CN201655852U - 表面组装技术封装的led背光源灯条 - Google Patents
表面组装技术封装的led背光源灯条 Download PDFInfo
- Publication number
- CN201655852U CN201655852U CN2010201630513U CN201020163051U CN201655852U CN 201655852 U CN201655852 U CN 201655852U CN 2010201630513 U CN2010201630513 U CN 2010201630513U CN 201020163051 U CN201020163051 U CN 201020163051U CN 201655852 U CN201655852 U CN 201655852U
- Authority
- CN
- China
- Prior art keywords
- led
- graphite substrate
- led backlight
- lamp bar
- surface installation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201630513U CN201655852U (zh) | 2010-04-19 | 2010-04-19 | 表面组装技术封装的led背光源灯条 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201630513U CN201655852U (zh) | 2010-04-19 | 2010-04-19 | 表面组装技术封装的led背光源灯条 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201655852U true CN201655852U (zh) | 2010-11-24 |
Family
ID=43121095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010201630513U Expired - Fee Related CN201655852U (zh) | 2010-04-19 | 2010-04-19 | 表面组装技术封装的led背光源灯条 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201655852U (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102306697A (zh) * | 2011-09-29 | 2012-01-04 | 昆山市华英精密模具工业有限公司 | 超薄型带底部散热的led支架 |
CN102569224A (zh) * | 2010-12-07 | 2012-07-11 | 点量科技股份有限公司 | 高散热性电路载板及相关的电路模组 |
CN103137832A (zh) * | 2013-03-13 | 2013-06-05 | 深圳市晨日科技有限公司 | Led一体化制造工艺 |
CN103855147A (zh) * | 2014-01-13 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | 一种led灯丝及灯具 |
CN106773295A (zh) * | 2016-12-21 | 2017-05-31 | 武汉华星光电技术有限公司 | 一种背光模组 |
-
2010
- 2010-04-19 CN CN2010201630513U patent/CN201655852U/zh not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102569224A (zh) * | 2010-12-07 | 2012-07-11 | 点量科技股份有限公司 | 高散热性电路载板及相关的电路模组 |
CN102569224B (zh) * | 2010-12-07 | 2014-03-05 | 点量科技股份有限公司 | 高散热性电路载板及相关的电路模组 |
CN102306697A (zh) * | 2011-09-29 | 2012-01-04 | 昆山市华英精密模具工业有限公司 | 超薄型带底部散热的led支架 |
CN103137832A (zh) * | 2013-03-13 | 2013-06-05 | 深圳市晨日科技有限公司 | Led一体化制造工艺 |
CN103137832B (zh) * | 2013-03-13 | 2017-03-15 | 深圳市晨日科技有限公司 | Led一体化制造工艺 |
CN103855147A (zh) * | 2014-01-13 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | 一种led灯丝及灯具 |
CN106773295A (zh) * | 2016-12-21 | 2017-05-31 | 武汉华星光电技术有限公司 | 一种背光模组 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101162816B (zh) | 电连接装置 | |
CN102709278A (zh) | 荧光薄膜平面薄片式led阵列光源 | |
CN201655852U (zh) | 表面组装技术封装的led背光源灯条 | |
CN101776248A (zh) | 灯具及其照明装置 | |
CN201672376U (zh) | 板上芯片方式封装的led背光源灯条 | |
CN102709281A (zh) | 一种双荧光薄膜双面出光平面薄片式led阵列光源 | |
CN2898575Y (zh) | 高密度直插式led照明模块 | |
CN101126863A (zh) | 具有散热结构的发光二极管光源模块 | |
CN201149869Y (zh) | 一种led封装结构 | |
CN202469553U (zh) | 柔性电路基板led二维阵列光源 | |
CN101350390B (zh) | 一种led封装结构 | |
CN100594323C (zh) | 高功率半导体照明灯 | |
TWM381175U (en) | Improved ceramic radiator structure | |
CN103367346A (zh) | 一种新型大功率led光源及其实现方法 | |
CN202712175U (zh) | 荧光薄膜平面薄片式led阵列光源 | |
CN103579210B (zh) | 发光二极管单元与散热基板的连接 | |
CN202473912U (zh) | 无电路基板led阵列光源 | |
CN101783341B (zh) | 具有散热结构的发光二极管光源模块 | |
CN201897096U (zh) | 一种led灯具散热结构 | |
CN202205411U (zh) | 一种贴片式led显示模组 | |
CN201368359Y (zh) | 一种led发光模组 | |
CN202101047U (zh) | 一种散热性能优异的高功率led光源模组 | |
CN203298017U (zh) | 一种带针状散热器的led灯具 | |
CN202013901U (zh) | 用于表面贴装led光源的散热基板装置 | |
CN202159663U (zh) | 大功率led厚膜集成面光源 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen Jia spring water treatment technology Co., Ltd. Assignor: Shenzhen DTT Science & Technology Development Co., Ltd. Contract record no.: 2011440020449 Denomination of utility model: LED backlight light bar encapsulated by adopting surface mount technology Granted publication date: 20101124 License type: Exclusive License Record date: 20111207 |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101124 Termination date: 20160419 |