领域和应用范围，其导热散热性能差的主要原因在于铝基板的结构设置。铝基板一般由保护油层、铜箔层，绝缘层以及铝板层依次叠加而成，其中，绝缘层虽然在绝缘方面起到良好且有效的积极作用，却同时也生产了隔热的负面效果，LED所产生的热量无法及时迅速导出，从而极大地影响了LED的使用寿命。故有必要对现有LED散热结构进行技术革新，最有效地解决LED的散热问题。
技术问题
本发明的目的在于针对现有技术的缺陷和不足，提供一种结构简单紧凑、散热效果好的大功率LED的散热结构。
技术解决方案
为实现上述目的，本发明采用以下技术方案：
本发明所述的一种大功率LED的散热结构，包括PCB板，导热板件以及散热板件，所述PCB板上设有定位孔，定位孔贯通PCB板两侧，所述PCB板一侧面上设有铜板层，PCB板另一侧面上设有电极焊脚；所述导热板件一侧面上设有导热柱，所述导热柱的形状大小与定位孔的形状大小相匹配，所述导热柱的高度等于铜板层，PCB板以及电极焊脚三者的厚度之和，所述导热柱配合设于定位孔内，导热板件设有导热柱的侧面与铜板层焊接连接；所述导热柱的上端面与电极焊脚的上表面处于同一平面内；所述散热板件贴设于导热板件的另一侧面上。
进一步地，所述散热板件上设有若干散热片。
其中，所述导热柱与导热板件为一体成型设置。当然所述导热柱与导热板件亦可为分体焊接固定设置。
进一步地，所述导热柱的横截面呈圆形设置；所述定位孔内壁上设有内螺纹，所述导热柱的侧壁上设有外螺纹，所述导热柱与定位孔螺纹连接。所述导热柱的横截面还可以设为椭圆形、三角形或正六边形设置。
其中，所述导热板件由紫铜材料制作，当然导热板件也可由铝材料制作。
其中，所述散热板件由铝或铜材料制作。
其中，所述导热柱由紫铜材料制作。
 有益效果
采用上述结构后，本发明有益效果为：LED基座底面贴设于本发明的电极焊脚和导热柱上，因本发明所述电极焊脚的上表面和导热柱的上端面处于同一平面内，在不影响LED基座底面与电极焊脚电连接的情况下，LED基座底面与导热柱的上端面可以实现充分接触焊接连接，有效增加LED基座底面导热部分与导热柱的上端面的接触面积，这样设置，本发明所述的散热结构可以将LED所产生热量经导热柱和导热板件迅速导出，其导热散热功能大大增强。
附图说明
图1是本发明整体剖视结构示意图；
图2是本发明分解结构示意图。
图中： 1、LED；2、基座；3、电极焊脚；4、PCB板；5、铜板层；6、导热板件；7、定位孔；8、导热柱；9、散热板件；10、散热片。
 本发明的最佳实施方式
下面结合附图对本发明作进一步的说明。
如图1，图2所示，本发明所述的一种大功率LED的散热结构，包括PCB板4，导热板件6以及散热板件9，也即PCB板4，导热板件6以及散热板件9构成本发明主体部件。其中，所述导热板件6由紫铜以及铝等材料制作，所述散热板件9由铝或铜材料制作，所述导热柱8由紫铜材料制作。紫铜以及铝材料均具体良好的导热散热功能，本发明所述导热板件6以及散热板件9采用紫铜以及铝材料制作，有利于实现本发明之目的。当然，上述结构主体亦可采用其它具有良好导热散热性能的金属材料制作。
其中，所述PCB板4上设有定位孔7，定位孔7贯通PCB板4两侧，所述PCB板4一侧面上设有铜板层5，用于焊接固定导热板件6；PCB板4另一侧面上设有电极焊脚3，用于连接LED 1的基座2面底上的电极部分。
所述导热板件6一侧面上设有导热柱8，所述导热柱8与导热板件6可以为一体成型设置，也可以为分体焊接固定设置。所述导热板件6的另一侧面上贴设有散热板件9，以便于将导热板件6的热量及时散出。所述散热板件9上设有若干散热片10，以增加散热板件9的散热面积，进一步增强散热板件9的散热效果。
所述导热柱8的形状大小与定位孔7的形状大小相匹配，具体而言，导热柱8的横截面呈圆形、椭圆形、三角形或正六边形设置，当导热柱8的横截面呈圆形设置时，所述定位孔7内壁上设有内螺纹，所述导热柱8的侧壁上设有外螺纹，所述导热柱8与定位孔7螺纹连接。导热柱8与定位孔7的螺纹连接，可以使本发明的结构紧密度，间接提高导热散热功能。
