WO2013067842A1 - 一种大功率led 散热结构的制作工艺 - Google Patents

一种大功率led 散热结构的制作工艺 Download PDF

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Publication number
WO2013067842A1
WO2013067842A1 PCT/CN2012/080773 CN2012080773W WO2013067842A1 WO 2013067842 A1 WO2013067842 A1 WO 2013067842A1 CN 2012080773 W CN2012080773 W CN 2012080773W WO 2013067842 A1 WO2013067842 A1 WO 2013067842A1
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WO
WIPO (PCT)
Prior art keywords
heat
heat conducting
heat dissipation
plate member
column
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PCT/CN2012/080773
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English (en)
French (fr)
Inventor
毕晓峰
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东莞勤上光电股份有限公司
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Application filed by 东莞勤上光电股份有限公司 filed Critical 东莞勤上光电股份有限公司
Priority to EP12848326.0A priority Critical patent/EP2642532A4/en
Priority to AU2012333910A priority patent/AU2012333910B2/en
Priority to KR1020137013861A priority patent/KR101507668B1/ko
Priority to BR112013015298A priority patent/BR112013015298A2/pt
Priority to US13/989,818 priority patent/US8757473B2/en
Priority to MX2013007639A priority patent/MX2013007639A/es
Priority to JP2013552829A priority patent/JP5585924B2/ja
Priority to CA2818087A priority patent/CA2818087C/en
Publication of WO2013067842A1 publication Critical patent/WO2013067842A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • the invention relates to the technical field of heat dissipating devices, in particular to a manufacturing process of a high-power LED heat dissipating structure.
  • LEDs are widely used in various fields such as indication, indoor and outdoor lighting, etc. due to their long theoretical life, low energy consumption and environmental protection.
  • the most critical factor affecting the service life of LEDs is the heat dissipation problem of LEDs, especially for high-power LEDs.
  • the manufacturing process of the heat dissipation structure of the existing high-power LED is mainly composed of a heat sink, an aluminum substrate, a thermal grease, a heat dissipation plate member and the like, and the LED is connected to the aluminum substrate through a heat sink.
  • the heat dissipation structure produced by the heat dissipation structure has defects and shortcomings such as poor heat conduction and heat dissipation performance, which greatly affects the application field and application range of the LED.
  • the main reason for the poor heat conduction and heat dissipation performance is the structural arrangement of the aluminum substrate.
  • the aluminum substrate is generally formed by superimposing a protective oil layer, a copper foil layer, an insulating layer and an aluminum plate layer.
  • the insulating layer plays a good and effective positive role in insulation, it also produces a negative effect of heat insulation.
  • the heat generated cannot be quickly and quickly exported, which greatly affects the service life of the LED. Therefore, it is necessary to innovate the existing manufacturing process, realize the difference in the heat dissipation structure, and effectively solve the heat dissipation problem of the LED.
  • the object of the present invention is to provide a heat-dissipating structure of a high-power LED with simple process and high production efficiency in view of the defects and deficiencies of the prior art, and the heat-dissipating structure obtained has the advantages of simple and compact structure, good heat dissipation effect and the like.
  • the present invention adopts the following technical solutions:
  • the manufacturing process of a high-power LED heat dissipation structure comprises the following steps:
  • Positioning holes 1 and fixing holes 1 are formed on the PCB board, a copper plate layer is welded on one side of the PCB board, electrode pads are soldered on the other side of the PCB board, and solder paste is applied on the surface of the copper board layer. ;
  • a side surface of the heat conducting plate member is superposed on a side surface of the PCB board provided with the copper plate layer, and the positioning hole is disposed corresponding to the positioning hole 2, and the fixing hole is disposed corresponding to the fixing hole 2;
  • the fixing hole 1 and the fixing hole 2 are fixedly connected to the PCB board and the heat conducting board member as a unitary piece;
  • a heat conducting column is disposed in the positioning hole 1 and the positioning hole 2, and one end of the heat conducting column protrudes from a side of the PCB board, and a length of the protruding end of the heat conducting column is greater than a thickness of the electrode pad;
  • a plurality of fins are disposed on the outer side surface of the heat dissipation plate member.
  • step (4) after the PCB board and the heat conducting board piece are fixedly connected as a single piece, the heat conducting board part and the copper board layer are reflow soldered;
  • the fixing hole 1 and the fixing hole 2 are both disposed through holes, and the fixing column is a rivet.
