WO2013067843A1 - 一种大功率led 散热结构 - Google Patents

一种大功率led 散热结构 Download PDF

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Publication number
WO2013067843A1
WO2013067843A1 PCT/CN2012/080774 CN2012080774W WO2013067843A1 WO 2013067843 A1 WO2013067843 A1 WO 2013067843A1 CN 2012080774 W CN2012080774 W CN 2012080774W WO 2013067843 A1 WO2013067843 A1 WO 2013067843A1
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WIPO (PCT)
Prior art keywords
heat
heat dissipation
positioning hole
plate member
fixing hole
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PCT/CN2012/080774
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English (en)
French (fr)
Inventor
毕晓峰
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东莞勤上光电股份有限公司
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Publication of WO2013067843A1 publication Critical patent/WO2013067843A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • the invention relates to the technical field of heat dissipating devices, in particular to a high power LED heat dissipating structure.
  • LEDs are widely used in various fields such as indication, indoor and outdoor lighting, etc. due to their long theoretical life, low energy consumption and environmental protection.
  • the most critical factor affecting the service life of LEDs is the heat dissipation problem of LEDs, especially for high-power LEDs.
  • the heat dissipation structure of the existing high-power LED is mainly composed of a heat sink, an aluminum substrate, a thermal grease, a heat dissipation plate member and the like, and the LED is connected to the aluminum substrate via a heat sink.
  • the heat dissipation structure has defects such as poor heat conduction and heat dissipation performance. Insufficient, which greatly affects the application field and application range of LED.
  • the main reason for its poor thermal conductivity is the structural setting of the aluminum substrate.
  • the aluminum substrate is generally formed by superimposing a protective oil layer, a copper foil layer, an insulating layer and an aluminum plate layer.
  • the insulating layer plays a good and effective positive role in insulation, it also produces a negative effect of heat insulation.
  • the heat generated cannot be quickly and quickly exported, which greatly affects the service life of the LED. Therefore, it is necessary to carry out technological innovation on the existing LED heat dissipation structure, and most effectively solve the heat dissipation problem of the LED.
  • the object of the present invention is to provide a high-power LED heat dissipation structure with simple and compact structure and good heat dissipation effect in view of the defects and deficiencies of the prior art.
  • the present invention adopts the following technical solutions:
  • the high-power LED heat dissipation structure of the present invention comprises a PCB board, a heat-conducting board member and a heat-dissipating board member, wherein the PCB board is provided with a positioning hole and a fixing hole, and the positioning hole and the fixing hole are connected On both sides of the PCB board, a copper plate layer is disposed on one side of the PCB board, and an electrode soldering leg is disposed on the other side of the PCB board; the heat conducting board member is provided with a positioning hole 2 and a fixing hole 2, and the positioning hole 2 And a fixing hole 2 penetrates both sides of the heat conducting plate member; a side surface of the heat conducting plate member is superposed with a side surface of the PCB board provided with the copper plate layer, and the positioning hole is disposed corresponding to the positioning hole 2, the fixing hole and the fixing hole
  • the heat-conducting plate member and the PCB board are fixedly connected by a fixing post which is disposed in the fixing hole 1 and the fixing hole 2; the positioning
  • the heat conducting plate member is welded and fixed to the copper plate layer.
  • the heat dissipation plate member is provided with a plurality of heat dissipation fins.
  • the shape of the heat conducting column is matched with the shape of the positioning hole 1 and the positioning hole 2, and the heat conducting column has a circular, elliptical, triangular or regular hexagonal cross section.
  • the fixing hole 1 and the fixing hole 2 are both disposed through holes, and the fixing column is a rivet.
  • the fixing hole 1 and the fixing hole 2 are both screw holes, and the fixing column is a screw.
  • the heat conducting plate member is made of a copper material.
  • the heat dissipation plate member is made of aluminum or copper material.
  • the thermally conductive column is made of a copper material.
  • the beneficial effect of the invention is that the bottom surface of the LED base is attached to the electrode soldering foot and the heat conducting column of the present invention, because the upper surface of the electrode soldering foot and the upper end surface of the heat conducting column are in the same plane
  • the bottom surface of the LED base is not electrically connected to the electrode pads
  • the bottom surface of the LED base and the upper end surface of the heat-conducting column can be fully contacted and soldered, thereby effectively increasing the heat-conducting portion of the bottom surface of the LED base and the upper end surface of the heat-conducting column.
  • the contact area is arranged such that the heat dissipation structure of the present invention can quickly derive the heat generated by the LED through the heat conducting column and the heat conducting plate, and the heat conducting and heat dissipating function is greatly enhanced.