所述导热柱8的高度等于铜板层5，PCB板4以及电极焊脚3三者的厚度之和，所述导热柱8配合设于定位孔7内。当导热板件6设有导热柱8的侧面通过导热柱8与定位孔7配合连接与铜板层5紧密贴合并焊接固定后，所述导热柱8的上端面与电极焊脚3的上表面处于同一平面内，如此设置，基座2底面可同时与导热柱8的上端面以及电极焊脚3的上表面进行充分帖合，即基座2底面的电极部分与电极焊脚3进行充分接触焊接的同时，也能实现基座2底面导热部分与热柱8的上端面的充分接触焊接，尽可能增大基座2底面导热部分与导热柱8的上端面的接触面积，以确保LED1所产生热量可以及时迅速的经由导热柱8，导热板件6传导至散热板件9，并经散热板件9散出。
本发明所述的散热结构可以将LED所产生热量迅速导出，其导热散热效果较现有技术而言大大增强。
表一，现有散热结构(旧)与本发明所述散热结构(新)的温度数据测试表
输入电流 环境温度 热沉温度（旧）导热柱温度（新） 铝基板（旧）导热板件（新） 散热板件
散热结构（旧） 700mA 24.3 ℃ 57.3℃ 44.7℃ 45.2℃
散热结构（新） 700mA 28℃ 48.1/51℃ 47.3/50.3℃ 45.6/50.3℃
从上表可以看出，对分别采用新散热结构和旧散热结构的大功率LED，均通以相同的电流，且在新散热结构环境温度较高的情况下，新散热结构导热柱温度明显低于旧散热结构热沉温度，而新散热结构的导热板件以及散热板件的温度却明显高于旧散热结构的铝基板和散热板件的温度，这充分说明了新散热结构的散热效果比旧散热结构的散热结构的效果更好。
以上所述仅是本发明的较佳实施方式，故凡依本发明专利申请范围所述的构造、特征及原理所做的等效变化或修饰，均包括于本发明专利申请范围内。
 本发明的实施方式
工业实用性
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Claims (9)

1. 一种大功率LED的散热结构，其特征在于：包括PCB板(4)，导热板件(6)以及散热板件(9)，所述PCB板(4)上设有定位孔(7)，定位孔(7)贯通PCB板(4)两侧，所述PCB板(4)一侧面上设有铜板层(5)，PCB板(4)另一侧面上设有电极焊脚(3)；所述导热板件(6)一侧面上设有导热柱(8)，所述导热柱(8)的形状大小与定位孔(7)的形状大小相匹配，所述导热柱(8)的高度等于铜板层(5)，PCB板(4)以及电极焊脚(3)三者的厚度之和，所述导热柱(8)配合设于定位孔(7)内，导热板件(6)设有导热柱(8)的侧面与铜板层(5)焊接连接；所述导热柱(8)的上端面与电极焊脚(3)的上表面处于同一平面内；所述散热板件(9)贴设于导热板件(6)的另一侧面上。
根据权利要求1所述的大功率LED的散热结构，其特征在于：所述散热板件(9)上设有若干散热片(10)。
根据权利要求2所述的大功率LED的散热结构，其特征在于：所述导热柱(8)与导热板件(6)为一体成型设置。
根据权利要求2所述的大功率LED的散热结构，其特征在于：所述导热柱(8)与导热板件(6)为分体焊接固定设置。
根据权利要求3或4所述的大功率LED的散热结构，其特征在于：所述导热柱(8)的横截面呈圆形设置；所述定位孔(7)内壁上设有内螺纹，所述导热柱(8)的侧壁上设有外螺纹，所述导热柱(8)与定位孔(7)螺纹连接。
根据权利要求3或4所述的大功率LED的散热结构，其特征在于：所述导热柱(8)的横截面呈椭圆形、三角形或正六边形设置。
根据权利要求1-4任一所述的大功率LED的散热结构，其特征在于：所述导热板件(6)由紫铜材料制作。
根据权利要求1-4任一所述的大功率LED的散热结构，其特征在于：所述散热板件(9)由铝或铜材料制作。
根据权利要求1-4任一所述的大功率LED的散热结构，其特征在于：所述导热柱(8)由紫铜材料制作。
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