  • the fixing hole 1 and the fixing hole 2 in the step (4) are both screw holes, and the fixing column is a screw.
  • the heat conducting column in the step (1) is screwed with the positioning hole and the positioning hole.
  • the heat conducting plate member in the step (1) is made of a copper material.
  • the heat dissipation plate member in the step (1) is made of aluminum or copper material.
  • the heat conducting column in the step (1) is made of a copper material.
  • the beneficial effects of the present invention are as follows: the upper surface of the electrode pad and the upper end surface of the heat conducting column are adjusted to be in the same plane, and the bottom surface of the LED base is attached to the electrode pad and the heat conducting column.
  • the bottom surface of the LED base and the upper end surface of the heat conducting column can be fully contacted and soldered, thereby effectively increasing the heat conduction portion of the bottom surface of the LED base and the heat conducting column.
  • the contact area of the end face is arranged such that the heat dissipation structure obtained by the manufacturing process of the invention can quickly derive the heat generated by the LED through the heat conducting column and the heat conducting plate, and the heat conducting and heat dissipating function is greatly enhanced.
  • FIG. 1 is a schematic overall cross-sectional structural view of a heat dissipation structure of the present invention
  • FIG. 2 is a schematic exploded view of the heat dissipation structure of the present invention.
  • FIG. 1 and FIG. 2 are schematic diagrams showing the overall structure and the exploded structure of the heat dissipation structure prepared by the present invention. The specific steps of the present invention will be further described and described below with reference to the accompanying drawings.
  • the manufacturing process of the heat dissipation structure of a high-power LED according to the present invention comprises the following steps:
  • 9 Made of aluminum or copper.
  • the materials such as copper and aluminum have a specific heat conduction and heat dissipation function.
  • the heat conductive plate member 6 and the heat dissipation plate member 9 of the present invention are made of copper and aluminum materials, which are advantageous for achieving the object of the present invention.
  • the above structural body can also be made of other metal materials having good heat conduction and heat dissipation properties.
  • the heat conducting column 8 and the heat conducting plate member 6 may be integrally formed or may be fixedly arranged by split welding.
  • a positioning hole 41 and a fixing hole 42 are formed on the PCB board 4, and a copper layer 5 is welded on one side of the PCB board 4, and a solder paste is applied on the surface of the copper layer 5 for soldering and fixing the heat conducting board.
  • Piece 6; electrode pads 3 are soldered on the other side of the PCB 4 for connecting the electrode portions on the bottom of the base 2 of the LED 1.
  • a positioning hole 216 and a fixing hole 262 are formed on the heat conducting plate member 6 so as to penetrate the two sides.
  • the plurality of fixing holes 42 may be evenly distributed around the positioning holes 41.
  • the fixing holes 62 may also be multiple. They are evenly distributed around the positioning holes 2 and 61.
  • both the fixing hole 42 and the fixing hole 62 are plural, their positions and numbers form a one-to-one correspondence.
  • One side of the heat conducting plate member 6 is superposed on the side of the PCB board 4 on which the copper plate layer 5 is disposed, and the positioning hole 41 is disposed corresponding to the positioning hole 216, and the fixing hole 42 and the fixing hole 62 are correspondingly arranged.
  • the fixing plate 8 is disposed in the fixing hole 42 and the fixing hole 62 to securely connect the PCB board 4 and the heat conducting plate member 6 into a single piece.
  • the fixing column 8 is a rivet, and the heat conducting plate member 6 and the PCB board 4 are riveted and connected, and the rivet is punched by a punching device after riveting;
  • the fixing post 8 is a screw, and the heat conducting plate member 6 and the PCB board 4 are screwed together.
  • the heat conducting plate member 6 is welded and fixed to the copper plate layer 5 to further increase the structural firmness and improve the compactness of the structure.
  • a heat conducting column 7 is disposed in the positioning hole 41 and the positioning hole 21, and one end of the heat conducting column 7 extends beyond the side of the PCB board 4.
  • the length of the protruding end of the heat conducting column 7 is greater than the thickness of the electrode pad 3.
  • the heat conducting column The shape and size of 7 is matched with the shape and size of the positioning hole 41 and the positioning hole 216.
  • the cross section of the heat conducting column 8 is circular, elliptical, triangular or regular hexagonal when the heat conducting column 7 is disposed.