  • Figure 1 is a schematic cross-sectional view showing the entire structure of the present invention
  • Figure 2 is a schematic exploded view of the present invention.
  • a high-power LED heat dissipation structure comprises a PCB board 4, a heat-conducting board member 6, and a heat-dissipating board member 9, that is, a PCB board 4, a heat-conducting board member 6, and a heat dissipation board.
  • the member 9 constitutes the main body member of the present invention.
  • the heat conducting plate member 6 is made of a material such as copper and aluminum
  • the heat radiating plate member 9 is made of aluminum or copper material
  • the heat conducting column 7 is made of a copper material. Both the copper and the aluminum materials have a specific heat conduction and heat dissipation function.
  • the heat conduction plate member 6, the heat conduction column 7 and the heat dissipation plate member 9 of the present invention are made of copper and aluminum materials, which are advantageous for achieving the object of the present invention.
  • the above structural body can also be made of other metal materials having good heat conduction and heat dissipation properties.
  • the PCB board 4 is provided with a positioning hole 41 and a fixing hole 42.
  • the positioning hole 41 and the fixing hole 42 extend through the two sides of the PCB 4.
  • the copper board 5 is disposed on one side of the PCB 4. It is used for soldering and fixing the heat conducting plate member 6; on the other side of the PCB board 4, an electrode soldering leg 3 is provided for connecting the electrode portion on the bottom surface of the base 2 of the LED 1.
  • the heat conducting plate member 6 is provided with a positioning hole 216 and a fixing hole 62, and the positioning hole 216 and the fixing hole 262 are penetrated from both sides of the heat conducting plate member 6.
  • One side of the heat conducting plate member 6 is superposed on the side surface of the PCB board 4 on which the copper plate layer 5 is disposed.
  • the positioning hole 41 is disposed corresponding to the positioning hole 62
  • the fixing hole 42 is corresponding to the fixing hole 62.
  • the heat conducting plate member 6 and the PCB board 4 are fixedly connected by a fixing post 8 that is disposed in the fixing hole 42 and the fixing hole 62.
  • the fixing post 8 is a rivet, and the heat conducting plate member 6 and the PCB board 4 are riveted; when the fixing hole 42 and the fixing hole are When the two 62 are screw holes, the fixing post 8 is a screw, and the heat conducting plate member 6 and the PCB board 4 are screwed together.
  • the heat conducting plate member 6 is welded and fixed to the copper plate layer 5 to further increase the structural firmness and improve the compactness of the structure.
  • the plurality of fixing holes 42 may be evenly distributed around the positioning holes 41.
  • the fixing holes 62 may also be multiple. They are evenly distributed around the positioning holes 2 and 61.
  • both the fixing hole 42 and the fixing hole 62 are plural, their positions and numbers form a one-to-one correspondence.
  • a heat dissipating plate member 9 is attached to the other side of the heat conducting plate member 6 so as to dissipate the heat of the heat conducting plate member 6 in time.
  • the heat dissipating plate member 9 is provided with a plurality of fins 10 to increase the heat dissipating area of the heat dissipating plate member 9, and further enhance the heat dissipating effect of the heat dissipating plate member 9.
  • a heat conducting column 7 is disposed in the positioning hole 41 and the positioning hole 216.
  • One end of the heat conducting column 7 is flush with the side of the heat conducting plate member 6 at one end, and the other end protrudes beyond the side of the PCB board 4, and the heat conducting column 7 protrudes.
  • the end length is equal to the thickness of the electrode fillet 3 to ensure that the upper end surface of the heat transfer post 7 is in the same plane as the upper surface of the electrode fillet 3.
  • the bottom surface of the pedestal 2 can be fully engaged with the upper end surface of the heat conducting column 7 and the upper surface of the electrode soldering leg 3, that is, the electrode portion of the bottom surface of the susceptor 2 is fully contacted with the electrode soldering leg 3,
  • the contact between the heat conducting portion of the bottom surface of the base 2 and the upper end surface of the hot column 7 can be achieved, and the contact area between the heat conducting portion of the bottom surface of the base 2 and the upper end surface of the hot column 7 can be increased as much as possible to ensure that the heat generated by the LED 1 can be promptly and quickly
  • the heat conducting plate member 6 is conducted to the heat radiating plate member 9 via the heat conducting column 7, and is radiated through the heat radiating plate member 9.
  • the shape of the heat conducting column 7 is matched with the shape of the positioning hole 41 and the positioning hole 61.
