CN201758485U - 热压法制作的高导热性电路板 - Google Patents
热压法制作的高导热性电路板 Download PDFInfo
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- CN201758485U CN201758485U CN 201020197650 CN201020197650U CN201758485U CN 201758485 U CN201758485 U CN 201758485U CN 201020197650 CN201020197650 CN 201020197650 CN 201020197650 U CN201020197650 U CN 201020197650U CN 201758485 U CN201758485 U CN 201758485U
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- circuit board
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- thermal conductivity
- metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Application Number | Priority Date | Filing Date | Title |
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CN 201020197650 CN201758485U (zh) | 2010-05-12 | 2010-05-12 | 热压法制作的高导热性电路板 |
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CN 201020197650 CN201758485U (zh) | 2010-05-12 | 2010-05-12 | 热压法制作的高导热性电路板 |
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CN201758485U true CN201758485U (zh) | 2011-03-09 |
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CN 201020197650 Expired - Fee Related CN201758485U (zh) | 2010-05-12 | 2010-05-12 | 热压法制作的高导热性电路板 |
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CN (1) | CN201758485U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102403419A (zh) * | 2011-11-09 | 2012-04-04 | 东莞勤上光电股份有限公司 | 一种大功率led散热结构的制作工艺 |
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2010
- 2010-05-12 CN CN 201020197650 patent/CN201758485U/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102403419A (zh) * | 2011-11-09 | 2012-04-04 | 东莞勤上光电股份有限公司 | 一种大功率led散热结构的制作工艺 |
CN102403419B (zh) * | 2011-11-09 | 2013-08-21 | 东莞勤上光电股份有限公司 | 一种大功率led散热结构的制作工艺 |
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Granted publication date: 20110309 Termination date: 20130512 |