  • the positioning hole 41 and the inner wall of the positioning hole 216 are provided with internal threads, and the side wall of the heat conducting column 7 is provided with external threads, and the heat conducting column 7 and the positioning hole are 41 and the positioning hole two 61 threaded connection.
  • the threaded connection of the heat conducting column 7 with the positioning hole 41 and the positioning hole 216 can increase the structural tightness of the present invention and indirectly improve the heat conduction and heat dissipation function.
  • the heat conducting plate member 6 and the integral piece of the PCB board 4 obtained in the step (5) are placed on a punching device, and the punching device presses the upper end surface of the heat conducting column 7 to adjust the length of the protruding end of the heat conducting column 7 to make the heat conducting column 7
  • the upper end surface is in the same plane as the upper surface of the electrode fillet 3.
  • This step is a key step of the manufacturing process of the present invention. As described above, one end of the heat conducting column 7 extends beyond the side of the PCB board 4, and the length of the protruding end of the heat conducting column 7 is greater than the thickness of the electrode pad 3, and the heat conducting column is punched by the punching device. 7.
  • the height of the heat conducting column 7 and the upper end surface are stamped and adjusted until the length of the protruding end of the heat conducting column 7 is equal to the thickness of the electrode pad 3. After the stamping, the cross section of the heat conducting column 7 becomes larger, and the positioning hole 41 and the positioning The second 61 forms an interference fit, so that the contact surface with the heat conducting portion of the bottom surface of the base 2 is increased to facilitate heat conduction, and at the same time, the upper end surface of the heat conducting column 7 is in the same plane as the upper surface of the electrode soldering leg 3, so that the bottom surface of the base 2 can be At the same time, the upper end surface of the heat conducting column 7 and the upper surface of the electrode soldering leg 3 are fully engaged, that is, the electrode portion of the bottom surface of the base 2 is fully contacted with the electrode soldering foot 3, and the heat conducting portion of the bottom surface of the base 2 can also be realized.