  • the cross section of the heat conducting column 8 is circular, elliptical, triangular or regular hexagonal when heat conducting.
  • the cross-section of the column 7 is circular, the positioning hole 41 and the inner wall of the positioning hole 61 are provided with internal threads, and the side wall of the heat-conducting column 7 is provided with external threads, and the heat-conducting column 7 and positioning The hole one 41 and the positioning hole two 61 are screwed.
  • the threaded connection of the heat conducting column 7 with the positioning hole 41 and the positioning hole 216 can increase the structural tightness of the present invention and indirectly improve the heat conduction and heat dissipation function.
  • the heat dissipation structure of the invention can quickly derive the heat generated by the LED, and the heat dissipation and heat dissipation effect thereof is greatly enhanced compared with the prior art.
  • Table 1 temperature data test table of the existing heat dissipation structure (old) and the heat dissipation structure (new) of the present invention
  • the high-power LEDs with new heat dissipation structure and old heat dissipation structure are all connected with the same current, and the temperature of the heat-dissipating column of the new heat-dissipation structure is significantly lower when the temperature of the new heat-dissipating structure is high.
  • the temperature of the heat conduction plate member and the heat dissipation plate member of the new heat dissipation structure is significantly higher than the temperature of the aluminum substrate and the heat dissipation plate member of the old heat dissipation structure, which fully demonstrates the heat dissipation effect ratio of the new heat dissipation structure.
  • the heat dissipation structure of the old heat dissipation structure is better.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明涉及散热装置技术领域，特别涉及一种大功率LED散热结构，包括PCB板，导热板件以及散热板件，所述PCB板上设有定位孔一和固定孔一，所述PCB板一侧面上设有铜板层，PCB板另一侧面上设有电极焊脚；所述导热板件上设有定位孔二和固定孔二，所述导热板件一侧面与PCB板设有铜板层的侧面叠加，所述导热板件和PCB板通过穿设于固定孔一和固定孔二内的固定柱连接；所述定位孔一和定位孔二内穿设有导热柱，所述导热柱一端伸出PCB板侧面外，所述导热柱的上端面与电极焊脚的上表面处于同一平面内；所述散热板件贴设于导热板件的另一侧面上。本发明结构简单紧凑，导热散热效果好。