  • the contact with the upper end surface of the heat conducting column 7 is sufficient to increase the contact area between the heat conducting portion of the bottom surface of the base 2 and the upper end surface of the heat conducting column 7 to ensure that the heat generated by the LED 1 can be quickly and timely guided.
  • Column 7, the heat conducting plate 6 is conducted to the heat radiating plate 9, 9 and radiated by the heat radiating plate.
  • the inner side of the heat dissipating plate member 9 is fixedly attached to the other side of the heat conducting plate member 6, and the heat dissipating plate member 9 is arranged to dissipate the heat of the heat conducting plate member 6 in time.
  • a plurality of fins 10 are disposed on the outer surface of the heat dissipating plate member 9 to increase the heat dissipating area of the heat dissipating plate member 9, thereby further enhancing the heat dissipating effect of the heat dissipating plate member 9.
  • the heat dissipation structure obtained by the manufacturing process of the invention can quickly derive the heat generated by the LED, and the heat conduction and heat dissipation effect thereof is greatly enhanced compared with the prior art.
  • Table 1 temperature data test table of the existing heat dissipation structure (old) and the heat dissipation structure (new) obtained by the present invention

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种大功率LED的散热结构的制造工艺，包括以下步骤：在PCB板上设置贯通的定位孔一和固定孔一；在导热板件上设贯通的定位孔二和固定孔二；用固定柱穿设固定孔一和固定孔二，将PCB板和导热板件固定连接为一整体件；在定位孔一和定位孔二内穿设导热柱，使导热柱上端伸出PCB板；将上述整体件置于冲压设备上进行冲压，调整导热柱伸出端的长度。该工艺使导热柱横截面变大，与定位孔形成过盈配合，与LED基底接触面积增大，便于导热。

Description

一种大功率LED 散热结构的制作工艺 技术领域
本发明涉及散热装置技术领域，特别涉及一种大功率LED散热结构的制作工艺。
背景技术
LED以其理论寿命长、能耗低以及绿色环保等特点而被广泛应用于指示、室内外照明等各个领域。众所周知，影响LED使用寿命的最关键的因素就是LED的散热问题，大功率LED尤其如此。现有大功率LED的散热结构的制作工艺是主要将热沉，铝基板、导热硅脂、散热板件等部分依次连接构成，LED经热沉与铝基板连接，这种制作工艺虽然工艺简单，但其所制得的散热结构却存在导热散热性能差等缺陷和不足，从而极大的影响了LED的应用领域和应用范围，其导热散热性能差的主要原因在于铝基板的结构设置。铝基板一般由保护油层、铜箔层，绝缘层以及铝板层依次叠加而成，其中，绝缘层虽然在绝缘方面起到良好且有效的积极作用，却同时也生产了隔热的负面效果，LED所产生的热量无法及时迅速导出，从而极大地影响了LED的使用寿命。故有必要对现有制作工艺进行革新，实现散热结构差异化，有效地解决LED的散热问题。
技术问题
本发明的目的在于针对现有技术的缺陷和不足，提供一种工艺简单，生产效率高的大功率LED的散热结构的制作工艺，其所得的散热结构具有结构简单紧凑、散热效果好等优点。
 技术解决方案
为实现上述目的，本发明采用以下技术方案：
本发明所述的一种大功率LED散热结构的制作工艺，其包括如下步骤：
(1) 准备PCB板，导热板件以及散热板件；
(2) 在所述PCB板上设贯通两侧的定位孔一和固定孔一，在PCB板一侧面上焊设铜板层，在PCB板另一侧面焊设电极焊脚，然后在铜板层表面涂焊锡膏；
(3) 在所述导热板件上设贯通两侧的定位孔二和固定孔二；
(4) 将导热板件一侧面与PCB板设有铜板层的侧面叠加，且所述定位孔一与定位孔二成对应设置，所述固定孔一和固定孔二成对应设置；用固定柱穿设于固定孔一和固定孔二内将PCB板和导热板件固定连接为一整体件；
(5) 向定位孔一和定位孔二内穿设导热柱，所述导热柱一端伸出PCB板侧面外，导热柱伸出端的长度大于电极焊脚的厚度；
(6) 将步骤(5)所得的导热板件和PCB板的整体件置于冲压设备上，冲压设备对导热柱上端面进行冲压，以调整导热柱伸出端的长度，使导热柱的上端面与电极焊脚的上表面处于同一平面内；
(7) 将散热板件内侧面固定贴设于导热板件的另一侧面上。
其中，步骤(5)中所述散热板件外侧面上设有若干散热片。
其中，步骤(4)中将PCB板和导热板件固定连接为一整体件后，将导热板件与铜板层通回流焊焊接；
其中，步骤(4)中所述固定孔一和固定孔二均为通孔设置，所述固定柱为铆钉。
其中，步骤(4)中所述固定孔一和固定孔二均为螺孔设置，所述固定柱为螺钉。
其中，步骤(1)中所述导热柱与定位孔一和定位孔二螺纹连接。
其中，步骤(1)中所述导热板件由紫铜材料制作。
其中，步骤(1)中所述散热板件由铝或铜材料制作。
其中，步骤(1)中所述导热柱由紫铜材料制作。
 有益效果
采用上述制作工艺后，本发明有益效果为：因本发明制作工艺将电极焊脚的上表面和导热柱的上端面调整为同一平面内，将LED基座底面贴设于电极焊脚和导热柱上时，在不影响LED基座底面与电极焊脚电连接的情况下，LED基座底面与导热柱的上端面可以实现充分接触焊接连接，有效增加LED基座底面导热部分与导热柱的上端面的接触面积，这样设置，本发明制作工艺所得的散热结构可以将LED所产生热量经导热柱和导热板件迅速导出，其导热散热功能大大增强。
 附图说明
图1是本发明制得散热结构的整体剖视结构示意图；
图2是本发明制得散热结构的分解结构示意图。
图中： 1、LED；2、基座；3、电极焊脚；4、PCB板；5、铜板层；6、导热板件；7、导热柱； 8、固定柱；9、散热板件；10、散热片；41、定位孔一；42、固定孔一；61、定位孔二；62、固定孔二。
 本发明的最佳实施方式
如图1，图2所示为本发明所制得的散热结构的整体以及分解结构示意图，下面结合附图对本发明具体步骤作进一步的说明和描述。
本发明所述的一种大功率LED的散热结构的制作工艺，其包括如下步骤：
(1) 准备PCB板4，导热板件6以及散热板件9等部件或材料；其中，所述导热板件6由紫铜以及铝等材料制作，所述导热柱8由紫铜材料制作，所述散热板件9由铝或铜材料制作。紫铜以及铝等材料均具体良好的导热散热功能，本发明所述导热板件6以及散热板件9采用紫铜以及铝材料制作，有利于实现本发明之目的。当然，上述结构主体亦可采用其它具有良好导热散热性能的金属材料制作。所述导热柱8与导热板件6可以为一体成型设置，也可以为分体焊接固定设置。
(2) 在所述PCB板4上设贯通两侧的定位孔一41和固定孔一42，在PCB板4一侧面上焊设铜板层5，在铜板层5表面涂焊锡膏，用于焊接固定导热板件6；在PCB板4另一侧面焊设电极焊脚3，用于连接LED1的基座2面底上的电极部分。
(3)在所述导热板件6上设贯通两侧的定位孔二61和固定孔二62。
需要进一步说明的是，为有效增加本发明结构的稳定性，所述固定孔一42可以多个，其均匀分布于定位孔一41的周围，同理，所述固定孔二62也可以为多个，其均匀分布于定位孔二61的周围。当固定孔一42和固定孔二62均为多个时，其位置以及数量形成一一对应关系。
(4) 将导热板件6一侧面与PCB板4设有铜板层5的侧面叠加，且所述定位孔一41与定位孔二61成对应设置，所述固定孔一42和固定孔二62成对应设置；用固定柱8穿设于固定孔一42和固定孔二62内将PCB板4和导热板件6固定连接为一整体件。其中，当所述固定孔一42和固定孔二62均为通孔设置时，所述固定柱8为铆钉，导热板件6和PCB板4铆接连接，铆接后用冲压设备对铆钉进行冲压；当所述固定孔一42和固定孔二62均为螺孔设置时，所述固定柱8为螺钉，导热板件6和PCB板4螺接连接。
另外，所述导热板件6与铜板层5焊接固定，以进一步增加其结构牢固度，提高结构紧凑度。
(5) 向定位孔一41和定位孔二61内穿设导热柱7，所述导热柱7一端伸出PCB板4侧面外，导热柱7伸出端的长度大于电极焊脚3的厚度；所述导热柱7的形状大小与定位孔一41和定位孔二61的形状大小相匹配，具体而言，导热柱8的横截面呈圆形、椭圆形、三角形或正六边形设置，当导热柱7 的横截面呈圆形设置时，所述定位孔一41和定位孔二61内壁上设有内螺纹，所述导热柱7的侧壁上设有外螺纹，所述导热柱7与定位孔一41和定位孔二61螺纹连接。导热柱7与定位孔一41和定位孔二61的螺纹连接，可以增加本发明的结构紧密度，间接提高导热散热功能。