Description

一种大功率LED 散热结构 技术领域
本发明涉及散热装置技术领域，特别涉及一种大功率LED散热结构。
 背景技术
LED以其理论寿命长、能耗低以及绿色环保等特点而被广泛应用于指示、室内外照明等各个领域。众所周知，影响LED使用寿命的最关键的因素就是LED的散热问题，大功率LED尤其如此。现有大功率LED的散热结构主要由热沉，铝基板、导热硅脂、散热板件等部分依次连接构成，LED经热沉与铝基板连接，这种散热结构存在导热散热性能差等缺陷和不足，从而极大的影响了LED的应用领域和应用范围，其导热散热性能差的主要原因在于铝基板的结构设置。铝基板一般由保护油层、铜箔层，绝缘层以及铝板层依次叠加而成，其中，绝缘层虽然在绝缘方面起到良好且有效的积极作用，却同时也生产了隔热的负面效果，LED所产生的热量无法及时迅速导出，从而极大地影响了LED的使用寿命。故有必要对现有LED散热结构进行技术革新，最有效地解决LED的散热问题。
 技术问题
本发明的目的在于针对现有技术的缺陷和不足，提供一种结构简单紧凑、散热效果好的大功率LED散热结构。
 技术解决方案
为实现上述目的，本发明采用以下技术方案：
本发明所述的一种大功率LED散热结构，包括PCB板，导热板件以及散热板件，所述PCB板上设有定位孔一和固定孔一，所述定位孔一和固定孔一贯通PCB板两侧，所述PCB板一侧面上设有铜板层，PCB板另一侧面上设有电极焊脚；所述导热板件上设有定位孔二和固定孔二，所述定位孔二和固定孔二贯通导热板件两侧；所述导热板件一侧面与PCB板设有铜板层的侧面叠加，所述定位孔一与定位孔二成对应设置，所述固定孔一和固定孔二成对应设置；所述导热板件和PCB板通过穿设于固定孔一和固定孔二内的固定柱固定连接；所述定位孔一和定位孔二内穿设有导热柱，所述导热柱一端伸出PCB板侧面外，导热柱伸出端长度与电极焊脚的厚度相等，所述导热柱的上端面与电极焊脚的上表面处于同一平面内；所述散热板件贴设于导热板件的另一侧面上。
进一步地，所述导热板件与铜板层焊接固定。
进一步地，所述散热板件上设有若干散热片。
进一步地，所述导热柱的形状大小与定位孔一和定位孔二的形状大小相匹配，所述导热柱的横截面呈圆形、椭圆形、三角形或正六边形设置。
进一步地，所述固定孔一和固定孔二均为通孔设置，所述固定柱为铆钉。当然，所述固定孔一和固定孔二均为螺孔设置，所述固定柱为螺钉。
优选地，所述导热板件由紫铜材料制作。
优选地，所述散热板件由铝或铜材料制作。
优选地，所述导热柱由紫铜材料制作。
 有益效果
采用上述结构后，本发明有益效果为：LED基座底面贴设于本发明的电极焊脚和导热柱上，因本发明所述电极焊脚的上表面和导热柱的上端面处于同一平面内，在不影响LED基座底面与电极焊脚电连接的情况下，LED基座底面与导热柱的上端面可以实现充分接触焊接连接，有效增加LED基座底面导热部分与导热柱的上端面的接触面积，这样设置，本发明所述的散热结构可以将LED所产生热量经导热柱和导热板件迅速导出，其导热散热功能大大增强。
 附图说明
图1是本发明整体剖视结构示意图；
图2是本发明分解结构示意图。
图中：1、LED；2、基座；3、电极焊脚；4、PCB板；5、铜板层；6、导热板件；7、导热柱；8、固定柱；9、散热板件；10、散热片；41、定位孔一；42、固定孔一；61、定位孔二；62、固定孔二。
 本发明的最佳实施方式
下面结合附图对本发明作进一步的说明。
如图1，图2所示，本发明所述的一种大功率LED散热结构，包括PCB板4，导热板件6以及散热板件9，也即PCB板4，导热板件6以及散热板件9构成本发明主体部件。其中，所述导热板件6由紫铜以及铝等材料制作，所述散热板件9由铝或铜材料制作，所述导热柱7由紫铜材料制作。紫铜以及铝材料均具体良好的导热散热功能，本发明所述导热板件6，导热柱7以及散热板件9采用紫铜以及铝材料制作，有利于实现本发明之目的。当然，上述结构主体亦可采用其它具有良好导热散热性能的金属材料制作。
其中，所述PCB板4上设有定位孔一41和固定孔一42，定位孔一41和固定孔一42贯通PCB板4两侧，所述PCB板4一侧面上设有铜板层5，用于焊接固定导热板件6；PCB板4另一侧面上设有电极焊脚3，用于连接LED1的基座2面底上的电极部分。
所述导热板件6上设有定位孔二61和固定孔二62，定位孔二61和固定孔二62贯通导热板件6两侧。所述导热板件6一侧面与PCB板4设有铜板层5的侧面叠加，叠加时，所述定位孔一41与定位孔二61对应设置，所述固定孔一42与固定孔二62对应设置。所述导热板件6和PCB板4通过穿设于固定孔一42和固定孔二62内的固定柱8固定连接。其中，当所述固定孔一42和固定孔二62均为通孔设置时，所述固定柱8为铆钉，导热板件6和PCB板4铆接连接；当所述固定孔一42和固定孔二62均为螺孔设置时，所述固定柱8为螺钉，导热板件6和PCB板4螺接连接。另外，所述导热板件6与铜板层5焊接固定，以进一步增加其结构牢固度，提高结构紧凑度。
需要进一步说明的是，为有效增加本发明结构的稳定性，所述固定孔一42可以多个，其均匀分布于定位孔一41的周围，同理，所述固定孔二62也可以为多个，其均匀分布于定位孔二61的周围。当固定孔一42和固定孔二62均为多个时，其位置以及数量形成一一对应关系。