(6) 将步骤(5)所得的导热板件6和PCB板4的整体件置于冲压设备上，冲压设备对导热柱7上端面进行冲压，以调整导热柱7伸出端的长度，使导热柱7的上端面与电极焊脚3的上表面处于同一平面内。本步骤为本发明制作工艺的关键步骤，如上所述，所述导热柱7一端伸出PCB板4侧面外，导热柱7伸出端的长度大于电极焊脚3的厚度，通过冲压设备冲压导热柱7，对导热柱7的高度以及上端面进行冲压调整，直至导热柱7伸出端的长度等于电极焊脚3的厚度，经过冲压后，导热柱7横截面变大，与定位孔一41以及定位二61形成过盈配合，从而与基座2底面导热部分接触面增大，便于导热，同时，导热柱7的上端面与电极焊脚3的上表面处于同一平面，这样，基座2底面可同时与导热柱7的上端面以及电极焊脚3的上表面进行充分帖合，即基座2底面的电极部分与电极焊脚3进行充分接触焊接的同时，也能实现基座2底面导热部分与导热柱7的上端面的充分接触焊接，尽可能增大基座2底面导热部分与导热柱7的上端面的接触面积，以确保LED1所产生热量可以及时迅速的经由导热柱7，导热板件6传导至散热板件9，并经散热板件9散出。
(7) 将散热板件9内侧面固定贴设于导热板件6的另一侧面上，散热板件9以便于将导热板件6的热量及时散出。所述散热板件9外侧面上设有若干散热片10，以增加散热板件9的散热面积，进一步增强散热板件9的散热效果。
本发明制作工艺所得的散热结构可以将LED所产生热量迅速导出，其导热散热效果较现有技术而言大大增强。
表一，现有散热结构(旧)与本发明所得的散热结构(新)的温度数据测试表
输入电流 环境温度 热沉温度（旧）导热柱温度（新） 铝基板（旧）导热板件（新） 散热板件
散热结构（旧） 700mA 24.3℃ 57.3℃ 44.7℃ 45.2℃
散热结构（新） 700mA 28℃ 48.1/51℃ 47.3/50.3℃ 45.6/50.3℃
从上表可看出，对分别采用新散热结构和旧散热结构的大功率LED，均通以相同电流，且新散热结构环境温度较高的情况下，新散热结构导热柱温度明显低于旧散热结构热沉温度，而新散热结构的导热板件以及散热板件的温度却明显高于旧散热结构的铝基板和散热板件的温度，这充分说明了本发明制作方法所得新散热结构的散热效果比旧散热结构的散热结构的效果更好。
以上所述仅是本发明的较佳实施方式，故凡依本发明专利申请范围所述的构造、特征及原理所做的等效变化或修饰，均包括于本发明专利申请范围内。
 本发明的实施方式
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Claims (9)

  1. 一种大功率LED散热结构的制作工艺，其特征在于，其包括如下步骤：
    (1) 准备PCB板(4)，导热板件(6)以及散热板件(9)；
    (2) 在所述PCB板(4)上设贯通两侧的定位孔一(41)和固定孔一(42)，在PCB板(4)一侧面上焊设铜板层(5)，在PCB板(4)另一侧面焊设电极焊脚(3)，然后在铜板层(5)表面涂焊锡膏；
    (3) 在所述导热板件(6)上设贯通两侧的定位孔二(61)和固定孔二(62)；
    (4) 将导热板件(6)一侧面与PCB板(4)设有铜板层(5)的侧面叠加，且所述定位孔一(41)与定位孔二(61)成对应设置，所述固定孔一(42)和固定孔二(62)成对应设置；用固定柱(8)穿设于固定孔一(42)和固定孔二(62)内将PCB板(4)和导热板件(6)固定连接为一整体件；
    (5) 向定位孔一(41)和定位孔二(61)内穿设导热柱(7)，所述导热柱(7)一端伸出PCB板(4)侧面外，导热柱(7)伸出端的长度大于电极焊脚(3)的厚度；
    (6)将步骤(5)所得的导热板件(6)和PCB板(4)的整体件置于冲压设备上，冲压设备对导热柱(7)上端面进行冲压，以调整导热柱(7)伸出端的长度，使导热柱(7)的上端面与电极焊脚(3)的上表面处于同一平面内；
    (7) 将散热板件(9)内侧面固定贴设于导热板件(6)的另一侧面上。
  2. 根据权利要求1所述的大功率LED散热结构的制作工艺，其特征在于：步骤(5)中所述散热板件(9)外侧面上设有若干散热片(10)。
  3. 根据权利要求1所述的大功率LED散热结构的制作工艺，其特征在于：步骤(4)中将PCB板(4)和导热板件(6)固定连接为一整体件后，将导热板件(6)与铜板层(5)通回流焊焊接。
  4. 根据权利要求1所述的大功率LED散热结构的制作工艺，其特征在于：步骤(4)中所述固定孔一(42)和固定孔二(62)均为通孔设置，所述固定柱(8)为铆钉。
  5. 根据权利要求1所述的大功率LED散热结构的制作工艺，其特征在于：步骤(4)中所述固定孔一(42)和固定孔二(62)均为螺孔设置，所述固定柱(8)为螺钉。
  6. 根据权利要求1所述的大功率LED散热结构的制作工艺，其特征在于：步骤(1)中所述导热柱(8)与定位孔一(41)和定位孔二(61)螺纹连接。
  7. 根据权利要求1所述的大功率LED散热结构的制作工艺，其特征在于：步骤(1)中所述导热板件(6)由紫铜材料制作。
  8. 根据权利要求1所述的大功率LED散热结构的制作工艺，其特征在于：步骤(1)中所述散热板件(9)由铝或铜材料制作。
  9. 根据权利要求1所述的大功率LED散热结构的制作工艺，其特征在于：步骤(1)中所述导热柱(8)由紫铜材料制作。
PCT/CN2012/080773 2011-11-09 2012-08-30 一种大功率led 散热结构的制作工艺 WO2013067842A1 (zh)

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