所述导热板件6的另一侧面上贴设有散热板件9，以便于将导热板件6的热量及时散出。所述散热板件9上设有若干散热片10，以增加散热板件9的散热面积，进一步增强散热板件9的散热效果。
所述定位孔一41和定位孔二61内穿设有导热柱7，所述导热柱7一端与一端导热板件6侧面齐平，另一端伸出PCB板4侧面外，导热柱7伸出端长度与电极焊脚3的厚度相等，以确保有所述导热柱7的上端面与电极焊脚3的上表面处于同一平面内。如此设置，基座2底面可同时与导热柱7的上端面以及电极焊脚3的上表面进行充分帖合，即基座2底面的电极部分与电极焊脚3进行充分接触焊接的同时，也能实现基座2底面导热部分与热柱7的上端面的充分接触焊接，尽可能增大基座2底面导热部分与热柱7的上端面的接触面积，以确保LED1所产生热量可以及时迅速的经由导热柱7，导热板件6传导至散热板件9，并经散热板件9散出。
所述导热柱7的形状大小与定位孔一41和定位孔二61的形状大小相匹配，具体而言，导热柱8的横截面呈圆形、椭圆形、三角形或正六边形设置，当导热柱7的横截面呈圆形设置时，所述定位孔一41和定位孔二61内壁上设有内螺纹，所述导热柱7的侧壁上设有外螺纹，所述导热柱7与定位孔一41和定位孔二61螺纹连接。导热柱7与定位孔一41和定位孔二61的螺纹连接，可以增加本发明的结构紧密度，间接提高导热散热功能。
本发明所述的散热结构可以将LED所产生热量迅速导出，其导热散热效果较现有技术而言大大增强。
表一，现有散热结构(旧)与本发明所述散热结构(新)的温度数据测试表
输入电流 环境温度 热沉温度（旧）导热柱温度（新） 铝基板（旧）导热板件（新） 散热板件
散热结构（旧） 700mA 24.3℃ 57.3℃ 44.7℃ 45.2℃
散热结构（新） 700mA 28℃ 48.1/51℃ 47.3/50.3℃ 45.6/50.3℃
从上表可以看出，对分别采用新散热结构和旧散热结构的大功率LED，均通以相同的电流，且在新散热结构环境温度较高的情况下，新散热结构导热柱温度明显低于旧散热结构热沉温度，而新散热结构的导热板件以及散热板件的温度却明显高于旧散热结构的铝基板和散热板件的温度，这充分说明了新散热结构的散热效果比旧散热结构的散热结构的效果更好。
以上所述仅是本发明的较佳实施方式，故凡依本发明专利申请范围所述的构造、特征及原理所做的等效变化或修饰，均包括于本发明专利申请范围内。
 本发明的实施方式
工业实用性
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Claims (9)

  1. 一种大功率LED散热结构，其特征在于：包括PCB板(4)，导热板件(6)以及散热板件(9)，所述PCB板(4)上设有定位孔一(41)和固定孔一(42)，所述定位孔一(41) 和固定孔一(42)贯通PCB板(4)两侧，所述PCB板(4)一侧面上设有铜板层(5)，PCB 板(4)另一侧面上设有电极焊脚(3)；所述导热板件(6)上设有定位孔二(61)和固定孔二(62)，所述定位孔二(61)和固定孔二(62)贯通导热板件(6)两侧；所述导热板件(6)一侧面与PCB板(4)设有铜板层(5)的侧面叠加，所述定位孔一(41)与定位孔二(61)成对应设置，所述固定孔一(42)和固定孔二(62)成对应设置；所述导热板件(6)和PCB板(4)通过穿设于固定孔一(42)和固定孔二(62)内的固定柱(8)固定连接；所述定位孔一(41)和定位孔二(61)内穿设有导热柱(7)，所述导热柱(7)一端伸出PCB板(4)侧面外，导热柱(7)伸出端长度与电极焊脚(3)的厚度相等，所述导热柱(7)的上端面与电极焊脚(3)的上表面处于同一平面内；所述散热板件(9)贴设于导热板件(6)的另一侧面上。
  2. 根据权利要求1所述的大功率LED散热结构，其特征在于：所述导热板件(6)与铜板层(5)焊接固定。
  3. 根据权利要求2所述的大功率LED散热结构，其特征在于：所述散热板件(9)上设有若干散热片(10)。
  4. 根据权利要求3所述的大功率LED散热结构，其特征在于：所述导热柱(7)的形状大小与定位孔一(41)和定位孔二(61)的形状大小相匹配，所述导热柱(7)的横截面呈圆形、椭圆形、三角形或正六边形设置。
  5. 根据权利要求3所述的大功率LED散热结构，其特征在于：所述固定孔一(42)和固定孔二(62)均为通孔设置，所述固定柱(8)为铆钉。
  6. 根据权利要求3所述的大功率LED散热结构，其特征在于：所述固定孔一(42)和固定孔二(62)均为螺孔设置，所述固定柱(8)为螺钉。
  7. 根据权利要求1-6任一所述的大功率LED散热结构，其特征在于：所述导热板件(6)由紫铜材料制作。
  8. 根据权利要求1-6任一所述的大功率LED散热结构，其特征在于：所述散热板件(9)由铝或铜材料制作。
  9. 根据权利要求1-6任一所述的大功率LED散热结构，其特征在于：所述导热柱(7)由紫铜材料制作。
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